qualcomm’s first 5g mmwave chipset - i-micronews

©2019 by System Plus Consulting | SP19482 Qualcomm 5G mmWave Chipset: SDX50M and QTM052 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Qualcomm’s First 5G mmWave ChipsetSDX50M and QTM052

SP19482 - Packaging report by Stéphane ELISABETHLaboratory Analysis by Nicolas RADUFFE

September 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of ContentsOverview / Introduction 4

o Executive Summaryo Reverse Costing Methodology

Company Profile 8o Qualcommo 5G Technologies Roadmapo 5G mmWave Handset Challengeso 5G mmWave Antenna, module and system configurationo Samsung Galaxy S10 5G USA Teardown

Market Analysis 27o RF Front-End Module Supply Chaino Connectivity Market Forecasto RFFE Market Forecasto 5G Commercial Rollout Summary

Physical Analysis 32

o Synthesis of the Physical Analysis

o Module Package 35 Package Views: Dimensions, marking, Block Diagram, Integration

o Main Board Cross-Section 40

Physical Analysis of the Baseband Module 44

o Baseband SiP 45 Package Views: Dimensions, marking

Package Opening: Views, Bill of Materials

Package Cross-Section : Dimensions, PCB Substrate

Summary of Physical Data

o Baseband SiP active dies 53 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic

Physical Analysis of the Antenna Board 78

o Antenna SiP 79 Package Views: Dimensions, marking

Gen. 1 Package Overview : Patch Antenna, Dipole Antenna, Shielding

Gen. 1 3D X-Ray deprocessing: Views, Routing, Antenna, Cross-Section Gen. 1 and Gen. 2 Comparison: Antenna, Transceiver Input,

Placements, Shielding Package Opening: Views, Bill of Materials

Package Cross-SectionPCB Substrate, Patch Antenna, Dipole Antenna

Summary of Physical Data Summary of main Dies

o Antenna SiP active dies 107 Die View & Dimensions Delayering & main Blocs Die Process: On Board Isolation, Transceiver

Die Cross-Section Die Process Characteristic

Physical Comparison 144 5G technology: Sub-6 GHz vs. mmWave Connectivity mmWave Solution: WiGig vs. 5G

Manufacturing Process 147o Synthesis of the main partso Baseband Processor, Transceiver, PMIC Die Front-End Process & Fabrication Unito SiP process & Fabrication Unit

Cost Analysis 161o Synthesis of the cost analysiso Yields Explanation & Hypotheses 164

o Baseband Processor Module 166 Dies Front-End Cost Dies Wafer and Die Cost

Baseband SiP Packaging and Component Cost

o Antenna SiP Packaging 175 Dies Front-End Cost Dies Wafer and Die Cost

Antenna SiP Packaging and Component Cost

Estimated Selling Price 184

Feedbacks 189

Company services 191




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

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About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm SDX50M and QTM052.

The complete solution has been specially designed for smartphone application, starting with Samsung but quickly spread with Motorola, Xiaomi, … The module in the Samsung Galaxy S10 5G USA, comes with four systems spread in the smartphone. The first SiP is the baseband processor using a standard BGA SiP packaging coupling Flip-Chip and Wire bonding integration. The other systems are the antenna module that are spread at the corner of the smartphone in order to provide a spherical coverage. The modules are placed in the smartphone in order to provide a full coverage without any hand blocking constraint.

Two generation of the antenna module are integrated in the flagship. The first generation come with dipole antenna coupled with patch antenna. The patch antenna is designed in order to provide a wide band radiating system. Among the innovation in the antenna design, Qualcomm seems to integrate Aperture coupling patch, Dual Polarized Antenna, and Dual band Antenna. In the second generation, the component has been shrunk by almost 30 % in order to fit in the smartphone’s z-height.

This report includes a full investigation of the system, featuring a detailed study of the SiPs including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features an exhaustive comparison with the structure of the Sub-6 GHz chipset and the Qualcomm’s WiGig Chipset dedicated to handset.




Overview / Introduction

Company Profile & Supply Chain o Qualcommo 5G technologyo 5G mmWave challengeso 5G mmWave configurationo Samsung Galaxy S10 5G USA

Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


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Samsung Galaxy S10 5G US Teardown

Samsung Galaxy 5G USA Plus Opening©2019 by System Plus Consulting

Samsung Galaxy 5G USA Plus – X-Ray View©2019 by System Plus Consulting

5G Antenna Module

Antenna Module – Side X-Ray View©2019 by System Plus Consulting






Market Analysis

Physical Analysis o Synthesiso Moduleo Board Cross-Sectiono Baseband SiP

Package SiP Cross-Section SiP Active Dies

o Antenna SiP Overview X-Ray Overview Package Antenna SiP Cross-Section Transceiver and PMIC Dies

Physical Comparison


Cost Analysis


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Modules Views & Dimensions






Market Analysis




Physical Comparison


Cost Analysis


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Board Cross-Section

Cross-Section Plan©2019 by System Plus Consulting

Board Cross-Section – Optical View©2019 by System Plus Consulting

Main Board #1

Flash Memory Die

PMIC Die

Main Board #2

Via Frame

• The PCB is made with three parts. Two main boards connectedwith a via frame.

• The baseband processor is soldered on the main board #1.

• The on board AiP is soldered on the main board #2.






Market Analysis




Physical Comparison


Cost Analysis


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Baseband Processor Module – Bill of material






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Package Opening






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Package Overview – X-Ray View

• Tomographic X-Ray view has been made on both generation of AoP to reveal the differences and the similarity. This analysis isnondestructive and allows us to virtually made cross section of the board. In this view, the silicon dies aren’t visible.






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Package Overview – Gen. 1 – X-Ray View – Dipole






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Package Overview – Gen. 1 vs. Gen. 2 – X-Ray View






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Transceiver Die Dimensions






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Transceiver Die Overview






Market Analysis




Physical Comparison


Cost Analysis


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Antenna Module – Transceiver Die Cross-Section – Transistor






Market Analysis

Physical Analysis

Physical Comparisono 5G Technologyo Connectivity mmWave


Cost Analysis


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5G technology – Sub-6 GHz vs. mmWave






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Baseband FE Cost & Wafer/Die

Costo BB SiP Packaging Costo BB SiP Component Costo Transceiver/PMIC FE Cost &

Wafer/Die Costo Antenna SiP Packaging Costo Antenna SiP Component Cost


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Baseband Processor Module – Modem Front-End Cost






Market Analysis

Physical Analysis

Physical Comparison







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Baseband Processor Module – Component Cost






Market Analysis

Physical Analysis

Physical Comparison







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Antenna Module – Transceiver Front-End Cost






Market Analysis

Physical Analysis

Physical Comparison







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Antenna Module – Packaging Cost






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

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Estimated Manufacturer Price






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

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Chipset estimated Manufacturer Price






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


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MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• 5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019• Advanced RF System-in-Package for Cellphones 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF & PACKAGING• Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition• RF Front-End Module Technical Comparison 2019• Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series

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https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/

https://www.i-micronews.com/products/advanced-rf-sip-for-cellphones-2019/

https://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/

https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-technical-comparison-2019/

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With the integration of the first mmWavechipset in a handset, Qualcomm hasstarted the 5G revolution early. We haveseen a first glimpse of how compatible thesystem could be to very high frequencyconnectivity. This year, we have seen theintroduction of real 5G connectivity, ledby Samsung. Starting with the Sub-6GHzapplication, Samsung launched its flagshipat the beginning of this year in SouthKorea. The second step was to release themmWave version in America inpartnership with Qualcomm, whichsupplies the complete chipset for thisversion.

The complete solution has been especiallydesigned for smartphone applications,starting with Samsung but soon to spreadto other designs from companies such asMotorola and Xiaomi. The module in theSamsung Galaxy S10 5G USA, comes withfour systems spread throughout thesmartphone. The first System-in-Package(SiP) is the baseband processor, whichuses standard Ball Grid Array (BGA) SiPpackaging, coupled with Flip-Chip andWire Bonding integration. The othersystems are the antenna module, whichare spread around the corner of thesmartphone in order to provide sphericalcoverage. The modules are placed in thesmartphone in order to provide fullcoverage without any hand-blockingconstraints.

Two generations of antenna modules areintegrated in the flagship. The firstgeneration comes with a dipole antennacoupled with a patch antenna.

The first generation comes with a dipoleantenna coupled with a patch antenna.The patch antenna is designed in order toprovide a wide-band radiating system.Among the innovations in the antennadesign, Qualcomm seems to integrate anAperture Coupling Patch, Dual PolarizedAntenna, and Dual-Band Antenna. In thesecond generation, the component hasbeen shrunk by almost 30% in order to fitin the smartphone’s z-height.

This report includes a full investigation ofthe system, featuring a detailed study ofthe SiPs, including die analyses, processesand board cross-sections. It contains acomplete cost analysis and a selling priceestimation of the system. Finally, itfeatures a technical comparison with thestructure of the Sub-6GHz chipset and theQualcomm’s WiGig chipset dedicated tohandsets.

COMPLETE TEARDOWN WITH

• Detailed photos and cross-sections

• Precise measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

• Comparison with WiGig chipset for handset application

A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset (AiP + BaseBand) for handset applications.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Qualcomm 5G mmWave Chipset

Pages: 194

Date: September 2019

Format: PDF & Excel file

Price: EUR 3,990

Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

TABLE OF CONTENTS

IntroductionCompany Profile and 5G TechnologySamsung Galaxy S10 5G USA TeardownMarket AnalysisPhysical Analysis

• Physical analysis - Methodology• Module analysis

o Module view: dimensions, marking, integration and block diagram

• Main board analysiso Board overview and cross-section

• Baseband processor SiP analysiso Package view and dimensionso Package opening and bill of materialo Package cross-section: PCB, dimensionso Package process analysis

• Antenna SiP analysis: Gen. 1 and Gen. 2o Package view and dimensionso Package X-Ray: overall view, PCB

routing, antenna structure, cross-sections

o Package opening and bill of materialo Package cross-section: PCB, dimensionso Package process analysis

• Die analysis: Baseband processor, transceiver, PMIC

o Die view and dimensionso Die delayering and main block IDs

o Die cross-section and process• Physical analysis comparison

o Sub-6 vs. mmWaveo WiGig System vs. 5G system for

handsetsManufacturing Process Flow

• Die fabrication unit: Baseband processor, transceiver, PMIC

• SiP packaging fabrication unitEstimated Price Analysis

• Overview of the cost analysis• Supply chain description• Yield hypotheses• Die cost analyses: Baseband processor,

transceiver, PMICo Front-end costo Wafer and die costs

• Baseband and antenna SiP package cost analysis

o Baseband and antenna SiP front-end cost

o Baseband and antenna SiP ost by process step

• Final test cost• Final assembly• Component cost

Estimated Price Analysis

QUALCOMM'S FIRST 5G MMWAVE CHIPSET: SDX50M AND QTM052

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AUTHORS

Dr. Stéphane Elisabeth has joinedSystem Plus Consulting's team in 2016.He has a deep knowledge of Materialscharacterizations and Electronicssystems. He holds an EngineeringDegree in Electronics and NumericalTechnology, and a PhD in Materials forMicroelectronics.

Nicolas Radufe is in charge of physicalanalysis at System Plus Consulting. Hehas a deep knowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone EditionEarly glimpse of very compact form millimeter-wave chipset commercially available for handset applications.July 2018 - EUR 3,490*

RF Front-End Module Technical Comparison 2019Extensive overview of 100 RF Front-End modules and components found in eight leading flagship smartphones from Apple, Samsung, Huawei, Xiaomi, and Oppo.July 2018 - EUR 3,490*

Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr SeriesSecond generation of mid/high band Front-End module with advanced and innovative packaging.February 2019 - EUR 3,990*

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qualcomm’s first 5g mmwave chipset - i-micronews

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