tq x86 products mainboards / hardware kits / devices © tq-group l x86 carrier boards product...

TQ x86 ProductsMainboards / Hardware kits / Devices

© TQ-Group l www.tq-group.com x86 Carrier Boards Product Overview Rev. 0100

TQ x86 ProductsPlatform Strategy: modular Hardware kits and Devices


Mainboard(standard & customized)

Hardware kit(standard & customized)

Device (BoxPC)(standard & customized)

Device (PanelPC)(customized)

Device (“BlackBox”)(customized)

Embedded Module(standard)

TQ x86 ProductsPlatform Concept


Qseven(R2.0 x86)

COM ExpressMini Type10

COM ExpressComp+Basic Type 2

COM ExpressCompact Type 6

QSysMB-Q7-2

MSysMB-M10-1

COMSysMB-COME10-1

COMSysMB-COME-1

COMSysMB-COME6-1

QKit(10x10)

MKit(10x10)

COMKit(17x17)

COMKit(17x17)

COMKit(17x17)

Mo

du

leM

ain

bo

ard

HW

Kit

Bo

xPC

QBox MBox COMBox COMBoxCOMBox

QPanel MPanel COMPanel COMPanelCOMPanel

Pan

elP

C

COM ExpressBasic Type 6

COMSysMB-COME6B-1

COMKit(17x17)

COMBox

COMPanel

COMSysSpace-saving, highly flexible and scalable platform


Large and easy cooling connection

Scalability by differentCOM Express CPU modules(based on COM Express type 2, 6, and 10)

MB-COMExuniversal COM Express mainboards

Riser for PCI / PCIe extension cards(patent pending)

optional PCI / PCIe extension cardsup to 2x PCIe x1 (4x PCI with COM Express Type 2)(prepared for PCIe x4 for the future)

Optimal coolingconnection

Flexibleextendibility

Interface cardsunderneath mainboard

Interface cards next to mainboard for flat design

Features and interfaces depend on combination of CPU module and mainboard.Examples shows COM Express Type 2.

COMSys Mainboard MB-COME10-1Mini ITX meets COM Express Type 10


Key Features For COM Express Mini Type 10 modules

»Focused on Intel® Atom (E3800 series) class Extended temperature range Rich featured and flexible For testing and rapid prototyping For mass production in low, mid and high volumes Interfaces and Features

12 V DC single supply Two versions: With DisplayPort + LVDS/eDP With 2x DisplayPort

Graphics External IO Internal IO Extension Mass storage

1) DP++2) LVDS / eDP / DP

2x Gbit EthernetUSB 3.0USB 3.0 Device3x USB 2.0RS-232

AudioRS-232RS-422USB 2.02x FAN

Mini PCIe + SIM Card slotRiser (PCIe+USB)System connectorDebug header

mSATA socketSD Card slot2,5” HDD/SSD socket



Block Diagram



Key Features

For COM Express Type 6 modules (Compact)

»Scalable from Intel® Atom up to Intel® Core i7 High speed interfaces and communication For testing and rapid prototyping

(mass production ready reference design) For mass production in low, mid and high volumes Interfaces and Features

12 V DC single supply

Graphics External IO Internal IO

Extension Mass storage

1) DP++2) DP++3) LVDS / (eDP)

2x Gb Ethernet2x USB 3.02x USB 2.0RS-232

AudioRS-232RS-422USB 2.02x FAN

Mini PCIe + SIM Card slotRiser (2x PCIe+ 2x USB)System connectorDebug header

mSATA socketCFast socket2,5” HDD/SSD socket

Block Diagram



COMSys: Mini ITX size system platformsRoadmap


CO

M E

xpre

ss

Type

2

MB-COME-1(„Legacy“)

Compact & Basicwith PCI / CFLaunched: Q4/2009

CO

M E

xpre

ss

Type

6 MB-COME6-1

CompactLaunch: Q3/2015

CO

M E

xpre

ss

Type

10 MB-COME10-1

MiniLaunched: Q2/2015 20

15

201

6

2017+

2020+

2020+

201

4

Atom E3800

Atom E3800

Core 5000U

Atom 2016

Core 7th Gen.

Atom 2016

Atom N270

Core 3rd Gen.

Preview, might be changed without notice

2021+Core 6th Gen.

MB-COME6B-1Compact & Basic

QSysUltra compact platform based on Qseven (I)


MB-Q7-2 QKit QBox / QPanel

Mainboard forQseven Modules(x86, according to Spec. 2.0)Only available for OEM partners

Hardware Kits for easy integration into complete systems and project-specific housings

Heat spreadernot shown

Consisting of:Mainboard+CPU-Module+Heat spreader+ optional additional features like mSATA

Parameters:CPU / DDR3 / eMMC / TempMass storage (mSATA) andadditional interface cards (on request)

BoxPCs and PanelPCs / HMIin various formatsaccording to your requirements

i. e. Standard QBox(110 x 105 x 56 mm³)with standard interfaces (top)and additional interfaces (bottom)

Examples for reference

QSysUltra compact platform based on Qseven (II)


Based on Intel® Atom™ E3800 („BayTrail“)

Optimized for ultra low power

Extended temperature (-20°C to 70°C)

High speed IO with Gbit Ethernet, USB 3.0 and eSATAp

DisplayPort (DP++) and LVDS

2 Mini PCIe sockets (PCIe + USB) with SIM card socket onboard

Optional add-on’s like second Gbit Ethernet, CAN,…

Soldered onboard eMMC and mSATA flash card socket

Integrated security features (TPM, SW-protection, Licensing)

Audio with integrated amplifier

Fanless operation

Ultra compact design (HW-Kit: 100 x 100 x 23 mm³)

Robust and reliable

Embedded alternative for Intel® NUC SFF boards (eNUC)

QBox (~ 100 x 100 x 60 mm³)with RS-232 / CAN add-on

Partners for additional services Thermal Special cooling solutions (heat pipes,…) Display/Touch Optical bonding,… Software BSPs (Windows, Linux, VxWorks, QNX, Virtualization)

Driver, app and application developmentIoT Gateway software solutions

Security Hardware encrypted feature licensing and software protection

Strong partner network guaranteesbest solutions from TQ and Matrix as general contractors

TQ and Matrix – your partners for your idea to your product

Specialized on application-specific design and manufacturing.

Our competence combined with strong partner networkOne-stop shopping with TQ and Matrix


We are the experts for application-specific design and manufacturing. Our focus is to help customers to be successful in their markets.

TQ and Matrix – your partners for Intel® based solutionsEmbedded Partnership


United by Technology . Embedded Partnership

www.tq-group.com/intel

[email protected] | +49 8153 9308 0

tq x86 products mainboards / hardware kits / devices © tq-group l x86 carrier boards product...

Documents

com express type

com expresscompact type

scalable platform tqgroup

pcie x4

pcie x1

differentcom express

comsys mainboard mbcome10

mini itx