Detector R&D SummaryDetector R&D Summary

Walter F.J. Müller, GSI, Darmstadt

6th CBM Collaboration MeetingPiaski, September 7-10, 2005

300

MIMOSA11 @ 1MRad (First results from Frankfurt)

300Charge collected [ADC] Charge collected [ADC]

Ent

ries

(no

rmal

ized

)

Ent

ries

(no

rmal

ized

)E

ntri

es (

norm

aliz

ed)

Ent

ries

(no

rmal

ized

)

4 pix. 4 pix.

1 pix.

1 pix.

Minor degen- eration.

Minor degen- eration.

Signal remains stable

Signal remains stable

Shoulder dissapears

Signal drops

Small peakdissapears

MIMOSA11 before and after 1MRad X-rays (@ +10°C, Treadout=700µs)

Hardened pixel (A0 Sub 1) Standard pixel (A0 Sub 2)

Optimal conditions (-25°C, Treadout= 170µs) : 15% more noise (~11 e- )=> Chip ok

! P

reli

min

ary

resu

lts

and

conc

lusi

ons

!

From M. Deveaux

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

3

Fast readout speed, the inner layers

External 12-bit ADCMIMOSA

Offline Cluster finding

Output

Standard approach for MAPS:

Sensor array (~100 pixels/line)

~1000 on - chip ADCsand/or discriminators

On - chip cluster-finding processor

Output: Cluster information(zero surpressed)

The design concept for CBM:

Goal: A readout time of 10µs for the CBM

3mm 2mm

From M. Deveaux

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

4

Vertex Detector

MAPS Significant progress in the radiation hardness front Still much too do, further tests planned

demonstrate limit under best operating conditions more tests with neutrons

Fast column-based readout in work since a while building blocks studied chip planned for late next year

DEPFET interesting alternative; 100 um thickness...; puts Λc in reach concept for fast readout to be worked out in an early stage...

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

5

Silicon Strip Detector Stations

Sectorized segmentation:Basic sensor elements: 200 m thick silicon wafers.double-sided, rad-tolerant. 25 m strip pitch.

Inner : 6x4 cm Middle : 6x12 cmOuter : 6X20 cmOpen questions: strip length, stereo angle

(to reduce fake hits) location of read-out

(on sensor, all at edge ?)

Prosal: Four tracking detector stations,built from a few types of silicon strip wafers.

From J. Heuser

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

6

Silicon Strip

3 R&D contracts for Sensor, FEE, and layout now active Many loose ends:

module layout how to arrange and connect sensors into a ladder and to read-out ? can the read-out be put on the perimeter ?

requirements on sensor and read-out optimal sensor thickness radiation hardness for read-out

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

7

STS technological options

STS

VT ITS

MAPS DEPFET

ITS

SI-StripHybrids ?

ILC, RHIC

ILC, Astrophysicis (X-ray observatory)

Contact to the Halbleiter Labor of MPI Munich,Peter Fischer (Mannheim)

Giga Tracker,LHC upgrade

Contact to ALICE group,G. Stefanini, P. Giubellino.ATLAS P. Fischer

(other) driving communities:

R&D started(talk by M. Merkin)St. Petersburg, Moscow; Obninsk

R&D started(next talk)St. Petersburg, Moscow; Obninsk

(FNAL), Phenix, Neutron imaging

R&D in progress(talk by Michael Deveaux)IReS, (GSI, JWGU)

From J. Stroth

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

8

Technology development for the PMT FEU-Hive, August 2005

Vladimir Rykalin

•Technology for the high frequency welding of the covar ring electrodes with the glass tubes has been installed

•Technology of the Sm evaporation on the PMT window has been tested •Technology of bialkaline photocathode activation has been tested

•The first distributed dinodes have been evaporated, but not still be tested

From S. Sadovsky

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

9

RICH

GSI-IHEP R&D contract for PMT development now active Next steps:

study and test mirror alternatives (Be, glas, Carbon) Is N radiator feasible ?

Are all properties known ? Do we need measurements, or simulations ?

Design issues: mirror support look at existing setups beam pipe look at the whole system

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

10

TRD

From C. Garabatos

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

11

A preliminary TOF system layout

Most central part : highest rate and occupancy Small single cells

Intermediate part : high occupancy and large area Single strip shielded RPCs

External part : largest area Multistrip (differential) counters

The uniformity of the response over the full detector surface is a key element for the physics performance

From E. Cordier

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

12

RPC

Key issues Rate:

new low resistivity glasses (ceramic, Glaverbel) high T operation

Aging tested to 600 mC/cm2

much to be learned from HADES/FOPI RPC projects

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

13

ECAL

Prototype being build (Y. Kharlov) 20 X0 ; 0.275 mm Pb+1.5 mm Sci; Target: 3%/sqrt(E) tests on U70 in fall 2005 and 2006

Much emphasis on MC and optimization of layout (I. Korolko) improving e/pi handling hit density

To be resolved: What is the prime mission of ECAL ?

help in e/pi look for direct photons

What is the required solid angle coverage to achieve physics goal

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

14

A CBM A CBM M-M-MPW RunMPW Run CBM organized a Multi-Multi Project Wafer run in UMC 0.18 μm CMOS

6 different parts combined on a 5 x 5 mm2 wafer submitted June to Europractice (IMEC) dies (already cut) just delivered, now come the moments of truth

Atkin

Fischer

Brüning

Deppe

Muthers

Tontisirin

Content addressable

memory

12bit 50MSPS ADC

Test structures

PreAmp for Si Strip

DLL based TDC

Clock-Data recovery

Coordination:Marcus Dorn @ KIP

From W.F.J. Müller

10 September 2005 6th CBM Collaboration Meeting, GSI, September 7-10, 2005

15

CBM FEE/DAQ DemonstratorCBM FEE/DAQ Demonstrator Mission: Provide a platform to

demonstrate essential architecture elements of the CBM FEE-DAQ concept FEE: self-triggered, data push, conditional RoI based readout CNet: combined data, time, control, and RoI traffic TNet: low jitter clock and synchronization over serial links BNet: high bandwidth, RDMA based architecture E/DCS: integrated approach for DCS/ECS

provide test bed for all future FEE/DAQ prototyping in hardware firmware controlware software

perform beam tests with detector prototypes form basis for medium-scale applications in intermediate-term

experiments

Be operational by end 2006 avoid cathedrals, go for the bazaar, try and learn build a first generation (G1) demonstrator quickly

From W.F.J. Müller