WP6 meeting

30/07/2013

• Status of flex prototypes production• New laser soldering tests• Discussion on mass production schedule

Flex prototypes• FHR order: 2 foils with 3 circuits, 25 mm apical from Rui (obtained

removing Cu layers bu chemical etching) + 15 mm Al (compatible with chemical etching procedure at CERN), issue on first foil coated (Al peels off at the edge) due to bad quality of apical?

• Next: another test using 50 mm apical from FHR and15 mm Al + 2 foils coated with 25 mm Al• Goals: 1) check chemical and laser etching on two Al thickness; 2) electrical tests • Delivered ….

Differential impedance simulations

New laser soldering tests

• Test performed at Neu Ulm not conclusive, issues with: – soldering grid design– Single chip flex: holes too small (160 mm), metallisation?– Small SnAg balls (200 mm)

• Laser soldering system rented at Dr Mergenthaler to optimize parameters (temperature profile, beam focusing)

• System to be installed in DSF, safety requirements to be verified next week with laser safety officer (actions for DSF?)

• Aim at starting at the beginning of September

Single chip flex, w/o coverlay, no soldering grid

Single chip flex, w/o coverlay, no soldering grid

Issues:- Mismatch between

microscope and metallurgy pictures numbering

- Most of solderings does not wet the chip pad

Single chip flex, w/o coverlay, no soldering grid

Planning of staves assembly

• Inner barrel– 48 staves x 2 + 10% ~ 110 staves– 990 chips, 49500 solderings

• Outer barrel– 1602 modules +10% ~ 1800 modules– 25200 chips, 1260000 solderings

Planning of staves assembly

Assembly sequence hypothesis:1) Placement of chips on vacuum table (auto): 9x10” ~ 90” (14

chips: 140”)2) Placement of flex on vacuum table + grid on flex (man,

pinholes): 300”3) Alignment (auto): 300”4) SnAg balls deposition + soldering of one chip (auto): 300” + 50x

10”= 800”

Total per IB module: 2h 11’ -> 30 d for full IBTotal per OB module: 3h 19’ -> ~ 750 d for full OB (1 d = 8h)

Planning for Layers 0, 1, 2, 3 and 4

ID Task Name Duration Start Finish

12 chips first acceptance (7000 units) 160 days Mon 01/09/14 Fri 10/04/153 visual inspection, database entry,

shipment to mass testing company160 days Mon 01/09/14 Fri 10/04/15

4 chips second acceptance after mass testing (7000 units)

160 days Mon 13/10/14 Fri 22/05/15

5 visual inspection, classification and grouping, datatbase update

160 days Mon 13/10/14 Fri 22/05/15

6 assembly of 504 HICs 600 days Mon 10/11/14 Fri 24/02/177 mounting of chips on flex, laser soldering600 days Mon 10/11/14 Fri 24/02/178 504 HICs validation 700 days Mon 22/12/14 Fri 25/08/179 electrical test, burning test 700 days Mon 22/12/14 Fri 25/08/17

10 504 modules assembly (HIC + stave) 800 days Mon 02/02/15 Fri 23/02/1811 gluing of HIC on stave 800 days Mon 02/02/15 Fri 23/02/1812 soldering of service cables 800 days Mon 16/03/15 Fri 06/04/1813 I/O connector and power supply flex cable800 days Mon 16/03/15 Fri 06/04/1814 final check + storage 800 days Mon 27/04/15 Fri 18/05/1815 electrical test, database update, storage800 days Mon 27/04/15 Fri 18/05/1816 half layer final commissioning 600 days Mon 20/06/16 Fri 05/10/1817 powering and cooling tests prior to

final assembly, I/O checks600 days Mon 20/06/16 Fri 05/10/18

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Short term plans (for TDR final version)

• By the end of September: – Preliminary results on technology for Al flex production,

chemical vs laser engraving– Preliminary results on chips embedding– Laser soldering: optimization of process parameters, tooling

• Critical issues– Design of flex depends on chips specs not available (i.e.

power consumption: if 25 mW/cm2 instead of 250 mW/cm2 less constraints on Al thickness?)

– Al flex processing dependence on Al layer thickness – Study of electrical characterization/ performance of flex