intel 100g psm4 qfso28 transceiver - i-micronews
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©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Intel 100G PSM4 QFSO28 TransceiverOptical Fiber Transceiver for Datacenter based on Intel’s Silicon Photonics
Photonic report by Sylvain HALLEREAUMarch 2019 – version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 2
Table of Contents
Overview / Introduction 4o Executive Summaryo Reverse Costing Methodology
Company Profile 8o Intelo Intel 100G PSM4 Edition Teardown
Market Analysis 16o Ecosystem & Forecast
Physical Analysis 20
o PSM4 Connector Teardown 23 Module View Function Identification
o Transmitter Block 29 View & Dimensions and Cross-Section Fiber Optic Coupler, Prism and Rotator Light Way and Lens Module
o MZI Modulator Driver Die 43 Die Overview & Dimensions Die Process and Cross-Section
o Silicon Photonic Die 57 Die Overview & Dimensions InP Laser process and cross-section MZI process and cross-section Mirror process and cross-section Waveguide process and cross-section Die Process Characteristic
o Receiver Block 97 Fiber Optic Coupler Light Way
o Germanium Photodiode die 104 Die View & Dimensions Die Process and Cross-Section
o TIA Die 116 Die Overview & Dimensions Die Process and Cross-Section
o MACOM MG37049G Die 129 Die Overview & Dimensions Die Process and Cross-Section
Comparison Intel Luxtera Silicon Photonic Die 143
Manufacturing Process 148o MZI Driver Die Front-End Process & Fabrication Unito Silicon Photonic Die Process Flowo Silicon Photonic Die Front-End Fabrication Unito Receiver Fiber Optic coupler, Process Flow and costo Germanium Photodiode Die Process Flow & Fabrication Unito TIA Die Front-End Process & Fabrication Unito MACOM M37049G Die Front-End Process & Fabrication Unit
Cost Analysis 165o Summary of the cost analysiso Yields Explanation & Hypotheses
o Transmitter Block 170o Si Photonic Die
o Wafer Costo Step costo Die Cost
o MZI Driver Dieo MACOM M37049Go Optical Elementso Assembly
o Receiver Block 188o Ge Photodiode Dieo TIA Dieo MACOM M37049Go Optical Elemento Assembly
Feedbacks 200
SystemPlus Consulting services 202
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theIntel’s Silicon Photonic 100G PSM4 QFSP28 Transceiver.
• In only a few years, Intel suceeded being number 2 supplier for Si photonics based optical transceivers. Intel has suceeded because they put a lot of effort into the bottleneck: the laser chip integration with its InP chiplet bonding followed by post processing. Intel introduced a silicon photonics QSFP transceiver that supports 100G communications in 2016 and since then, the company has nowships a million units of the product per year into data centers. Intel’s 400G products are expected to enter volume production in the second half of 2019. At ECOC 2018, Intel announced new 100G silicon photonics transceivers targeted at 5G wireless fronthaul applications. All these innovations have been allowed with the first generation, the Intel 100G series silicon photonics QSP transceivers featuring laser on chip.
• The transceivers came with two separated line with several dies. The transmitter integrated several InP laser and a CMOS die chiplets are bonded on a main silicon die in flip-chip configuration. On the main silicon die a Mach-Zehnder modulator is added in order to produce the signal. Other components are added to the system in order to focus or isolate the signals. The data are processed using a four channel 25G optical Clock and Data Recovery (CDR) component from MACOM. The receiver function is performed by 4 germanium photodiodes die and a TransImpedance Amplifier (TIA) circuit. The Ge photodiodes are manufactured on a dedicated SOI substrate. A specific fiber optical coupler with focusing lens is used to connect the photodiode die with the fiber optic.
• All of these described in this report shows the potential of Intel in term of packaging, and photonics. In a very small form factor, Intel managed to integrate four lasers, a photonic driver, optical modules, CDR functionality, high performance photodiodes, two advanced substrates and materials for optic. This report will show how implement the chiplet configuration along with a detailed description of the transmitter and receiver line.
• This report constitutes an exhaustive analysis of the main components of the Intel 100G PSM4 connector, including a full analysis of the Silicon Photonic die, the TIA circuit, the Mach-Zehnder Driver circuit, the MACOM circuit and the germanium photodiode alongwith a cost analysis and price estimate. The 2 fiber optic couplers, focusing lens and the isolator are describe and the price estimated. Moreover, a comparison with Luxtera silicon photonic circuit is performed.
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 4
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
Executive Summary
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 5
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Summary of the Physical Analysis – Transmitter Block
• The optical connector is disassembled to get dies and optical components data: dimensions, main characteristics, device markings.
• The components of the transmitter line are identified :
o Pictures of selected area are made in order to understand the connections and the way of light
o High Resolution Optical photographs to measure the lines dimensions.
o Cross section of Silicon Photonic die to measure thicknesses.
o Delayering of the die to observe waveguides, Mach-zehnder modulator, etc
o Cross section of optical parts to measure thicknesses and EDX analyse of the materials.
Lens module
Prism
Isolator
Fiber optic coupler
o Cross section of MZI Driver and CDR ICs to measure thicknesses.
o Explanation of the transmitter line
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Summary of the Physical Analysis – Receiver Block
• The optical connector is disassembled to get dies and optical components data: dimensions, main characteristics, device markings.
• The components of the receiver line are identified :
o Pictures of selected area are made in order to understand the connections and the way of light
o High Resolution Optical photographs to measure the lines dimensions.
o Cross section of Germanium photodiode die to measure thicknesses.
o Cross section of optical parts to measure thicknesses and EDX analyse of the materials.
Fiber optic coupler
o Cross section of TIA and CDR ICs to measure thicknesses.
o Explanation of the transmitter line
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Intel 100G PSM4
Intel 100G PSM4 Overview©2019 by System Plus Consulting
Intel 100G PSM4 Front, Side and Back View©2019 by System Plus Consulting
Dimensionso Height: 120 mmo Width: 18.5 mmo Thickness: 8.6 mm
Weighto 69g
120 mm
72.5 mm
8.6 mm
18.5 mm
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Intel 100G PSM4 Teardown
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Intel 100G PSM4 – Transmitter Block
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Intel 100G PSM4 – Optical Path of Light
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
InP Laser Diode – Silicon Photonic Die
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 100G PSM4 Teardowno Transmitter Block
o View, Dimensions, Cross-Section, Fiber Optic Coupler
o MZI Modulator Driver Dieo Die View & Cross-section
o Silicon Photonic Dieo InP Laser Cross-Sectiono MZI Modulator Cross-Secto Mirror Cross-Sectiono Waveguide Cross-Section
o Receiver Blocko Fiber Optic Coupler
o Ge Photodiode Dieo View & Processo Die Cross-Section
o TIA Dieo Macom M37049G Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Die Delayering – 4x Ge Photodiode Die
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Optical Elementso MZI Driver Die Fab Unito Si Photonic Process Flowo Si Photonic Fabrication Unito Ge Photo Fabrication Unito TIA Die Fabrication Unito MACOM Die Fabrication Unit
Cost Analysis
Related Reports
About System Plus
Silicon Photonic Die Wafer Process Flow Epitaxy
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso Transmitter Block
o Si Photonic Dieo Wafer Costo Step costo Die Cost
o MZI Driver Dieo MACOM M37049Go Optical Elementso Assembly
o Receiver Blocko Ge Photodiode Dieo TIA Dieo MACOM M37049Go Optical Elemento Assembly
Related Reports
About System Plus
Handle Wafer Front-End Cost
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso Transmitter Block
o Si Photonic Dieo Wafer Costo Step costo Die Cost
o MZI Driver Dieo MACOM M37049Go Optical Elementso Assembly
o Receiver Blocko Ge Photodiode Dieo TIA Dieo MACOM M37049Go Optical Elemento Assembly
Related Reports
About System Plus
Transmitter Block Cost
©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING• Luxtera Silicon Photonic Die• Mobile Camera Module Comparison 2019• STMicroelectronics’ Near Infrared Camera Sensor in the
Apple iPhone X• Apple iPhone X – Infrared Dot Projector• Orbbec’s Front 3D Depth Sensing System in the Oppo
Find X
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING• InP Wafer and Epiwafer Market – Photonic and RF Applications• Silicon Photonics 2018
In only a few years, Intel has become thenumber two supplier for silicon photonics-based optical transceivers. Intel hassucceeded because it put a lot of effortinto the bottleneck, which was integratingthe laser chip through InP chiplet bondingfollowed by post processing. Intelintroduced a silicon photonics Quad SmallForm-factor Pluggable (QSFP) formattransceiver that supports 100G com-munications in 2016. The company nowships a million units of this product peryear into data centers. Intel’s 400Gproducts are expected to enter volumeproduction in the second half of 2019. AtECOC 2018, Intel announced new 100Gsilicon photonics transceivers targeted at5G wireless fronthaul applications. Allthese innovations have been enabled byIntel’s first generation 100G series siliconphotonics QSFP transceivers, featuringlaser-on-chip integration.
The transceiver contains two separateblocks, each with several dies. Thetransmitter integrates several InP lasersand a CMOS die chiplets through bondingon the main silicon die in flip-chipconfiguration. On the main silicon die aMach-Zehnder modulator encodessignals. Other components focus or isolatethe signals. Data are processed using afour-channel 25G optical Clock and DataRecovery (CDR) component fromMACOM. The receiver function is perf-ormed by four germanium (Ge) photo-diode dies and a TransImpedance Amp-lifier (TIA) circuit. The Ge photo-diodesare manufactured on a dedicated Silicon-on-Insulator substrate. A fiber-opticalcoupler with focusing lens connects thephotodiode die with the fiber optic.
All of these components – described inthis report – show Intel’s potential interms of packaging and photonics. In avery small form factor, Intel manages tointegrate four lasers, a photonic driver,optical modules, CDR functionality, highperformance photodiodes, two advancedsubstrates and materials for optics. Thisreport will show how the companyimplements the chiplet configuration, andprovides a detailed description of thetransmitter and receiver line.
This report is exhaustive analysis of themain components of the Intel 100G PSM4connector, including a full analysis of thesilicon photonic die, the TIA circuit, theMach-Zehnder driver circuit, the MACOMcircuit and the germanium photodiodealong with a cost analysis and priceestimate. It also describes the two fiberoptic couplers, focusing lens and theisolator and estimates their price. We alsocompare the product against Luxtera’ssilicon photonic circuit.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Comparison
• Didactic explanation of device operation
• Estimated sales price
Deep analysis of the first silicon photonic die with Intel’s unique approach for laser integration, the outcome of 15 years of development, along with the main optoelectronic components in the connector.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Intel Silicon Photonic 100G PSM4 QFSP28
Pages: 200
Date: March 2019
Format: PDF & Excel file
Price: EUR 3,990
Intel Silicon Photonic 100G PSM4 QFSP28 Transceiver
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Intel Company Profile
Physical Analysis
• Physical Analysis Methodology• PSM4 Connector Teardown• Transmitter Block
• View, dimensions, light path, cross-section
• MZI Driver Die• Silicon Photonic Die
• Die overview and dimensions• InP laser process and cross-section• MZI process and cross-section• Mirror process and cross-section• Waveguide process and cross-section• Die process characteristic
• Receiver Block • View, dimensions, light path, cross-
section• Germanium Photodiode
• Die view and dimensions, process and cross-section
• TIA Die• MACOM MG37049G Die
Comparison Intel – Luxtera Silicon Photonics Dies
Manufacturing Process Flow
• MZI Driver Die Front-End Process and Fabrication Unit
• Silicon Photonic Die Process Flow
AUTHORS
• Silicon Photonic Die Front-End Fabrication Unit
• Receiver Fiber Optic coupler, Process Flow and Cost
• Germanium Photodiode Die Process Flow and Fabrication Unit
• TIA Die Front-End Process and Fabrication Unit
• MACOM M37049G Die Front-End Process and Fabrication Unit
Cost Analysis
• Summary of the Cost Analysis• Yields Explanation and Hypotheses• Transmitter Block
• Silicon photonic die• Wafer dost• Step cost• Die cost• MZI driver die• MACOM M37049G• Optical elements• Assembly
• Receiver Block• Germanium photodiode die• TIA die• MACOM M37049G• Optical element• Assembly
Estimated Price Analysis: Transmitter Block and Receiver Block
INTEL SILICON PHOTONIC 100G PSM4 QFSP28 TRANSCEIVER
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MOLEX – Luxtera Silicon PhotonicDieThe 1064101003 Quad SmallForm-factor Pluggable Plusconnector from Molex integratesthis photonic circuit fromLuxtera.November 2012 - EUR 2,990*
Sylvain Hallereau is in charge ofcosting analyses for IC, power andMEMS. He has more than 10 years ofexperience in power devicemanufacturing cost analysis and hasstudied a wide range of technologies.
Nicolas Radufe is in charge of physicalanalysis at System Plus Consulting. Hehas a deep knowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.
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©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 18
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©2019 by System Plus Consulting | Intel Silicon Photonic 100G PSM4 Transceiver 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Pluso Company serviceso Contact
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