© 2017

From Technologies to Market

Advanced RF SiP

for Cell Phones

2017

2

REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology

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3

REPORT METHODOLOGY

Technology analysis methodology Information collection

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METHODOLOGIES AND DEFINITIONS

Yole’s market forecast model is based on the following elementary structured blocks:

Yole’sanalysis

framework

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o Technology 56

o Challenges and requirements for 5G packaging

o Analysis on RF SiP packaging platforms indevelopment

o RF SiP Packaging roadmaps

o Players and Supply Chain 87

• Player landscape and positioning

• Company strategies

• Business model shifts

TABLE OF CONTENTS

o Introduction 3

• Methodology

• Report Synergies

• Objectives, Scope, Glossary

• Advanced Packaging platforms

o Executive Summary ___________15

o Market drivers and dynamics ___________35

• Advanced Packaging drivers

• RF packaging environment

o Disruptions and opportunities

• Market forecasts 102

• RF SiP Forecasts

• Unit count

• Wafer count

• Revenue

o Conclusions 117

o YOLE presentation 121

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Advanced RF SiP for Cellphones

Reverse Costing Review: Physical Analyses & Cost Estimations

RF report by Stéphane ELISABETH

October 2017

THIS REPORT IS ACCOMPANIED

BY A PHYSICAL TEARDOWN AND

REVERSE COSTING REPORT!

7

COMPANIES CITED IN THE REPORT

Amkor (J-Devices, Nanium), Apple, ASE Group, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Cavendish Kinetics, Cisco, Deca Technologies, Ericsson, Fujitsu, GLOBALFOUNDRIES, Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS

ChipPAC, Kyocera, Lenovo, LG, Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing Company, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech Technology,

Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec, Spreadtrum, SPIL, STMicroelectronics, TDK-EPC (EPCOS), Texas Instruments, TSMC, UMC, Vivo, Xiaomi, ZTE and more…

(non-exhaustive list)

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WHAT’S NEW IN THE ADVANCED PACKAGING TEAM?

Advanced Substrates and RF packaging activities

• From 2017, the Advanced Packaging team at Yole Développement is establishing “Advanced Substrates” and “RF Packaging” asstandalone and separate activities, to allow deeper focus on these segments

• The “Advanced Substrate” activity is dedicated to exploring the market and technologies of PCBs, IC substrates and thin film RDLs

• The “RF Packaging” activity will deal with low power RF packaging as requirements for high frequency packages rise (5G)

• The objectives of these activities will be to:

• Propose a common terminology framework

• Identify and analyze competitive and overlapping technologies

• Analyze the supply chain and business model shifts

• Provide related market forecasts

• Provide related technology roadmaps

• Provide an outlook on market dynamics and disruptions

• Identify market shares of involved players

• Provide analysis on substrate and RF package - architectures, equipment and materials

Start of the

standalone Advanced Substrates

and RF packagingactivities

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KEY FEATURES OF THIS REPORT

Market overview

o Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz

o Disruptions and opportunities thereof

o Focus on FEM and PAM architectures in RF Front-End of cellphones

o RF Front End SiP forecast (Revenue,Wafers, Units)

Technology trends and forecasts

o RF Front-End multi-die System-in-Package challenges and technology

requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands

o 5G SiP packaging roadmaps for smartphone Front-End

o RF SiP Revenue,Wafer and Unit forecasts

Supply chain analysis

• Supply chain changes in the new 5G era

• Strategies and outlook of current RF SiP manufacturers

• New entries and supply chain disruptions for mmWave packaging

The “Advanced RF SiP for Cell Phones 2017” is the first report of the RF advanced packaging series.The objectives of the report are as follows:

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SCOPE OF THE REPORT

• RF Front-End SiPpackaging for 5G in cell phones

Mobile phones

Mobile Infrastructure

RF front-end components (PA, LNA, filters, switches, antenna tuners)

2G, 3G, 4G, 5G technologies

Modems, transceivers, baseband processors, Wi-fi & Bluetooth modules…

Antennas, IPDs, …

Topics NOT included in the report

Focus of the report

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OSAT services

RF COMPONENT AND MODULE SUPPLY CHAIN (KEY PLAYERS)

RF component stage

FEM stage

Handset device stage

Antenna device

(tuner & switch)

RF switch

PA/LNA

RF filter

(Module maker + test + assembly)

Pure players Integrated players

Discrete components Integrated modules

CMOS-based

5G mmWave FEM

Focus of this

report!

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12

Leadframes

QFN

w/o IC substrates

Fan-in Fan-out

IC substrates-based

Package Substrate

(organic)

W/B BGAFlip Chip

BGA3DIC

Interposer based

(Si, Glass, Org)SiP

Integration:2D 3D

ADVANCED PACKAGING PLATFORMS

• Overview of advanced packaging platforms

PCB

(organic board)

Increased functionality, performance…

Interconnect:Bumping, Pillars, Studs, Through-silicon-via, Bump-less, Embedded Technologies...

X

Embedded die

(in substrate or PCB)

Focus packaging platform

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HOW DOES A 4G SiP (PAMID) LOOK LIKE TODAY ?

• Example with the Broadcom AFEM 8050 module in the iphone 7 Plus phone

• Mid Band PAMiD

PA

PA

sPxT

switch

sPxT

switch

RF IC

BAW

filters

BAW

filters

BAW

filters

BAW

filters

BAW

filters

BAW

filters

BAW

filtersBAW

filtersBAW

filters

BAW

filtersBAW

filters

BAW

filters

Passives

Passives

Passives

in a 43mm2 !

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DEVELOPMENT OF TECHNOLOGY FOR 5G

• Advancements in 4G in sub 6 GHz range (labeled 4G+) will go in parallel with 5G mmWave developments

2G 3G 4G

5G

mm

Wave

5G

IoT

• Upgrade of 4G technology - incremental innovation

• Will stay at frequencies < 6 GHz

• Modification of current RF packaging architectures

• Minimal change in BOM

• mmWave 5G technology - disruptive innovation

• Introduction of mmWave frequencies >24 GHz

• Adoption off new packaging architectures and

platforms

• Heavy design changes and new materials required

Different flavors of 5G are developing in

parallel!

All tracks include higher integration and

further RF SiP development

5G

sub 6

GHz

• Used frequencies <1GHz

• To address transfer of data generated by many IoT

end devices (mainly sensors)

• Still undefined standards/protocols

• Little to no innovation regarding semiconductor

packaging

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SMARTPHONE RF PACKAGING ARCHITECTURES

• Disruptive packaging ahead!

Tomorrow, 5G sub 6 GHz and mmWave 5G (>2019)

Sub 2.7 GHz

FC substrate SiP

Today (4G in 2017)

• 10-15 dies in Flip Chip SiP

• Mix of Si and III/V Front End

(i.e. PA)

• Flip Chip balls or Cu pillars

• Power amplifiers still

wirebonded

Improvements in sub 6 GHz and mmWave

bands (28, 39, 60 GHz)

Glass substrate

Fan-Out WLP

Enhanced

FC substrate SiP

Which

package

architecture

will win?

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16

OSAT services

SUPPLY CHAIN CHANGES EXPECTED IN 5G!

• Supply chain to get more complex with Qualcomm 5G push and potential new entries

OSAT services

Key RF FEM/PAM SiP

suppliers in 4G5G sub 6GHz

mmWave

5G

Potential new

semiconductor entries

?

Technology strategy

and competition

ongoing

Working on

incremental

advancements

Directly to disruptive

mmWave 5G

Key OEM mobile driversMore OEM

involvement +

others

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17

RELATED REPORTS

Discover more related reports within our bundle here

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The 5th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications and services. One of the key drivers for developing such speed is high resolution video demand (4K, 8K etc.) over mobile devices. Furthermore, future applications such as mobile driven augmented and virtual reality would benefit greatly from such technical capabilities. In addition, certain amounts of data generated by the Internet of Things end devices will need to be transmitted over the cellular network as well. Global mobile data traffic is growing at an astonishing rate, with >40% CAGR predicted from 2017-2022.

While some parts of 5G might be available as soon as 2019, in reality, there are many uncertainties which keep the global community in discussion:

• Accuracy of future projected data demands and market growth

• Growth of applications and services which would require 5G networks

• Justification of financial investment in infrastructure required

• Allocation of appropriate frequency bands• Technology readiness• Competition from advanced WiFi (i.e.

WiGiG)• Capabilities of ongoing 4G innovation

The fundamental motivation for developing 5G networks is the assumption that much higher datarates will be needed, than current 4G allows. The speed of 5G adoption will highly depend on market demand and status of RF

semiconductor technology quality. While the step from 3G to 4G was more incremental, 5G is considered a disruptive step, both from financial and technology viewpoint. 5G has 3 aspects: mmWave, sub 6GHz and sub 1 GHz (5G Internet-of-Thing - IoT). Highest frequency 5G targets mmWave frequency bands, in the range from 28 GHz to 60 GHz and even in some cases up to 80 GHz. This requires significant technology overhaul and installation of a large number of smaller local cells to assure signal quality. Meanwhile, significant efforts are being allocated to improve current 4G technology in the sub 6 GHz bands, towards 100 Mbit/s and beyond. The semiconductor industry, from front end to assembly and test is under heavy pressure to innovate at a very fast pace while maintaining desired quality and reliability.

RF front end modules today are utilizing complex System-in-Package (SiP) architectures with 10-15 dies (switches, filters, power amplifiers) included and several types of interconnects (wire bond, flip chip, Cu pillars) in a single package. Future smartphone connectivity relies on SiP innovation with SiP packaging revenue expected to grow >10% CAGR 2017 to 2022, more than the overall fast growing advanced packaging sector with CAGR 2017-2022 of 7%. Overall RF front end component market for smartphones is expected to grow from 12.3 $B in 2017 to 22.8 $B in 2022, with a CAGR of 13%. Advanced multi die SiP packaging holds a large set of key technologies to address all flavors of 5G requirements with the ability to enable or slow down the 5G market!

ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017 Market & Technology report - October 2017

5G – THE DISRUPTION IS AROUND THE CORNER!

The transition from 4G to 5G requires disruptive packaging innovation. 5G mmWave, 5G sub 6 GHz - which packaging architectures can rise to the occasion?

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.comMarket overview • Drivers and dynamics for 5G

flavors: 5G mmWave and 5G sub 6 GHz

• Disruptions and opportunities thereof

• Focus on FEM and PAM architectures in RF front-end of cellphones

• RF front end SiP forecast (revenue, wafers, units)

Technology trends and forecasts• RF front-end multi-die System-in-

Package challenges and technology requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands

• 5G SiP packaging roadmaps for smartphone front-end

• RF SiP revenue, wafer and unit forecasts

Supply chain analysis• Supply chain changes in the new

5G era• Strategies and outlook of current

RF SiP manufacturers• New entries and supply chain

disruptions for mmWave packaging

(Yole Développement, October 2017)

All flavors of 5G are developing in parallel!

• Upgrade of 4G technology - incremental innovation

• Will stay at frequencies < 6 GHz • Modification of current RF packaging architectures • Minimal change in BOM

• mmWave 5G technology - disruptive innovation

• Introduction of mmWave frequencies >24 GHz • Adoption of new packaging architectures and

platforms • Major design changes and new materials

required

• Used frequencies <1GHz • To address transfer of data generated by many

IoT end devices (mainly sensors) • Still undefined standards/protocols • Little to no innovation regarding semiconductor

packaging

5G mm

Wave

5G sub 6 GHz

5G IoT

4G2G 3G

All tracks include higher integrationand further RF SiP development

Supply chain to get more complex with Qualcomm 5G push and potential new entries

(Yole Développement, October 2017)

ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017

5G BRINGS BOTH COMPLEXITY AND NEW BUSINESS OPPORTUNITIES

NEW DESIGNS FOR CHALLENGING 5G REQUIREMENTS

The SiP supply chain in the smartphone RF front end (FEM/PAM) in today’s 4G technology is clearly led by 5 IDMs: Qorvo, Broadcom (Avago), Skyworks, Murata and TDK Epcos. Part of their production is outsourced to top OSATs: ASE, Amkor, JCET Group and SPIL. The future brings diversified strategies on which markets to target first. Today’s IDMs are more focusing on 5G sub 6 GHz solutions while Qualcomm is attempting to skip a step directly focusing on promoting and developing mmWave 5G technologies while working on establishing a 5G mmWave supply chain in order to ensure early leadership. Various packaging technology options and market uncertainties leave OSATs to make difficult choices on targeted customers, markets and packaging architectures to qualify and offer, in order to motivate IDMs for further outsourcing.

With 5G mmWave, 5G sub 6 GHz and 5G IoT developing in parallel, what are the strategies of each RF SiP manufacturer and their long term

Accomplishing Gbps wireless datarates on the cellular network requires operation of devices at GHz frequencies. While allocation of frequency bands is still in discussion, mmWave bands around 28 GHz, 39 GHz and 60 GHz come most into discussion. Meanwhile 5G below 6GHz is targeting expansion to 3.5 GHz and 4.5 GHz. Although 5G below 6 GHz also requires semiconductor packaging innovation, it can be considered mostly incremental. However, the 5G mmWave domain is opening completely new sets of requirements that requires considerable technology disruptions. At mmWave frequencies signal path length becomes particularly critical and any design imperfection is transformed into considerable signal losses and deteriorated device performance. Today, RF SiPs,

namely FEMiD and PAMiD are rather complex and contain 10-15 heterogeneous dies (Si based, III/V, MEMS etc.) with mixed wirebonding, flip chip ball or Cu pillar interconnects attaching to organic package substrates with up to 7 metal layers. Future 5G sub 6 GHz and especially 5G mmWave will require even denser integration of dies in order to minimize signal paths and keep losses under control.

Finding new innovative substrate/RDL solutions will directly impact the performance and success of a product. On top of that, integration of the antenna within the SiP is more a need than an option, bringing a set of additional challenges from placement options, processing, shielding etc. Future RF packaging innovation in cellphones is being performed on several levels and in parallel for 5G sub 6GHz and 5G mmWave, however the real packaging disruption is expected on mmWave frequencies >24 GHz. Some of the future RF packaging quests are search for low loss materials, antenna integration, possible integration of dies in front end, overhaul in packaging architectures and exploration of shielding options – all in order to develop new generations of 5G RF SiPs. Investigated packaging platforms for 5G so far include advanced Flip Chip substrate solutions, Fan-Out WLP and glass interposers.

What are the requirements and challenges in 5G packaging? How does that reflect on RF packaging architectures and materials? What are the advantages and limitations of developing RF packaging architectures? How will the dies and interconnects change at higher frequencies? Is there a better fit for lower and higher mmWave 5G bands? Which RF packaging architectures will win? Take a look into the full report for an in depth analysis providing answers to these questions.

More and disruptive SiP architectures expected in 5G mmWave

(Yole Développement, October 2017)

Tomorrow, 5G sub 6 GHz and mmWave 5G (>2019)

Sub 2.7 GHz

FC substrate SiP

Today (4G in 2017)

• 10-15 dies in Flip Chip SiP • Mix of Si and III/V Front End (i.e. PA) • Flip Chip balls or Cu pillars • Power amplifiers still wirebonded

Improvements in sub 6 GHz and mmWave bands (28, 39, 60 GHz)

Glass substrate

Fan-Out WLP

Enhanced Flip Chip substrate

SiP

Which package architecture

will win?

OSAT services OSAT services

Key RF FEM/PAM SiP suppliers in 4G

5G sub 6GHz

mmWave 5G

Potential new semiconductor entries

?

Technology strategy and competition

ongoing

Working on incremental

advancements

Directly to disruptive mmWave 5G

Key OEM mobile drivers More OEM

involvement + others

MARKET & TECHNOLOGY REPORT

outlook? Can Qualcomm outpace the competitors by being first to develop 5G mmWave technologies or are the timelines premature? How are OSATs responding and is outsourcing expected to increase or decrease at mmWave frequencies? With specific technology changes at 5G mmWave, doors are open for other fabless and IDM to enter the competition at RF front end. Why are they considered as potential new entries and how can the supply chain? This report aims to provide answers to these diverse and challenging questions.

Find more details about

this report here:

COMPANIES CITED IN THE REPORT (non exhaustive list)Amkor (J-Devices, Nanium), Apple, ASE Group, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Cavendish Kinetics, Cisco, Deca Technologies, Ericsson, Fujitsu, GLOBALFOUNDRIES, Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS ChipPAC, Kyocera, Lenovo, LG, Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing Company, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec, Spreadtrum, SPIL, STMicroelectronics, TDK-EPC (EPCOS), Texas Instruments, TSMC, UMC, Vivo, Xiaomi, ZTE and more…

Introduction 3

> Methodology> Report synergies> Objectives, scope, glossary> Advanced packaging platforms

Executive summary 15

Market drivers and dynamics 35

> Advanced packaging drivers> RF packaging environment> Disruptions and opportunities

Technology 56

> Challenges and requirements for 5G packaging

> Analysis on RF SiP packaging platforms in development

> RF SiP packaging roadmaps

Players and supply chain 87

> Player landscape and positioning> Company strategies> Business model shifts

Market forecasts 102

> RF SiP forecasts> Unit count> Wafer count> Revenue

Conclusions 117

Yole Développement presentation 121

TABLE OF CONTENTS (complete content on i-Micronews.com)

• Smartphone RF Front-End Module Review • Status of the Advanced Packaging Industry

2017• Glass Substrate Manufacturing in the

semiconductor field 2017 • 5G’s Impact on the

RF Front-End Industry

RELATED REPORTSBenefit from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages

AUTHORSAndrej Ivankovic is a Technolo-gy & Market Analyst , in the Advanced Packaging and Semiconductor Manu-facturing team, at Yole Développement the «More than Moore» market re-search and strategy consulting company. He holds a master’s degree in Electri-cal Engineering, with specialization in Industrial Electronics from the Univer-sity of Zagreb, Croatia and a PhD in Mechanical Engineering from KU Leuven, Belgium. He star ted as an intern at ON Semiconductor per forming reliability tests, failure analysis and characteriza-tion of power electronics and packages. The following 4 years he worked as a R&D engineer at IMEC Belgium on the development of 3D IC technology, focu-sing on electrical and thermo-mechani-cal issues of 3D stacking and packaging. Par t of this time he also worked at GLO-BALFOUNDRIES as an external resear-cher. He has regularly presented at in-ternational conferences authoring and co-authoring 18 papers and 1 patent.

Claire Troadec is leading the RF activity at Yole Développement. She has been a member of the MEMS manufacturing team from 2013. She graduated from INSA Rennes in France with an engineering degree in microelectronics and material sciences. She then joined NXP Semiconductors, and worked for 7 years as a CMOS process integration engineer at the IMEC R&D facility. During this time, she oversaw the isolation and per formance boost of CMOS technology node devices from 90 nm down to 45 nm. She has authored or co-authored seven US patents and nine international publications in the semiconductor f ield and before joining Yole Développement managed her own distr ibution company.

Find all our reports on www.i-micronews.com

OBJECTIVES OF THE REPORT• Translate 5G market drivers to semiconductor packaging dynamics• Summarize multi die packaging (SiP) technology challenges and requirements for RF Front-End

in smartphones• Analyze various developing RF SiP architectures for sub 6 GHz and mmWave frequencies,

advantages and suitability thereof• Analyze supply chain changes and opportunities for 5G in smartphones

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

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• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.

In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.

REPORTS COLLECTION

www.i-Micronews.com

10©2017 | www.yole.fr | About Yole Développement

OUR 2017 REPORTS PLANNING (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Acoustic MEMS and Audio Solutions 2017

− Integrated Passive Devices Market Status 2017

− 3D Imaging & Sensing 2017

− Status of the MEMS Industry 2017

− Silicon Photonics 2017*

− MEMS & Sensors for Automotive 2017

− High End Inertial Sensors for Defense and Industrial Applications 2017*

− Magnetic Sensors Market and Technologies 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Sensing and Display for AR/VR/MR 2017**

− MEMS Packaging 2017

− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017

o RF DEVICES AND TECHNOLOGIES

− RF Front End Modules and Components for Cellphones 2017

− Advanced RF SiP for Cellphones 2017

− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals

2017

− RF Technologies for Automotive Applications 2017

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

o MANUFACTURING

− Glass Substrate Manufacturing 2017

− Equipment & Materials for Fan Out Technology 2017

− Equipment and Materials for 3D TSV Applications 2017

− Emerging Non Volatile Memories 2017*

o MEDTECH

− Status of the Microfluidics Industry 2017

− Solid State Medical Imaging 2017

− Connected Medical Devices: the Internet of Medical Things 2017

− Sensors for Medical Robotics 2017

− Artificial Organs: Market & Technology Analysis 2017

− Organs-on-a Chip 2017

o ADVANCED PACKAGING

− Advanced Substrates Overview 2017

− Integrated Passive Devices Market Status 2017

− Status of the Advanced Packaging Industry 2017

− Fan Out Packaging: Market & Technology Trends 2017*

− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

− Advanced QFN: Market & Technology Trends 2017**

− MEMS Packaging 2017

− Advanced Packaging for Memories 2017

− Advanced RF SiP for Cellphones 2017

− Power Packaging Market and Technology Trends 2017

− Embedded Die Packaging: Technologies and Markets Trends 2017

o IMAGING & OPTOELECTRONICS

− 3D Imaging & Sensing 2017

− Status of the CMOS Image Sensor Industry 2017*

− Camera Module for Consumer and Automotive Applications 2017*

− Uncooled Infrared Imaging Technology & Market Trends 2017*

− Solid State Medical Imaging 2017

− Embedded Software for Machine Vision Systems 2017**

o BATTERY AND ENERGY MANAGEMENT

− Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed

11©2017 | www.yole.fr | About Yole Développement

OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS

− Status of Power Electronics Industry 2017

− Power MOSFET 2017: Market and Technology Trends

− IGBT Market and Technology Trends 2017

− Power Module Packaging: Material Market and Technology Trends 2017

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications*

− Materials Market Opportunities for Cellphone Thermal Management (Battery

Cooling, Fast Charging, Data Processing, etc.) 2017

− Gate Driver Market and Technology Trends 2017

− Power Management ICs Market Quarterly Update 2017

− Integrated Passive Devices Market Status 2017

− Thermal Management for LED and Power 2017

o COMPOUND SEMICONDUCTORS

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications*

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals

2017

− Bulk GaN Substrate Market 2017

o DISPLAYS

− MicroLED Displays 2017

− MicroLED IP 2017

− Quantum Dots for Display Applications 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

o SOLID STATE LIGHTING

− UV LEDs 2017 - Technology, Manufacturing and Application Trends*

− Horticultural Lighting 2017 - Technology, Industry and Market Trends

− Automotive Lighting 2017 - Technology, Industry and Market Trends*

− Active Imaging and Lidar 2017 - IR Lighting**

− LED Lighting Module 2017 - Technology, Industry and Market Trends

− IR LEDs and VCSELs - Technology Applications and Industry Trends 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− MicroLED Displays 2017

− CSP LED Lighting Module 2017

− LED Packaging 2017

− Thermal Management Technology and Market Perspectives in Power Electronics

and LEDs 2017

PATENT ANALYSIS by Knowmade

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk

and Potential Targets 2017

− MEMS Microphone: Patent Landscape Analysis 2017

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping

− Microbolometer: Patents Used in Products 2017

− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− MicroLEDs: Patent Landscape Analysis 2017

− Uncooled Infrared Imaging: Patent Landscape Analysis 2017

− 3D Monolithic Memory: Patent Landscape Analysis 2017

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− FLUIDIGM Patent Portfolio Analysis

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.

*2016 version still available / **To be confirmed

12©2017 | www.yole.fr | About Yole Développement

OUR 2016 PUBLISHED REPORTS LIST (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Gas Sensors Technology and Market 2016

− Status of the MEMs Industry 2016

− Sensors for Cellphones and Tablets 2016

− Market and Technology Trends of Inkjet Printheads 2016

− Sensors for Biometry and Recognition 2016

− Silicon Photonics 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

o MEDTECH

− BioMEMS 2016

− Point of Care Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Embedded Die Packaging: Technology and Market Trends 2017

− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

− Fan-Out: Technologies and Market Trends 2016

− Fan-In Packaging: Business update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

o MANUFACTURING

− Thin Wafer Processing and Dicing Equipment Market 2016

− Emerging Non Volatile Memories 2016

o COMPOUND SEMICONDUCTORS

− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− Power SiC 2016: Materials, Devices, Modules, and Applications

o LED

− UV LED Technology, Manufacturing and Applications Trends 2016

− OLED for Lighting 2016 – Technology, Industry and Market Trends

− Automotive Lighting: Technology, Industry and Market Trends 2016

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics 2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

o BATTERY AND ENERGY MANAGEMENT

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

− Stationary Storage and Automotive Li-ion Battery Packs 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

13©2017 | www.yole.fr | About Yole Développement

OUR 2016 PUBLISHED REPORTS LIST (2/2)

PATENT ANALYSIS by Knowmade

− Microbattery Patent Landscape Analysis

− Miniaturized Gas Sensors Patent Landscape Analysis

− 3D Cell Culture Technologies Patent Landscape

− Phosphors and QDs for LED Applications Patent Landscape

− TSV Stacked Memory Patent Landscape

− Fan-Out Wafer Level Packaging Patent Landscape Analysis

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published

in 2016.

MORE INFORMATION

o All the published reports from the Yole Group of Companies are available on our website

www.i-Micronews.com.

o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the

number of reports you are interested in and select the related offer. You then have up to 12

months to select the required reports from the Yole Développement, System Plus Consulting

and KnowMade offering. Pay once and receive the reports automatically (multi-user format).

Contact your sales team according to your location (see the last slide).

14©2017 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

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15©2017 | www.yole.fr | About Yole Développement

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail eloy@yole.fr - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: levenez@yole.fr - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Japan & Asia: Miho Othake, Account ManagerEmail: ohtake@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

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• Jean-Christophe Eloy, CEO & PresidentEmail: eloy@yole.fr - +33 4 72 83 01 80

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