sapphire applications & market 2015 report by yole developpement
TRANSCRIPT
July © 2015
From Technologies to Market
Sapphire Applications & Market 2015:
from LED to Consumer Electronic.
Report Sample
From Technologies to Market
2
TABLE OF CONTENTS
Part 1/V
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
Sapphire properties vs. orientation
Value chain.
Example: Sapphire wafer process
Material defects and slicing
Core / brick length
Major industry players: crystal growth companies
Major industry players: wafer slicing and finishing
Major industry players: PSS
Status of the Sapphire Industry p67
Price trends: cores for LED and optical wafers
Material cost structure exemple: Aurora Sapphire
Price trends: Conventional sapphire substrates for LED
Price trends: Patterned sapphire substrates for LED (PSS)
Discussion
Price trends: bricks and optical wafers for consumer electronic
2008-2020 price forecast
2014 top 20 Sapphire company revenue for core, bricks & wafers
Detailed breakdown by segment
Revenue structure: captive and open markets
2014 revenue breakdown for Core & bricks and polished wafers
2014 revenue breakdown for optical and PSS wafers
Geographic breakdown per product category
Exchange rates impacts
Product categories and applications covered in this report p5
Executive Summary p7
The 3 page summary
China dominates
Sapphire industry growth drivers: Historical perspective
Application breakdown
Consumer electronic applications
List of mobile devices with sapphire components
Smartwatches
Sapphire display covers
2014 Sapphire company revenue
Sapphire supply and demand
LED applications
Alternative substrates
Sapphire wafer forecast
Core shipment forecasts
What happened to silicon on sapphire?
Past year and Noteworthy News p46
Introduction to the Sapphire Industry p56
Industry Overview
Sapphire properties overview
3
TABLE OF CONTENTS
Part 1I/V
Optical wafer manufacturing:
Camera lens covers: overview and adoption trends
Fingerprint reader covers: overview/emerging technologies/established
technologies/alternative technologies/sapphire use/adoption trends
Heart monitor sensor covers
Optical Wafers 2012 -2020 volume and revenue forecast/ingot (core)
forecast
Smart watches market review & forecast p138
Forecasting the Smartwatch market
Smartwatch volume forecast 2012-2020
Sapphire in Smartwatches: Apple Watch/other brands/sapphire adoption
rate forecast
Sapphire smartwatch cover volume & revenue forecast
Sapphire covers design and slicing pitch
Smartwatch volumes and forecast
Sapphire display covers - market review and forecast p148
Mobile devices display covers – Overview
Touch panels – technology overview
Display and touch sensor structures
Touch sensors and display panels supply chain
Display cover manufacturing process
Supply and demand analysis p86
Definitions and metrics
Brick and core extraction
Geographic and product category geographic breakdown
Crystal Growth Capacity: 2012-2015 evolution by region
Crystal Growth Capacity: Top 20 ranking
Crystal growth technology breakdown (Q3-2015)
HEM furnaces
Finishing Capacity: 2012-2015 evolution by region
Finishing Capacity: Top 20 ranking
PSS Capacity: 2012-2015 evolution by region
PSS Capacity: Top 20 ranking
Material, finishing and PSS Supply vs demand
Attrition and consolidation
Why does capacity keep increasing?
Focus on China/Taiwan/Korea/Europe/North America
Supply vs demand analysis: no sapphire display cover
Supply vs demand analysis: sapphire display cover adoption
Discussion
“Optical Wafers” market review and forecast: Camera lens,
fingerprint readers and heart rate monitors covers p123
Sapphire components at Apple
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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TABLE OF CONTENTS
Part 1II/V
iPhone display covers: current status
Partial roll out in a premium model
Full roll out in major iPhone model(s)
Material supply chain requirements
Most significant capacity investments 2014-2016
Material capacity evolution 2014-2016
Who will supply Apple display covers?
Who will supply material for Apple display covers?
Conclusions
Crystal growth technologies for display covers p198
Sapphire growth methods for display covers: KY etc…
Sapphire technology –VHGF
HEM CHESS
EFG Method
Orientation for display covers
Sapphire display cover manufacturing cost p205
2014 cost model
Sapphire brick – GTAT ASF cost
Sapphire brick – Kyropoulos cost
Brick cost modeling Results
Potential benefits of sapphire display covers: mechanical strength /
dielectric constant
Putting sapphire to the test: GTAT vs Corning/Ubreakifix.com / impact of
finishing process
Conclusions on mechanical testing
Major issues of Sapphire display covers
Summary
Current status
Apple sapphire patent portfolio overview
Which Strategy for differentiation?
Sapphire adoption trends
Display cover adoption scenario
Display cover adoption rate forecast 2015-2020.
Apple Sapphire ecosystem and strategy p173
Apple supply chain: overview
2014 revenue from Apple
Optical wafers supply chain
Apple Watch supply Chain
Discussion
Display cover supply chain overview: GTAT, Biel and Lens.
GTAT – Apple partnership: what went wrong?
What’s next for GTAT and the mesa furnace
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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TABLE OF CONTENTS
Part 1V/V
Alternative LED substrates p238
Gan-on-Si overview
GaN-on-Si cost of ownership
Gan-on-Si adoption
Key players and strategic positioning
GaN-On-Gan
Alternative substrates adoption forecast
LED Epitaxy (MOCVD) capacity trends p245
Gan MOCVD capacity 2010-2015 evolution per region
GaN MOCVD capacity supply vs demand trends
Gan MOCVD Q3-2015 utilization rate per region
Gan MOCVD Q3-2015 utilization rate in China
Geographic breakdown and conclusions
LED wafer market & forecast p251
LED wafer forecast methodology
LED wafers value chain
Sapphire wafer consumption Q3-2015 geographic breakdown
Incentive for adoption of large diameter wafers
Challenges for the adoption of large diameter wafers
Q3-2015 Diameter breakdown per region
Q3-2015 Diameter breakdown – global
6” adoption and beyond
LED wafer diameter breakdown forecast 2012-2020.
2008-2020 sapphire wafer start by diameter
Discussions
Brick cost structure
Yields impact
Full display cover cost
Conclusions
Alternative technologies for display covers p221
Strengthened glass - Gorilla glass
Alternative technologies – Coatings
Schott “Hard and clear” solution.
Alternative technologies – Exfoliation & laminates
Alternative technologies – DLC
Transparent ceramics: ALON TM & spinel
LED market overview p229
LED market growth cycles
LED adoption trends per application
General lighting market segmentation and main drivers
Previous LED market forecast (2014)
Updated LED forecast
Discussion
LED bulb lifetimes
LED market Trends – Display
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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TABLE OF CONTENTS
Part V/V
2012-2015 ASP and gross margins trends per product
2012-2014 capacity and utilization rates trends
2015 capacity expansion plans
2012-2014 revenue by product & application
2014 revenue breakdown by product & application
2012-2014 revenue geographic breakdown
Major customers 2012-2014
LENS Technology (蓝思科技股份有限公司) p301
Overview
Capacity
Revenue breakdown by product and customers
Sapphire revenue breakdown
Sapphire investment status and future plans
Other Company Profiles p309
BIEL Crystal (伯恩光学有限公司)
Biel-Roshow Sapphire (伯恩露笑蓝宝石有限公司)
Sapphire technology
Rubicon technology
Monocrystal
Saifei (广东赛翡蓝宝石科技有限公司)
Crystal Optech (浙江水晶光电科技股份有限公司)
NJC (南京京晶光电科技有限公司)
Kama Crystal
Patterned sapphire substrates – benefits
When are PSS used?
Pattern design
PSS manufacturing process overview
Lithography techniques for LED
Nano-Imprint Litography
PSS market: historical perspectives
Q3-2015 CSS and PSS consumption per region
PSS supply chain
2008-2020 CSS and PSS volume forecast
2008-2020 core shipment forecasts
2008-2020 LED wafer revenue forecast
LED filaments p279
Overview
Filament material
Filament manufacturing process
Performance and cost
Analysis
LED filament 2012-2020 shipment and revenue forecast
Aurora Sapphire (哈尔滨奥瑞德光电技术股份有限公司) p288
Overview
2011-2015 revenue and gross margins trends
Growth technology and cost control
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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Biography & contact
ABOUT THE AUTHORS
Eric VIREY received a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble. He’s held various R&D,engineering, manufacturing and marketing positions with Fortune 500 company Saint-Gobain in France and the United States. Inits most recent position, he was Market Manager Optoelectronics in charge various product lines and serving the LED andoptical telecommunication industries. In parallel, he was leading the corporate “Lighting Community” effort, acting as a marketand technology competitive intelligence evangelist to identify and develop new business opportunities in solid state lighting(LED/OLEDs) across multiple business units.
Eric has a broad knowledge of the entire solid state lighting value chain. In 2009, he joined Yole Developpement as a SeniorMarket and Technology Analyst for LED Devices and Materials.
Eric is also author / co-author of the following reports:
• LED Packaging
• LED Front End Manufacturing
• III-V Epitaxy
• Bulk GaN
• GaN on Silicon
• Status of the LED Industry
• Sapphire Market & Applications
• High Purity Alumina
Contact: [email protected]
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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ACRONYMS
A: AmpereAMOLED: Active Matrix OLEDASP: Average Selling PriceCAGR: compound Annual Growth RateCapex: Capital ExpenditureCCFL: Cold Cathode Fluorescence LampCE: Consumer ElectronicCHES: Controlled Heat Extraction SystemCSS: Conventional Sapphire WaferCTE: Coefficient of Thermal ExpansionCZ: CzochralskiDD: Dislocations densityEFG: Edge-defined Film-fed GrowthFPR: FingerPrint ReaderGES : Growth from an Element of ShapeHB-LED: High-Brightness Light Emitting DiodesHEM: Heat Exchange MethodHPA: High Purity AluminaHVPE: Hybrid Vapor Phase Epitaxy KY: KyropoulosLCD: Liquid Crystal DisplayLD: Laser DiodeLEC : Liquid Encapsulation CzochralskiLED: Light Emitting DiodeLEE: Light Extraction Efficiency
LOG: Lateral Over-GrowthMBE: Molecular Beam EpitaxyMOCVD: Metal-Organic Chemical Vapor DepositionMsi: Million Square InchnPSS: Nano-PSSOEM: Original Equipment ManufacturerOLED: Organic LEDPA: Power AmplifierPSS: Patterned Sapphire Substrate PV: PhotovoltaicRF: Radio FrequencyRFIC: Radio Frequency Integrated CircuitSoI: Silicon on InsulatorSOS: Silicon on Sapphire TAM: Total Accessible MarketTc: Thermal ConductivityTj: Junction TemperatureTIE: Two Inch EquivalentTTV: Total Thickness VariationV: VoltVHGF: Vertical Horizontal Gradient Freezing W: Watt
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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PRODUCT CATEGORIES AND APPLICATIONS COVERED IN THIS REPORT
Volume and revenue
forecast for the check marked
items are covered in this report.
Cores
Bricks
Single side polished Conventional
Sapphire Wafers (CSS) for LED and
Silicon On Sapphire epitaxy
Patterned Sapphire Substrates
(PSS) for LED epitaxy
Double Side Polished
Optical Wafer
Covers for camera lens, fingerprint
reader and heart rate monitor
Covers for camera lens, fingerprint
reader and heart rate monitor
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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CONSUMER ELECTRONIC APPLICATIONS
• In 2012, Apple introduced the iPhone 5, the first smartphone to use a sapphire camera lens cover. In 2013, it
introduced the iPhone 5s which featured a Fingerprint Reader (FPR) protected by a sapphire cover in the
“Home Button”. The technology was unrolled in iPad products in 2014. Finally, in 2015, Apple introduced its first
smart watch, the Apple Watch which features a heart rate monitor constituted of a combination of green and
infrared LEDs and photodiodes protected by 4 transparent sapphire lenses.
• As of H1-2015, adoption of sapphire camera lens covers at non-Apple cell phone manufacturers is still
limited. But with manufacturing process now reasonably mature, the ASP of sapphire lens covers is expected
to fall below $0.5/unit which will increase adoption from 2016. In 2015, leading Tier 2 brands Huawei and
HTC both already announced new flagship models featuring sapphire lens covers.
• We expect fingerprint readers to become standard on all smartphone by 2020. But the use of sapphire will likely
remain an Apple oddity. So far only one other OEM has adopted sapphire in a model introduce in 2015.
By successively introducing camera lens
covers, fingerprint readers and smartwatch,
Apple has created an entire new
market for sapphire wafers
The HTC One M9 (2015) features
a sapphire camera lensThe Huawei Honor 7 (2015) features a
sapphire camera lens
The Meizu MX4 Pro features a front face
fingerprint reader with a sapphire cover
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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SAPPHIRE DISPLAY COVERS
• But KY and GTAT’s ASF both have room for improvement: GTAT could eventually succeed in producing larger
boules of 200, 240 or 260 kg and Monocrystal recently demonstrated a 300 kg KY process.
• Other possible options include ARC Energy which also recently announced a 300 kg process based on its new
generation of CHES furnaces. Sapphire Technology VHGF technology produces much smaller boules in brick
shapes and short cycle times which could prove competitive for display cover applications.
• With the ability to produce multiple rectangular ribbons of adjustable width and length in parallel, EFG has
always seemed a good fit for the application. Trading companies recently signed an agreement with a Japanese
supplier with 20 years of EFG experience to sell high performance furnaces in China which could produce up to
3000 parts per month. The companies claim to already have orders for 300 units in 2015 and expect to sell 1000
in 2016.Various technologies and companies are
positioning themselves to
win the market
Different sizes of slabs produced by Sapphire
Technology with the VHGF technology
(source: company)
A 300 kg boule produced with ARC Energy
new CHES furnaces designA 300 kg boule produced by Monocrystal
using its Kyropoulos technology
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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SAPPHIRE DISPLAY COVERS
• But in any case, we don’t see a quick path for the industry to achieve the kind of cost that Apple and GTAT initially
targeted for 2015.
• For the bricks, while not out of reach, sub $XX/mm cost will require further process development, economies of
scale (consumable, spare parts…) and are at least 2 years away. In the short term, it is going to be challenging for
sapphire makers to offer prices even approaching $XX/mm.
• As of 2015, we estimate that even in high volume (millions), the price for sapphire display covers would hover
around $XX/pcs. With rapid process improvements and economies of scale achieved by the large projects currently
under construction, this could drop to around $XX in 2016 and below $XX in 2017.We don’t expect that initial targets
set by Apple in 2013 can be
achieved until 2017 when the
price of a sapphire display
cover could finally pass below
the $XX bar.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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2014 SAPPHIRE COMPANY REVENUE
[1] Revenue generated by GTAT from smartphone bricks shipped to Biel and Lens for the aborted iPhone 6 sapphire display ramp up are not included (est.: US$ 45M)[2] Lens claims US$412M of sapphire related revenue in 2014. We estimate that US$284 was generated from actual component sales (next page)
Adding finished components (lens covers etc…), revenue reached US$1.8b dominated by Biel and Lens:
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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Q3-2014
Toshiba, JP announces plans to invest US$ 500mto ramp up capacity for its GaN-On-Silicon LEDtechnology 150x by 2016 to capture 10% of thewhite LED market.
LED maker Epistar, TW (晶元光電股份有限公司),currently the 2nd largest in term of GaN MOCVDcapacity acquires rival Formosa Epitaxy, TW (璨圓光電股份有限公司).
July August September
TDG Core, CN (天通控股股份有限公司 )announces a JV with Taiwan-based PSS foundryPhecda Technology,TW (德晶科技股份有限公司)to set up a new PSS manufacturing factory. Eachcompany will invest RMB 20m in the JV.
PSS foundry Aceplux Optotech, TW (兆鑫光電科技股份有限公司) increases capital by NT$297m(US$10m) by issuing 3500 shares at NT$85 each.The proceed will be used to increase capacityfrom 150k TIE/m to 300k TIE/m. The company willhave a total of 15 production lines.
EGing Photovoltaic Technology, CN (EGingPV) (亿晶光电科技股份有限公司) will install 50x100kg sapphire for annual capacity of 750,000 mmof 4” ingot + 370k mm of 2” ingots. Totalinvestment: RMB 132m.
Tera Xtal, TW (鑫晶鑽科技股份有限公司) willincrease PSS capacity from 100k to 200kTIE/month by the end of 2014. The companyintends to implement nano imprint lithographytechnology. Competitor Rigidtech, CN (銳捷科技股份有限公司) plans to set up a manufacturingplant in Suzhou (CN) and expand PSS capacityfrom 800k to 1.2m TIE/month.
Sunyes Electronic Manufacturing, CN (深圳市新亚电子制程股份有限公司) acquires 10.3% ofGuangdong Saifei, CN (广东赛翡蓝宝石科技有限公司) for RMB 280m, valuating the company atRMB 2.72b (~US$440m) and approves a RMB180m loan to supplement working capital.
Southwest Pharmaceutical, CN (西南药业股份有限公司) acquires Aurora Sapphire, CN (哈尔滨奥瑞德光电技术股份有限公司) via an assetswap valuing the company at RMB 4.12b(US$644m) and will raise an additional US$167mto fund capacity expansion close to 10 mm of TIEmillion in 2015.
Anhui Guofeng Plastic, CN (安徽国风塑业股份有限公司) acquires 29.59% of Ning Xia JiajingTechnology (宁夏佳晶科技有限公司), the China-based subsidiary of sapphire maker Procrystal,TW (佳晶科技股份有限公司). Guofeng will laterincrease participation to 51.02% in February 2015after further equity transfer and capital increase.
Huawei, CN and Vivo, CN release limited editionof their new flagship models with sapphire coverglass
Apple announces new iPhone 6 and 6+. Nonefeatures the highly anticipated cover glass. Thecompany also presents its first line of smartwatchwith 2 of the 3 models featuring a sapphire cover.
X
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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EXAMPLE: SAPPHIRE WAFER PROCESS
Crystal GrowthBoule Cropping,
X-Ray orientation, CoreExtraction & Cropping
Core cropping, X-ray core orientation, OD grinding /
orientation adjustment, Notch or flat grinding
Picture:ThermalTechnology
Illustration :Rubicon Technology
Metrology: Thickness, BOW, TTV, TV5
Thickness and quality sorting (up to 30 bins)
Illustration: Meyer Burger
Illustration: Meyer Burger
Slicing
Illustration: Meyer Burger Illustration: Meyer Burger
Lapping or Grinding
Picture:TeraXtal
Shape measurement, flip sorting (concave / convex)
Illustration: Meyer Burger
Mechanical Polishing + CMP
Illustration: Meyer BurgerPicture:Corning/Tropel
Metrology (Bow, Warp, TTV, LTV, Sori, Sag…)
Laser markingFinal cleaning
Core mounting
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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After severe shortage in 2010-2011,
excess supply since 2012 sent back prices to
levels close to or below
cost for most suppliers.
PRICE TRENDS: CORES FOR LED AND OPTICAL WAFERS
Cores (cylinders) for the manufacturing of LED or optical wafers are sold by the length (measured in mm)
at a given diameter.
6”
4”
2”
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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PRICE TRENDS: CORES FOR LED AND OPTICAL WAFERS
• Core prices recovered briefly from Q3-2013 to Q2-2014. This allowed many
material suppliers to finally break even. Those which operated at high utilization
rates and with the most competitive cost structures even generated reasonable
profits (Aurora Sapphire, Monocrystal …).
• However, prices starting falling again from Q3-2014 and are likely to reach their
lowest level ever by the end of 2015:
• 2” ASP might pass below the US$XX/mm level
• 4” will get close to or slightly below the $XX/mm bar on spot offers by players eager
to utilize their capacity.
• 6” is proven more resilient because few suppliers have so far been able to deliver long
cores with high quality.
• Leading suppliers have made significant progresses in reducing cost in the last 18
months. Improved yields is the most significant contributor but raw materials
and crucible cost have also decreased significantly. Some credit should actually
be given for that to the Apple-GTAT project which aggressively negotiated prices,
and coaxed various suppliers into increasing capacity, developing and
implementing new capabilities and new manufacturing paradigms to reduce their
costs.
• Most high volume suppliers such as Aurora, Monocrystal, STC, USIO, Biel-
Roshow design and assemble their furnaces internally, allowing for further
savings on equipment and depreciation cost.
It’s a cost game and few
suppliers can win. Price probably
haven’t hit bottom yet and are constantly
challenging suppliers ability to reduce cost.
Ingots and cores at Monocrystal
(source: company)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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MATERIAL COST STRUCTURE: AURORA SAPPHIRE
Aurora highly competitive cost position combined with high utilization rate allowed the company to achieve a XX% gross margin in 2015
US$XX
[1] RMB 11.41 at 6.394 RMB/US$ exchange rate
Aurora Sapphire 2” cost structure and raw
material cost
(source: company)
• Aurora Sapphire (奥瑞德) claimed a cost around US$XX/mm of 2
inch core in 2014 [1] and expects to bring that figure to $XX/mm by
the end of the decade.
• The company achieved significant cost structure improvements
through reduction of depreciation (improved furnace throughput) and
raw material cost.
• One however has to be cautious when comparing costs for a given
product category from one manufacturer to another. Cost accounting
allows some flexibility for example on how fixed costs and overheads
are distributed between product lines etc…
• Nevertheless, we believe that the company indeed has a very
competitive cost structure as demonstrated by a company-level gross
margin above 20% in 2014.
• We believe that only a handful of manufacturers currently have a cost
position close to those levels and can breakeven at current US$XX-
$XX /mmm price levels.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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CRYSTAL GROWTH TECHNOLOGY BREAKDOWN (Q3-2015)
• As of Q3 2015, Kyropoulos (“KY”) dominates the worldwide installed capacity, followed by GTAT’s ASF HEM
furnaces.
• Turnkey equipment is available off the shelves from a dozen suppliers located mostly in Eastern Europe and Asia.
Leading Suppliers are Apeks, Juropol, Yufeng New Energy etc…However, the bulk of the installed KY capacity still
derives from sapphire companies that design and assemble their furnaces internally such as Monocrystal, Rubicon,
Biel-Roshow, USI Opto, DK-Aztec. New companies willing to get a quick start will typically purchase off the
shelve equipment and later on, customize the design and build additional or upgrade furnaces internally.
Kyropoulosdominates the
installed capacity thanks
to its long history and the availability of
quality off-the-shelves
equipment from various
vendors.
Kyropoulos boules at Monocrystal
(Source: company)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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CHINA: EMERGING COMPANIES
Q3-2015 Capacity
(TIE/month)Comment
• New project. Plans 170 furnaces (HEM type, 110-120 kg boules)
• Have installed 700x 80Kg furnaces in Ordos, Inner Mongolia. Plan to upgrade to 120 kg.
• Plans to set up capacity for 100 millions sapphire windows per year in Inner Mongolia.
Applications include 50M display covers, 37.5M smaller displays , 82.25M nn2 (equivalent to
12.5M windows) for watches.
• Will install 600 crystal grower (already 260 as of Q2-2015), 889 crystal processing, cutting
and other equipment.
• Furnaces supplied by Aurora Sapphire,
• Growing100kg boules (equipment from XXXXXXXXXXXXX)
• Initial plan for 260t/year. Long term: Plan to install 600x 100 kg KY for annual output of 600 t
• Initial plan for 50x 100kg furnaces.
• Announced new plan in July 2015 for US$640M and 1000 furnaces.
• JV agreement signed with XXX
• RMB 1.05b investment to set up PSS capacity of 12m /year with first line to start in 2015
• Sapphire division of XXXXXXXX (CN)
• Growth will be 400k in 2016
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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FINGERPRINT READER COVERS: ESTABLISHED TECHNOLOGIES
iPhone + iPad Galaxy S5 Galaxy S6 Huawei Ascend Mate 7
• Apple/Authentec touch sensor
• 2D matrix
• 7,744 pixels at 500 DPI
• Sapphire cover
• Synaptic/Validity swipe sensor
• Linear
• 20 µm linewidth at 40 µm pitch
• Hard polymer coating
• Synaptic/Validity swipe sensor
• Linear
• 25 µm linewidth at 47 µm pitch
• Hard polymer coating
• Finger print Cards AB touch
sensor
• 2D matrix
• 36,864 pixels at 508 DPI
• Hard polymer coating
6 x 6.3 mm2
4 x 15 mm25 x 14 mm2
10 x 10 mm2
Source: System + Consulting; teardown and reverse costing analysis of the Apple 5s, Samsung Galaxy S5, S6 and Huawei Ascend Mate 7 fingerprint readers.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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SAPPHIRE COVERS DESIGN AND SLICING PITCH
• The Apple Watch display cover design is a 3D design with complex curvatures and edge shapes. We assume a fairly low
manufacturing yield for this product (75% exiting 2015) and a slicing pitch of XXX mm.
• Other smart watch makers seem so far to have adopted a simpler 2D design.We assumed higher manufacturing yields (>90%).
Illustration: the different type of covers The Apple Watch cover has a complex 3D shape
(Pictures: Apple, iFixit)
The LG Urbane (showed here) or the Huawei Watch
have a much simpler 2D design (pictures: iFixtit)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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APPLE SAPPHIRE PATENT PORTFOLIO OVERVIEW
• We have identified 17 families of patents relevant to sapphire with priority dates dating back from 2012 (the 2007 patent just
mentions sapphire amongst a long list of possible transparent material):
Mar.
2012
Apr.
2012
May.
2012
Jun.
2012
Jul.
2012
Aug.
2012
Sep.
2012
Oct.
2012
Nov.
2012
Dec.
2012
Jan.
2013
Jul.
2007
Sapphire growth
Sapphire strengthening
Sapphire Cutting
Sapphire parts and components
Solving issues specific to the use of sapphire components
Apple Inc, sapphire related patents organized by priority date
Mar.
2013
Aug.
2013
Sep.
2013
Note: due to the normal delay between filing and publication, its is expected that many more patents have been filled by
Apple between Sept 2013 and now (Jul.2015) but have not yet been published by the patent offices.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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OPTICAL WAFERS SUPPLY CHAIN: LENS, FINGERPRINT READER, HEART SENSOR
Material (Cores) Slicing + PolishingCoating + Laser Cutting – Silk
Printing Assembly
100%
2014 Material fluxes (in volumes)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
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ALTERNATIVE TECHNOLOGIES - COATINGS
• Various companies have announced Al2O3 coating technologies which we estimate could be brought to the market in
high volume for less than US$XX per unit, bringing the total glass + coating cost to less than $XX per unit,
compared to > $20 for a pure bulk sapphire solution.
• Such technologies are being developed by Rubicon and GTAT and various other companies. China-based cell
phone OEM Desay (德赛) and Dakele (大可乐) already unrolled such coating in commercial products. We
believe that Corning’s “Project Phire” announced in February 2015 relies on a similar approach.
• Schott “Hard and Clear” coating technology (next page) expected to be available for mass production from July 2015
also offers performance close to sapphire in term of scratch resistance and doubles as an efficient anti reflective
coating (although there seem to be a compromise between reflectivity and hardness)As of July 2015,
the overall
potential
benefits of
sapphire
remain unclear.
Desay “Magic Mirror X5” smartphone retails for RMB 999 (US$160)
and feature a strengthened glass display cover with an Al2O3 coating.
Hard & Clear -
Type I Ultra Hard
Hard & Clear
-Type II AR
Standard toughened
Alumino Silicate glass
Scratch
Resistance
Excellent
(>95 % scratches
reduced)
High
(>90 % scratches
reduced)
Medium
Residual
Reflection
(air – glass)
Low
(~1 %)
Excellent
(~0.6 %)
Standard
(~4 %)
Coating
VisibilityVery low Close to neutral
Neutral
(bare glass)
Breakage
StrengthExcellent Excellent High
Schott “Hard and Clear” coating performance. 2 variations are available with
emphasize on hardness or reflectivity,
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
26
GAN-ON-SI OVERVIEW
• With the most recent product from Toshiba, performance of GaN-On-Si LEDs have made dramatic
progress and essentially bridged the gap with sapphire based best in class LEDs, making those GaN-On-Si LEDs
a credible alternative:
The best GaN-On-Si LED are now on par with state of the art sapphire LEDs in term of performance.
Dec. 2013
PlesseyPLW114050:
64 lm/W
Jul. 2013
Plessey LEDPLW111010 :
36 lm/W30
60
120
150
180
0
Seoul SemiconductorSTW8Q14C175 lm/w
Apr. 2013
Low and Mid power
package, cold white (5000-
5500k)
Best performance based
on company claims
SamsungLM561B
170 lm/W
EverlightL62-217D150 lm/W
OsramLab result:104lm/W
LumiledsLuxeon 3535 2D
150 lm/W
Sapphire
Silicon
CreeXLamp XH170 lm/w
ToshibaTL2FK :
110 lm/W
90January 2013
Lattice Power*LPIBB55A:140 lm/W
*Available as die. Lm/w of white package Led is extrapolated
ToshibaTL1F4 :
160 lm/W
Jun. 2014
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
27
GAN-ON-SI COST OF OWNERSHIP
• The tear down analysis conducted by System+ Consulting however indicate that droop is still an issue and that to
deliver similar efficiency as a state of the art sapphire LEDs, the die size has to be significantly larger.
• To achieve the same efficiency as a sapphire LED, the epi surface of the GaN-On-Si LED is therefore XXx larger.
• Using the LED CoSim+ cost simulation tool developed by System+ Consulting, we calculated that the epitaxy cost of
GaN-On-Si was about US$ XXX/mm2 compared to compared to 4” PSS was about US$XXX/mm2.
• To achieve the same efficiency, the GaN-On-Si die cost is therefore still about 25% higher than sapphire.
To achieve the same efficiency, the GaN-On-Si die cost is still about 25% more expensive compared to sapphire
Toshiba TL1F1 Toshiba TL1L4 Typical Sapphire
Year
Die Size (GaN Epitaxy
surface)
Current Density
Efficiency
(Intermediate
Bin @ 25 C)
Est. die cost per mm2
Die cost for this LED
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
28
2008-2020 SAPPHIRE WAFER START BY DIAMETER
Total substrate surface shipment is expected to increase by 28% between 2015 and 2020.
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
29
NANO-IMPRINT LITOGRAPHY
• Nano Imprint Lithography (NIL) has emerged as an alternative
and potentially cost-effective solution to create nanoscale
patterns over large surfaces.
• NIL creates the nanostructures by stamping a deformable
material (polymer) with a mold. The material is then UV cured
and forms a hard mask used to pattern the wafer with standard
etching processes.
• NIL is based on mechanical replication and is not limited by
optical diffraction. It can potentially achieve < 5nm resolution
and very good critical defect (CD) control at a very low cost.
• The stamp is produced from a master created by using high-
resolution electron beam or optical interference lithography.
The master’s lifetime is essentially infinite, while stamps can be
re-used multiple times.
• Different variations of the NIL process are available:
• Hard molds: silicon, metal, silica
• Conformable molds: PDMS polymer
• Due to the higher bow of larger sapphire wafers, a soft mold is
preferable for PSS.
Nano-Imprint Lithography is a full field, high resolution technology.
Resist spin coating
Stamp Loading
Imprinting + UV curing
Stamp Releasing
Etching(Pattern transfer)
Resist RemovalImprint Lithography process
(Source: EVG)
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
30
AURORA SAPPHIRE: MAJOR CUSTOMERS 2012-2014
• In 2012, XX represented XX% of the
revenue but includes the sale of 37
growth furnaces for the JV with XX +
4 directly to XX for a total estimated
at US$XX m. the balance is cores and
optical wafers.
Biel and/or Lens have been the
single largest customers since 2012.
• In 2014, sales to XX are material and
wafers only (no equipment).
• Sales to XX are mostly for 101
sapphire furnaces
• Other notable 2014 customers
included XX at around US$6m as
well as XX (the sapphire substrate
venture of XX), XX, XX (15 furnaces)
and XX.
• 2013 sales to XX and XX Sapphire
are mostly constituted of sapphire
growth furnaces.
• Sales to XX are mostly to the
Chinese branch (88% of the total).
©2015 | www.yole.fr | Sapphire Applications & Market 2015 report
ORDER FORMSapphire Applications & Market 2015: from LED to Consumer Electronic
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SALES CONTACTS • North America: Steve Laferriere - [email protected]• Japan & Asia: Takashi Onozawa - [email protected] • Europe & RoW: Jérôme Azemar - [email protected]• Korea: Hailey Yang - [email protected] • General: [email protected]
(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: July 28th, 2015
/
ABOUT YOLE DEVELOPPEMENT
BILL TOName (Mr/Ms/Dr/Pr):
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I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
MEDIA & EVENTS• i-Micronews.com, online disruptive technologies website• @Micronews, weekly e-newsletter• Technology Magazines dedicated to MEMS, Advanced Packaging,
LED and Power Electronics• Communication & webcasts services• Events: Yole Seminars, Market Briefings…More information on www.i-micronews.com
CONTACTSFor more information about :• Consulting Services: Jean-Christophe Eloy ([email protected])• Financial Services: Jean-Christophe Eloy ([email protected])• Report Business: David Jourdan ([email protected])• Press relations: Sandrine Leroy ([email protected])
CONSULTING• Market data & research, marketing analysis• Technology analysis• Reverse engineering & costing services• Strategy consulting• Patent analysisMore information on www.yole.fr
REPORTS• Collection of technology & market reports• Manufacturing cost simulation tools• Component reverse engineering & costing
analysis• Patent investigationMore information on www.i-micronews.com/reports
FINANCIAL SERVICES• Mergers & Acquisitions• Due diligence• FundraisingMore information on www.yolefinance.com
Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”.
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2. MAILING OF THE PRODUCTS 2.1 Products are sent by email to the Buyer:
• within [1] month from the order for Products already released; or • within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.
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the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
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8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and Conditions
or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES
32
MEMS &
Sensors
LED / OLED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
PackagingPV
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
33
4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market & Technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool
www.i-Micronews.com/reports
o Financial services
• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
Blu Morpho
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication & webcast services
• Events
www.i-Micronews.com
34
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management & optimization
TBA
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Blu Morpho
35
OUR GLOBAL ACTIVITY
Yole JapanYole Inc.
Yole
Korea
40% of our business is in
EU countries30% of our business is in
North America
30% of our business is in
Asia
Blu Morpho
36
RESEARCH PRODUCTS - CONTENT COMPARISON
Custom analysis scope is defined with
you to meet your information and
budget needs
Breadth of the analysis
Dep
th o
f th
e a
naly
sis
Custom
Analysis
Workshops
Standard Reports
37
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market
analysis, technology
evaluation, and business plan
along the entire supply
chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers
38
SERVING MULTIPLE INDUSTRIAL FIELDS
• We are working accrossmultiples industries to understand the impact of More-than-Moore technologies from device to system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systemsIndustrial and
defense
Energy
39
REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• Imaging
• Medical technologies (MedTech)
• Advanced packaging
• Power electronics
• Compound semiconductors
• OLED, LED & Laser diode
• Semiconductor Manufacturing
• Photovoltaics
• Batteries
o Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps, etc.
• Supply & value chain analysis: business models, relationships, value flows, etc.
• In-depth analysis of applications and market drivers: challenges, inflection points, etc.
• Market data ($, units, wafer starts, etc.)
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com
40
OUR 2015 REPORTS PLANNING
MARKET & TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− AlN Thin Film Markets And Applications
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled IR Imagers
− IR Detectors
− High End Gyro, Accelerometers and IMU
− Non-Volatile Memory
o IMAGING & OPTOELECTRONICS
− Camera Module Packaging (Vol 1 : Market & Technology Trends / Vol 2 Teardowns &
Reverse Engineering)
− Uncooled IR Imagers
− Wafer Level Optics
− Status of the CMOS Image Sensors
− Machine Vision
o MEDTECH
− Microfluidic for Sample Preparation
− Microfluidic Applications
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− High Purity Alumina (HPA)
− Sapphire
− Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN,
Diamond, Graphene… as a trend)
* Reports to be decided within 2015
o LED
− LED Module
− OLED for Lighting
− UV LED
− LED Phosphors Market
o POWER ELECTRONICS
− Power Packaging
− Thermal Management for LED and Power
− Power Electronics for Renewable Energy
− Energy Management For Smart Grid And Smart Cities
− Status of Chinese Power Electronics Industry
− New Technologies For Data Center
− Inverter Market Trends For 2013 – 2020 And Major Technology Changes*
− IGBT Markets And Application Trends
− Power Electronics for HEV/EV*
− Status of Power Electronics Industry
o ADVANCED PACKAGING
− Advanced Packaging in Emerging Markets in China
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− WLCSP*
− Flip Chip Business Update
− 2.5D & 3DIC Business Update
− Fan-Out and Embedded Business Update
o MANUFACTURING
− Lithography for MEMS, Advanced Packaging and LED
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
Image Sensors
− Non-Volatile Memory
41
OUR 2015 REPORTS PLANNING
PATENT ANALYSIS by Knowmadeo Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)
− MEMS Microphone Applications
− Infrared Imaging
o Patent Investigation (crossed analysis based on Knowmade &Yole Développement expertise)
− Power GaN
− MEMS Gyroscope
− 6-axis & 9-axis Inertial MEMS IMUs
− Microbatteries
− Embedded Active & Passive Packages
− Interposer
− Phosphors for LED
TEARDOWN & REVERSE COSTING by System Plus ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.
* Reports to be decided within 2015
42
OUR 2014 PUBLISHED REPORTS LIST
MARKET & TECHNOLOGY REPORTS
by Yole Développement
o MEMS & SENSORS
− Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024
− MEMS Microphone: Market, Applications and Business Trends 2014
− Status of the MEMS industry
− MEMS & Sensors for Mobile Phones and Tablets
− High End Gyroscopes and Accelerometer Applications
− Inertial MEMS Manufacturing Technical Trends
− New Detection Principles & Technical Evolution for MEMS & NEMS
− 6/9 DOF Applications in Consumer Electronics
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Silicon Photonics
o MEDTECH
− Point of Care Testing: Applications for Microfluidic Technologies
− Solid State Medical Imaging: X-ray and Endoscopy
o COMPOUND SEMICONDUCTORS
− RF GaN Technology & Market Analysis: Applications, Players, Devices & Substrates 2010-
2020
− SiC Modules, Devices and Substrates for Power Electronics Market
− GaN-on-Si Substrate Technology and Market for LED and Power Electronics
− Power GaN Market
− Graphene Materials for Opto & Electronic Applications
− Sapphire Applications and Market: from LED to Consumer Electronics
o LED
− LED Packaging
− LED Front-End Manufacturing Trends
− LED Front-End Equipment Market
o POWER ELECTRONICS
− Power Electronics for HEV/EV
− Inverters
− Gate Driver Unit Market for Power Transistors
o PHOTOVOLTAICS
− Emerging and Innovative Technology Approaches in the Solar Industry
o ADVANCED PACKAGING
− 3DIC Equipment and Materials
− 3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
o MANUFACTURING
− Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics
− Permanent Wafer Bonding for Semiconductor: Application Trends & Technology
PATENT ANALYSIS
by Knowmade− LED Based on Nano-wires Patent Investigation
− GaN on Si Patent Investigation (LED, Power devices and RF Devices)
− New MEMS Devices Patent Investigation
− Non Volatile Memory Patent Investigation
TEARDOWN & REVERSE COSTING
by System Plus ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
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MICRONEWS MEDIA
o About Micronews Media
Micronews Media, powered by Yole
Développement, ensures you the best visibility
in the disruptive semiconductor community.
With our services, we help you to reach your
customers worldwide with the media products
they prefer, including our website, e-newsletter,
webcasts, and magazines. Invest in a high added-
value editorial program and get access to Yole
Développement’s network (48 000+ contacts).
o Five supports and channels for your visibility
• A technology magazine to highlight
your visibility with advertisements,
company profiles, product descriptions and
white papers
• A webcast to highlight your expertise and
develop your business identifying
commercial leads
• Articles, advertisements & logo and
banners dedicated to your company, its
products and expertise in @Micronews e-
newsletter and on i-Micronews.com
Focused
community
Identified
contacts
Large
community
Mass contacts
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COMMUNICATION SERVICES
All services listed below are available on–demand.
o i-Micronews.com, the website
Slider – Banners (on English or Japanese websites) – Articles –
Logo and profile as sponsor
o @Micronews, the e-newsletter
Headline article - Tiles
o Custom webcast
Develop your dedicated event with a high added-value program. A
turnkey event withYole support (logistics, promotion, data…)
o Technology Magazines: Custom – Co-produced
Increase your visibility through a dedicated technology magazine
with ads, company profile, product descriptions and white papers.
It can be a custom magazine: your company is the only one to
benefit from it – or a co-produced one: up to 2 companies.
Contacts:
Camille Veyrier ([email protected]) and Clotilde Fabre ([email protected]),
Media & Communication Coordinators.
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CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: [email protected]
• Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Email: [email protected]
• RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: [email protected]
o Report business
• North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: [email protected]
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: [email protected]
• Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: [email protected]
• Korea: Hailey Yang, Business Development Manager, Korean Office
Email: [email protected]
o Financial services
• Jean-Christophe Eloy, CEO & President
Email: [email protected]
o General
• Email: [email protected]
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