emerging non-volatile memory - i-micronews
TRANSCRIPT
© 2021
Emerging Non-Volatile
Memory
Market and Technology
Report 2021
From Technologies to Markets
Sample
22
o Embedded NVM for analog ICs 156
o Embedded NVM for MCU, SoC, ASIC, etc. 160
o Embedded cache memory for CPU/APU 174
o Embedded NVM for Edge AI 184
• Emerging NVM market forecast 192
o MRAM market forecast – in $M, Gb, units, and 12’’ eq. wafers 202
o PCM market forecast – in $M, Gb, units, and 12’’ eq. wafers 209
o RRAM market forecast – in $M, Gb, units, and 12’’ eq. wafers 223
• MRAM technology roadmap and players 230
Technology description, time to market, key players, products and trends
o MRAM manufacturing challenges - overview 253
• PCM technology roadmap and players 262
Technology description, time to market, key players, products and trends
• RRAM technology roadmap and players 282
Technology description, time to market, key players, products and trends
• FeFETs and other newly emerging NVMs (CeRAM, NRAM and more) 302
• China’s memory landscape 317
• Impact of Covid-19 on the memory business 331
• General conclusions 333
• M&A, partnerships, new companies and funding 341
• Noteworthy news 348
• How to use our data? 357
• Yole Group Presentation 358
• Glossary and definitions 2
• Table of contents 10
• Report objectives 11
• Scope of the report 12
• Methodology & definitions 13
• About the authors 14
• Companies cited in this report 15
• Comparison with the 2020 report 16
• Who should be interested in this report 18
• Yole Group related reports 19
• Three-slide summary 21
• Executive summary 25
• Context – Overview of the memory business 59
o Stand-Alone memory – NAND, DRAM, NOR and (NV)SRAM 66
o Embedded memory – eFlash, eDRAM, SRAM 81
o Memory market players 92
• Overview of emerging non-volatile memory 108
• Emerging non-volatile memory applications 120
o Fast/Reliable memory for industry, defense, etc. (NVRAM) 128
o Code/Data storage (NOR-like) 133
o Persistent memory (NVDIMM) 139
o Low-latency storage (SCM Drive) 147
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TABLE OF CONTENTS
33
4DS, Adata, Adesto, Advantest, Alliance Memory, AP Memory, Apacer, Apple, Applied Materials, ASE Tech. Hold., ASML,
Avalanche, Buffalo, Canon, Centon, CXMT, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, Dialog Semiconductor,
Dosilicon, Etron, ESMT, Everspin, Facebook, Ferroelectric Memory Company, Fidelix, Freescale, Fudan
Microelectronics, Fujitsu, Fusion IO, GigaDevice, GlobalFoundries, Google, GSI Technology, H-Grace, Hikstor, Hitachi,
HLMC, Honeywell, HP, Huawei, IBM, IDT, IMEC, Infineon, Intel, Intrinsic Semiconductor, ISSI, JHICC, Kingston, KLA
Tencor, Lam Research, Lapis, Lenovo, Longsys, Liteon, Lyontek, Macronix, Marvell, Maxio, Maxim, Materion, MediaTek,
Microchip, Micron, Montage Technology, Nantero, Nanya, Naura, Nikon, NEC, NetApp, NetList, Numem, Numonyx,
NXP, ON Semiconductors, Panasonic, Phison, Powerchip, Powertech, ProMOS Technologies, Qualcomm, Rambus,
Reliance, Realtek, Renesas, Rohm, Samsung, SanDisk, Seagate, Semtech, Silicon Motion, SK hynix, SK Materials, Smart
Modular Technologies, SMIC, Sony, SPIL, SST, Spin Memory, Spin Ion Technologies, STMicroelectronics, STEC, Swissbit,
TDK, Texas Instruments, Tezzaron, TEL, Teledyne e2v, Kioxia, TowerJazz, TPSCo, Transcend, Tsinghua Unigroup, TSMC,
UMC, UniIC Semiconductors, Unimos Microelectronics, Weebit, Western Digital, Winbond, XFab, XMC, YMTC, new
Chinese emerging NVM players and many more.
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COMPANIES CITED IN THIS REPORT
44
Simone Bertolazzi, Ph.D.
Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of Yole’s
memory team and contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and fabrication
processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting
materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the prestigious
Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland),
where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics.
Simone earned a double M.A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Contact: [email protected]
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Biographies & contacts
ABOUT THE AUTHORS
Emilie Jolivet
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages
the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships
with semiconductor leaders and the development of market research and strategy consulting activities. With its previous collaborations at Freescale
and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software &
computing. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated with
an MBA from IAE (Lyon,France).
Contact: [email protected]
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METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
aggregation
Preexisting
information
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SCOPE OF THE REPORT
Your needs are
out of scope of this
report?
Contact us for a custom study:
• Emerging non-volatile memory technologies
• Our market study focuses on the following emerging non-volatile technologies: (STT-)MRAM, RRAM, and PCM.
• New memory types could emerge in the long term, such as oxide-based FeFETs, SOT-MRAM, VCMA-MRAM,
CeRAM. Although promising, these technologies are still in their early development stages and their future adoption
in commercial products is likely no to occur before 2026, which is the time limit assumed for this market study.
• Emerging non-volatile memory applications
Stand-alone:
Fast/Reliable memory for industry, defense,etc. (NVRAM)
Code/Data storage (NOR-Flash replacement)
Persistent memory (NVDIMM)
Low-latency storage (Client SCM Drives)
Low-latency storage (Enterprise SCM Drives)
Embedded:
Embedded NVM for analog ICs (EEPROM/eFlash-like)
Embedded NVM for MCU, SoC,ASIC… (Slow-SRAM/eFlash-like)
Embedded cache memory for CPU (SRAM/eDRAM-like)
Embedded cache memory for APU (SRAM/eDRAM-like)
Embedded NVM for Edge AI
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REPORT OBJECTIVES
• Present an overview of the semiconductor memory market:
• Stand-alone (e.g., NAND, DRAM, NOR) and embedded memory (eFlash, SRAM): main markets, trends.
• Technology status, and roadmap for the coming years.
• Provide an understanding of emerging NVM applications:
• Market drivers & challenges, technology roadmap, players, and main trends are provided for a total of 10 application
fields: 5 for stand-alone and 5 for embedded. A roadmap with time-to-market (by application) is provided.
• Offer market forecasts for emerging NVM business:
• 2020-2026 market forecast in US$, Gb, number of dies, wafer starts.
• Price evolution, by both application and technology.
• Forecast for 10 applications and 3 technologies (MRAM, RRAM, PCM).
• Describe emerging NVM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market.
• Roadmap with technological nodes, and chip density evolution with main players.
• Latest product development status for each key market player.
• Detail and analyze the competitive landscape:
• Recent acquisitions and funding.
• Latest company news.
• Key players, by technology and application.
8
2021 REPORT UPDATES
New content compared to the 2020 version
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• Updated market data on the stand-alone memories: NAND, DRAM, (NV)SRAM, and more.
• Updated market forecast and technical trends for PCM, MRAM, and RRAM.
• Re-definition of the AI market segment – “Embedded NVM for Edge AI” – to include the following types of products:
• Edge AI chips based on emerging NVM replacing SRAM (digital approach)
• Analog In Memory Computing (AIMC)
• Report on the recent activities on ferroelectric technologies (.e.g., FeFET) and other newly-emerging devices:
• SOT-MRAM,VCMA-MRAM, CeRAM and NRAM.
• Overview of equipment – technology,challenges and solutions – for manufacturing magnetic memories (STT-MRAM).
• Financial analysis of leading memory companies involved in the emerging NVM business.
• Presentation of Intel’ new products and activities to develop the Persistent Memory (PM) ecosystem.
• Overview In-Memory-Computing (IMC) approaches for Neural Network (NN) computation.
• Comprehensive list of company announcements, press releases, industry news and highlights from the IEDM 2020 conference.
• Updated analysis of new entrants and startup funding.
• Updated presentation ad analysis of emerging NVM activities in China.
• Analysis of the impact of the COVID-19 pandemic on the memory business.
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STAND-ALONE MEMORY BUSINESS
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EMBEDDED MEMORY BUSINESS
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EMBEDDED EMERGING NVM PLAYERS
Key partnerships and developments for the top players
Foundry / IDM
Other
Alliances and
Licensing
RRAM Players Bulk 22nm (sampling)
22nm FD-SOI(in development)
Bulk 28/22nm (in development)
22nm FinFET (in development)
55nm
(STT-)MRAM
Players22nm bulk
(production)
22nm FD-SOI(production)
28nm FD-SOI (production)
28/22nm bulk(in development)
22nm FinFET (pre-production)
28/22nm
PCM Players28nm FD-SOI (in qualification for
automotive)
Strategic alliances are essential for mass adoption of emerging NVM
Note: Dialog Semiconductor completed the acquisition of Adesto in July 2020, and they licensed Adesto’s CBRAM technology to G lobalFoundries in October 2020
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PLAYERS’ DYNAMICS, FINANCIAL ANALYSIS, AND MORE…
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TECHNOLOGY ANALYSIS, APPLICATIONS AND ROADMAPS
14
FOCUS ON INTEL OPTANE (3D XPOINT)
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1515
Product 1 – Sony
• Sony’s GNSS/GPS SoC (CXD5605) is based on a Samsung S4LP173 die manufactured on 28nm FDSOI
that features 8Mb of eMRAM.
• Sony’s CXD5605 chips are utilized in low-power Huawei Watch GT2. They were first introduced at
the FDSOI Shanghai Forum in September 2019.
Product 2 – Ambiq Micro
• In September 2020, Ambiq launched the 4th series of Apollo MCUs, which employ 16Mb eMRAM
instead of eFlash.They are manufactured with TSMS’s 22nm ULL process.
• Apollo 4 MCUs are based on Arm Cortex-M4, which runs up to 192 MHz while using 3 µA/MHz (10
times lower than the industry average).
• The Apollo family of highly-integrated MCUs from Ambiq Micro are optimized for use in wearable
electronics, activity & fitness monitors, wireless sensors and other power-sensitive and
battery-operated applications.
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The first IC products with eMRAM hit the market in 2020. They are used in wearables.
EMBEDDED MRAM – MARKET PRODUCTS
Source: Ambiq
Source: Huawei
16
EMERGING MEMORY – EMBEDDED APPLICATIONS
Potential eFlash/SRAM market cannibalization by emerging NVM
Beginning of Emerging NVM Application
Tech
no
log
y N
od
e 55nm
40nm
28/22nm
14nm
2023 2025
130nm
180nm
Embedded emerging NVM
Established embedded memory
SRAM for MCU,
CPU, GPU, AP…
(TAM2020~$XX)
NVM for AI / IMC(2)
NVM for MCU,
SoC, ASIC, etc.
20212019 2020
110nm
7nm
5nm
20222018 2024
eFLASH for MCU
(TAM2020~$XX)
≈
Cache Memory
for CPU/APU
NVM for Analog IC(1)
Note: the bubble size is
indicative of the market size
(1) TSMC starts to adopt RRAM in its
40nm ULP process PMIC and low-
power IoTs. Subsequent adoption of
RRAM by analog foundries is expected
at nodes 90-130nm (likely after 2022).
(2) Emerging NVM will be likely
competing against an analog-like eFlash
technology for in-memory computing.
(the market is not established yet).
(1) In analog ICs, the average memory
density of eFlash or EEPROMs (e.g.,
OTP/MTP) is very low (<<1Mb), so the
“memory”-related revenues are
estimated to be below $50M.
MTP/OTP/eFlash
For Analog ICs(1)
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17
TOWARDS MASS ADOPTION OF EMERGING NVM TECHNOLOGIES
Stand-Alone Chip Provider
Module System
nvNitroTM Storage Accelerator
FlashCoreTM Module
Optane DIMM
Server Processor
Embedded NVM IP Provider
STT-MRAM
Enterprise-Storage
Players
3D XPoint
IoT, General Purpose
and Automotive MCU
integrators
Foundries
In the early
stages of
deployment,
Trojan-horse
strategies are
used to
introduce
emerging NVM
technologies to
the market
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Optane Hybrid SSD
Bundle
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FERROELECTRIC FETS AND OTHER NEWLY EMERGING NVMs
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EMERGING NVM BUSINESS IN CHINA AND IMPACT OF COVID-19
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2020 - 2026 MARKET FORECAST FOR MRAM, PCM AND RRAM
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Yole Développement
YOLE GROUP OF COMPANIES RELATED REPORTS
Status of the Memory Industry 2020
DRAM and NAN Market Monitor 2020
MRAM Technology & Business2019
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YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Intel Optane 128GB DIMM
2323
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