mobileye eyeq4 processor family - i-micronews
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©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 1
22 BD BENONI GOULIN44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
MobilEye EyeQ4 Processor FamilyTricam and Monocam Version of Vision Processing
IC report by Sylvain HALLEREAUMarch 2019 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profil 8
o Mobileye
o EyeQ Family
Physical Analysis 21
o Physical Analysis Methodology
o System Teardown
o Package
Package Views, Dimensions & Marking
Package Opening
Package Cross-Section
o Die
View, Dimensions & Marking
Cross-Section
Process Characteristics
o Comparison Mobileye EyeQ4-High, EyeQ4-Mid and EyeQ3
Manufacturing Process Flow 56
o Global Overview
o EyeQ4 Front-End Process
o EyeQ4 Wafer Fabrication Unit
o Package Assembly Unit
o Back-End: Final test
Cost Analysis 65
o Yields Explanation & Hypotheses
o EyeQ4 Dies
Front-End Cost
EyeQ4 Tricam and Monocam Wafer & Die Cost
o Components
Back-End : Packaging Cost
Back-End : Final Test Cost
EyeQ4 Tricam Component Cost
EyeQ4 Monocam Component Cost
Estimated Price Analysis 76
o Definition of Prices
o Manufacturer Financial ratios
o Estimated Manufacturer price
o Selling price 500k, 1M & 5M Units
Company services 84
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profil & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost andselling price of the Mobileye EyeQ4® processor.
• After releasing the EyeQ2® processor in 2010 and the EyeQ3 in 2014, the two vision processors at the core of theAutonomous Emergency Braking (AEB) revolution that has already saved hundreds of lives. Mobileye, leader on themarket, just launched in 2018 the EyeQ4® processor which offers 10 times the processing capability of the EyeQ3®.EyeQ4® supports now, in addition to the previous chips, mapping using REM, Driving Policy, Vehicle detection fromany angle and next generation lane detection.
• With the generalization on all vehicles of AEB and the arrival of the Advanced Driver Assistance Systems (ADAS), thevision processor market is predicted to grow with an impressive CAGR of 90% from 2018 to 2024 according to YoleDeveloppement. In this highly competitive market, Mobileye is currently the leader of Camera-based AdvancedDriver Assistance Systems with products currently available in 160 car models from 18 original equipmentmanufacturers (OEM) including General Motors, Nissan, BMW and Honda.
• The EyeQ4 is still developed with STMicroelectronics, the manufacturer of the die. The EyeQ4 is based on the28nm FD-SOI low consumption technology from STMicroelectronics. Thanks to the SOI substrate, the EyEQ4 is 10time more powerful than the EyeQ3 for a power consumption only 20% upper.
• The EyeQ4-High® processor integrates four multi-threaded MIPS InterAptiv processor cores, coupled with six coresof the new generation of Mobileye’s Vector Microcode Processors (VMP), two Multithreaded Processing Cluster(MPC) cores and two Programmable Macro Array (PMA) cores.
• The EyeQ4-Mid® processor integrates three multi-threaded MIPS InterAptiv processor cores, coupled with fourcores of the new generation of Mobileye’s Vector Microcode Processors (VMP), one Multithreaded ProcessingCluster (MPC) core and one Programmable Macro Array (PMA) core. It can only process one camera while theEyeQ4-High can process 3 cameras.
Executive Summary
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 4
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
System Teardown
• The EyeQ4-High and EyeQ4-Mid circuits have been found in the ZF S-Cam4 TriCam Camera and S-Cam4 Mono Camera automotive system.
ZF S-Cam4 TriCam CameraZF S-Cam4 Mono Camera
• You can find the fully teardown analysis and the cost simulation of these 2 systems in the System Plus Consulting catalogue :• SP19457 - ZF S-Cam4 TriCam• SP19457 - ZF S-Cam4 MonoCam
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 5
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package View & Dimensions : EyeQ4-High Tricam
Package Top View – Optical View
22.5 mm
22
.5 m
m
• Package: Flip-Chip FBGA 784-pin
• Dimensions: 22.5 x 22.5 x 1.7mm
• Pitch: 0.8mm
Package Side View – Optical View
Package Bottom View – Optical View
10
.5 m
m
1.7 mm
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 6
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Top View – Optical View
22.5 mm
22
.5 m
m
• Package: Flip-Chip FBGA 784-pin
• Dimensions: 22.5 x 22.5 x 1.7mm
• Pitch: 0.8mm
Package Side View – Optical View
Package Bottom View – Optical View
10
.5 m
m
1.7 mm
The Tricam and the Monocam components are assembled in the same package, a flip-chip FBGA 784-pin
Package View & Dimensions : EyeQ4-Mid Monocam
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 7
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section
Underfill
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 8
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
EyeQ4-High Tricam Die View & Dimensionsxxmm
xxm
m
• Die Area: xx mm²(xx mm x xx mm)
• Number of PGDW per 12-inch wafer: xx
PGDW: Potential Good Dies per Wafer
EyeQ4-High Die Top View – Optical View
• Total Pad Number: xx
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 9
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Die Cross-Section – Metal Layers
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 10
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis o Summaryo System Teardowno Packageo Processo Cross-Sectiono Process Characteristico Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Die Cross-Section – Transistors
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 11
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Economic Hypothesis &
Yieldso Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
Related Reports
About System Plus
EyeQ4 Tricam and Monocam Wafer Front-End Cost
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 12
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Economic Hypothesis &
Yieldso Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
Related Reports
About System Plus
EyeQ4-High Tricam - Component Cost
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 13
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Financial Ratioso Manufacturer Priceo Selling Price
Related Reports
About System Plus
EyeQ4-Mid Monocam - Estimated Selling Price
©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 14
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
• Bluetooth 5: System-on-Chip Comparison 2018• Bosch MPC2 – Forward Automotive Camera for Advanced
Driver Asistance Systems• TRW S-Cam 3 – Forward Automotive Camera for
Advanced Driver Assistance Systems• Continental MFC430TA – Forward Automotive Camera for
Advanced Driver Assistance Systems• MobilEye_EyeQ3 Processor
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
• LiDAR for Automotive and Industrial Applications 2019• Radar and Wireless for Automotive: Market and Technology
Trends 2019• Artificial Intelligence Computing for Automotive 2019
After releasing the EyeQ2® processor in2010 and the EyeQ3® in 2014, the twovision processors have been at the core ofthe Autonomous Emergency Braking(AEB) revolution that has already savedhundreds of lives. In 2018 Mobileye, themarket leader, launched the EyeQ4®processor, which offers ten times theprocessing capability of the EyeQ3®.EyeQ4® adds supports for mapping usingRoad Experience Management, DrivingPolicy, vehicle detection from any angleand next-generation lane detection. Thevision processor market is predicted tohave an impressive Compound AnnualGrowth Rate (CAGR) of 90% from 2018 to2024 according to Yole Développement.Mobileye is currently the leader ofcamera-based ADAS, with productscurrently available in 160 car modelsincluding General Motors, Nissan, BMWand Honda.
The EyeQ4® chipsets are developed byMobileye and manufactured bySTMicroelectronics using the proprietary28nm Fully Depleted Silicon On Insulator(FD-SOI) low power consumptiontechnology. Thanks to the SOI substrate,the EyeQ4® is 10 times as powerful as theEyeQ3® for just 20% more powerconsumption.
The EyeQ4®-High and -Mid processors,found in the ZF S-Cam4 Tri-cam andMono-cam cameras, integrates multi-threaded Microprocessor from MIPS.These cores are coupled with the newgeneration of Mobileye’s Vector Micro-code Processors (VMP), Multithreaded
Processing Cluster (MPC) cores andProgrammable Macro Array (PMA) coresto manage up to three cameras at thesame time.
This report contains a complete teardownanalysis and a cost estimation of theEyeQ4®-High and-Mid processors. In afirst part, information about the packageand the overall die data: dimensions, maincharacteristics, markings ; are present.Then high-definition optical and SEMpictures of selected areas show the mainIntellectual Property (IP) blocks ans thetransistors' design. Finally, cross-sectionsof integrated circuits (ICs) allow tounderstand the manufacturing process.
The report features an exhaustivecomparison between the EyeQ4®-Highand -Mid versions and the previousEyeQ3®, highlighting the improvements,similarities and differences between thesethree circuits.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Comparison between EyeQ4-Mid, EyeQ4-High and EyeQ3
• Estimated sales price
Fourth generation Mobileye vision processor for Advanced Driver AssistanceSystems: EyeQ4-High version for Tri-cam and EyeQ4-Mid version for Mono-cam.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: MobilEyeEyeQ4 Vision Processor Family
Pages: 90
Date: April 2019
Format: PDF & Excel file
Price: EUR 3,990
Mobileye EyeQ4 Vision Processor Family
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
MobilEye Company Profile
EyeQ Family
Physical Analysis
• Physical Analysis Methodology
• System Teardown
• EyeQ4 High and Mid Packages
o Package views, dimensions and markings
o Package opening
o Package cross-section
• EyeQ4 High and Mid Dies
o View, dimensions and marking
o Cross-section
o Process characteristics
Physical Comparison
• Comparison between MobilEye EyeQ4-High, EyeQ4-Mid and EyeQ3
AUTHORS
Manufacturing Process Flow
• Global Overview
• EyeQ4 High and Mid Front-End Process
• EyeQ4 High and Mid Wafer Fabrication Unit
• EyeQ4 High and Mid Package Assembly Unit
• EyeQ4 High and Mid Back-End: Final test
Cost Analysis
• Summary of the Cost Analysis
• Yield Explanations and Hypotheses
• EyeQ4 High and Mid Dies
o Front-end cost
o Wafer and die cost
• EyeQ4 High & Mid Components
o Back-end : Packaging cost
o Back-end : Final test cost
o Component cost
Estimated Price Analysis
MOBILEYE EYEQ4 VISION PROCESSOR FAMILY
RELATED REPORTS
Bluetooth 5: System-on-Chip Comparison 2018Cost-oriented report on cutting edge components from NXP, Qualcomm, Dialog Semi-conductor and Nordic Semi-conductor, dedicated to the 5th generation Bluetooth protocol.August 2018 - EUR 3,990*
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Sylvain Hallereau is in charge ofcosting analyses for IC, power andMEMS. He has more than 10 years ofexperience in power devicemanufacturing cost analysis and hasstudied a wide range of technologies.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer. Coming fromAtmel Nantes, she has extensiveknowledge in failure analysis ofcomponents and in deprocessing ofintegrated circuits.
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©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 15
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©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 16
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©2019 by System Plus Consulting | Mobileye EyeQ4 Vision Processor Family 17
Overview / Introduction
Company Profil & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Pluso Company serviceso Contact
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