led packaging market and technology 2013 report by yole developpement

Copyrights © Yole Développement SA. All rights reserved. © 2012 1

75 cours Emile Zola, F-69001 Lyon-Villeurbanne, France Tel : +33 472 83 01 80 - Fax : +33 472 83 01 83

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LED Packaging

A Comprehensive Survey Of LED Packaging Covering Main Technologies and Market Metrics

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© 2012 2 Copyrights © Yole Développement SA. All rights reserved.

Executive Summary Equipment Market (2/2)

• The graph shows our estimate of actual equipment sales after accounting for:

– Investment cycles and evolution of the average industry capacity utilization rate.

– Natural replacement market (tools reaching their end of life) + technology driven replacement market (new generation of tools offering significant cost of ownership benefits)

• An unprecedented investment cycle started toward the end of 2009 and have extended through early 2012. This cycle initiated in Korea was then essentially fueled by MOCVD subsidies and other incentives in China, as the country is aggressively trying to position itself as a future leader in Solid State Lighting. This has led to a world averaged overcapacity that have briefly exceed 50% for some tools (e.g.: capacity utilization rate < 50%) by middle 2012.

• This in turn have caused a 12-18 month down cycle corresponding to the absorption of this overcapacity as well as some consolidations that will bring the industry back to more usual utilization rates of 80%.

• This down cycle will extend through middle 2013. Then we expect a new investment cycle to kick in to respond to further increasing demand for general lighting. This might lead to another shorter excess investment to be absorbed in 2016 - 2017.

• End of line related equipment (die attach and beyond) though tend to be less prompt to investment overshoot and follow demand more closely.

Executive Summary


Executive Summary Wafer Bonding

• Wafer bonding is an enabling technology for active layer transfer of AlInGaP and InGaN vertical LEDs.

• For both GaAs-based and Sapphire-based LEDs, wafer bonding enables improved thermal, electrical and / or optical properties to ensure high power operation, which is needed for future applications such as general lighting

• While thermo-compression bonding is often applied for LEDs grown on GaAs… Eutectic and solder bonding dominates for InGaN LEDs grown on sapphire substrates. The selection of the substrate, bonding process and material system as well as appropriate adhesion layers and diffusion barriers is essential for a high yield bonding process.

• Alternative techniques to wafer bonding also exists (metal electroplating…) however their use is still “marginal” and restricted to companies that have developed specific IP.

• Wafer bonding process and the associated substrate removal process will grow in concert with the increasing popularity of vertical LEDs.

• We estimate that a minimum of XX bonding equipment will be needed between 2012 and 2017. Factoring in capacity utilization rates and replacement market, we forecast actual sales of equipment to reach XX units in the period.

Executive Summary


Executive Summary Die Singulation

• Laser based scribing or dicing has grown significantly since 2005. However, mechanical solutions are still improving on a regular basis thanks to new design, blades and processes and remain strong for GaAs based LEDs as well as for some vertical LED structures.

• New laser technologies are being developed in order gain further market share against mechanical techniques and further increase throughput and yields.

• With the advent of more complex vertical LED structures, new singulation techniques are emerging including dry or wet etching, or combinations of mechanical and laser techniques.

• Cost and performance are the main elements to decide on a singulation technique. The choice is strongly application dependent and can vary based on the die size, substrate, type of structure and nature of the layers and substrates.

• We estimate that a minimum of X,X76 new tools will be needed in the 2012-2017 period. However, due to the replacement market and capacity utilization rates, we’re forecasting a total volume of X,X80 tools.

Executive Summary


Executive Summary Thermal Management - Packaging Substrates (Including COB)

• Thermal management is one of the most critical aspect of the design and manufacturing of high power LEDs. It requires a full system approach to ensure compatibility between all components and maximum LED package performance. A multitude of designs and substrate materials are being used by LED manufacturers. Due to the potential competitive advantages brought in by each solution, standardization seems unlikely, putting extra burden on manufacturing lines and equipment that often need to be modified or reconfigured when switching from a product to another.

• We expect innovation in materials and package design to continue at a rapid pace in order to enable the development of higher brightness and efficiency packages while lowering LED solutions cost of ownership.

• Standard leadframe with plastic casing will remains the solution of choice for most low and middle power application.

• For high power application, the field remains wide open due to the variety of package types and applications. Dual Plated Copper AlN based ceramic substrates are emerging as a promising solution for handling very high power densities and cost is expecting to decrease significantly. Chip On Board designs are also emerging for various type of applications. They can use ceramic substrates or allow MCPCBs to be used directly as substrates, potentially reducing manufacturing complexity and material cost. Longer term, Silicon is another very promising candidate for high power applications.

Executive Summary


Executive Summary Die Attach

• Most LEDs are low power and can be attached using standard adhesives (Epoxy, Acrylic, Silicone).

• Backside metallization increases as the penetration rate of vertical LEDs increases in middle power and high power LED packages.

• The die attach material of choice for high power LED packages is silver filled epoxy, with varying content rates of silver particles.

• In some very high power packages, Au / Sn solder paste is more and more used… However, it is still considered as expensive (cost factor of nearly x2 with silver filled epoxy).

• As the market of high power LEDs is growing and as die sizes of large size LEDs keep on increasing, the market for die attach materials of LEDs will keep growing fast over the next 5 years.

• There is still a large diversity of technology options and materials for die attach and new ones may add up to the list in the future, particularly technologies developed by the power electronics industry, like low temperature sintering of silver nanoparticles. Eutectic bonding might also develop significantly and be used for Flip chip mounting instead of stud bumping.

Standard MESA Structure

Vertical structure Flip Chip Mesa

Structure

LED substrate Sapphire Metal (Cu) Semiconductor (Si, Ge, SiC) Sapphire (or removed

sapphire)

Low power LED package Standard adhesives

Mid power LED package Standard adhesives, silver-filled epoxy, back-side metal and

silver-filled epoxy or back-side metal on silver paste (substrate

side)

back-side metal (Au, Ni) with silver-filled epoxy

back-side metal (AuSn, Au, Pt) with silver-filled epoxy or

AuSn solder past, Eutectic

High power LED Package Gold bumps and underfill

Executive Summary


LED Penetration Rates - Comparison 2012 vs. 2020

*: Penetration rate of LED based LCD TV vs. all other technologies (CCLF based LCD, OLED, Plasma, CRT…)

LCD Display Applications

Lighting Applications

LED Market Overview


HB LED Packaging Companies Headquarters

Lumileds, Cree,

Luminus, Avago…

PhotonStar

Osram

Optogan

Heesung, Itswell, LG

Innotek, Lumens,

LumiMicro, Seoul

Semiconductor,

Wooree LED…

Citizen, Epitex,

Kodenshi, Toyoda

Gosei, Nichia…

A-Bright, American

Bright, Lumitek,

Lustrous, Neo-Neon,

Oasis, Optotech, Unity

Opto, Visera…

Advanced

Photoelectronic, APT,

BYD, Fangda, Golden

Valley, HuiYuan,

Huixin, Nationstar…

Dominant

Semiconductors

Kwality Group

• There are more than 120 companies involved in HB LED packaging.

• Some companies are vertically integrated and produce a fraction or all their epiwafers (eg: Lumileds, Nichia, Lextar, Osram, Toyoda Gosei, Cree, Samsung LED, LG Innotek…).

• The number of companies in China has strongly increased in 2012.

LED Packaging Overview


Leading LED Packaging Companies 2011 Revenue Ranking

In 2011, Nichia holds #1 position with a market share of ~21%... And the Top-10 Packaged LED manufacturers represented more than 80% of the overall Packaged LED business.

LED Packaging Overview


• Laser Lift Off equipment sales have been taking off in the last couple years thanks to the increasing popularity of vertical LED structures.

• We estimate that a minimum of XX new sets of equipment will be needed between 2012 and 2017. Factoring in capacity utilization rates and replacement market, we forecast actual sales of equipment to reach XX units in the period.

• A pause is likely after the strong investment cycle of 2010-2011 but adoption of LLO technology will keep increasing until 2016… However, IP constraints, cost, performance limitations or damaged caused to the epilayer are providing incentive for the development of alternative techniques.

LLO Equipment Volumes and Revenues

Substrate Removal


Comparison of Die Singulation Techniques

1. In real manufacturing conditions, cutting speed can be lower than announced feed speed - In some case, 2 or more passes are needed for a full cut

Capex Consumable Typical Cutting

Speed1 Street Width Typical

Yield

Main

Application Comments

Blade

Dicing

• < $XXXk for

dual spindle

• < $XXXk for

single spindle

Blades

(Diamond…)

• GaAs: X to XXmm/s

• SiC: X to XXmm/s

• X0 to X0µm

Recent progress

allow street

width < X0µm

90 to 95%

• GaAs and SiC

based LEDs

• Vertical LED

structures

• Well suited for large

dice and vertical

LED structures with

metal substrates

Laser

Dicing • > $XM /

• Si: XXmm/s for

150µm thick

• Cu / Mo based: XX

to XXmm/s for

100µm thick

• GaAs: XX to

XXmm/s for 100µm

thick

• Cu based: X0

to X0µm

• GaAs: X5µm

(Multibeam)

> 95% • Vertical LED

structures

• Requires thin

wafers (< 150µm)

• Multibeam can

increase cutting

speed by up to x3

and cut thicker

wafers (250µm

wafer on GaAs)

Diamond

Scribe &

Break

• $XXXk Diamond tips

• GaAs: XX to

XXmm/s

• Sapphire: X to

XXmm/s

• X5 to X0µm

~90%

• GaAs based

LEDs

• Requires thin

wafers (< 150µm)

Laser

Scribe &

Break

• $XXXk to

$X.XM /

• Sapphire: X to

XXXmm/s

• GaAs: Up to

XXXmm/s

• 1X-X5 um

Potentially as

low as 10µm

with stealth

dicing (no Kerf

loss)

98 to 99%

• Sapphire

based LEDs

• Requires thin

wafers

• Scribing speed

depends on depth

required

Die Singulation


Thermal Management of High Power LEDs Main Design Options

Ch

ip O

n B

oa

rd (

CO

B)

PCB

PCB (MCPCB, FR-4, CEM-3, Ceramic…)

Substrate Only

Si Submount

Substrate

Leadframe / Heat

slug

Optek Lednium

Ceramic

Lumileds Luxeon Rebel

Silicon (Wafer Level Packaging)

Viscera Technology

Leadframe / Heat

slug

Lumileds Luxeon

Ceramic

Cree-X-lamp

Heatsink (Metal, Plastic…)

Heatsink

Ch

ip O

n H

ea

tsin

k (

CO

H)

LED Die Chip

Level

Packaged

LED

Level1

LED

Module

Level 2

LED Light

Engine

Level 3

Thermal Management - Packaging Substrates

http://www.newark.com/jsp/search/results.jsp?N=0&Ntk=gensearch_001&Ntt=categorynumber163084&displaytext=SMD LEDs?ICID=SF_Optek


Choosing the Substrate Type (3/3)

Thermal

Conductivity

Thermo-

Mechanical

Match

Moldability Cost Size Light

Reflectivity

Status &

Trend

Al2O3 Ceramic Fair Fair Fair Excellent Excellent Fair Dominant but

decreasing

AlN Ceramic Excellent Excellent Fair Fair Excellent

Fair

Large

volumes -

Increasing

fast

Leadframes Fair Poor Excellent Excellent Poor Fair Decreasing

Silicon Excellent Excellent Excellent Fair Excellent Fair Few devices -

Promising

Glass Ceramic Excellent Fair Excellent ? Excellent Excellent Emerging



High Power LED Substrate Market Penetration by Substrate Type (2/2)



Die Attach of LEDs Summary Table

Standard MESA

Structure Vertical structure

Flip Chip Mesa

Structure

LED substrate

Sapphire Metal (Cu) Semiconductor (Si,

Ge, SiC)

Sapphire (or removed sapphire)

Low power LED package

Standard adhesives

Mid power LED package

Standard adhesives, silver-filled epoxy, back-

side metal and silver-filled epoxy or back-side

metal on silver paste (substrate side)

back-side metal (Au, Ni) with silver-filled

epoxy

back-side metal (AuSn, Au, Pt) with silver-

filled epoxy or AuSn solder past, Eutectic

High power LED Package

Gold bumps and underfill

Die Attach / Die Bonding


Flip Chip Example - Lumileds Luxeon Rebel (1/2)

Contact to lower (n-GaN)

level

Contact to upper (p-GaN)

level

Bump

(b)

(c)

(d)

(a)

(a) x-ray picture of substrate metal layers through LED die and bumps

(b) Drawing of LED front (bottom) side layout

(c) Drawing of LED cross-section with contacts

(d) Picture of LED die front side

Source: System Plus Consulting

Interconnects


Focus on Silicone The Different Type of Silicone for Encapsulation (1/3)

Hard

ne

ss

Refractive Index

1.39 1.41 1.50 1.44

A70

A50

Gel

A20

1.53 1.57

D70

D30

Low

Reflective

Index

Silicone

Methyl

Silicone Methyl-

Phenyl

Silicone

Encapsulation and Optics


Long Term Vision of WLP 3D Packaging Roadmap

2010 2011 2012 2013 2015 2014 2016 2017 2018 2020 2019

Qualification First product on

the market !

1 year

LED

Driver

Driver integration

in the module

LED

LED

3D Silicon

submount

ESD / EMI IPD

Interposer

Multi-chip

modules

Single

chip

modules

LED Driver

Driver

LED LED

LED LED

Wire bonded LED

LED connected by Flip Chip LED

LED

Fully integrated

LED module

(possible future

architecture)

Wafer Level Packaging


Testing Equipment Main Players

Package Testing, Sorting and Taping

Wafer Defect Inspection

Wafer / Die Probing & Sorting

Yield Management / SPC

Testing and Binning

http://www.hauman.com.tw/


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