5g packaging trends for the smartphones - i-micronews
TRANSCRIPT
From Technologies to Markets
© 2021
From Technologies to Markets
5G Packaging Trends for the Smartphones
Market and Technology
Report 2021 Sample
225G Packaging Trends for the Smartphones | Sample | www.yole.fr | ©2021
TABLE OF CONTENTS
• Glossaries 2
• Table of contents 4
• Report objectives 5
• Scope of the report 7
• Report methodology 8
• About the authors 9
• Companies cited in this report 10
• Definitions 11
• Who should be interested by this report 13
• Yole Group of Companies related reports 14
• 3 pages summary 15
• Executive summary 19
• 5G Market Drivers & Dynamics 48
o Evolution of 5G networks, applications, implementation timeline,
disruptions and opportunities
• 5G packaging trends 70
o Technology & trends, RFFEM SiP architectures, requirements,
challenges, roadmap, interconnection trends
o 5G Packaging Market Forecasts 92
o Cellphone forecast by type & air standards, 5G RF component
packaging market at wafer-level & SiP level, RF SiP forecasts in
units & market by type of SiP modules
o Packaging for 5G mmWave including AiP 113
o AiP trends, antenna key parameters, design for mmW & sub6Ghz,
,AiP markets forecast, technology challenges, Flip-chip vs fan-out
o Players and supply chain 138
o Player landscape and positioning, company strategies, packaging
supply chain of key RFFEM suppliers
o 5G Packaging Technology trends by players 157
o 5G packaging Substrate Material Trends 169
o Technology trends, suppliers, market forecast
o EMI Shielding trends for 5G packaging 197
o Summary & Outlook 206
o Appendix 209
33
5G Packaging for Smartphones 2021 is a new report which focuses on the modules and components packagingfor the 5G Sub6Ghz and 5G mmWave.The objectives of this new report are as follows:
o Discuss drivers and dynamics for 5G varieties: 5G mmWave and 5G sub-6 GHz, and investigate thedisruptions and opportunities thereof
o Focus on various SiP architectures in the RF Front end of cellphones, for both cellular and connectivity
o RF front-end SiP market forecast in revenue, wafers, and units by:
o Interconnects trends forecast for RF SiP
o Analyze various developing RF SiP architectures for sub-6 GHz and mmWave frequencies, advantages andsuitability thereof
o RF front-end multi-die SiP roadmap, challenges, and technology requirements for 5G sub-6 GHz and 5GmmWave (>24 GHz) bands, including antenna-in-package (AiP) trends
o Analyze supply chain changes and opportunities for 5G in smartphones, focusing on RF SiP manufacturingand assembly, including package substrate
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REPORT OBJECTIVES
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SCOPE OF THE REPORT (1/2)
Yours needs are
out of the report’
scope?
Contact us for a custom study:
RF Front-End modules and components
5G sub 6 GHz and 5G mmWave modules and components including AiP
Modems, transceivers, baseband processors
Topics NOT included in the report
Main focus
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SCOPE OF THE REPORT (2/2)
Yours needs are
out of the report’
scope?
Contact us for a custom study:
Cellular
Baseband
SoC
Cellular RF
Transceiver
RF
Front-End
RF signal amplification,
filtering and rooting
up/down to the antennas
Analog
Up/Down
conversion
Digital
Signal coding
Report scope
The focus of the report is on the RF Front-End and Antenna in Package (AiP) packaging for the 5G mobile
applications covering sub 6Gz and mmWave. The 5G cellular baseband and the RF transceiver are not
covered in this report from the package point of the view, except for the mmWave RF module, where RF
transceiver is integrated in the package
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METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
77
Santosh KUMAR
Santosh Kumar is currently working as Senior Director & Principal Analyst in the Semiconductor & Software division at Yole Développement, part ofYole Group of Companies. His main interest areas are advanced electronic packaging materials and technology including TSV and 3D packaging,modeling and simulation, reliability and material characterization, wire bonding and novel solder materials and process etc. He received bachelor andmaster degrees in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul, respectively. He has published more than40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiumsrelated to advanced microelectronics packaging.
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Biographies & contact
ABOUT THE AUTHORS
88
Amkor (J-Devices, Nanium), Acco, Ajinomoto Fine-Techno, Apple, Applied Materials, ASE Group, ASMPT (NEXX),
AT&T, AT&S, Avago Technologies, Besi, Broadcom, Cavendish, Daeduck Electronics, Deca Technologies, Dupont,
Ericsson, Evatec, Foxconn, GLOBALFOUNDRIES, Google, Henkel, HiSilicon, Hitachi Chemical, Huawei, Huatian,
Ibiden, Infineon, Intel, JCET/STATS ChipPAC, Kinetics, Kinsus, Kyocers, Kulicke & Soffa, Lenovo, LG Electronics, LG
Innotek, Marvell, MediaTek, Mitsubishi Materials, Mitsui Kinzoku, Murata, Nepes, NXP Semiconductors (Freescale),
NGK/NTK, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech
Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Rogers, Samsung Electronics, Samsung Electromechanics
(SEMCO), SJSemi, Shinko, Skyworks Solutions, Soitec, Spreadtrum, SPIL, Sprint, TDK-EPCOS, Tongfu
Microelectronics, Towa, TSMC, Unimicron, Unisem, USI, Wisol, Xiaomi, Yamada, ZTE and more…
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COMPANIES CITED IN THIS REPORT
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WHO SHOULD BE INTERESTED IN THIS REPORT
RF component manufacturers
• Evaluate market potential of future technologies and products
• Understand the differentiated value of your products and
technologies in this market
• Build a roadmap for modules: which type of modules? When?
• Identify new business opportunities
• Identify potential strategic partners or technology providers
• Monitor and benchmark your competitor’s advancements
RF foundries, material and equipment suppliers,
packaging houses• Understand what the components and technologies that will drive
the volumes in 2025
• Identify new business opportunities and prospects
RF and component specialists (manufacturers,
fabless), transceiver, modem, software vendors…• Spot new opportunities and define diversification strategies linked
to RF components
Mobile phone OEMs• Evaluate market potential of future technologies and products to
differentiate your products
• Evaluate the benefits of using these new technologies in your end
system, design architectures for the next generation of systems
• Screen potential new suppliers able to provide new functionalities,
or cost and size savings
R&D centers
• Assess market potential and trends about future technologies and
products
• Identify the best candidates for technology transfer
Financial & strategic investors
• Understand the structure and value chain of RF cellular
technology
• Estimate the potential of new technologies such as SOI, RF
MEMS,…
• Get the list of the main key players and emerging start-ups of this
industry worldwide
10
AIR STANDARD EVOLUTION
Toward network standard unification
Standard unification has been followed by an explosion in mobile applications
1G
AMPS
TACS
ETACS
NMT450
NTT/JTACS/NTACS
C-Netz
Radiocom 2000
RTMI
GSM
CDMA
D-AMPS
PDC
PHS
WCDMA
CDMA2000
TD-SCDMA
WiMAX
FDD-LTE (A)
TDD-LTE (A)
NR NR
2G 3G 4G 5G 6G
1980 1990 2000 2010 2020 2030
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11
5G COMMERCIAL AVAILABILITY
Worldwide 5G network launches
Multiple 5G networks have been launched worldwide. North East Asia is quickly adopting 5G with more than 75 M subscribers as of June 2020
<5 M subscribers
<1 M subscribers
> 75 M subscribers
<1 M subscribers
<1 M subscribers
Fully launched
Multiple launches
Single launch
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12125G Packaging Trends for the Smartphones | Sample | www.yole.fr | ©2021
5G PACKAGING ROADMAP (FROM 2G TO 5G AND FURTHER …)Leve
l of in
tegr
atio
n =
> Fro
m d
iscr
ete
to
Hig
hly
inte
grat
ed S
iP
2G (GSM)
3G (WCDMA)
4G(LTE)
5G Sub 6GHz
5G mmWave
6GSingle-side SiP
Single side SiP
Double-side SiP
Enhanced double-
side SiP
AiP
Outside
phone body
2008 2013 2019 2020 >>2025
Phone
caseFlex PCB Package
Package or
wafer BEOL ??Antenna
placement
Single /double side SiP
Enhanced double-side SiP
5G mm Wave onwards need disruptive
innovation in packaging for complex
interconnections
Discrete PA pkg
Low loss package
material: substrate,
dielectric, mold
Laminate/ceramic/glass
Flip-chip, fan-out
WLP/PLP
Thermal management
Heterogeneous package integration
with precision antenna arrays, low-
loss interconnects and waveguides
and active devices
Ultra low loss material
Sub THz antenna array
Optical interconnect
Thermal management
(>100W/cm2)
No FEM,
Discrete PA
Usually 1 FEM (Tx,Rx)
Discrete PA still main
3-5 FEM
PA + FEM integration5-7 FEM
PA + FEM integration
7-9 FEM
PA + Antenna + RFIC+
FEM + PMIC integration
PA + Antenna + RFIC+
FEM + PMIC+ Modem
integration
Heterogeneous
integration
AiP/AoC
1313
RF FRONT-END MODULE COMPONENT DESCRIPTION
Filter
Switch
esPA
PMIC
Switch
es
PA
PMIC
PA
PMIC
PMIC
MMIC
PA Ante
nnas
Filter
Switch
es
LNA
Filter
Switch
es
Switch
es
Single radio support
2G, 3G, 4G or 5G
Multi radio support
2G & 3G, 3G & 4G, …
No Filter functionLNA
FilterSwitch
es
PA
PMIC
LNADuplexer
Filter
Switch
esPA
PMIC
Multiple radio support
Filter and switches
Multiple radio support
Filter, switches and LNA
Multi radio support 3G & 4G, 4G & 5G, …
PA, Switch, Filter, Duplexer, Multiplexer, LNA
5G mmWave support
MMIC, antenna, eventually a PA
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1414
5G PACKAGING MARKET FOR MOBILE
Packaging at both wafer and SiP level
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BAW
filters
SAW
filters
Power
Amplifier
Low Noise
AmplifierSwitchesIPDs
RF Transceivers for
AiP (mmWave FEM)
Bumped die Bare die
Coreless substrate
SMD Passives
Wafer Thinning,
Dicing, Probe
WLP capping, TSV,
Bumping, Thinning,
Dicing, Probe
SMT
Wire-
bond
Shielding
SMT
Various RF components considered for the 5G RF SiP assembly market
1515
Air standard segmentation is quite complex as multiple generations can be mixed on a singlecomponent
Cellular Front-End segmentation is more difficult as multiple air standards can be aggregated in a singlecomponent.
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PACKAGING MARKET FOR 5G
2G • Standalone 2G PAM
3G • MMMB PA aggregating 2G/3G and standalone 3G PAM
4G • MMMB PA aggregating 2G/3G/4G, 2G/4G, 3G/4G
4G • Components and modules ensuring 4G connectivity
5G• Components and modules ensuring 5G connectivity (PAD Drx FEM,
LNA bank, discrete switch, standalone filter,…), as well as 4G modules that include 5G components (For instance 5G PA, filter,… in a PAD)
Classification of RF
modules by air
standards for
packaging market
calculation
FOCUS OF THE REPORT
1616
5G PACKAGING MARKET FOR SMARTPHONE
5G packaging market was $0.51B in 2020 and is expected to grow at 31% CAGR to reach ~$4.8B in 2026
AiP assembly market for the mmWcommunication in mobile will grow by XX% to reach ~$XXM in 2026. AiP market share in the 5G packaging market will increase from 11% in 2020 to 17% by 2026
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5G sub 6
RFFEM
48%
5G mmW
RFFEM
32%
mmW
AiP
15%
mmW
Discrete
antenna
5%
5G sub 6
RFFEM
49%
5G mmW
RFFEM
43%
mmW AiP
4%
mmW
Discrete
antenna
4%
2020
($
0.51B)
2026
($2.6B)
17175G Packaging Trends for the Smartphones | Sample | www.yole.fr | ©2021
5G PACKAGING SUPPLY CHAIN
v
vv
OSATS
IDMs
Packaging
/ Testing
Substrate suppliers
Mold
com
pound
v
Subst
rate
core
, pre
peg,
build
-up, R
DL d
iele
ctri
c
v
Inte
rconnect
mat
eri
als
v
Thermal interface material (TIM)
Plating tool
vEMI Shielding (sputter)
v
Die bonder
v
Molding equipment
18185G Packaging Trends for the Smartphones | Sample | www.yole.fr | ©2021
5G RF SUPPLY CHAIN STATUS
Manufacturing/Foundry Packaging/TestingDesign
PA
Sw
itch
-LN
A-T
un
er
Filte
r
Despite a growing number of design company trying to enter the RF Front-End market, a few leaders have captured most of the
market. Foundries and packaging houses have an ever-stronger footprint in the RF Front-End market
19
SUBSTRATE MARKET FOR 5G PACKAGING
By 5G sub6GHz & mmWave SiP module
Substrate market for 5G mmWave SiPgrow by XX% to reach ~XXM by 2026, while for 5G sub6GHz SiP, it’ll grow by XX% to reach ~$XXXM
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2020 2021 2022 2023 2024 2025 2026 CAGR
5GmmWave5G sub 6
5G packaging substrate market by 5Gsub6GHz & mmW module
20
SUBSTRATE MARKET FOR 5G PACKAGING
By different 5G RF modules (including Antenna)
Substrate market for mmWave AiPincrease from XX% of the total 5G substrate market in 2020 to XX% of the markt by 2026. 5G sub6GHz modules account for XX% of the substrate market by 2026
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5G sub
6
5G
mmW
RFFEM
mmW
AiP
mmW
Discrete
antenna
5G sub 6
5G
mmW
RFFEM
mmW
AiP
mmW
Discrete
antenna
2020
($XM)
2026
($XM)
21
Contact our
Sales Team
for more
information
21
Contact our
Sales Team
for more
information
5G's Impact on RF Front-End for Telecom Infrastructure 2021
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YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
22
Contact our
Sales Team
for more
information
22
Contact our
Sales Team
for more
information
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YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Qualcomm’s Second Generation 5G mmWave Chipset, from
Modem to Antenna
Broadcom AFEM-8200 PAMiDin the Apple iPhone 12 Series
RF Front-End Module Comparison2021 –Vol. 2 – Focus on 5G
Chipset
2323
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