status fee-daq walter f.j. müller, gsi, darmstadt for the cbm collaboration 11 th cbm collaboration...

Status FEE-DAQStatus FEE-DAQ

Walter F.J. Müller, GSI, Darmstadtfor the CBM Collaboration

11th CBM Collaboration Meeting29 February 2008

29 February 2008 11th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 2

FEE-DAQ:FEE-DAQ:Getting ready Getting ready

forfordetector R&Ddetector R&D


FEE-DAQ for Detector R&DFEE-DAQ for Detector R&D The work horse for CBM detector R&D will be the n-

XYTER 128 channel chip, designed for Silicon Strip & GEM self-triggered architecture use for STS, GEM, MAPMT detector R&D

Needed n-XYTER Frond-end Board with an n-XYTER (aka FEB) Read-out controller (aka ROC) Data Acquisition System handling time stamped data Active Buffer board (aka ABB) time synchronization over a serial optical link

Target Beam time September 26-29

11th CBM Collaboration Meeting, GSI, Feb. 26th 2008

Tests on n-XYTER

64/128 chan. connected

I²C-Interface

Test points accessible

All functional tests possible

Analogue evaluation possible

One additional analogue test channel available for direct access of slow and fast shaper outputs... with output buffer would

have been even more useful

Slide: C.Schmidt

n-XYTERn-XYTER

http://wwwires.in2p3.fr/

11th CBM Collaboration Meeting, GSI, Feb. 26th 2008

In-Channel Discriminator Feedback Detected

...upon removal of discriminator-power decouppling

Test Pulse circuit itself is cause of transient, not the external PCB!These issues are particularly important with the self triggered architecture!

....correlates with peak detector reset!as well as the comparator

Digital external TestTrigger input (blue) causes this transient. Signal shifts upon programmed delay. No oscillation but rather capacitive coupling. Not related to discriminator Vdd

Slide: C.Schmidt

n-XYTERn-XYTER

http://wwwires.in2p3.fr/

29 February 20086

ASICs and Detector

top bottom

HeatsinkRequired!

>90 *C

~50 *C

Silicon detector

128-stripesAC-coupling75 um pitch1 cm length

Several channelsleft floating

CBM Collaboration Meeting 26.02.2008 Krzysztof Kasiński (AGH Cracow) [email protected] Slide: K. Kasinski

n-XYTERn-XYTER

29 February 20087

Strontium Sr90 first acquisition

-37 hours of acquisition- ~37000 events-per-channel (total)- detector polarized by 135V- still too small statistic

CBM Collaboration Meeting 26.02.2008 Krzysztof Kasiński (AGH Cracow) [email protected]

Threshold [reg.value]

Slide: K. Kasinski

n-XYTERn-XYTER

29 February 2008 11th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 8Slide: R. Lalik

general purpose FEBgeneral purpose FEB

11

Basic Components and Interfaces

Xilinx Virtex4 FPGA

320 up to 576 user I/Os

LAN interfaces

SD-Card connector

LAN, USB, JTAG programming capability via CPLD

RS232 interface

High Speed Serial Ports (MGTs)

DDR SDRAM

user definable I/O

Watchdog

Slide: D. Gottschalk

ROCROC

12

SysCore as N-XYTER Application

Slide: D. Gottschalk

ROCROC

29 February 2008 11th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 13Slide: N. Abel

ROCROC


n-XYTER Starter Kitn-XYTER Starter Kit

'Starter Kit' = 1 n-XYTER general purpose FEB + ROC

Target: simple laboratory test bench setups first gas detector tests (up to 128 channels) MAPMT – RICH readout tests (64 channels) first Si Strip detector tests

Timelines FEB layout done; fabrication + tests by mid April ROC V1 done and tested ROC V2 available in mid May first Starter Kits by end May


Truly Basic n-XYTER Readout Truly Basic n-XYTER Readout ChainChainDetector

FEB ROCX

YTER

AD

C

Tag data

ADC data

clock

FP

GA

control

PHYEth

Front-EndBoard

Read-OutController

Bond orcable

connection

1 n-XYTER128 ch.

LVDSsignalcable

plainEthernet

any PCrunning

Linux andROOT

The minimaln-XYTER StarterKit Configuration

No "DAQ" needed

ROC ROOT


Test Beams in 2008 – Dates, Test Beams in 2008 – Dates, ObjectivesObjectives GSI, September 26-28, 2008: 3.5 GeV Protons

Get started with self-triggered FEE in a beam environment First beam characterization of CiS STS sensors w/ n-XYTER

cluster size vs. angle position resolution

First test of Hamamatsu MAPMT w/ n-XYTER MAPMT response for single electrons interfacing MAPMT to n-XYTER

ROC as target SEU Mitigation tests for ROC Gas detector tests (GEM, THGEM, .....) RPC Tests w/ prototypes from Hefei

IHEP, November 2008: More detailed STS sensor tests


Basic STS SetupBasic STS Setup

Use three CiS CBM01B2 Baby sensors with 2 x 256 strips, 50.7 μm pitch, double-sided, orthogonal strips mounted on FEB with 4 n-XYTER use two as reference use one as 'detector under test' "DUT" DUT will be tilted in x- and y- direction

Key measurements: position resolution cluster size vs. particle angle

Ref 1 Ref 2DUT

beam


FEB for Beam TelescopeFEB for Beam Telescope

Note: The CBM01B2 sensor setup will later be used as standard beam telescope in our beam line.

It holds 4 n-XYTER, two on front, two on back side connects to two user ports of a ROC

n-XYTER for y-stripson front side of FEB

n-XYTER for x-stripson back side of FEB

direct sensor ton-XYTER bondingno pitch adapter

BabySensor


FEB Types – Current StatusFEB Types – Current Status

simple general purpose 128 channel (1 n-XYTER) inputs in 'standard' connectors (which ones...) robust (in a box, input protection)

for Gas Detector Readout (general purpose) 512 channel (4 n-XYTER)

for 'BabySensor' Beam Telescope (special purpose) 2*256 channels (4 n-XYTER)

for 5x5 cm2 sensor use chip cable / TAB bonding

... more to come ...

Rafal Lalik (GSI)

M. Dey (VECC)

Anton Lymanets &

Rafal Lalik (GSI)

V. Pugatch (Kiev)

(Dubna/Kharkov)


"DAQ" Configuration"DAQ" ConfigurationDetector

FEB ROC

PHYEth

Front-EndBoard

Read-OutController

Switchany PCrunning

Linux andROOT

The "stretched"n-XYTER StarterKit ConfigurationPHYEth

PHYEth

AuxilliarySignals

Master ROC

Slave ROC

DABC

Data Acquisition Backbone Core http://wiki.gsi.de/DABC

datainput

sortingtaggingfilteranalysis

datainput

sortingtaggingfilteranalysis

IB

PC

PC

GE

analysisarchive

archive

PC

GE: Gigabit EthernetIB: InfiniBand

frontendDataCombinerr

frontendother

frontendReadout scheduler

scheduler

DABC

DABC design: functional overview

DABC data flow

Slide: J. Adamczewski

DAQDAQ


DAQ:DAQ:ArchitectureArchitecture

revisitedrevisitedDi-Muon TriggerDi-Muon Trigger

for J/for J/ΨΨ and and ΨΨ''


CBM Trigger RequirementsCBM Trigger Requirements

measure: π, K

measure: K, , , ,

measure: D0, D±, Ds, c

measure: J/, ' e+e- or μ+μ-

measure: , , e+e- or μ+μ-

measure: γ

Hadrons

Leptons

Photons

trigger <10 AGeV

trigger

trigger e+e-

offline

offline >10 AGeV

offline ?

offline for e+e-

trigger for μ+μ- ?

assume archive rate:few GB/sec20 kevents/sec

trigger on high pt e+ - e- pair

trigger ondisplaced vertex

drives FEE/DAQarchitecture

trigger μ+μ-

μ identification


CBM DAQ Architecture – Open CBM DAQ Architecture – Open CharmCharm

Detector

FEE buffer

Readoutbuffer

Switch

Processorfarm

Storage

L1trigger

HLT

conventionalsystem

CBM

L1

Self-triggered Front-endall hits shipped to DAQ.Data push architecture

High-throughputEvent building

First event selectiondone in processor farm.

Readout buffer outside radiation area. Many Gbyte

storage easily possible. Allows L1 decision times of

10-100 ms

Fast links


CBM DAQ Architecture – Full CBM DAQ Architecture – Full picturepicture

Detector

FEE buffer

Readoutbuffer

Switch

Processorfarm

Storage

CBM

L1

Broadcastnetwork

Time base

Time distribution

system


CBM DAQ Architecture – CBM DAQ Architecture – RevisitedRevisited

Detector

FEE buffer

Readoutbuffer

Switch

Processorfarm

Storage

CBM

L1

Self-triggered Front-endall hits shipped to DAQ.Data push architecture

High-throughputEvent building

First event selectiondone in processor farm.

All Data goes through Event

building

Good solution if event selection needs most of

the CBM data:open charm:

STS+ITS+TOF

However:Potentially too expensive for

full dataflow at 107 int/sec


MUCH – J/MUCH – J/ΨΨ and and ΨΨ' L1 Event ' L1 Event SelectionSelection Anna Kiseleva showed that a

high mass di-muon event selection based in the formation of the last two detector groups seems feasible

With 'thick-absorber' configuration the hit rate is modest even at 107 int/sec in last two station groups

This would allow to derive a L1 event selection decision from a small subsetsmall subset of the data

Reconsider DAQ structure


CBM DAQ Architecture – MUCHCBM DAQ Architecture – MUCH

Detector

FEE buffer

Readoutbuffer

Switch

Processorfarm

Storage

L1

CBMopen charm

CBMMUCH

L2

Still all self-triggered

Still all data send to readout buffer

Only MUCH-end + TOF part of event build

always

Full event build only

on L1 accept

L1

Di-Muon L1 selection

Time and L1 selection

distribution network


CBM DAQ-Trigger SummaryCBM DAQ-Trigger Summary

Open charm Self-triggered FEE

MUCH two stage selective event building smaller total bandwidth required lower cost

Practical implementation design readout buffers for full output bandwidth in first phase, use event building network with bandwidth

sufficient for open charm (all detectors at 500 kHz) Di-Muon event selection (selective build at 10 MHz) Di-Electron event selection (selective build of TRD)

plan for an upgrade path to increase event builder bandwidth


FEE:FEE:Radiation DosesRadiation Doses

andandConsequences Consequences


Gray – Mrad – Particle FluenceGray – Mrad – Particle Fluence

1 Gy = 100 rad = 1 J/kg 1 J = 1 VAs = 1 CV → 1 eV = 1.6·10-19 J dE/dx(mip,si) = 1.67 MeV/(g/cm2) [PDG] 1 mip/cm2 ↔ 1.67 MeV/g = 2.67·10-9 J/kg

This leads to the often used relations:1 Gy ↔ 3.75·109 mip/cm2

10 krad ↔ 3.75·1011 mip/cm2 1 Mrad ↔ 3.75·1013 mip/cm2

1 Mrad 1 Mrad ↔↔ 3.75·10 3.75·101313 mip/cm mip/cm22


CBM-Year and CBM-Lifetime CBM-Year and CBM-Lifetime

To estimate lifetime doses an operating scenario has to be assume. For CBM the current key numbers are:

CBM-Year ↔ 5·106 sec at 100% duty cycle Note: 1 yr = 3.156·107 sec 1 CBM-year ↔ 2 month at 100% duty cycle

↔ 4 month at 50% duty cycle

CBM-Life ↔ 6 CBM-Year @ full intensity CBM-Life ↔ 3·107 sec at 100% & full intensity

full intensity ↔ 107 Au+Au interactions/sec

CBM-LifeCBM-Life ↔ ↔ 33··10101414 Au-Au min. bias interactions Au-Au min. bias interactions


TTotal otal IIntegrated ntegrated DDose in CBM-ose in CBM-LifetimeLifetime Reference system is Au+Au @ 25 A GeV central

collisions Hit densities are given in hit/cm2 per central Au-Au For an estimate of a lower limitlower limit of the TID

assume multiplicity(min. bias) = 0.25 · multiplicity(central) assume particles are MIP hadrons

1 hit/cm2(cent) → 0.25 hit/cm2

(min.bias)

→ 7.5·1013 part/cm2 over CBM-Life→ 2 Mrad over CBM-Life

For rough lower limit estimatesrough lower limit estimates:1 hit/cm1 hit/cm22 ↔↔ 2 Mrad in CBM-Life 2 Mrad in CBM-Life


Some ValuesSome Values

Use hit densities form CBM Technical Status Report2006 Update, Section 13.1 "Hit densities and Rates"

Detector edge hit/cm2 part/cm2 TIDSTS @ 30cm inner 10 7.5·1014 20 Mrad

outer 0.25 1.8·1013 0.5 MradSTS @ 1m inner 1 7.5·1013 2 Mrad

outer 0.03 2.3·1012 60 kradTRD @ 4m inner 0.04 3.0·1012 80 krad

outer 0.002 1.5·1011 4 kradTOF @ 10m inner 0.01 7.5·1011 20 krad

outer 0.0006 5.0·1010 1.2 krad

STS @ 30 cm is now 1st plane in 'all strips' configuration(the hit rate for STS@30 cm is scaled from the STS3 @ 20 cm plot of the CBM TSR)

Hit rates in 1st MUCH plane are similar to STS plane @ 1m


Consequences 2Consequences 2

COTS (CCustom-00f-TThe-SShelf) components many COTS components are known to fail at 20-100 krad some fail, e.g. bipolar transistors, can fail at 1 krad and are

sensitive to displacement damage, thus neutron flux A very preliminary very preliminary COTS usage policy:

TID < 1 krad: selected COTS equipment can be usede.g. crates, power supplies ect.qualification done on the equipment level

TID < 20 krad: qualified COTS components can be usedqualification done on the component level

This divides the Cave in 3 Zones. Examples TOF perimeter (1.2 krad) → COTS equipment TOF center (20 krad) → COTS components STS whole assembly → no COTS possible


Cave Layout - OldCave Layout - Old

Cave – Side View

Magnet MUCHBeamdump

Step in Floor, dividing cave in CBM and HADES sector No shielded area closeNo shielded area close

to STS and MUCHto STS and MUCH


Cave Layout - NewCave Layout - New

Cave – Side View

No 'Step' anymore Shielded area forelectronics ect.

Extra Shielding


Cave Layout – First FLUKA Cave Layout – First FLUKA CalculationCalculation

Cave – Side View

FLUKA by D. BertiniSimulation Session 26.2.

3*108


TID and COTS TID and COTS SEU – Part 1 SEU – Part 1

Assume COTS parts are used at 20 krad 'places' 20 krad ↔ 0.01 hit/cm2

(cent)

↔ 2.5·104 part/(cm2·s) [ @107 int/s ]

Typical SEU (SSingle EEvent UUpset) cross section for SRAM cells: 3·10-14 cm2/bit

Typical SEU is a SBU (SSingle BBit UUpset): one bit toggles 0↔1 Rate of SRAM SBU's

7.5·10-10 SBU/(bit·s) 7.5·10-4 SBU/(Mbit·s) 2.7 SBU/(Mbit·hour)

20 krad 20 krad ↔↔ 2.5·10 2.5·1044 part/(cm part/(cm22··s)s)20 krad 20 krad ↔↔ 2.7 SBU/(Mbit 2.7 SBU/(Mbit··hour)hour)

Note: Neutronsare likely to dominate !

!! This is a lower limit !!!! This is a lower limit !!n contribution mightn contribution mightbe 10 times higherbe 10 times higher


TID and COTS TID and COTS SEU – Part 2 SEU – Part 2

The ALICE RCU (an FPGA board on the TPC) was designed for a flux of 400 hardons/cm2/sec works only when SEU mitigation techniques are used the board had to be completely redesign to implement

this On the outer edge of TOF we have 1500 mips/cm2/sec

even in quite 'cold' spots we have significantly more flux than the ALICE RCU design point

likely all FPGA's used on detectors will need SEU mitigation measures

in many places no COTS possible anyway


Cave neutrons fluence

DPM

UrQmd


3*1011

No PSD included

3*1011


MUCH: neutrons particles fluence


1013

1012


STS Data Rates – MC ResultsSTS Data Rates – MC Results

Radek made a detailed study. The current 8 station STS with a total of ~1.2 Mchannels, 9296 CBM-XYTER chips 586 modules (with mostly 2 * 8 chips)

Note: cluster size not yet included ( 1 strip hit per particle)

(ALICE SSD has an average cluster size of ~1.4) effects due to non-perpendicular incidence also still

ignored

Following tables under the caveats listed above


STS Data Rates – Au+Au @ STS Data Rates – Au+Au @ 25AGeV25AGeV

Hit rate [MHz]

Sta 1

Sta 2

Sta 3

Sta 4

Sta 5

Sta 6

Sta 7

Sta 8

Total

16-32 23 16 26 16 19 0 6 2 105

8-16 37 55 50 60 66 64 55 58 431

4-8 80 75 101 125 84 84 67 72 692

2-4 111 138 123 89 133 141 129 157 1053

1-2 109 142 162 170 176 250 161 141 1275

0.5-1 127 193 74 41 54 21 210 256 971

< 0.5 53 13 0 3 0 0 28 2 121

Chip count only for one of the two sides of the modules Properties of stations quite similar (module size tracks quite

well the inverse hit density hit/chip roughly equal)

Hit rate per chipHit rate per chip


STS Data Rates – # of Data STS Data Rates – # of Data LinksLinks 75% of the chips have < 4 MHz It is prudent to aggregate the data of several chips

onto one data link before it is send of the module

Hit rate [MHz]

# module

s

#links

128-150 16 128

64-128 126 504

32-64 188 376

<32 842 842

Hit rate per moduleHit rate per module Total hit rate: 32.6 GHz Net data rate: ~200 GByte/s Number links: 1850

Per station end (top/bot) we have about 120 data links

- Aggregation may be cleverer, links a little faster- Cluster size will be >1 and increase data volume About 2000 'fast' links seems a reasonable estimate About 2000 'fast' links seems a reasonable estimate

11th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 46

Readout. Preliminaries.

Use as few cables as possible → fill max. bandwidth Must provide a concept to cope with different occupancies

on different chips

cable data rate distance Connectors driver

optical fiber >2.5Gbps infinite clumsy

or special

Laser (clumsy),

serializer

coax >2Gbps >10m small on chip,

serializer

CAT7 LVDS 250Mbps 10m clumsy on chip,

clk & data

Custom LVDS

100Mbps few m (?) small on chip,

clk & data

Slide: P.Fischer


Optical Serial Data Transmission

Assume we have it somewhere in the path for level shift Components required:

Protocol FSM

8B/10B

Serializer

LVDS/CML output

Laser Driver

Laser Diode

Connector

fiber

Laser Package

Chip1

Chip2

Mechanics

digital

analog

difficult

Provided bySFP package!

available

available (?)

Slide: P.Fischer


Readout 5: Integrated serializer, coax

No extra components needed on Hybrid Receiver needed (?) Cost of cables?

FE

FE

Hybrid on detector Cavern Outside

clock, epoch???

serser

serser

ser

FPGA

drv.drv.

drv.drv.

drv.

coax cable rec.

Slide: P.Fischer


Radiation & FEE/DAQ – Radiation & FEE/DAQ – SummarySummary Consolidate the FLUKA simulations

more verification, cross checks include also PSD and ECAL

Update CBM-Life definition (e and μ time) Create Radiation Map of Cave

define the 'no-COTS zones': COTS equipment (power supplies ect.) (~ 1 krad) COTS components (boards w/ qualified parts) (~20 krad)

Strawman system design of all subsystems decompose electronics in 'no-COTS' and 'COTS' section what must/can be put on detector ? what should be put in service area ? Space required in service area ? Connections to

detector


FEE:FEE:Getting ready Getting ready

for the real thingfor the real thing

29 February 200829 February 2008 11th CBM Collaboration Meeting -- 11th CBM Collaboration Meeting -- Walter F.J. Müller, GSIWalter F.J. Müller, GSI

5151

The PADI together with aThe PADI together with aSC Diamond (4 pixels) detectorSC Diamond (4 pixels) detector

PADI test PCBPADI test PCB

LVDS-PECLLVDS-PECL

Converter PCBConverter PCB

Interface PCBInterface PCB

+5V,GND,THR+5V,GND,THR

connectionsconnections

Time Output'sTime Output's

LAN-K5 cableLAN-K5 cable

~2.1m~2.1m

Connection'sConnection's

with with

SC DiamondSC Diamond

Pixel DetectorPixel Detector

Slide: M. Ciobanu

RPC- PADIRPC- PADI

EE- ASIC

DLL structure with 64 DE 160MHz clock input Intrinsic bin size: ~ 50ps Additional components:

Hit-Reg, RO-Logic 1 Bit serial output

Size: 1525µm x 1525µm

Testchip DANTE DLL

870µm 210µm

Delay Chain

Loop Filter

Ref Clk

Phase Detector Charge PumpChip submitted in Feb 2007

Slide: H. Flemming

RPC- TDCRPC- TDC

EE- ASIC

DANTE DoubleBin DLL

20 40 60 80 100 1200

500000

1000000

1500000

2000000

2500000 Modell: GaussGleichung: y=y0 + (A/(w*sqrt(PI/2)))*exp(-2*((x-xc)/w)^2)

w 1.17816 ±0.0087corr. 28.76 ps ± 0.21ps

uncorr. 20.34 ps ± 0.15ps

Co

un

ts

# TimeBin

Power consumption DLL (Sim.) I = 3 mA @1.8V => 5.4 mW

Power consumption DANTE (Mea.) I = 18 mA @1.8V => 32.4 mW

Resolution σuc = 20.34 ps ± 0.15ps

DNL: (+ 0.34 / - 0.38) LSB INL: (+ 0.51 / - 0.49) LSB

DNL PLOT DANTE-DLL Vcore=1.8V, f=160MHz

-1,00

-0,80

-0,60

-0,40

-0,20

0,00

0,20

0,40

0,60

0,80

1,00

1 17 33 49 65 81 97 113

TIME BIN #

LS

B

+0.49 LSB -0.39 LSB

DNL =

Slide: H. Flemming

RPC- TDCRPC- TDC


Connecting DC coupled chips. (1/N possibilities)

moreanalog

digital

digitalDAQmore

analogdigital

levelshift

HV decouplingHV

powersupply

digitalsupply

analogsupply

Hybrid on detector Cavern Outside

refer single ended signal

to which ground here?

feedback & leakage compensation analog

supply

Slide: P.Fischer

CBM-XYTERCBM-XYTER


FEE – Next Steps – Summary FEE – Next Steps – Summary

Reassess FEE requirements. Get FEE Strawman design for ECAL and PSD all considered detector technologies for MUCH for TRD (MWPC based)

Do 'family planning' for CBM-XYTER it is not a single 'omni-purpose' chip for all of CBM and FAIR one targeted for STS and GEM

high channel density (128 ch), possibly 'TimeOverThreshold' design with limited amplitude resolution.

one targeted for TRD (MWPC) more flexible front-end (variable gain, shaping,...),tail

cancelation channel density might be lower (e.g. 64 channels)

all share backend (data links ect.)


The EndThe End

Thanks for Thanks for your attentionyour attention

status fee-daq walter f.j. müller, gsi, darmstadt for the cbm collaboration 11 th cbm collaboration...

Documents

cbm detector rd

channel total detector

peak detector

nxyter aka febread

nxyter applicationslide

channel discriminator

nxyter128 channel chip

detector rdthe work