From Technologies

to Market

Equipment and Materials for

Fan-Out Packaging

Sample

Jérôme Azémar - azemar@yole.fr

Santosh Kumar - kumar@yole.fr

From Technologies to Market

2

REPORT SCOPE

This report’s main objectives are as follows:

o Describe technologies that can be classified as “fan-out packaging”

o Identify and detail the fan-out packaging platform’s key process steps

o Analyze the manufacturing chain for fan-out technologies

o Pinpoint the equipment and materials suppliers for key process steps

o For these steps, provide a market forecast for the coming years and an prediction of future trends

o Elaborate on key market drivers, benefits, and challenges for equipment and materials in fan-out packages

Fan-out equipment and materials are studied from the following perspectives:

o Available technologies and their inherent challenges

o Players involved and their market share

o Market value

©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

3

REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology

©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

4

REPORT METHODOLOGY

Technology analysis methodology Information collection

©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

5©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

EQUIPMENT AND MATERIALS FOR FAN-OUT PACKAGING - TABLE OF CONTENTS (1/2)

• Market and Technologies Analysis per Process

Step

• Carrier Bonding and Debonding 110

• Carriers

• Bonding/debonding equipment

• Pick-and-Place 127

• Pick-and-place equipment

• Molding 141

• Compression molding tools

• Epoxy mold compounds

• Report Scope & Definitions

• Report scope 5

• Companies cited in this report 7

• Glossary

• Related Reports 8

10

• Executive Summary 13

• Fan-Out Packaging - Context 29

• Drivers for fan-out 36

• Fan-out market growth and hype 45

• General Market Forecast 53

• Fan-Out Processes

• Generic process descriptions, step by step 67

• Key challenges and issues: die shift, warpage, reliability 82

• Panel processing 98

6©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

EQUIPMENT AND MATERIALS FOR FAN-OUT PACKAGING - TABLE OF CONTENTS (2/2)

• Market and Technologies Analysis per Process

Step, cont.

• RDL Processing 158

• Dielectric Passivation 160

• Coating equipment

• Dielectric materials

• Photolithography 175

• Photolithography tools and coating equipment

• Photoresists

• RDL Metal Layers 200

• PVD equipment

• Meterology and Inspection 217

• Conclusions 222

• About the Authors / Company Presentation 224

Biography & contact

7©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

ABOUT THE AUTHORS

Jérôme Azémar

Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team at Yole Développement. As a Technology & Market

Analyst, Jérôme provides numerous market research and strategy analyses on power electronics, advanced packaging, and semiconductor

manufacturing, and he has given several presentations and market briefings at semiconductor conferences.

Upon graduating from INSA Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for

three years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired photolithography skills

which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. While with STMicroelectronics he developed new

processes, co-authored an international publication, and worked on metrology structures embedded on reticules before joining Yole

Développement in 2013.

azemar@yole.fr

Santosh Kumar

Santosh Kumar currently works as Senior Technology & Market Research Analyst at Yole Développement. Prior to Yole, Santosh was Senior R&D

Engineer at MK Electron Co. Ltd., where he was engaged in electronic packaging materials development and technical marketing. His main interests are

advanced electronic packaging materials and technology, including TSV and 3D packaging, modeling and simulation, reliability and material

characterization, wire bonding, novel solder materials, and process. He received a bachelor’s and a master’s degree in Engineering from the Indian

Institute of Technology (IIT) Roorkee and the University of Seoul, respectively. He has published 20+ papers in peer-reviewed journals and has

obtained two patents. Santosh has also presented and spoken at numerous conferences and technical symposiums related to advanced

microelectronics packaging.

kumar@yole.fr

Sample

9©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

• “Fan-out packaging” can be defined several different ways, depending on who we are talking to. It is especially confusingbecause when the hype began around this package type, many players erroneously used the term “fan-out” to describe theirsolution and gain more attention from the market.

• An even more confusing aspect is that acknowledged fan-out solutions are/were not even called “fan-out” by their creators. Forinstance, Infineon, creator of eWLB (one of the most widespread fan-out solutions), did not describe eWLB as “fan-out” in its IP.Instead, for a long time Infineon termed it an “embedded die” solution.

• An acknowledged characteristic of “fan-out” packages is that, as the name implies, interconnections are “fanned out” of thechip.Thus, bumping is not dependent on die surface.

• This means fan-out can potentially achieve any number of interconnects with standard pitches, at any shrink stage of the wafernode technology

• If fan-out’s only definition is that it is “a package from which connections and bumping are out of the chip scale”, then almostall packages can be defined as fan-out! Flip-chip BGA, flip-chip CSP, embedded die, etc. This has created much confusionwithin the industry.

• To make a fair comparison and clarify the situation, Yole has focused this report on selected fan-out technologies possessingtwo additional characteristics:

• Fan-out solutions that use mold compound (and not laminated materials) to embed dies

• Fan-out solutions’ RDL that does not use advanced substrate (PCB layer-type)

Mold Chip

FAN-OUT - DEFINITION (1/2)

Different interpretations, and Yole’s scope

Fan-out can be many

different things

No advanced substrate (PCB-type) used for redistribution layers

Mold compound is used to embed the chips

Connections are fanned out of the chip

scale area

10©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT - DEFINITION (2/2)

What about other technologies called “fan-out”?

Fan-out can be many

different things

• Dies embedded in laminated materials:

• This package type, also known as “embedded die” package, is based on PCB manufacturing capability andtherefore is not in the same category as fan-out technologies that use molding compound. Resolution is lower(L/S of 10µm or higher), tool types are different, the actors are often different (more substrate makers thanOSATs or IDMs), and end-markets are different, with simpler applications targeted.

• Examples of known technologies falling into this category: J-Devices’ PLP, AT&S’ ECP

• Mold compound embedded atop advanced-substrate (PCB-type) solution (standard or coreless):

• This package type can also be considered a flip-chip CSP. Similar to the category described above, our reportis not focused on this technology type due to differences in resolution achieved and end-markets targeted.

• Another critical difference is that “fan-out hype” started with fan-out wafer-level package (FOWLP) solutionslike eWLB and RCP, and became famous because of substrate removal - compared to FC-CSP and FC-BGA,which made the packages much thinner. If we include fan-out solutions that imply a substrate, then thesituation is different.

• An example of a known technology falling into this category: ASE’s fan-out chip last

11©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT - TECHNOLOGY PRINCIPLE

Fan-out: dies embedded in mold

compound, no advanced

substrate, and interconnections fanned out of chip

surface

eWLB example (chip-first, face-

down)

Pick and place

Wafer-level

molding

Carrier removal/debonding

Tape lamination

Standard WLB process

(passivation, pattern, RDL,

bonding)

Dicing

Source: Infineon

Carrier

Carrier with foil and chips

Molding with liquid mold compound

WLP fan-out wafer

After singulation

Reconstituted wafer

after molding

12©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

Smaller footprint and thinner package than

flip-chip BGA

Lower thermal resistance compared

to flip-chip BGA

Simplified supply chain and manufacturing

infrastructure

No laminate substrate required

No restriction in bump pitch

Shorter interconnections

Fan-out zone adaptable to customer

needs

FAN-OUT - KEY DIFFERENTIATORS

Fan-out provides several

advantages

Mold Chip

Other advantages:

• Better board-level reliability

compared to WLCSP

• RoHS is a REACH-compliant

package

• Excellent electrical

performance

• High degree of package design

freedom

• Reliable, miniaturized, high-

performance package

13©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

Topography

Due to different device sizes to embed, non-planarity can

become an issue for SiP integration Chip-to-mold

non-planarity

Die protrusion at the interface can

lead to RDL distortion

Die shift

Lack of precision in die positioning during

pick and place induces challenges for

lithography steps/alignments

Reliability

With large packages (above 15x15mm), creep fatigue and

solder joint problemsappear Issue for large die embedding

and PoP

Warpage

Nonuniform stress during process steps

like molding compound deposition

and die placing can impact wafer flatness

and die stress

IC 1 IC 2

FAN-OUT PACKAGING - TECHNICAL CHALLENGES

Despite its manydrivers and

advantages, fan-out packaging has challenges to

overcome whichrequire innovation,

investment, and improvements

14©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT ACTIVITY - MARKET FORECAST

Apple’s example will

show competitors

the way

15©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT APPLICATIONS

Where do we find fan-out? Some examples below

Orange: devices found in FOWLP packages

today

Green: future devices that could be found in

FOWLP

Grey: devices that will likely remain on WLCSP

or flip-chip package, or move to 3DIC or

embedded die

Apple iPhone 7 (2016)A10 APE – InFO package (TSMC)

Samsung Galaxy S7 (2016)Qualcomm Audio Codec

WCD9335 – eWLB package

(Nanium/STATSChipPAC)

Bosch MRR1Plus Radar (2015)Infineon RASIC™ (77GHz RADAR System

IC Chipset) – eWLB package

BK Ultrasound Sonic Window (2015)Multichip Module – eWLB Package (Nanium)

BasebandSpreadtrumSC8502

Intel-Mobile/InfineonPMB7900, PMB9810, PMB9801

RFSpreadtrumSC8502

Intel-Mobile/InfineonPMB5712, PMB5726 Power Management

MarvellPM820

SpreadtrumSC2712A

Continental ARS400 Radar (2015)NXP MR2001 (77GHz multichannel

RADAR) – RCP Package

16©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT - DETAILED PROCESS FLOW (1/3)

Chip-first face-down scenario

These four « front-end »

steps are critical for fan-out packages

(the rest of the process exists

in other manufactured packages, and

is more mature)

Specific tools & equipment Specific materials

Chip-to-wafer bonding tool

Wafer debonding equipment

Dual-attached film spill-off

Mold compound

(liquid or granular)

Dual-attached film

+

Carrier (Si, ceramic, glass, metal)

Compression wafer-level

molding tool

Vacuum lamination tool

Cleaning solutions

Grinding & CMP tools CMP pad and slurries

Tape lamination

Pick and place

Molding

Debonding

Critical materials: • Choice of adhesive is key for

debonding step

• Choice of carrier type

strongly impacts warpage and

debonding capability

Critical material: • Mold compound deposition

induces stress on the die, die

shift, and warpage

Critical step: • High accuracy required to

limit die shift

Critical step:

• High impact on warpage

and reliability

• Cost greatly depends on

carrier choice

17©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

Passivation for RDL

Redistribution layer (RDL)

Patterning for RDLPhotolithography for patterning

- Stepper or mask aligner

Wet bench (photoresist stripping)

- Seed layer deposition (PVD)

- Thick-resist deposition

- Resist patterning/lithography

(Stepper or mask aligner)

- Cu local ECD plating

- Polymer/thick-resist stripping

- Seed layer etching

- Sputtering targets

- Thick photoresist

- ECD chemistry

- Wet etch chemistry

- Cleaning chemistry

Dielectric material deposited by spin

coating

Dielectric materials for passivation

- BCB, PI, PBO, epoxy, Al-X

FAN-OUT - DETAILED PROCESS FLOW (2/3)

Chip-first face-down scenario

Specific materials

Critical materials: • Choice of dielectric polymer

is key for reliability and curing

temperature (mold

compound cannot handle high

temperature)

Specific tools & equipment

18©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

UBM etching via wet etch

Final test + singulation

Ball mount + wafer test

Re-passivation layer

UBM deposition + etching

Dicing tool- Laser

- Blade

- Stealth

- Dielectric material deposited by spin coating

- Exposure (stepper/mask aligner)

- Resist stripping

Materials for passivation

- BCB, PBO, epoxy, Al-X

- Stripping chemistries

UBM deposition techniques:

- PVD + ECD

or

- Electroless

or

- PVD

Consumables

- Sputtering targets + ECD

chemistry

or

- Electroless chemistry

or

- Sputtering targets

UBM wet-etch chemistry materials

(dependent on metal type for etching)

Final test tool

FAN-OUT - DETAILED PROCESS FLOW (3/3)

Chip-first face-down scenario

- Balling (ball drop, printing)

- Wafer test tool

Critical materials: • Choice of dielectric polymer

is key for reliability and curing

temperature (mold

compound cannot handle high

temperature)

Specific materialsSpecific tools & equipment

19©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT PROCESS STEPS TO FOCUS ON (1/2)

• In this report, Yole focuses on some specific process steps. These steps are considered more specific and illustrative offan-out packaging, as well as areas showing strong innovation from different players:

• Pick and place:

• Pick-and-place is a key step for FOWLP. The process speed directly impacts the production pace, and die positioning accuracy hasconsequences on RDL manufacturing.

• Bonding/debonding:

• A trademark step of fan-out packaging is the bonding of chips on carriers’ surface and debonding them once the reconstituted wafer ismolded. This step directly impacts package reliability and defines this platform’s feasibility. It impacts warpage, defectiveness, and packagemanufacturing success.

• Mold compound deposition:

• Mold deposition is fan-out packaging’s most illustrative step. Mold constitutes the package itself, and embeds the chips. Creating areconstituted wafer/panel and processing it is at the very core of fan-out manufacturing.

• RDL process:

• Redistribution layers are the source of the “fan-out” packaging name. They allow the connections to transcend the chip surface and not belimited by it. All steps are essential: polymers’ passivation coating, patterning them thanks to photolithography, and creating copperconnection layers through plating (after first sputtering the seed).This process impacts package thickness and efficiency

• Metrology:

• Metrology steps are very important for guaranteeing good process execution. In the case of fan-out, some steps that are not commonlymeasured in advanced packaging (i.e. warpage) become mandatory to follow.

20©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FAN-OUT PROCESS STEPS TO FOCUS ON (2/2)

• What about other process steps?

• All manufacturing steps are important for an optimum process, but some steps were not considered during our investigation.Several reasons for this: either we did not have enough information on these steps, or they were closed markets, or we deemedthem less characteristic of FOWLP. For relevance and information quantity’s sake, Yole has focused its investigation on theprocess steps listed on the previous slide. However, we are capable of studying other steps and their associated equipment andmaterials upon request, if desired.

• List of steps not investigated in this report:

• UBM deposition and etching

• Ball mounting

• Wafer testing

• Dicing

• Some steps were investigated only at a technical level, and a market study was not performed:

• Carriers (market forecasts available only for glass carriers)

• Metrology steps

21©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FOWLP* - TOTAL MARKET FORECAST FOR EQUIPMENT AND MATERIALS

* The market estimated here only includes process steps investigated by Yole for this report, and is not exhaustive. For details, see the following slides for breakdowns, along with the “fan-out process steps to focus on” slides in the “Challenges” section.

22©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FOWLP - EQUIPMENT MARKET FORECAST

23©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

FOWLP - MATERIALS MARKET FORECAST

24©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

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2017

o COMPOUND SEMICONDUCTORS

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017

o DISPLAYS

− Microdisplays and MicroLEDs 2017

− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017

− QD for Display Applications 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Emerging Display Technologies 2017**

o LED

− UV LEDs 2017 - Technology, Manufacturing and Application Trends

− Agricultural Lighting 2017 - Technology, Industry and Market Trends

− Automotive Lighting 2017 - Technology, Industry and Market Trends

− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**

− LED Lighting Module 2017 - Technology, Industry and Market Trends

− IR LEDs 2017 - Technology, Manufacturing and Application Trends

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− CSP LED Module 2017

− LED Packaging 2017

PATENT ANALYSIS by Knowmade

− 3D Monolithic Memory: Patent Landscape Analysis

− Microfluidic Diagnostic: Patent Landscape Analysis

− GaN Technology: Top-100 IP profiles**

− Uncooled Infrared Imaging: Patent Landscape Analysis**

− MEMS Microphone: Patent Landscape Analysis**

− MEMS Microphone: Knowles' Patent Portfolio Analysis**

− MicroLEDs: Patent Landscape Analysis**

− Microbolometer: Patents used in products**

− Micropumps: Patent Landscape Analysis**

− Flexible batteries: Patent Landscape Analysis**

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.

** To be confirmed

36©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

OUR 2016 PUBLISHED REPORTS LIST (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Gas Sensors Technology and Market 2016

− Status of the MEMs Industry 2016

− Sensors for Cellphones and Tablets 2016

− Market and Technology Trends of Inkjet Printheads 2016

− Sensors for Biometry and Recognition 2016

− Silicon Photonics 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

o MEDTECH

− BioMEMS 2016

− Point of Care Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Embedded Die Packaging: Technology and Market Trends 2017

− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

− Fan-Out: Technologies and Market Trends 2016

− Fan-In Packaging: Business update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

o MANUFACTURING

− Thin Wafer Processing and Dicing Equipment Market 2016

− Emerging Non Volatile Memories 2016

o COMPOUND SEMICONDUCTORS

− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− Power SiC 2016: Materials, Devices, Modules, and Applications

o LED

− UV LED Technology, Manufacturing and Applications Trends 2016

− OLED for Lighting 2016 – Technology, Industry and Market Trends

− Automotive Lighting: Technology, Industry and Market Trends 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− LED Packaging 2017: Market, Technology and Industry Landscape

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics 2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

o BATTERY AND ENERGY MANAGEMENT

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

− Stationary Storage and Automotive Li-ion Battery Packs 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

37©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

OUR 2016 PUBLISHED REPORTS LIST (2/2)

PATENT ANALYSIS by Knowmade

− Microbattery Patent Landscape Analysis

− Miniaturized Gas Sensors Patent Landscape Analysis

− 3D Cell Culture Technologies Patent Landscape

− Phosphors and QDs for LED Applications Patent Landscape 2016 report

− TSV Stacked Memory Patent Landscape

− Fan-Out Wafer Level Packaging Patent Landscape Analysis

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.

MORE INFORMATION

o All the published reports from the Yole Group of Companies are available on our website

www.i-Micronews.com.

o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the

number of reports you are interested in and select the related offer. You then have up to 12

months to select the required reports from the Yole Développement, System Plus Consulting

and KnowMade offering. Pay once and receive the reports automatically (multi-user format).

Contact your sales team according to your location (see the last slide).

38©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 8,500+

monthly visitors, the 11,500+

weekly readers of @Micronews

e-newsletter

Seven main events planned for

2017 on different topics to

attract 140 attendees on average

Gain new leads for your business

from an average of 300

registrants per webcast

Contacts: Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing & Communication Project Managers.

39©2017 | www.yole.fr | Equipment and Materials for Fan-Out Packaging | Sample

CONTACT INFORMATION

Follow us on

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail eloy@yole.fr - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: levenez@yole.fr - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Japan & Asia: Miho Othake, Account ManagerEmail: ohtake@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

o FINANCIAL SERVICES

• Jean-Christophe Eloy, CEO & PresidentEmail: eloy@yole.fr - +33 4 72 83 01 80

o GENERAL

• Public Relations: leroy@yole.fr - +33 4 72 83 01 89

• Email: info@yole.fr - +33 4 72 83 01 80