silicon photonics 2018 - report by yole developpement

From Technologies to Market

SAMPLE

January 2018

Silicon Photonics 2018

Yes, we’ve reached Si photonics’ tipping point!

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ABOUT THE AUTHORSDr. Eric Mounier, Photonics, MEMS & Sensors Senior Analyst

With almost 20 years of experience in MEMS, Sensors and Photonics applications, markets, and technology analyses, Eric provides deep industry insight intoMEMS and Photonics’ current and future trends. He is a daily contributor to the development of MEMS and Photonics activities at Yole, with a largecollection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisitiontargets, due diligences (buy/sell side), market and technology analysis, cost modelling, technology scouting, etc. He has contributed to more than 250marketing/technological analyses and 80 reports, helping move the MEMS and Si Photonics industry forward.

Thanks to his deep knowledge of the MEMS, Sensors and Photonics-related industries, Eric is often invited to speak at industry conferences worldwide. Hehas been interviewed and quoted by leading media throughout the world.

Previously, Eric held R&D and Marketing positions at CEA Leti in France. Eric has a Semiconductor Engineering Degree and a Ph.-D in Optoelectronics fromthe National Polytechnic Institute of Grenoble.

Jean-Louis Malinge

Jean-Louis Malinge is an accomplished business management executive with extensive experience as a General Manager and CEO in France and theUnited States. He also serves on numerous Boards of Directors. He has formulated successful strategies to position or reposition numerousbusinesses, has led numerous acquisition projects, and also managed the creation of a successful joint-venture in Asia.

Jean-Louis is currently a Venture Partner with Arch Venture Partners. He is also a Director on the boards of EGIDE Group, POET Technologies, andCailabs. He is also Managing Director ofYADAIS, a telecommunications and photonics consulting firm.

Jean-Louis was President & CEO of Kotura from 2004 - 2013, when Kotura was acquired by Mellanox. A global leader in silicon photonics, Koturadesigns, manufactures, and markets CMOS optical components that are deployed throughout the communications network.

Formerly, Jean-Louis served as Vice President - Optical Networking Products for Corning, Inc. His other prior experience includes serving asTechnology Director with Amphenol and Thompson CSF in France.

Jean-Louis’ academic credentials include an Executive M.B.A. from MIT Sloan School in Boston, Massachusetts. He also holds an Engineering degreefrom the Institut National des Sciences Appliquées in Rennes, France.

©2018 | www.yole.fr | Silicon Photonics 2018 | Sample

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A*Star, Amazon, Amicra, Amkor, AMS Technologies, Aurrion, Axalume, Ayar Labs, Broadcom, BSAC, Cadence, Caliopa, Ciena,

Cypress, Dell, Facebook, FhG IZM, Ficontec, Georgia Tech University, GlobalFoundries, Google, HP, Huawei, IBM, IMEC, IMT,

Infinera, Inphi, Intel, Juniper Networks, Leti, Luxtera, MACOM, Mentor Graphics, Microsoft, MIT, Molex, Multiphoton Optics,

Novati, NTT, Oclaro, Optocap, Petra, PhoxTrot, Ranovus, Rockley Photonics, Seagate, Sicoya, Silex, Skorpios, Soitec,

STMicroelectronics, Teramount, Towerjazz, Tyco, Tyndall University, VLC Photonics, Yahoo, and many more.

COMPANIES CITED

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TABLE OF CONTENTS

About the Authors … 4

Glossary … 5

Companies Cited in this Report … 6

Report Objectives … 7

Comparison with 2016 Report … 8

Yole methodology … 8

Executive Summary … 12

Introduction to Si Photonics … 30

Market forecast for Si Photonics … 39

Units … 40

Value … 42

Wafers … 47

Applications … 50

Data Centers … 56

Telecom … 80

Other applications … 89

Supply Chain … 95

Manufacturing … 114

Light sources … 119

Packaging … 129

Examples of processes … 133

Conclusions … 150

Appendix … 155

Si photonics building blocks … 156

Yole Développement presentation … 179


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Introduction, Definition &

Methodology

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GLOSSARY• AOC:Active Optical Cable

• APD:Avalanche Photo Diode

• CFP: C Form-Factor Pluggable

• COBO: Consortium for On-Board Optics

• CWDM: Coarse Wavelength DeMultiplexer

• DC: Data Center

• DML: Directly Modulated Laser

• DWDM: Dense Wavelength DeMultiplexer

• EEL: Edge-Emitting Laser

• EIC: Electrical IC

• EML: Electro-absorption Modulator Laser

• HPC: High-Performance Computer

• IC: Integrated Circuit

• Lidar: Light Detection And Ranging

• MEMS: Micro Electro Mechanical Systems

• MMF: Multi-Mode Fibre

• MSA: Multi Suppliers Agreement

• OEO: Optical Electrical Optical

• OIC: Optical IC

• OOO: Optical Optical Optical

• OXC: Optical Cross-Connect

• PAM: Pulse Amplitude Modulation

• PIC: Photonic Integrated Circuit

• PSM4: Parallel Single-Mode 4-lane

• QSFP: Quad (4-channel) Small Form-factor Pluggable

• ROSA: Receiver Optical Sub-Assembly

• SEL: Surface-Emitting Laser

• SFP: Small Form-Factor Pluggable

• SiPh: Silicon Photonics

• SMF: Single-Mode Fiber

• SOI: Silicon-on-Insulator

• TIA:Transimpedance Amplifier

• TOSA:Transmitter Optical Sub-Assembly

• VC:Venture Capitalist

• VCSEL:Vertical Cavity Surface-Emitting Lasers

• VOA:Variable Optical Attenuator

• WBG:Wide Band Gap

• WDM:Wavelength DeMultiplexer


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OBJECTIVES OF THE REPORT

• This report’s objectives are as follows:

• Examine the current status and future challenges for data centers

• Explain why Si photonics is the answer to future DC needs and other possibleapplications

• Offer an Si photonics 2016 - 2025 market forecast in $USM, units, and wafers

• Provide updated market share numbers for SiPh players

• Give a description of the industrial supply chain, with player status

• Present Si photonics’ technical challenges


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COMPARISON WITH THE 2016 REPORT

What we got right, what we got wrong

• What we got right:• We had the right title:“We have reached the tipping point for Si Photonics!”

• 2017 was the first year when a significant volume of SiPh transceivers was shipped

• The Si photonics market is still small compared to the total photonics IC market

• Si photonics still attracts much global interest via active R&D programs

• Data centers are the main market attraction, but other markets are interesting too

• More and more players are looking at this technology, and companies not currently involved in photonics (IC foundries, materials suppliers)are investigating possible opportunities

• What we got wrong:• We were too optimistic regarding market launches of new Si photonics products

• We revamped our forecast model to account for new challenges

• We were overly optimistic regarding WDM Si photonics and embedded optics in DC

• Data centers will provide the main market traction for Si photonics. Other markets could be interesting (i.e. sensing applications), but theyare more long-term.


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METHODOLOGIES & DEFINITIONS

Yole’s market forecast model is based on the following elementary structured blocks:

Yole’s analysisframework


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REPORT METHODOLOGY (1/2)

Market segmentation methodology

Market forecast methodology


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REPORT METHODOLOGY (2/2)

Technology analysis methodologyInformation collection


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SI PHOTONICS - APPLICATIONS

Low volumes

DATA CENTRES

(In row/Inter/Intra)

>100M units

$0.10 to $5

<1M units

$100 to $5000

AUTOMOTIVE

(low latency for

autonomous cars)

>10M units

$1 to $50

AERONAUTICS

(in-flight entertainment)

High volumes

>1M units

$10 to $500

DEFENSE

MEDICAL

HIGH-PERFORMANCE

COMPUTING

SI PHOTONICS

TELECOM (Metro)


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SILICON PHOTONICS APPLICATIONS - EXAMPLES OF PLAYERS’ POSITIONING

Aeronautics/

aerospaceSensorsAutonomous cars

High

performance

computing (HPC)

Telecom

(FTTH,

metropolitan)Data Centres

Commercial

productsCommercial

products

Commercial

products

Medical


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SI PHOTONICS VS. LEGACY OPTICAL TRANSCEIVER FORECAST, IN VALUE

The Si photonicstransceivermarket isgrowing

faster thanthe total optical

transceivermarket


2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 CAGR

Optical transceivers $5 048 $5 642 $6 144 $6 779 $7 414 $8 009 $8 973 $9 776 $10 572 $11 334 9,4%

SiPh transceivers $202 $260 $492 $681 $973 $1 420 $1 627 $2 141 $2 825 $3 729 38,3%

$0

$2 000

$4 000

$6 000

$8 000

$10 000

$12 000

$14 000

$16 000

Mill

ion

US$

SiPh vs. optical transceiver market, in US$M

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SI PHOTONICS CHIP FORECAST, IN VALUE (40G, 100G, 200/400G)

A $560M market by 2025 for SiPh dies

2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 CAGR

200G/400G Si photonics dies US$M $0 $0 $1 $3 $10 $21 $27 $39 $64 $84 95,9%

100G Si photonics dies US$M $29 $38 $71 $98 $135 $192 $217 $283 $360 $475 31,2%

40G Si photonics dies US$M $2 $1 $2 $1 $1 $0 $0 $0 $0 $0 0,0%

$0

$100

$200

$300

$400

$500

$600M

illio

n U

S$

Si photonics die forecast, in US$M


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DATA CENTERS - ARCHITECTURE AND DATA RATE

SPIN (commutation)

CORE

LEAF (servers &

storage)

TOP OF RACK

INTRA RACK: 10G, moving to 25G

Direct attach cable (DAC) in copper

3 - 5m

Lowest-priced link

INTER RACK: 40G, moving to 100G

Multimode fiber

< 100m: active optical cable (AOC) with VCSELs

100 - 200m: SR4

Lowest-priced optical link

LONG SPAN/INTER BUILDINGS: 40G - 100G & beyond

(200G, 400G)

Single-mode fiber

PSM4 or WDM4

500m - 10km

For distance > 500m

with data rate > 100G

(not accessible to

VCSEL), Si photonics

makes sense

DAC: copper cables

AOC: transceivers with integrated fibers

Optical transceivers (transmitter-receiver) with detachable connectors

SiPh will first be used for inter-DC. As data rate grows to 100G (outside VCSEL

capabilities), SiPh will then move to inter-rack.


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ECOSYSTEMS AND STAKEHOLDERS

Si Photonics’ value chain in motion

Differentiation and competitive

advantages come with new positioning in

the supply chain. Hyperscale is

driving R&D for future optical

DC.

HYPERSCALE

SYSTEM VENDORS

CHIP

COMPANIESOPTICS

COMPANIES

FOUNDRIES

DESIGN

PACKAGING

VENDORS

OPTICS FABS

MANUFACTURERS

CHIP VENDORS

MATERIALS (epiwafers,

SOI, tools)

AXALUME


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2016 MARKET SHARE

2016 market share (units) 2016 market share ($M)

The high price of a coherent module from Acacia explains

the difference in market share (units vs. $M)

Main focus is

INTRA DC

interconnects

@1310nm

• In units, Luxtera is number one and is likely to hold market share for 100G transceivers - all technologies included. We

estimate this share to be 5 - 10%.

• As of October 2017, Luxtera has shipped more than 800K transceivers

• STMicroelectronics is today’s leading chip manufacturer


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SI PHOTONICS - FUTURE TRENDS (2/2)

Inter-ChipIntra/Inter

Data CentersFTTH/Metro Long-haul

SiPh current

market: main

drivers are high

data rate/low cost

for distances

beyond VCSEL’s

reach

With a zero-change CMOS

process development, SiPh

could access inter-chip

optical communication

huge volume

SiPh could be interesting for

telecom, as FTTH and Metro

specs could converge.

For long-haul, volumes are not

large enough for SiPh to be

cost-effective.

Main SiPh data/telecom applications


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SILICON PHOTONICS LANDSCAPE

In Japan, extra effort

is made for

inter/intra-chip

comunication


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EXAMPLE OF SUPPLY CHAIN ANALYZED IN THE REPORT

WAFERS FOUNDRY EXTERNAL SUPPLIERS ASSEMBLY VENDOR / PRODUCTS CUSTOMER

Epi-wafers

R&D (2017)?

? ?

2012 acquisition

($271M)

?

OPTICAL TRANSCEIVER

PHOTONIC INTERPOSER

OPTICAL TRANSCEIVER

OPTICAL TRANSCEIVER

Subcontractor in

Thailand for

module

assembly

?

Albuquerque


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Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China. Indeed, in China data centers are expanding fast, with over 650 million Internet users and three big operators setting up their own fiber networks. In 2018, new hyperscale data centers will be set up in China to expand the growth of optical components, new installed fiber and optical technologies.

In US and Europe, big names like Facebook, Google, and Amazon are developing their own optical data center technology in partnership with chip firms, such as Facebook and Microsoft’s partnership with Intel.

While traffic continues to increase between users and data centers across the internet, more and more data communication is taking place within the data center. And with existing data center switching

and interconnects making it difficult and costly to cope with this increasing flow, new approaches are necessary.

As a semiconductor-based technology, silicon photonics’ cost will drop with increasing volume thanks to economies of scale. Silicon photonics components will therefore answer data centers’ requirements in terms of low cost, higher integration, greater embedded functionality and higher interconnect density, lower power consumption and better reliability compared with legacy optics.

And more players are entering this industry’s landscape (see figure). After 16 years of development, Intel has successfully penetrated this application and shares the current market with its leader Luxtera. We also see new startups and more products reaching the market, mostly for 100G data rates, but soon for 400G. Besides Luxtera, which did well in 2016 in inter-data center links, Acacia Inc. had success with its single-chip silicon photonics 100G coherent transceiver for metropolitan applications, opening the way for silicon photonics in telecoms.

SILICON PHOTONICS 2018Market & Technology report - January 2018

SILICON PHOTONICS TECHNOLOGY HAS REACHED ITS TIPPING POINT, WITH TRANSCEIVERS SHIPPING IN VOLUME!

Yes, we’ve reached Si photonics’ tipping point!

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Introduction to silicon photonics• Market forecast by data rate for

chips and transceivers in units, value in US$M and wafers

• Description of applications: data center, telecom, high performance computing, medical, sensors, automotive, aeronautics

• Supply chains• Manufacturing trends and challenges

WHAT’S NEW• Updated silicon photonics forecast

in units, value and wafers for 40G, 100G, 200G and 400G for 2016-2025

• Wavelength division multiplexing (WDM) versus parallel

• Updated 2016 market shares for silicon photonics suppliers

• Supply chains• Technology and process trends• Application descriptions: Data

centre, HPC, telecom, automotive, medical, sensors, aeronautics/aerospace

OBJECTIVES OF THE REPORT• Examine the current status and

future challenges for data centers• Explain why silicon photonics is the

answer to future datacenter needs and other possible applications

• Offer 2016-2025 market forecast for silicon photonics in US$M, units, and wafers

• Provide updated market shares for silicon photonics players

• Give a description of the industrial supply chain, with player status

• Present silicon photonics’ technical challenges

Ecosystems and stakeholders 2017

HYPERSCALE

SYSTEM VENDORS

CHIP COMPANIES

OPTICS COMPANIES

FOUNDRIES

DESIGN

PACKAGING VENDORS

OPTICS FABS

MANUFACTURERS

CHIP VENDORS

MATERIALS, including epiwafers, SOI and

tools

AXALUME

(Yole Développement, January 2018)

MARKET WILL BOOM FOR 100G THEN 400G

Silicon photonics is still a small market today, with sales at die level estimated to be $30M in 2016. However, it has big promise, with a 2025 market value of $560M at chip level and almost $4B at

transceiver level. It means that silicon photonics technology will grow from a few percent of total optical transceiver market value in 2016 to 35% of the market in 2025, mostly for intra-data center

SILICON PHOTONICS 2018

WE ARE AT THE VERY BEGINNING OF MASSIVE DEPLOYMENT

We believe we are only at the very beginning as there is massive ongoing development worldwide for further integration. The recent involvement of large integrated circuit foundries, such as TSMC’s relationship with Luxtera, and GlobalFoundries with Ayar Labs, are very encouraging signs showing the big promise for silicon photonics. STMicroelectronics is the major silicon photonics manufacturer today.

The “Zero-Change” processes currently in development, manufacturing optical components without making any changes to a CMOS process, are targeting future inter-chip optical interconnects that could represent huge market volumes. Silicon photonics is at the maturity level of the electronics industry in the 1980s and there are still challenges to overcome. For all these challenges, technical breakthroughs will be necessary (see figure).

• Laser source: For low-cost, low data rate <50Gb/s and <300m distance, edge-emitting lasers cannot compete with VCSELs and buying lasers from an external supplier is costly. There have been no noticeable breakthroughs in silicon laser development. Silicon nanocrystals-based laser development stopped a few years ago because the technology offers too little gain.

• We need smaller modulators: cheaper, better peak-to-peak driver performance, less power consumption.

• Alignment and packaging, wafer-scale testing.• Design and software: Photonics software is very

specialized and very custom-designed, with pre-defined models.

• Supply chain.• Manufacturability: A new trend is to have a zero-

change approach on a CMOS line.

communication. The strongest demand is for 400G, and 200G could be only an intermediate step between 100G and 400G. The next evolution is to develop a 400G optical port over a single fiber across 500m at less than $1 per gigabit and with power <5mW/Gb. One terabit per second rates should follow. Although the wafer area this accounts for will be a minute part of the worldwide silicon-on-insulator (SOI) market, it will represent significant value because of the SOI wafer high price. The main supplier is SOITEC.

Silicon photonics transceivers market forecast


Silicon photonics roadmap


2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 CAGR

200G/400G Si photonics transceivers $ 0 $ 0 $ 5 $ 21 $ 68 $ 142 $ 179 $ 257 $ 424 $ 559 95,9%

100G Si photonics transceivers $ 191 $ 251 $ 475 $ 651 $ 900 $1 278 $1 448 $1 884 $2 401 $3 169 37,3%

40G Si photonics transceivers $ 11 $ 9 $ 12 $ 9 $ 4 $ 0 $ 0 $ 0 $ 0 $ 0 0,0%

$0

$500

$1 000

$1 500

$2 000

$2 500

$3 000

$3 500

$4 000M

illio

n U

S$

Silicon photonics transceiver forecast in US$M

2017 2020

LASER SOURCE Quantum dot laser

MODULATOR New materials: SiGe, graphene, organics, III-V

• Size • Power • High bandwidth

PHOTO DETECTOR

WAVEGUIDES

Co-integration of photodetector, modulators, sources Extension to mid-infrared

CMOS INTEGRATION Interposer

FIBER ATTACH AND PACKAGING Fast/low cost assembly technique

Zero-change process

Optimal layer thickness standardization

: Main challenges : Technical breakthrough

2018 2019 2021

• Low losses • Thermal management • Lower power consumption

• Photonic and semiconductors processes optimization • Multiple SOI patterns, improved lithography/

etching control

• High speed • Low loss • Temperature sensitivity

• Silicon technology compatibility • Sensitivity

• Integration of a large number of components on a common chip

• Light coupling • Low loss • Polarization insensitive

• Thermal management • Light source/electronics integration • Insertion loss • Limited optical bandwidth • Packaging standardization

FROM DATA CENTERS TO NUMEROUS OTHER APPLICATIONS!

Besides data centers, some other interesting applications could follow. High performance computing most generally refers to the practice of aggregating computing power in a way that delivers much higher performance than one could get out of a typical desktop computer or workstation in order to solve large problems in science, engineering, or business. Due to the accelerated growth in performance of microprocessors and the recent emergence of chip multiprocessors (CMP), the critical performance bottleneck of high-performance computing systems has shifted from the processors to the communications infrastructure. So, by exploiting the parallelism and capacity of wavelength division multiplexing (WDM), optical interconnects

offer a high-bandwidth, low-latency solution that can address the bandwidth scalability challenges of future computing systems. Optically-connected memory systems can enable continued performance scaling through high-bandwidth capacity, energy-efficient bit-rate transparency, and time-of-flight latency.

Telecom is also one possible application for silicon photonics, especially metropolitan networks from 80km to 1,500km in length. For example, Acacia Communications is developing coherent-based silicon photonics modules for telecom applications. While coherent was first adopted in long haul, Acacia’s coherent technology reduces polarization dispersion and losses and reduces channel passbands. There

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MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)A*Star, Amazon, Amicra, Amkor, AMS Technologies, Aurrion, Axalume, Ayar Labs, Broadcom, BSAC, Cadence, Caliopa, Ciena, Cypress, Dell, Facebook, FhG IZM, Ficontec, Georgia Tech University, GlobalFoundries, Google, HP, Huawei, IBM, IMEC, IMT, Infinera, Inphi, Intel, Juniper Networks, Leti, Luxtera, MACOM, Mentor Graphics, Microsoft, MIT, Molex, Multiphoton Optics, Novati, NTT, Oclaro, Optocap, Petra, PhoxTrot, Ranovus, Rockley Photonics, Seagate, Sicoya, Silex, Skorpios, Soitec, STMicroelectronics, Teramount, Towerjazz, Tyco, Tyndall University, VLC Photonics, Yahoo, and many more.

AUTHORSWith almost 20 years of experience in MEMS, Sensors and Photonics applications, markets, and technology analyses, Eric provides deep industry insight into MEMS and Photonics’ current and future trends. He is a daily contributor to the development of MEMS and Photonics activities at Yole, with a large collection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisition targets, due diligences (buy/sell side), market and technology analysis, cost modelling, technology scouting, etc. Previously, Eric held R&D and Marketing positions at CEA Leti in France. Eric has a Semiconductor Engineering Degree and a Ph.-D in Optoelectronics from the National Polytechnic Institute of Grenoble.

About the authors 4

Glossary 5

Companies cited in this report 6

Report objectives 7

Comparison with 2016 report 8

Yole methodology 8

Executive summary 12

Introduction to silicon photonics 30

Market forecast for silicon photonics 39> Units > Value> Wafers

Applications 50> Data centers> Telecom > Other applications

Supply chain 95

Manufacturing 114> Light sources > Packaging > Examples of processes

Conclusions 150

Appendix 155

Silicon photonics building blocks 156

Yole Développement presentation 179

TABLE OF CONTENTS (complete content on i-Micronews.com)

Jean-Louis Malinge collaborates with Yole Développement (Yole) to investigate the silicon photonics technologies and market evolution. Jean-Louis is strongly involved in this industry for many years and as an expert, he is an accomplished business management executive with extensive experience as a General Manager and CEO in France and the United States. He serves on numerous Boards of Directors. Amongst his experiences, he has formulated successful strategies to position or reposition lot of businesses, led numerous acquisition projects, and managed the creation of a successful joint-venture in Asia. Jean-Louis’ academic credentials include an Executive M.B.A. from MIT Sloan School in Boston, Massachusetts. He also holds an engineering degree from the Institut National des Sciences Appliquées (INSA Rennes, France).

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is also interest for fiber-to-the-home (FTTH), especially second-generation gigabit passive optical networks (GPON2). Silicon photonics may be useful as FTTH moves from 10G to 25G, because more functionality will be needed, such as wavelength tuning and switching.

Silicon photonics is also an interesting platform for sensing applications in biomedical applications and sensors. Future autonomous vehicles will

require a high level of security with very low latency for high reactivity speed. Lidar is also an attractive application for silicon photonics, with IMEC developing the necessary technology, and with some R&D projects already having started. For aerospace/aeronautic applications where size and weight are critical parameters for reducing power consumption, silicon photonics is also promising.

Silicon photonics application range


Aeronautics/aerospace Sensors Autonomous

cars

Highperformance

computing (HPC)

Telecom(FTTH,

metropolitan) Data Centers

Commercial products

Commercial products

Medical

Commercial products


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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr

MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com

REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports

CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])

© 2018

Yole Développement

FromTechnologies to Market

Source: Wikimedia Commons

http://www.yole.fr/

http://www.yole.fr/

24©2018 | www.yole.fr | About Yole Développement

FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS

MEMS & Sensors

Solid State Lighting(LED, OLED, …)

Compound Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries / Energy Management

Power Electronics

Displays

RF

Devices &

Techno.

Advanced

Substrates

Software

http://www.yole.fr/

http://www.yole.fr/


3 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization of

innovative optical systems

• Financial services (due diligence,

M&A with our partner)

www.yole.fr

o Reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

http://www.yole.fr/

http://www.yole.fr/

http://www.yole.fr/

http://www.yole.fr/

https://www.i-micronews.com/reports.html

https://www.i-micronews.com/reports.html

https://www.i-micronews.com/media-kit.html

https://www.i-micronews.com/media-kit.html


A GROUP OF COMPANIES

Market, technology

and strategy

consulting

www.yole.fr

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

http://www.yole.fr/

http://www.yole.fr/


OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

http://www.yole.fr/

http://www.yole.fr/


ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

http://www.yole.fr/

http://www.yole.fr/


SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators and

end-users

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors,

R&D centers

http://www.yole.fr/

http://www.yole.fr/


SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

http://www.yole.fr/

http://www.yole.fr/


o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


OUR 2018 REPORTS COLLECTION (1/3)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 - Update

− Silicon Photonics 2018 - Update

− Consumer Biometrics: Sensors & Software 2018 - Update

− MEMS Pressure Sensors 2018

− Air Quality Sensors 2018

− Sensors for AR/VR 2018

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− Gas & Particles Sensors

− MEMS Pressure Sensors

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

RF DEVICES AND TECHNOLOGIES


− RF Front End Module and Connectivity for Cellphones 2018 – Update

− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals

2018 - Update

− RF GaN 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Radar Technologies for Emerging Applications 2018 *

− Radar Technologies for Automotive 2018

− RF & Photonic Technologies for 5G Infrastructure 2018


− RF Front-End Modules in Smartphones

− RF GaN *


− RF Front End Module – Patent Landscape Analysis

− RF GaN – Patent Landscape Analysis

IMAGING & OPTOELECTRONICS


− Status of the CMOS Image Sensor Industry 2018 – Update

− Status of the Compact Camera Module Industry 2018 - Update

− 3D Imaging and Sensing 2018 - Update

− Imaging for Industry and Automation 2018

− Sensors for Robotic Vehicles 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− LiDARs 2018

o QUARTERLY UPDATE – by Yole Développement

− CMOS Image Sensors 2018 *


− CMOS Image Sensors

− Compact Camera Modules


− LiDAR – Patent Landscape Analysis

− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping

SOFTWARE


− Consumer Biometrics: Sensors & Software 2018 - Update

− Processing Hardware and Software for AI: Integration Challenges 2018

Update : 2017 version still available / *To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING


− Status of Advanced Packaging Industry 2018 - Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates

Like PCB Trends

− Fan-Out Packaging 2018 – Update

− 3D TSV and Monolithic Business Update 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Power Packaging Modules 2018 - Update

− Discrete Power Packaging 2018 – Update

− MEMS Packaging and Testing 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update

− Status of Panel Level Packaging 2018

− Trends in Automotive for Advanced Packaging 2018

− Processing Hardware and Software for AI: Integration Challenges 2018

− Integrated Passive Devices (IPD) 2018


− RF Front-End SiP

− Fan-Out Packaging *


− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

MANUFACTURING


− Manufacturing Wafer Starts for More than Moore 2018

− Equipment for More than Moore: Technology & Market Trends for Lithography &

Bonding/Debonding 2018

− Equipment for More than Moore: Technology & Market Trends for Thin Film

Deposition & Etching 2018


− Wafer Bonding Technology Overview 2018

MEMORY


− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update


− Memory Market 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement

− Memory Pricing 2018 (NAND & DRAM)


− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018

COMPOUND SEMICONDUCTORS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018 *

− Power SiC 2018: Materials, Devices, and Applications - Update

− Power GaN 2018: Materials, Devices, and Applications – Update

− RF GaN 2018 – Update

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018


− Power SiC Devices

− Power GaN Devices


− Power SiC – Patent Landscape Analysis

− Status of the GaN IP – Patent Landscape Analysis


http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (3/3)

POWER ELECTRONICS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 - Update

− Power Packaging Modules 2018 - Update

− Discrete Power Packaging 2018 - Update

− EV/HEV Market Expectations and Technology Trends - Update

− Wireless Charging Market Expectations and Technology Trends 2018

− Integrated Passive Devices (IPD) 2018


− Power ICs Market 2018 – Update


− Power ICs Market 2018 *

− Power Modules *

BATTERY AND ENERGY MANAGEMENT


− Status of Battery Industry Update with Focus on Manufacturing 2018 *

− Battery Pack Technology and Business Opportunities 2018 - Update


− Solid-State Batteries – Patent Landscape Analysis

SOLID STATE LIGHTING


− IR LEDs and Lasers 2018 - Update

− Automotive Lighting 2018 – Update

− UV LEDs 2018 - Update

− VCSELs 2018

− Lasers 2018

− Light Shaping Technologies 2018

− LiFi 2018


− VCSELs 2018

− UV LEDs 2018 *

DISPLAYS


− MicroLED Displays 2018 – Update

− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update

− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -

Update *

− Displays for AR / VR / MR 2018

− Non Display Applications of MicroLEDs 2018 *


− MicroLED Display – Patent Landscape Analysis

MEDTECH


− Status of the BioMEMS Industry 2018 - Update

− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update

− Neuro-Technologies for Healthcare and Consumer Applications 2018

− CRISPR Technology: From Lab to Industries 2018

− Portable Medical Imaging 2018

− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018

− Liquid Biopsy 2018: From Isolation to Downstream Applications

− Chinese Microfluidics Industry 2018


− Microfluidic IC Cooling – Patent Landscape Analysis

− Circulating Tumor Cell Isolation – Patent Landscape Analysis

− Organ-on-a-Chip – Patent Landscape Analysis


http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS


− Status of the MEMS Industry 2017

− High End Inertial Systems Market and Technology 2017

− Magnetic Sensors Market and Technologies 2017

− MEMS and Sensors for Automotive - Market and Technology Trends 2017

− Acoustic MEMS and Audio Solutions 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

o REVERSE COSTING REPORT – by System Plus Consulting

− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –

Reverse Costing Report

− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report

− MEMS Packaging 2017 - Reverse Costing Review

− Bosch BMP380 Pressure Sensor – Reverse Costing Report

IMAGING & PHOTONICS


− Status of the CMOS Image Sensor Industry 2017

− 3D Imaging and Sensing 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Camera Module Industry Market and Technology Trends 2017


− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse

Costing Report

− Camera Module Physical Analyses Overview 2017

RF DEVICES AND TECHNOLOGIES


− RF Front End Modules and Components for Cellphones 2017

− Advanced RF System-in-Package for Cell Phones 2017

− 5G Impact on RF Front-End Industry 2017

ADVANCED PACKAGING


− Status of the Advanced Packaging Industry 2017

− Embedded Die Packaging: Technology and Market Trends 2017

− Fan-Out: Technologies and Market trends 2017

− Advanced Substrates Overview: From IC Package to Board 2017

− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

− Advanced RF System-in-Package for Cellphones 2017

− Memory Packaging Market and Technology Report 2017

− MEMS Packaging 2017

− Emerging Non-Volatile Memory 2017


− NVIDIA Tesla P100 - Reverse Costing Report

− MEMS Packaging - Reverse Technology Review

− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review

SOFTWARE


− Embedded Software in Vision Systems

MEDTECH


− Status of the Microfluidics Industry 2017

− Solid-State Medical Imaging 2017

− Organs-On-Chips 2017

− Connected Medical Devices Market and Business Models 2017

− Artificial Organ Technology and Market analysis 2017

− Medical Robotics Technology & Market Analysis 2017

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (2/3)

MANUFACTURING


− Laser Technologies for Semiconductor Manufacturing 2017

− Equipment and Materials for 3D TSV Applications 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

BATTERIES & ENERGY MANAGEMENT


− Status of the Rechargeable Li-ion Battery Industry

− Market Opportunities for Thermal Management Components in Smartphones

DISPLAYS


− MicroLED Displays

− Quantum Dots and Wide Color Gamut Display Technologies

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

SOLID STATE LIGHTING


− LED Packaging 2017: Market, Technology and Industry Landscape

− CSP LED Lighting Modules

− IR LEDS and VCSELs - Technology, Applications and Industry Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− Automotive Lighting: Technology, Industry and Market Trends 2017

− Horticultural LED Lighting: Market, Industry, and Technology Trends

POWER ELECTRONICS


− Status of the Power Electronics Industry 2017

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Gate Driver Market and Technology Trends 2017

− Power MOSFET 2017: Market and Technology Trends

− Power Module Packaging: Material Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017


− Power Management ICs Market 2017


− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report

− Silicon Capacitor - Technology and Cost Review

− Industrial 100V MOSFET - Technology and Cost Review

− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor

Combo – Reverse Costing Report

COMPOUND SEMICONDUCTORS


− Bulk GaN Substrate Market 2017

− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS

− Power SiC 2017: Materials, Devices, Modules, and Applications

− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

http://www.yole.fr/

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MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

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Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 11,200+

monthly unique visitors, the

10,500+ weekly readers of

@Micronew se-newsletter

Several key events planned for

2018 on different topics to

attract 120 attendees on average

Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager

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mailto:[email protected]


CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

• Japan: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)

• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80

o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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