october 29, 2019 intercontinental shanghai pudonghotel archive€¦ · session 3 presentation 1...

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October 29, 2019

InterContinental Shanghai Pudong Hotel

Extreme TestingTestConX China 2019Session 3 Presentation 1

October 29, 2019TestConX China Workshop TestConX.org

1

Cooling Solution for IC Device Testing

Terence Miao, Quynh NguyenSmiths interconnect

Shanghai ▪ October 29, 2019



2

Agenda

• Background • Heat Transfer• Structure • Natural Convection• Force Convection (Fan)

Cooling Solution for IC Device Testing2

• Force Convection (Liquid Cooling)

• Force Convection (Fan W/heat pipe)

• Conclusion



3

Background


• Billions of transistors.• Higher Power, Higher

Dissipation– Test socket probes damage.– IC thermal breakdown &

thermal runaway.– PCB thermal runway.



4

Heat Transfer


Sometime have phase changes while heat is being transferred.



5

Structure


• Device can be cooled from bottom side by PCB ground layers.

• Also, device can be cooled from top side by Hand Socket Lid (HSL) for Manual test and Work Press for Handler test.

• HSL or Work Press will have heatsink for heat dissipation by natural or force convection.



6

Natural Convection


Touching surface: Conduction Fins Area: ConvectionAir flow holesMTG holes

Power: LowHeatsink material: Aluminum, Copper



7

Natural Convection


Simulated the two different Contact Areaof heatsink & IC top surface.

Definition: Design A1: Area 16.5 mm X 16.5 mmDesign A2: Area 10.0 mm X 10.0 mmHeat resource: 8 W



8

Natural Convection


Design A1 Design A2



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Natural Convection Result (conduction)

Item Design A1 Design A2Max Temp.(℃) 97.1 100.5


q = - kA 𝛻T• q = heat flow vector, (W)• k = thermal conductivity, a thermodynamic property of the

material. (W/m K)• A = Cross sectional area in direction of heat flow. (m^2)• 𝛻 T = Gradient of temperature (K/m)• = ∂T/∂xi + ∂T/∂yj + ∂T/∂zk



10

Natural Convection


Heatsink can have wall fins, cross-cut fins or cylindrical fins.Refer to top views below for heatsink fins/types:

Design B1 Wall fins

Design B2Cross-cut fins

Design B3Cylindrical fins



11

Natural Convection


Design B1 Design B2 Design B3



12

Natural Convection Result (convection)

Item Design B1 Design B2 Design B3

Max Temp.(℃) 97.1 87.5 77.1


Newton’s Law of Cooling: q = h As ∆T• q = heat flow from surface, a scalar, (W)• h = heat transfer coefficient (which is not a thermodynamic property of the

material, but may depend on geometry of surface, flow characteristics, thermodynamic properties of the fluid, etc. (W/m^2 K)

• As = Surface area from which convection is occurring. (m^2 )• ∆T = TS – T∞ = Temperature Difference between surface and coolant. (K)



13

Force Convection: Fan


IC power: MediumComponent: Fan, Heat sinkMedia: Air



14



Axial fans are recommended in force convection to cool the device.

Definition: Design C1: Fan 1 Max airflow 10.10 cfm. Design C2: Fan 2 Max airflow 31.30 cfm.Heat resource 20 W



15



Design C1 Design C2



16


item Design C1 Design C2

Max Temp.(℃) 61.0 47.4


Newton’s Law of Cooling: q = h As ∆T

h = heat transfer coefficient (which is not a thermodynamic property of the material, but may depend on geometry of surface, flow characteristics, thermodynamic properties of the fluid, etc. (W/m2K)



17

Force Convection: Liquid Cooling


IC power: HighComponent: Pump, Heat sink Media: Water



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Series grooves: The three paths carry water one by one. Heat resource 300 W, die size 23 X 23 mm2.

Design D1



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Parallel grooves: 3 paths have a same start point.Heat resource 300 W die size 23X23 mm2.

Design D2



20


item Design D1 Design D2

Max Temp.(℃) 54.4 49.6


Newton’s Law of Cooling: q = h As ∆T

h = heat transfer coefficient (which is not a thermodynamic property of the material, but may depend on geometry of surface, flow characteristics, thermodynamic properties of the fluid (like as specific heat, thermal conductivity), etc. (W/m2K)



21

Force Convection: Comparison


Air Water

0

500

1000

1500

2000

2500

3000

3500

0 30 60 90 120 150 180

Spec

ific

heat

(Cp)

[J/(k

g*K

)]

Temperature[°C]

4150

4200

4250

4300

4350

4400

4450

4500

0 30 60 90 120 150 180Sp

ecifi

c he

at (C

p)[J

/(kg*

K)]

Temperature[°C]

Cp-water ≈ 4.2X Cp-air



22

Force Convection: Comparison


0

0.01

0.02

0.03

0.04

0.05

0 50 100 150 200

Ther

mal

con

duct

ivity

[W/(m

*K)]

Temperature[°C]

0.30

0.40

0.50

0.60

0.70

0.80

0 50 100 150 200

Ther

mal

con

duct

ivity

[W/(m

*K)]

Temperature[°C]

Air Water

K-water ≈ 30X K-air



23

Force Convection: Fan W/Heat pipe


IC power: high

Component: Fan, HS(heat pipe)+ Fins

Media: Air



24



Several heat pipesFinsFanothers



25

Heat Pipe


• Enclosed tube (Copper)• liquids • Phases change• Evaporation-Condensation cycle• Low heat loss



26



IC heat resource: 100 WDie size 19X18 mm2

Design E1: Heat PipesDesign E2: Copper Rods



27



Design E1 Design E2

526.5 ºC



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item Design E1 Design E2

Max Temp.(℃) 74.9 526.5


Material: E2 is using Copper rods. Copper thermal conductivity is 398 W/(m·K), while heat pipe thermal conductivity is over 10000 W/(m·K). Structure: E1 heat pipes internal liquids change phases while transferring heat but copper pipes not.Since heat pipes utilize phase changes process and benefit from very high heat transfer coefficients during boiling and condensation stages. therefore, heat pipes thermal conductivity is 10x greater than copper. Hence, heat pipes are highly effective thermal conductors.



29

Conclusion


• Fan cooling is using force air convection to improve performance.

• Water cooling is using water special specific heat property to get high performance.

• Heat pipes can transfer amount of heat from one end to another by internal liquids phase change.

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october 29, 2019 intercontinental shanghai pudonghotel archive€¦ · session 3 presentation 1...

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