led packaging 2014 report by yole developpement

Copyrights © Yole Développement SA. All rights reserved.© 2014 1

LED Packaging 2014 A Detailed and Exhaustive Survey of LED Packaging,

Covering Main Technologies, Trends and Market Metrics

SAMPLE

© 2014 2Copyrights © Yole Développement SA. All rights reserved.

Table of Contents (1/6)

About the Authors of the Report P8

Glossary P9

Company Index P10

Executive Summary P11

LED Market Overview P33

– Synthesis

– Introduction

• Segmentation of High-Brightness LEDs

• History of LED Industry - The 3 Growth cycle

– Packaged LED Revenue

• Forecast by Application

• Recent Trends

– Packaged LED Volume

• Forecast by Application

• Forecast by Package Type

• Forecast by Chip Type

– LED Adoption Rates - Comparison 2014 vs. 2020

– Packaged LED Price Trends

– LED Supply by Region - Market Shares

– GaN Reactor Capacity vs. Demand

LED Packaging Overview P46

– The Functions of LED Packaging

– Main Integration Strategies

– Key Components of a Packaged LED

– LED Packaging: Typical Process Flow

– GaN LED Chip Design

• Simple MESA

• Flip Chip (FC)

• Vertical Thin Film (VTF) and Vertical Thin Film with Vias (VTFV)

• Thin Film Flip Chip (TFFC)

• Market Trends

– Low and Middle Power LED Packaging

– High-Power LED Packaging

– LED Package Power vs. Application

– Cost Structure of Packaged LED

– Main LED Packaging Companies

– Leading LED Packaging Companies - 2013 Revenue Ranking

– Supply Chain

2013 / 2014 Trends P70

– Overview

• LED Industry Challenges

• Solutions Developed

• Other Trends

– Flip Chip LED

• Introduction

• Benefits

• Key Players Identified

• Applications

– Chip Scale Package

• Introduction

• Benefits


• Applications

– LED Filament Lamp

• Introduction

• Manufacturing Process

• Focus on Substrate

• Performance

• Trends

– Flexible LED Strip

• Introduction

• Manufacturing Process


Table of Contents



Finding the Right Information P108

Wafer Bonding P110

– Position in the Process

– Synthesis

– Introduction

– Process Selection

– Technologies (Status, Trends and Alternatives)

– Carrier Substrate

– Permanent Bonding Equipment - Main Suppliers

– Permanent Bonding Equipment - Volume and Revenue

Substrate Removal P126


– Synthesis

– Introduction

• Overview

• Substrate Removal Technologies

– Laser Lift Off

• Overview

• Specificities

• Equipment

• IP Environment

• Potential Effect on Reverse Leakage Current

• Yield Aspects

– Chemical Lift Off

– New Techniques in Development

– Focus on GaAs-Based LEDs

– Laser Lift Off Equipment - Volume and Revenue

Die Singulation P146


– Synthesis

– Introduction

– Preliminary Definitions

– Overview of Die Singulation Techniques

– Blade Dicing

• Overview

• Advantages & Drawbacks

– Laser Dicing

• Overview

• Advantages & Drawbacks

• Additional Challenges

– Diamond Scribing

– UV Laser Scribing

• Overview

• Equipment

– Comparison of Scribing Techniques for Sapphire

– Breaking Systems

– Comparison of Die Singulation Techniques

– Focus on Stealth Dicing

• Overview

• Process

• Comparison with Traditional Dicing Techniques

– Focus on Serial Multibeam Laser Dicing

– Focus on Plasma Dicing

• Introduction

• Comparison with Blade Dicing

• Details on Panasonic’s Technology

• Details on Plasma-Therm’s Technology

– Focus on Chemical etching

– Novel Chip Geometries

– Dicing Equipment - Main Suppliers

– Dicing Equipment - Market Share by Dicing Technology

– Dicing Equipment - Volume and Revenue

Table of Contents



Thermal Management - Packaging Substrates (Including COB) P181


– Synthesis

– Introduction

– Low and Middle Power Packaged LEDs

• Overview

• New Materials (PCT, EMC, SMC and Ceramic)

– High-Power Packaged LEDs

• Thermal Management of High Power LEDs

– Overview

– Material Properties

– Main Design Options

– Packaging Substrate Options

• Leadframe Substrates

– Overview

– Structures

– Examples

– Conclusion

• Ceramic Substrates

– Overview

– Description

– Segmentation

– Structures

– Examples

– Focus on Direct Plated Copper (DPC)

– Al2O3 vs. AlN

– Trends

– Main Suppliers

– Alternative Materials

– Summary

• Choosing the Substrate Type

– Chip On Board

• Introduction

• Benefits

• SMT Packages vs. Chip On Board

• Connection to the Fixture

• Substrate Comparison - AL2O3 vs. AlN vs. MCPCB

• COB vs. Package Substrate

– Packaging Substrate Market

• Substrates vs. Circuit Board Material Options

• Choosing the Right Substrate

• High-Power LED Substrate - Market Share by Substrate Type

• High-Power LED Substrate - Volume and Revenue

Thermal Management - Module Substrates P240

– PCB for LED Lighting Applications

– Overview of Key PCB Properties

– Typical PCB Usage vs. LED Power

– Focus on Glass Epoxy PCB

• Overview

• Focus on Enhanced Glass Epoxy PCB

– Focus on Metal Core PCB

• Overview

• Importance of the Prepreg

– Focus on Enhanced Metal Core PCB

• Focus on Vertical Metal Post MCPCB

• Focus on Diamond-Like Carbon MCPCB

– Focus on Anodized Aluminum Substrate

– Focus on Ceramic PCB

– Focus on nanoceramic PCB

– Focus on Thick Film Paste

– System Design Choice

Table of Contents



ESD Protection P261


– Synthesis

– ESD / EOS Issues of High Power LEDs

– Where are ESD / TVS Diodes Used?

– Zener Diodes

– Embedded ESD Protection

– ESD Protection Diode - Main Suppliers

– ESD Protection Diode - Volume and Revenue

Die Attach P275


– Synthesis

– Introduction

– Overview of Materials and Techniques

– Die Attach Resin / Adhesives

• Epoxy and Acrylic

• Silicone

• Silver-Filled Epoxy

• Gold-Filled Epoxy

• Details on Backside Metallization for Vertical LED

– HMP Eutectic Die Attach

• Au/Sn Solder Paste

• Metallization Techniques

– Comparison of Die Attach Techniques - Gluing vs. Soldering

– Potential Failure Associated with Die Attach

– Emerging Technique - Ag Sintering

– Die Attach Technique per Package Type

Interconnections P295


– Synthesis

– Overview

– Wire Bonding

• Overview

• Comparison of Techniques

• Challenges

• Materials - Gold vs. Copper vs. Aluminium

• Typical Failure

• Alternative - Ribbon Bonding

– Flip Chip

• Overview

• Layout Principles and Technologies

• Main Techniques

• Example - Gold Bumping - Lumileds Luxeon Rebel

• Example - Eutectic Bonding - Cree XLamp XB-D

• High Power Companies Using/Designing Flip Chip LEDs


• Underfill

• Trends - Implementation in Middle Power LEDs

– Interconnection Volume - The Case of High Power LED Chips

– Flip Chip Bonding Equipment - Volume and Revenue

– Die Placement Equipment - Volume and Revenue

Table of Contents



Encapsulation and Optics P332


– Synthesis

– Introduction

– Materials

• Overview

• Epoxy vs. Silicone

– Focus on Silicone

• Introduction

• The Different Types of Silicone for Encapsulation

• Methyl Silicone vs. Phenyl Silicone

– Refractive Index

– Thermal Stability

– Gas Permeability

– Hardness

• Methyl Silicone vs. Methyl-Phenyl Silicone

– Encapsulation Process

• Overview of Main Techniques

• Focus on Dispensing Process - Needle Dispensing vs. Jet Dispensing

• Focus on Molding Process

– Transfer Molding vs. Compression Molding

– Benefits of Compression Molding

– Screen printing

– Processability

– Dispensing vs. Compression Molding

• Comparison of Encapsulation Process

• The Case of Injection Molding

– Trends (Epoxy vs. Silicone, Advanced Material Development…)

– LED Encapsulant - ASP

– LED Encapsulant - Main Suppliers

– Encapsulation Material - Volume and Revenue

– Primary Optics - Volume and Revenue

Phosphors P373


– Synthesis

– How to Make White Light?

– Surface of Phosphor Converted Chips

– Key Requirements for LED Down-Converters

– LED Down-Converters for Display Applications

– LED Down-Converters for Lighting Applications

– Remote Down-Converters (Overview, Benefits & Drawbacks)

– LED Phosphor IP

– LED Down-Converter Materials

• Yellow Phosphors

• Green and Red Phosphors

• Emerging Composition - PFS

• UV + RGB Solutions

• Mainstream, Emerging and R&D Compositions

– Quantum Dots

• Overview and Discussion

• Display Applications (Benefits, Status and Adoption Rates)

• Lighting Applications (Benefits, Status and Adoption Rates)

• Conclusion

– LED Down-Converter Materials Timeline

– The Different Type of White LEDs

– Down-Converter Configurations and Deposition Methods

– Deposition Methods - Dispersion

– Ceramic Preformed Phosphors

– Deposition Methods - Conformal Coating

– Phosphor Sheets

– CSP and Phosphor Deposition

– Deposition Method - Summary Table

– LED Phosphor - Supply Chain

– LED Phosphor Material - ASP

– LED Phosphor Material - Volume and Revenue

Table of Contents



Testing and Binning P434


– Synthesis

– Introduction

– Overview of LED Testing and Sorting / Binning

– Example of Testing Workflow in LED Manufacturing

– Measurement Challenges

– Wafer Level And Die Testing - Optical Inspection and Probing

– Sorting & Binning

– Equipment, Capex and Throughput

– Software

– Testing Equipment - Main Suppliers

– Testing Equipment - Volume and Revenue

Wafer Level Packaging P449

– Synthesis

– Overview

– Manufacturing Status of WLP

– Wafer Level Phosphor Coating

• Overview

• Package Level vs. Wafer Level

• Emerging Trends (Spraying, Printing, Sheet Deposition)

– Wafer Level Optics

– Wafer Level Bumping

– Silicon Substrate and WLP

– True WLP

– Technology Challenges

General Conclusion P468

Appendix P472

– Lumen Consumption Forecast

– Substrate Removal

– Thermal Management - Packaging Substrates (Including COB)

– Wafer Level Packaging

About Yole Développement and LED Activity P492

Table of Contents


Executive SummaryIntroduction (1/2)

• Depending on the device type, packaging can represent 40% to 60% of LED total cost. As such, packagingrepresents the single-largest opportunity for cost reduction, which is required in order for the industry toaccess the “Holy Grail” that is General Lighting.

• However, if you’re expecting this cost reduction to come from standardization, you can abandon all hope.The creativity of LED engineers and specificities of each application have led to an infinite number ofpackage type and formats → Single or multiple chips, low and middle power Plastic Leaded Chip Carrier(PLCC), ceramic-based high power LED, small and large arrays, Chip On Board (…). This profusion of stylesis inhibiting LED manufacturing cost reduction by multiplying the Stock Keeping Unit (SKU), thuspreventing standardization of the manufacturing process and the associated economies of scale.

• In this context, LED manufacturers are reacting by developing new manufacturing philosophies /concepts, such as:

– “Design for manufacturing”, which consists of trying to simplify and standardize elements whenever possible, andpush differentiation as far downstream as possible in the manufacturing process.

– “Design for cost”, which consists of favoring cost of ownership or cost per lumen over end-performance.

• In the end, LEDs are going mainstream but are still not a mature commodity! And this is good news for theentire industry, since design and materials innovation still provides opportunity for differentiation. All ofthis benefits the consumer, who receives budget-friendly, environmentally-friendly and increasinglycredible LED-based alternatives for replacing traditional light sources.

Executive Summary


Executive Summary2013 / 2014 Trends - LED Industry Challenges (1/3)

• Following the LED TV crisis and the entry of Chinese players, cards have been reshuffled → Industry is stillrecovering and product quality of Chinese LED manufacturers has increased at a level where they canrepresent now real competitors for all players.

– And this situation is likely to emphasize as several key patents will expired in the next years.

• As in several other semiconductor industries, cost reduction and performance have become main driversfor new device development.

• Three major challenges are ahead of the LED industry regarding general Lighting market.

• How to respond these challenges will determine the future of LED lighting.

LED industry is facing several challenges (overcapacity, strong competition…) and require development of new devices to further develop itself.

Cost Challenge

Color

Consistency

Efficacy

Challenge

• XX

• Low cost material

• XX

• XX

• XX

• High performance / cost material

SOLUTIONS

Conflict:

• XX

• Low cost material vs.

High performance

material

• XX

Executive Summary


Executive Summary2013 / 2014 Trends - Other Trends

In addition to Flip Chip LED and Chip Scale Package, 2 other new trends have emerged regarding packaging ofLED device and LED module.

LED Filament Lamp

• In the continuity of COB, some LED manufacturers have developed new type ofpackage called LED filaments ad that feature chip-scale COB-type packages thatmimic a traditional incandescent filament.

• In such package, low power LED chips are assembled directly onto a transparentsubstrate and coated with phosphors, offering power package at low cost.

Flexible LED Strip

• A new type of LED-based module / system have also been commercialized duringthe 2 past years → Flexible LED strips. These products have not been developedwith the direct objective to decrease cost or increase efficacy (…) but arepresented here as developing more and more on the international market.

• Indeed, such products have taken advantage of Solid State Lighting era and offerplug and play linear lighting solution for direct or indirect lighting.

LED filament lamp

Flexible LED strips

Executive Summary


Executive SummaryLED Packaging Equipment Market

• Equipment investments are related to LED volumeannual growth rates.

• An unprecedented investment cycle began near the endof 2009 and ran through early 2012, driven by LCDdisplay applications.

– This cycle started in South Korea and was essentiallyfueled by MOCVD subsidies and other incentives in China(since the country was aggressively trying to position itselfas a future leader in Solid State Lighting). This cycle has ledto an average global overcapacity that briefly exceeded50% for some tools in 2012 and has caused a 12 - 18 monthdown-cycle corresponding to the absorption of theovercapacity, as well as some consolidations that willreturn the industry to more typical utilization rates of 80%.

• 2013 and beyond is driven by General Lighting applications however growth in equipment investment willbe tempered by a combination of:

– Significant improvement in LED manufacturing yields, especially in epitaxy, will reduce the number of epiwafers tobe inspected and diced. This will impact the growth of associated tools.

• In some case, need to dice > 50% of “bad” dies due to low yields.

– General Lighting applications will drive the product mix toward much larger die and multi-die packages. This willsignificantly increase the throughput of dicing equipment in terms of die per hour.

• It is much faster to dice 1 x 1mm² die than 4 x 0.25 mm² dies.

Executive Summary

DATA ON THE REPORT


Executive SummaryLED Packaging Material Market

• Material and ESD diode suppliers will enjoy a smoother ride, with regular growth from 2014 to 2019.

• Package substrate, Encapsulant & Primary Optic and Phosphor manufacturers will see the fastest growthin the period 2014 to 2019.

– However keep in mind that phosphor materials will experience a strong price pressure but still enjoy a double digitgrowth.

• There’s still a lot of room for innovation, which could create opportunities for more added-value. For suchproducts however, it remains paramount that the solution offers an overall reduction in cost ofownership ($/lumen) to LED manufacturers.

Executive Summary

DATA ON THE REPORT


Typical Process FlowGaN LED Chip DesignImpact on Packaging Process

Packaging of vertical LED induce additional steps than MESA LED (Epiwafer Bonding and Substrate Removal). For Flip Chip LED, packaging induce some different steps (Interconnection level mostly).

Epiwafer

Carrier wafer

Epitaxial

substrate

Die

Lens

Carrier wafer

MESA &

Vertical

Flip

Chip

LEGEND

Only for vertical LED

packaging

Only for MESA and

vertical LED packaging

Epiwafer

Carrier wafer

Epitaxial

substrate

Die

Lens

Carrier wafer

MESA &

Vertical

Flip

Chip

LEGEND

Only for vertical LED

packaging

Can be “mixed” with

interconnection for Flip

Chip LED packaging

LED Packaging Overview


Lumileds

Cree

Osram

Lumileds

Cree

Osram

Osram

Luminus

Device

Luminus

Device

Luminus

DeviceEdison Opto

Sharp

Leadframe +

PolymerCeramic Ceramic

MCPCB and

Ceramic PCB

MCPCB and

Ceramic PCB

High-Power LED PackagingExamples

Single Large

Die(1 die, typical dimension: 0.5

to 1.5mm)

Single or Multi

“Jumbo Die”1 to 6 dice, typical dimension

2 to 5mm each)

Small / Medium

COB Array (4 to 100 dice, typical dimension:

250 to 1mm each)

Multiple Large

Die(3 to 25 dice, typical

dimension: 0.5 to 1.5mm each)

Mid-Power

(1-2 die, typical

dimension: 0.3 to

0.8mm)

Samsung TSMC

LED Packaging Overview

http://www.cree.com/press/enlarge.asp?i=1317907138192

http://www.cree.com/press/enlarge.asp?i=1317907138192


Flip ChipKey Players Identified - Japan and South Korea

Whereas some Japanese players were already strongly involved in Flip Chip LED development, Korean manufacturers have recently boosted their involvement in this technology.

Company Country Comments / Highlights

Nichia JP • XX.

XX JP • XX

Samsung KR

• Samsung has developed Flip Chip (FC) technology for TV application (to reduce cost and thickness) and flash

application.

• Samsung is also the first company to have developed a middle power LED based on FC technology.

• Samsung also purchase LED FC components from some Taiwanese manufacturers (mostly Epistar, Formosa

Epitaxy and GPI).

LG KR• XX

• XX

XX KR• XX

• XX

Iljin LED KR• According to industry sources, Iljin LED has worked on Flip Chip development with Samsung (and Lumens)

regarding TV applications.

Interconnections


Chip Scale PackageKey Players Identified (1/2)

• Taiwanese LED chip manufacturers have been the most aggressive in Chip Scale Package (CSP)development.

In 2013, Lumileds was the first to commercialize LEDs in Chip Scale Package (CSP) format. But several other manufacturers (mostly Taiwanese) were also following the same developments.

Lumileds, XX

Samsung

XX

Epistar, XX, XX, XX,

XX, XX, Everlight

XX, XX

1. Cree has launched the XQB and XQE LEDs which can be apparented to 2. Formosa Epitaxy was Acquired by Epistar in July 2014.

2013 / 2014 Trends


Overview (3/3)

• And several other new axis of improvement have been developed / implemented.

New material

→ PCT and EMC mostly Plasma Treatment

→ Power, Time

Die Attach

→ High Thermal Conductivity

(XXW/mk to XXW/mk)

Mechanical design

→ Optimize die placement and

leadframe wall design (window size)

and to improve brightness!

Slope (in degree) Reflector to Chip Distance (in mm)

Source: Everlight and Yole Développement

Thermal Management - Packaging Substrates


New MaterialsSMC

• In addition to PCT and EMC, Silicone or Smart MoldingCompound (SMC) are also being developed, mostly byKorean players.

Main advantage of SMC:

• Heat resistance (30°C/W)

• Good adhesion with Silicone (die attach level).

• Reflectance.

– SMC whiteness = ~97% & Reflectance decay ratio = -1.5% at150°C.

• Reliability.

• Can be driven at high current (0.5W to 20W).

Main drawback of SMC:

• Cost (x2 minimum compared to EMC).

Reliability - Comparison of PPA, PCT and SMC

Source: Lumens

Ultra narrow bezel BLU for TV display

Source: Courtesy of Lumens



Thermal Management of High-Power LEDsMain Design Options

Ch

ip O

n B

oa

rd (

CO

B)

PCB PCB (MCPCB, FR-4, CEM-3, Ceramic,etc.)

Substrate Only

Si Submount

Substrate

Leadframe / Heat

Slug

Optek Lednium

Ceramic

Lumileds Luxeon Rebel

Silicon(Wafer Level Packaging)

Viscera Technology

Leadframe or

Ceramic

Lumileds Luxeon

Ceramic

Cree-X-lamp

Heatsink (Metal, Plastic, etc.)Heatsink

Ch

ip O

nH

ea

tsin

k (

CO

H)

LED DieChip

Level

Packaged

LED

Level1

LED

Module

Level 2

LED Light

Engine

Level 3


http://www.newark.com/jsp/search/results.jsp?N=0&Ntk=gensearch_001&Ntt=categorynumber163084&displaytext=SMD LEDs?ICID=SF_Optek

http://www.newark.com/jsp/search/results.jsp?N=0&Ntk=gensearch_001&Ntt=categorynumber163084&displaytext=SMD LEDs?ICID=SF_Optek


PCB for LED Lighting ApplicationsOverview

PCB for

LED

Flexible PCB

Glass-epoxy

(FR4, CEM1,

CEM3 etc.) XX)

Standard

Metal Core

PCB

(Aluminum,

Copper core)

Others

XX

Standard

XX

XX

“Chip on fixture” & “Chip

on Heat Sink”

XX

XX

XX

Thermal Management - Module Substrates


Die Attach Resin / AdhesivesSilicone

• With the increased use of (low and) middle power LEDs for General Lighting applications, severalcompanies (e.g.: Dow Corning, Shin Etsu, Momentive) have developed Silicone-based die attach adhesive.

• Advantage of Silicone over Epoxy being its higher reliability, which is key for General lighting applications.

– Silicone can withstand higher temperature and have better thermal stability.

– Silicone have a better thermal conductivity and resistance to UV.

• However ASP of Silicone-based die attach material is higher than the one of Epoxy-based.

• As General Lighting represent the next big applications, we expect an increased use of Silicone-based dieattach materials, mostly for middle power LEDs.

Maximum use temperature of Epoxy and Silicone materials

Source: Dow Corning

Die Attach


Flip ChipUnderfill - Introduction

• In the mainstream semiconductor industry, the use of underfill becamemainstream when lower-cost organic substrates started to substituteceramic substrates for flip-chip applications. As epoxy-based organicsubstrates introduced significant thermomechanical mismatch because ofthe relatively high CTE of organic materials.

• The underfill is so a material that acts as a stress buffer between the dieand the packaging substrate (as having different CTE). The role of theunderfill is to lower the CTE of the overall package (die + substrate).

• The choice of the underfill material is based on its thermal dissipationproperties and its CTE, that should match the CTE of the interconnect (notthe CTE of the chip or substrate) → This aids bump fatigue of theinterconnect between the package and the die.

• Underfill can be optional, depending on the difference of CTE between thedie and the packaging substrate, and the bump density.

• For Flip Chip LED package manufacturing, it seems Lumileds and Nichiawere using Silicone-based underfill however we were not able to identifymaterial used by new entrants.

LED GaN

Underfill

Bump

Lumileds’ Luxeon Rebel → SEM

images of cross-section through die

bumps with an underfill.

Source: System Plus Consulting

LED GaN

Underfill

Interconnections


Quantum DotsDisplay Applications - Status (3/3)

• QD manufacturer Nanosys worked with 3M to develop “QD Enhancement Films” (QDEF). Unlike QD VisionColor IQ design, the quantum dots in 3M products are embedded in 2D sheets applied parallel to thesurface of the display.

• The companies also announced significant design wins in 2013 and 2014 including the Kindle Fire HDX 7,the 15.6” display of the new Asus Zenbook NX500, and a 28” monitor by Foxconn subsidiary VP Dynamics.China-based display maker Hisense also announced a line of 4K TVs up to 85”.

100 µm

55 µm

55 µm

Asus Zenbook NX500

The QDEF is a sheet of polymer with embedded

QD protected from oxidation by barrier layers. It

is used in substitution of the diffusion film in a

standard LCD stack - The white LEDs in the

BLU are replaced by blue LEDs

Source: 3MKindle Fire HDX 7 (Amazon)

Phosphors


Phosphor Sheets (3/3)

• Phosphor sheets have recently gained a lot of attention as a cost efficient way to improve colorconsistency.

• Phosphor sheets have been developed independently by various companies such as XX or XX. But manypackaged LED and chip manufacturers have also developed their own solutions internally. Those include:XX, XX, Samsung (…).

• With dispensing or spraying technologies now fairly mature, there is limited cost benefits in usingphosphor sheet with traditional SMD chips. However, the technology is especially well suited to themanufacturing of CSP with Flip Chip die were the absence of wire bond leaves a perfectly flat surface:

– XX

– XX

– XX

• The tables on the following slides illustrate various examples of CSP.

Cross section of a CSP with phosphor sheet preform and transparent Silicone over-molding

Source: Everlight

Chip

Phosphor sheet preform (phosphor + binder)

Silicone over-molding

Phosphors


TrendsEpoxy vs. Silicone - Analysis by Application

• Epoxy is used for traffic lighting and signage.

– Low cost and few thermal issues with such lighting systems (do not require middle or high power LEDs).

• Phenyl Silicone is used in applications favoring high optical performance or cost: TV backlighting andmainstream lighting products (for General Lighting and Automotive Lighting).

– XX

– XX

• Methyl Silicone is used in applications requiring high stability of performance over the time: Tablet andnetbook backlighting, and high power lighting products (for General Lighting and Automotive Lighting).

– XX

– XX

Remark: In a general way, choice of Methyl Silicone is done for thermal stability / reliability reason (application requirement)and lower RI is compensated by increasing the number of LED chips.

• Hybrid Silicone can be used for some backlighting products and some lighting products.

– XX

Encapsulation and Optics

ORDER FORMLED Packaging Technology and Market Trends 2014

SHIPPING CONTACT

First Name:

Email:

Last Name:

Phone:

PAYMENTBY CREDIT CARD Visa Mastercard Amex

Name of the Card Holder:

Credit Card Number:

Card Verification Value (3 digits except AMEX: 4 digits):

Expiration date:

BY BANK TRANSFERBANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code : 00170Account No: 0170 200 1565 87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587

RETURN ORDER BY • FAX: +33 (0)472 83 01 83• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,

75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France

SALES CONTACTS • North America: David Jourdan - [email protected]• Asia: Takashi Onozawa - [email protected] • Europe & RoW: Jean-Christophe Eloy - [email protected]• Korea: Hailey Yang - [email protected] • General: [email protected]

(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: September 25th, 2014

/

ABOUT YOLE DEVELOPPEMENT

BILL TOName (Mr/Ms/Dr/Pr):

Job Title:

Company:

Address:

City:

State:

Postcode/Zip:

Country*:

*VAT ID Number for EU members:

Tel:

Email:

Date:

PRODUCT ORDERPlease enter my order for above named report : One user license*: Euro 3,990 Multi user license: Euro 5,990For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT. Buy more than 3 reports and get significant discount. Do not hesitate to contact us. I hereby accept Yole Développement’s Terms and Conditions of Sale(1)

Signature:

*One user license means only one person at the company can use the report. Please be aware that our publication will be watermarked on each page with the name of the recipient and of the organization (the name mentioned on the PO). This watermark will also mention that the report sharing is not allowed.

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

MEDIA & EVENTS• i-Micronews.com, online disruptive technologies website• @Micronews, weekly e-newsletter• Technology Magazines dedicated to MEMS, Advanced Packaging, LED and Power Electronics• Communication & webcasts services• Events: Yole Seminars, Market Briefings…More information on www.i-micronews.com

CONTACTSFor more information about :• Consulting Services: Jean-Christophe Eloy ([email protected])• Financial Services: Géraldine Andrieux-Gustin ([email protected])• Report Business: David Jourdan ([email protected])• Corporate Communication: Sandrine Leroy ([email protected])

CONSULTING• Market data & research, marketing analysis• Technology analysis• Reverse engineering & costing services• Strategy consulting• Patent analysisMore information on www.yole.fr

REPORTS• Collection of technology & market reports• Manufacturing cost simulation tools• Component reverse engineering & costing analysis• Patent investigationMore information on www.i-micronews.com/reports

FINANCIAL SERVICES• Mergers & Acquisitions• Due diligence• Fundraising• Coaching of emerging companies• IP portfolio management & optimizationMore information on www.yolefinance.com