igbt market and technology trends 2017 report by yole developpement

August 2017

From Technologies to Market

Sample

IGBT Market and Technology Trends

2017

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INTRODUCTION

©2017 | www.yole.fr | IGBT Market and Technology Trends 2017 | Sample

• This report covers all IGBT types and the related markets. This includes:• IGBTs

• from 400V up to 6.5kV. IGBT

• Applications as:• Automotive

• Energy production (renewable energies such as photovoltaics, wind…) and transportation

• Transportation (rail, marine, avionics…)

• Industrial (motor drives, UPS…)

• Commercial (consumer, white goods…)

•

• This report is both application and technology oriented: • Each important application is targeted, with specific needs and evolutions analyzed, in order to determine challenges to

be faced for IGBT technologies and their impact on the overall market

• Technology evolution and choices of the main IGBT manufacturers in the world are analyzed, and technology roadmap is provided

• Technology roadmap is also provided

• Special focuses are also included in this report, based on current trends both for technology and supply chain organization:

• Chinese supply chain and market, manufacturers and technology

• Packaging trends and challenges to face, especially for power modules

• What’s in this report?

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YOLE METHODOLOGY

• Yole Développement uses mainly three different sources to best carry on this report:

• Internal knowledge: Yole has been working in the power electronics industry for years now and we have acquired a deep understanding of the market and its trends and evolutions. We have created a rich internal data-base of figures and key contacts in the industry.

• Interviews: we carry on an important number of interviews during the report production with key players of the industry all along the supply chain (dies and modules manufacturers, tiers 1 and 2, end users…).

• WSTS: World Semiconductor Trade Statistics => access to raw data

Three sources for Yole’sanalysis

Internal knowledge Interviews Raw data

IGBT market

figures

MULTI-SOURCING


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Biographies & contacts

ABOUT THE AUTHORS

Dr. Hong Lin works at Yole Développement, the "More than Moore" market research and strategy consulting company, as a technology and market analyst since

2013. She is specialized in compound semiconductors and provides technical and economic analysis. Before joining Yole Développement, she worked as R&D

engineer at Newstep Technologies. She was in charge of the development of cold cathodes by PECVD for visible and UV lamp applications based on

nanotechnologies. She holds a Ph.D in Physics and Chemistry of materials.

E-mail: [email protected]

Hong Lin

Ana VILLAMOR

Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is involved in many custom studies and reports focused

on emerging power electronics technologies, including device technology and reliability analysis (MOSFET, IGBT, HEMT, etc).

Previously, Ana was involved in a high-added value collaboration related to SJ Power MOSFETs, within the CNM research center for the leading power electronic

company ON Semiconductor. During this partnership and after two years as Silicon Development Engineer, she acquired a relevant technical expertise and a deep

knowledge of the power electronic industry.

Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in micro and nano

electronics, both from Universitat Autonoma de Barcelona (SP).



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Biographies & contacts

ABOUT THE AUTHORS

Zhen Zong works as an analyst for Power Electronics and Compound Semiconductors technologies and market at Yole Développement, the “More than Moore”

strategy consulting and market research company. He graduated from INSA Lyon with an engineering degree in material sciences, specialized in semiconductor

devices and Micro/Nano technologies.


Zhen Zong

Jonathan Liao

Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement (Yole). Jonathan is leading the quarterly power management market

updates. In addition, he performs technology & market reports for gate driver, discrete, module, compound semiconductors, and power management IC.

Before joining Yole, Jonathan served as a power electronics Sr. Analyst at IHS Markit. Within a global semiconductor business ecosystem, financial analyses and

power management scouting were part of his mission. Prior to IHS, he was a product engineer at Microchip Technology Inc. During this period, Jonathan gained a

strong expertise in analog & mixed signal devices.

Jonathan Liao earned his Master of Science (AZ, USA) and graduated with a Bachelor of Science (PA, USA).



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INTRODUCTION

• This report is built in three main parts:

• A part presenting our analysis, market metrics and forecasts, including splits by application and voltage range:

• Main applications each have an extensive analysis about global trends, type of devices used and market splits, in volume and in value:

• These applications are: Motor drives, UPS, PV inverters, Hybrid and electric cars, Rail traction, Wind turbines

• Secondary applications are presented through a lighter analysis on the trends and market metrics and forecasts:

• It includes consumer, commercial and other industrial applications, such as welding, transportation or induction heating

• A second part related to supply chain:

• Description and analysis of different established business models

• Market shares of main players, depending on voltage range

• Focus on Chinese players business model and main players strategy

• A third technology oriented part:

• Comparison between the different IGBT structures and analysis of their evolution, depending on the IGBT manufacturers

• Roadmap for IGBT future technologies

• Impact at a wafer level, with associated market metrics

• Overview of packaging evolution and new trends, both for discrete components and power modules

©2017 | www.yole.fr | IGBT Market and Technology Trends 2017

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FROM POLYSILICON TO AN INVERTER

Main Technical Steps over the Value Chain

The value-chain is complex, where different business core activities participate

Silicon growth

Epitaxy

WaferingPolishing

Silicon ingot Silicon wafer

Front-End

CZ Silicon epi-wafer

Chips: dies-on-wafer

Back-End

Back-grindingDicing,Flip-chip

Packaging

Binning, pick-and-placePackaging, Housing

Power module

Power Inverter

Litho, deposition, etching, metallization…

Can be replaced by the use of FZ thinned wafer (NDT/PFZ)

ApplicationPower device bare-die

Discrete component


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TECHNOLOGY BRIEFING

Semiconductor devices

IGBTs are positioned in high power applications, while MOSFETs are for higher frequency applications

6kV

4kV

2kV

200A 1kA 2kA 2.2kA+1MHz

100kHz

1kHz

100Hz

Vo

lta

ge Applications:

All types of inverters kW to MW range

---400V to 6.5kVUp to 3600A

Applications:AC drive – renewable

energy – Grid T&DMedium voltage only

(>1kV DC link)MW range minimum

Applications: AC drive – Grid T&D / Medium to high voltage

Today’s split between the different devices is very

clear, with each being used for a particular

application.

Recent improvements of Si devices (super junction,

high speed IGBT) and future materials (SiC, GaN)

will blur the boundaries and open new device

choices.


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INTRODUCTION

Power devices history

Two Main types of Power Devices current exists

Bip

ola

rFi

eld

Eff

ect

Tr

ansi

sto

rs

DiodeGTO

Thyristor

BJT

IGCT

1970 1990 2010 2020

IGBT

SiC BJT

SiCMOSFET

SJMOSFET

SiliconSiC

GaN

Gen. 2Max. 600V

Gen. 5Max. 6500V

…

SiC JFET

MOSFET

2017

SiC diode(unipolar)

Focus of the report

Yole Développement - July 2015 Thyristor & MOSFET era Si IGBT era WBG era ??

GaN HeMT


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Sample

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GLOBAL POWER ELECTRONICS MARKET

2016 – 2022 value chain analysis: converter, device, wafer

The total power electronics market perspectives are optimistic with a CAGR around 6% for the period 2016–2022

Power Inverters$49.5 B

Semiconductor power devices (discretes and

modules)

$12.5 B

Power wafers$1.25 B

2016

Power Inverters$70.8 B

Semiconductor power devices (discretes and

modules)

$16.4 B

Power wafers$1.44 B

2022

CAGR: +2.4%

CAGR: +6.1%

CAGR: +5.5%


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IGBT MARKET AND TECHNOLOGY TRENDS 2017

IGBT forecast by application

and type available in unit

shipments and revenues.


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IGBT MARKET METRICS & FORECASTS

Split between discrete components and power modules, in value and in volume

In 2016, discrete IGBT grew XX% and IGBT modules grew XX% in revenue

• IGBT market is divided between discrete components and power modules, the solution used depending on theapplication’s needs

• In term of shipment numbers, discrete components are six times the volume of power modules in 2016. However,the IGBT modules market three times the size of the discrete IGBT market in revenues.

• Medium and high voltage applications mostly use power modules, while consumer or low voltage applications preferdiscrete components.

IGBT Discrete

88%IGBT Modules

12%

Split between IGBT Discretes and Modules

in Shipment Units (2016)

IGBT Discrete

25%IGBT Modules

75%

Split between IGBT Discretes and Modules

in Revenues (2016)


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IGBT MARKET METRICS & FORECASTS

IGBT for End Market Applications

Detail IGBT application analysis are provided for motor drivers, EV/HEV, Rail, and others.


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• Market shares for discrete and power module manufacturers for 2016


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Information of the global IGBT supply

chain, market, and player rankings by

voltage.

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Detail analysis of the Chinese players and

technologies.


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• Insights and technology roadmaps for IGBTs, wafers,architectures, and packaging

Analysis of relevant technologies for the

advancement and/or replacement of IGBTs


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• Related Reports


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https://www.i-micronews.com/category-listing/product/power-sic-2017-materials-devices-modules-and-applications.html


https://www.i-micronews.com/category-listing/product/power-module-packaging-material-market-and-technology-trends-2017.html


https://www.i-micronews.com/category-listing/product/inverter-technology-trends-and-market-expectations.html


https://www.i-micronews.com/category-listing/product/status-of-the-power-electronics-industry-2017.html


https://www.i-micronews.com/category-listing/product/p1200v-sic-mosfet-vs-silicon-igbt-technology-and-cost-comparison.html


The IGBT market represents a very promising bet for the next few years. Yole Développement expects the IGBT market to go over $5B by 2022, with the major growth coming from IGBT power modules. It will follow power electronics’ growth pattern, mainly caused by the high volume automotive market, especially for the electrification of powertrains in Electric and Hybrid Vehicles (EV/HEV). The EV/HEV sector has great growth prospects because it is still an emerging market with tremendous volume potential. The total 2016 revenue for IGBTs in EV/HEV was estimated to be $845M and it is expected to represent about 40% of the whole IGBT market by 2022.

Another big sector for IGBT is clearly motor drives, which keep on growing, thanks to aggressive regulation targets. Yole Développement forecasts a compound annual growth rate (CAGR) of 4.6% for motor drives from 2016 to 2022. Photovoltaics (PV) and wind are very dynamic markets with growth from huge installations being installed during the last few years. It is worth to say that

China led the solar panel implementation in 2016, with an impressive 35 GW installed.

Low-medium voltage 400-1700 V IGBT discrete solutions are still very appealing for consumers, grid, welding or white good applications, which comprise a quarter of the total IGBT market. The white goods market share will increase, with a CAGR of about 6% over the next five years, due the need to increase energy efficiency in the systems. In addition, Yole Développement expects discrete IGBT shipments in the transportation market to double from 2016 to 2022, mainly for avionics and marine propulsion.

In this report, Yole Développement presents its updated IGBT market forecasts, split by voltage and application. Sub-segments are also analyzed for each of the eight main power electronics applications. Moreover, this year Yole Développement added a new application section which gives more details on energy storage systems, with an explanation of why that sector will represent a bigger market share for IGBTs in the near future.

IGBT MARKET AND TECHNOLOGY TRENDS 2017Market & Technology report - August 2017

HOW IS THE IGBT MARKET EVOLVING FOR DIFFERENT APPLICATIONS AND VOLTAGES?

The global IGBT market is growing, and IGBT technologies keep evolving. How will the IGBT marketface the adoption of high performance WBG based devices?

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Updated market metrics and

forecasts by application to 2022 in volume and value

• Comparison with Yole Développement’s former IGBT market forecast estimates

• Segmentation of the market and associated figures, split by voltage, and forecasts to 2022 in volume and value

• Analysis of supply chain and associated business models

• Presentation of main players by IGBT type, with associated ranking

• Main player identification and market share

• Wafer trends and market• General IGBT and technology

evolution• Deep per-player analysis of IGBT

technology• Overview of main challenges and

evolutions at power packaging level• Analysis of Chinese IGBT market

and related dynamics

WHAT’S NEW: • New forecasts, extended from

2016 to 2022• Market metrics and forecasts in

units and revenues, considering bare dies, discrete components or modules, depending on the application

• Segmentation modifications, voltage splits

• Update on business models for IGBT manufacturing

• Focus on Chinese players and their business model, technology gaps, and challenges

• Focus on IGBT technologies and architectures by player, with evolution from first generation to current generation

• Roadmap and future evolution for IGBT architectures

• Focus on future evolutions for IGBT packaging and roadmap analysis, both for modules and discretes

• Impact of SiC and the automotive industry with analysis of two different penetration scenarios

Total IGBT market evolution by application for 2016-2022

0

1

2

3

4

5

6

2016 2017 2018 2019 2020 2021 2022

Rev

enue

s (U

S$B)

EV/HEV Motors Others (detailed in the report)

(Yole Développement, August 2017)

TECHNOLOGY AND PACKAGING EVOLUTION FOR IGBTS TO COUNTER THE ARRIVAL OF NEW TECHNOLOGIES

Since the introduction of wide band gap (WBG) technologies to the market, the big question over what will happen with silicon based devices has been the timelines. The good performance that SiC and GaN materials can afford is already creating a battlefield with existing power devices. For instance, Yole thinks that there will be applications for SiC

which will impact the IGBT market, for example it is highly possible that it will take over the automotive market. However, we forecast that IGBTs will keep a significant market share in the power electronics industry and will not be replaced completely.

In fact, even if the IGBT has almost reached its technological limit, new designs and new materials


IGBT PLAYERS AND SUPPLY CHAIN: A WELL-ESTABLISHED BUSINESS IS ATTRACTING NEW PLAYERS

As IGBTs are mature devices, the supply chain is well established, with strong partnerships and companies well positioned in each level. Therefore, the main IGBT manufacturers that we included in our 2015 report are still in the IGBT best sellers, except ON Semiconductor, which has become one of the top five IGBT vendors after the acquisition of Fairchild at the end of 2016. However, more companies are entering the IGBT market in order to capture added value, like Starpower or Littelfuse.

The majority of the players have both discrete and module solutions in the 600-1300 V middle voltage range, which comprises more than the 60% of the global IGBT market. Only a few players work exclusively on low voltage discrete IGBTs, as Microchip or Sanken, while several players, like

Mitsubishi or Hitachi, sell only module solutions. In fact, module solutions rated from 2.5k V up to 6.5k V have been well introduced in the Chinese market thanks to high-speed rail and high-power locomotive technologies.

Big players like Infineon, Fuji, ON Semiconductor or Toshiba lead in both low and medium voltage IGBT discrete and modules mainly up to 1.7k V, and Mitsubishi dominates the high voltage IGBT manufacturing from 2.5k V.

This report provides an overview of updated market share, with a split between power module makers and discrete component makers. A description of the supply chain and the companies involved is also provided for each key power electronics application.

can still be used to improve system performance to overcome the WBG devices arrival. In coming years,

there will be new IGBT designs from Infineon, Fuji or ABB coming into the market. Packages are being improved by different manufacturers to decrease parasitics and improve system efficiency. A clear example is the introduction of the embedded techniques for discrete IGBTs and overmolded solutions for IGBT modules to reduce size or increase functional density.

Currently, IGBT manufacturers can have wide voltage ranges in their portfolios, going from 400 V to 6.5k V. The 400 V IGBTs will directly compete with MOSFETs, whereas IGBTs with voltages higher than 600 V will compete with superjunction (SJ) MOSFETs and WBG devices, which exhibit advantages over IGBTs. Lower voltage IGBTs will not be developed since they do not show any advantage compared with MOSFETs.

In this report, Yole Développement gives an insight into the technology roadmap, with detail on the different generations and packaging for both discrete and modules. It also gives an insight into why there will be competition between IGBT with WBG materials. (Yole Développement, August 2017)

IGBT technology evolution forecast

Trench FS with split gate

2017 SiC IGBT

P-ring FS+ Trench

Advanced HiGT

(Around 2020)

(Around 2025)

(Before 2020)

Superjunction IGBT

(Around 2025)

(Yole Développement, August 2017)

IGBT manufacturer ranking by voltage range

N° 1 N° 2 N° 3 N° 4 N° 5

400 V and less

600-650 V

1,200 V

1,700V

2,500-3,300 V

4,500 V and more

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)ABB, Advanced Energy, Alstom, Alpha&Omega SC, ASMC, American Superconductor, AnsaldoBreda, APC, AT&S, Atotec, Bosch, BYD, CAS-IGBT, Continental, CR Microelectronics, CREE, CRRC, CSR, Daimler, Danfoss, Daxin, DEC, Denso, DHC, Dynapower, Dynex, E3DC, Eaton, Eguana, Electrovipryamitel, Emerson, Enercon, Fronius, Ford, Fuji Electric, Gamesa, Gdle, General Electric, General Motors, GeneSiC, Global Technologies Group, Goldwind, Green Charge, Hitachi, HHGrace, Honda, Ideal Power, ILFA, Imecas, Infineon, Ingeteam, Ixys, IR Peri, KACO, Kawasaki, Keda Semiconductor, LG Chem, LS Power Semitech, Littelfuse, Shenzhen Lytran Technology, Macmic, Magnachip, Mercedes-Benz, Microchip, Microsemi, Mingyang wind power, Mitsubishi, Mitsubishi Electric, Nissan, Nordex, ON Semiconductor, Panasonic, Phoenix Semiconductor, Poseico, Powerex, Princeton Power Systems, Renesas, Rhom, Saft, Samil Power, Sanrex, Schneider Electric, Schweizer, Semikron, Semipower, Senec, SGEC, Shanghai Electric, Siemens, Silan, Silvermicro, Sino-Microelectronics, Sinovel, SMA, Semiconductor Manufacturing International Corporation, Sonnen, STMicroelectronics, Starpower, Sungrow, Suzlon, Tesla Motors, Tesvolt, The Switch, TMC, TMEIC, Toshiba, ToyoDenki, Toyota, TU Wien, United Power, Valeo, Vestas, Vincotech, Vishay, Walchip, Winde, Wolfspeed, VW, XEMC, Yaskawa, Zhonghuan Semiconductor

• Status of the Power Electronics Industry 2017

• Power SiC 2017: Materials, Devices, Modules, and Applications

• Inverter Technology Trends & Market Expectations

• 1200V SiC MOSFET vs Silicon IGBT: Technology and cost comparison

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Changes for the 2017 report 7

> Companies cited in the report > Executive summary > Preliminary definitions > Introduction > Market metrics and forecasts

Update on power electronics market 58

IGBT market metrics and forecasts 64

Application analysis 82> IGBTs for motor drives > IGBTs for PV inverters > IGBTs for electric and hybrid cars > IGBTs for rail traction > IGBTs for wind turbines > IGBTs for Uninterruptable Power Supplies > IGBTs for energy storage

> IGBTs for white goods > IGBTs for other markets

Supply-chain and player analysis 165

> Main players and their market shares > IGBTs in China

IGBT technology analysis 189

> IGBT history and positioning > Wafer trends and market > Architectures of silicon IGBT and analysis

Case studies of technology evolution 221> IGBT and technology evolution trends > Packaging for IGBT

Conclusions 271

Yole Développement presentation 274

TABLE OF CONTENTS (complete content on i-Micronews.com)

AUTHORS

Dr. Hong Lin works at Yole Développement, the “More than Moore” market research and strategy consulting company, as a technology and market analyst since 2013. She is specialized in compound semiconductors and provides technical and economic analysis. Before joining Yole Développement, she worked as R&D engineer at Newstep Technologies. She was in charge of the development of cold cathodes by PECVD for visible and UV lamp applications based on nanotechnologies. She holds a Ph.D in Physics and Chemistry of materials.

Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is involved in many custom studies and reports focused on emerging power electronics technologies, including device technology and reliabil i ty analysis . Previously Ana was involved in a high-added value collaboration related to SJ Power MOSFETs, within the CNM research center for the leading power electronic company ON Semiconductor. During her PhD and af ter two years as Silicon Development Engineer, she acquired a relevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in micro and nano electronics, both from UAB (SP).

Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement (Yole). Jonathan is leading the quarterly power management market updates. In addition, he performs technology & market reports for gate driver, discrete, module, compound semiconductors, and power management IC. Before joining Yole, Jonathan served as a power electronics Sr. Analyst at IHS Markit. Within a global semiconductor business ecosystem, financial analyses and power management scouting were part of his mission. Prior to IHS, he was a product engineer at Microchip Technology Inc. During this period, Jonathan gained a strong expertise in analog & mixed signal devices. Jonathan Liao earned his Master of Science (AZ, USA) and graduated with a Bachelor of Science (PA, USA).

Zhen Zong works as an analyst for Power Electronics and Compound Semiconductors technologies and market at Yole Développement, the “More than Moore” strategy consulting and market research company. He graduated from INSA Lyon with an engineering degree in material sciences, specialized in semiconductor devices and Micro/Nano technologies.






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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

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of our business

Yole Inc.

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Phoenix

Yole Korea

Seoul

http://www.yole.fr/

http://www.yole.fr/


ANALYSIS SERVICES - CONTENT COMPARISON

Multi-

Customers

Action

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

http://www.yole.fr/

http://www.yole.fr/


SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plan along the entire

supply chain

Integrators and

end-users

Device

makers

Suppliers: material,

equipment, OSAT,

foundries…

Financial investors,

R&D centers

http://www.yole.fr/

http://www.yole.fr/


SERVING MULTIPLE INDUSTRIAL FIELDS

We are workingacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and consumer

electronics

Automotive

Medical

systemsIndustrial and

defense

Energy

http://www.yole.fr/

http://www.yole.fr/


o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.

In the past 19 years, we worked on more than 2 000 projects, interacting with technology professional and high level opinion makers from the main players of theindustry.

o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.

REPORTS COLLECTION

www.i-Micronews.com

http://www.yole.fr/

http://www.yole.fr/

http://i-micronews.com/index.php?option=com_content&view=article&id=6267

http://www.i-micronews.com/


OUR 2017 REPORTS PLANNING (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Acoustic MEMS and Audio Solutions 2017

− 3D Imaging & Sensing 2017

− Microspectrometers Markets and Applications 2017

− Status of the MEMS Industry 2017*

− MEMS & Sensors for Automotive 2017

− High End Inertial Sensors for Defense and Industrial Applications 2017*

− Magnetic Sensors Market and Technologies 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Sensing and Display for AR/VR/MR 2017

− MEMS Packaging 2017

− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017

o RF DEVICES AND TECHNOLOGIES

− RF Front End Modules and Components for Cellphones 2017

− Advanced RF SiP for Cellphones 2017

− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals

2017

− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals

2017

− RF Technologies for Automotive Applications 2017

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

o MANUFACTURING

− Glass Substrate Manufacturing 2017

− Equipment & Materials for Fan Out Technology 2017

− Equipment and Materials for 3D TSV Applications 2017

− Emerging Non Volatile Memories 2017*

o MEDTECH

− Status of the Microfluidics Industry 2017

− Solid State Medical Imaging 2017

− Connected Medical Devices: the Internet of Medical Things 2017

− Sensors for Medical Robotics 2017

− Artificial Organs: Market & Technology Analysis 2017

− Organs-on-a Chip 2017

o ADVANCED PACKAGING

− Advanced Substrates Overview 2017

− Status of the Advanced Packaging Industry 2017

− Fan Out Packaging: Market & Technology Trends 2017*

− 3D Business Update: Market & Technology Trends 2017*

− Advanced QFN: Market & Technology Trends 2017**

− Inspection and Metrology for Advanced Packaging Platform 2017**

− MEMS Packaging 2017

− Advanced Packaging for Memories 2017

− Advanced RF SiP for Cellphones 2017

− Power Packaging Market and Technology Trends 2017

− Embedded Die Packaging: Technologies and Markets Trends 2017

o IMAGING & OPTOELECTRONICS

− 3D Imaging & Sensing 2017

− Status of the CMOS Image Sensor Industry 2017*

− Camera Module for Consumer and Automotive Applications 2017*

− Uncooled Infrared Imaging Technology & Market Trends 2017*

− Solid State Medical Imaging 2017

o BATTERY AND ENERGY MANAGEMENT

− Status of Battery Industry for Stationary, Automotive and Consumer Applications

*2016 version still available / **To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS

− Status of Power Electronics Industry 2017*

− Silicon Power Mosfet: Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017

− Power Packaging Market and Technology Trends 2017

− Power SiC 2017: Materials, Devices, and Applications*

− Power GaN 2017: Materials, Devices, and Applications*

− Materials Market Opportunities for Cellphone Thermal Management (Battery

Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017

− Gate Driver Market and Technology Trends 2017

− Power Management ICs Market Quarterly Update 2017

− Power Electronics for Electrical Aircraft, Rail and Buses 2017**

− Thermal Management for LED and Power 2017

o COMPOUND SEMICONDUCTORS

− Power SiC 2017: Materials, Devices, and Applications*

− Power GaN 2017: Materials, Devices, and Applications*

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals

2017

− Bulk GaN Substrate Market 2017

o DISPLAYS

− MicroLED Displays 2017

− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017

− Quantum Dots for Display Applications 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Automotive Lighting 2017 - Technology, Industry and Market Trends

o SOLID STATE LIGHTING

− UV LEDs 2017 - Technology, Manufacturing and Application Trends*

− Horticultural Lighting 2017 - Technology, Industry and Market Trends

− Automotive Lighting 2017 - Technology, Industry and Market Trends*

− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**

− LED Lighting Module 2017 - Technology, Industry and Market Trends

− IR LEDs and Lasers - Technology Applications and Industry Trends 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− MicroLED Displays 2017

− CSP LED Lighting Module 2017

− LED Packaging 2017

− Thermal Management for LED and Power 2017

PATENT ANALYSIS by Knowmade

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation

− Risk and Potential Targets 2017

− MEMS Microphone: Patent Landscape Analysis 2017

− MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017

− Microbolometer: Patents Used in Products 2017

− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017

− Micropumps: Patent Landscape Analysis 2017

− GaN Technology: Top-100 IP Profiles 2017

− MicroLEDs: Patent Landscape Analysis 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017

− Uncooled Infrared Imaging: Patent Landscape Analysis 2017

− 3D Monolithic Memory: Patent Landscape Analysis 2017

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.*2016 version still available / **To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2016 PUBLISHED REPORTS LIST (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Gas Sensors Technology and Market 2016

− Status of the MEMs Industry 2016

− Sensors for Cellphones and Tablets 2016

− Market and Technology Trends of Inkjet Printheads 2016

− Sensors for Biometry and Recognition 2016

− Silicon Photonics 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

o MEDTECH

− BioMEMS 2016

− Point of Care Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Embedded Die Packaging: Technology and Market Trends 2017

− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

− Fan-Out: Technologies and Market Trends 2016

− Fan-In Packaging: Business update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

o MANUFACTURING

− Thin Wafer Processing and Dicing Equipment Market 2016

− Emerging Non Volatile Memories 2016

o COMPOUND SEMICONDUCTORS

− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− Power SiC 2016: Materials, Devices, Modules, and Applications

o LED

− UV LED Technology, Manufacturing and Applications Trends 2016

− OLED for Lighting 2016 – Technology, Industry and Market Trends

− Automotive Lighting: Technology, Industry and Market Trends 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− LED Packaging 2017: Market, Technology and Industry Landscape

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics 2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

o BATTERY AND ENERGY MANAGEMENT

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

− Stationary Storage and Automotive Li-ion Battery Packs 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

http://www.yole.fr/

http://www.yole.fr/


OUR 2016 PUBLISHED REPORTS LIST (2/2)

PATENT ANALYSIS by Knowmade

− Microbattery Patent Landscape Analysis

− Miniaturized Gas Sensors Patent Landscape Analysis

− 3D Cell Culture Technologies Patent Landscape

− Phosphors and QDs for LED Applications Patent Landscape

− TSV Stacked Memory Patent Landscape

− Fan-Out Wafer Level Packaging Patent Landscape Analysis

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published

in 2016.

MORE INFORMATION

o All the published reports from the Yole Group of Companies are available on our website

www.i-Micronews.com.

o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the

number of reports you are interested in and select the related offer. You then have up to 12

months to select the required reports from the Yole Développement, System Plus Consulting

and KnowMade offering. Pay once and receive the reports automatically (multi-user format).

Contact your sales team according to your location (see the last slide).

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

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Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

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Contacts: Camille Veyrier ([email protected]) and Clotilde Fabre ([email protected]), Marketing & Communication Project Managers.

http://www.yole.fr/

http://www.yole.fr/




CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

o FINANCIAL SERVICES

• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80

o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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