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Page 1: October 23 -25 2018 Suzhou -Shenzhen, China Archive€¦ · Session 4 Presentation 3 TestConX China Workshop TestConX.org October 23 & 25, 2018 9 3D Printing Material Flexural Modulus

ArchiveOctober 23 -25 2018

Suzhou - Shenzhen, China

©2018 TestConX - Image: Breath10/iStock

Page 2: October 23 -25 2018 Suzhou -Shenzhen, China Archive€¦ · Session 4 Presentation 3 TestConX China Workshop TestConX.org October 23 & 25, 2018 9 3D Printing Material Flexural Modulus

COPYRIGHT NOTICEThe presentation(s)/poster(s) in this publication comprise the Proceedings of the 2018 TestConX China workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2018 TestConX China workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2018 TestConX China workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by TestConX or the workshop’s sponsors.

There is NO copyright protection claimed on the presentation/poster content by TestConX. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies.

The TestConX China logo and TestConX logo are trademarks of TestConX. All rights reserved.

www.TestConX.org

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

October 23 & 25, 2018TestConX China Workshop TestConX.org

1

Additive Manufacturing Capability Study for Semiconductor Test

ComponentsCody Jacob

Test Tooling Solutions Group

Suzhou ▪ October 23, 2018Shenzhen ▪ October 25, 2018

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

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Contents• Introduction to Additive Manufacturing• History of 3D Printing Technology• 3D Printing Manufacturing Processes• 3D Printing Material Comparison• Strengths and Weaknesses• Sample Part Analysis: Hand Socket Lid • Component Tolerance Analysis• Lessons Learned

Additive Manufacturing Capability Study for Semiconductor Test Components2

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

October 23 & 25, 2018TestConX China Workshop TestConX.org

3

Introduction to Additive Manufacturing

Additive Manufacturing Capability Study for Semiconductor Test Components3

• Additive manufacturing refers to a wide variety of manufacturing methods where a finished part is created from material being solidified, bonded, or deposited through a series of additive steps.– 3D printing is a subset of additive manufacturing which deals more specifically

with plastics and metals being formed in a 3D building space through computer automated machines.

• Recent improvements in 3D printing cost and quality have significantly increased the use of these machines in many markets but our semiconductor test market has been slow to adopt them.

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

October 23 & 25, 2018TestConX China Workshop TestConX.org

4

Prior Studies from the BiTS Community

Additive Manufacturing Capability Study for Semiconductor Test Components4

• “Using Alternate Manufacturing Methods for Rapid Prototyping of Test Sockets”– 2012 BiTS Workshop March 4 - 7, 2012, James Migliaccio RF Micro Devices– This project found some difficulty in printing the hole arrays needed for a socket

and spring probes but it was acceptable for one time use application

• “3D Printed Space Transformers”– BiTS Workshop March 4 - 7, 2018, Don Thompson R&D Altanova– This project used some of the unique geometry available to 3D printers and is an

excellent example of how the technology is shifting thoughts away from rectangular boxes and holes

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

October 23 & 25, 2018TestConX China Workshop TestConX.org

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History of 3D Printing Technology

Additive Manufacturing Capability Study for Semiconductor Test Components5

1980 1990 2000 2010 2020

First machines and processes are invented

Growth and innovation and most parts are used for engineering prototyping Machines are widely available

and technology becomes viable for production quality parts

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

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3D Printing Manufacturing Processes

Additive Manufacturing Capability Study for Semiconductor Test Components6

• FDM – Fused Deposition Modeling– Filament of material is extruded

through a moving nozzle– Most common process, very low

cost, low quality and low durability– Scalable to very large applications

including automobiles, homes, etc.

Image Source: www.makerbot.com

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3D Printing Manufacturing Processes

Additive Manufacturing Capability Study for Semiconductor Test Components7

• SLA, SLS – Stereolithography & Selective Laser Sintering– Laser scans the surface of the material to

harden, melt, and/or cure it– Widest range of materials from durable

polymers to metal alloys– High accuracy and moderate cost

Image Source: www.3dnatives.com

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

October 23 & 25, 2018TestConX China Workshop TestConX.org

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3D Printing Manufacturing Processes

Additive Manufacturing Capability Study for Semiconductor Test Components8

• MJP – Multi Jet Printing– Specialized print heads deposit droplets or particles of material similar to an inkjet printer

which are then cured in place– Limited material choices with highest available accuracy and moderate cost, multi color

printing available

Image Source: www.highlive.org

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3D Printing Material

Flexural Modulus (MPa)

Flexural Strength (MPa)

Tensile Modulus (MPa)

Tensile Strength (MPa)

Elongation at Break

Impact Strength, Notched(J/m)

Heat Deflection Temp(°C)

High Temp SLA 8300-9800 124-154 7600-11700 66-68 1.4-2.4% 13-17 @ 66 PSI - 267-284

High Res SLA 2690-3240 88-110 3200-3380 63-68 5-8% 12-22 @ 66 PSI - 55-58

High Strength SLS 4400-4550 83-89 5475-5725 48-51 4.5% 37.4 @ 66 PSI - 184

High Strength MJP 2168 65 2168 49 8.3% @ 66 PSI - 88Standard MaterialsCeramic PEEK 5500 170 5500 102 5% 35 @ 264 PSI - 316

MDS 100 9790 141 10300 101 1.5% 21 @ 264 PSI - 210

3D Printing Material Comparison

Additive Manufacturing Capability Study for Semiconductor Test Components9

• Polymer materials for SLA and SLS can reach comparable performance to currently used standard materials for contactors and lids

• High temperature material performance is still limited

Sources: www.3dsystems.comwww.matweb.com

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10

3D Printing Process Strengths and Weaknesses

Additive Manufacturing Capability Study for Semiconductor Test Components10

• FDM– Fast, low-cost parts, suitable for prototype checks– Low accuracy, weakest selection of material properties

• SLA, SLS– Moderate cost, high accuracy with widest available material selection, suitable

for prototype or production quality parts depending on application– Not capable of finest detail

• MJP– Moderate cost, high speed, highest accuracy parts– Moderate strength and low temp applications only

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3D Printing Strengths

Additive Manufacturing Capability Study for Semiconductor Test Components11

• 3D printing can create nearly any geometry that a designer can imagine and model in CAD– Shapes and features that are forbidden in traditional

subtractive machining processes are OK for 3D printing:• Undercuts and internal grooves, square or hexagonal

holes, sharp interior corners• Angled and curved surfaces, lattices and meshes, air and

fluid channels, • Negative images of final parts for filling or secondary

processing, Etc. to the limits of your imagination

• Reduced number of steps from design to finished part reduces lead times

Image Source: www.3dprintingprogress.com

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3D Printing Weaknesses

Additive Manufacturing Capability Study for Semiconductor Test Components12

• Limited resolution in high performance material, Z axis less accurate than XY

• Material properties are non isotropic and can change depending on part orientation

• Rough surface finishes require some post processing which can affect tolerance control

• Design methods need to be adapted to a different set of DFM (design for manufacturing) rules

Design intent was for a 1.5mm circular hole near a chamfered 90 degree corner, Z axis steps visible

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13

Sample Part Analysis: Hand Socket Lid

Additive Manufacturing Capability Study for Semiconductor Test Components13

With knowledge of the difficulty in creating the pin arrays for a Test Socket we decided to focus on Hand Socket Lid components for this study

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Sample Part Highlights

Additive Manufacturing Capability Study for Semiconductor Test Components14

Fully functional male/female threaded knob, overall clean parts and assembly

Crossed air flow holes on CNC would require 3 setups to drill on 3 orthogonal planes

Edge features are better for alignment than dowel pins due to hole tolerance

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Sample Part Lowlights

Additive Manufacturing Capability Study for Semiconductor Test Components15

Lettering groove smaller than min feature size

Sanding and material removal in blind holes is difficult

Excessive stepping on draft edges

Rough line where chamfer comes to a sharp edge (thickness < min feature size)

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Additive Manufacturing Capability Study for Semiconductor Test Components16

3D PRINT Cp 1.0 LSL, -0.368

3D PRINT Cp 1.0 USL, 0.352

MACHINED Cp 1.0 LSL, -0.103

MACHINED Cp 1.0 USL, 0.123

-0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4

MEASURMENT DISTRIBUTION - 3D PRINT VS. MACHINING

3D PRINT FREQUENCY 3D PRINT NORMAL DISTRIBUTIONMACHINED FREQUENCY MACHINED NORMAL DISTRIBUTION

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17

Component Tolerance Analysis

Additive Manufacturing Capability Study for Semiconductor Test Components17

• 3D printed parts had a linear tolerance band approximately 3x greater than the machined components– 3D print data was clustered close to the machining data but had more outliers

spreading the distribution– Outliers are mostly contributed by areas of the part that fell outside DFM

guidelines for 3D printing such as corner relief radii, thin edges on chamfers, etc.

• Tolerance deviations did not have a negative affect on the overall form, fit and function of the assembly indicating that lid most components can generally allow for extra linear tolerance

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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 3

October 23 & 25, 2018TestConX China Workshop TestConX.org

18

Lessons Learned

Additive Manufacturing Capability Study for Semiconductor Test Components18

• 3D printing requires a new dedicated set of design rules to maximize the benefits of the unique geometry available while minimizing deviations from minimum feature size restrictions– Many design requirements that are needed for machining can be removed or

simplified with 3D printed parts, speeding the design process and allowing for more robust designs

• We will continue to study the functionality and longevity of 3D printed parts to find knew ways to use them in other assemblies

• With proof of concept complete the door is open for novel new designs and test technology using this emerging manufacturing method that will continue to advance in coming years