market and technology report - i-micronews
TRANSCRIPT
© 2020
From Technologies to Markets
WLCSP / Fan-In Packaging
Technologies & Market 2020
Market and Technology Report
Sample
2
• Table of contents 2
• Glossary and definition 8
• Executive summary 15
• Context 47
o Scope of the report
o WLCSP packaging definition
o WLCSP packaging introduction
o WLCSP packaging process flow
• Market forecasts 58
o Market revenue
o Total overview
o End-market
o Possible market inflection points
o Market units
o Total overview
o End-market
o Production volume, 300mm wafer equivalent
• Market shares 70
o What’s new?
o Market shares
o Supplier market share
o Market share by application
o 8” vs. 12” WLCSP market share
TABLE OF CONTENTS
Part 1/2
o Market units
o Supplier market share
o Market share by application
o 8” vs. 12” WLCSP market share
• Players & supply chain 82
o What’s new?
o WLCSP key supplier’s activity summary
o Global mapping
o Positioning of players
o Deca’s m-series value proposition
o Analysis of the latest developments in supply chain
• Market trends 107
o Market drivers, technical requirements, key players / segments
o PMIC with 6S side-wall protection
o Role of WLCSP in growth in SiP
(System In Package) and heterogeneous integration
o WLCSP packaging drivers
o Chapter conclusion
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TABLE OF CONTENTS
Part 2/2
• Commercialization status 136
o What’s new?
o Overview
o Commercialization window by io count & package size
o Smartphones market applications
o IoT market applications
o Automotive applications
• Technology trends 152
o What’s new?
o WLCSP packaging technology roadmaps
o WLCSP packaging technology by manufacturers
• Report conclusion 156
• Yole Corporate presentation 160
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The main objectives of this report are:
• To identify and describe which technologies can be classified as ‘WLCSP packaging’
• To define clearly the different market classes of WLCSP packaging
• To analyze key market drivers, benefits and challenges of WLCSP packages by application
• To describe the different existing technologies, their trends and roadmaps
• To analyze the supply chain and WLCSP landscape
• To update the business status of WLCSP technology markets
• To provide a market forecast for the coming years, and estimate future trends
WLCSP packaging markets are studied from the following angles:
• Top-down based on end-systems demand
• Market valuations based on top-down and bottom-up models
• Market shares based on production projections
• Supply value chain analysis
• State-of-the-art technologies and trends
• End-user application adoptions
SCOPE OF THE REPORT
Yours needs are
out of scope of this
report?
Contact us for a custom study:
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REPORT METHODOLOGY & DEFINITIONS
Market
Volume (in M.units)
ASP (in $)
Revenue (in $M)
Yole Développement ’s market forecast model is based on the matching of several sources:
Information
aggregation
Preexisting
information
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6
ABOUT THE AUTHOR
Biography & contact
Vaibhav Trivedi
Vaibhav Trivedi is a Sr. Technology and Market Analyst in the Semiconductor & Software division at Yole Développement, part
of Yole Group of Companies.
Based in the US, he is a member of Yole’s advanced packaging team and contributes to analysis of ever-changing advanced
packaging technologies. Vaibhav has 17+ years of field experience in semiconductor processing and semiconductor supply
chain, specifically on memory and thermal component sourcing and advanced packaging such as SiP and WLP.
Vaibhav has held multiple technical and commercial lead roles at various semiconductor corporations prior to joining Yole.
Vaibhav holds a Bachelor of Science in Chemical Engineering, and Master of Science of Material Science from University of
Florida in addition to an MBA from Arizona State
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GLOSSARY
Abbreviation Meaning Abbreviation Meaning Abbreviation Meaning
ADAS Advanced Driver-Assistance Systems HBM High Bandwidth Memory PCB Printed Circuit Board
AiP Antenna in Package HD FO High Density Fan-Out PDN Power Distribution Network
APE Application Processor Engine HDI High Density Interconnect PMIC Power Management Integrated Circuit
APU Application Processor Unit HPC High Performance Computing PMU Power Management Unit
ASIC Application-Specific Integrated Circuit HVM High-Volume Manufacturing PoP Package-on-Package
BEOL Back-end Of Line I/O Inputs/Outputs PTOR Production Tool of Record
BGA Ball Grid Array IC Integrated Circuits PVD Physical Vapor Deposition
BOM Bill Of Materials IDM Integrated Device Manufacturers PWB Printed Wiring Board
CAGR Compound Annual Growth Rate inFO integrated Fan-Out QFN Quad-Flat No-Lead Package
CSP Chip Scale Package IP Intellectual Property Radar RAdio Detection And Ranging
DSP Digital Signal Processor IPD Integrated Passive Devices RCC Resin Coated Copper
DTOR Development Tool of Record L/S Line/Space RCP Redistributed Chip Package
ECD Electro-Chemical Deposition LiDAR Light Detection and Ranging RDL Redistribution Layer
EMC Epoxy Mold Compound LTE Long-Term Evolution RF Radio Frequency
ePLP embedded Package-Level-Packaging LVM Low Volume Manufacturing SiP System-in-Package
ePoP embedded Package-on-Package MCM Multi-Chip Module SoC System-on-Chip
eWLB embedded Wafer-Level BGA MCP Multi-Chip Package TMV Through-Mold-Via
F2F Face-to-Face MEMS Micro-Electro-Mechanical System TPV Through-Package-Via
FC Flip-Chip mmWave Millimeter wave TSV Through-Silicon-Via
FO Fan-Out NR New Radio TTV Total Thickness Variation
FOPLP Fan-Out Panel-Level Packaging OEM Original Equipment Manufacturer UBM Under Bump Metallization
FOWLP Fan-Out Wafer-level Packaging OSAT Outsource Semiconductor Assembly and Test UHD FO Ultra-High-Density Fan-Out
FPGA Field-Programmable Gate Array PA Power Amplifier WLCSP Wafer-Level Chip-Scale Package
WLFO Wafer-Level Fan-Out
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3D-Plus, 3M, AGC, Amkor, Ajinomoto, AKG, Analog Devices, Apple, ASE, A*Star (IME),
AT&S, Atotech, Aurora semiconductors, BASF, BK Ultrasound, Blackberry,
Boschmann, Brewer Science, Broadcom, Bosch, China Mobile, Cirrus Logic, Cypress,
Deca Technologies, Denso, Dialog Semiconductor, Dow Dupont, Evatec, Fitbit,
Freescale (NXP), Fujifilm, Global Foundry, Google, Hella, HiSilicon, Hitachi chemicals,
Huawei, Huatian, Infineon, Intel, Lenovo, LGE, Marvell, Maxim IC, Mediatek, Medtronic,
Nagase ChemteX, Nanium (Amkor), Nepes, Nepes Laweh, Nephos, Nokia, NXP,
Oppo, Onda, PTI, Qualcomm, Qorvo, Rena, Rohm, Samsung, Schmoll maschinen,
SEMCO, SEMSYSCO, Shinko Electric, Sivers IMA, Spectrum, SPIL, STATS ChipPAC
(JCET), STMicroelectronics, Synaptics, Synergy, Texas Instruments, TSMC, Unimicron,
Xiaomi and more…
COMPANIES CITED IN THIS REPORT
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WLCSP / FAN-IN PACKAGING SEGMENTATION: BY APPLICATION
WLCSP applications by L/S & I/O
RDL L/S (µm/µm)
Codec
DC-DC
Switches
Antenna
Tuner
WiFi
PMU/PMIC
RF
MCU
Serial Flash
Envelope Tracker
Wireless
Charging
NFC Controller
RFFE MIPI Interface
I/O
per
Pac
kag
e A
rea
( I/O
per
mm
2)
2
>>12
6
4
≤ 1
5/510/10≥20/20 15/15 ≤2/2
Majority of WLCSP/FAN-IN
Packages active in lower I/O
area and >15 um L/S
applications
Advanced design rules
require Fan-Out/2.5-3D/SiP
type high end packageLight
Sensor
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A LOOK AT WLP (WAFER LEVEL PACKAGING) REVENUE FORECAST
Global WLP TAM
Global WLP market was worth at $3,324M in 2019 and is expected to grow at a CAGR of 8.9% to reach $5,537M by 2025.
WLCSP / Fan-In Packaging Technologies & Market 2020 | Sample | www.yole.fr | ©2020
Covid-19
Impact
11
WLCSP / FAN-IN PACKAGE REVENUE EVOLUTION
WLCSP packages revenue expected to grow to close to $2.5B USD by 2025 fueled by steady smartphone adoption of WLCSP
Packages and explosive growth in wearable segments for smartwatches and smartearbuds market. Key megatrends such as 5G
deployment, AI, and In-Vehicle Infotainment are steady growth drivers promising a bright future for WLCSP market.
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20192025
Major players
12
WLCSP / FAN-IN: MARKET BREAKDOWN BY APPLICATION (MU)
WLCSP packages get a strong foothold in smart phone eco-system as seen in RF devices, serial flash, connectivity modules,
driver ICs, wireless charging, PMU/PMICs, NFC controller, audio-codec modules
5G to increase number of RF WLCSP components over the course of 2-3 years
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13WLCSP Packaging Technologies and Market | Report | www.yole.fr | ©2020
FAN-IN IS SPREAD THROUGHOUT THE IC LANDSCAPE
A variety of analog/mixed signal/digital devices an sensors can be found in Fan-In packages
Analog &
mixed signalWireless
ConnectivityMEMS & sensorsOpto
Devices found in Fan-In packages
CMOS image
sensors
AL sensor
photonic
MEMS
ASIC IC
IPD (ESD/EMI protection,
RF filtering)
Inertial (accelerometers,
gyroscopes, combos)
Magnetometers
Oscillators
µ-bolometers
Chemical sensors (gas, humidity)
FBAR/BAW filters
Power amplifiers
BAW & SAW filters
PMU
IC drivers (LED,
battery, display…)
Local power (DC-DC converters,
MOSFET, oscillators)
Audio & video (codec, amplifiers…)
Bluetooth +
FM + WLAN
combos (+other combos)
WLAN
single chip
GPS, A-GPS
single chip
Misc Logic
and Memory
Logic gates
EEPROM/DRA
M/SRAM/Flash
µcontrollers
RF transceiver
Majority of application
found in
Mobile/Consumer
Segment
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FAN-IN PENETRATION STATUS IN MOBILE PLATFORMS
Overview by applications
Many functionalities in
handsets are packaged using
Fan-In
CPU
Drivers
Ics
Switches
Devices packaged using
‘Fan-in’
Discrete passives
Fan-In ICs started in 2000 in handsets, with small ESD/EMI
protection/interface conditioning devices:
• at first - Integrated Passive Devices (IPD)
• and then - Larger ICs.
The main drivers are:
• Size:
• CostDevices using other packaging technologies
(not ‘Fan-In’)
• Footprint
• Thickness
• Weight
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Case Study: Apple iPhone 11 PRO
Latest Apple iPhone 11 PRO contains many WLCSP components in the range of 40-45+ WLCSPcomponents as WLCSP is adopted to many platforms such as switches, tuners, wireless charging, RF, andmany more components.
WLCSP IN HIGH END PHONES (1/3)
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16WLCSP Packaging Technologies and Market | Report | www.yole.fr | ©2020
WAFER-LEVEL-PACKAGING MARKET DRIVERS
Numerous market drivers lead to a WLCSP solution.
WLP
•Lower packaging cost
•Lower test cost
▪ I/O density
•Smaller pitches
•Smaller dies
•Higher density of I/Os
▪ Integration• IPD
•SiP
•3D▪ Thermal performance•Lower power consumption
•Lower thermal resistance
▪ Electrical performance
•Shorter interconnects
•Lower parasitics
•Higher package speed
•Higher frequencies
▪ Form-factor
•No laminate substrate required
•Smaller thickness
•Smaller footprint
▪ Cost
• Improve chip-to-board coupling
• New materials
• Batch processing
• Panel capability• Lower thickness
• Multiple RDL
• Interconnect optimization
• Smallest thickness on the market
• Integration capability
• Low pitch capability
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Smaller footprint and thinner package than Flip-Chip BGA
Simplified supply chain and manufacturing
infrastructure/shorter lead-times
No laminate substrate requiredShorter interconnections
Best in Cost/Simplest design
WLCSP KEY DIFFERENTIATORS
Chip
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WLCSP / FAN-IN KEY APPLICATIONS
WLCSP packaging
Smart phones
Smart watches
Smart earbuds
Antenna tuner(s)
PMIC
PMU
RF transceivers
Switches
Wireless charging IC
Envelope tracker
Connectivity module
MCU
Audio codec
Selective MCUs/Serival flash in
industrial apps
MCUs
Infotainment Modules/Sensors
Sensors
MOSFET devices
Mobile &
Consumer
Telecom &
Infrastructure
Automotive &
Mobility
END-MARKET Applications Devices
*Non-exhaustive list of companies and products
New: Newly covered in this year’s report WLCSP / Fan-In Packaging Technologies & Market 2020 | Sample | www.yole.fr | ©2020
*Fabless/IDM/OEM
Packaging supplier
Fabless OEMs continue to drive adoption of many
devices on WLCSP platform for Apple, Samsung
smartphones in addition to tablets.
While fabless OEMs design to WLCSP specifications for
many devices, top OSATs & secondary OSAT supply
chain optimizes processes/factory network in
establishing this robust market which is here to stay for
many years.
19
WLCSP IS SEEING ADOPTION IN APPLE EARBUDS
Apple airpods pro consist of 24+ WLCSP components as this wearable market segment is expected to grow
dramatically over the new five years.
Airpods Pro
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OSATs such as ASE w/SPIL, Amkor,
JCET, and PTI dominate this robust
WLCSP market. China WLCSP, Nepes,
Chipbond, Chipmos and other smaller
players also contribute to 8” WLCSP
significantly.
OSATS
IDM
FOUNDRY
WLCSP PACKAGING SUPPLY-CHAIN: POSITIONING OF PLAYERS*
FO
UN
DRY
OSA
TS
IDM
TSMC emerging as WLCSP provider as a turn-key
solution providing best time-to market, excellent
“foundry” quality for backend packaging services
such as WLCSP process flow and turn-key test
solutions as well.
*Non-exhaustive list of companies
WLCSP
PackagingIDMs are a critical part of the WLCSP
supply chain as many IDMs such as ST,
NXP, and TI initially qualified WLCSP
line as this form factor came along the
market. TI has expanded its WLCSP
factory network to Chengdu in
addition to Philippines.
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Contact our
Sales Team
for more
information
Fan-Out Packaging Technologies and Market 2020
Advanced Packaging Quarterly Market Monitor
Status of the Advanced Packaging Industry 2020
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YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
22
Contact our
Sales Team
for more
information
Fan-Out Packaging Processes Comparison 2020
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar
Chipset
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YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Deca M-Series Fan-Out Process
23
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: [email protected]
HOW TO USE OUR DATA?
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24About Yole Développement | www.yole.fr | ©2020
CONTACTS
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+ 1 310 600 8267
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