semiconductor industry ehs - university of arizona

SEMICONDUCTOR INDUSTRYEHS

Materials Lifecycle Solutions

AGENDAAGENDA

� CURRENT & FUTURE ISSUES

� POINT-OF-USE (POU) DEVICE INFORMATION

� EXPECTATIONS FOR POU DEVICE SUPPLIERS

� CURRENT & FUTURE ISSUES

� POINT-OF-USE (POU) DEVICE INFORMATION

� EXPECTATIONS FOR POU DEVICE SUPPLIERS


PFC’S (GLOBAL WARMING)PFC’S (GLOBAL WARMING)

IN APRIL, 1999, THE WORLDSEMICONDUCTOR COUNCIL (WSC)

REACHED AGREEMENT TO REDUCEAGGREGATE ABSOLUTE EMISSIONS OF

PFCs FROM SEMICONDUCTORFABRICATION FACILITIES BY 10% OR

GREATER BY 2010. THE BASELINE YEARIS 1995 FOR EUROPEAN UNION, JAPAN,AND UNITED STATES; 1997 FOR SOUTH

KOREA; AND 1998 FOR TAIWAN (JOINEDIN YEAR 2000). THIS AGREEMENT ALSO

PROVIDES UNIFORM GUIDANCE TORESEARCHERS AND EQUIPMENT

SUPPLIERS.

IN APRIL, 1999, THE WORLDSEMICONDUCTOR COUNCIL (WSC)

REACHED AGREEMENT TO REDUCEAGGREGATE ABSOLUTE EMISSIONS OF

PFCs FROM SEMICONDUCTORFABRICATION FACILITIES BY 10% OR

GREATER BY 2010. THE BASELINE YEARIS 1995 FOR EUROPEAN UNION, JAPAN,AND UNITED STATES; 1997 FOR SOUTH

KOREA; AND 1998 FOR TAIWAN (JOINEDIN YEAR 2000). THIS AGREEMENT ALSO

PROVIDES UNIFORM GUIDANCE TORESEARCHERS AND EQUIPMENT

SUPPLIERS.


PERFLUOROCOMPOUNDS (PFC)PERFLUOROCOMPOUNDS (PFC)� SULFUR HEXAFLUORIDE (SF6)

� NITROGEN TRIFLUORIDE (NF3)

� TETRAFLUOROMETHANE (CF4)

� TRIFLUOROMETHANE (CHF3)

� HEXAFLUOROETHANE (C2F6)

� OCTAFLUOROPROPANE (C3F8)

� SULFUR HEXAFLUORIDE (SF6)

� NITROGEN TRIFLUORIDE (NF3)

� TETRAFLUOROMETHANE (CF4)

� TRIFLUOROMETHANE (CHF3)

� HEXAFLUOROETHANE (C2F6)

� OCTAFLUOROPROPANE (C3F8)


DEVELOPMENTS FOR CVDDEVELOPMENTS FOR CVD

� PROCESS OPTIMIZATION:

� CLEANING OF CVD CHAMBERS WITH C2F6 WASOPTIMIZED TO REDUCE THE AMOUNT OF C2F6USED

(EXAMPLE: END-POINT DETECTORS).

� CHANGES IN PROCESS VARIABLES (ie: PFC FLOWS, PRESSURE AND PLASMA POWER)

� PROCESS OPTIMIZATION:

� CLEANING OF CVD CHAMBERS WITH C2F6 WASOPTIMIZED TO REDUCE THE AMOUNT OF C2F6USED

(EXAMPLE: END-POINT DETECTORS).

� CHANGES IN PROCESS VARIABLES (ie: PFC FLOWS, PRESSURE AND PLASMA POWER)


DEVELOPMENTS FOR CVDDEVELOPMENTS FOR CVD

� ALTERNATIVE CHEMISTRIES:

� NF3 HAS BEEN USED AS A REPLACEMENT IN AFEW INSTANCES. UTILIZATION EFFICIENCY ISHIGHER FOR NF3 THAN C2F6

� C3F8 IS USED AS A REPLACEMENT FOR C2F6,WITH THE MMTCE EMISSIONS BEING REDUCED.UTILIZATION EFFICIENCY IS HIGHER FOR C3F8THAN C2F6

� SOME FACILITIES SWITCHED TO ClF3

� ALTERNATIVE CHEMISTRIES:

� NF3 HAS BEEN USED AS A REPLACEMENT IN AFEW INSTANCES. UTILIZATION EFFICIENCY ISHIGHER FOR NF3 THAN C2F6

� C3F8 IS USED AS A REPLACEMENT FOR C2F6,WITH THE MMTCE EMISSIONS BEING REDUCED.UTILIZATION EFFICIENCY IS HIGHER FOR C3F8THAN C2F6

� SOME FACILITIES SWITCHED TO ClF3


� PROCESS HARDWARE CHANGE:

� NF3 MICROWAVE CLEANS. NF3 IS BROKENDOWN IN A PRE-CHAMBER PLASMA DEVICE TOGENERATE FLUORINE TO CLEAN CHAMBER.

� PROCESS HARDWARE CHANGE:

� NF3 MICROWAVE CLEANS. NF3 IS BROKENDOWN IN A PRE-CHAMBER PLASMA DEVICE TOGENERATE FLUORINE TO CLEAN CHAMBER.

DEVELOPMENTS FOR CVD


DEVELOPMENTS FOR DRY ETCHDEVELOPMENTS FOR DRY ETCH

� SINCE THE PFCs ACTUALLY CONTACTWAFERS, PROCESS OPTIMIZATION ANDALTERNATIVE CHEMISTRIES ARE MORESENSITIVE. CHANGES IN PROCESSVARIABLES (I. E. PFC FLOWS, PRESSURE ANDPLASMA POWER) CAN BE DONE TO REDUCEEMISSIONS.

� SINCE THE PFCs ACTUALLY CONTACTWAFERS, PROCESS OPTIMIZATION ANDALTERNATIVE CHEMISTRIES ARE MORESENSITIVE. CHANGES IN PROCESSVARIABLES (I. E. PFC FLOWS, PRESSURE ANDPLASMA POWER) CAN BE DONE TO REDUCEEMISSIONS.


PFC RECOVERY / RECYCLEPFC RECOVERY / RECYCLE

CENTRALIZED CAPTURE/RECOVERY SYSTEMSHAVE BEEN SHOWN TO RECOVER C2F6,

CHF3 AND SF6 VERY EFFICIENTLY (>95%);HOWEVER, CF4 CAPTURE IS ABOUT 75%.

THE COST EFFECTIVENESS OF THISTECHNOLOGY IS STILL UNKNOWN. MANY

OF THE RECOVERY/RECYCLE EFFORTSHAVE BEEN STOPPED.

CENTRALIZED CAPTURE/RECOVERY SYSTEMSHAVE BEEN SHOWN TO RECOVER C2F6,

CHF3 AND SF6 VERY EFFICIENTLY (>95%);HOWEVER, CF4 CAPTURE IS ABOUT 75%.

THE COST EFFECTIVENESS OF THISTECHNOLOGY IS STILL UNKNOWN. MANY

OF THE RECOVERY/RECYCLE EFFORTSHAVE BEEN STOPPED.


PFC ABATEMENT DEVICESPFC ABATEMENT DEVICES

� ABATEMENT TECHNOLOGIES (BEFORE OR AFTERPUMP) EXIST AND ARE BEING DEVELOPED THATCAN REDUCE PFC EMISSIONS. EACH TECHNOLOGYMUST BE REVIEWED FOR INDIVIDUAL PFCEFFECTIVENESS.

� IT IS IMPORTANT TO NOTE THAT OTHER GASESEMITTED (E.G. SILANE) FROM THE PROCESS MAYREQUIRE POU ABATEMENT DEVICE. THIS WILLENTER INTO POU ABATEMENT DEVICE SELECTION.

� ABATEMENT TECHNOLOGIES (BEFORE OR AFTERPUMP) EXIST AND ARE BEING DEVELOPED THATCAN REDUCE PFC EMISSIONS. EACH TECHNOLOGYMUST BE REVIEWED FOR INDIVIDUAL PFCEFFECTIVENESS.

� IT IS IMPORTANT TO NOTE THAT OTHER GASESEMITTED (E.G. SILANE) FROM THE PROCESS MAYREQUIRE POU ABATEMENT DEVICE. THIS WILLENTER INTO POU ABATEMENT DEVICE SELECTION.


PFC ABATEMENT DEVICESPFC ABATEMENT DEVICES

� THE FOLLOWING TECHNOLOGIES CAN BEUSED FOR REDUCING PFC EMISSIONS (EACHVENDOR'S TECHNOLOGY NEEDS TO BEREVIEWED):

� THERMAL OXIDATION

� PRE-PUMP PLASMA OR MICROWAVE (IN BETATESTING AND ACTUAL PRODUCTION TESTINGFOR DRY ETCH ONLY)

� CATALYTIC OXIDATION

� THE FOLLOWING TECHNOLOGIES CAN BEUSED FOR REDUCING PFC EMISSIONS (EACHVENDOR'S TECHNOLOGY NEEDS TO BEREVIEWED):

� THERMAL OXIDATION

� PRE-PUMP PLASMA OR MICROWAVE (IN BETATESTING AND ACTUAL PRODUCTION TESTINGFOR DRY ETCH ONLY)

� CATALYTIC OXIDATION


PFC’S - FUTUREPFC’S - FUTURE

❶ HOW WILL COUNTRIES NOT IN WSCAGREEMENT HANDLE PFC REDUCTIONS?

❷ HOW WILL COMPANIES IN WSCAGREEMENT COUNTRIES HANDLE FABSLOCATED IN NON-AGREEMENTCOUNTRIES?

❸ RECOVERY/RECYCLE WILL BE A MINORPFC STRATEGY.

❹ COST TARGET FOR PURCHASING POUABATEMENT DEVICE FOR DRY ETCH ISUS$20,000 PER CHAMBER. COST TARGETFOR PURCHASING PFC REDUCTIONTECHNOLOGY FOR CVD IS US$40,000 PERCHAMBER.

❶ HOW WILL COUNTRIES NOT IN WSCAGREEMENT HANDLE PFC REDUCTIONS?

❷ HOW WILL COMPANIES IN WSCAGREEMENT COUNTRIES HANDLE FABSLOCATED IN NON-AGREEMENTCOUNTRIES?

❸ RECOVERY/RECYCLE WILL BE A MINORPFC STRATEGY.

❹ COST TARGET FOR PURCHASING POUABATEMENT DEVICE FOR DRY ETCH ISUS$20,000 PER CHAMBER. COST TARGETFOR PURCHASING PFC REDUCTIONTECHNOLOGY FOR CVD IS US$40,000 PERCHAMBER.


❺ ALTERNATIVE CHEMISTRYDEVELOPMENT FOR DRY ETCH WILL BELIMITED FOR EXISTING PROCESSES.THESE EFFORTS WILL BECONCENTRATED ON FUTUREPROCESSES.

❻ PROCESS EQUIPMENT SUPPLIERSAPPEAR TO ONLY SUPPORT 200 MM(AND LARGER) FABS.

❼ SOME SEMICONDUCTORMANUFACTURING COMPANY'S PFCREDUCTION GOALS ARE HIGHER THAN10%.

❺ ALTERNATIVE CHEMISTRYDEVELOPMENT FOR DRY ETCH WILL BELIMITED FOR EXISTING PROCESSES.THESE EFFORTS WILL BECONCENTRATED ON FUTUREPROCESSES.

❻ PROCESS EQUIPMENT SUPPLIERSAPPEAR TO ONLY SUPPORT 200 MM(AND LARGER) FABS.

❼ SOME SEMICONDUCTORMANUFACTURING COMPANY'S PFCREDUCTION GOALS ARE HIGHER THAN10%.

PFC’S - FUTURE (CONTINUED)


ENERGYENERGY

� DUE TO GLOBAL WARMING CONCERNS ANDCONSTANT NEED TO REDUCE COST, ENERGYREDUCTION EFFORTS WILL INCREASE.

� SEMICONDUCTOR COMPANY GOALS ARE BEINGDEVELOPED AND COMMUNICATED.

� PROJECTS ARE BEING CONDUCTED TO GETENERGY USE BASELINES, REDUCE FACILITIESENERGY USAGE, AND REDUCE AIR FLOW.

� WILL THERE BE INTERNATIONAL REDUCTIONS?

� DUE TO GLOBAL WARMING CONCERNS ANDCONSTANT NEED TO REDUCE COST, ENERGYREDUCTION EFFORTS WILL INCREASE.

� SEMICONDUCTOR COMPANY GOALS ARE BEINGDEVELOPED AND COMMUNICATED.

� PROJECTS ARE BEING CONDUCTED TO GETENERGY USE BASELINES, REDUCE FACILITIESENERGY USAGE, AND REDUCE AIR FLOW.

� WILL THERE BE INTERNATIONAL REDUCTIONS?


PLUME OPACITYPLUME OPACITY� AMMONIUM HALIDE PLUMES ARE A

REGULATORY AND/OR VISIBLE ISSUE INPARTS OF THE WORLD.

� THE SOLUTIONS HAVE BEENSUCCESSFULLY IMPLEMENTED TOELIMINATE PLUMES.

� NEW FABS REQUIRE AMMONIA AND ACIDGAS SEGREGATION AND/OR POU DEVICEINSTALLATION. LOWER COSTS IF THIS ISDONE INITIALLY.

� AMMONIUM HALIDE PLUMES ARE AREGULATORY AND/OR VISIBLE ISSUE INPARTS OF THE WORLD.

� THE SOLUTIONS HAVE BEENSUCCESSFULLY IMPLEMENTED TOELIMINATE PLUMES.

� NEW FABS REQUIRE AMMONIA AND ACIDGAS SEGREGATION AND/OR POU DEVICEINSTALLATION. LOWER COSTS IF THIS ISDONE INITIALLY.


AIR EMISSIONS REDUCTIONSAIR EMISSIONS REDUCTIONS� BETTER DESIGNED CENTRALIZED CONTROL

DEVICES

� CHEMICAL USE REDUCTION

� CHEMICAL REPLACEMENTS

� PROCESS CHANGES

� WORK PRACTICES IMPLEMENTATION

� BY-PRODUCTS FROM PROCESSES AND CONTROLDEVICES (BOTH POU AND CENTRALIZED) KNOWNAND MINIMIZED

� BETTER DESIGNED CENTRALIZED CONTROLDEVICES

� CHEMICAL USE REDUCTION

� CHEMICAL REPLACEMENTS

� PROCESS CHANGES

� WORK PRACTICES IMPLEMENTATION

� BY-PRODUCTS FROM PROCESSES AND CONTROLDEVICES (BOTH POU AND CENTRALIZED) KNOWNAND MINIMIZED


WATER REDUCTION/RECYCLEWATER REDUCTION/RECYCLE� WATER REDUCTION IS A RESOURCE

CONSERVATION AND COST REDUCTIONISSUE.

� WATER RECYCLE PROJECTS AREPREVALENT THROUGHOUT THE INDUSTRY.

� RECYCLE OF RECLAIMED DI WATER BACKTO RO/DI PLANT HAS PRODUCED BETTERQUALITY DI WATER.

� WATER REDUCTION IS A RESOURCECONSERVATION AND COST REDUCTIONISSUE.

� WATER RECYCLE PROJECTS AREPREVALENT THROUGHOUT THE INDUSTRY.

� RECYCLE OF RECLAIMED DI WATER BACKTO RO/DI PLANT HAS PRODUCED BETTERQUALITY DI WATER.


FLUORIDE WASTEWATER LIMITSFLUORIDE WASTEWATER LIMITS� IN MANY LOCATIONS FLUORIDE

WASTEWATER DISCHARGE LIMITS AREESTABLISHED BY REGULATORY AGENCIES.

� SEGREGATION OF CONCENTRATEDFLUORIDE PROCESS DISCHARGES ANDSOMETIMES DILUTE PROCESSDISCHARGES.

� FLUORIDE WASTEWATER TREATMENT ONSEGREGATED STREAMS IS A KNOWNTECHNOLOGY.

� IN MANY LOCATIONS FLUORIDEWASTEWATER DISCHARGE LIMITS AREESTABLISHED BY REGULATORY AGENCIES.

� SEGREGATION OF CONCENTRATEDFLUORIDE PROCESS DISCHARGES ANDSOMETIMES DILUTE PROCESSDISCHARGES.

� FLUORIDE WASTEWATER TREATMENT ONSEGREGATED STREAMS IS A KNOWNTECHNOLOGY.


CMP WATER/TREATMENTCMP WATER/TREATMENT

� WATER REDUCTION AND/OR RECYCLE ISREQUIRED TO MINIMIZE COSTS.

� CONTINUED WORK ON DEVELOPING CMPWASTEWATER TREATMENT OPTIONS.

� WATER REDUCTION AND/OR RECYCLE ISREQUIRED TO MINIMIZE COSTS.

� CONTINUED WORK ON DEVELOPING CMPWASTEWATER TREATMENT OPTIONS.


CHEMICAL USE REDUCTIONCHEMICAL USE REDUCTION� CHEMICAL REDUCTION PROJECTS HAVE

BEEN AND CONTINUE TO BE CONDUCTED(REPLACE SULFURIC ACID WITH OZONE,REPLACE NEGATIVE PHOTORESIST WITHPOSITIVE PHOTORESIST, EXTENDINGBATH LIFE, ETC.)

� CHEMICAL RECYCLE: SULFURIC ACID,ISOPROPANOL, ETC.

� CHANGING PROCESS EQUIPMENT

� CHEMICAL REDUCTION PROJECTS HAVEBEEN AND CONTINUE TO BE CONDUCTED(REPLACE SULFURIC ACID WITH OZONE,REPLACE NEGATIVE PHOTORESIST WITHPOSITIVE PHOTORESIST, EXTENDINGBATH LIFE, ETC.)

� CHEMICAL RECYCLE: SULFURIC ACID,ISOPROPANOL, ETC.

� CHANGING PROCESS EQUIPMENT


NEW CHEMICALSNEW CHEMICALS� NEW CHEMICALS ARE BEING REQUIRED

FOR DEVICE MANUFACTURING. HEALTHDATA IS VERY LIMITED.

� HOW DO WE DETERMINE THE CHEMICALPROPERTIES (PHYSICAL, HEALTH, ETC.)WHEN TECHNOLOGY DRIVES NEWCHEMICAL USAGE?

� IS ENGINEERING OUT HAZARDS ENOUGH?

� NEW CHEMICALS ARE BEING REQUIREDFOR DEVICE MANUFACTURING. HEALTHDATA IS VERY LIMITED.

� HOW DO WE DETERMINE THE CHEMICALPROPERTIES (PHYSICAL, HEALTH, ETC.)WHEN TECHNOLOGY DRIVES NEWCHEMICAL USAGE?

� IS ENGINEERING OUT HAZARDS ENOUGH?


FAB FIRE SAFETYFAB FIRE SAFETY

� FAB FIRES HAVE CAUSED INCREASEDACTIVITY.

� PROPER INSTALLATION OF POU DEVICESAND FIRE SUPPRESSION SYSTEMS ARENECESSARY. USE APPROPRIATEMATERIALS OF CONSTRUCTION FOR THEPROCESS APPLICATION AND DUCTWORK.

� FAB FIRES HAVE CAUSED INCREASEDACTIVITY.

� PROPER INSTALLATION OF POU DEVICESAND FIRE SUPPRESSION SYSTEMS ARENECESSARY. USE APPROPRIATEMATERIALS OF CONSTRUCTION FOR THEPROCESS APPLICATION AND DUCTWORK.


SAFETYSAFETY� LOCK-OUT/TAG-OUT

� MACHINE GUARDING (DESIGNING OUTHAZARDS)

� PROPER USE OF SEMI STANDARDS

� ERGONOMICS

� TOXIC GAS MONITORING

� ETC.

� LOCK-OUT/TAG-OUT

� MACHINE GUARDING (DESIGNING OUTHAZARDS)

� PROPER USE OF SEMI STANDARDS

� ERGONOMICS

� TOXIC GAS MONITORING

� ETC.

semiconductor industry ehs - university of arizona

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