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I S S U E N ° 1 1 2 M A Y 1 1 , 2 0 1 1

E D I T O R I A L

The research facility, located on NTU's sprawling 200-hectare green campus, will focus on developing innovative breakthrough products

using MicroVision's PicoP® Display technology.MicroVision plans to staff the new R&D facility with up

to 25 engineers by 2012 to work on advanced research and development projects, perform operational support functions, and build upon the company's current industry leading portfolio of over 500 patents issued and pending…

M E M S

C O N T E N T S

• C O W I N 3

• M E M S 8

• M I C R O F L U I D I C S 1 2

• C O M P O U N D S E M I C O N D U C TO R S 1 4

• P H OTO N I C S 1 5

• P H OTO V O LTA I C 1 6

• A D VA N C E D PA C K A G I N G 1 8

• N A N OT E C H N O L O G Y 2 0

• P O W E R E L E C T R O N I C S 2 1

Microvision establishes fi rst global R&D center in Singapore

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rTHE D ISRUPT IVE SEMICONDUCTOR TECHNOLOGIES MAGAZ INE

Free registration onwww.i-micronews.com

Y O L E D É V E L O P P E M E N T

STATS ChipPAC was one of the fi rst Outsourced Semiconductor Assembly and Test (OSAT) providers to invest in TSV technology with a

51,000 square foot research and development facility dedicated to the development of next generation wafer level integration with TSV technology.One of the fi rst implementations of TSV technology is in the form of silicon interposers used to bridge 2D silicon designs into more advanced and effi cient 3D configurations. Often referred to as the 2.5D technology, TSV interposers are an immediate and practical approach to die level integration using the capabilities of TSV technology. TSV interposers

provide fl exibility for the integration of die from different technology nodes and deliver advantages in miniaturisation, thermal performance and fi ne line/width spacing in a semiconductor package…

The purpose of the fund is to provide growth fi nancing for young, promising nanotechnology companies in the administrative district Perm.

Nanostart AG will invest up to 25 percent of the fund volume, 12.5 million euros, as well as manage the fund.

RUSNANO and the governor of Perm are investing equal amounts for a total of 37.5 million euros, which represents 75 percent of the fund volume.

STATS ChipPAC expands 300mm Through Silicon Via capabilities

Nanostart launches nanotechnology fund in Russia

A D V A N C E D P A C K A G I N G

N A N O T E C H N O L O G Y

STATS ChipPAC announced it is expanding its 300mm TSV offering with the addition of mid-end manufacturing capabilities.

Together with RUSNANO and the Governor of the administrative district Perm, Nanostart is launching a nanotechnology fund in Russia.

P L A T I N U M P A R T N E R S

PiezoMEMS market is forecasted to grow

8

20

New R&D center to develop breakthrough innovations in laser display and imaging for mobile, automotive, and medical applications.

In this issue of Micronews, I encourage you to have a look at the SolMateS’ news. SolMateS is a Dutch company that has recently received a three mil l ion dollar investment for the final stage of development of their piezoelectric deposition machine. This confirms a trend we recently identified: a “reborn” of the interest for piezo actuated MEMS device using ferroelectric thin films. Indeed, such thin films have been used for many years in Integrated Passives Devices (IPDs), Ferroelectric memories (FeRAM) and MEMS inkjet heads. Such thin films can be used for their different physical properties: ferroelectric, piezoelectric or pyroelectric properties.Today, because of a better knowledge and industrialization of these materials, they are increasingly used in many new applications, and especially in the MEMS field. We can name a few of them: MEMS wafer level autofocus, RF MEMS, MEMS ultrasonic transducers, infrared sensors…..Driven by existing and new MEMS applications, we have estimated the production of ferroelectric thin films will undergo a CAGR of +7.5 % over 2010-2015. Inkjet head application and IPDs ESD/EMI planar capacitor represent more than 90% of the production in 2010 but other applications will grow strongly. In the next 5 years, we have identified many new players who plan to adopt or evaluate ferroelectric thin f ilms to enter into key markets, from MEMS SMEs to large InkJet Heads/IPD groups. Yole Développement thinks this is really good news for equipment/materials makers as well.

Dr. Éric MounierEditor-in-chief

2.5D silicon interposer "PoP module" demonstrator from STATS ChipPAC

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G O L D P A R T N E R S

CONSULTING

T O M E E T U S

CS Mantech - Palm Springs, CA - May 17 to 20, 2011

Join the CS-MANTECH conference at the Hyatt Grand Champions Resort & Spa and bring yourself up-to-date on the latest in compound semiconductor (GaAs, GaN, SiC and related materials) manufacturing processes. Full Details including Advance Program on the website.

PCIM Europe - Nuremberg, Germany - May 17 to 19, 2011

Visit the leading show in power electronics, intelligent motion and power qualify and have a

look at the comprehensive conference program. The visit of the exhibtion is free of charge with pre-registration. From 17 – 19 May 2011, Nuremberg will be the meeting point for international experts from science and industry.

MEPTEC - 9th Annual MEMS Technology Symposium - San Jose, CA - May 19, 2011

This symposium will bring together experts from many of these sectors to tell us not only where we are going in the future, but will also address specifi c areas that they will need help from existing technologies.

ECTC - Lake Buena Vista, FL - May 31 - June 3, 2011

The premier international packaging, components, and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information.

M I C R O N E W S F I N A N C E

Companies composing the Yole Index, May, 2011

Companies Sector Currency Symbol Price 06/05/11 Price 04/01/11 Price 01/04/10 Price 16/01/09 Price 01/01/07 jan 4th - may 1st

ANALOG DEVICES Comp $ ADI.N 40,73 37,52 31,67 19,83 32,87 8,50%

AFFYMETRIX INC Bio Rel Comp $ AFFX.OQ 6,05 4,66 5,9 3,46 23,06 29,80%

AUSTRIAMICROSYSTEMS Comp CHF AMS.S 48,2 45,3 23,45 12,45 84,25 -6,40%

CALIPER LIFE SCI Bio Rel Comp $ CALP.O 6,8 6,11 2,64 1,15 5,72 11,30%

CREE INC Comp $ CREE.O 38,59 66,97 56,84 17,93 17,32 -42,40%

CYPRESS SEMICONDUCTR Comp $ CY.O 21,14 18,24 10,58 4,83 16,87 15,80%

ELMOS SEMICONDUCTOR Comp € ELGG.DE 10,73 9,81 6,85 2,05 7,58 9,30%

HEWLETT PACKARD ( HP ) Comp $ HPQ.N 41,25 43,63 52,45 34,77 41 -5,40%

INFINEON TECH ADS Comp € IFXGn.de 7,91 7,02 4,1 0,94 14,44 12,60%

LAM RESEARCH CP Equipment $ LRCX.O 48,71 49,41 39,88 22,17 50,95 -1,40%

MICRONAS Comp CHF MASN.S 7,96 12,95 4 3,75 26,92 -38,50%

MELEXIS Comp € MLXS.BR 12,5 13,38 6,84 4,90 13,91 -6,50%

MEMSIC Comp $ MEMS.0 3,36 3,21 3,34 1,60 1,7 4,60%

MEMSCAP Comp € MEMS.PA 3,5 4,15 2,26 2,20 21,9 -15,60%

MENTOR GRAPHICS Software $ MENT.O 14,46 11,96 9,25 5,17 18,37 20,90%

NANOGATE Nano tech € N7GG.DE 18,5 15,65 21,9 8,80 34,5 18,20%

NANOPHASE Nano tech $ NANX 1,27 1,26 0,84 0,97 4,9 1,00%

NANOGEN Bio Rel Comp $ NGEN 0,01 0,1 0,2 0,20 1,87 0,00%

OERLIKON Mat/equipt CHF OERL.S 7,1 5,34 4,66 7,40 84,95 33,90%

OKMETIC Material € OKMI.BE 5,46 5,05 3,42 2,46 3,58 8,10%

PLAN OPTIK Material € P40G.DE 3,89 4,06 2,87 1,68 7,35 -4,10%

PSIVIDA LIMITED Bio Rel Comp $ PSDV.OQ 4,12 5,02 3,69 0,99 1,95 -17,90%

Q-CELLS Photovoltaic € QCEG.DE 2,61 2,49 11,39 21,40 34,07 4,80%

RIBER Equipment € RIBE.PA 3,35 2,55 1,3 1,00 2,1 31,30%

SAES GETTERS Materials € SAEI.MI 7,73 6,92 6,1 6,30 27,63 11,70%

SUESS MICROTEC Equipment € SMHG.DE 11,73 9,59 4,4 1,37 6,95 37,80%

SOITEC Material € SOIT.PA 10,44 8,51 10,77 2,92 27,72 22,60%

SUNPOWER CORPORATION Photovoltaic $ SPWRA 21,34 13,63 23,95 33,62 37,17 56,50%

STMICROELECTRONICS Comp € STM.PA 7,91 8,1 6,48 4,29 14,07 -2,30%

PVA TEPLA Equipment € TPEG.DE 4,36 3,91 5,37 2,59 28,45 11,50%

TESSERA Equipment $ TSRA.O 18,83 21,7 23,81 11,32 4,37 -13,20%

TEXAS INSTRUMENTS Comp $ TXN.N 35,36 32,67 26,01 15,02 40,34 8,20%

ULTRATECH INC Equipment $ UTEK.O 30,26 19,27 15,37 10,60 12,48 57,10%

Find more details on www.I-micronews.comComp for components, Bio Comp for Bio related component, Nano tech for Nanotechnologies

M for Million, MD for Billions

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

COWIN Marketplace - 14th-16th June 2011, Scandic Marina Congress in HelsinkiCome to COWIN Marketplace to know more about available technologies, on-going innovative projects and funding opportunities in smart systems. COWIN is a support action to optimize value creation from European collaborative research results in generating business opportunities.

C O W I N

From Smart phones to smart industrial processes, the trend is set. Miniaturised smart systems are becoming more and more key components in our private and professional lives. They enable better telecommunications,

energy effi ciency, sustainable transport, fast and reliable medical diagnostics, breakthroughs in healthcare, innovative entertainment…Whatever the domain of activity, the market is already asking for Miniaturised Smart Systems.

To optimise your innovation process, join the European network and meet with future key partners. Take the chance to access available resources and most of all to start interactions with the most suitable operational and fi nancial resources related to your needs.

COWIN Marketplace will be composed of 3 events which participation is free of charge:

• An information session on “Financing major milestones from R&D to market" will gather representatives from the European Commission, from the European Technology Platform EPoSS, from the investors community and from EURIPIDES in order to provide the audience with key elements on support initiatives all along the technology value chain.

14th June 2011 from 15:00 to 17:30, Room FENNIA I

• Personal contacts are essential for successful co-operations. COWIN is organising a matchmaking event consisting in individual meetings between technology providers, integrators and business partners in order to foster innovation and to discuss on concrete business opportunities. COWIN will give you the chance to optimise your meetings schedule according to your needs.

14th-16th June 2011, Room NORDIA

• A posters exhibition is the actual core of COWIN Marketplace. In this common Euripides-COWIN area, innovative research results from FP6-FP7 projects but also on-going projects under the EURIPIDES programme will be given the fl oor to present themselves and to raise interests among the audience for further partnerships. The poster presenters will be available for questions and discussions. Furthermore exhibitors will have the opportunity to bring demonstrators to emphasise the impact of the posters.

14th -16th June 2011, Room NORDIA

About the Smart System WeekThe Smart System Week will take place at the Scandic Marina Congress in Helsinki from 14th to 17th June 2011. The EURIPIDES Cluster, in close cooperation with VTT and TEKES, will present its 5th Annual Forum, highlight new trends in Technology and Business and gather the Smart System Community with dedicated events aiming at generating ideas for future businesses.

A series of workshops will take place on the 14th June:• The EPoSS Key Technologies Working Group will organise a practical workshop

to elaborate and prepare expression of interests (EOI) and project ideas.• The Eemeli Workshop, supported by TEKES and VTT, will focus on helping

SMEs to get access to Smart Systems Technologies as well as to network internationally and to learn to use European funding schemes in creating new competitive advantages.

• Easy access to Microsystems production through contract manufacturing services organised by VTT Memsfab. Purpose of the event is to promote increasing use of Microsystems, to bridge the gap from lab-to-fab and to offer an opportunity to meet foundries.

Technical visits will be organised on 17th June 2011:Two tours (tour 1: Nokia Research Center, Micronova or tour 2: VTI Technologies, Okmetic) will give an overview of Key Finnish research sites as well as industrial facilities.

Mrs. Géraldine Andrieux Gustin Mr. Nicolas GouzeCOWIN Coordinator COWIN Communicationc/o Yole Développement c/o VDI/VDE- Innovation + Technikandrieux@yole.fr nicolas.gouze@vdivde-it.deTel. : +33 6 75 800 829 Tel.: +49 30 310078-209

www.cowin4u.eu

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rAbout COWINCOWIN is a support action launched under the 7th framework Program for 3 years to strengthen the European competitiveness in miniaturized smart systems. This initiative is dedicated to the commercial exploitation of advanced technologies developed in the framework of European collaborative research projects. COWIN’s mission is to facilitate take-up of the advanced technologies worthy of investments, in order to capture innovation, win new markets and make a profi t.

meto

A Smart System Week in Helsinki forCreating Innovations and Business

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

C A L L F O R P A P E R S

MEMS – Entering a New Growth Cycle!The SEMICON Europe 2011 is the perfect platform for all players in the MEMS/MST industry. The show will be in Dresden/Germany from 11 – 13 October.

The development of the MEMS Market is hardly to be overlooked. With a 22 % growth in 2010, the MEMS and Sensor Market is back on track

again. According to reliable prognoses this trend will further extend until 2015.

The new growth stands on a solid basis and several reasons support that this may be a long-term development: • MEMS markets for consumer electronics and

mobile phones will grow at an accelerated rate over the next 4 years, in particular revenue for handsets and slate tablets.

• The soaring demand for MEMS sensors from BRIC countries (Brasil, Russia, India and China) in all sectors from cars to infrastructure e.g. for smart meters and optical telecom is driving demand.

• Sales of DLP chips (Digital Light Processing) were again up in 2010.

• Increasing use of sensors in addressing critical areas like energy and aging population.

Therefore, the relevance of the International MEMS/MST Industry Forum on the SEMICON Europa 2011 cannot be underestimated. The Forum takes focus on the key success factors of the new growth cycle:

• An area of new interesting applications promotes new technologies and provides line utilization;

• Successful management of distributed operations including foundries, with methodologies for steep learning curves, best system know-how and ever shorter time-to-revenue cycles;

• Effi cient high volume testing and quality assurance;• Innovative integration concepts for complex sensor

systems.

The MEMS applications will be the centre of attraction for many visitors: What will be their future usage in the automotive industry, biomedicine and l i fe science, consumer electronics, opt ical telecommunication and also in high-end areas like aeronautics and industrial manufacturing?

Additionally, the conference will cover all standard par ts which are important for the day-to-day industrial production. The current leverage of the standardization, testing methods and results as well as strategies for high added volume and emerging products will be in the focus during the show.

The range of the conference contains the know-how of technical processes and new materials for the MEMS in front-end, back-end and testing. This technical part deals with 3D and TSV (through silicon via) processes. Different Chip and WLP (wafer level package) technologies are also part of the program. Another session deals with the MEMS application markets, the chances and risks but also with forecasts and outlook.

For information on SEMICON Europa 2011, please visit www.semiconeuropa.org

or contact Carlos Lee, per email clee@semi.org or per telephone: +32 2 6095334

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

I N D U S T R Y O U T L O O K

“ Permanent Wafer Bonding will be a key enabling technology foradvanced semiconductor manufacturing” says Yole DéveloppementYole Développement announces the publication of its technology study and market research report, Permanent Wafer Bonders Applications & Market Report. Historically developed for MEMS & SOI substrates, the wafer bonding technology is today becoming a key processing technology for a wide range of applications: MEMS, CMOS Image Sensors, LEDs, Power Devices, RF and Advanced Packaging. The wafer bonding market is a very complex one crossing different wafer sizes (from 2’’ to 12’’), different applications and different bonding technologies.

Market overviewWafer bonding is usually defi ned as a process that temporarily or permanently joins two wafers or substrates using a suitable process. Historically developed for MEMS and then SOI wafers, wafer bonding technology has shifted to non-mainstream IC applications over the last years. Our report aims at analyzing the market perspectives and technical trends for permanent bonding.“MEMS have been the fi rst application where wafer bonders have been massively used (the wafer bonding step is mostly used to protect the MEMS sensitive element). And CMOS Image Sensors is also a very large market for wafer bonders”, explained Dr Er ic Mounier, Project Manager at Yole Développement.But besides MEMS and CIS, wafer bonder can be also used for LEDs or Power Devices. Indeed, in a typical LED active region, spontaneous emission scatters photons in all directions. If the substrate material has a smaller band gap than the active region, approximately half of the light is absorbed in the substrate; signif icantly reducing device

performance. So, one of the manufacturing solutions for photon loss involves bonding a wafer containing an array of devices to another wafer that provides both a refl ective surface for maximum light extraction and a heat sink for thermal management. And of course, over the 5 past years, much attention has been given to this technology for 3D integration of memories for example.

Technology challengesFor MEMS, there is today a shift from Glass Frit for eutectic/metal-based bonding mainly to increase real estate by smaller bond frames. Metal direct bonding also gives good hermeticity and mechanical stability for many MEMS applications. For example, Nasiri process is using eutectic bonding of the MEMS directly on the aluminum layer of the CMOS wafer. This leads to smaller package footprints & package heights. STMicroelectronics’ latest 3 -axis accelerometer also shows a dif ferent sealing technique compared to what is usually done: gold eutectic sealing allows a dramatic die size reduction.For CMOS Image sensors, the advent of the BSI

(Back Side Illumination) technology has raised a competition between Molecular Bonding and adhesive bonding. Here, cost and fi nal application will drive the technology fi nal choice.Yole Développement has estimated the wafer bonder to have big market growth for the next year. The growth will be driven small size wafer for LEDs and 12” wafer for 3D stacking and CIS.

Yole Développement’s report analyzes in details the technical & economical evolution of the permanent wafer bonding process. It gives, for example, 2010-2016 market forecasts for permanent bonding, number of equipment, an overview of the different bonding approaches and equipment players market shares.It describes the applications for wafer bonding with main characteristics, challenges and technical trends.

For more information about Yole Développement reports, please contact D. Jourdan (jourdan@yole.fr)

Wafer Bonding

Advanced substrates MEMS

LEDs

1st level packaging

Advanced Packaging

Stress isolation/device manufacturing

Accelerometers

Gyros

Pressure sensor

Microfluidics

Microphones

Microbolometers

Resonators RF MEMS

Optical MEMS

Thin films LEDs

CMOS Image

Sensors

Interposers

FO WLP

3D ICs

Microbumps

SOI

SOQ SGOI

GOI

Power

IGBTs

RF Devices

Encapsulation MMIC

Permanent Wafer Bonding Applications(Source: Yole Développement, May 2011)

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O N L I N E E V E N T

Register for a live webcast today:Revolution in consumer motion sensors

Join Yole Développement’s expert, Laurent Robin, on Tuesday, 31st of May at 5.30 pm CET to learn about motion sensors.Visit our website www.i-Micronews.com, webcast section, to register.

The inertial sensor market for consumer electronics is growing very quickly due the fast adoption of accelerometers, gyroscopes and magnetometers in mobile phones, tablets, game stations, laptops…. Indeed 20.3% annual

growth is expected: from $847M in 2009, the motion sensor market will reach $2.56B in 2015! The MEMS accelerometer market will show very nice business opportunities in the coming years. Moreover this market will be strategic because many applications are expected to rely on 3-axis accelerometer + 3-axis gyroscope in a single package within 2015. There is thus a strong synergy between accelerometer and gyroscope technologies and players…

Therefore Yole Developpement is pleased to organize a webcast on this topic. The webcast entitled “Revolution in Consumer Motion Sensors” will be presented by Laurent Robin, Market & Technology Analyst, on Tuesday, 31st of May at 5.30 pm CET. Register NOW on I-Micronews.com, webcast section.

For more information about the webcast, please contact David Jourdan (jourdan@yole.fr)

Speaker: Laurent Robin is in charge of the MEMS & Sensors market research at Yole Developpement. He previously worked at image sensor company e2v Technologies (Grenoble, France) and at EM Microelectronics (Switzerland). He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse. He was also granted a Master Degree in Technology & Innovation Management from EM Lyon Business School, France.

Mobile phone & consumer

electronics are driving the growth of the MEMS business...

Evolutions in the microphone and motion sensor market

June 7, at Transducers 2011 At 6.30 PM

6.30 PM - MEMS market forecasts : where is the MEMS industry heading?

Jean-Christophe Eloy, President & CEO, Yole Développement

7.00 PM - MEMS microphone market: evolution of business models and supply chain

Wenbin Ding, MEMS Market & Technology Analyst, Yole Développement

7.30 PM - Revolution in consumer motion sensorsJean-Christophe Eloy,

President & CEO, Yole Développement

8.00 PM - Networking cocktail

MEMS MARKET BRIEFING AT TRANSDUCERS 2011

FREE ENTRANCE

Y O L E D É V E L O P P E M E N T

For more information, please contact Sandrine Leroy (leroy@yole.fr)

© 2011 • 6 Copyrights © Yole Développement SA. All rights reserved.

22009-2015 Market Overview Overview

• The market for motion sensors is growing to

more than $2.5B in 2015, corresponding to

4.5B sensor packages

– One sensor package can contain several sensors

(combo sensors) market is actually 5.18B sensing

functions in 2015

– 15.7% 2009-2015 CAGR in value, 24.4% in volume

• Mobile phone and gaming are the biggest CE

markets for motion sensors and combo

sensors

• Remote control application will emerge

slowly, with gaming functions as a key feature

• Very high potential in the sports area, but it

will take time to emerge, and it is a collection

of plenty of niche applications

© 2011 • 11 Copyrights © Yole Développement SA. All rights reserved.

MMEMS Gyroscopes for Mobile Phones What’s next for gyropscopes after iPhone 4?

• Now that appropriate Android drivers seem available, we start to see that the major

handset makers release few models with gyroscopes

• Samsung Galaxy S Pro: first Android phone with a gyroscope?

– Rumors said that this phone integrates a gyroscope. But it has not been confirmed

– Also features an accelerometer, AGPS, compass

– Named Epic 4G in USA, released by Sprint

• Released beginning 2011, the Google Nexus S integrates a gyro

– This confirms the adoption of gyroscopes in high-end smartphones

• LG Optimus Black: first handset design win for InvenSense!

– This smartphone will integrate InvenSense’s ITG-3200 3 axis MEMS gyroscope for

nice user interface functions

– This design-win from InvenSense on an Android phone shows that ST can expect

strong competition

• Other mobile phone makers:

– HTC has revealed that they will release a gyroscope-equipped smartphone in mid

2010

– June 2010: the director of Motorola mobile division has announced that they are

willing to release a smartphone with a gyro by the end of 2010. But such a product

has not been seen on the market yet.

– Sony Ericsson

–

Samsung Galaxy

S Pro

Google Nexus S

(manufactured by

Samsung)

LG Optimus

Black

FREE OF CHARGE WEBCAST

Organized by Hosted by

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It’s not who you know today.It’s who you’re going to need to know tomorrow.The world of inertial devices is in a rapid state of change. Value is shifting. Players are changing. The entire industry of motion is in motion. While we all know the current players, our growth depends on meeting and engaging the emerging innovators.

The world leader in MEMS technology information, Yole Développement, is har-nessing the power and effi ciency of an exciting new networking and collaboration event. Not another tradeshow or conference, the MEMS in Motion Collaboration Summit promises the freedom to meet, learn, talk, and ultimately collaborate in a time-effi cient and casual environment. The Yole team will bring together industry leaders for this fi rst-of-a-kind, two-day event in Palm Springs. Qualifi ed attendees will enjoy exclusive Yole plenary sessions; small, facilitated roundtable discussions; and hours of small group and one-on-one discussion activities. If your business depends on—or will depend on—inertial devices, the MEMS in Motion Collaboration Summit is perfect for you.

Shape the future of inertial devices at the MEMS in Motion Collaboration Summit

OCTOBER 12-13, 2011Palm Springs, CA USAInformation@MEMSinMotion.comwww.MEMSinMotion.com

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M E M S

Microvision establishes fi rst global R&D center in Singapore

DelfMEMS successfully delivered custom RF MEMS samples to NTT DOCOMO

Lemoptix MEMS micromirrors replace galvanometer and rotating mirrors

Okmetic increases SOI wafer production capacity in Vantaa and specifi es long-term fi nancial objectives

DelfMEMS has provided arrays of custom MEMS ohmic switches to enable tunability into Radio-Frequency front-end modules -FEM- for mobile applications.

Optical MEMS scanning micromirrors much smaller, much faster, much more robust and much less power consuming than conventional optical scanning systems.

Okmetic's board of directors has approved plans to increase the group's silicon-on-insulator (SOI) wafer production capacity by extending the Vantaa plant.

By collaborating with NTU, MicroVision aims to leverage the university's strength and expertise in Engineering, Microelectronics

and Materials Science to conduct joint research and development with faculty and students.MicroVision's dedicated R&D center includes a

customized laboratory at NTU's Innovation Centre. The company will work directly with NTU's School of Electrical and Electronic Engineering and the Division of Physics and Applied Physics.NTU has established strong industry partners including Rolls-Royce, Robert Bosch, Thales, and

Toray. Like MicroVision, these leading companies chose to set up research facilities at NTU, where they collaboratively work with NTU faculty and students to pursue their respective research interests.

www.microvision.com

Voltage, size, losses, isolation, ultra-fast switching time and power handling will be evaluated by the innovative telecom operator

according to the requested specifications until 6 GHz.DelfMEMS is setting-up an open technology platform

to propose a new integrated micro-mechanical building block that is based on a strong, totally new IP portfolio that solves past issues of RF MEMS ohmic switches. MEMS switch is considered as the optimum RF switching technology that drastically decreases

power consumption and bill of material by minimizing losses between the antenna and active devices of a FEM.

www.delfmems.com

Lemoptix silicon-based, magnetically actuated MEMS micromirror technologies are best in class replacement solutions to traditional

galvanometer and rotating mirrors, bringing outstanding performance and space reduction.Responding to industry requests to significantly reduce size, power consumption and increased performance of micromirror devices, Lemoptix has developed a bottom-up approach by using semi-conductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.

Lemoptix LSCAN laser scanning micromirrors are integrated by OEM customers into a number of immediately available applications like optical spectrometers, laser range finders and microscopes, enhancing performances and enabl ing the development of smaller, higher resolution and lower cost products. Lemoptix’ resonant and static scanning micromirrors are designed to rotate and deflect light and can be used in a myriad of optical applications due to the unique combination of performance and size.

www.optoiq.com

The around 30 million euro investment includes the plant extension and different kinds of production equipment. This investment,

together with the on-going SOI equipment investments, more than triples the Vantaa plant's current SOI wafer production capacity. Along with the growing production amounts, new equipment and process development, improved productivity is being aimed at. At the same time, improvement of SOI wafers' performance continues in order to ensure customers' competitiveness.The investment will be carried out mainly in 2011-2013. The building of the Vantaa plant extension will

start in autumn 2011. The surface area of the extension is 2,420 m2, approximately a quarter of which is for clean room facilities. The extension is due to be complete in the end of 2012, after which it will be taken into production use in stages, following the growth of the market demand.

The aim is that the investment will be covered mainly with cash flow from operations, and no need for significant loan financing is foreseeable.SOI wafers are used for demanding MEMS sensors and HV applications whose markets have increased year by year. It is estimated that the markets continue

to grow as automotive electronics, consumer electronics as well as industrial process control increase. Sensor applications increase especially in consumer products such as smart phones, cameras, game consoles and in other portable devices.

This newly made investment decision supports Okmetic's long-term strategy and growth objectives, strengthens company's market leadership as the supplier of demanding sensor wafers and enables increase of market share in SOI wafers.

www.reuters.com

LSCAN-F series (Resonant) (Courtesy of Lemoptix)

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M E M S

New MEMS microphones from STMicroelectronics enhance audio experience in mobile phones and portable computersSTMicroelectronics introduced two new digital MEMS microphones.

Combining superior sound quality with robustness and reliability at reduced size and cost, ST’s MP34DB01 and MP45DT02 microphones enable enhanced audio experience in mobile phones and portable computers, as

well as in many other existing and emerging applications with a voice input.ST’s MEMS microphones use best-in-class acoustic sensor technology jointly developed with OMRON that is inherently less susceptible to mechanical vibration, temperature variations and electromagnetic interference, while providing high-fidelity reproduction of audio signals. Integrating ST’s electronic control circuit and OMRON’s micro-machined sensor in a single package, the microphones deliver superb audio performance at lower power consumption than traditional condenser (ECM) microphones. This optimized power consumption ensures longer battery life in portable devices for an extended user experience. In addition to the size, robustness and energy economy advantages over ECM microphones, MEMS microphones enable dramatic advancements in sound quality, realized by incorporating multiple microphones in one device. Such microphone arrays, facilitated by the small form factor, superior sensitivity matching and frequency response of ST’s microphones, enable the implementation of active noise and echo cancelling, as well as beam-forming, a sound-processing technology that helps isolate a sound and its location. These features are valuable with the increasing use of cell phones and other devices in noisy and uncontrollable environments. Another important factor in multiple-microphone applications is the high temperature stability of MEMS microphones after reflow that ensures ample flexibility in placing the auxiliary microphones, including in locations with higher temperature excursions. ST’s MP34DB01 microphone is the only device in the market with real high-fidelity audio bandwidth, delivering flat frequency response in the full audio band of 20–20,000 Hz, coupled with an unparalleled signal-to-noise ratio (62 dB) and power-supply noise rejection (70 dB).Housed inside an ultra-small 3x4x1 mm package, the microphone has been specifically designed for mobile phones, with the acoustic port hole placed on the bottom of the package. This layout enables phone manufacturers to mount the microphone on the backside of the cell-phone printed circuit board for slimmer designs and still obtain a short acoustic path from the environment to the microphone. The MP34DB01 has already been qualified by top-tier cell-phone makers and is now in mass production. The other addition to ST’s MEMS microphone family, the MP45DT02, is a top-port 3.76 x 4.72 x 1.25mm device that ideally suits the size and sound-inlet position requirements of laptops and tablets. The microphone provides an excellent signal-to-noise ratio (58 dB) and superior frequency response to alternatives for that market.

www.st.com/mems

MP34DB01 and MP45DT02 microphones (Courtesy of STMicroelectronics)

October 2 to 5, 2011

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M E M S

Key Enabling Technology for

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ULIS introduces Pico640™, a new VGA 17-micron uncooled infrared imaging sensor with enhanced factor of merit

Dutch company SolMateS enables next generations MEMS products

Factor of merit, a relative measure of thermal sensor sensi-tivity against response rate, will allow camera makers to see how well Pico640E’s optimum performance compares to other uncooled IR imaging sensors on the market.

SolMateS receives a three million dollar investment for the fi nal development phase of their piezoelectric deposition machine.

ULIS announced that it will launch Pico640E™, a new VGA 640 x 480 17-micron IR imaging sensor that offers new advantages in size, performance and factor of merit. It responds to needs from camera

manufacturers and other imaging-system designers for large format, small-form factor, uncooled IR sensors that optimize the trade-off between performance and sensor response speed. Pico640E is a high-resolution (more than 300,000 pixels) IR imaging sensor that comes in a small footprint (24.13 x 24.13 x 5.57mm). In tests, it has demonstrated a high response speed with a thermal time constant of 8.8 ms and a thermal resolution less than 45 mK. This translates into a uniform pixel factor of merit (400 mK.ms), meaning Pico640E compares very favorably with other IR products in its category. The versatility of its high-quality, compact design means that it can perform long-range detection up to approximately 2km, depending on the target, as well as detect fast-moving objects. These performance advantages make Pico640E well adapted for military applications, as well as thermography, predictive maintenance and 24/7 camera surveillance.The performance Pico640E achieves is also a plus for image-fusion applications, which use both visible and IR images. Visible sensors have a much faster response rate than IR sensors, so there is often a time lag between visible and IR images when the camera is panning. Due to Pico640E’s fast response rate, it minimizes the delay between visible and IR images when they are superimposed, thereby improving overall image quality.

www.ulis-ir.com

On the 27th of April 2011, SolMateS received a substantial investment from private equity funds Twente Technology Fund and Participatiemaatschappij Oost Nederland. SolMateS will use the investment to accelerate product

development and international expansion for its unique production system. Piezoelectric layers are to be used in all kinds of miniature systems were precise actuation is needed, for instance in small motors, RF MEMS components or micro pumps. Currently those layers are deposi ted by notoriously unreliable and costly wet processing. Price and quality are not meeting the high volume electronic industry’s standards. SolMateS technology is developed at the University of Twente, and is the most advanced manufacturing solution currently available to deposit piezoelectric thin films. It marks a whole new era of MEMS and will be used to create essential components for the next-generation mobile electronics, thin film actuators and medical devices. SolMateS introduces the PiezoFlare 1200. The PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition. It offers high-yield piezo performance and flexibility for customized PZT compositions. The technology enables for the first time high volume reliable production capability for PZT thin film deposition.

www.solmates.nl

Wafer deposited with Piezo material and top electrodes (Courtesy of SolMateS)

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

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M I C R O F L U I D I C S

Multiple emulsion droplet design by Sichuan University

University of Illinois has developed a low-cost sensor for bacterial infections

A*STAR microfl uidic chip for quick on-site diagnosis of infectious diseases

Scientists in China have developed a device that can control the production of multiple emulsion systems.

Bacterial infections really stink. And that could be the key to a fast diagnosis.

The control of infectious diseases such as the 2009 H1N1 pandemic influenza hinges on handy analytical tools that can rapidly and accurately identify infected patients at the doctor's office or at an airport.

This system could be used to encapsulate incompatible drug ingredients and to design multi-compartment materials, they say.

Liang-Yin Chu at Sichuan University and colleagues have designed a microfluidic device capable of producing multi-compartment multiple emulsions. The team tested their system using different coloured oil droplets in water. The device - a droplet maker, connector and liquid extractor - can be arranged in different combinations to generate different emulsions.

As the oil droplets move through the system, they merge in the main channel to form the multi-component emulsions.

The team now intends to explore the full potential of their device and promote its application in different areas.

esraa-chemist.blogspot.com

Researchers have demonstrated a quick, simple method to identify infectious bacteria by smell using a low-cost array of printed

pigments as a chemical sensor. Led by University of Illinois chemistry professor Ken Suslick, the team published its results in the Journal of the American Chemical Society.While there has been some interest in using sophisticated spectroscopy or genetic methods for clinical diagnosis, Suslick's group focused on another distinctive characteristic: smell. Many experienced microbiologists can identify bacteria based on their aroma. Bacteria emit a complex mixture of chemicals as by-products of their metabolism. Each species of bacteria produces its own unique blend of gases, and even differing strains of the same species will have an aromatic "fingerprint."Suslick previously developed an artificial "nose" that can detect and identify poisonous gases, toxins and explosives in the air.

The artificial nose is an array of 36 cross-reactive pigment dots that change color when they sense chemicals in the air. The researchers spread blood samples on Petri dishes of a standard growth gel, attached an array to the inside of the lid of each dish, then inverted the dishes onto an ordinary flatbed scanner. Every 30 minutes, they scanned the arrays and recorded the color changes in each dot. The pattern of color change over time is unique to each bacterium.

In only a few hours, the array not only confirms the presence of bacteria, but identifies a specific species and strain. It even can recognize antibiotic resistance – a key factor in treatment decisions.

In the paper, the researchers showed that they could identify 10 of the most common disease-causing bacteria, including the hard-to-kill hospital infection methicillin-resistant Staphylococcus aureus (MRSA),

with 98.8 percent accuracy. However, Suslick believes the array could be used to diagnose a much wider variety of infections.

Given their broad sensitivity, the chemical-sensing arrays also could enable breath diagnosis for a number of conditions. Medical researchers at other institutions have already performed studies using Suslick's arrays to diagnose sinus infections and to screen for lung cancer.

Next, the team is working on integrating the arrays with vials of liquid growth medium, which is a faster culturing agent and more common in clinical practice than Petri dishes. They have also improved the pigments to be more stable, more sensitive and easier to print.

news.illinois.edu

Linus Tzu-Hsiang Kao and co-workers at the A*STAR Institute of Microelectronics and the Genome Institute of Singapore have now

developed a silicon-based microfluidic system that is able to sense and differentiate the H1N1 virus from other seasonal influenza strains in ultrasmall specimens. The detection and characterization of viral strains is now routinely performed using an assay method called real-time reverse transcription polymerase chain reaction (RT-PCR). Kao's team, however, was able to integrate the PCR function into a compact two-module microfluidic chip using standard semiconductor technology. Because untreated influenza samples usually contain minute amounts of viral RNA mixed with other nucleic acids and proteins, the researchers designed an 'on-chip' PCR module that amplifies target sequences for both H1N1 and seasonal viruses at the same time.

The key to their compact screening technology, however, is the silicon-nanowire sensing module used for virus identification. The nanowires in the module are modified with nucleic acid-containing polymers that specifically bind the target DNA, which results in a change in electrical resistance in proportion to the concentration of target DNA present in the sample. The team fabricated the PCR module, which includes a reaction chamber connected to small aluminum heaters and temperature sensors through tiny channels, directly into a silicon chip using an etching technique. They then constructed the silicon nanowires by optical l ithography and finally immobilized the nucleic acid-containing polymers. Experiments revealed that the small size of the PCR chamber gave it a uniform temperature distribution (see image), providing an ideal environment for efficient RNA amplification. The PCR module also responded much faster to heating/cooling cycles than

standard instruments because of the small sample volume—leading to quicker diagnoses. The team is currently planning to improve the sample extraction module.

www.a-star.edu.sg

Optical micrographs of monodisperse sextuple(Courtesy of Sichuan University)

Photograph of the PCR microfluidic chip (Courtesy of A*STAR).

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Cree announces it has entered into a silicon carbide (SiC) materials license agreement with Nippon Steel Corporation.

Under the terms of the agreement, Nippon Steel Corporation, and affiliates including Nippon Steel Materials Co., Ltd., have been given the

right to manufacture and sell silicon carbide materials for electronic device applications. Over the lifetime of the agreement, Cree will receive certain financial considerations from Nippon Steel. As part of this agreement, Cree was also granted rights to Nippon Steel’s relevant SiC-related patents. Other terms of the agreement were not disclosed. No technology transfer between the parties was included.SiC is a high-performance semiconductor material used in the production of a broad range of lighting, power and communication components, including light-emitting diodes (LEDs), power switching devices and RF power transistors for wireless communications.SiC devices are used today for solar inverters, high-voltage power supplies and power conditioning in many industrial power applications.“Cree is a pioneer in SiC materials technologies, resulting in energy-efficient power switching devices and high brightness LEDs,” said Steve Kelley, Cree chief operating officer. “We are pleased that Nippon Steel joins us in supporting the electronics device industry with licensed SiC materials.”“Nippon Steel has been conducting intensive R&D on SiC materials over twenty years,” said Dr. Misao Hashimoto, Nippon Steel, fellow and director of the Advanced Technology Research Laboratory. “The good working relationship between Cree and Nippon

Steel enabled us to achieve our commitment for growing the global SiC market.”Cree is a market-leading innovator of semiconductor solutions for wireless and power applications, lighting-class LEDs, and LED lighting solutions.

Cree has more than 1,800 patents issued worldwide and more than 2,600 pending patent applications that address LED chip, component and lighting technology, as well as SiC materials, and RF and Power electronics.

Cree’s product families include power-switching devices and radio-frequency/wireless devices, blue and green LED chips, high-brightness LEDs, lighting-class power LEDs, and LED fixtures and bulbs. Cree solutions are driving improvements in applications such as var iab le-speed motors , w i re less communications, general illumination, backlighting and electronic signs and signals.

www.cree.com

A global SiC materials license agreement between Cree and Nippon Steel

Taiwan Semiconductor Manufacturing (TSMC`s) board of directors approved, at a provisional meeting, a proposal to reorganize two green-energy business units into wholly-owned subsidiaries.

The board determined initial paid-in capital for its solar-energy business unit, christened TSMC Solar Ltd., at NT$12.5 billion (US$416 million

at US$1:NT$30) and the capital for its LED (light emitting diode) business unit, named TSMC Solid State Lighting Ltd., at NT$2.8 billion (US$93 million).The company has set baseline date for the splits on August 1 this year. It said the main thrust of spinning off the two business units into subsidiaries is to motivate entrepreneurship and facilitate business specialization in order to boost overall competitiveness and operational efficiency.

TSMC stressed that the splits will not affect its shareholders’ interests as its ownership capital in the two subsidiaries is equivalent to their operating value, suggesting the company does not overvalue the two subsidiaries.

In recent years, TSMC has seen some results from its investments in green-energy industries; the company has bought into solar-cell maker Motech Industries Inc., entered into partnership with German solar module maker, CENTROSOLAR, on polycrystalline silicon business, and begun constructing a CIGS-

based (copper indium gallium selenide-based) solar-cell factory.In the LED field, TSMC has begun pilot production in a wafer factory in the Hsinchu Science Park running around eight to 12 MOCVD (metal organic chemical vapor deposition) chambers. The TSMC-held VisEra Technologies Co., Ltd. has begun offering packaging and test service to its LED wafer factory. TSMC will make its LED light sources and light engines available on the market with its brand names.

news.cens.com

TSMC spins off two green energy business units

GT Solar International, a provider of sapphire crystalline growth systems and materials for the solar, LED and other specialty markets,

reports that that it has received an order for its sapphire crystallization furnaces totaling $218.9 million from

Guizhou Haotian Optoelectronics Technology Co. LTD (HTOT).The order will be placed in HTOT's new sapphire production facility to supply manufacturers with sapphire wafers for LED chip production. GT Solar

says that the order marks HTOT's entrance into the LED industry.

www.sslighting.net

GT Solar gets order for sapphire growth systems from new entrant into LED-related material market

C O M P O U N D S E M I C O N D U C T O R S

(Courtesy of Cree and Nippon Steel Corporation)

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The silicon photonics market is expected to reach a value of the $2.02 billion by 2015, refl ecting a fi ve-year compound annual growth rate of 78.2 percent, according to the report Global Silicon Photonics Market (2010-2015), published by MarketsandMarkets.

New managing director at 3S Photonics French subsidiary 3S Photonics Group announced the nomination of Jean-Michel Bonard as its managing director in France, as well as the creation of three new transversal positions within the group’s board.

Universal Display announced the release of a novel single-layer encapsulation technology for plastic substrate systems and thin-fi lm devices, including rigid and fl exible OLED displays and lighting panels.

A new industry and university cooperative research center proposes to provide a one-stop shop for the design, fabrication and testing of a wide range of metamaterials designed to aid solar photovoltaic systems, specialized light sensors and more.

P H O T O N I C S

Highlights of the market report include the following: • Silicon photonics technology is gaining

ground as a low-cost alternative for addressing the speed and bulk data transfer challenges faced by microelectronics. The market is in its infancy and is expected to be commercialized by 2016.• In 2010, the wavelength division multiplex filters contributed $35,212 to the global silicon photonics

market, mainly because of early commercialization and extensive usage in optical switches and transceiver devices. • The silicon photonics LED market is expected to experience the relatively high compound annual growth rate of 87.6 percent from 2010 to 2015 because of an increasing need for an efficient light sou rce i n sma l l -d i s tance commun ica t i on networks.

• At present, North America dominates the silicon photonics market, having generated $59,667 in 2010. The worth of the market in the region is projected to reach $849,587 in 2015 with a compound annual growth rate from 2010 to 2015 of 70.1 percent.• Major players in the global silicon photonics market include Kotura, Lightwire, Luxtera and Chiral Photonics, all US companies.

www.marketsandmarkets.com

Bonard joined the company in 2009 as deputy general manager in charge of company operations. In addition, he was responsible for

the finance department. Prior to joining the group, he worked at Katun Corp. and GE Capital Finance, and he created JMB Conseils, a financial consulting firm for telecom and IT companies.To strengthen the collaboration between its entities, the company has created three transversal and

strategic positions within its board: Jean-Pierre Hirtz, business development director; Geoffroy Morel, chief financial officer; and Fotis Konstantinidis, vice president of sales. The announcement follows the company’s February 2010 acquisition of Avensys Inc., based in Canada. To reinforce its international position, 3S Photonics has also launched a policy for diversification, geographical expansion and strategic partnerships.

3S Photonics designs, develops and markets optical components and modules, and modules based on optical fiber. Through its subsidiary Avensys Solutions, it provides environmental and industrial process surveillance.

www.3sphotonics.com

Developed in collaboration with research partner Princeton University, the single-layer hybrid organic-inorganic layer approach was

demonstrated successfully as an encapsulant for flexible and rigid OLED devices. Its encapsulation layer provides a permeation barrier to protect thin-film devices from environmental conditions such as

moisture and oxygen, a quality that is critical for the long-term performance of OLED display and lighting products. The encapsulation technology was supported in part by National Science Foundation, US Department of Defense and US Department of Energy SBIR contracts. To demonstrate the technology’s

effectiveness for flexible OLED display prototype, the company has worked with the US Army Research Laboratory and the Flexible Display Center at Arizona State University.

www.universaldisplay.com

Researchers at the Nat ional Science Foundation-sponsored center will focus on fundamental research concepts that are

limiting the application and implementation of metamaterials to commercial products. For example, by controlling the composition of a material, it may be possible to produce superlenses with near-perfect resolution.The center's research thrusts will encompass fundamental metamaterials research, including the fo l lowing: mater ia ls for rapid prototyping, metamaterials building blocks, all-dielectric resonator

metamaterials, development of modeling and design algorithms, process development of composite materials, aperture and cavity arrays, tools for characterization of metamaterials, next-generation metallic resonator metamaterials, and high-, zero-, and negative-refractive-index materials. Industry and university cooperative research centers conduct fundamental research. The companies that participate in the center direct the research and receive royalty-free, nonexclusive licenses to the intellectual property the center produces. Placing thin metamaterial films over silicon panels

would allow solar light to pass through to silicon surfaces unblocked. The same film would capture the electricity produced by those surfaces, possibly raising the efficiency of terrestrial solar cells from 17 to 21 percent, he said. Because the film would spread light laterally across the cell, thinner silicon wafers could be used, which would reduce costs. The sensor projects, being conducted with NASA and DARPA, aim to produce lightweight polar image metric sensors capable of measuring light's intensity, color and polarization or orientation.

www.ccny.cuny.edu

Strong growth projected for silicon photonics market according to new market survey

New managing director at 3S Photonics French subsidiary

Universal Display unveils novel encapsulation technology

The City College of New York set up a new metamaterials center

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This factory will impress by covering the entire solar value chain, ranging from ingot production and solar cell manufacturing through to solar

module end-products, although it will not include the production of silicon as a raw material. The high degree of integration in the production of solar wafers, cells and modules allows low production costs to be achieved, thereby resulting in high-quality modules at competitive prices. The order volume for the consortium consisting of centrotherm photovoltaics and Kinetics weighs in at around EUR 290 million, with the largest proportion of this amount being attributable to centrotherm photovoltaics. In line with centrotherm photovoltaics' company policy, the order will only be reported in the

order book if certain internal criteria are satisfied, such as a pre-payment. As part of this turnkey project, centrotherm photovoltaics will deliver all of the photovoltaic systems on a turnkey basis, ranging from multi-crystalline ingot furnaces and ingot manufacturing through to module production, and it will provide support to Sonelgaz all the way through to system commissioning. Kinetics will be responsible for engineering services, construction management, the turnkey production of the building, and the technical fittings for the building.The first high-performance modules should be produced by 2014 at the plant, which is to be constructed at Rouiba, 30 km east of the capital Algiers. These modules are primarily intended to supply the

domestic market. The largest solar module factory in the African continent's second largest country will deliver an annual production capacity of around 116 MWp and is to be constructed on a land area of around 43,000 m² – which corresponds to the size of approximately six football fields. With more than 3,000 hours of sunshine per year, Algeria is one of the countries with the highest solar radiation levels in the world. According to information provided by Algerian sources, around 6 to 8 percent of electricity demand in Algeria is to be covered from renewable energy by 2020, and even as much as up to 35 percent by 2040.

www.centrotherm-pv.com

Total Group will launch a friendly tender offer through a wholly owned subsidiary for up to 60 percent of SunPower's outstanding Class A

Common shares and 60 percent of SunPower's outstanding Class B Common shares at a price of $23.25/share for each class. The offer price represents

a 46 percent premium over the April 27, 2011 closing price of SunPower's Class A common stock and a 49 percent premium over the April 27, 2011closing price of SunPower's Class B common stock, and values SunPower's equity at $2.3 billion. In addition, Total will provide SunPower with up to $1 billion of credit support

over the next five years. Following closing of the transaction, which has been approved by the boards of both companies, SunPower will continue to operate with its current management team.

us.sunpowercorp.com

GT Solar announced that it has received a $93.9 million order from Taiwan-based polysilicon producer Powertec Energy Corporation for a

complete suite of polysilicon production equipment and technology including SDR™ 400 reactors, hydrochlorination, filament and product processing

equipment.The equipment will be installed in Powertec’s new polysilicon facility which is expected to begin production in 2012. The order will be included in GT Solar’s backlog for its current Q1 FY12, which ends on July 2, 2011. The SDR 400 CVD reactor has proven capability of producing over 400 metric tons

annually (MTA) of polysilicon and continues GT Solar’s leadership position for developing the most energy efficient reactors in the industry.

www.gtsolar.com

Apeak efficiency rate of up to 19.2 percent has been reached for the first time in standard volume production by combining Sunrise’s

unique processing know-how and the selective emitter technology from Schmid, one of its technology partners.Sunrise Global Solar Energy (Sunrise) has achieved a conventionally processed cell conversion efficiency of 19.2 percent for the first time in industrial mass production. Sunrise achieved this result through its cooperation with Schmid GmbH + Co (Schmid). The measurements were confirmed by the University of Konstanz and the Fraunhofer Institute for Solar Energy

Systems, verifying the claims of the two companies.Alongside the selective emitter technology from Schmid and advanced processing steps optimized by Sunrise, the cell efficiency record was otherwise achieved in a standard single-sided screen-printed solar cell structure – thereby setting a new global standard for conventional solar cells. The production runs of record solar cells which achieve a peak rate of 19.2 percent are based on industrial grade 6” mono-crystalline wafer material (Czochralski drawing) with conventional screen printed aluminum backside.The increased rate of efficiency reached by Sunrise was made possible by the use of the selective emitter

technology developed internally by the Schmid Group and combined with the highly optimized fabrication steps by the Sunrise team, which has a track record of pushing the boundaries of solar cell efficiencies.

www.schmid-group.com

centrotherm photovoltaics & Kinetics Germany consortium signs major order to construct fully integrated factory in Algeria

SunPower and Total Partner to create a new global leader in the solar industry

GT Solar receives $93.9 million order for polysilicon production equipment and technology Powertec Energy Corporation

New world record for mass produced conventional silicon solar cell - 19.2 percent effi ciency

The consortium signed an agreement with state utility Société Nationale de l'Electricité et du Gaz (Sonelgaz) to construct an almost fully integrated solar module factory in Algeria.

SunPower and Total announced that the two companies have entered into a broad strategic relationship to shape the future of the solar industry.

Sunrise Global Solar Energy has set a new world effi ciency record for mass produced conventional solar cells.

P H O T O V O L T A I C

Digital printing of etch masks on solar cells.

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SPEAKERSMadison M. Daily, Jr.,Technology Directorfor MEMS, Sensors, and Displays,Brewer Science

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

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A D V A N C E D P A C K A G I N G

STATS ChipPAC expands 300mm Through Silicon Via capabilities

STATS ChipPAC has complete front to back-end manufacturing capabilities for 200mm wafers and currently handles both chip-to-chip and chip-to-wafer assembly for TSV technology. This includes high density microbump

capabilities in both solder and copper column materials, microbump bonding down to 40um pitch, thin wafer handling, wafer level underfill, thin wafer dicing and microbumps for flip chip interconnection. Microbump technology is critical to delivering fine pitch, low profile solutions for high performance devices.The latest TSV investment that STATS ChipPAC has made is the addition of a 300mm “mid-end” process flow that occurs between the wafer fabrication and back-end assembly process. Mid-end processes support the advanced manufacturing requirements of 2.5D and 3D TSV as well as wafer level packaging, flip chip and embedded die technology.

www.statschippac.com

From page 1

2.5D silicon interposer "PoP module" demonstrator from STATS ChipPAC

Recent Through-Silicon-Via and micro-bumping realisations from STATS ChipPAC:

While Leti's new state-of-the-art facility is focused on R&D and prototyping, EVG's equipment will be leveraged with an eye toward widespread adoption of 3D technology for high-volume applications. Specifically, EVG's

equipment will be used in 3D technology demonstrations for Leti's global customer base, as well as low-volume pilot production on 300-mm wafers with the end goal of transferring the processes to their industrial partners' high-volume manufacturing environments. The EVG systems to be deployed on CEA-Leti's new 300-mm 3D line include an IQ Aligner production mask alignment system, a SmartView NT highest precision bond alignment system, an EVG560 production wafer bonding system and an EVG850 production bonding system for direct wafer bonding. These lithography and packaging systems were specifi cally chosen for the advantages they deliver in 3D-integration processing. Moreover, CEA-Leti will be able to tap EVG's extensive process know-how in 3D integration and through-silicon via (TSV) manufacturing, as the institute's 3D offerings include TSVs along with advanced capabilities in alignment, bonding, thinning and interconnects.EVG works not only with research consortia and institutions such as CEA-Leti, but also with global consortia, including EMC-3D, SEMI, NILCOM, NIL Austria, and Mancef.

www.EVGroup.com

CEA-Leti to implement multiple EV Group systems on its new 300-mm fab line dedicated to 3D integrationEV Group (EVG) announced that its longtime customer and partner, CEA-Leti, has installed multiple EVG tools in its industry-fi rst 300-mm cleanroom dedicated to R&D and prototyping for 3D-integration applications.

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A D V A N C E D P A C K A G I N G

SEMATECH announced that these companies have joined SEMATECH’s 3D Enablement program based at the College of Nanoscale

Science and Engineering (CNSE) of the University at Albany. These leading semiconductor companies will join CNSE, GlobalFoundries, Hewlett Packard, Hynix, IBM, Intel, Samsung, and UMC to extend the program’s position as a broad, cohesive initiative and to enable industry-wide ecosystem readiness for cost ef fective TSV-based 3D stacked IC solutions.

As members, these program participants will work with SEMATECH researchers to contribute to the overall vision of the Enablement Center, which includes identif ication of critical needs for 3D technologies, and the development of path fi nding capabilities, EDA tools, and appropriate test vehicles.In December 2010, SEMATECH, along with the Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC), launched a new 3D Enablement program to drive industry standardization ef for ts and technical

specifi cations for heterogeneous 3D integration. As a fi rst-of-its-kind effort, the 3D Enablement program aims to establish the infrastructure necessary for the entire industry to leverage 3D packaging technology for innovative new applications. The primary focus is on developing technologies and specif ications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer, and die handling.

www.sematech.org

Major semiconductor companies join SEMATECH’s 3D enablement center to accelerate adoption of 3D TSV technologies

ASE steps up investment in China

Advanced Semiconductor Engineering (ASE), Altera Corporation, Analog Devices, LSI Corporation, ON Semiconductor, and Qualcomm collaborate to develop standards and technical specifi cations for 3D ICs.

Advanced Semiconductor Engineering (ASE) has revealed plans to invest a total of US$1.2 billion on manufacturing facilities in Shanghai, China.

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ASE will build a 180,000-square-meter plant as part of an effort to expand its operations in China, the company said. Located in Jinqiao,

Pudong New Area, the new facility will target higher-end wirebonding and packaging services with volume production slated for the second half of 2011.ASE also unveiled plans to set up its regional

headquarters and R&D center in Zhangjiang, Shanghai. Construction of the 116,000-square-meter factory building will be divided into three phases, ASE said, adding that operations are scheduled to commence in 2012. In November 2010, ASE announced investment worth US$60 million to expand capacity at its subsidiary ASE (Weihai) in

Shandong Province, China. Earlier in the year, the company said it would spend a total of US$124 million on operation expansion in China, including construction of a new plant in the Pudong industrial district of Shanghai and additional production lines at its Kunshan, Jiangsu Province facility.

www.digitimes.com

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A leading nanotechnology scientist has raised questions over a billion dollar industry by boldly claiming that there is a limit to how small nanotechnology materials can be mass produced.

Archimedes Polymer Technologies and Brunel University, London have secured Technology Strategy Board Funding (TSB) to develop a new continuous flow process for separating and sorting commercially available carbon nanotubes and carbon nanomaterials.

Polymeric composites consist of two or more materials and are used for example to shield off electrostatics in airplanes.

Nanostart launches nanotechnology fund in Russia

Limit to nanotechnology mass-production?

New continuous fl ow process for separating and sorting carbon nanomaterials

New method to improve the electrical conductivity of polymeric composites

In addition to the shareholding, as fund manager Nanostart receives a carried interest of up to 25 percent as well as an annual management fee

totaling 3 percent of fund volume. For Nanostart, the fund marks a prelude to business activities in Russia.Nanostart found ideal conditions for the fund in Perm. Governor Oleg Chirkunov is developing the region into a technology pioneer. The emphasis is on development, commercialization, and application of nanotechnology products. According to RBC Daily, Perm is among the Top 10 most innovative regions of Russia.

The fund is part of an initiative by the Russian government to develop into a high-tech nation. The goal is to be one of the most important countries in the world for the production of nanotechnology-based products. This progress is mainly driven by the Russian company RUSNANO. The former government holding has been a stock corporation since March 2011. It promotes the commercialization of nanotechnological innovation and the development of necessary infrastructure to support projects. The equivalent of nearly 10 billion dollars has been made available. Nanostart was selected from among several renowned international competitors during the fund

appl icat ion process. This cooperat ion with distinguished Russian partners is further proof that Nanostart AG has established itself as a leading and sought-after expert for nanotech investment. Through the fund, which should last up to 10 years, Nanostart will benefit from the growth potential of nanotechnology in Perm and Russia. Russia has set a goal to become a leading producer o f nanotechnology products by 2015. The Kama Fund First is named after the Kama River, which flows through the region.

www.nanostart.de

In a paper published on April 21, in IOP Publishing's journal Nanotechnology, Professor Mike Kelly, Centre for Advanced Photonics and Electronics,

University of Cambridge, stated that you cannot mass produce structures with a diameter of three nanometres or less using a top-down approach.This statement raises a major question concerning the billions of dollars that are poured into nanotechnology each year in the hope that the latest technology developed in the lab can make the transition to a manufactured product on the market.Nanotechnology is built on the ability to control and manipulate matter at the atomic and molecular level and has far reaching applications including the delivery of drugs into the body, increasing the efficiency of solar

panels and improving methods of food packaging. The overall goal when entering nanotechnologies into the market is low-cost, high-volume manufacturability, but at the same time, the materials' properties must be highly reproducible within a pre-specified limit, which Kelly states cannot happen below the 3nm limit when trying to make arrays.The top-down approach to manufacturing, which Kelly states is limited, uses external tools to cut and shape large materials to contain many smaller features. Its alternative, the bottom-up approach, involves piecing together small units, usually molecules, to construct whole materials -- much like a jigsaw puzzle -- however this process is too unpredictable for defect -- free mass production of arrays.

Kelly used statistical evaluation of vertical nanopillars -- that have been suggested for uses in sensors and displays -- as an example to demonstrate his theory. He states that the proof comes in two stages. The first is due to the fact that when materials are mass produced on such a small scale there will be a lot of variation in the size of different components.As a result of this variation, the properties of the material will vary to an extent where the material cannot function to full capacity within an array.Professor Kelly says, "If I am wrong, and a counterexample to my theorem is provided, many scientists would be more secure in their continued working, and that is good for science.

www.iop.org

Developing an effective process for the separa t ing and so r t i ng o f ca rbon nanomaterials will offer industry new cost-

effective manufacturing techniques, high value-added materials and end-user products.Carbon nanomaterials are one of the most commercially relevant classes of nanomaterials,

potentially having the broadest range of applications from composites to consumer mass electronics, energy storage, membranes, healthcare and toxicity assessments. For high-value applications, high-purity and uniform carbon nanotubes are essential.This project aims to prove the concept and efficiency of a flow process for separation and sorting of carbon

nanotube products using a variable force field generated by a novel centrifuge, providing continuous parameter controlled, highly efficient mixing, separation and extraction.

wwwfr.uni.lu

By introducing addit ives into polymeric composites, favorable properties can be achieved. For instance, they develop

favorable electrical properties when reinforced with carbon nanotubes. Such composites are used to make flat-panel displays and solar cells more efficient. The researchers in Luxembourg, in cooperation with scientists from the Netherlands,

have studied the electrical percolation of carbon nanotubes in a polymer matrix and shown the percolation threshold - the point at which the polymer composite becomes conductive - can be considerably lowered if small quantit ies of a conductive polymer latex are added. The simulations were done in Luxembourg, while the experiments took place at Eindhoven University.

By mixing finely dispersed particles, so-called colloidal particles, of differing shapes and sizes in the medium, system-spanning networks form: the prerequisi te for electr ical ly conduct ive composites.

www.brunel.ac.uk

N A N O T E C H N O L O G Y

From page 1

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

IGBT module tops the competition in current density: 4.9 A/cm² for 3-level inverters

Alpha Technologies debuts new UPS power solutions

Enecsys secures $41 million investment to accelerate its growth plan

The new module boasts a rated current of 4.9 A/cm², the highest rated current per unit of area in comparison to competitor products, and one

phase leg per module, enabling the development of compact inverters with output power of up to 85 kVA. The MiniSKiiP is characterised by the fast and easy single-screw assembly and therefore optimised for the efficient manufacture of 3-level solar inverters and UPS systems.

The rated current per unit of area is up to twice that of other 3-level modules. Since no solid busbars are needed between the three phases/modules, more compact inverters can be made. The reverse voltage of the IGBTs and diodes used has been increased to 650 V to enable DC link voltages of 900 V for 480 V three-phase power applications typical in commercial or industrial settings in the United States. Each module has a 3-level phase leg with sufficient space for ten power semiconductors each.

Across the world, more than 15 million MiniSKiiP modules are in use in drives and frequency converters.

The success of this module platform continues in the new 3-level topology, which improves electrical efficiency and makes power converters more efficient. Thermal and electrical connection between the module and the heat sink and the driver board is established with a single screw or two screws for rated module currents of up to 150 A or 200 A, respectively. This means that solder equipment and time-consuming soldering processes are done away with in the assembly stage. For solar inverter output power of 60 kVA and above, i.e. for rated current of 150 A and higher, modules with screw connections were previously used for the busbars. Thanks to MiniSKiiP 200 A 3-level modules, the busbars can be replaced with cheaper PCBs in inverters with outputs of up to 85 kVA. Former complex 8-screw connections have been reduced to simple 2-screw-assembly solutions.

“Owing to the efficiency gain, 3-level technology is set to become standard in solar inverters and UPS systems in the very near future,” comments Thomas Grasshoff, Head of International Product Management, referring to the trends on these markets. In the drives sector,

MiniSKiiP modules have already gained a strong footing thanks to their fast and easy assembly.

The 3-level product range from Semikron covers rated currents of 20 A to 600 A: featuring SEMITOP solder modules for up to 150 A, MiniSKiiP spring contact modules for up to 200 A and SKiM screw connection modules for up to 600 A.

www.powersystemsdesign.com

The latest addition to Alpha’s FXM family of UPS products, the FXM 350 is engineered to address a broad range of applications requiring lower

output power and smaller footprints than the existing FXM 650, 1100 and 2000 models."The FXM 650, 1100 and 2000 have been stalwart performers for a variety of critical applications across many industries," said William Huang, AC Portfolio Product Manager at Alpha. "The new FXM 350 represents the leading ruggedized UPS in the Security market that supports both ac and dc loads. It simply

offers the class leading performance our customers have come to expect from the larger FXM modules, but in a more compact and cost effective package."The new FXM 350 UPS Module features: flexible dual ac and dc output for multiple loads up to 350W; local or remote monitoring and control via USB and SNMP communication; small footprint for wall, rack or enclosure mounting; dependable operation in extreme operating environments; and powerful new firmware with enhanced features such as battery run time information.

Also released is the Micro 350, Alpha’s latest outdoor UPS system that integrates the FXM 350 module in a NEMA 3R enclosure with batteries, an adaptor plate and an optional distribution panel. It provides reliable backup power for a wide range of applications, including security, access control, public utility and telecommunications.

www.powerpulse.net

Enecsys was founded in 2003 and its patented technology was originally developed at Cambridge University in the UK. Solar inverters

convert the DC power produced by solar photovoltaic (PV) modules into AC power for supply to the electricity grid. Enecsys micro inverters are installed on the rail behind solar modules, either one inverter per solar module or one for every two modules. The Enecsys micro inverter represents a breakthrough in inverter design for residential and commercial solar PV installations as its technology has, for the first time, eliminated components that limit inverter life.

Additionally the Enecsys micro inverter enables solar PV systems to harvest between 5% and 20% more energy; it makes planning and installation of PV systems easier and safer due to the elimination of high voltage DC wiring, and it enhances system optimization by monitoring the performance of each solar module. Enecsys has recently launched its products in Europe and North America and the latest financing has been arranged to facilitate substantial expected growth.Climate Change Capital Private Equity led this Series B equity financing with an investment of £11 million ($18 million). The balance, £14 million ($23 million),

was secured from the existing Enecsys investors, Wellington Partners, NES Partners (formerly known as Bankinvest New Energy Solutions) and Good Energies, who together previously invested £8.5 million ($14.3 million) in Enecsys in a Series A financing in 2009. The latest financing round represents the largest private equity raise in the European cleantech sector so far this year.

www.powersystemsdesign.com

P O W E R E L E C T R O N I C S

Semikron presents its newest MiniSKiiP IGBT power semiconductor module, which is now also available in 3-level topology.

Alpha Technologies Ltd. introduced the new FXM 350 and Micro 350 Uninterruptible Power Supply (UPS) products

Enecsys has secured a further £25 million ($41 million) in equity fi nancing to invest in its growth plan.

The new MiniSKiiP IGBT power semiconductor module (Courtesy of Semikron)

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For 35 years, Plasma-Therm has been shrinking the limits of what is possible. Today, our Mask Etcher V® produces at <32nm technology nodes. And our sights are set on 22nm and beyond.

Whether it’s new device designs, accelerated productivity goals or innovative material challenges, bring them to us. We will meet them.

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M A Y 2 0 1 1 i s s u e n ° 1 1 2 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

Y O L E L I F E

THE D ISRUPT IVE SEMICONDUCTOR TECHNOLOGIES MAGAZ INE

About Yole Développement

CONTACTS

Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to fi nance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 40 associates worldwide covering MEMS and Microfl uidics, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

For more information about :• Services : Jean-Christophe Eloy (eloy@yole.fr)• Reports: David Jourdan (jourdan@yole.fr)• Media : Sandrine Leroy (leroy@yole.fr)

MEDIA• Critical news, Bi-weekly: Micronews, the magazine• In-depth analysis & Quarterly Technology Magazines: MEMS Trends– 3D Packaging – PV Manufacturing – iLED – Power Dev'• Online disruptive technologies website: www.i-micronews.com • Exclusive Webcasts• Live event with Market Briefi ngs

CONSULTING SERVICES• Market data, market research and marketing analysis• Technology analysis • Reverse engineering and reverse costing• Strategy consulting• Corporate Finance Advisory (M&A and fund raising)

REPORTS• Collection of market & technology reports• Players & market databases• Manufacturing cost simulation tools• Component reverse engineering & costing analysisMore information on www.yole.fr

About Yole Développement

Editorial StaffBoard Members: Jean-Christophe Eloy & Jeff Perkins - Media Activity, Editor in chief: Dr Eric Mounier - Editors: Alexandre Avron, Frédéric Breussin, Arnaud Duteil, Barbara Jeol, Patrick Keating, Jerôme Mouly, Dr. Éric Mounier, Laurent Robin, Dr. Philippe Roussel - Media & PR Manager: Sandrine Leroy - VP New Media Development: Bill Stinson - Assistant: Camille Favre - Production: K.Zen

Discover our latest reports

Permanent Wafer BondingWafer Bonding will be a Key Enabling Technology for Advanced Semiconductor Manufacturing.The report will analyze in details the technical & economical evolution of the permanent wafer bonding process. The wafer bonding market is a very complex one crossing different wafer sizes (from 2’’ to 12’’), different applications (Advanced Substrates) and different bonding technologies (Adhesive, Anodic, Fusion, Direct Oxide, Eutectic, Glass Frit, Metal Diffusion). Released in May 2011 – For more information, feel free to contact David Jourdan (jourdan@yole.fr)

Also available…

MEMS Microphone Better communication through better listening.The mobile phone market is still the largest consumer of MEMS microphones. With the penetration of MEMS microphones in the iphone 4 and other smart phones, Yole Développement estimates rapid growth of the market in 2011-2016. By 2013, shipments will increase to over 1 billion units. Released in May 2011

Flip-Chip Understanding the new requirements and technologies that will reshape the supply chain of the world’s highest value package platform.Throughout this fi rst ever Yole Développement report on fl ip-chip technologies and markets, you will fi nd out how this market emerged almost from scratch 15 years ago and turned into a $16 billion market, and why we think that even though it is a large market by the fi gures and looks mature at fi rst sight, we think that it is still in its growth phase, with major technology and application and supply chain transformations looming ahead. Released in April 2011

O U R R E P O R T S

Permanent WaferBonding