ads1294 24 bits

Control

CL

KG

PIO

AN

D C

ON

TR

OL

Oscillator

SPI

Test Signals and

Monitors

PACE

SP

I

RLD

Wilson

TerminalWCT

Reference

REF

ADC7

ADC8

ADC1

ADC2

ADC3

ADC4

ADC5

ADC6

A7

A8

A1

A2

A3

A4

A5

A6

MUX

INP

UT

S

¼ ¼

¼

To Channel

RESP

Resp

RESP

DEMOD

ADS129xR

ADS129xR

ADS1294, ADS1294RADS1296, ADS1296RADS1298, ADS1298R

www.ti.com SBAS459I –JANUARY 2010–REVISED JANUARY 2012

Low-Power, 8-Channel, 24-Bit Analog Front-End for Biopotential MeasurementsCheck for Samples: ADS1294, ADS1294R, ADS1296, ADS1296R, ADS1298, ADS1298R

With its high levels of integration and exceptional1FEATURES

performance, the ADS1294/6/8/4R/6R/8R family23• Eight Low-Noise PGAs and Eight enables the development of scalable medical

High-Resolution ADCs (ADS1298, ADS1298R) instrumentation systems at significantly reduced size,• Low Power: 0.75mW/channel power, and overall cost.• Input-Referred Noise: 4μVPP (150Hz BW, G = 6) The ADS1294/6/8/4R/6R/8R have a flexible input

multiplexer per channel that can be independently• Input Bias Current: 200pAconnected to the internally-generated signals for test,• Data Rate: 250SPS to 32kSPStemperature, and lead-off detection. Additionally, any

• CMRR: –115dB configuration of input channels can be selected for• Programmable Gain: 1, 2, 3, 4, 6, 8, or 12 derivation of the right leg drive (RLD) output signal.

The ADS1294/6/8/4R/6R/8R operate at data rates as• Supports AAMI EC11, EC13, IEC60601-1,high as 32kSPS, thereby allowing the implementationIEC60601-2-27, and IEC60601-2-51 Standardsof software PACE detection. Lead-off detection can

• Unipolar or Bipolar Supplies: be implemented internal to the device, either with aAVDD = 2.7V to 5.25V, DVDD = 1.65V to 3.6V pull-up/pull-down resistor or an excitation current

sink/source. Three integrated amplifiers generate the• Built-In Right Leg Drive Amplifier, Lead-OffWilson Central Terminal (WCT) and the GoldbergerDetection, WCT, PACE Detection, Test SignalsCentral Terminals (GCT) required for a standard• Integrated Respiration Impedance12-lead ECG. The ADS1294R/6R/8R versions

Measurement (ADS1294R/6R/8R only) include a fully-integrated, respiration impedance• Digital PACE Detection Capability measurement function.• Built-In Oscillator and Reference Multiple ADS1294/6/8/4R/6R/8R devices can be• Flexible Power-Down, Standby Modes cascaded in high channel count systems in a

daisy-chain configuration.• SPI™-Compatible Serial InterfacePackage options include a tiny 8mm × 8mm, 64-ball• Operating Temperature Range:BGA and a TQFP-64. The ADS1294/6/8 BGA version–40°C to +85°Cis specified over the commercial temperature range of0°C to +70°C. The ADS1294R/6R/8R BGA andAPPLICATIONSADS1294/6/8 TQFP versions are specified over the

• Medical Instrumentation (ECG, EMG and EEG): industrial temperature range of –40°C to +85°C.Patient monitoring; Holter, event, stress, andvital signs including ECG, AED, telemedicineBispectral index (BIS), Evoked audio potential(EAP), Sleep study monitor

• High-Precision, Simultaneous, MultichannelSignal Acquisition

DESCRIPTIONThe ADS1294/6/8/4R/6R/8R are a family ofmultichannel, simultaneous sampling, 24-bit,delta-sigma (ΔΣ) analog-to-digital converters (ADCs)with built-in programmable gain amplifiers (PGAs),internal reference, and an onboard oscillator. TheADS1294/6/8/4R/6R/8R incorporate all of the featuresthat are commonly required in medicalelectrocardiogram (ECG) and electroencephalogram(EEG) applications.1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2SPI is a trademark of Motorola.3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Copyright © 2010–2012, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

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ADS1294, ADS1294RADS1296, ADS1296RADS1298, ADS1298RSBAS459I –JANUARY 2010–REVISED JANUARY 2012 www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

FAMILY AND ORDERING INFORMATION (1)

MAXIMUM OPERATINGPACKAGE NUMBER OF ADC SAMPLE RATE TEMPERATURE RESPIRATION

PRODUCT OPTION CHANNELS RESOLUTION (kSPS) RANGE CIRCUITRY

BGA 4 16 8 0°C to +70°C NoADS1194

TQFP 4 16 8 0°C to +70°C No

BGA 6 16 8 0°C to +70°C NoADS1196

TQFP 6 16 8 0°C to +70°C No

BGA 8 16 8 0°C to +70°C NoADS1198

TQFP 8 16 8 0°C to +70°C No

ADS1294 BGA 4 24 32 0°C to +70°C External

ADS1294R BGA 4 24 32 –40°C to +85°C Yes

ADS1294 TQFP 4 24 32 –40°C to +85°C External


ADS1296R BGA 6 24 32 –40°C to +85°C Yes



ADS1298R BGA 8 24 32 –40°C to +85°C Yes


(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit thedevice product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS (1)

Over operating free-air temperature range, unless otherwise noted.

ADS1294, ADS1296, ADS1298 UNITADS1294R, ADS1296R, ADS1298R

AVDD to AVSS –0.3 to +5.5 V

DVDD to DGND –0.3 to +3.9 V

AVSS to DGND –3 to +0.2 V

VREF input to AVSS AVSS – 0.3 to AVDD + 0.3 V

Analog input to AVSS AVSS – 0.3 to AVDD + 0.3 V

Digital input voltage to DGND –0.3 to DVDD + 0.3 V

Digital output voltage to DGND –0.3 to DVDD + 0.3 V

Input current (momentary) 100 mA

Input current (continuous) 10 mA

Commerical Grade: ADS1294, ADS1296, ADS1298 0 to +70 °COperatingtemperature Industrial grade: ADS1294I, ADS1296I, ADS1298I, –40 to +85 °Crange ADS1294RI, ADS1296RI, ADS1298RI

Human body model (HBM) ±2000 VJEDEC standard 22, test method A114-C.01, all pinsESD ratings

Charged device model (CDM) ±500 VJEDEC standard 22, test method C101, all pins

Storage temperature range –60 to +150 °CMaximum junction temperature (TJ) +150 °C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods maydegrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyondthose specified is not implied.

2 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated

Product Folder Link(s): ADS1294 ADS1294R ADS1296 ADS1296R ADS1298 ADS1298R







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ELECTRICAL CHARACTERISTICSMinimum/maximum specifications apply for all commercial grade (0°C to +70°C) devices and from –40°C to +85°C forindustrial grades devices. Typical specifications are at +25°C. All specifications at DVDD = 1.8V, AVDD – AVSS = 3V (1),VREF = 2.4V, external fCLK = 2.048MHz, data rate = 500SPS, High-Resolution mode, and gain = 6, unless otherwise noted.

ADS1294, ADS1296, ADS1298ADS1294R, ADS1296R, ADS1298R

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ANALOG INPUTS

Full-scale differential input voltage (AINP – AINN) ±VREF/GAIN V

See the Input Common-Mode RangeInput common-mode range subsection of the PGA Settings and Input

Range section

Input capacitance 20 pF

TA = +25°C, input = 1.5V ±200 pA

Input bias current TA = 0°C to +70°C, input = 1.5V ±1 nA

TA = –40°C to +85°C, input = 1.5V ±1.2 nA

No lead-off 1000 MΩ

DC input impedance Current source lead-off detection 500 MΩ

Pull-up resistor lead-off detection 10 MΩ

PGA PERFORMANCE

Gain settings 1, 2, 3, 4, 6, 8, 12

Bandwidth See Table 6

ADC PERFORMANCE

Data rates up to 8kSPS, no missing codes 24 Bits

Resolution 16kSPS data rate 19 Bits

32kSPS data rate 17 Bits

fCLK = 2.048MHz, High-Resolution mode 500 32000 SPSData rate

fCLK = 2.048MHz, Low-Power mode 250 16000 SPS

CHANNEL PERFORMANCE

DC Performance

Gain = 6 (2), 10 seconds of data 5 μVPP

Gain = 6, 256 points, 0.5 seconds of data 4 7 μVPPInput-referred noiseGain settings other than 6, data rates other See Noise Measurements sectionthan 500SPS

Full-scale with gain = 6, best fit 8 ppm

Full-scale with gain = 6, best fit, 40 ppmIntegral nonlinearity ADS1294R/6R/8R channel 1

–20dBFS with gain = 6, best fit, 8 ppmADS1294R/6R/8R channel 1

Offset error ±500 µV

Offset error drift 2 µV/°C

Gain error Excluding voltage reference error ±0.2 ±0.5 % of FS

Gain drift Excluding voltage reference drift 5 ppm/°C

Gain match between channels 0.3 % of FS

(1) Performance is applicable for 5V operation as well. Production testing for limits is performed at 3V.(2) Noise data measured in a 10-second interval. Test not performed in production. Input-referred noise is calculated with input shorted

(without electrode resistance) over a 10-second interval.

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ELECTRICAL CHARACTERISTICS (continued)Minimum/maximum specifications apply for all commercial grade (0°C to +70°C) devices and from –40°C to +85°C forindustrial grades devices. Typical specifications are at +25°C. All specifications at DVDD = 1.8V, AVDD – AVSS = 3V(1),VREF = 2.4V, external fCLK = 2.048MHz, data rate = 500SPS, High-Resolution mode, and gain = 6, unless otherwise noted.



CHANNEL PERFORMANCE (continued)

AC Performance

Common-mode rejection ratio (CMRR) fCM = 50Hz, 60Hz (3) –105 –115 dB

Power-supply rejection ratio (PSRR) fPS = 50Hz, 60Hz 90 dB

Crosstalk fIN = 50Hz, 60Hz –126 dB

Signal-to-noise ratio (SNR) fIN = 10Hz input, gain = 6 112 dB

10Hz, –0.5dBFs –98 dB

ADS1294R/6R/8R channel 1, 10Hz, –0.5dBFs –70 dB

100Hz, –0.5dBFs (4) –100 dBTotal harmonic distortion (THD)

ADS1294R/6R/8R channel 1, –68 dB100Hz, –0.5dBFs (4)

ADS1294R/6R/8R channel 1, –86 dB100Hz, –20dBFs (4)

DIGITAL FILTER

–3dB bandwidth 0.262fDR Hz

Digital filter settling Full setting 4 Conversions

RIGHT LEG DRIVE (RLD) AMPLIFIER AND PACE AMPLIFIERS

RLD integrated noise BW = 150Hz 7 μVRMS

PACE integrated noise BW = 8kHz 20 µVRMS

PACE amplifier crosstalk Crosstalk between PACE amplifiers 60 dB

Gain bandwidth product 50kΩ || 10pF load, gain = 1 100 kHz

Slew rate 50kΩ || 10pF load, gain = 1 0.25 V/μs

Short-circuit to GND (AVDD = 3V) 270 μA

Short-circuit to supply (AVDD = 3V) 550 μAPACE and RLD amplifier drive strength

Short-circuit to GND (AVDD = 5V) 490 μA

Short-circuit to supply (AVDD = 5V) 810 μA

Peak swing (AVSS + 0.3V to AVDD + 0.3V) 50 μAat AVDD = 3VPACE and RLD current

Peak swing (AVSS + 0.3V to AVDD + 0.3V) 75 μAat AVDD = 5V

PACE amplifier output resistance 100 Ω

Total harmonic distortion fIN = 100Hz, gain = 1 –70 dB

Common-mode input range AVSS + 0.7 AVDD – 0.3 V

Common-mode resistor matching Internal 200kΩ resistor matching 0.1 %

Short-circuit current ±0.25 mA

Quiescent power consumption Either RLD or PACE amplifier 20 μA

WILSON CENTRAL TERMINAL (WCT) AMPLIFIER

Integrated noise BW = 150Hz See Table 5 nV/√Hz

Gain bandwidth product See Table 5 kHz

Slew rate See Table 5 V/s

Total harmonic distortion fIN = 100Hz 90 dB

Common-mode input range AVSS + 0.3 AVDD – 0.3 V

Short-circuit current Through internal 30kΩ resistor ±0.25 mA

Quiescent power consumption See Table 5 μA

(3) CMRR is measured with a common-mode signal of AVSS + 0.3V to AVDD – 0.3V. The values indicated are the maximum of the eightchannels.

(4) Harmonics above the second harmonic are attenuated by the digital filter.









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LEAD-OFF DETECT

Frequency See the Register Map section for settings 0, fDR/4 kHz

Current See the Register Map section for settings 6, 12, 18, 24 nA

Current accuracy ±20 %

Comparator threshold accuracy ±30 mV

RESPIRATION (ADS1294R/6R/8R Only)

Internal source 32, 64 kHzFrequency

External source 32 64 kHz

Phase shift See the Register Map section for settings 22.5 90 157.5 Degrees

Impedance range IRESP = 30μA 10 kΩ

0.05Hz to 2Hz brick wall filter, 32kHzmodulation clock, phase = 112.5,Impedance measurement noise 20 mΩPPusing IRESP = 30μA with 2kΩ baseline load,gain = 4 test condition

internal reference, signal path = 82kΩ,Modulator current 29 µAbaseline = 2.21kΩ

EXTERNAL REFERENCE

3V supply VREF = (VREFP – VREFN) 2.5 VReference input voltage

5V supply VREF = (VREFP – VREFN) 4.0 V

Negative input (VREFN) AVSS V

Positive input (VREFP) AVSS + 2.5 V

Input impedance 10 kΩ

INTERNAL REFERENCE

Register bit CONFIG3.VREF_4V = 0, 2.4 VAVDD ≥ 2.7VOutput voltage

Register bit CONFIG3.VREF_4V = 1, 4.0 VAVDD ≥ 4.4V

VREF accuracy ±0.2 %

TA = +25°C 35 ppm/°C

Internal reference drift Commerical grade, 0°C to +70°C 35 ppm

Industrial grade, –40°C to +85°C 45 ppm

Start-up time 150 ms

SYSTEM MONITORS

Analog supply reading error 2 %

Digital supply reading error 2 %

From power-up to DRDY low 150 msDevice wake up

STANDBY mode 9 ms

Temperature sensor reading, voltage TA = +25°C 145 mV

Temperature sensor reading, coefficient 490 μV/°C

Test Signal

Signal frequency See Register Map section for settings HzfCLK/221, fCLK/220

Signal voltage See Register Map section for settings ±1, ±2 mV

Accuracy ±2 %









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CLOCK

Internal oscillator clock frequency Nominal frequency 2.048 MHz

TA = +25°C ±0.5 %

0°C ≤ TA ≤ +70°C ±2 %Internal clock accuracy–40°C ≤ TA ≤ +85°C, ±2.5 %ADS1298I industrial grade version only

Internal oscillator start-up time 20 μs

Internal oscillator power consumption 120 μW

External clock input frequency CLKSEL pin = 0 1.94 2.048 2.25 MHz

DIGITAL INPUT/OUTPUT (DVDD = 1.65V to 3.6V)

Logic level

VIH 0.8DVDD DVDD + 0.1 V

VIL –0.1 0.2DVDD V

VOH IOH = –500μA DVDD – 0.4 V

VOL IOL = +500μA 0.4 V

Input current (IIN) 0V < VDigitalInput < DVDD –10 +10 μA

POWER-SUPPLY REQUIREMENTS

Analog supply (AVDD – AVSS) 2.7 3.0 5.25 V

Digital supply (DVDD) 1.65 1.8 3.6 V

AVDD – DVDD –2.1 3.6 V

SUPPLY CURRENT (RLD, WCT, and PACE Amplifiers Turned Off)

High-Resolution mode (ADS1298)

AVDD – AVSS = 3V 2.75 mAIAVDD

AVDD – AVSS = 5V 3.1 mA

DVDD = 3.0V 0.5 mAIDVDD

DVDD = 1.8V 0.3 mA

Low-Power mode (ADS1298)

AVDD – AVSS = 3V 1.8 mAIAVDD

AVDD – AVSS = 5V 2.1 mA

DVDD = 3.0V 0.5 mAIDVDD

DVDD = 1.8V 0.3 mA

POWER DISSIPATION (Analog Supply = 3V, RLD, WCT, and PACE Amplifiers Turned Off)

Quiescent power dissipation

High-Resolution mode 8.8 9.5 mWADS1298/8R

Low-Power mode (250SPS) 6.0 7.0 mW

High-Resolution mode 7.2 7.9 mWADS1296/6R

Low-Power mode 5.3 6.6 mW

High-Resolution mode 5.4 6 mWADS1294/4R

Low-Power mode 4.1 4.4 mW

Power-down 10 μW

Standby mode 2 mW

Quiescent channel power PGA + ADC 818 μW









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POWER DISSIPATION (Analog Supply = 5V, RLD, WCT, and PACE Amplifiers Turned Off)

Quiescent power dissipation

High-Resolution mode 17.5 mWADS1298/8R

Low-Power mode 12.5 mW


Low-Power mode 10 mW


Low-Power mode 8.3 mW

Power-down 20 μW

Standby mode 4 mW

Quiescent channel power PGA + ADC 1.5 mW

TEMPERATURE

Specified temperature range 0 +70 °C

Operating temperature range 0 +70 °C

Specified temperature range –40 +85 °C(industrial grade only)

Operating temperature range –40 +85 °C(industrial grade only)

Storage temperature range –60 +150 °C

THERMAL INFORMATIONADS1294/6/8/ADS1294/6/8 4R/6R/8R

THERMAL METRIC (1) UNITSPAG ZXG

64 PINS 64 PINS

θJA Junction-to-ambient thermal resistance 35 48

θJCtop Junction-to-case (top) thermal resistance 31 8

θJB Junction-to-board thermal resistance 26 25°C/W

ψJT Junction-to-top characterization parameter 0.1 0.5

ψJB Junction-to-board characterization parameter — 22

θJCbot Junction-to-case (bottom) thermal resistance — —

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.









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NOISE MEASUREMENTS

NOTEThe ADS1294R/6R/8R channel performance differs from the ADS1294/6/8 in regards torespiration circuitry found on channel one. Unless otherwise noted, ADS129x refers to allspecifications and functional descriptions of the ADS1294, ADS1296, ADS1298,ADS1294R, ADS1296R, and ADS1298R.

The ADS129x noise performance can be optimized by adjusting the data rate and PGA setting. As the averagingis increased by reducing the data rate, the noise drops correspondingly. Increasing the PGA value reduces theinput-referred noise, which is particularly useful when measuring low-level biopotential signals. Table 1 andTable 2 summarize the noise performance of the ADS129x in the High-Resolution (HR) mode and Low-Power(LP) mode, respectively, with a 3V analog power supply. Table 3 and Table 4 summarize the noise performanceof the ADS129x in the HR mode and LP mode, respectively, with a 5V analog power supply. The data arerepresentative of typical noise performance at TA = +25°C. The data shown are the result of averaging thereadings from multiple devices and are measured with the inputs shorted together. A minimum of 1000consecutive readings are used to calculate the RMS and peak-to-peak noise for each reading. For the twohighest data rates, the noise is limited by quantization noise of the ADC and does not have a gaussiandistribution. Thus, the ratio between rms noise and peak-to-peak noise is approximately 10. For the lower datarates, the ratio is approximately 6.6.

Table 1 to Table 4 show measurements taken with an internal reference. The data are also representative of theADS129x noise performance when using a low-noise external reference such as the REF5025.

Table 1. Input-Referred Noise (μVRMS/μVPP) in High-Resolution Mode3V Analog Supply and 2.4V Reference (1)

DR BITS OF OUTPUT –3dBCONFIG1 DATA RATE BANDWIDTH PGA PGA PGA PGA PGA PGA PGA

REGISTER (SPS) (Hz) GAIN = 1 GAIN = 2 GAIN = 3 GAIN = 4 GAIN = 6 GAIN = 8 GAIN = 12

000 32000 8398 335/3553 168/1701 112/1100 85/823 58/529 42.5/378 28.6/248

001 16000 4193 56/613 28/295 18.8/188 14.3/143 9.7/94 7.4/69 5.2/44.3

010 8000 2096 12.4/111 6.5/54 4.5/37.9 3.5/29.7 2.6/21.7 2.2/17.8 1.8/13.8

011 4000 1048 6.1/44.8 3.2/23.3 2.4/17.1 1.9/14.0 1.5/11.1 1.3/9.7 1.2/8.5

100 2000 524 4.1/27.8 2.2/15.4 1.6/11.0 1.3/9.1 1.1/7.3 1.0/6.5 0.9/6.0

101 1000 262 2.9/19.0 1.6/10.1 1.2/7.5 1.0/6.2 0.8/5.0 0.7/4.6 0.6/4.1

110 500 131 2.1/12.5 1.1/6.8 0.9/5.1 0.7/4.3 0.6/3.5 0.5/3.1 0.5/2.9

(1) At least 1000 consecutive readings were used to calculate the RMS and peak-to-peak noise values in this table.

Table 2. Input-Referred Noise (μVRMS/μVPP) in Low-Power Mode3V Analog Supply and 2.4V Reference (1)



000 16000 4193 333/3481 166/1836 111/1168 84/834 56/576 42/450 28/284

001 8000 2096 56/554 28/272 19/177 14.3/133 9.7/85 7.4/64 5.0/42.4

010 4000 1048 12.5/99 6.5/51 4.5/35.0 3.4/25.9 2.4/18.8 2.0/14.5 1.5/11.3

011 2000 524 6.1/41.8 3.2/22.2 2.3/15.9 1.8/12.1 1.4/9.3 1.2/7.8 1.0/6.7

100 1000 262 4.1/26.3 2.2/14.6 1.6/9.9 1.3/8.1 1.0/6.2 0.8/5.4 0.7/4.7

101 500 131 3.0/17.9 1.6/9.8 1.1/6.8 0.9/5.7 0.7/4.2 0.6/3.6 0.5/3.4

110 250 65 2.1/11.9 1.1/6.3 0.8/4.6 0.7/4.0 0.5/3.0 0.5/2.6 0.4/2.4










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Table 3. Input-Referred Noise (μVRMS/μVPP) in High-Resolution Mode5V Analog Supply and 4V Reference (1)



000 32000 8398 521/5388 260/2900 173/1946 130/1403 87/917 65/692 44/483

001 16000 4193 86/1252 43/633 29/402 22/298 15/206 11/141 7/91

010 8000 2096 17/207 9/112 6/71 4/57 3/36 3/29 2/18

011 4000 1048 6.4/48.2 3.4/25.9 2.417.7 1.9/15.4 1.5/11.2 1.3/9.6 1.1/8.2

100 2000 524 4.2/29.9 2.3/15.9 1.6/11.1 1.3/9.3 1.0/7.5 0.9/6.6 0.8/5.8

101 1000 262 2.9/18.8 1.6/10.4 1.1/7.8 0.9/6.1 0.7/4.9 0.6/4.7 0.6/3.9

110 500 131 2.0/12.8 1.1/7.2 0.8/5.2 0.7/4.0 0.5/3.3 0.5/3.3 0.4/2.7


Table 4. Input-Referred Noise (μVRMS/μVPP) in Low-Power Mode5V Analog Supply and 4V Reference (1)



000 16000 4193 526/5985 263/2953 175/1918 132/1410 88/896 66/681 44/458

001 8000 2096 88/1201 44/619 29/411 22/280 15/191 11/139 7/83

010 4000 1048 17/208 9/103 6/62 4/52 3/37 2/25 2/16

011 2000 524 6.0/41.1 3.3/23.3 2.2/15.5 1.8/12.3 1.3/9.8 1.1/7.8 0.9/6.5

100 1000 262 4.1/27.1 2.3/14.8 1.5/10.1 1.2/8.1 0.9/6.0 0.8/5.4 0.7/4.4

101 500 131 2.9/17.4 1.6/9.6 1.1/6.6 0.9/5.9 0.7/4.3 0.6/3.4 0.5/3.2

110 250 65 2.1/11.9 1.1/6.6 0.8/4.6 0.6/3.7 0.5/3.0 0.4/2.5 0.4/2.2


Table 5. Typical WCT Performance

ANY ONE ANY TWO ALL THREEPARAMETER (A, B, or C) (A+B, A+C, or B+C) (A+B+C) UNIT

Integrated noise 540 382 312 nVRMS

Power 53 59 65 μW

–3dB BW 30 59 89 kHz

Slew rate BW limited BW limited BW limited —









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1

2

3

4

5

6

7

8

H G F E D C B A

IN8PIN7PIN6PIN5PIN4PIN3PIN2PIN1P

IN8NIN7NIN6NIN5NIN4NIN3NIN2NIN1N

RLDINRLDOUTRLDINVWCT

TESTP_PACE_OUT1

TESTN_PACE_OUT2VCAP4VREFP

AVDDAVDDRLDREFAVSSRESV1RESP_MODN

RESP_MODPVREFN

AVSSAVSSAVSSAVSSGPIO4GPIO1PWDNVCAP1

AVDDAVDDAVDDDRDYGPIO3DAISY_INRESETVCAP2

AVDD1VCAP3DGNDDGNDGPIO2CSSTARTDGND

AVSS1CLKSELDVDDDVDDDOUTSCLKCLKDIN


PIN CONFIGURATIONS

ZXG PACKAGEBGA-64

(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)

BGA PIN ASSIGNMENTSNAME TERMINAL FUNCTION DESCRIPTION

IN8P (1) 1A Analog input Differential analog positive input 8 (ADS1298/8R)

IN7P (1) 1B Analog input Differential analog positive input 7 (ADS1298/8R)

IN6P (1) 1C Analog input Differential analog positive input 6 (ADS1296/8/6R/8R)

IN5P (1) 1D Analog input Differential analog positive input 5 (ADS1296/8/6R/8R)

IN4P (1) 1E Analog input Differential analog positive input 4

IN3P (1) 1F Analog input Differential analog positive input 3

IN2P (1) 1G Analog input Differential analog positive input 2

IN1P (1) 1H Analog input Differential analog positive input 1

IN8N (1) 2A Analog input Differential analog negative input 8 (ADS1298/8R)

IN7N (1) 2B Analog input Differential analog negative input 7 (ADS1298/8R)

IN6N (1) 2C Analog input Differential analog negative input 6 (ADS1296/8/6R/8R)

IN5N (1) 2D Analog input Differential analog negative input 5 (ADS1296/8/6R/8R)

IN4N (1) 2E Analog input Differential analog negative input 4

IN3N (1) 2F Analog input Differential analog negative input 3

IN2N (1) 2G Analog input Differential analog negative input 2

IN1N (1) 2H Analog input Differential analog negative input 1

(1) Connect unused terminals to AVDD.









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BGA PIN ASSIGNMENTS (continued)NAME TERMINAL FUNCTION DESCRIPTION

RLDIN (2) 3A Analog input Right leg drive input to MUX

RLDOUT 3B Analog output Right leg drive output

RLDINV 3C Analog input/output Right leg drive inverting input

WCT 3D Analog output Wilson Central Terminal output

TESTP_PACE_OUT1 (2) 3E Analog input/buffer output Internal test signal/single-ended buffer output based on register settings

TESTN_PACE_OUT2 (2) 3F Analog input/output Internal test signal/single-ended buffer output based on register settings

VCAP4 3G Analog output Analog bypass capacitor

VREFP 3H Analog input/output Positive reference voltage

AVDD 4A Supply Analog supply

AVDD 4B Supply Analog supply

RLDREF 4C Analog input Right leg drive noninverting input

AVSS 4D Supply Analog ground

RESV1 4E Digital input Reserved for future use; must tie to logic low (DGND).

ADS1294R/6R/8R: modulation clock for respiration measurement, negativeRESP_MODN 4F Analog output side.

ADS1294/6/8: leave floating.

ADS1294R/6R/8R: modulation clock for respiration measurement, positiveRESP_MODP 4G Analog output side.

ADS1294/6/8: leave floating.

VREFN 4H Analog input Negative reference voltage

AVSS 5A Supply Analog ground

AVSS 5B Supply Analog ground

AVSS 5C Supply Analog ground

AVSS 5D Supply Analog ground

GPIO4 5E Digital input/output GPIO4 in normal mode

GPIO1 5F Digital input/output General purpose input/output pin

PWDN 5G Digital input Power-down; active low

VCAP1 5H Analog input/output Analog bypass capacitor

AVDD 6A Supply Analog supply

AVDD 6B Supply Analog supply

AVDD 6C Supply Analog supply

DRDY 6D Digital output Data ready; active low

GPIO3 6E Digital input/output GPIO3 in normal mode

DAISY_IN 6F Digital input Daisy-chain input; if not used, short to DGND.

RESET 6G Digital input System reset; active low

VCAP2 6H — Analog bypass capacitor

AVDD1 7A Supply Analog supply for charge pump

VCAP3 7B — Analog bypass capacitor; internally generated AVDD + 1.9V.

DGND 7C Supply Digital ground

DGND 7D Supply Digital ground

GPIO2 7E Digital input/output General-purpose input/output pin

CS 7F Digital input SPI chip select; active low

START 7G Digital input Start conversion

DGND 7H Supply Digital ground

AVSS1 8A Supply Analog ground for charge pump

CLKSEL 8B Digital input Master clock select

DVDD 8C Supply Digital power supply

DVDD 8D Supply Digital power supply

DOUT 8E Digital output SPI data out

SCLK 8F Digital input SPI clock

CLK 8G Digital input/output External Master clock input or internal clock output.

DIN 8H Digital input SPI data in










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48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

DVDD

GPIO4

GPIO3

GPIO2

DOUT

GPIO1

DAISY_IN

SCLK

START

CLK

DIN

DGND

DRDY

CS

RESET

PWDN

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

IN8N

IN8P

IN7N

IN7P

IN6N

IN6P

IN5N

IN5P

IN4N

IN4P

IN3N

IN3P

IN2N

IN2P

IN1N

IN1P

WC

T

RLD

OU

T

RLD

IN

RLD

INV

RLD

RE

F

AV

DD

AV

SS

AV

SS

AV

DD

VC

AP

3

AV

DD

1

AV

SS

1

CLK

SE

L

DG

ND

DV

DD

DG

ND

TE

ST

P_P

AC

E_O

UT

1

TE

ST

N_P

AC

E_O

UT

2

AV

DD

AV

SS

AV

DD

AV

DD

AV

SS

VR

EF

P

VR

EF

N

VC

AP

4

NC

VC

AP

1

NC

VC

AP

2

RE

SV

1

AV

SS

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49


PAG PACKAGETQFP-64

(TOP VIEW)









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PAG PIN ASSIGNMENTSNAME PIN FUNCTION DESCRIPTION

IN8N (1) 1 Analog input Differential analog negative input 8 (ADS1298)

IN8P (1) 2 Analog input Differential analog positive input 8 (ADS1298)

IN7N (1) 3 Analog input Differential analog negative input 7 (ADS1298)

IN7P (1) 4 Analog input Differential analog positive input 7 (ADS1298)

IN6N (1) 5 Analog input Differential analog negative input 6 (ADS1296/8)

IN6P (1) 6 Analog input Differential analog positive input 6 (ADS1296/8)

IN5N (1) 7 Analog input Differential analog negative input 5 (ADS1296/8)

IN5P (1) 8 Analog input Differential analog positive input 5 (ADS1296/8)

IN4N (1) 9 Analog input Differential analog negative input 4

IN4P (1) 10 Analog input Differential analog positive input 4







TESTP_PACE_OUT1 (1) 17 Analog input/buffer output Internal test signal/single-ended buffer output based on register settings

TESTN_PACE_OUT2 (1) 18 Analog input/output Internal test signal/single-ended buffer output based on register settings

AVDD 19 Supply Analog supply

AVSS 20 Supply Analog ground




VREFP 24 Analog input/output Positive reference voltage

VREFN 25 Analog input Negative reference voltage

VCAP4 26 Analog output Analog bypass capacitor

NC 27 — No connection

VCAP1 28 — Analog bypass capacitor

NC 29 — No connection

VCAP2 30 — Analog bypass capacitor

RESV1 31 Digital input Reserved for future use; must tie to logic low (DGND).


DGND 33 Supply Digital ground

DIN 34 Digital input SPI data in

PWDN 35 Digital input Power-down; active low

RESET 36 Digital input System reset; active low

CLK 37 Digital input/output External Master clock input or internal clock output.

START 38 Digital input Start conversion

CS 39 Digital input SPI chip select; active low

SCLK 40 Digital input SPI clock

DAISY_IN 41 Digital input Daisy-chain input; if not used, short to DGND.

GPIO1 42 Digital input/output General-purpose input/output pin

DOUT 43 Digital output SPI data out




DRDY 47 Digital output Data ready; active low

DVDD 48 Supply Digital power supply


DVDD 50 Supply Digital power supply










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PAG PIN ASSIGNMENTS (continued)NAME PIN FUNCTION DESCRIPTION


CLKSEL 52 Digital input Master clock select

AVSS1 53 Supply Analog ground

AVDD1 54 Supply Analog supply

VCAP3 55 Analog Analog bypass capacitor; internally generated AVDD + 1.9V.





RLDREF 60 Analog input Right leg drive noninverting input

RLDINV 61 Analog input/output Right leg drive inverting input

RLDIN (1) 62 Analog input Right leg drive input to MUX

RLDOUT 63 Analog output Right leg drive output

WCT 64 Analog output Wilson Central Terminal output









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1

CS

SCLK

DIN

DOUT

2 3 8 1 2 83

tCSSC

tDIST

tDIHD tDOHD

tCSH

tDOPD

tSPWH

tSPWL tSCCS

Hi-Z

tCSDOZtCSDOD

Hi-Z

tSCLK

tSDECODE

CLK

tCLK

D ISY_INA

DOUT

SCLK

MSBD1

tDISCK2ST

MSB

21 3 216 217 218

MSBD1LSB

tDISCK2HT

tDOPD

Don’t Care

LSBD1

219



TIMING CHARACTERISTICS

NOTE: SPI settings are CPOL = 0 and CPHA = 1.

Figure 1. Serial Interface Timing

NOTE: Daisy-chain timing shown for eight-channel ADS1298, ADS1298R, and ADS1298I.

Figure 2. Daisy-Chain Interface Timing

Timing Requirements For Figure 1 and Figure 2Specifications apply from –40°C to +85°C, unless otherwise noted. Load on DOUT = 20pF || 100kΩ.

2.7V ≤ DVDD ≤ 3.6V 1.65V ≤ DVDD ≤ 2V

PARAMETER DESCRIPTION MIN TYP MAX MIN TYP MAX UNIT

tCLK Master clock period 414 514 414 514 ns

tCSSC CS low to first SCLK, setup time 6 17 ns

tSCLK SCLK period 50 66.6 ns

tSPWH, L SCLK pulse width, high and low 15 25 ns

tDIST DIN valid to SCLK falling edge: setup time 10 10 ns

tDIHD Valid DIN after SCLK falling edge: hold time 10 11 ns

tDOHD SCLK falling edge to invalid DOUT: hold time 10 10 ns

tDOPD SCLK rising edge to DOUT valid: setup time 17 32 ns

tCSH CS high pulse 2 2 tCLKs

tCSDOD CS low to DOUT driven 10 20 ns

tSCCS Eighth SCLK falling edge to CS high 4 4 tCLKs

tSDECODE Command decode time 4 4 tCLKs

tCSDOZ CS high to DOUT Hi-Z 10 20 ns

tDISCK2ST DAISY_IN valid to SCLK rising edge: setup time 10 10 ns

tDISCK2HT DAISY_IN valid after SCLK rising edge: hold time 10 10 ns









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3

2

1

0

1

2

3

-

-

-

Time (sec)

Input-

Refe

rred N

ois

e (

V)

m

1 20 103 4 5 6 7 8 9

Peak-to-Peak Over 10sec = 5 Vm

1600

1400

1200

1000

800

600

400

200

0

Input-Referred Noise ( V)m

Occu

rre

nce

s

-2

.88

-2

.35

-1

.85

-1

.35

-0

.84

-0

.34

0.1

7

1.1

7

2.1

8

0.6

7

1.6

8

2.408

2.406

2.404

2.402

2.4

2.398

2.396-40 85

Temperature ( C)°

Inte

rnal R

efe

rence (

V)

-15 10 6035

-130

125

120

115

110

105

100

95

90

85

-

-

-

-

-

-

-

-

-

10 1k

Frequency (Hz)

Co

mm

on-M

od

e R

eje

ctio

n R

atio

(d

B)

100

Gain = 1

Data Rate = 4kSPS

AIN = AVDD 0.3V to AVSS + 0.3V-

Gain = 2

Gain = 3

Gain = 4

Gain = 6

Gain = 8

Gain = 12

0.18

0.16

0.14

0.12

0.10

0.08

0.06

0.04

0.02

00.3 4.8

Input Voltage (V)

Inp

ut

Le

aka

ge

Cu

rre

nt

(nA

)

2.3

AVDD AVSS = 5V

PGA = 1

-

1.81.30.8 2.8 3.3 3.8 4.3

1200

1000

800

600

400

200

0-40 85

Temperature ( C)°

Le

aka

ge

Cu

rre

nt

(pA

)

3510-15 60


TYPICAL CHARACTERISTICSAll plots at TA = +25°C, AVDD = 3V, AVSS = 0V, DVDD = 1.8V, internal VREFP = 2.4V, VREFN = AVSS, external clock =

2.048MHz, data rate = 500SPS, High-Resolution mode, and gain = 6, unless otherwise noted.

INPUT-REFERRED NOISE NOISE HISTOGRAM

Figure 3. Figure 4.

INTERNAL REFERENCE vs TEMPERATURE CMRR vs FREQUENCY

Figure 5. Figure 6.

LEAKAGE CURRENT vs INPUT VOLTAGE LEAKAGE CURRENT vs TEMPERATURE

Figure 7. Figure 8.









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110

105

100

95

90

85

80

75

7010 1k

Frequency (Hz)

Po

we

r-S

up

ply

Re

jectio

n R

atio

(d

B)

100

Data Rate = 4kSPS

Gain = 2

Gain = 4

Gain = 1

Gain = 12

Gain = 3

Gain = 8

Gain = 6

-105

100

95

90

85

80

75

70

-

-

-

-

-

-

-

10 1k

Frequency (Hz)

Tota

l H

arm

onic

Dis

tort

ion (

dB

)

100

Data Rate = 4kSPS

AIN = 0.5dBFS

Gain = 1

Gain = 2

Gain = 4

Gain = 12

Gain = 3

Gain = 8

Gain = 6

8

6

4

2

0

2

4

6

8

-

-

-

-

-1 1

Input Range (Normalized to Full-Scale)

Inte

gra

l N

onlin

earity

(ppm

)

-0.5 0.50

-40 C°

-20 C°

0 C°

+25 C°

+40 C°

+60 C°

+70 C°

+85 C°

10

8

6

4

2

0

2

4

6

8

10

-

-

-

-

-

Input (Normalized to Full-Scale)

Inte

gra

l N

onlin

earity

(ppm

)

-0.8-1.0 1.0-0.2 0.2 0.6-0.6 0.8-0.4 0 0.4

Gain = 6Gain = 8Gain = 12

Gain = 1Gain = 2Gain = 3Gain = 4

0

20

40

60

80

100

120

140

160

180

-

-

-

-

-

-

-

-

-

Frequency (Hz)

Am

plit

ude (

dB

FS

)

500 250100 150 200

PGA Gain = 1

THD = 102dB

SNR = 115dB

f = 500SPS

f = External Clock

-

DR

CLK

0

20

40

60

80

100

120

140

160

180

-

-

-

-

-

-

-

-

-

Frequency (kHz)

Am

plit

ude (

dB

FS

)

20 164 6 8

PGA Gain = 6

THD = 104dB

SNR = 74.5dB

-

f = 32kSPSDR

10 12 14



TYPICAL CHARACTERISTICS (continued)All plots at TA = +25°C, AVDD = 3V, AVSS = 0V, DVDD = 1.8V, internal VREFP = 2.4V, VREFN = AVSS, external clock =2.048MHz, data rate = 500SPS, High-Resolution mode, and gain = 6, unless otherwise noted.

PSRR vs FREQUENCY THD vs FREQUENCY

Figure 9. Figure 10.

INL vs PGA GAIN INL vs TEMPERATURE


THD FFT PLOT FFT PLOT(60Hz Signal) (60Hz Signal)










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800

700

600

500

400

300

200

100

01 12

PGA Gain

Offse

t (

V)

m

8642 109753 11

70

60

50

40

30

20

10

0

-0.5

3

Error (%)

Num

ber

of B

ins

-0.4

1

-0.1

8

0.0

6

0.3

0

0.5

4

0.6

6

0.4

2

0.1

8

-0.0

6

-0.2

9

Data From 31 Devices, Two Lots

80

70

60

50

40

30

20

10

0

-2

0

Threshold Error (mV)

Nu

mb

er

of

Bin

s

-1

5 0

10

20

30

35

25

155

-1

0

Data From 31 Devices, Two Lots120

100

80

60

40

20

0

-2

.70

Error in Current Magnitude (nA)

Nu

mb

er

of

Bin

s

-2

.14

-1

.01

0.1

2

1.2

4

2.3

7

2.9

3

1.8

0

0.6

8

-0

.45

-1

.57

Data From 31 Devices, Two Lots

Current Setting = 24nA

17.5

15.5

13.5

11.5

9.5

7.5

5.5

3.5

1.5

Number of Channels Disabled

Pow

er

(mW

)

10 84 62 3 5 7

AVDD = 3V

AVDD = 5V

40

30

20

10

0

10

20

30

40

50

-

-

-

-

-

Input Range (Normalized to Full-Scale)

Inte

gra

l N

onlin

earity

(ppm

)

-0.8-1 1-0.2 0.2-0.6 -0.4 0 0.4 0.80.6

Channel 1Channel 2Channel 3Channel 4Channel 5Channel 6Channel 7Channel 8



OFFSET vs PGA GAIN(ABSOLUTE VALUE) TEST SIGNAL AMPLITUDE ACCURACY


LEAD-OFF CURRENT SOURCE ACCURACYLEAD-OFF COMPARATOR THRESHOLD ACCURACY DISTRIBUTION


ADS1294R/6R/8R NONLINEARITY ADS1298/8R CHANNEL POWER










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110

105

100

95

90

85

80

75

70

65

60

Channel

Tota

l H

arm

onic

Dis

tort

ion (

dB

c)

1 84 62 3 5 7

f = 10Hz, 0.5dBFS-IN

120

110

100

90

80

70

60

50

Input Amplitude (dBFS)

Sig

nal-to

-Nois

e R

atio (

dB

)

-50-60 -0.5-20 -5-40 -30 -12 -2

Internal Master Clock, AVDD = 3V

External Master Clock, AVDD = 3V

External Master Clock, AVDD = 5V

Internal Master Clock, AVDD = 5V




SNR vs INPUT AMPLITUDEADS129xR THD (10Hz Sine Wave)










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OVERVIEW

NOTEThe ADS1294R/6R/8R channel performance differs from the ADS1294/6/8 in regards torespiration circuitry found on channel one. Unless otherwise noted, ADS129x refers to allspecifications and functional descriptions of the ADS1294, ADS1296, ADS1298,ADS1294R, ADS1296R, and ADS1298R.

The ADS129x are low-power, multichannel, simultaneously-sampling, 24-bit delta-sigma (ΔΣ) analog-to-digitalconverters (ADCs) with integrated programmable gain amplifiers (PGAs). These devices integrate variousECG-specific functions that make them well-suited for scalable electrocardiogram (ECG),electroencephalography (EEG), and electromyography (EMG) applications. The devices can also be used inhigh-performance, multichannel data acquisition systems by powering down the ECG-specific circuitry.

The ADS129x have a highly programmable multiplexer that allows for temperature, supply, input short, and RLDmeasurements. Additionally, the multiplexer allows any of the input electrodes to be programmed as the patientreference drive. The PGA gain can be chosen from one of seven settings (1, 2, 3, 4, 6, 8, and 12). The ADCs inthe device offer data rates from 250SPS to 32kSPS. Communication to the device is accomplished using anSPI-compatible interface. The device provides four GPIO pins for general use. Multiple devices can besynchronized using the START pin.

The internal reference can be programmed to either 2.4V or 4V. The internal oscillator generates a 2.048MHzclock. The versatile right leg drive (RLD) block allows the user to choose the average of any combination ofelectrodes to generate the patient drive signal. Lead-off detection can be accomplished either by using apull-up/pull-down resistor or a current source/sink. An internal ac lead-off detection feature is also available. Thedevice supports both hardware PACE detection and software PACE detection. The Wilson Central Terminal(WCT) block can be used to generate the WCT point of the standard 12-lead ECG.

Additionally, the ADS1294R, ADS1296R, and ADS1298R provide options for an internal respiration modulatorand a demodulator circuit in the signal path of channel 1.









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DR

DY

CL

K

CL

KS

EL

STA

RT

MU

X

Oscill

ato

r

Po

we

r-S

up

ply

Sig

na

l

SP

I

DV

DD

DG

ND

RLD

INV

RL

DO

UT

RL

DR

EF

Le

ad

-Off

Excita

tio

nS

ou

rce

PA

CE

OU

T2

GP

IO1

GP

IO4

/RC

LK

O

GP

IO3

/RC

LK

O

RE

SP

CL

K

PA

CE

OU

T1

CS

SC

LK

DIN

DO

UT

RL

DIN

ADS1298/8RADS1296/6R/8/8R

GP

IO2

AV

DD

AV

SS

IN8

P

IN8

N

IN7

P

IN7

N

IN6

P

IN6

N

IN5

P

IN5

N

IN4

P

IN4

N

IN3

P

IN3

N

IN2

P

IN2

N

IN1

P

IN1

N

PG

A1

DS

AD

C1

PG

A2

PG

A3

PG

A4

PG

A5

PG

A6

PG

A7

PG

A8

EM

I

Filt

er

EM

I

Filt

er

EM

I

Filt

er

EM

I

Filt

er

EM

I

Filt

er

EM

I

Filt

er

EM

I

Filt

er

EM

I

Filt

er

Tem

pe

ratu

re S

en

so

r In

pu

t

RL

D

Am

plif

ier

PA

CE

Am

plif

ier

2

PA

CE

Am

plif

ier

1

WC

T

BC A

Fro

m

Wm

uxc

Fro

m

Wm

uxa

Fro

m

Wm

uxb

WC

T

Re

fere

nce

VR

EF

PV

RE

FN

Contr

ol

PW

DN

RE

SE

T

DS

AD

C2

DS

AD

C3

DS

AD

C4

DS

AD

C5

DS

AD

C6

DS

AD

C7

DS

AD

C8

AV

DD

1

AV

SS

1

Test

Sig

na

lIn

tern

al R

esp

ira

tio

n

Mo

du

lato

r

()

AD

S1

29

xR

RE

SP

DE

MO

DR

ES

P_

DE

MO

D_

EN

ADS129xR

ADS129xR

RE

SP

_M

OD

P

RE

SP

_M

OD

N

G =

0.4

G =

0.4



Figure 23. Functional Block Diagram









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MUX[2:0] = 101

TempPMUX[2:0] = 100

MvddP(1) MUX[2:0] = 011

From LoffP

MUX[2:0] = 000

MUX[2:0] = 110

MUX[2:0] = 001

To PgaP

To PgaNMUX[2:0] = 001

RLDIN

MUX[2:0] = 010RLD_MEAS

AND

MUX[2:0] = 111

VINP

VINNMUX[2:0] = 000

From LoffN

RLD_REF

MUX[2:0] = 010RLD_MEAS

AND

MvddN(1)

TempNMUX[2:0] = 100

MUX[2:0] = 101

ADS129x

MUX

TestP

TestN

TESTP_PACE_OUT1

INT_TEST

INT_TEST

TESTN_PACE_OUT2

INT_TEST

INT_TEST

MUX[2:0] = 011

EMI

Filter

(AVDD + AVSS)

2


THEORY OF OPERATION

This section discusses the details of the ADS129x internal functional elements. The analog blocks are reviewedfirst, followed by the digital interface. Blocks implementing ECG-specific functions are covered in the end.

Throughout this document, fCLK denotes the frequency of the signal at the CLK pin, tCLK denotes the period of thesignal at the CLK pin, fDR denotes the output data rate, tDR denotes the time period of the output data, and fMODdenotes the frequency at which the modulator samples the input.

EMI FILTER

An RC filter at the input acts as an EMI filter on all of the channels. The –3dB filter bandwidth is approximately3MHz.

INPUT MULTIPLEXER

The ADS129x input multiplexers are very flexible and provide many configurable signal switching options.Figure 24 shows the multiplexer on a single channel of the device. Note that the device has eight such blocks,one for each channel. TEST_PACE_OUT1, TEST_PACE_OUT2, and RLD_IN are common to all eight blocks.VINP and VINN are separate for each of the eight blocks. This flexibility allows for significant device andsub-system diagnostics, calibration, and configuration. Selection of switch settings for each channel is made bywriting the appropriate values to the CHnSET[2:0] register (see the CHnSET: Individual Channel Settings sectionfor details) and by writing the RLD_MEAS bit in the CONFIG3 register (see the CONFIG3: Configuration Register3 subsection of the Register Map section for details). More details of the ECG-specific features of the multiplexerare presented in the Input Multiplexer subsection of the ECG-Specifc Functions section.

(1) MVDD monitor voltage supply depends on channel number; see the Supply Measurements (MVDDP, MVDDN)section.

Figure 24. Input Multiplexer Block for One Channel









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Temperature ( C) =°Temperature Reading ( V) 145,300 Vm - m

490 V/ Cm °

+ 25 C°

2x

1x

1x

8x

AVDD

AVSS

Temperature Sensor Monitor

To MUX TempP

To MUX TempN



Device Noise Measurements

Setting CHnSET[2:0] = 001 sets the common-mode voltage of (AVDD – AVSS)/2 to both inputs of the channel.This setting can be used to test the inherent noise of the device in the user system.

Test Signals (TestP and TestN)

Setting CHnSET[2:0] = 101 provides internally-generated test signals for use in sub-system verification atpower-up. This functionality allows the entire signal chain to be tested out. Although the test signals are similar tothe CAL signals described in the IEC60601-2-51 specification, this feature is not intended for use in compliancetesting.

Control of the test signals is accomplished through register settings (see the CONFIG2: Configuration Register 2subsection in the Register Map section for details). TEST_AMP controls the signal amplitude and TEST_FREQcontrols switching at the required frequency.

The test signals are multiplexed and transmitted out of the device at the TESTP_PACE_OUT1 andTESTN_PACE_OUT2 pins. A bit register (CONFIG2.INT_TEST = 0) deactivates the internal test signals so thatthe test signal can be driven externally. This feature allows the calibration of multiple devices with the samesignal. The test signal feature cannot be used in conjunction with the external hardware PACE feature (see theExternal Hardware Approach subsection of the ECG-Specific Functions section for details).

Auxiliary Differential Input (TESTP_PACE_OUT1, TESTN_PACE_OUT2)

When hardware PACE detect is not used, the TESTP_PACE_OUT1 and TESPN_PACE_OUT2 signals can beused as a multiplexed differential input channel. These inputs can be multiplexed to any of the eight channels.The performance of the differential input signal fed through these pins is identical to the normal channelperformance.

Temperature Sensor (TempP, TempN)

The ADS129x contain an on-chip temperature sensor. This sensor uses two internal diodes with one diodehaving a current density 16x that of the other, as shown in Figure 25. The difference in current densities of thediodes yields a difference in voltage that is proportional to absolute temperature.

As a result of the low thermal resistance of the package to the printed circuit board (PCB), the internal devicetemperature tracks the PCB temperature closely. Note that self-heating of the ADS129x causes a higher readingthan the temperature of the surrounding PCB.

The scale factor of Equation 1 converts the temperature reading to °C. Before using this equation, thetemperature reading code must first be scaled to μV.

(1)

Figure 25. Measurement of the Temperature Sensor in the Input









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ADS1298- V to

+1/2VREF

REF

1/2

Common

Voltage

Single-Ended Input

ADS1298

V

peak-to-peakREF

V

peak-to-peakREF

Common

Voltage

Differential Input


Supply Measurements (MVDDP, MVDDN)

Setting CHnSET[2:0] = 011 sets the channel inputs to different supply voltages of the device. For channels 1, 2,5, 6, 7, and 8, (MVDDP – MVDDN) is [0.5 × (AVDD – AVSS)]; for channel 3 and for channel 4, (MVDDP –MVDDN) is DVDD/4. Note that to avoid saturating the PGA while measuring power supplies, the gain must beset to '1'. For example, if AVDD = 2.5V and AVSS = –2.5V, then the measurement result would be 2.5V.

Lead-Off Excitation Signals (LoffP, LoffN)

The lead-off excitation signals are fed into the multiplexer before the switches. The comparators that detect thelead-off condition are also connected to the multiplexer block before the switches. For a detailed description ofthe lead-off block, refer to the Lead-Off Detection subsection in the ECG-Specific Functions section.

Auxiliary Single-Ended Input

The RLD_IN pin is primarily used for routing the right leg drive signal to any of the electrodes in case the right legdrive electrode falls off. However, the RLD_IN pin can be used as a multiple single-ended input channel. Thesignal at the RLD_IN pin can be measured with respect to the voltage at the RLD_REF pin using any of the eightchannels. This measurement is done by setting the channel multiplexer setting to '010' and the RLD_MEAS bit ofthe CONFIG3 register to '1'.

ANALOG INPUT

The analog input to the ADS1298 is fully differential. Assuming PGA = 1, the differential input (INP – INN) canspan between –VREF to +VREF. Note that the the absolute range for INP and INN must be between AVSS – 0.3Vand AVDD + 0.3V. Refer to Table 8 for an explanation of the correlation between the analog input and the digitalcodes. There are two general methods of driving the analog input of the ADS1298: single-ended or differential,as shown in Figure 26 and Figure 27. Note that INP and INN are 180°C out-of-phase in the differential inputmethod. When the input is single-ended, the INN input is held at the common-mode voltage, preferably atmid-supply. The INP input swings around the same common voltage and the peak-to-peak amplitude is the(common-mode + 1/2VREF) and the (common-mode – 1/2VREF). When the input is differential, the common-modeis given by (INP + INN)/2. Both the INP and INN inputs swing from (common-mode + 1/2VREF tocommon-mode – 1/2VREF). For optimal performance, it is recommended that the ADS1298 devices be used in adifferential configuration.

Figure 26. Methods of Driving the ADS1298: Single-Ended or Differential









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CM + 1/2VREF

+1/2VREF

- VREF1/2

Single-Ended Inputst

INPCM Voltage

CM V- REF1/2

CM + 1/2VREF

Differential Inputs

t

INP

INN

CM Voltage

CM 1/2VREF-

+VREF

-VREF

Common-Mode Voltage (Differential Mode) =(INP) + (INN)

2, Common-Mode Voltage (Single-Ended Mode) = INN.

INN = CM Voltage

Input Range (Differential Mode) = (AINP AINN) = V ( V ) = 2V .- REF REF- - REF

PgaP

R

50kW

2

R

20k

(for Gain = 6)

W

1

R

50kW

2

From MuxP

PgaN

From MuxN

To ADC



Figure 27. Using the ADS1298 in the Single-Ended and Differential Input Modes

PGA SETTINGS AND INPUT RANGE

The PGA is a differential input/differential output amplifier, as shown in Figure 28. It has seven gain settings (1,2, 3, 4, 6, 8, and 12) that can be set by writing to the CHnSET register (see the CHnSET: Individual ChannelSettings subsection of the Register Map section for details). The ADS129x have CMOS inputs and hence havenegligible current noise. Table 6 shows the typical values of bandwidths for various gain settings. Note thatTable 6 shows the small-signal bandwidth. For large signals, the performance is limited by the slew rate of thePGA.

Figure 28. PGA Implementation

Table 6. PGA Gain versus Small-Signal Bandwidth

NOMINAL BANDWIDTH AT ROOMGAIN TEMPERATURE (kHz)

1 237

2 146

3 127

4 96

6 64

8 48

12 32









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AVDD 0.2- -

Gain VMAX_DIFF

2> CM > AVSS + 0.2 +

Gain VMAX_DIFF

2

Max (INP INN) <-

VREF

GainFull-Scale Range =

±VREF

Gain; =

2VREF

Gain

−160−150−140−130−120−110−100

−90−80−70−60−50−40−30−20−10

0

0.001 0.01 0.1 1Normalized Frequency (fIN/fMOD)

Pow

er S

pect

ral D

ensi

ty (

dB)

G001


The resistor string of the PGA that implements the gain has 120kΩ of resistance for a gain of 6. This resistanceprovides a current path across the outputs of the PGA in the presence of a differential input signal. This currentis in addition to the quiescent current specified for the device in the presence of a differential signal at the input.

Input Common-Mode Range

The usable input common-mode range of the front end depends on various parameters, including the maximumdifferential input signal, supply voltage, PGA gain, etc. This range is described in Equation 2:

where:

VMAX_DIFF = maximum differential signal at the input of the PGA

CM = common-mode range (2)

For example:If VDD = 3V, gain = 6, and VMAX_DIFF = 350mVThen 1.25V < CM < 1.75V

Input Differential Dynamic Range

The differential (INP – INN) signal range depends on the analog supply and reference used in the system. Thisrange is shown in Equation 3.

(3)

The 3V supply, with a reference of 2.4V and a gain of 6 for ECGs, is optimized for power with a differential inputsignal of approximately 300mV. For higher dynamic range, a 5V supply with a reference of 4V (set by theVREF_4V bit of the CONFIG3 register) can be used to increase the differential dynamic range.

ADC ΔΣ Modulator

Each channel of the ADS129x has a 24-bit ΔΣ ADC. This converter uses a second-order modulator optimized forlow-power applications. The modulator samples the input signal at the rate of fMOD = fCLK/4 for High-Resolutionmode and fMOD = fCLK/8 for Low-Power mode. As in the case of any ΔΣ modulator, the noise of the ADS129x isshaped until fMOD/2, as shown in Figure 29. The on-chip digital decimation filters explained in the next sectioncan be used to filter out the noise at higher frequencies. These on-chip decimation filters also provide antialiasfiltering. This feature of the ΔΣ converters drastically reduces the complexity of the analog antialiasing filters thatare typically needed with Nyquist ADCs.

Figure 29. Modulator Noise Spectrum Up To 0.5 × fMOD









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½H(z) =½

3

1 Z-

- N

1 Z-

- 1

½H(f) =½

3

sinN fp

fMOD

N sin´

pf

fMOD



DIGITAL DECIMATION FILTER

The digital filter receives the modulator output and decimates the data stream. By adjusting the amount offiltering, tradeoffs can be made between resolution and data rate: filter more for higher resolution, filter less forhigher data rates. Higher data rates are typically used in ECG applications for implement software PACEdetection and ac lead-off detection.

The digital filter on each channel consists of a third-order sinc filter. The decimation ratio on the sinc filters canbe adjusted by the DR bits in the CONFIG1 register (see the Register Map section for details). This setting is aglobal setting that affects all channels and, therefore, in a device all channels operate at the same data rate.

Sinc Filter Stage (sinx/x)

The sinc filter is a variable decimation rate, third-order, low-pass filter. Data are supplied to this section of thefilter from the modulator at the rate of fMOD. The sinc filter attenuates the high-frequency noise of the modulator,then decimates the data stream into parallel data. The decimation rate affects the overall data rate of theconverter.

Equation 4 shows the scaled Z-domain transfer function of the sinc filter.

(4)

The frequency domain transfer function of the sinc filter is shown in Equation 5.

where:N = decimation ratio (5)









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0

-20

-40

-60

-80

-100

-120

-140

Normalized Frequency (f /f )IN DR

Gain

(dB

)

1.0 2.00 3.0 4.0 5.00.5 4.53.52.51.5

0

0.5

1.0

1.5

2.0

2.5

3.0

-

-

-

-

-

-

Normalized Frequency (f /f )IN DR

Gain

(dB

)

0.05 0.100 0.15 0.350.20 0.25 0.30

0

20

40

60

80

100

120

140

-

-

-

-

-

-

-

Normalized Frequency (f /f )IN MOD

Gain

(dB

)

0.05 0.100 0.500.15 0.20 0.25 0.30 0.35 0.40 0.45

DR[2:0] = 110

DR[2:0] = 000

0

20

40

60

80

100

120

140

-

-

-

-

-

-

-


Gain

(dB

)

0.010 0.070.02 0.03 0.04 0.05 0.06

DR[2:0] = 000

DR[2:0] = 110

10

10

30

50

70

90

110

130

-

-

-

-

-

-

-


Gain

(dB

)

0.50 4.01.0 1.5 2.0 2.5 3.0 3.5

DR[2:0] = 110DR[2:0] = 000


The sinc filter has notches (or zeroes) that occur at the output data rate and multiples thereof. At thesefrequencies, the filter has infinite attenuation. Figure 30 shows the frequency response of the sinc filter andFigure 31 shows the roll-off of the sinc filter. With a step change at input, the filter takes 3 × tDR to settle. After arising edge of the START signal, the filter takes tSETTLE time to give the first data output. The settling time of thefilters at various data rates are discussed in the START subsection of the SPI Interface section. Figure 32 andFigure 33 show the filter transfer function until fMOD/2 and fMOD/16, respectively, at different data rates. Figure 34shows the transfer function extended until 4 × fMOD. It can be seen that the passband of the ADS129x repeatsitself at every fMOD. The input R-C anti-aliasing filters in the system should be chosen such that any interferencein frequencies around multiples of fMOD are attenuated sufficiently.

Figure 30. Sinc Filter Frequency Response Figure 31. Sinc Filter Roll-Off

Figure 32. Transfer Function of On-Chip Figure 33. Transfer Function of On-ChipDecimation Filters Until fMOD/2 Decimation Filters Until fMOD/16

Figure 34. Transfer Function of On-Chip Decimation FiltersUntil 4fMOD for DR[2:0] = 000 and DR[2:0] = 110









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22 Fm

To ADC Reference Inputs

VCAP1

10 Fm

VREFP

VREFN

Bandgap2.4V or 4V

AVSS

R1(1)

R3(1)

R2(1)

100W

100kW

100W

OPA211

10pF

0.1 Fm

+5V

0.1 Fm10 Fm

100 Fm22 Fm

OUTVIN+5V

TRIM22 Fm

REF5025

To VREFP Pin



REFERENCE

Figure 35 shows a simplified block diagram of the internal reference of the ADS129x. The reference voltage isgenerated with respect to AVSS. When using the internal voltage reference, connect VREFN to AVSS.

(1) For VREF = 2.4V: R1 = 12.5kΩ, R2 = 25kΩ, and R3 = 25kΩ. For VREF = 4V: R1 = 10.5kΩ, R2 = 15kΩ, and R3 = 35kΩ.

Figure 35. Internal Reference

The external band-limiting capacitors determine the amount of reference noise contribution. For high-end ECGsystems, the capacitor values should be chosen such that the bandwidth is limited to less than 10Hz, so that thereference noise does not dominate the system noise. When using a 3V analog supply, the internal referencemust be set to 2.4V. In case of a 5V analog supply, the internal reference can be set to 4V by setting theVREF_4V bit in the CONFIG2 register.

Alternatively, the internal reference buffer can be powered down and VREFP can be applied externally. Figure 36shows a typical external reference drive circuitry. Power-down is controlled by the PD_REFBUF bit in theCONFIG3 register. By default the device wakes up in external reference mode.

Figure 36. External Reference Driver









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CLOCK

The ADS129x provide two different methods for device clocking: internal and external. Internal clocking is ideallysuited for low-power, battery-powered systems. The internal oscillator is trimmed for accuracy at roomtemperature. Over the specified temperature range the accuracy varies; see the Electrical Characteristics. Clockselection is controlled by the CLKSEL pin and the CLK_EN register bit.

The CLKSEL pin selects either the internal or external clock. The CLK_EN bit in the CONFIG1 register enablesand disables the oscillator clock to be output in the CLK pin. A truth table for these two pins is shown in Table 7.The CLK_EN bit is useful when multiple devices are used in a daisy-chain configuration. It is recommended thatduring power-down the external clock be shut down to save power.

Table 7. CLKSEL Pin and CLK_EN Bit

CONFIG1.CLK_ENCLKSEL PIN BIT CLOCK SOURCE CLK PIN STATUS

0 X External clock Input: external clock

1 0 Internal clock oscillator 3-state

1 1 Internal clock oscillator Output: internal clock oscillator

DATA FORMAT

The ADS129x output 24 bits of data per channel in binary twos complement format, MSB first. The LSB has aweight of VREF/(223 – 1). A positive full-scale input produces an output code of 7FFFFFh and the negativefull-scale input produces an output code of 800000h. The output clips at these codes for signals exceedingfull-scale. Table 8 summarizes the ideal output codes for different input signals. Note that for DR[2:0] = 000 and001, the device has only 17 and 19 bits of resolution, respectively. The last seven (in 17-bit mode) or five (in19-bit mode) bits can be ignored.

Table 8. Ideal Output Code versus Input Signal (1) (2)

INPUT SIGNAL, VIN(AINP – AINN) IDEAL OUTPUT CODE (3)

≥ VREF 7FFFFFh

+VREF/(223 – 1) 000001h

0 000000h

–VREF/(223 – 1) FFFFFFh

≤ –VREF (223/223 – 1) 800000h

(1) Only valid for 24-bit resolution data rates.(2) Assumes gain = 1.(3) Excludes effects of noise, linearity, offset, and gain error.









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SPI INTERFACE

The SPI-compatible serial interface consists of four signals: CS, SCLK, DIN, and DOUT. The interface readsconversion data, reads and writes registers, and controls the ADS129x operation. The DRDY output is used as astatus signal to indicate when data are ready. DRDY goes low when new data are available.

Chip Select (CS)

Chip select (CS) selects the ADS129x devices for SPI communication. While CS is low the serial interface isactive CS must remain low for the entire duration of the serial communication. After the serial communication isfinished, always wait four or more tCLK cycles before taking CS high. When CS is taken high, the serial interfaceis reset, SCLK and DIN are ignored, and DOUT enters a high-impedance state. DRDY asserts when dataconversion is complete, regardless of whether CS is high or low.

While ADS129x is selected the device will attempt to decode and execute commands every eight serial clocks. Ifthe devices ceases to execute serial commands, it is possible extra clock pulses were presented and placed theserial interface in an unknown state. Take CS high and back low to reset the serial interface to a known state.

Serial Clock (SCLK)

SCLK is the serial peripheral interface (SPI) serial clock. It is used to shift in commands and shift out data fromthe device. The serial clock (SCLK) features a Schmitt-triggered input and clocks data on the DIN and DOUTpins into and out of the ADS129x. Even though the input has hysteresis, it is recommended to keep SCLK asclean as possible to prevent glitches from accidentally forcing a clock event. The absolute maximum limit forSCLK is specified in the Serial Interface Timing table.

While ADS129x is selected(CS = LOW), the device attempts to decode and execute commands every eightserial clocks. It is therefore recommended that multiples of 8 SCLKs be presented every serial transfer to keepthe interface in a normal operating mode. If the interface ceases to function because of extra serial clocks, it canbe reset by toggling CS high and back to low.

For a single device, the minimum speed needed for the SCLK depends on the number of channels, number ofbits of resolution, and output data rate. (For multiple cascaded devices, see the Cascade Mode subsection of theMultiple Device Configuration section.)tSCLK < (tDR – 4tCLK)/(NBITS × NCHANNELS + 24) (6)

For example, if the ADS1298 is used in a 500SPS mode (eight channels, 24-bit resolution), the minimum SCLKspeed is 110kHz.

Data retrieval can be done either by putting the device in RDATAC mode or by issuing a RDATA command fordata on demand. The above SCLK rate limitation applies to RDATAC. For the RDATA command, the limitationapplies if data must be read between two consecutive DRDY signals. The above calculation assumes that thereare no other commands issued between data captures.

Data Input (DIN)

The data input pin (DIN) is used along with SCLK to communicate with the ADS129x (opcode commands andregister data). The device latches data on DIN on the falling edge of SCLK.









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CS

SCLK

DRDY

DOUT STAT

24-Bit 24-Bit 24-Bit 24-Bit 24-Bit 24-Bit 24-Bit 24-Bit 24-Bit

CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8

216 SCLKs

DIN


Data Output (DOUT)

The data output pin (DOUT) is used with SCLK to read conversion and register data from the ADS129x. Data onDOUT are shifted out on the rising edge of SCLK. DOUT goes to a high-impedance state when CS is high. Inread data continuous mode (see the SPI Command Definitions section for more details), the DOUT output linealso indicates when new data are available. This feature can be used to minimize the number of connectionsbetween the device and the system controller.

Figure 37 shows the data output protocol for ADS1298.

Figure 37. SPI Bus Data Output for the ADS1298 (Eight Channels)

Data Retrieval

Data retrieval can be accomplished in one of two methods. The read data continuous command (see theRDATAC: Read Data Continuous section) can be used to set the device in a mode to read the data continuouslywithout sending opcodes. The read data command (see the RDATA: Read Data section) can be used to readjust one data output from the device (see the SPI Command Definitions section for more details). The conversiondata are read by shifting the data out on DOUT. The MSB of the data on DOUT is clocked out on the first SCLKrising edge. DRDY returns to high on the first SCLK falling edge. DIN should remain low for the entire readoperation.

The number of bits in the data output depends on the number of channels and the number of bits per channel.For the ADS1298/8R, the number of data outputs is (24 status bits + 24 bits × 8 channels) = 216 bits. The formatof the 24 status bits is: (1100 + LOFF_STATP + LOFF_STATN + bits[4:7] of the GPIO register). The data formatfor each channel data are twos complement and MSB first. When channels are powered down using the userregister setting, the corresponding channel output is set to '0'. However, the sequence of channel outputsremains the same. For the ADS1294/4R and ADS1296/6R, the last four and two channel outputs shown inFigure 37 are zeros. The four and six channels parts require only 120 and 168 SCLKs to shift data out,respectively. Status and GPIO register bits are loaded into the 24-bit status word 2tCLKs before DRDY goes low.

The ADS129x also provide a multiple readback feature. The data can be read out multiple times by simply givingmore SCLKs, in which case the MSB data byte repeats after reading the last byte. The DAISY_EN bit inCONFIG1 register must be set to '1' for multiple readbacks.

Data Ready (DRDY)

DRDY is an output. When it transitions low, new conversion data are ready. The CS signal has no effect on thedata ready signal. Regardless of the status of the CS signal, a rising edge on SCLK pulls DRDY high. Hence,when using multiple devices in the SPI bus, it is recommended that SCLK be gated with CS. The behavior ofDRDY is determined by whether the device is in RDATAC mode or the RDATA command is being used to readdata on demand. (See the RDATAC: Read Data Continuous and RDATA: Read Data subsections of the SPICommand Definitions section for further details).

When reading data with the RDATA command, the read operation can overlap the occurrence of the next DRDYwithout data corruption.

The START pin or the START command is used to place the device either in normal data capture mode or pulsedata capture mode.









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DRDY

DOUT

SCLK

Bit 215 Bit 214 Bit 213

GPIO Pin

GPIO Data (read)

GPIO Data (write)

GPIO Control



Figure 38 shows the relationship between DRDY, DOUT, and SCLK during data retrieval (in case of an ADS1298with a selected data rate that gives 24-bit resolution). DOUT is latched out at the rising edge of SCLK. DRDY ispulled high at the falling edge of SCLK. Note that DRDY goes high on the first falling edge SCLK regardless ofwhether data are being retrieved from the device or a command is being sent through the DIN pin.

Figure 38. DRDY with Data Retrieval (CS = 0 in RDATA mode)

GPIO

The ADS129x have a total of four general-purpose digital I/O (GPIO) pins available in the normal mode ofoperation. The digital I/O pins are individually configurable as either inputs or as outputs through the GPIOC bitsregister. The GPIOD bits in the GPIO register control the level of the pins. When reading the GPIOD bits, thedata returned are the logic level of the pins, whether they are programmed as inputs or outputs. When the GPIOpin is configured as an input, a write to the corresponding GPIOD bit has no effect. When configured as anoutput, a write to the GPIOD bit sets the output value.

If configured as inputs, these pins must be driven (do not float). The GPIO pins are set as inputs after power-onor after a reset. Figure 39 shows the GPIO port structure. The pins should be shorted to DGND if not used.

GPIO1 can be used as the PACEIN signal; GPIO2 is multiplexed with RESP_BLK signal; GPIO3 is multiplexedwith the RESP signal; and GPIO4 is multiplexed with the RESP_PH signal.

Figure 39. GPIO Port Pin

Power-Down (PWDN)

When PWDN is pulled low, all on-chip circuitry is powered down. To exit power-down mode, take the PWDN pinhigh. Upon exiting from power-down mode, the internal oscillator and the reference require time to wake up. It isrecommended that during power-down the external clock is shut down to save power.









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STAR coT Op de

START Pin

D NI

4/fCLKDRDY

or

tDR

tSETTLE


Reset (RESET)

There are two methods to reset the ADS129x: pull the RESET pin low, or send the RESET opcode command.When using the RESET pin, take it low to force a reset. Make sure to follow the minimum pulse width timingspecifications before taking the RESET pin back high. The RESET command takes effect on the eighth SCLKfalling edge of the opcode command. On reset it takes 18 tCLK cycles to complete initialization of the configurationregisters to the default states and start the conversion cycle. Note that an internal RESET is automatically issuedto the digital filter whenever registers CONFIG1 and RESP are set to new values with a WREG command.

START

The START pin must be set high for at least 2 tCLKs or the START command sent to begin conversions. WhenSTART is low or if the START command has not been sent, the device does not issue a DRDY signal(conversions are halted).

When using the START opcode to control conversion, hold the START pin low. The ADS129x feature two modesto control conversion: continuous mode and single-shot mode. The mode is selected by SINGLE_SHOT (bit 3 ofthe CONFIG4 register). In multiple device configurations the START pin is used to synchronize devices (see theMultiple Device Configuration subsection of the SPI Interface section for more details).

Settling Time

The settling time (tSETTLE) is the time it takes for the converter to output fully settled data when START signal ispulled high. Once START is pulled high, DRDY is also pulled high. The next falling edge of DRDY indicates thatdata are ready. Figure 40 shows the timing diagram and Table 9 shows the settling time for different data rates.The settling time depends on fCLK and the decimation ratio (controlled by the DR[2:0] bits in the CONFIG1register). Table 8 shows the settling time as a function of tCLK. Note that when START is held high and there is astep change in the input signal, it takes 3 × tDR for the filter to settle to the new value. Settled data are availableon the fourth DRDY pulse. This time must be considered when trying to measure narrow PACE pulses for PACEdetection.

Figure 40. Settling Time

Table 9. Settling Times for Different Data Rates

DR[2:0] HIGH-RESOLUTION MODE LOW-POWER MODE UNIT

000 296 584 tCLK

001 584 1160 tCLK

010 1160 2312 tCLK

011 2312 4616 tCLK

100 4616 9224 tCLK

101 9224 18440 tCLK

110 18440 36872 tCLK









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START

Opcode

(1)

S RT PinTA

DIN

tDR

tSETTLEDRDY

STOP

Opcode

(1)

or or

tSDSU

tDSHD

STOP Opcode

DRDY and DOUT

START Pin

or

STOP(1)STOP(1)



Continuous Mode

Conversions begin when the START pin is taken high for at least 2 tCLKs or when the START opcode commandis sent. As seen in Figure 41, the DRDY output goes high when conversions are started and goes low when dataare ready. Conversions continue indefinitely until the START pin is taken low or the STOP opcode command istransmitted. When the START pin is pulled low or the stop command is issued, the conversion in progress isallowed to complete. Figure 42 and Table 10 show the required timing of DRDY to the START pin and theSTART/STOP opcode commands when controlling conversions in this mode. To keep the converter runningcontinuously, the START pin can be permanently tied high. Note that when switching from pulse mode tocontinuous mode, the START signal is pulsed or a STOP command must be issued followed by a STARTcommand. This conversion mode is ideal for applications that require a fixed-continuous stream of conversionsresults.

(1) START and STOP opcode commands take effect on the seventh SCLK falling edge.

Figure 41. Continuous Conversion Mode

(1) START and STOP commands take effect on the seventh SCLK falling edge at the end of the opcode transmission.

Figure 42. START to DRDY Timing

Table 10. Timing Characteristics for Figure 42(1)

SYMBOL DESCRIPTION MIN UNIT

START pin low or STOP opcode to DRDY setup timetSDSU 16 tCLKto halt further conversions

START pin low or STOP opcode to complete currenttDSHD 16 tCLKconversion

(1) START and STOP commands take effect on the seventh SCLK falling edge at the end of the opcode transmission.









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START

DRDY

4 f/ CLK 4 f/ CLKData Updating

tSETTLE


Single-Shot Mode

The single-shot mode is enabled by setting the SINGLE_SHOT bit in CONFIG4 register to '1'. In single-shotmode, the ADS129x perform a single conversion when the START pin is taken high or when the START opcodecommand is sent. As seen in Figure 42, when a conversion is complete, DRDY goes low and further conversionsare stopped. Regardless of whether the conversion data are read or not, DRDY remains low. To begin a newconversion, take the START pin low and then back high for at least 2 tCLKs, or transmit the START opcode again.Note that when switching from continuous mode to pulse mode, make sure the START signal is pulsed or issuea STOP command followed by a START command.

Figure 43. DRDY with No Data Retrieval in Single-Shot Mode

This conversion mode is provided for applications that require non-standard or non-continuous data rates.Issuing a START command or toggling the START pin high resets the digital filter, effectively dropping the datarate by a factor of four. This mode leaves the system more susceptible to aliasing effects, thus requiring morecomplex analog or digital filtering. Loading on the host processor increases because it must toggle the STARTpin or send a START command to initiate a new conversion cycle.

MULTIPLE DEVICE CONFIGURATION

The ADS129x are designed to provide configuration flexibility when multiple devices are used in a system. Theserial interface typically requires four signals: DIN, DOUT, SCLK, and CS. With one additional chip select signalper device, multiple devices can be connected together. The number of signals needed to interface n devices is3 + n.

The right leg drive amplifiers can be daisy-chained as explained in the RLD Configuration with Multiple Devicessubsection of the ECG-Specific Functions section. To use the internal oscillator in a daisy-chain configuration,one of the devices must be set as the master for the clock source with the internal oscillator enabled (CLKSELpin = 1) and the internal oscillator clock brought out of the device by setting the CLK_EN register bit to '1'. Thismaster device clock is used as the external clock source for the other devices.









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START1

ADS12981

CLK

DRDY DRDY1

START

CLK

START2

ADS12982

CLK

DRDY DRDY2

START

CLK

DRDY1

DRDY2



When using multiple devices, the devices can be synchronized with the START signal. The delay from START tothe DRDY signal is fixed for a fixed data rate (see the START subsection of the SPI Interface section for moredetails on the settling times). Figure 44 shows the behavior of two devices when synchronized with the STARTsignal as an example.

There are two ways to connect multiple devices with a optimal number of interface pins: cascade mode anddaisy-chain mode.

Figure 44. Synchronizing Multiple Converters









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START DRDY

CS

SCLK

DIN

DOUT

ADS1298

(Device 1)

START DRDY

CS

SCLK

DIN

DOUT

ADS1294

(Device 2)

START(1)

a) Cascaded Configuration

CLK

CLK

INT

GPO0

GPO1

SCLK

MOSI

Host Processor

MISO

CLK

START DRDY

CS

SCLK

DIN

DOUT1

ADS1298

(Device 1)

START

DRDY

CS

SCLK

DIN

DAISY_IN2

ADS1294

(Device 2)

START(1)

b) Daisy-Chain Configuration

CLK

CLK

INT

GPO

SCLK

MOSI

Host Processor

MISO

CLK

0

DOUT2

DAISY_IN1

DOUT

DAISY_IN1

0

DO TU 0

SCLK

MSB1

MSB0

21 3 216 217 218

MSB1LSB0

LSB1

219 338

LSB1

Da a ft rom first d ce (evi ADS1298) Da a ft rom second vide ce (ADS1294)

XX


Cascaded Mode

Figure 45a shows a configuration with two devices cascaded together. One of the devices is an ADS1298 (eightchannels) and the other is an ADS1294 (four channels). Together, they create a system with 12 channels.DOUT, SCLK, and DIN are shared. Each device has its own chip select. When a device is not selected by thecorresponding CS being driven to logic 1, the DOUT of this device is high-impedance. This structure allows theother device to take control of the DOUT bus. This configuration method is suitable for the majority ofapplications.

Daisy-Chain Mode

Daisy-chain mode is enabled by setting the DAISY_EN bit in the CONFIG1 register. Figure 45b shows thedaisy-chain configuration. In this mode SCLK, DIN, and CS are shared across multiple devices. The DOUT ofone device is hooked up to the DAISY_IN of the other device, thereby creating a chain. One extra SCLK must beissued between each data set. Also, when using daisy-chain mode, the multiple readback feature is notavailable. Short the DAISY_IN pin to digital ground if not used. Figure 2 describes the required timing for theADS1298 shown in Figure 46. Data from the ADS1298 appear first on DOUT, followed by a don’t care bit, andfinally by the status and data words from the ADS1294.

(1) To reduce pin count, set the START pin low and use the START serial command to synchronize and start conversions.

Figure 45. Multiple Device Configurations

Figure 46. Daisy-Chain Timing for Figure 45b









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fSCLK

f (N )(NDR BITS CHANNELS) + 24N =DEVICES



In a case where all devices in the chain operate in the same register setting, DIN can be shared as well andthereby reduce the SPI communication signals to four, regardless of the number of devices. However, becausethe individual devices cannot be programmed, the RLD driver cannot be shared among the multiple devices.Furthermore, an external clock must be used.

Note that from Figure 2, the SCLK rising edge shifts data out of the ADS129x on DOUT. The SCLK rising edge isalso used to latch data into the device DAISY_IN pin down the chain. This architecture allows for a faster SCLKrate speed, but it also makes the interface sensitive to board level signal delays. The more devices in the chain,the more challenging it could become to adhere to setup and hold times. A star pattern connection of SCLK to alldevices, minimizing length of DOUT, and other PCB layout techniques help. Placing delay circuits such asbuffers between DOUT and DAISY_IN are ways to mitigate this challenge. One other option is to insert a Dflip-flop between DOUT and DAISY_IN clocked on an inverted SCLK. Note also that daisy-chain mode requiressome software overhead to recombine data bits spread across byte boundaries.

The maximum number of devices that can be daisy-chained depends on the data rate at which the device isbeing operated. The maximum number of devices can be estimated with Equation 7.

where:NBITS = device resolution (depends on data rate), andNCHANNELS = number of channels in the device (4, 6, or 8). (7)

For example, when the ADS1298 (eight-channel, 24-bit version) is operated at a 2kSPS data rate with a 4MHzfSCLK, 10 devices can be daisy-chained.









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SPI COMMAND DEFINITIONS

The ADS129x provide flexible configuration control. The opcode commands, summarized in Table 11, controland configure the operation of the ADS129x. The opcode commands are stand-alone, except for the registerread and register write operations that require a second command byte plus data. CS can be taken high or heldlow between opcode commands but must stay low for the entire command operation (especially for multi-bytecommands). System opcode commands and the RDATA command are decoded by the ADS129x on the seventhfalling edge of SCLK. The register read/write opcodes are decoded on the eighth SCLK falling edge. Be sure tofollow SPI timing requirements when pulling CS high after issuing a command.

Table 11. Opcode Command Definitions

COMMAND DESCRIPTION FIRST BYTE SECOND BYTE

System Commands

WAKEUP Wake-up from standby mode 0000 0010 (02h)

STANDBY Enter standby mode 0000 0100 (04h)

RESET Reset the device 0000 0110 (06h)

START Start/restart (synchronize) conversions 0000 1000 (08h)

STOP Stop conversion 0000 1010 (0Ah)

Data Read Commands

Enable Read Data Continuous mode.RDATAC 0001 0000 (10h)This mode is the default mode at power-up. (1)

SDATAC Stop Read Data Continuously mode 0001 0001 (11h)

RDATA Read data by command; supports multiple read back. 0001 0010 (12h)

Register Read Commands

RREG Read n nnnn registers starting at address r rrrr 001r rrrr (2xh) (2) 000n nnnn (2)

WREG Write n nnnn registers starting at address r rrrr 010r rrrr (4xh) (2) 000n nnnn (2)

(1) When in RDATAC mode, the RREG command is ignored.(2) n nnnn = number of registers to be read/written – 1. For example, to read/write three registers, set n nnnn = 0 (0010). r rrrr = starting

register address for read/write opcodes.

WAKEUP: Exit STANDBY Mode

This opcode exits the low-power standby mode; see the STANDBY: Enter STANDBY Mode subsection of theSPI Command Definitions section. Time is required when exiting standby mode (see the ElectricalCharacteristics for details). There are no restrictions on the SCLK rate for this command and it can beissued any time. Any subsequent command must be sent after 4 tCLK cycles.

STANDBY: Enter STANDBY Mode

This opcode command enters the low-power standby mode. All parts of the circuit are shut down except for thereference section. The standby mode power consumption is specified in the Electrical Characteristics. There areno restrictions on the SCLK rate for this command and it can be issued any time. Send a WAKEUPcommand to return device to normal operation. Serial interface is active, thus register read/write commands arepermitted while in this mode.

RESET: Reset Registers to Default Values

This command resets the digital filter cycle and returns all register settings to the respective default values. Seethe Reset (RESET) subsection of the SPI Interface section for more details. There are no restrictions on theSCLK rate for this command and it can be issued any time. 18 tCLK cycles are required to execute theRESET command. Avoid sending any commands during this time.









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START

DRDY

CS

SCLK

DINtUPDATE

DOUTHi-Z

RDATAC Opcode

Status Register + 8-Channel Data (216 Bits) Next Data



START: Start Conversions

This opcode starts data conversions. Tie the START pin low to control conversions by command. If conversionsare in progress this command has no effect. The STOP opcode command is used to stop conversions. If theSTART command is immediately followed by a STOP command, there must be a gap of 4 tCLK cycles betweenthe two commands. When the START opcode is sent to the device, keep the START pin low until the STOPcommand is issued. (See the START subsection of the SPI Interface section for more details.) There are norestrictions on the SCLK rate for this command and it can be issued any time.

STOP: Stop Conversions

This opcode stops conversions. Tie the START pin low to control conversions by command. When the STOPcommand is sent, the conversion in progress completes and further conversions are stopped. If conversions arealready stopped, this command has no effect. There are no restrictions on the SCLK rate for this commandand it can be issued any time.

RDATAC: Read Data Continuous

This opcode enables the output of conversion data on each DRDY without the need to issue subsequent readdata opcodes. This mode places the conversion data in the output register and may be shifted out directly. Theread data continuous mode is the default mode of the device and the device defaults to this mode on power-upand reset.

RDATAC mode is cancelled by the Stop Read Data Continuous command. If the device is in RDATAC mode, aSDATAC command must be issued before any other commands can be sent to the device. There is norestriction on the SCLK rate for this command. However, the subsequent data retrieval SCLKs or the SDATACopcode command should wait at least 4 tCLK cycles. The timing for RDATAC is shown in Figure 47. As Figure 47shows, there is a keep out zone of 4 tCLK cycles around the DRDY pulse when this command cannot be issued.If no data are retrieved from the device, DOUT and DRDY behave similarly in this mode. To retrieve data fromthe device after RDATAC command is issued, make sure either the START pin is high or the START commandis issued. Figure 47 shows the recommended way to use the RDATAC command. RDATAC is ideally suited forapplications such as data loggers or recorders where registers are set once and do not need to be re-configured.

(1) tUPDATE = 4/fCLK. Do not read data during this time.

Figure 47. RDATAC Usage

SDATAC: Stop Read Data Continuous

This opcode cancels the Read Data Continuous mode. There is no restriction on the SCLK rate for thiscommand, but the subsequent command must wait for 4 tCLK cycles.









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Hi-Z

START

DRDY

CS

SCLK

DIN

DOUT

RDATA Opcode

Status Register+ 8-Channel Data (216 Bits)

RDATA Opcode


RDATA: Read Data

Issue this command after DRDY goes low to read the conversion result (in Stop Read Data Continuous mode).There is no restriction on the SCLK rate for this command, and there is no wait time needed for the subsequentcommands or data retrieval SCLKs. To retrieve data from the device after RDATA command is issued, makesure either the START pin is high or the START command is issued. When reading data with the RDATAcommand, the read operation can overlap the occurrence of the next DRDY without data corruption. Figure 48shows the recommended way to use the RDATA command. RDATA is best suited for ECG- and EEG-typesystems where register settings must be read or changed often between conversion cycles.

Figure 48. RDATA Usage

Sending Multi-Byte Commands

The ADS129x serial interface decodes commands in bytes and requires 4 tCLK cycles to decode and execute.Therefore, when sending multi-byte commands, a 4 tCLK period must separate the end of one byte (or opcode)and the next.

Assume CLK is 2.048MHz, then tSDECODE (4 tCLK) is 1.96µs. When SCLK is 16MHz, one byte can be transferredin 500ns. This byte transfer time does not meet the tSDECODE specification; therefore, a delay must be inserted sothe end of the second byte arrives 1.46µs later. If SCLK is 4MHz, one byte is transferred in 2µs. Because thistransfer time exceeds the tSDECODE specification, the processor can send subsequent bytes without delay. In thislater scenario, the serial port can be programmed to cease single-byte transfer per cycle to multiple bytes.









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1 9 17 25

CS

SCLK

DIN OPCODE 1 OPCODE 2

DOUT REG DATA REG DATA + 1

1 9 17 25

CS

SCLK

DIN OPCODE 1 OPCODE 2 REG DATA 1 REG DATA 2

DOUT



RREG: Read From Register

This opcode reads register data. The Register Read command is a two-byte opcode followed by the output of theregister data. The first byte contains the command opcode and the register address. The second byte of theopcode specifies the number of registers to read – 1.

First opcode byte: 001r rrrr, where r rrrr is the starting register address.

Second opcode byte: 000n nnnn, where n nnnn is the number of registers to read – 1.

The 17th SCLK rising edge of the operation clocks out the MSB of the first register, as shown in Figure 49. Whenthe device is in read data continuous mode, it is necessary to issue a SDATAC command before a RREGcommand can be issued. An RREG command can be issued any time. However, because this command is amulti-byte command, there are restrictions on the SCLK rate depending on the way the SCLKs are issued. Seethe Serial Clock (SCLK) subsection of the SPI Interface section for more details. Note that CS must be low forthe entire command.

Figure 49. RREG Command Example: Read Two Registers Starting from Register 00h (ID Register)(OPCODE 1 = 0010 0000, OPCODE 2 = 0000 0001)

WREG: Write to Register

This opcode writes register data. The Register Write command is a two-byte opcode followed by the input of theregister data. The first byte contains the command opcode and the register address.

The second byte of the opcode specifies the number of registers to write – 1.

First opcode byte: 010r rrrr, where r rrrr is the starting register address.

Second opcode byte: 000n nnnn, where n nnnn is the number of registers to write – 1.

After the opcode bytes, the register data follows (in MSB-first format), as shown in Figure 50. WREG commandcan be issued any time. However, because this command is a multi-byte command, there are restrictions on theSCLK rate depending on the way the SCLKs are issued. See the Serial Clock (SCLK) subsection of the SPIInterface section for more details. Note that CS must be low for the entire command.

Figure 50. WREG Command Example: Write Two Registers Starting from 00h (ID Register)(OPCODE 1 = 0100 0000, OPCODE 2 = 0000 0001)









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REGISTER MAP

Table 12 lists the various ADS129x registers.

Table 12. Register AssignmentsRESETVALUE

ADDRESS REGISTER (Hex) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Device Settings (Read-Only Registers)

00h ID xx DEV_ID7 DEV_ID6 DEV_ID5 1 0 DEV_ID2 DEV_ID1 DEV_ID0

Global Settings Across Channels

01h CONFIG1 06 HR DAISY_EN CLK_EN 0 0 DR2 DR1 DR0

02h CONFIG2 40 0 0 WCT_CHOP INT_TEST 0 TEST_AMP TEST_FREQ1 TEST_FREQ0

RLD_LOFF_03h CONFIG3 40 PD_REFBUF 1 VREF_4V RLD_MEAS RLDREF_INT PD_RLD RLD_STAT

SENS

VLEAD_OFF_04h LOFF 00 COMP_TH2 COMP_TH1 COMP_TH0 ILEAD_OFF1 ILEAD_OFF0 FLEAD_OFF1 FLEAD_OFF0

EN

Channel-Specific Settings

05h CH1SET 00 PD1 GAIN12 GAIN11 GAIN10 0 MUXn2 MUXn1 MUXn0

06h CH2SET 00 PD2 GAIN22 GAIN21 GAIN20 0 MUX22 MUX21 MUX20



09h CH5SET(1) 00 PD5 GAIN52 GAIN51 GAIN50 0 MUX52 MUX51 MUX50

0Ah CH6SET(1) 00 PD6 GAIN62 GAIN61 GAIN60 0 MUX62 MUX61 MUX60

0Bh CH7SET(1) 00 PD7 GAIN72 GAIN71 GAIN70 0 MUX72 MUX71 MUX70

0Ch CH8SET(1) 00 PD8 GAIN82 GAIN81 GAIN80 0 MUX82 MUX81 MUX80

0Dh RLD_SENSP (2) 00 RLD8P(1) RLD7P(1) RLD6P(1) RLD5P(1) RLD4P RLD3P RLD2P RLD1P

0Eh RLD_SENSN (2) 00 RLD8N(1) RLD7N(1) RLD6N(1) RLD5N(1) RLD4N RLD3N RLD2N RLD1N

0Fh LOFF_SENSP (2) 00 LOFF8P LOFF7P LOFF6P LOFF5P LOFF4P LOFF3P LOFF2P LOFF1P

10h LOFF_SENSN (2) 00 LOFF8N LOFF7N LOFF6N LOFF5N LOFF4N LOFF3N LOFF2N LOFF1N

11h LOFF_FLIP 00 LOFF_FLIP8 LOFF_FLIP7 LOFF_FLIP6 LOFF_FLIP5 LOFF_FLIP4 LOFF_FLIP3 LOFF_FLIP2 LOFF_FLIP1

Lead-Off Status Registers (Read-Only Registers)

12h LOFF_STATP 00 IN8P_OFF IN7P_OFF IN6P_OFF IN5P_OFF IN4P_OFF IN3P_OFF IN2P_OFF IN1P_OFF

13h LOFF_STATN 00 IN8N_OFF IN7N_OFF IN6N_OFF IN5N_OFF IN4N_OFF IN3N_OFF IN2N_OFF IN1N_OFF

GPIO and OTHER Registers

14h GPIO 0F GPIOD4 GPIOD3 GPIOD2 GPIOD1 GPIOC4 GPIOC3 GPIOC2 GPIOC1

15h PACE 00 0 0 0 PACEE1 PACEE0 PACEO1 PACEO0 PD_PACE

RESP_ RESP_MOD_16h RESP 00 1 RESP_PH2 RESP_PH1 RESP_PH0 RESP_CTRL1 RESP_CTRL0

DEMOD_EN1 EN1

SINGLE_ WCT_TO_ PD_LOFF_17h CONFIG4 00 RESP_FREQ2 RESP_FREQ1 RESP_FREQ0 0 0

SHOT RLD COMP

18h WCT1 00 aVF_CH6 aVL_CH5 aVR_CH7 avR_CH4 PD_WCTA WCTA2 WCTA1 WCTA0

19h WCT2 00 PD_WCTC PD_WCTB WCTB2 WCTB1 WCTB0 WCTC2 WCTC1 WCTC0

(1) CH5SET and CH6SET are not available for the ADS1294/4R. CH7SET and CH8SET registers are not available for the ADS1294/4Rand ADS1296/6R.

(2) The RLD_SENSP, PACE_SENSP, LOFF_SENSP, LOFF_SENSN, and LOFF_FLIP registers bits[5:4] are not available for theADS1294/4R. Bits[7:6] are not available for the ADS1294/6/4R/6R.









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User Register Description

ID: ID Control Register (Factory-Programmed, Read-Only)

Address = 00h

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

DEV_ID7 DEV_ID6 DEV_ID5 1 0 DEV_ID2 DEV_ID1 DEV_ID0

The ID Control Register is programmed during device manufacture to indicate device characteristics.

Bits[7:5] DEV_ID[7:5]: Device family identification

These bits indicate the device family.000 = Reserved011 = Reserved100 = ADS129x device family101 = Reserved110 = ADS129xR device family111 = Reserved

Bit 4 This bit reads high.

Bit 3 This bit reads low.

Bits[2:0] DEV_ID[2:0]: Channel number identification

These bits indicates number of channels.000 = 4-channel ADS1294 or ADS1294R001 = 6-channel ADS1296 or ADS1296R010 = 8-channel ADS1298 or ADS1298R011 = Reserved111 = Reserved









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CONFIG1: Configuration Register 1

Address = 01h


HR DAISY_EN CLK_EN 0 0 DR2 DR1 DR0

Bit 7 HR: High-Resolution/Low-Power mode

This bit determines whether the device runs in Low-Power or High-Resolution mode.0 = Low-Power mode (default)1 = High-Resolution mode

Bit 6 DAISY_EN: Daisy-chain/multiple readback mode

This bit determines which mode is enabled.0 = Daisy-chain mode (default)1 = Multiple readback mode

Bit 5 CLK_EN: CLK connection (1)

This bit determines if the internal oscillator signal is connected to the CLK pin when the CLKSEL pin = 1.0 = Oscillator clock output disabled (default)1 = Oscillator clock output enabled

Bits[4:3] Must always be set to '0'

Bits[2:0] DR[2:0]: Output data rate

For High-Resolution mode, fMOD = fCLK/4. For low power mode, fMOD = fCLK/8.These bits determine the output data rate of the device.

(1) Additional power is consumed when driving external devices.

BIT DATA RATE HIGH-RESOLUTION MODE (1) LOW-POWER MODE (2)

000 fMOD/16 32kSPS 16kSPS





101 fMOD/512 1kSPS 500SPS

110 (default) fMOD/1024 500SPS 250SPS

111 Do not use n/a n/a

(1) Additional power is consumed when driving external devices.(2) fCLK = 2.048MHz.









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Address = 02h


0 0 WCT_CHOP INT_TEST 0 TEST_AMP TEST_FREQ1 TEST_FREQ0

Configuration Register 2 configures the test signal generation. See the Input Multiplexer section for more details.


Bit 5 WCT_CHOP: WCT chopping scheme

This bit determines whether the chopping frequency of WCT amplifiers is variable or fixed.0 = Chopping frequency varies, see Table 131 = Chopping frequency constant at fMOD/16

Bit 4 INT_TEST: TEST source

This bit determines the source for the Test signal.0 = Test signals are driven externally (default)1 = Test signals are generated internally

Bit 3 Must always be set to '0'

Bit 2 TEST_AMP: Test signal amplitude

These bits determine the calibration signal amplitude.0 = 1 × –(VREFP – VREFN)/2.4mV (default)1 = 2 × –(VREFP – VREFN)/2.4mV

Bits[1:0] TEST_FREQ[1:0]: Test signal frequency

These bits determine the calibration signal frequency.00 = Pulsed at fCLK/221 (default)01 = Pulsed at fCLK/220

10 = Not used11 = At dc









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Address = 03h


PD_REFBUF 1 VREF_4V RLD_MEAS RLDREF_INT PD_RLD RLD_LOFF_SENS RLD_STAT

Configuration Register 3 configures multi-reference and RLD operation.

Bit 7 PD_REFBUF: Power-down reference buffer

This bit determines the power-down reference buffer state.0 = Power-down internal reference buffer (default)1 = Enable internal reference buffer


Default is '1' at power-up.

Bit 5 VREF_4V: Reference voltage

This bit determines the reference voltage, VREFP.0 = VREFP is set to 2.4V (default)1 = VREFP is set to 4V (use only with a 5V analog supply)

Bit 4 RLD_MEAS: RLD measurement

This bit enables RLD measurement. The RLD signal may be measured with any channel.0 = Open (default)1 = RLD_IN signal is routed to the channel that has the MUX_Setting 010 (VREF)

Bit 3 RLDREF_INT: RLDREF signal

This bit determines the RLDREF signal source.0 = RLDREF signal fed externally (default)1 = RLDREF signal (AVDD – AVSS)/2 generated internally

Bit 2 PD_RLD: RLD buffer power

This bit determines the RLD buffer power state.0 = RLD buffer is powered down (default)1 = RLD buffer is enabled

Bit 1 RLD_LOFF_SENS: RLD sense function

This bit enables the RLD sense function.0 = RLD sense is disabled (default)1 = RLD sense is enabled

Bit 0 RLD_STAT: RLD lead-off status

This bit determines the RLD status.0 = RLD is connected (default)1 = RLD is not connected









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LOFF: Lead-Off Control Register

Address = 04h


COMP_TH2 COMP_TH1 COMP_TH0 VLEAD_OFF_EN ILEAD_OFF1 ILEAD_OFF0 FLEAD_OFF1 FLEAD_OFF0

The Lead-Off Control Register configures the Lead-Off detection operation.

Bits[7:5] COMP_TH[2:0]: Lead-off comparator threshold

These bits determine the lead-off comparator threshold level setting. See the Lead-Off Detection subsection of theECG-Specific Functions section for a detailed description.

Comparator positive side

000 = 95% (default)001 = 92.5%010 = 90%011 = 87.5%100 = 85%101 = 80%110 = 75%111 = 70%

Comparator negative side

000 = 5% (default)001 = 7.5%010 = 10%011 = 12.5%100 = 15%101 = 20%110 = 25%111 = 30%

Bit 4 VLEAD_OFF_EN: Lead-off detection mode

This bit determines the lead-off detection mode.0 = Current source mode lead-off (default)1 = Pull-up/pull-down resistor mode lead-off

Bits[3:2] ILEAD_OFF[1:0]: Lead-off current magnitude

These bits determine the magnitude of current for the current lead-off mode.00 = 6nA (default)01 = 12nA10 = 18nA11 = 24nA

Bits[1:0] FLEAD_OFF[1:0]: Lead-off frequency

These bits determine the frequency of lead-off detect for each channel.00 = When any bits of the LOFF_SENSP or LOFF_SENSN registers are turned on, make sure that FLEAD[1:0] are eitherset to 01 or 11 (default)01 = AC lead-off detection at fDR/410 = Do not use11 = DC lead-off detection turned on









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CHnSET: Individual Channel Settings (n = 1 : 8)

Address = 05h to 0Ch


PD GAIN2 GAIN1 GAIN0 0 MUXn2 MUXn1 MUXn0

The CH[1:8]SET Control Register configures the power mode, PGA gain, and multiplexer settings channels. Seethe Input Multiplexer section for details. CH[2:8]SET are similar to CH1SET, corresponding to the respectivechannels.

Bit 7 PD: Power-down

This bit determines the channel power mode for the corresponding channel.0 = Normal operation (default)1 = Channel power-down.When powering down a channel, it is recommended that the channel be set to input short by setting the appropriateMUXn[2:0] = 001 of the CHnSET register.

Bits[6:4] GAIN[2:0]: PGA gain

These bits determine the PGA gain setting.

000 = 6 (default)001 = 1010 = 2011 = 3100 = 4101 = 8110 = 12

Bit 3 Always write '0'

Bits[2:0] MUXn[2:0]: Channel input

These bits determine the channel input selection.

000 = Normal electrode input (default)001 = Input shorted (for offset or noise measurements)010 = Used in conjunction with RLD_MEAS bit for RLD measurements. See the Right Leg Drive (RLD DC Bias Circuit)subsection of the ECG-Specific Functions section for more details.011 = MVDD for supply measurement100 = Temperature sensor101 = Test signal110 = RLD_DRP (positive electrode is the driver)111 = RLD_DRN (negative electrode is the driver)

RLD_SENSP

Address = 0Dh


RLD8P RLD7P RLD6P RLD5P RLD4P RLD3P RLD2P RLD1P

This register controls the selection of the positive signals from each channel for right leg drive derivation. See theRight Leg Drive (RLD DC Bias Circuit) subsection of the ECG-Specific Functions section for details.

Note that registers bits[5:4] are not available for the ADS1294/4R. Bits[7:6] are not available for theADS1294/6/4R/6R.

RLD_SENSN

Address = 0Eh


RLD8N RLD7N RLD6N RLD5N RLD4N RLD3N RLD2N RLD1N

This register controls the selection of the negative signals from each channel for right leg drive derivation. Seethe Right Leg Drive (RLD DC Bias Circuit) subsection of the ECG-Specific Functions section for details.










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LOFF_SENSP

Address = 0Fh


LOFF8P LOFF7P LOFF6P LOFF5P LOFF4P LOFF3P LOFF2P LOFF1P

This register selects the positive side from each channel for lead-off detection. See the Lead-Off Detectionsubsection of the ECG-Specific Functions section for details. Note that the LOFF_STATP register bits are onlyvalid if the corresponding LOFF_SENSP bits are set to '1'.


LOFF_SENSN

Address = 10h


LOFF8N LOFF7N LOFF6N LOFF5N LOFF4N LOFF3N LOFF2N LOFF1N

This register selects the negative side from each channel for lead-off detection. See the Lead-Off Detectionsubsection of the ECG-Specific Functions section for details. Note that the LOFF_STATN register bits are onlyvalid if the corresponding LOFF_SENSN bits are set to '1'.


LOFF_FLIP

Address = 11h


LOFF_FLIP8 LOFF_FLIP7 LOFF_FLIP6 LOFF_FLIP5 LOFF_FLIP4 LOFF_FLIP3 LOFF_FLIP2 LOFF_FLIP1

This register controls the direction of the current used for lead-off derivation. See the Lead-Off Detectionsubsection of the ECG-Specific Functions section for details.

LOFF_STATP (Read-Only Register)

Address = 12h


IN8P_OFF IN7P_OFF IN6P_OFF IN5P_OFF IN4P_OFF IN3P_OFF IN2P_OFF IN1P_OFF

This register stores the status of whether the positive electrode on each channel is on or off. See the Lead-OffDetection subsection of the ECG-Specific Functions section for details. Ignore the LOFF_STATP values if thecorresponding LOFF_SENSP bits are not set to '1'.

'0' is lead-on (default) and '1' is lead-off. When the LOFF_SENSEP bits are '0', the LOFF_STATP bits should beignored.









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LOFF_STATN (Read-Only Register)

Address = 13h


IN8N_OFF IN7N_OFF IN6N_OFF IN5N_OFF IN4N_OFF IN3N_OFF IN2N_OFF IN1N_OFF

This register stores the status of whether the negative electrode on each channel is on or off. See the Lead-OffDetection subsection of the ECG-Specific Functions section for details. Ignore the LOFF_STATN values if thecorresponding LOFF_SENSN bits are not set to '1'.

'0' is lead-on (default) and '1' is lead-off. When the LOFF_SENSEN bits are '0', the LOFF_STATP bits should beignored.

GPIO: General-Purpose I/O Register

Address = 14h


GPIOD4 GPIOD3 GPIOD2 GPIOD1 GPIOC4 GPIOC3 GPIOC2 GPIOC1

The General-Purpose I/O Register controls the action of the three GPIO pins. Note that when RESP_CTRL[1:0]is in mode 01 and 11, the GPIO2, GPIO3, and GPIO4 pins are not available for use.

Bits[7:4] GPIOD[4:1]: GPIO data

These bits are used to read and write data to the GPIO ports.When reading the register, the data returned correspond to the state of the GPIO external pins, whether they areprogrammed as inputs or as outputs. As outputs, a write to the GPIOD sets the output value. As inputs, a write to theGPIOD has no effect. GPIO is not available in certain respiration modes.

Bits[3:0] GPIOC[4:1]: GPIO control (corresponding GPIOD)

These bits determine if the corresponding GPIOD pin is an input or output.0 = Output1 = Input (default)

PACE: PACE Detect Register

Address = 15h


0 0 0 PACEE1 PACEE0 PACEO1 PACEO0 PD_PACE

This register provides the PACE controls that configure the channel signal used to feed the external PACE detectcircuitry. See the Pace Detect subsection of the ECG-Specific Functions section for details.


Bits[4:3] PACEE[1:0]: PACE even channels

These bits control the selection of the even number channels available on TEST_PACE_OUT1. Note that only one channelmay be selected at any time.00 = Channel 2 (default)01 = Channel 410 = Channel 6, ADS1296/8/6R/8R only11 = Channel 8, ADS1298/8R only

Bits[2:1] PACEO[1:0]: PACE odd channels

These bits control the selection of the odd number channels available on TEST_PACE_OUT2. Note that only one channelmay be selected at any time.00 = Channel 1 (default)01 = Channel 310 = Channel 5, ADS1296/8/6R/8R only11 = Channel 7, ADS1298/8R only

Bit 0 PD_PACE: PACE detect buffer

This bit is used to enable/disable the PACE detect buffer.0 = PACE detect buffer turned off (default)1 = PACE detect buffer turned on









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RESP: Respiration Control Register

Address = 16h


RESP_ RESP_MOD_ 1 RESP_PH2 RESP_PH1 RESP_PH0 RESP_CTRL1 RESP_CTRL0DEMOD_EN1 EN1

This register provides the controls for the respiration circuitry; see the Respiration section for details.

Bit 7 RESP_DEMOD_EN1: Enables respiration demodulation circuitry (ADS1294R/6R/8R only, for ADS1294/6/8 alwayswrite '0')

This bit enables/disables the demodulation circuitry on channel 1.0 = RESP demodulation circuitry turned off (default)1 = RESP demodulation circuitry turned on

Bit 6 RESP_MOD_EN1: Enables respiration modulation circuitry (ADS1294R/6R/8R only, for ADS1294/6/8 always write '0')

This bit enables/disables the modulation circuitry on channel 1.0 = RESP modulation circuitry turned off (default)1 = RESP modulation circuitry turned on

Bit 5 Reserved

Must always be set to '1' for ADS1294R/6R/8R. This bit does not have any effect for the ADS1294/6/8.

Bits[4:2] RESP_PH[2:0]: Respiration phase (1)

These bits control the phase of the respiration demodulation control signal. (GPIO4 is out-of-phase with GPIO3 by thephase determined by the RESP_PH bits.)

000 = 22.5° (default)001 = 45°010 = 67.5°011 = 90°100 = 112.5°101 = 135°110 = 157.5°111 = N/A

Bits[1:0] RESP_CTRL[1:0]: Respiration control

These bits set the mode of the respiration circuitry.00 = No respiration (default)01= External respiration10 = Internal respiration with internal signals11 = Internal respiration with user-generated signals

(1) RESP_PH[2:0] phase control bits only for internal respiration (RESP_CTRL = 10) and external respiration (RESP_CTRL = 01) modeswhen the CONFIG4.RESP_FREQ[2:0] register bits are 000b or 001b.









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Address = 17h


RESP_FREQ2 RESP_FREQ1 RESP_FREQ0 0 SINGLE_SHOT WCT_TO_RLD PD_LOFF_COMP 0

Bits[7:5] RESP_FREQ[2:0]: Respiration modulation frequency

These bits control the respiration control frequency when RESP_CTRL[1:0] = 10 or RESP_CTRL[1:0] = 10 (1).

000 = 64kHz modulation clock001 = 32kHz modulation clock010 = 16kHz square wave on GPIO3 and GPIO04. Output on GPIO4 is 180 degree out of phase with GPIO3.011 = 8kHz square wave on GPIO3 and GPIO04. Output on GPIO4 is 180 degree out of phase with GPIO3.100 = 4kHz square wave on GPIO3 and GPIO04. Output on GPIO4 is 180 degree out of phase with GPIO3.101 = 2kHz square wave on GPIO3 and GPIO04. Output on GPIO4 is 180 degree out of phase with GPIO3.110 = 1kHz square wave on GPIO3 and GPIO04. Output on GPIO4 is 180 degree out of phase with GPIO3.111 = 500Hz square wave on GPIO3 and GPIO04. Output on GPIO4 is 180 degree out of phase with GPIO3.

Modes 000 and 001 are modulation frequencies in internal and external respiration modes. In internal respiration mode, thecontrol signals appear at the RESP_MODP and RESP_MODN terminals. All other bit settings generate square waves asdescribed above on GPIO4 and GPIO3.

(1) These frequencies assume fCLK = 2.048MHz.


Bit 3 SINGLE_SHOT: Single-shot conversion

This bit sets the conversion mode.0 = Continuous conversion mode (default)1 = Single-shot mode

Bit 2 WCT_TO_RLD: Connects the WCT to the RLD

This bit connects WCT to RLD.0 = WCT to RLD connection off (default)1 = WCT to RLD connection on

Bit 1 PD_LOFF_COMP: Lead-off comparator power-down

This bit powers down the lead-off comparators.0 = Lead-off comparators disabled (default)1 = Lead-off comparators enabled










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WCT1: Wilson Central Terminal and Augmented Lead Control Register

Address = 18h


aVF_CH6 aVL_CH5 aVR_CH7 aVR_CH4 PD_WCTA WCTA2 WCTA1 WCTA0

The WCT1 control register configures the device WCT circuit channel selection and the augmented leads.

Bit 7 aVF_CH6: Enable (WCTA + WCTB)/2 to the negative input of channel 6 (ADS1296/8/6R/8R)

0 = Disabled (default)1 = Enabled

Bit 6 aVL_CH5: Enable (WCTA + WCTC)/2 to the negative input of channel 5 (ADS1296/8/6R/8R)


Bit 5 aVR_CH7: Enable (WCTB + WCTC)/2 to the negative input of channel 7 (ADS1298/8R)


Bit 4 aVR_CH4: Enable (WCTB + WCTC)/2 to the negative input of channel 4


Bit 3 PD_WCTA: Power-down WCTA

0 = Powered down (default)1 = Powered on

Bits[2:0] WCTA[2:0]: WCT amplifier A channel selection; typically connected to RA electrode.

These bits select one of the eight electrode inputs of channels 1 to 4.

000 = Channel 1 positive input connected to WCTA amplifier (default)001 = Channel 1 negative input connected to WCTA amplifier010 = Channel 2 positive input connected to WCTA amplifier011 = Channel 2 negative input connected to WCTA amplifier100 = Channel 3 positive input connected to WCTA amplifier101 = Channel 3 negative input connected to WCTA amplifier110 = Channel 4 positive input connected to WCTA amplifier111 = Channel 4 negative input connected to WCTA amplifier









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WCT2: Wilson Central Terminal Control Register

Address = 19h


PD_WCTC PD_WCTB WCTB2 WCTB1 WCTB0 WCTC2 WCTC1 WCTC0

The WCT2 configuration register configures the device WCT circuit channel selection.

Bit 7 PD_WCTC: Power-down WCTC


Bit 6 PD_WCTB: Power-down WCTB


Bits[5:3] WCTB[2:0]: WCT amplifier B channel selection; typically connected to LA electrode.


000 = Channel 1 positive input connected to WCTB amplifier (default)001 = Channel 1 negative input connected to WCTB amplifier010 = Channel 2 positive input connected to WCTB amplifier011 = Channel 2 negative input connected to WCTB amplifier100 = Channel 3 positive input connected to WCTB amplifier101 = Channel 3 negative input connected to WCTB amplifier110 = Channel 4 positive input connected to WCTB amplifier111 = Channel 4 negative input connected to WCTB amplifier

Bits[2:0] WCTC[2:0]: WCT amplifier C channel selection; typically connected to LL electrode.


000 = Channel 1 positive input connected to WCTC amplifier (default)001 = Channel 1 negative input connected to WCTC amplifier010 = Channel 2 positive input connected to WCTC amplifier011 = Channel 2 negative input connected to WCTC amplifier100 = Channel 3 positive input connected to WCTC amplifier101 = Channel 3 negative input connected to WCTC amplifier110 = Channel 4 positive input connected to WCTC amplifier111 = Channel 4 negative input connected to WCTC amplifier









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MUX1[2:0] = 000

RLD_SENSP[0] = 1

RLD_SENSN[0] = 1

MUX2[2:0] = 000

MUX3[2:0] = 000

MUX8[2:0] = 111

PGA1

RLD_SENSP[1] = 1

RLD_SENSN[1] = 1PGA2

RLD_SENSP[2] = 1


RLD_AMP

RLD_SENSP[7] = 0


RLDOUT RLDINVRLDREFRLDIN

Filter or

Feedthrough

ADS1298

¼ ¼

MUX

EMI

Filter

EMI

Filter

EMI

Filter

EMI

Filter

IN1P

¼

IN1N

IN2P

IN3P

IN8P

IN2N

IN3N

IN8N

1MW(1)

1.5nF(1)

RLDREF_INT

(AVDD + AVSS)/2

RLD

RE

F_IN

T



ECG-SPECIFIC FUNCTIONS

INPUT MULTIPLEXER (REROUTING THE RIGHT LEG DRIVE SIGNAL)

The input multiplexer has ECG-specific functions for the right leg drive signal. The RLD signal is available at theRLDOUT pin once the appropriate channels are selected for the RLD derivation, feedback elements are installedexternal to the chip, and the loop is closed. This signal can be fed after filtering or fed directly into the RLDIN pinas shown in Figure 51. This RLDIN signal can be multiplexed into any one of the input electrodes by setting theMUX bits of the appropriate channel set registers to 110 for P-side or 111 for N-side. Figure 51 shows the RLDsignal generated from channels 1, 2, and 3 and routed to the N-side of channel 8. This feature can be used todynamically change the electrode that is used as the reference signal to drive the patient body. Note that thecorresponding channel cannot be used and can be powered down.

(1) Typical values for example only.

Figure 51. Example of RLDOUT Signal Configured to be Routed to IN8N









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MUX1[2:0] = 000

RLD_SENSP[0] = 1

RLD_SENSN[0] = 1

MUX2[2:0] = 000

MUX3[2:0] = 000

MUX8[2:0] = 010

RLD_MEAS = 1AND

PGA1

RLD_SENSP[1] = 1


RLD_SENSP[2] = 1


RLD_AMP

RLD_SENSP[7] = 0


RLD_OUT RLD_INVRLD_REFRLD_IN

Filter or

Feedthrough

ADS1298

¼ ¼

IN1P

IN1N

EMI

Filter

MUX

EMI

Filter

EMI

Filter

EMI

Filter

¼

IN2N

IN3N

IN8N

IN2P

IN3P

IN8P

MUX8 010[2:0] =

1MW(1)

1.5nF(1)

RLDREF_INT

RLD

RE

F_IN

T

(AVDD + AVSS)/2


INPUT MULTIPLEXER (MEASURING THE RIGHT LEG DRIVE SIGNAL)

Also, the RLDOUT signal can be routed to a channel (that is not used for the calculation of RLD) formeasurement. Figure 52 shows the register settings to route the RLDIN signal to channel 8. The measurement isdone with respect to the voltage on the RLDREF pin. If RLDREF is chosen to be internal, it would be at (AVDD +AVSS)/2. This feature is useful for debugging purposes during product development.

(1) Typical values for example only.

Figure 52. RLDOUT Signal Configured to be Read Back by Channel 8









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Wcta

8:1 MUX

WC

T1[2

:0]

IN4N

IN4P

IN3N

IN3P

IN2N

IN2P

WCT

IN1N

IN1P

Wctb

8:1 MUX

WC

T2[5

:3]

Wctc

8:1 MUX

WC

T2[2

:0]

To Channel

PGAs

ADS1294/6/8

30kW 30kW 30kW

80pF

AVSS



WILSON CENTRAL TERMINAL (WCT) AND CHEST LEADS

In the standard 12-lead ECG, WCT voltage is defined as the average of Right Arm (RA), Left Arm (LA), and LeftLeg (LL) electrodes. This voltage is used as the reference voltage for the measurement of the chest leads. TheADS129x has three integrated low-noise amplifiers that generate the WCT voltage. Figure 53 shows the blockdiagram of the implementation.

Figure 53. WCT Voltage

The devices provide flexibility to choose any one of the eight signals (IN1P to IN4N) to be routed to each of theamplifiers to generate the average. Having this flexibility allows the RA, LA, and LL electrodes to be connected toany input of the first four channels depending on the lead configuration.

Each of the three amplifiers in the WCT circuitry can be powered down individually with register settings. Bypowering up two amplifiers, the average of any two electrodes can be generated at the WCT pin. Powering upone amplifier provides the buffered electrode voltage at the WCT pin. Note that the WCT amplifiers have limiteddrive strength and thus should be buffered if used to drive a low-impedance load.

See Table 5 for performance when using any 1, 2, or 3 of the WCT buffers.

As can be seen in Table 5, the overall noise reduces when more than one WCT amplifier is powered up. Thisnoise reduction is a result of the fact that noise is averaged by the passive summing network at the output of theamplifiers. Powering down individual buffers gives negligible power savings because a significant portion of thecircuitry is shared between the three amplifiers. The bandwidth of the WCT node is limited by the RC network.The internal summing network consists of three 30kΩ resistors and a 80pF capacitor. It is recommended that anexternal 100pF capacitor be added for optimal performance. The effective bandwidth depends on the number ofamplifiers that are powered up, as shown in Table 5.

The WCT node should be only be used to drive very high input impedances (typically greater than 500MΩ).Typical application would be to connect this WCT signal to the negative inputs of a ADS129x to be used as areference signal for the chest leads.









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200

180

160

140

120

100

80

60

40

20

00.3 2.8

Input Common-Mode Voltage (V)

WC

T Input Leakage C

urr

ent (p

A)

0.8

T = +25 C°A

1.3 1.8 2.3

DR = 0.5kSPS, 0.25kSPS

DR = 1kSPS

DR = 2kSPS

DR = 4kSPS

DR = 8kSPS

DR = 16kSPS

DR = 32kSPS

200

180

160

140

120

100

80

60

40

20

00.3 2.8

Input Common-Mode Voltage (V)

WC

T Input Leakage C

urr

ent (p

A)

0.8

T = +25 C°A

LP Mode

HR Mode

1.3 1.8 2.3


As mentioned previously in this section, all three WCT amplifiers can be connected to one of eight analog inputpins. The inputs of the amplifiers are chopped and the chopping frequency varies with the data rates of theADS129x. The chop frequency for the three highest data rates scale 1:1. For example, at 32kSPS data rate, thechop frequency is 32kHz in HR mode with WCT_CHOP = 0. The chopping frequency of the four lower data ratesis fixed to 4kHz. When WCT_CHOP = 1, the chop frequency is fixed to highest data rate (that is, fMOD/16)frequency, as shown in Table 13. The chop frequency shows itself at the output of the WCT amplifiers as a smallsquare wave riding on dc. The amplitude of the square wave is the offset of the amplifier and is typically 5mVPP.This artifact as a result of chopping is out-of-band and thus does not interfere with ECG-related measurements.As a result of the chopping function, the input current leakage on the pins with WCT amplifiers connected seesincreased leakage currents at higher data rates and as the input common voltage swings closer to 0V (AVSS),as described in Figure 54.

Note that if the output of a channel connected to the WCT amplifier (for example, the V lead channels) isconnected to one of the PACE amplifiers for external PACE detection, the artifact of chopping appears at thePACE amplifier output.

Figure 54. WCT Input Leakage Current versus Figure 55. WCT Input Leakage Current versusInput Voltage (WCT_CHOP = 0) Input Voltage (WCT_CHOP = 1)

Table 13. WCT Amplifiers Chop Frequency

CONFIG1.DR[2:0] BIT CONFIG2.WCT_CHOP = 0 CONFIG2.WCT_CHOP = 1

000 fMOD/16 fMOD/16

001 fMOD/32 fMOD/16

010 fMOD/64 fMOD/16

011 fMOD/128 fMOD/16












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Wcta

8:1 MUX

WC

T1[2

:0]

IN4N

IN4P

IN3N

IN3P

IN2N

IN2P

IN7N

IN7P

IN6N

IN6P

IN5N

IN5P

IN1N

IN1P

Wctb

8:1 MUX

WC

T2[5

:3]

Wctc

8:1 MUXW

CT

2[2

:0]

To ChannelPGAs

ADS1298

avF_ch6 avF_ch5 avF_ch7

avF_ch4

To ChannelPGAs



Augmented Leads

In the typical implementation of the 12-lead ECG with eight channels, the augmented leads are calculateddigitally. In certain applications, it may be required that all leads be derived in analog rather than digital. TheADS1298/8R provides the option to generate the augmented leads by routing appropriate averages to channels5 to 7. The same three amplifiers that are used to generate the WCT signal are used to generate the GoldbergerCentral Terminal signals as well. Figure 56 shows an example of generating the augmented leads in analogdomain. Note that in this implementation it takes more than eight channels to generate the standard 12 leads.Also, this feature is not available in the ADS1296/6R and ADS1294/4R.

Figure 56. Analog Domain Augmented Leads

Right Leg Drive with the WCT Point

In certain applications, the out-of-phase version of the WCT is used as the right leg drive reference. TheADS1298 provides the option to have a buffered version of the WCT terminal at the RLD_OUT pin. This signalcan be inverted in phase using an external amplifier and used as the right leg drive. Refer to the Right Leg Drive(RLD DC Bias Circuit) section for more details.









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a) LOFF_FLIP = 0 a) LOFF_FLIP = 1

PGA

10MW

10MW

AVDD

INP

INN

PGA

10MW

10MW

AVDD

INP

INN

ADS129x ADS129x

a) Pull-Up/Pull-Down Resistors b) Current Source

PGA

10MW

10MW

AVDD

INP

INN

PGA

AVDD

INP

INN

ADS129xADS129x


LEAD-OFF DETECTION

Patient electrode impedances are known to decay over time. It is necessary to continuously monitor theseelectrode connections to verify a suitable connection is present. The ADS129x lead-off detection functional blockprovides significant flexibility to the user to choose from various lead-off detection strategies. Though calledlead-off detection, this is in fact an electrode-off detection.

The basic principle is to inject an excitation signal and measure the response to determine if the electrode is off.As shown in the lead-off detection functional block diagram in Figure 59, this circuit provides two differentmethods of determining the state of the patient electrode. The methods differ in the frequency content of theexcitation signal. Lead-off can be selectively done on a per channel basis using the LOFF_SENSP andLOFF_SENSN registers. Also, the internal excitation circuitry can be disabled and just the sensing circuitry canbe enabled.

DC Lead-Off

In this approach, the lead-off excitation is with a dc signal. The dc excitation signal can be chosen from either apull-up/pull-down resistor or a current source/sink, shown in Figure 57. The selection is done by setting theVLEAD_OFF_EN bit in the LOFF register. One side of the channel is pulled to supply and the other side is pulledto ground. The pull-up resistor and pull-down resistor can be swapped (as shown in Figure 58) by setting the bitsin the LOFF_FLIP register. In case of current source/sink, the magnitude of the current can be set by using theILEAD_OFF[1:0] bits in the LOFF register. The current source/sink gives larger input impedance compared to the10MΩ pull-up/pull-down resistor.

Figure 57. DC Lead-Off Excitation Options Figure 58. LOFF_FLIP Usage

Sensing of the response can be done either by looking at the digital output code from the device or by monitoringthe input voltages with an on-chip comparator. If either of the electrodes is off, the pull-up resistors and/or thepull-down resistors saturate the channel. By looking at the output code it can be determined that either the P-sideor the N-side is off. To pinpoint which one is off, the comparators must be used. The input voltage is alsomonitored using a comparator and a 4-bit DAC whose levels are set by the COMP_TH[2:0] bits in the LOFFregister. The output of the comparators are stored in the LOFF_STATP and LOFF_STATN registers. These tworegisters are available as a part of the output data stream. (See the Data Output Protocol (DOUT) subsection ofthe SPI Interface section.) If dc lead-off is not used, the lead-off comparators can be powered down by settingthe PD_LOFF_COMP bit in the CONFIG4 register.

An example procedure to turn on dc lead-off is given in the Lead-Off subsection of the Guide to Get Up andRunning section.









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51kW

51kW

100kW

100kW

47nF

51kW100kW

47nF

47nF

4-Bit

DAC

Skin,

Electrode Contact

Model

Patient

Protection

Resistor

AVDD

LOFF_SENSP

VLEAD_OFF_EN

AND

AVSS

LOFF_SENSN

VLEAD_OFF_EN

AND

LOFF_SENSP

VLEAD_OFF_EN

AND LOFF_SENSN

VLEAD_OFF_EN

AND

RLD OUT

FLEAD_OFF[1:0]Vx

3.3MW

3.3MW

3.3MW

3.3MW

3.3MW

3.3MW

Anti-Aliasing Filter

< 512kHz

FLEAD_OFF[0:1]

AVDD AVSS

To ADC

LOFF_STATP

LOFF_STATN

COMP_TH[2:0]

VINP

VINN

(AVDD + AVSS)/2

7MW 7MW

10pF 10pF

PGAEMI

Filter

12pF

12pFPatient



AC Lead-Off

This method uses an out-of-band ac signal for excitation. The ac signal is generated by alternatively providingpull-up resistors and pull-down resistors at the input with a fixed frequency. The ac signal is passed through ananti-aliasing filter to avoid aliasing. The frequency can be chosen by the FLEAD_OFF[1:0] bits in the LOFFregister. The excitation frequency is a function of the output data rate and is fDR/4. This out-of-band excitationsignal is passed through the channel and measured at the output.

Sensing of the ac signal is done by passing the signal through the channel to digitize it and measure at theoutput. The ac excitation signals are introduced at a frequency that is above the band of interest, generating anout-of-band differential signal that can be filtered out separately and processed. By measuring the magnitude ofthe excitation signal at the output spectrum, the lead-off status can be calculated. Therefore, the ac lead-offdetection can be accomplished simultaneously with the ECG signal acquisition.

Figure 59. Lead-Off Detection









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51kW100kW

47nF

Skin,

Electrode Contact

Model

Patient

Protection

Resistor

AVSS

RLD_SENS

VLEAD_OFF_EN

AND

AVSS

RLD_STAT

Patient

RLD_SENS

VLEAD_OFF_EN

AND

To ADC input (through V

connection to any of the channels).REF

ILGND_OFF[1:0]


RLD LEAD-OFF

The ADS129x provide two modes for determining whether the RLD is correctly connected:• RLD lead-off detection during normal operation• RLD lead-off detection during power-up

The following sections provide details of the two modes of operation.

RLD Lead-Off Detection During Normal Operation

During normal operation, the ADS129x RLD lead-off at power-up function cannot be used because it isnecessary to power off the RLD amplifier.

RLD Lead-Off Detection At Power-Up

This feature is included in the ADS129x for use in determining whether the right leg electrode is suitablyconnected. At power-up, the ADS129x provide two measurement procedures to determine the RLD electrodeconnection status using either a current or a voltage pull-down resistor, as shown in Figure 60. The referencelevel of the comparator is set to determine the acceptable RLD impedance threshold.

Figure 60. RLD Lead-Off Detection at Power-Up

When the RLD amplifier is powered on, the current source has no function. Only the comparator can be used tosense the voltage at the output of the RLD amplifier. The comparator thresholds are set by the same LOFF[7:5]bits used to set the thresholds for other negative inputs.









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RIGHT LEG DRIVE (RLD DC BIAS CIRCUIT)

The right leg drive (RLD) circuitry is used as a means to counter the common-mode interference in a ECGsystem as a result of power lines and other sources, including fluorescent lights. The RLD circuit senses thecommon-mode of a selected set of electrodes and creates a negative feedback loop by driving the body with aninverted common-mode signal. The negative feedback loop restricts the common-mode movement to a narrowrange, depending on the loop gain. Stabilizing the entire loop is specific to the individual user system based onthe various poles in the loop. The ADS129x integrates the muxes to select the channel and an operationalamplifier. All the amplifier terminals are available at the pins, allowing the user to choose the components for thefeedback loop. The circuit shown in Figure 61 shows the overall functional connectivity for the RLD bias circuit.

The reference voltage for the right leg drive can be chosen to be internally generated (AVDD + AVSS)/2 or it canbe provided externally with a resistive divider. The selection of an internal versus external reference voltage forthe RLD loop is defined by writing the appropriate value to the RLDREF_INT bit in the CONFIG3 register.

If the RLD function is not used, the amplifier can be powered down using the PD_RLD bit (see the CONFIG3:Configuration Register 3 subsection of the Register Map section for details). This bit is also used in daisy-chainmode to power-down all but one of the RLD amplifiers.

The functionality of the RLDIN pin is explained in the Input Multiplexer section. An example procedure to use theRLD amplifier is shown in the Right Leg Drive subsection of the Guide to Get Up and Running section.









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220kW

50kW

50kW

RLD1P

220kW

20kW

RLD1N

220kW

50kW

50kW

RLD2P

20kW

220kW

RLD2N

From

MUX1P

From

MUX2P

From

MUX2N

From

MUX1N

220kW

50kW

50kW

RLD3P

220kW

20kW

RLD3N

220kW

50kW

50kW

RLD4P

20kW

220kW

RLD4N

From

MUX3P

From

MUX4P

From

MUX4N

From

MUX3N

220kW

50kW

50kW

RLD5P

220kW

20kW

RLD5N

220kW

50kW

50kW

RLD6P

20kW

220kW

RLD6N

From

MUX5P

From

MUX6P

From

MUX6N

(AVDD + AVSS)/2RLDOUT

From

MUX5N

220kW

50kW

50kW

R(1)

EXT

1MW

C(1)

EXT

1.5nF

RLD7P

220kW

20kW

RLD7N

220kW

50kW

50kW

RLD8P

20kW

220kW

RLD8N

RLDREF_INT

From

MUX7P

From

MUX8P

From

MUX8N

From

MUX7N

RLD

Amp

RLDINV

RLDREF

RLDREF_INT

PGA1P

PGA1N

PGA3P

PGA3N

PGA5P

PGA5N

PGA7P

PGA7N

PGA8N

PGA8P

PGA6N

PGA6P

PGA4N

PGA4P

PGA2N

PGA2P


(1) Typical values.

(2) When CONFIG3.RLDREF_INT = 0, the RLDREF_INT switch is closed and the RLDREF_INT switch is open. WhenCONFIG3.RLDREF_INT = 1, the RLDREF_INT switch is open and the RLDREF_INT switch is closed.

Figure 61. RLD Channel Selection(2)









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RLD

Amp(AVDD + AVSS)/2

RLDREF_INT

RLDREF_INT

RLD_REF

RLD_OUT

RLD_INV

RLD

ADS129x

WCT_TO_RLDFrom WCT Amplifiers

RLD_REF

WCT

RLDINVRLD

OUT

RLD

REF

RLDIN

VA1-8

Device 2

VA1-8

RLDINVRLD

OUT

RLD

REF

RLDIN

VA1-8

Device N

VA1-8

Power-Down Power-Down

RLDINVRLD

OUT

RLD

REF

RLDIN

VA1-8

Device 1

VA1-8

To I

np

ut

MU

X

To I

np

ut

MU

X

To I

np

ut

MU

X



WCT as RLD

In certain applications, the right leg drive is derived as the average of RA, LA, and LL. This level is the same asthe WCT voltage. The WCT amplifier has limited drive strength and thus should be used only to drive very highimpedances directly. The ADS129x provide an option to internally buffer the WCT signal by setting theWCT_TO_RLD bit in the CONFIG4 register. The RLD_OUT and RLD_INV pins should be shorted external to thedevice. Note that before the RLD_OUT signal is connected to the RLD electrode, an external amplifier should beused to invert the phase of the signal for negative feedback.

Figure 62. Using the WCT as the Right Leg Drive

RLD Configuration with Multiple Devices

Figure 63 shows multiple devices connected to an RLD.

Figure 63. RLD Connection for Multiple Devices









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PACE DETECT

The ADS129x provide flexibility for PACE detection either in software or by external hardware. The softwareapproach is made possible by providing sampling rates up to 32kSPS. The external hardware approach is madepossible by bringing out the output of the PGA at two pins: TESTP_PACE_OUT1 and TESTN_PACE_OUT2.Note that if the WCT amplifier is connected to the signal path, the user sees switching noise as a result ofchopping; see the Wilson Central Terminal (WCT) section for details.

Software Approach

To use the software approach, the device must be operated at 8kSPS or more to be able to capture the fastestpulse. Afterwards, digital signal processing can be used to identify the presence of the pacemaker pulse. Thesoftware approach gives the utmost flexibility to the user to be able to program the PACE detect threshold on thefly using software. This becomes increasingly important as pacemakers evolve over time. Two parameters mustbe considered while measuring fast PACE pulses:1. The PGA bandwidth shown in Table 6.2. For a step change in input, the digital decimation filter takes 3 × tDR to settle. The PGA bandwidth determines

the gain setting that can be used and the settling time determines the data rate that the device must beoperated at.

External Hardware Approach

One of the drawbacks of using the software approach is that all channels on a single device must operate athigher data rates. For systems where it is of concern, the ADS129x provide the option of bringing out the outputof the PGA. External hardware circuitry can be used to detect the presence of the pulse. The output of the PACEdetection logic can then be fed into the device through one of the GPIO pins. The GPIO data are transmittedthrough the SPI port and loaded 2tCLKs before DRDY goes low. Two of the eight channels can be selected usingregister bits in the PACE register, one from the odd-numbered channels and the other from the even-numberedchannels. During the differential to single-ended conversion, there is an attenuation of 0.4. Therefore, the totalgain in the PACE path is equal to (0.4 × PGA_GAIN). The PACE out signals are multiplexed with the TESTP andTESTN signals through the TESTP_PACE_OUT1 and TESTN_PACE_OUT2 pins respectively. The channelselection is done by setting bits[4:1] of the PACE register. If the PACE circuitry is not used, the PACE amplifierscan be turned off using the PD_PACE bit in the PACE register.

Note that if the output of a channel connected to the WCT amplifier (for example, the V lead channels) isconnected to one of the PACE amplifiers for external PACE detection, the artifact of chopping appears at thePACE amplifier output. Refer to the Wilson Central Terminal (WCT) section for more details.









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50kW

50kW

00

PACE[4:3]

20kW

00

50kW

50kW

00

PACE[2:1]

00

From

MUX1P

From

MUX2P

From

MUX2N

From

MUX1N

50kW

50kW

01

01

50kW

50kW

01

01

From

MUX3P

From

MUX4P

From

MUX4N

From

MUX3N

50kW

50kW

10

10

50kW

50kW

10

10

From

MUX5P

From

MUX6P

From

MUX6N

PACE_IN (GPIO1)(1)

GPIO1

From

MUX5N

50kW

50kW

200kW

11

200kW

11

50kW

50kW

11

11

From

MUX7P

From

MUX8P

From

MUX8N

From

MUX7N

TESTN_PACE_OUT2PACE

Amp

PDB_PACE

200kW

200kW

TESTP_PACE_OUT1PACE

Amp

PDB_PACE

20kW

20kW

20kW

20kW

20kW

20kW

20kW

PGA1P

PGA2P

PGA1N

PGA3P

PGA7N

PGA7P

PGA5N

PGA5P

PGA3N

PGA2N

PGA4P

PGA4N

PGA6P

PGA6N

PGA8P

PGA8N-(AVDD AVSS)

2

-(AVDD AVSS)

2

500kW

500kW



(1) GPIO1 can be used as the PACE_IN signal.

Figure 64. Hardware PACE Detection Option









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RESPIRATION

The ADS1294R/6R/8R provide three modes for respiration impedance measurement: external respiration,internal respiration using on-chip modulation signals, and internal respiration using user-generated modulationsignals, as shown in Table 14.

Table 14. Respiration Control

RESP.RESP_CTRL[1] RESP.RESP_CTRL[0] MODE AVAILABLE DESCRIPTION

ADS1294, ADS1296, ADS1298, Respiration disabled0 0 ADS1294R, ADS1296R, ADS1298R

Generates modulation and demodulation signals for externalADS1294, ADS1296, ADS1298,0 1 respiration circuitry. RESP CLK signals on GPIO2, GPIO3, andADS1294R, ADS1296R, ADS1298R GPIO4.

Respiration measurement using internally-generated1 0 ADS1294R, ADS1296R, ADS1298R RESP_MOD signals.

ADS1294R, ADS1296R, Respiration measurement using user-generated modulation and1 1 ADS1298R (1) blocking signal.

For more information on respiration impedance measurement, refer to application note Respiration RateMeasurement Using Impedance Pneumography (SBAA181).(1) RESP_CTRL[1:0] = 11 is not recommend if CLKSEL = 1 (internal master clock).









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GPIO3

GPIO4

GPIO2

tBLKDLY

(Demodulation Clock)

(Blocki gn Si n l)g a

tPHASE

(Modulation Cl ck)o

Respiration

Modulation

Generator

RESP_PH[2:0]

CLK

(2.048MHz)

Modulation Clock

Demodulation Clock

GPIO4

GPIO3

GPIO2



External Respiration Circuitry Option (RESP_CTRL = 01b)

In this mode, GPIO2, GPIO3, and GPIO4 are automatically configured as outputs. The phase relationshipbetween the signals is shown in Figure 65. GPIO2 is the exclusive-OR of GPIO3 and GPIO4, as shown inFigure 66. GPIO3 is the modulation signal, and GPIO4 is the de-modulation signal. While in this mode, thegeneral-purpose pin function of GPIO2, GPIO3, and GPIO4 is not available. The modulation frequency can be64kHz or 32kHz using RESP_FREQ[2:0] bits in the CONFIG4 register. The remaining bit options ofRESP_FREQ[2:0] generate square waves on GPIO3 and GPIO4. The exclusive-OR out on GPIO2 is onlyavailable on 64kHz and 32kHz modes. The phase of GPIO4, relative to GPIO3, is set by RESP_PH[2:0] bits inthe RESP register.

The mode can be used when the user implements custom respiration impedance circuitry external to theADS129x.

Figure 65. External Respiration (RESP_CTRL = 01b) Timing Diagram


2.7V ≤ DVDD ≤ 3.6V 1.65V ≤ DVDD ≤ 2VPARAMETER DESCRIPTION MIN TYP MAX MIN TYP MAX UNIT

Respiration phase delay, set bytPHASE 22.5 157.5 22.5 157.5 DegreesRESP.RESP_PH[2:0] bits

Modulation clock rising edge to XORtBLKDLY 1 5 nssignal

(1) Specifications apply from –40°C to +85°C.

Figure 66. External Respiration (RESP_CTRL = 01b) Block Diagram









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Ch1

ADC

Modulation

Block

Demodulation

Block

RESP_CTRL[1:0]

Ch1

PGA

Respiration Clock

Generator

CLK

I/O

I/O

I/O

RESP_CTRL[1:0]

GPIO3

GPIO4

GPIO2

RESP_MODP

RESP_MODN

IN1P

IN1N

EMI

FilterMUX

Blo

ckin

g

Dem

odula

tion

Clo

ck

Modula

tion

Clo

ck

Mod. C

lock


Internal Respiration Circuitry with Internal Clock (RESP_CTRL = 10b, ADS1294R/6R/8R Only)

Figure 67 shows a block diagram of the internal respiration circuitry. The internal modulation and demodulatorcircuitry can be selectively used. The modulation block is controlled by the RESP_MOD_EN bit and thedemodulation block is controlled by the RESP_DEMOD_EN bit. The modulation signal is a square wave ofmagnitude VREFP – AVSS. In this mode, the output of the modulation circuitry is available at the RESP_MODPand RESP_MODN terminals of the device. This availability allows custom filtering to be added to the squarewave modulation signal. In this mode, GPIO2, GPIO3, and GPIO4 can be used for other purposes. Themodulation frequency can be 64kHz or 32kHz, as set by the RESP_FREQ[2:0] bits in the CONFIG4 register. Thephase of the internal demodulation signal is set by the RESP_PH[2:0] bits in the RESP register.

The ADS1294R/6R/8R channel 1 with respiration enabled mode cannot be used to acquire ECG signals. If theRA and LA leads are intended to measure respiration and ECG signals, the two leads can be wired into channel1 for respiration and channel 2 for ECG signals.

Figure 67. Internal Respiration Block Diagram









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GPIO4

GPIO2

tBLKDLY

(Blocki gn Si n l)g a

tPHASE

(Modulation Cl ck)o

R

10MW

6

R

10MW

5

C

2.2nF1

R

40.2kW

2C

0.1 Fm

2 C

2.2nF3

AVDD

AVSS

Left Arm Lead RESP_MODP

IN1P

IN2P

Right Arm Lead RESP_MODN

IN2N

R

40.2kW

1C

0.1 Fm

6 C

2.2nF4

C

2.2nF5R

10MW

4

R

10MW

3

AVDD

AVSS

IN1N

ADS1294R/6R/8R



Internal Respiration Circuitry with User-Generated Signals (RESP_CTRL = 11b, ADS1294R/6R/8R Only)

In this mode GPIO2, GPIO3, and GPIO4 are automatically configured as inputs. GPIO2, GPIO3, and GPIO4cannot be used for other purposes. The signals must be provided as described in Figure 68. The internal masterclock is not recommended in this mode.

Figure 68. Internal Respiration (RESP_CTRL = 11b) Timing Diagram


1.65V ≤ DVDD ≤ 3.6V

PARAMETER DESCRIPTION MIN TYP MAX UNIT

tPHASE Respiration phase delay 0 157.5 Degrees

tBLKDLY Modulation clock rising edge to XOR signal 0 5 ns

(1) Specifications apply from –40°C to +85°C.

ADS129xR Application

The ADS1294R, ADS1296R, and ADS1298R channel 1 with respiration enabled mode cannot be used toacquire ECG signals. If the RA and LA leads are intended to measure respiration and ECG signals, the two leadscan be wired into channel 1 for respiration and channel 2 for ECG signals, as shown in Figure 69.

NOTE: Patient and input protection circuitry not shown.

Figure 69. Typical Respiration Circuitry









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R

40.2kW

2

R = 2.21kWBASELINE

R

40.2kW

2

IN1P

RESP_MODP

RESP_MODN

IN1N

ADS1294R/6R/8R

10

9.5

9

8.5

8

7.5

7

6.5

6

Normalized Baseline Respiration Impedance ( )W

Channel 1 N

ois

e (

V)

mP

P

3690 48452214 152588076 9155

Phase = 112.5, PGA = 4

Phase = 112.5, PGA = 3

Phase = 135, PGA = 4


20

18

16

14

12

10

8

6

Normalized Baseline Respiration Impedance ( )W

Channel 1 N

ois

e (

V)

mP

P

3690 48452214 152588076 9155





R =NORMALIZED

R I´ACTUAL ACTUAL

29 Am


Figure 70 shows a respiration test circuit. Figure 71 and Figure 72 plot noise on channel 1 for theADS1294R/6R/8R as baseline impedance, gain, and phase are swept. The x-axis is the baseline impedance,normalized to a 29µA modulation current (as shown in Equation 8).

Figure 70. Respiration Noise Test Circuit Figure 71. Channel 1 Noise versus Impedance for32kHz Modulation Clock and Phase

(BW = 150Hz, Respiration Modulation Clock =32kHz)

Figure 72. Channel 1 Noise versus Impedance for 64kHz Modulation Clock and Phase(BW = 150Hz, Respiration Modulation Clock = 64kHz)

where:RACTUAL is the baseline body impedance,IACTUAL is the modulation current, as calculated by (VREFP – AVSS) divided by the impedance of themodulation circuit. (8)

For example, if modulation frequency = 32kHz, RACTUAL = 3kΩ, IACTUAL = 50µA, and RNORMALIZED = (3kΩ ×50µA)/29µA = 5.1kΩ.

Referring to Figure 71 and Figure 72, it can be noted that gain = 4 and phase = 112.5° yield the bestperformance at 6.4µVPP. Low-pass filtering this signal with a high-order 2Hz cutoff can reduce the noise to lessthan 600nVPP. The impedance resolution is 600nVPP/29µA = 20mΩ.

When the modulation frequency is 32kHz, gains of 3 and 4 and phase of 112.5° and 135° are recommended.

When the modulation frequency is 64kHz, gains of 2 and 3 and phase of 135° and 157° are recommended forbest performance.









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ADS1298

AVDD

0.1 Fm1 Fm

+3V

AVDD1

AVSSAVSS1 DGND

DVDD

+1.8V

0.1 Fm 1 Fm

0.1 Fm

VREFP

VREFN

VCAP1

VCAP2

VCAP3

VCAP4

WCT

1nF 1 Fm 1 Fm 1 Fm

10 Fm

22 Fm0.1 Fm

RESV1



QUICK-START GUIDE

PCB LAYOUT

Power Supplies and Grounding

The ADS129x have three supplies: AVDD, AVDD1, and DVDD. Both AVDD and AVDD1 should be as quiet aspossible. AVDD1 provides the supply to the charge pump block and has transients at fCLK. Therefore, it isrecommended that AVDD1 and AVSS1 be star-connected to AVDD and AVSS. It is important to eliminate noisefrom AVDD and AVDD1 that is non-synchronous with the ADS129x operation. Each supply of the ADS129xshould be bypassed with 1μF and 0.1μF solid ceramic capacitors. It is recommended that placement of the digitalcircuits (DSP, microcontrollers, FPGAs, etc.) in the system is done such that the return currents on those devicesdo not cross the analog return path of the ADS129x. The ADS129x can be powered from unipolar or bipolarsupplies.

Capacitors used for decoupling can be of surface-mount, low-cost, low-profile, multi-layer ceramic type. In mostcases, the VCAP1 capacitor can also be a multi-layer ceramic, but in systems where the board is subjected tohigh- or low-frequency vibration, it is recommend to install a non-ferroelectric capacitor such as a tantalum orclass 1 capacitor (C0G or NPO). EIA class 2 and class 3 dielectrics such as (X7R, X5R, X8R, etc.) areferroelectric. The piezoelectric property of these capacitors can appear as electrical noise coming from thecapacitor. When using internal reference, noise on the VCAP1 node results in performance degradation.

Connecting the Device to Unipolar (+3V/+1.8V) Supplies

Figure 73 illustrates the ADS129x connected to a unipolar supply. In this example, analog supply (AVDD) isreferenced to analog ground (AVSS) and digital supplies (DVDD) are referenced to digital ground (DGND).

NOTE: Place the capacitors for supply, reference, WCT, and VCAP1 to VCAP4 as close to the package as possible.

Figure 73. Single-Supply Operation









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ADS1298

0.1 Fm1 Fm

AVDD AVDD1

0.1 Fm1 Fm

-1.5V

AVSSAVSS1 DGND

DVDD

+1.5V

+1.8V

0.1 Fm 1 Fm

VCAP1

VCAP2

VCAP3

0.1 Fm

VREFP

VREFN10 Fm

VCAP4

WCT

1 Fm 1 Fm1nF 1 Fm

-1.5V

22 Fm0.1 Fm

RESV1

5kW

10pF

AVSS

AVDD

INxP,

INxN


Connecting the Device to Bipolar (±1.5V/1.8V) Supplies

Figure 74 illustrates the ADS129x connected to a bipolar supply. In this example, the analog supplies connect tothe device analog supply (AVDD). This supply is referenced to the device analog return (AVSS), and the digitalsupply (DVDD) is referenced to the device digital ground return (DGND).

NOTE: Place the capacitors for supply, reference, WCT, and VCAP1 to VCAP4 as close to the package as possible.

Figure 74. Bipolar Supply Operation

Shielding Analog Signal Paths

As with any precision circuit, careful PCB layout ensures the best performance. It is essential to make short,direct interconnections and avoid stray wiring capacitance—particularly at the analog input pins and AVSS.These analog input pins are high-impedance and extremely sensitive to extraneous noise. The AVSS pin shouldbe treated as a sensitive analog signal and connected directly to the supply ground with proper shielding.Leakage currents between the PCB traces can exceed the input bias current of the ADS129x if shielding is notimplemented. Digital signals should be kept as far as possible from the analog input signals on the PCB.

Analog Input Structure

The analog input of the ADS129x is as shown in Figure 75.

Figure 75. Analog Input Protection Circuit









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Power Supplies

RESET tRST

Start Using the Device

tPOR

18 tCLK



POWER-UP SEQUENCING

Before device power-up, all digital and analog inputs must be low. At the time of power-up, all of these signalsshould remain low until the power supplies have stabilized, as shown in Figure 76. At this time, begin supplyingthe master clock signal to the CLK pin. Wait for time tPOR, then transmit a RESET pulse. After releasing RESET,the configuration register must be programmed, see the CONFIG1: Configuration Register 1 subsection of theRegister Map section for details. The power-up sequence timing is shown in Table 17.

Figure 76. Power-Up Timing Diagram

Table 17. Power-Up Sequence Timing

SYMBOL DESCRIPTION MIN TYP MAX UNIT

tPOR Wait after power-up until reset 216 tCLK

tRST Reset low width 2 tCLK

SETTING THE DEVICE FOR BASIC DATA CAPTURE

The following section outlines the procedure to configure the device in a basic state and capture data. Thisprocedure is intended to put the device in a data sheet condition to check if the device is working properly in theuser's system. It is recommended that this procedure be followed initially to get familiar with the device settings.Once this procedure has been verified, the device can be configured as needed. For details on the timings forcommands refer to the appropriate sections in the data sheet. Also, some sample programming codes are addedfor the ECG-specific functions.









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Set = 1

Set = 1

W it

PDWN

RESET

a fo 1sr f ro

Power-On Reset

// Delay for Power-On Reset and Oscillator art-UpSt

// If START is Tie Hi hd g , After This St pe

// Toggles at f /8192

// (LP Mode with DR = f /1024)

DRDY CLK

MOD

Set CLKSEL Pin = 1

and Wait for Oscillator

to Wake Up

No

Analog/Digital Po er-Upw // Follow Power-Up Sequencing

E ernaxt l

Clock

Set CLKSEL Pin = 0

and Provide External Clock

f = 2.048MHzCLK

Yes

Set PDB_R 1EFBUF =

and Wait for Internal Reference

to Settle

Write Certain Registers,

Including Input Short

Set START = 1

// Activate nversionCo

// After This Point Should Toggle at

// f /4096

DRDY

CLK

// Set Device in HR Mode and DR = f /1024

WREG CONFIG1 0x86

WREG CONFIG2 0x00

// Set All Channels to Input Short

WREG CHnSET 0x01

MOD

Yes

R ATACD// Put the Device Back in RDATAC Mode

RDATAC

Capture Data

and Check Noise// ookL for an Issu sdDRDY e 24 + n 24 SCLK´

Set Test Signals

Capture Data

and Test Signal

// ctivateA a 1mV V /2.´( 4) ve lSquare-Wa Test Signa

// On All Channels

SDATAC

WREG CONFIG2 0x10

WREG CHnSET 0x05

RDATAC

REF

// Look for a d Issu sDRDY n e 24 + n 24 SCLK´

External

Reference

// If Using Internal Reference, Send This Command

¾WREG CONFIG3 0xC0

No

Send SD TACA

Command

// Device Wakes Up in RDATAC Mode, so Send

// SDATAC Command so Registers can be Written

SDATAC

Issue Reset Pulse,

Wait for 18 t sCLK

// Activate DUT

// can be Either Tied Permanently Low

// Or Selectively Pulled Low Before Sending

// Commands or Reading/Sending Data from/to Device

CS


Figure 77. Initial Flow at Power-Up









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Lead-Off

Sample code to set dc lead-off with pull-up/pull-down resistors on all channels

WREG LOFF 0x13 // Comparator threshold at 95% and 5%, pull-up/pull-down resistor // DC lead-off

WREG CONFIG4 0x02 // Turn-on dc lead-off comparators

WREG LOFF_SENSP 0xFF // Turn on the P-side of all channels for lead-off sensing

WREG LOFF_SENSN 0xFF // Turn on the N-side of all channels for lead-off sensing

Observe the status bits of the output data stream to monitor lead-off status.

Right Leg Drive

Sample code to choose RLD as an average of the first three channels.

WREG RLD_SENSP 0x07 // Select channel 1—3 P-side for RLD sensing

WREG RLD_SENSN 0x07 // Select channel 1—3 N-side for RLD sensing

WREG CONFIG3 b’x1xx 1100 // Turn on RLD amplifier, set internal RLDREF voltage

Sample code to route the RLD_OUT signal through channel 4 N-side and measure RLD with channel 5. Makesure the external side to the chip RLDOUT is connected to RLDIN.

WREG CONFIG3 b’xxx1 1100 // Turn on RLD amplifier, set internal RLDREF voltage, set RLD measurement bit

WREG CH4SET b’1xxx 0111 // Route RLDIN to channel 4 N-side

WREG CH5SET b’1xxx 0010 // Route RLDIN to be measured at channel 5 w.r.t RLDREF

PACE Detection

Sample code to select channel 5 and 6 outputs for PACE

WREG PACE b’0001 0101 // Power-up PACE amplifier and select channel 5 and 6 for PACE out









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REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (October 2011) to Revision I Page

• Added eighth Features bullet (list of standards supported) .................................................................................................. 1

• Deleted duplicate Digital input voltage and Digital output voltage rows from Absolute Maximum Ratings table ................. 2

• Changed parameter name of Channel Performance, Common-mode rejection ratio and Power-supply rejection ratioparameters in Electrical Characteristics table ....................................................................................................................... 4

• Updated BGA pin out .......................................................................................................................................................... 10

• Updated Figure 23 .............................................................................................................................................................. 21

• Updated description of Analog Input section ...................................................................................................................... 24

• Updated Figure 29 .............................................................................................................................................................. 26

• Changed description of Data Ready (DRDY) section ......................................................................................................... 32

• Changed description of START pin in START section ....................................................................................................... 34

• Changed conversion description in Continuous Mode section ........................................................................................... 35

• Changed Unit column in Table 10 ...................................................................................................................................... 35

• Changed conversion description in Single-Shot Mode section .......................................................................................... 36

• Added power-down recommendation to bit 7 description of CHnSET: Individual Channel Settings section ..................... 50

• Changed description of bit 5 in RESP: Respiration Control Register section .................................................................... 53

• Corrected name of bit 6 in WCT2: Wilson Central Terminal Control Register section ....................................................... 56

• Updated Figure 51 .............................................................................................................................................................. 57

• Updated Figure 52 .............................................................................................................................................................. 58









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Changes from Revision G (February 2011) to Revision H Page

• Deleted Non-Magnetic BGA Package Features bullet ......................................................................................................... 1

• Added (ADS1298) to High-Resolution mode and Low-Power mode subsection headers of Supply Current section inElectrical Characteristics table .............................................................................................................................................. 6

• Changed 3V Power Dissipation, Quiescent channel power test conditions in Electrical Characteristics table .................... 6

• Changed 5V Power Dissipation, Quiescent channel power test conditions in Electrical Characteristics table .................... 7

• Changed footnote 1 of BGA Pin Assignments table ........................................................................................................... 10

• Added footnote 1 cross-reference to RLDIN, TESTP_PACE_OUT1, and TESTP_PACE_OUT in BGA PinAssignments table ............................................................................................................................................................... 11

• Changed footnote 1 of PAG Pin Assignments table ........................................................................................................... 13

• Added footnote 1 cross-reference to TESTP_PACE_OUT1, TESTP_PACE_OUT2, and RLDIN in PAG PinAssignments table ............................................................................................................................................................... 13

• Changed description of AVSS and AVDD in PAG Pin Assignments table ......................................................................... 14

• Changed title of Figure 20 .................................................................................................................................................. 18

• Updated Equation 5 ............................................................................................................................................................ 27

• Changed title of Table 8 ...................................................................................................................................................... 30

• Updated Figure 45 .............................................................................................................................................................. 38

• Changed description of STANDBY: Enter STANDBY Mode section .................................................................................. 40

• Changed bit name for bits 5, 6, and 7 in ID register of Table 12 ....................................................................................... 44

• Changed bit name for bits 5, 6, and 7 in ID: ID Control Register section .......................................................................... 45

• Updated Figure 60 .............................................................................................................................................................. 64

• Added new paragraph to Respiration section ..................................................................................................................... 70

• Added footnote to Figure 69 ............................................................................................................................................... 73

• Changed description of solid ceramic capacitor in Power Supplies and Grounding section .............................................. 75

• Changed description of Connecting the Device to Bipolar (±1.5V/1.8V) Supplies section ................................................. 76









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PACKAGE OPTION ADDENDUM

www.ti.com 23-Nov-2011

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type PackageDrawing

Pins Package Qty Eco Plan (2) Lead/Ball Finish

MSL Peak Temp (3) Samples

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ADS1294CZXGR ACTIVE NFBGA ZXG 64 1000 Green (RoHS& no Sb/Br)

SNAGCU Level-3-260C-168 HR

ADS1294CZXGT ACTIVE NFBGA ZXG 64 250 Green (RoHS& no Sb/Br)


ADS1294IPAG ACTIVE TQFP PAG 64 160 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

ADS1294IPAGR ACTIVE TQFP PAG 64 1500 Green (RoHS& no Sb/Br)


ADS1294RIZXGR ACTIVE NFBGA ZXG 64 1000 Green (RoHS& no Sb/Br)


ADS1294RIZXGT ACTIVE NFBGA ZXG 64 250 Green (RoHS& no Sb/Br)
























PACKAGE OPTION ADDENDUM

www.ti.com 23-Nov-2011

Addendum-Page 2

Orderable Device Status (1) Package Type PackageDrawing

Pins Package Qty Eco Plan (2) Lead/Ball Finish

MSL Peak Temp (3) Samples

(Requires Login)



(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

ADS1294CZXGR NFBGA ZXG 64 1000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q1

ADS1294CZXGT NFBGA ZXG 64 250 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q1

ADS1294IPAGR TQFP PAG 64 1500 330.0 24.4 13.0 13.0 1.5 16.0 24.0 Q2

ADS1294RIZXGR NFBGA ZXG 64 1000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q1

ADS1294RIZXGT NFBGA ZXG 64 250 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q1











PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

ADS1294CZXGR NFBGA ZXG 64 1000 336.6 336.6 28.6

ADS1294CZXGT NFBGA ZXG 64 250 336.6 336.6 28.6

ADS1294IPAGR TQFP PAG 64 1500 367.0 367.0 45.0

ADS1294RIZXGR NFBGA ZXG 64 1000 336.6 336.6 28.6

ADS1294RIZXGT NFBGA ZXG 64 250 336.6 336.6 28.6











PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK

0,13 NOM

0,25

0,450,75

Seating Plane

0,05 MIN

4040282/C 11/96

Gage Plane

33

0,170,27

16

48

1

7,50 TYP

49

64

SQ

9,80

1,050,95

11,8012,20

1,20 MAX

10,20SQ

17

32

0,08

0,50 M0,08

0°–7°

NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. Falls within JEDEC MS-026

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. Allsemiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the timeof order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components whichhave not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of suchcomponents to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2012, Texas Instruments Incorporated

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