spp2- siemens txp hw manual

TXP Hardware Course

TXP-HW

For Software Releases 7. 5 and Later January, 2003

Siemens Westinghouse Power Corporation

TXP-HW Course

Training CenterCopying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment ofdamages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design.

1 System Architecture

2 OM 650 /Exercise 1

3 AS 620B /Exercise 2

4 AS 620T / Exercise 3

5 SIMATIC H1 Plant Bus /Exercise 4&5

6 Ethernet Terminal Bus /Exercise 6

7 Reading I&C Drawings

8 Loading Procedures / Exercise 7

9 Preventative Maintenance /Exercise 8

10 Troubleshooting /Exercise 9

11 Glossary of Terms

Content:

Process control systemTXPHardware Configuration/Maintenance Course

Course Code:

TXP - HW

SIEMENS WestinghouseTraining Center

Since the equipment explained in this manual has a variety of uses, the user and thoseresponsible for applying this equipment must satisfy themselves as to the acceptability ofeach application and use of the equipment. Under no circumstances will SiemensWestinghouse Power Corporation be responsible or liable for any damage, includingindirect or consequential losses resulting from the use, misuse, or application of thisequipment.

The text, illustrations, charts and examples included in this manual are intended solely toexplain the use and application of the TXP control system. Due to the many variablesassociated with specific use or applications, Siemens Westinghouse Power Corporationcannot assume responsibility or liability for actual use based upon the data provided inthis manual.

No patent liability is assumed by Siemens Westinghouse Power Corporation withrespect to the use of circuits, information, equipment, or software described in thismanual.

No part of this manual may be reproduced, stored in a retrieval system, or transmitted inany form or by any means, including electronic, mechanical, photocopying or otherwise,without the prior express written permission of Siemens Westinghouse PowerCorporation.

This document is the property of and contains Proprietary Information owned bySiemens Westinghouse Power Corporation and/or its subcontractors and suppliers. It istransmitted in confidence and trust, and the user agrees to treat this document in strictaccordance with the terms and conditions of the agreement under which it was provided.

This manual is printed in the USA and is subject to change without notice.

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TXP-HW Course


System Architecture

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System Architecture

TXP – Overview

The TXP process control system provides all I&C facilities that are necessary forautomating, handling, monitoring, and archiving processes specifically for powerplants.

The tasks of the TXP process control system are distributed to differentsubsystems:

� OM 650

Operating and Monitoring system. This is the process control andinformation system for operator-process communication andvisualization.

� AS 620

Automation System. This is the system used for processautomation.

� ES 680

Engineering System. This system is employed for configuration andcommissioning.

� SINEC H1

SIEMENS Network Communication. Communication system.

� DS 670

Diagnostic System. Optional component for detailed systemdiagnostics.

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OM 650 process control and information system

The OM 650 process control and information system is the interface between thesystem and the operator in the control room. This window to the process enablesthe process to be centrally monitored and controlled. In addition, the systemprovides all functions that are required for logging the process and for archivingthe data.

AS 620 Automation System Overview

The AS 620 subsystem performs the automation tasks of the industrialprocesses. The AS 620 acquires measured values and states from the process,performs open and closed-loop control functions, and transfers the resultingmanipulated variable values, correction values, and commands to the process.The other subsystems employ the AS 620 subsystem as the interface to theprocess. The AS 620 transfers the commands from the OM 650 operatorcommunication and visualization system to the process, reads information fromthe process that is required by OM 650, ES 680, or the DS 670 diagnosticsystem and transfers this information to the upstream operator communicationand visualization level.According to the different requirements that result from industrial measurementand control activities safety relevant tasks (such as boiler protection), and high-speed control tasks (at the turbine unit for example), various variants of the AS620 automation system are available.

Terminal bus

ESESSUSUPU2PU2PU1PU1

OT1OT1 OT2OT2 OT3OT3 OT4OT4 OT5OT5

AS3AS3 AS4AS4AS2AS2AS1AS1

Plant bus

DS

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AS 620 BBasic system for general automation tasks, system and unit protection, closed-loop control.Central structure or distributed arrangement using buses are both possible.

FUM B variant: In a central structure, FUM modules (function modules) are usedfor connecting the sensors and actuators of the process.

SIM B variant: SIM modules (signal modules) enable a distributed structure tobe set up (locally, in vicinity to the process). A bus connects the SIM moduleswith the central system components.

AS 620 FFail-safe for protection and control tasks that require TÜV approval (e.g. burnercontrol).Single and fault-tolerant structures are both possible, including the variants withthe fail-safe automation processor (APF) and the fail-safe programmablecontroller (AGF).

FUM F variant: Configuration with the fail-safe APF automation processor andthe related FUM F modules (fail-safe function modules).

SIM F variant: Configuration with the AGF programmable logic controller. Thisvariant employs the SIMATIC S5 95 F programmable logic controller with SIM Fmodules.

AS 620 TTurbine controller and other high-speed control tasks at the turbine unit.

Auxiliaries connectionSignal exchange with SIMATIC S5 units or other manufacturer’s components,such as, Allen-Bradley PLCs for example. The SIMATIC units contain theimplementation of a complete automation task that is not configured via ES 680.

Combinations:Combining two or more system variants is possible. The components of thedifferent variants must then be connected to the same component of the APautomation processor. Any combination of the above mentioned system variantsis possible, except mixing FUM F and SIM F (AGF) components at the sameautomation processor.

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ES 680 engineering system

The ES 680 engineering system is the central configuration system of TXP. ES680 is used for configuring the AS 620 automation system, the OM 650 processcontrol and information system, the SINEC H1 FO bus system, and thenecessary hardware. ES 680 provides a configuration package for each targetsystem. ES 680 centrally administers all configuration data, which means data isentered only once.The configuration of the AS functions and processing functions in OM 650 arebased on control system flow charts. A control system flowchart editor in the ES680 permits interactive entry of these control system flow charts.The configuration principle of the ES 680 is based on consistent forwardconfiguration. Initial configuration and modifications are exclusively performedthrough the configuration system with subsequent automatic code generation.This guarantees real time documentation of the system hardware and all AS,OM, and SINEC functions, and permits modifications to be centrally controlled.

SINEC H1 bus system

The network structure of the SINEC H1 bus system enables communicationbetween the individual sub-systems of TXP. The bus system complies withinternational standards and consequently offers the prerequisites of opencommunication.

DS 670 diagnostic system

The optional DS 670 diagnostic system is the tool that is used for monitoring anddetecting malfunctions in the I&C components of TXP.In the event of a malfunction, the DS 670 swiftly points the user to the source ofthe fault and informs about the cause and possible elimination of the fault.

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OM 650 & Exercise 1

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OM 650 The OM 650 sub-system is made up of all or some combination thereof of the following components:

PU Processing Unit SU Server Unit OT Operating Terminal

CU Compact Unit All of these components are made up of Pentium II computers running SCO UNIX and for the OT and CU components a graphics server is needed if more than 1 monitor is desired. Otherwise, an integrated graphics card for connecting a single monitor can be used instead of the graphics server. The following connectable devices are also available:

MOD Magnetic Optical Disk DAT Digital Audio Tape MMT MultiMedia-Terminal Monitor Large-area display Printer Keyboard Mouse

UNIX Computer The UNIX computer accommodates the main memory, disk drives and modules required for operating the particular OM component, and is optionally equipped with an installed MOD (for SU and CU only) for the external storage of archived data. An external MOD can also be connected, which allows reading in older archived data from MOD storage media. To bridge brief supply voltage failures and properly organize automatic shutdown in the event of long-term supply voltage failure, the UNIX computer is supplied with voltage via a UPS and informed of the mains voltage failure via a serial port.

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TXP-HW Course The following devices can be connected to the UNIX computer: • Up to two printers or one printer and one plotter • Up to two audible alarms and keys for acknowledgment of the audible alarm With an integrated graphics card the following devices can be connected to the UNIX computer: • 1 monitor • 1 keyboard • 1 mouse For servicing purposes the following devices can be connected (does not apply to variants with an integrated graphics card): • 1 monitor and • 1 keyboard An external DAT streamer can be connected for loading and saving the system software. Figure 1 shows the rear panel of the UNIX computer with a listing of the individual connection ports. Figure 2 lists component specific interface assignments of the UNIX computer.


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Fig.1: Generally applicable interface assignment of the UNIX computer


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TXP-HW Course Component specific slot assignment


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Explanations Explanations of the component texts: 1k Single-channel option with graphics 4k 4-channel option nMT Single- to 4-channel option with graphics server red Redundant option ME OM/ME system Explanation of the slot assignment nomenclature: 2940 Adaptec 2940 U2W, SCSI--3--Controller Ultrawide U2W 3COM Etherlink XL PCI 3C900--Combo (3COM), LAN card Combo (BNC) Connector to the mMT graphics server, Licensing of the ES

functionality e.g. for CU/ME and CU—ES Redundancy coupling for CU (substitute for terminal bus); Substitute for plant/ terminal bus if not present

CP 1413 CP 1413 for connection to the plant bus No. 1 CP 1413 Second CP 1413 for connection to the plant bus No 2 Radio clock radio clock module (Hopf) Audible alarm 1 1st signal module Audible alarm 2 2nd signal module Intel Intel-Ether Express-Pro/10+ Combo PCI (Intel 10 MB), LAN

card Combo for connection to the terminal bus (AUI)

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N-AT NAT module for connection to the CS275 bus Chase Research For connecting the capacitive 21” touchscreen monitors Ilyama PCI--Fast 4 S10M/MT via Micro Touch Controller SMT3V, (stock no. 14--

701), (RJ45) RS 232 port with 9--pin connection and Siemens label. To be

used with release version 7 or higher. (1) If the plug--in slot in all PU/OT--OMME systems of a plant is

used by audible alarm 1, the radio clock must be inserted into the SU--OM/ME slot.

MultiMedia-Terminal The MULTIMEDIA-TERMINAL MMT-X was designed to control large, modular OVERVIEW display walls. Its multi-screen capability allows you to control displays of nearly any size and layout. The display area is one logically connected display. It is able to digitally control monitors based on modern technologies such as Single LCD, DLP™ and Poly-Silicon LCD with the highest display quality. High contrast and absolute immunity to electromagnetic interference distinguishes this type of control. CRT monitors and projectors can also be controlled by the MULTIMEDIA-TERMINAL MMT-X using the optional analog output. The hardware and software of the MULTIMEDIA-TERMINAL MMT-X is based on world-wide accepted standards, so that the investment is protected. The MULTIMEDIA-TERMINAL MMT-X offers the following exceptional capabilities: • High performance graphics output using the most modern processor and

chip technologies • Supports current LAN and WAN interfaces • Graphic and video outputs in high color quality • Video in a window, up and down scaleable • Unlimited, overlapping and freely moveable video and graphics windows The graphics server is used for multi--channel mode as an extension of the OT and CU, PU/ OT. It is suitable for the connection of 1 to 4 monitors, 1 to 4 large-area display units or a 2x2 display wall. The mMT--X is available with a video card for the connection of a display wall or large--area display units as an option. The video input card allows you to connect a video source such as a video recorder, camera, etc. to the graphics server. It supports the recording standards S--Video (S--VHS, Y/ C) and Composite (VHS, FBAS, CVBS, Y). The video card has three 4--pin female Mini--DIN connectors for the connection of up to three S--Video or 6 Composite video sources.


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Fig.3: Interface assignment of the mMT-X for large-area display units or a display wall

Fig.4: Monitor port assignment of the mMT-X


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Programming Device PG 740PII

Fig.5: Interface assignment of the PG 740PII The PG740PII programmer is the hardware basis for the CT675 hand-held operating device.


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TXP-HW Course The Cable Connectors Used The following cables are used for the OM components: • Data cable (for connecting the graphics server to the UNIX computer) • Monitor cable for the graphics server • Monitor cable for the UNIX computer (for servicing purposes only) • Monitor cable for the UNIX computer if a graphics card is used, single--

channel operation • AUI connection cable (3Com (network card) or CP1413) • NAT cable • Antenna cable (coax) for the radio clock card • Parallel printer cable • Serial printer cable • Mouse and keyboard cable extension for the graphics server • UPS data cable (black) • UPS power cable Connection between the Mouse and Keyboard and the UNIX Computer (Single Channel)


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Monitor Connection with a Single-Channel Graphics Card

Connection between Printer and the Parallel Port of the PC

Connection between Printer and the Serial Port of the PC


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TXP-HW Course Connection between the Mouse and Keyboard and the mMT-X

Connection of 4 Monitors to a 4-channel mMT-X

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Connection between the PC and the Terminal Bus

Connection between the PC and the Plant Bus


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TXP-HW Course Connection between the Graphics Server and the PC using a thin Ethernet (coaxial) cable.


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Connection of the External DAT-Streamer to the PC Caution When connecting the external DAT-Streamer or the external MO drive to the PC or WS both devices must be switched off. Otherwise the devices might be damaged and their functionality would no longer be ensured.

Note: The SCSI address of the DAT streamer needs to be set to SCSI id 2


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TXP-HW Course Automatic Restart after Power Outage In case of a mains voltage failure, the PC and the graphics server, if applicable, are powered by the connected UPS. If the supply voltage does not return within 2 minutes the UPS will initiate a PC shutdown (approx. 3 minutes). During the shutdown the mouse and keyboard are inoperable. There are 2 status conditions possible during shutdown: • If the voltage returns during shutdown, the PC automatically starts up after completion of the shutdown. • If the voltage does not return during shutdown the component is switched off by the UPS, i.e. the UPS battery is no longer discharged. After return of the voltage, the OM component (PC and graphics server) automatically restarts. After the completion of the restart, the basic startup display appears on each screen of the graphics server. The mouse and keyboard are again inoperable.

Primergy 170


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Sinec Pro M7

Copying of this document, and givindamages. All rights are reserved in

Primergy 351/75

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the event of the grant of a patent or the registration of a utility model or design. 17

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TXP-HWTest/Exercise 1

� What are the 4 sub-systems of TXP?

� What is the name of the communications system that ties them together?

� How many variants of the AS 620 system exist, and what are their differentuses?

� What I/O modules are used for a central configuration of AS 620?

� What I/O modules are used for a distributed configuration of AS 620?

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� What are the 3 different types of OM 650 components?

� What one component combines all OM 650 components?

� What operating system runs on OM 650 computers?

� Look at the back of your OM 650 computer and identify the followingcomponents:

� Keyboard and Mouse ports� SCSI bus connector� Video card� Graphics server communications card (if applicable)� Plant bus card (CP 1413)

� What device(s) is (are) connected to the SCSI bus connector?

� What is the MMT used for?

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� What kind of cable is used to connect the MultiMedia-Terminal to the UNIXcomputer?

� What kind of cable(s) is (are) used to connect the UNIX computer to the PlantBus?

� What is the primary use of the DAT streamer?

� What is the MOD drive used for?

� In a 4-channel MultiMedia-Terminal configuration, which CRT port is the left-most monitor connected to?

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AS 620B & Exercise 2

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AS 620B Automation System

Automation Processor (AP)

The AP is the central component of the AS 620 B and AS 620 F automationsystems. It is based on the SIMATIC S5 CPU 948R. All subordinate AS 620components are linked with the plant bus (and thus with the OM 650 system) viathe AP.System and unit protection functions are processed in the AP. In addition to thebase operations, a large spectrum of power plant related open and closed-loopcontrol blocks are available for this purpose. The user employs these blocks onthe graphical ES 680 tool to create the user program that executes in the AP.The AS 620 T employs a special automation processor, the APT (SIMADYN D),to solve high-speed control tasks at the turbine unit. The APT communicates withthe TXP systems on the OM 650 level via an AP.The AP also plays an important role in the connection of auxiliaries(programmable logic controllers). These PLC systems also always communicatevia an AP with the OM 650 level.The hardware of the automation processor is based on a SIMATIC S5 155Ucentral controller (CC). Figure 1 shows the basic structure and a possible slotallocation of the central unit used as an AP. The slot numbers appear on theannotation strip of the central unit rack. The actual installation of interfacemodules and communications processors in the individual slots depends on theplant-related structure and on the variant of the automation system.

Figure 1: Standard slot assignment of the AP

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* IM304 is only allowed in this slot as EG connection to the IM314R

Figure 1.1: Possible module installations when used as an AP

CPU 948R

The CPU 948R and 948RL can be used in S5-135U/155H central controllers andis available in the following versions:

CPU version Internal user memory (RAM)CPU 948RL 128 KbyteCPU 948R-1 640 KbyteCPU 948R-2 1664 Kbyte

All three versions of the CPU 948 are programmed in STEP 5 (LAD, CSF, STL,SCL) and process all STEP 5 operations at a very high speed. They are alsoequipped with a high-speed floating-point arithmetic facility.

The following program processing levels are possible:

Cyclic

Time-controlled (9 different time grids, clock-controlled, delayed interrupt)

Interrupt-driven over the S5 bus

’Soft STOP’

003 011 019 027 035 043 051 059 067 075 083 091 099 107 115 123 131 139 147 155 163Power supplyCPU 948RIM304/324RIM304 * * * *IM611/651IM308CP1430CP5431CP530CP581DEDA

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The CPU 948’s electronics, including RAM, are on two PCBs (Printed CircuitBoards), have Eurocard format, and are bolted to one another. They must neverbe separated.

The module’s front plate has a width of 2 2/3 standard slots, or 40 mm and takesup two slots in the central controller rack. Figure 2 shows the front panel layout ofthe CPU 948:

Fig. 2: Front panel indicators of CPU 948

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Principle of Operation

In a redundant system, identical user programs run in both sub-units. The sub-units are ”event-synchronized”; that is, only those events that could producedifferent internal ”states” in the two controllers cause them to be synchronized.The internal ”state” is determined by the states of the memory areas used, suchas process image, flags, counters, timers, and data blocks.

On startup or restart, the S5-155H assumes one of the operating states shownbelow:

Solo mode:The master sub-unit alone scans the user program and controls theprocess; the standby sub-unit is inactive.

Activating the standby:The master sub-unit passes the current data to the standby.

Error search mode:The master sub-unit scans the user program and controls the process; thestandby sub-unit executes the self-test.

Redundant mode:The master sub-unit controls the process; the standby sub-unit runs inparallel (”updated” mode), and is ready to take over at any time.

After both sub-units have been started up, they are synchronized to ensure abump-less transfer in the event of a fault. The synchronization procedure used inthe S5-155H is known as ”event-driven synchronization”, which means that thesub-units are synchronized whenever an event occurs which could result in thetwo sub-units having different internal states; for example different processimages, flags, timers or communications data. Synchronization is done at so-called “synchronization points” which are at the end of each ground cycle.

Each sub-unit reads it’s one-sided inputs (if applicable). The ’switched’ inputs areread only by the master, who then updates the input image for both sub-units andgenerates a unified input image.

At the end of each ground cycle, the entire process output image (PIQ) in bothCPU 948Rs is immediately compared by the IM 324R card. The PIQ (switchedPIQ by the master, one-sided PIQ by each processor) is output. The self-test isthen run.

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Following the self-test, the process image input (PII) is read in again. The PII isexchanged and unified and the ground cycle is re-called.

In each sub-unit, a check is made at every synchronization point to make surethe other sub-unit is functioning. Depending on the result of the check, a switchover from the standby to the master controller is performed and the message”Standby failure” output.

The synchronization procedure is timed at each synchronization point by meansof a watchdog timer set to 30 ms. A check is also made at each synchronizationpoint to make sure that both sub-units are executing the same statement(comparison of OP codes). If they are not, the standby controller stops and a”synchronization error” is reported.

Switchover from standby to master takes place in the following instances:

1. Failure of the master CC (BASP, NAU or STOP switch)

2. Initial error search of both sub-unit CPUs unsuccessful (see ”Error searchmode”)

3. First failure of a master controller’s IM 314R when the standby controller hasaccess to a larger number of IM 314R interface modules than the master

4. First failure of a master controller’s I/O bus (i.e. a wire break) or failure of anIM 304 when the standby controller has access to a larger number of IM 314Rinterface modules than the master

5. First failure of a switched I/O module

In cases 3 to 5 the new standby CPU does not stop, but continues functioning asa standby controller.

The functional sequence of a switchover from standby to master is as follows:

The standby controller checks the operational status of the master controller ateach synchronization point. Failure of a master is detected at the hardware levelby evaluating the S5 bus signals BASP and NAU in the IM 324R parallelinterface module. The standby CPU’s operating system detects the failure of themaster controller at the next synchronization point, and branches to a routinewhich executes the following functions:

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� Switches over the I/O buses of all IM 314R modules� Switches all two-channel I/Os to single-channel operation� Switches the operating system to Solo mode; that is, no sub-unit

synchronization

With regards to the I/Os allocated to the failed sub-unit, the following occurs:

� PIQ and PII are set to zero� No ’ADF’ error is reported when this PIQ/PII is accessed� Timeout is reported in the event of direct access to one of these I/Os

Self-Test Strategy

A redundant system’s highest priority is fault detection and fault localization. Thisis required in order to control the fault. The S5-155H’s self-test routines run inboth CPUs. They detect and localize hardware failures in a minimal amount oftime. To localize a fault, it is necessary to only find out which modules are faultyand to replace them.

Which self-test routines execute depends on the operating status of the system:

� Self-test in the Restart routine

The entire self-test is run when a central controller is restarted. If a fault isdetected at this stage, the CPU stops. Because the self-test takes longerthan one minute, it is skipped on a warm restart of the master controller.During execution of the self-test in the Restart routine, the RUN andSTOP LEDs on the front plate show a steady light. A complete self-test isrun in all Restart modes.

� Self-test in cyclic mode

Each time the ground cycle is processed (once per cycle), part of the self-test is executed in small slices (2 ms test slices). The self-test thereforeruns, transparent of the other software, or in the background, until ahardware failure is detected.

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Tested System Components

Important system components such as CPU, memory, I/Os and communicationslinks are continually tested and monitored. Following is a brief description of eachof these tests:

� CPU test

Includes testing of STEP 5 operations, timers, CMOS clock, interruptmask and the scan time monitor

� Firmware/RAM test

Comparison of the RAM in both sub-units and a checksum test of the OB,SB, PB, FB, FX blocks and of the constants DB/DX. Also a RAM test forall variable DB/DX

� I/O bus test with IM 314R

Tests for short-circuits and breaks in the 721 I/O bus cable to the IM 314R

� I/O bus test for page addressing

Page addressing is tested in cyclic mode once in every complete test runand also once on each restart. The test detects the following faults:

� A CP/IP reacts to (acknowledges) not only its own interfacenumber, but also to the other 255 interface numbers

� An acknowledgement is issued by an unassigned interfacenumber

� IM 304R/IM 324R parallel interface test

The parallel interface’s dual-port RAM is tested on both sub-units A andB to locate any short-circuits or cable/wire breaks

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Self-Test in Error Search Mode

When an error is detected which, because it was found during a RAMcomparison test, could not be allocated to a specific sub-unit, the standbycontroller enters the Error Search mode. This mode is also entered when adiscrepancy is found when comparing the output images of the two sub-units. InError Search mode, the self-test is not executed in slices, but rather in itsentirety, which takes approximately 10 to 30 seconds. Following is an example toillustrate the functional sequence in Error Search Mode:

At the end of each ground cycle the two sub-units exchange and compare theentire process output image (PIQ). If a discrepancy is found during this cyclicPIQ comparison test, the memory locations in the PIQ are tested for ”stuck at 0”and ”stuck at 1” errors. If such an error is found, only the malfunctioning sub-unitstops.

If the error cannot be localized, the 155H responds by placing the standbycontroller into the ”Error Search” mode and putting master controller into ”Solo”mode.

If the self-test locates a fault in the standby controller, the standby stops.Otherwise, the standby controller is activated and a standby-master switchoverinitiated. The PLC now runs in “Redundant” mode. Should another comparisonerror be found, the new standby controller enters the ”Error Search” mode whilethe new master continues in ”Solo” mode.

If the self-test locates an error in the new standby controller, which is now inError Search mode, the standby controller stops and reports an error. If the self-test cannot locate an error in this sub-unit either, the sub-unit stops with a ”Non-locatable error” if the second comparison error occurred within the sametest cycle.

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Mode Selector Switch

The mode selector switch has two positions:

RUNWhen the mode selector switch is set to ’RUN’ and the green LED is on, the CPUis processing the user program.

STOPThe CPU goes to ’soft STOP’ when the user switches from’RUN’ to ’STOP’. The red ”STOP” LED goes on.

Reset Switch

The restart functions ”Overall reset”, ”Cold restart” and ”Cold restart withmemory” can be initiated via the mode selector switch and the reset switch:

Function Switch position DescriptionOVERALL RESET Down An overall reset reinitializes

the internal RAM (meaningany data currently in RAM areerased and the contents of thememory card, if any, arecopied to internal RAM). Acomplete self-test is thenexecuted.

RESET (Cold restart) Up A cold restart, or RESET,resets all flags, timers,counters and the processimage. OB 20 is then called,and user program processingbegins again.

Cold restart with memory Middle User program processingbegins again, but all flags,timers, counters and theprocess image retain theircurrent states.

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Status LEDs

The ”STOP” LED signals a ’soft STOP’, the ”SYS FAULT” LED a ’hardSTOP’. In ’soft STOP’ mode, the CPU can cyclically scan the user program butthe digital outputs remain disabled. In ’hard STOP’ mode, no program can run;the CPU is at a ’standstill’. This state can only be exited by cycling the power.

Overview of Status LEDs

LEDRUN STOP SYS-

FAULTMode

RUN or Restart modeOn Off Off The CPU is in RUN mode and is master

Flashes Off Off The CPU is in RUN mode and is the standby

On Flashes Off The CPU is master; the parallel link has failed

On On On Appears briefly when the controller is switched on

On On Off The CPU executes the self-test on startup

Off Off Off The CPU is in the RESTART mode or PROGRAM TEST

‘Soft STOP’ modeOff On Off The CPU is in ‘soft stop’ mode.

After cycling the power on when the mode selector switch is at STOP and noerrors occurred during initialization.A restart is possible.

Off Flashesat high

fre-quency

Off The CPU is in ‘soft stop’ mode.An Overall reset was requested via mode selector switch/reset switch or by theoperating system. A restart is possible only after performing an overall reset orafter eliminating the problem and then performing an overall reset.

Off Flashesat low

fre-quency

Off The CPU is in ‘soft stop’ mode.� An error was detected during cyclic program processing. The CPU is at

STOP because no appropriate error handling routine was programmed.When the mode selector switch is moved from RUN to STOP, the LED willonce again show a steady light as long as the error does not re-occur.

� When error conditions exist, for example, selection of an illegal Restartmode.

� When a STOP operation was encountered in the user program.� In the event of a PROGRAM TEST programmer function for this CPU.� Some programming errors and controller faults also set the ‘ADF’, ‘QVZ’,

or ‘ZYK’ LEDs.

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‘Hard STOP’ mode

Off Off On The CPU is in ‘hard STOP’ mode.� When error free execution of the system program is no longer possible, the

CPU enters the ‘hard STOP’ mode� Reasons for a ‘hard STOP’:

� Timeout (QVZ) or parity error (PARE) in system RAM� ISTACK overflow� STEP 5 operation “STW”

� A ‘hard STOP’ can only be exited by cycling the power on the controller.‘Activate standby’ mode

Flashes Flashes Off The CPU is the standby, and the mode is ‘Activate standby’.

Overview of Error LEDs

LED Description

A module addressed by the program no longer acknowledges, although/because:� It either acknowledged in the process image on a CPU cold restart and was entered as

available� Or was entered in the address list and was recognized as being available on a cold restart� Or was addressed in direct access mode� Or no access is possible to the data handling blocks on the module.

Possible causes:� Module failure; failure of the expansion unit� Module was removed during operation, while the CPU was at STOP or when controller was

switched off and there was no subsequent cold restart� Failure of the enable voltage L+

QVZ(timeout)

A timeout occurred while user memory was being accessedADFOn

The user program referenced an address in the process image which was not entered in DX1

ZYKOn

The watchdog timer used for scan time monitoring responded and cyclic program processing wasinterrupted

BASPOn

Command output is disabled; the digital outputs are set directly to the safe state (0)

INITOn

This LED briefly shows a steady light during the initialization procedure which follows POWER ON,and during operation in the event of a system fault

Interface Error LEDs SI1 and SI2

LED SI2 is always off unless there is a CPU fault. LED SI1 will be ON if nocommunication is possible which is an internal error. It will be OFF if bothinterfaces are initialized and ready.

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Communications Processor (CP 1430)

The CP 1430 communications processor is used to connect the AP to the PlantBus and will be discussed in detail in the chapter on the SIMATIC H1 Plant Bus.

Interface Module IM 324R

The IM 324R interface module is used in conjunction with the IM 304 interfacemodule in the accompanying AP rack for redundancy. The figure below illustrateshow the redundancy link and the expansion unit are interconnected:

Fig. 3: Redundant AP > AP connection

The IM 324R module is inserted in the main central controller rack anddetermines which controller is the master. See figure 1.1 above for slotassignments for the IM 324R.

The IM 304 > IM 314R connections from master to expansion and standby toexpansion are used to access the I/O from the field. The IM308 modules connectto the ET200 stations to establish this link to the field I/O.

TXP-HW Course

Copying of this document, and givdamages. All rights are reserved in

Figure 4 showsrack:

Fig. 4: EG 185 U e

Fig. 4.1: Possible m

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Training it to others and use or communication of the c the event of the grant of a patent or the registrati

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13

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EU902 FUM Rack

The function modules (FUM) of the individual control level are installed in theEU902 racks. Each rack can accommodate upto 19 function modules and upto 2IM614 interface modules. To ensure high availability, each function module hastwo bus interfaces that are independent of each other. Each bus interface isconnected with a separate IM614 interface module via a separate rack bus.

The EU902 rack with the function modules connects to the AP via the IM304 andIM 614 interface modules. One IM614 module of the rack connects to AP (A),and the second to AP(B). This produces a continuous redundant bus connectionfrom the AP down to the function modules.

While the IM614 interface module in slot 155 is connected with AP(A), the IM614in slot 163 is connected with AP(B).

Upto 4 IM614 interface modules in series connection may be combined to form abus chain that is connected to the AP via an IM304 module. The maximumdistance between the AP and the last IM614 of the bus chain is 100 meters.

Typical EU902 Rack configuration:

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Below is a typical connection layout for the EU902 rack to the Basic AutomationProcessor.

IM614 Interface module

The IM614 interface module is used in the As620 B automation processor forconnecting the function modules (FUM’s) to the AP automation processor. Theinterface module is installed in each EU902 rack, and handles the entire datatraffic with the function modules in the rack

Two IM614 interface modules may be installed in each EU902 rack. Thisprovides a consistant redundancy of the I/O bus, from the automation processordown to the function modules.

The major functions of the IM614 and IM304 interface modules are coupling thehigher order level (AP) with the FUM racks (EU902).

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Figure below shows front view of IM614 Interface module

The Function Module (FUM) of the Individual Control Level

The function module (FUM) of the individual control level form the interfacebetween the process control system and the process. Functionality andconnections of the FUM modules have been designed such that they satisfy thespecific requirements of the power plant technology. The major tasks of thefunction modules include:

� Acquiring, conditioning, processing, distributing and monitoring signals andsensor supply

� Processing stand-alone automation tasks for individual closed- and openloop control systems.

� Time stamp of 1ms resolution

� Monitoring function for simple and precise diagnosis in the event of failure.

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Each module has its own microprocessor, a module related power supply, andtwo independent bus interfaces that connect to the redundant cabinet bussystem. The system automatically selects the second bus system when the firstone fails. The defective module may then be located and replaced duringoperation.

The figure below shows the basic structure of such a FUM module:

The connections to the analog and binary sensors on field level, and to the powersection of switching and actuating elements (switchgear), are established via thefunction related part.

If necessary, manual intervention from conventional control locations (CCR) maybe performed via modules of the individual control level. In this case theinformation is output via conventional indicators and signaling fields.

Besides various monitoring and diagnosis functions, the individual control levelsalso acquires signal transitions of binary and/or the change of analog signal byselectable value. The system adds a time stamp of 1ms resolution, and handlesthese events as data with time (DMZ).

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FUM 210

The FUM 210 may be used for sensor conditioning of binary signals or drivecontrol functions depending upon the configuration chosen. Below is a summaryof the functions of the FUM 210 module.

The FUM 210 is inserted into the EU902 rack and its inputs are wire rapped ontothe back of the module

Sensor conditioning for binary signals with FUM 210

� Acquiring of 28 binary signals

� Output of 24v DC / 120mA for sensor supply

� Sensor monitoring for open circuit and short circuit to ground

� Signal simulation with software

� Redundant design is possible

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Drive control with FUM 210

� Control of upto 8 individual drives, 5 motors/solenoid valves/switchgear, 4servo drives, 3 reversing drives.

The module has the following functions, depending on the application,

� Acquiring the drive check-back messages (travel limit and torque limitswitches).

� Interpreting switchgear messages (undervoltage, switchgear fault, and motortemp high).

� Monitoring C&I functions (Module fault, run time faults).

� Simulation via software

� Redundant design possible

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The illustration below shows the front view of a FUM 210 module

The card has fuse access, identification label and an error indication lamp on thefront of the card. All the inputs are fed to the back of the module from wire rappedterminals.

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Connecting the ET 200M stations

The ET 200M stations connect to the AP via the IM 308-C and IM 153 interfacemodules. A SINEC L2-DP bus chain with up to thirty two (32) IM 153 (ET 200Mstations) modules may be connected to each IM 308 (bus master) in the centralunit (CU) or expansion unit (EU). Up to ten IM 308 modules (10 chains) may beconnected to each AP. The total number of ET 200M stations is limited to 32.The following maximum distances to the AP may not be exceeded in adistributed structure.

Maximum length of a chain (L2-DP bus length):

- With copper conductor at a baud rate of 1,500 bits/s 200 meters- With glass optical leads 1,400 meters

There are 3 types of connections possible with ET200 stations:

Directly, un-switched

Here, the IM 308 interface modules are installed in the AP’s centralcontroller. If the AP fails, all chains directly connected to this AP includingthe ET 200M stations concerned and the SIM modules installed there areno longer available.

Switched

Here, the IM 308 modules are installed in the expansion unit of theredundant AP. The chains are connected with the master AP. If the masterAP fails, the standby AP immediately takes over mastership, and the ET200M chains communicate with the new master AP.

Redundant (beginning from release 6)

The IM 308-C interface modules are present once on each bus chain andAP subsystem. The bus medium is redundant. The ET 200M stations have2 bus medium connections. Unlike the switched option, the availability ofthe redundant option will not be impaired if an IM 308-C or a bus mediumfails. A mixture of redundant and non-redundant bus chains in one AP ispossible.

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IM 308 > IM 153 Interface Modules

The IM 308 C interface modules are used as the bus master on the PROFIBUS(a.k.a. L2 bus) to establish a link to the IM 153 modules of the ET 200M family ofI/O modules. The figure below illustrates a typical configuration followed by atable of connecting cables:

Fig. 5: Typical ET 200M configuration

See item number of connecting cable in Table 5.1

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ItemNo.

Connection IM <--> or buscomponent

Order No. Application/Comment

1 Connecting cableIM 324R <----> IM 304

6ES5 721--0xxx0 *) Redundancy linkAP (A) <--> AP (B)

2 Connecting cableIM 304 <----> IM 314R

6ES5 721--0xxx0 *) Link ZG <--> EG withswitched I/O

6XV1 830--0AH10 Cable without connectors3 SINEC L2--DP two--wire cableIM 308--B/C <----> ET 200M/U/B 6ES7972--0BA20--

0XA0 Bus connector

4 Connecting cableIM 316 <----> IM 316

6DS5 712--8yy00 ET 200M tiers one below theother in a multi--tier structure

5 Glass optical leadFIBER OPTIC CABLE standard cable,can be subdivided, prefabricated with 4BFOC connectors

6XV1 820--5Bxxx *) Link of Optical Link Modules(OLM) for the connection ofET 200M stations

6 CUPOFLEX twin cable PVC UL3.6 mm BFOC

5DX8031--8AAxx *) Link of Optical Link Modules(OLM) for the connection ofET 200M stations, maximumlength 65 m

7 OLM/S4 for PROFIBUSOptical Link Module with glass opticallead, for standard length with signalingcontact, 4 channel version

6GK1 502--4AB10 Optical Link Modules (OLM)for the connection of ET200M via glass optical leads

8 OLM/P4 for PROFIBUSOptical Link Module with plastic opticallead, 4 channel version with signalingcontact including 4 BFOC connectors

6GK1 502--4AA10 Optical Link Modules (OLM)for the connection of ET200M via plastic opticalleads

Fig. 5.1: Connecting cables

Bus terminating connector for SINEC L2-DP

The L2 bus connector is used as a bus terminating connector. The busconnectors at the IM 308 card and the last ET 200M station must have theterminating resistor installed in order for the bus to function properly.

Basic Structure of the ET 200M Stations

The ET 200M distributed I/O device is a DP slave within the distributed I/Osystem ET 200. For TXP, it consists of the following components:

� Slave interface module IM 153

� Up to 8 Signal modules (SIM)

� Up to 124 bytes for outputs and 124 bytes for inputs

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Slave interface modules and signal modules are installed on a profile rail. Ifactive bus modules are used, the modules can be plugged in and removedduring online operation.The IM 153 slave interface module connects the SIM modules to the PROFIBUSand the automation processor. Up to 32 ET 200M stations can be connected to abus chain. If 2 IM 153 slave interface modules are used a redundant connectionto the Profibus is possible.

Fig. 6: ET 200M station

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The IM 153 module has a back plane connector for connecting active headstation bus modules (Figure 7), which hold the SIM I/O modules.

Fig. 7: Installing a SIM module on a bus module of an ET 200M station

Each ET 200M station can be equipped with SIM modules up to an addressingvolume of 124 input bytes and 124 output bytes.

Each chain permits up to thirty two ET 200M stations to be connected with twowire cables via SINEC L2--DP in a daisy-chain fashion (see Fig. 8).

Fig. 8: Daisy-chain connection of ET 200M stations

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The Signal Modules (SIM)

The following modules from the SIMATIC S7 ET 200M distributed I/O system areused in AS 620 B:

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Concise Description of the Signal Modules in ET200M

Input Modules for Binary Signals SIM 321The following modules can be used:

To read in the binary signals, the function block FB70 (BINAUF) or FB72(BINEIN) is called up in the AP for each channel. If form C contacts areconnected, the FB70 (BINAUF) is required in the AP for each form C contactsystem. Each form C contact system occupies two input channels. The NOcontact is on the odd channel (e.g. K1, K3, ...). The channel no. of the form Ccontact system is specified by the channel--no. of the odd channel (e.g. K1, K3,...).

The modules can also be used for the DCM function blocks FB163(MOTVENTR), FB164 (STELANTR) and FB165 (REGELANR).

No provisions have been made for the installation of AC 120V modules in TXPcabinets.

The following connection diagrams of the digital input modules always refer toindividual contacts. The following figure shows the type of form C contactcircuitry.

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SIM 321-1BH01 Module, DI 16 * DC 24 V

Order No.: 6ES7 321 - 1BH01-0AA0

Features:� 16 inputs, electrically isolated in groups of 8� Rated input voltage DC 24 V� Suited for switches and 2-/3-/4-wire proximity switches (BEROs)

Connections of the module SIM 321--1BH01, DI 16 * DC 24 V

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SIM 321-7BH00 Module, DI 16 * DC 24 V with Sensor Power Supply /Diagnosis

Order No. 6ES7 321 - 7BH00--0AB0

Features:

� 16 inputs, electrically isolated in groups of 16

� Rated input voltage DC 24 V

� Suited for switches and 2-/3-/4-wire proximity switches (BEROs)

� 2 short--circuit proof sensor power supplies, each supplying 8 channels

� External redundant feeding of the sensor power supply is optional

� Status indicators “Sensor voltage (Vs) O.K:”

� Common fault indicator (SF)

� Settable input delays 0,1 / 0, 5 / 3 / 15 / 20 ms; presetting: 3ms

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Connections of the module SIM 321-7BH00, DI 16* DC24V with sensor power supply/diagnostics

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SIM 321-1EH01 Module, DI 16 * AC 120 V

Order No.: 6ES7 321 - 1EH01-0AA0

Features:

� 16 Inputs, electrically isolated in groups of 4

� Rated input voltage AC 120 V

� Suited for switches and 2-/3-/4-wire proximity switches

Connections of the module SIM 321--1EH01, DI 16 * AC 120 V

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SIM 321-1BL00 Module, DI 32 * DC 24 V

Order No.: 6ES7 321 - 1BL00-0AA0

Features:



� Suited for switches and 2- /3- /4-wire proximity switches (BEROs)

Connections of the module SIM 321-1BL00, DI 32 * DC 24 V

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Output Module for Binary Signals SIM 322

The following modules can be used:

The associated function blocks in the AP are: FB71 ( BINAUS ) per channel orbinary outputs for the FB163 (MOTVENTR) FB164 (STELANTR) and FB165(REGELANR).

No provisions for the use of AC 230 V modules in TXP cabinets have beenmade.

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SIM 322-1HF01 Module, DO 8 * Rel. AC 230 V

Order No.: 6ES7 322 - 1HF01-0AA0

Features:

� 8 outputs, electrically isolated in groups of 2

� Load voltage DC 24 V to120 V, AC 48 V to 230 V

� Suited for AC/DC solenoid valves, contactors, motor starters, low powermotors and alarm lamps

Connections of the module SIM 322-1HF01; DO 8 * REL. AC 230 V

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SIM 322-1BH01 Module, DO 16 * DC 24 V / 0,5 A

Order No.: 6ES7 322 - 1BH01-0AA0

Features:


� Output current 0.5 A

� Rated load voltage DC 24 V

� Suited for solenoid valves, DC contactors and alarm lamps

Connections of the SIM 322-1BH01 module

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SIM 322-1HH00 Module, DO 16 * Rel. AC 120 V

Order No.: 6ES7 322 - 1HH00-0AA0

Features:


� Load voltage DC 24 V to 120 V, AC 48 V to 120 V

� Suited for AC/DC solenoid valves, contactors, motor starters, low powermotors and alarm lamps

Connections of the module SIM 322-1HH00; DO 16 * Rel. AC 120 V

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SIM 322-1BL00 Module, DO 32 * DC 24 V / 0,5 A


Features:


� Output current 0,5 A

� Rated load voltage DC 24 V

� Suited for solenoid valves, DC contactors and alarm lamps

Connections of the module SIM 322-1BL00; DO 32 * DC 24 V / 0,5 A

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SIM 323-1BL00 Module, DI 16 / DO 16 * DC 24 V /0,5 A


Features:




� Load voltage DC 24 V

� Suited for switches and 2- /3- /4-wire proximity switches (BEROs), solenoidvalves,

� DC contactors and alarm lamps

� This module is optionally used for the following functions:

� To input 8 form C contacts or 16 single contacts each with contact supply

� To input and output 16 each binary signals

� To read in control commands and output lamp signals for desk tiles inconventional control rooms and operator stations

� Drive control module for 4 motors/solenoid valves (FB153) or 2 reversingactuators (FB156)

The output channel with the same channel no. as the input channel for the formC contacts is used for the contact supply of single contacts.

The function block FB70 is called up to read in input signals in the AP for eachsystem (contact supply and individual contact or contact supply and form Ccontact).

You are free to mix form C and single contacts. Binary contacts which are notused for the contact sup-ply can be used for signal output.

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Example of a circuit with single contacts with sensor power supply

Connections of the module SIM 323-1BL00; DI 16 / DO 16 input and output of binary signals

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Analog input module SIM 331

Associated function blocks in the AP:

FB73 (ANAEIN ), FB74 (ANAAUS ), FB76 (ANATHERM ) and FB77 (ANAWID ):Input ranges: 0...20 mA

4...20 mA+--20mAThermocouples type J,KResistance thermometer Pt100

Connecting Voltage and Current Sensors, Resistance-Type-Thermometersand Thermocouples

The abbreviations and mnemonics used in Fig. 9 through Fig. 12 have thefollowing meanings:

� IC + : Constant-current lead (positive)

� IC - : Constant-current lead (negative)

� M +: Measuring lead (positive)

� M -: Measuring lead (negative)

� COMP+ : Compensating terminal (positive)

� COMP - : Compensating terminal (negative)

� MANA : Reference potential of the analog measuring circuit

� M : Ground terminal

� L +: Terminal for 24 V DC supply voltage

To reduce electrical interference, you should use twisted-pair shielded cables forthe analog signals. The shield of the analog signal cables should be grounded atboth cable ends.

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Connecting Current Sensors as 2-Wire and 4-Wire TransducersThe 2-wire transducer receives its short-circuit-proof power supply via the analoginput. This transducer then converts the measured variable into a current. Four-wire transducers have separate power supplies.

Two-wire transducers must be isolated sensors.

Fig. 9 shows you how to connect current sensors as 2-wire transducers to anisolated analog input module.

Fig. 9: Connecting 2-wire transducers to an isolated analog input module

Fig. 10 shows you how to connect current sensors as 4-wire transducers to anisolated analog input module.

Fig. 10: Connecting 4-wire transducers to an isolated analog input module

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Fig. 11 shows you how to connect resistance-type thermometers to an isolatedanalog input module.

Fig. 11: Connecting resistance-type thermometers to an isolated analog input module

Thermocouples

If you connect thermocouples direct to the inputs of the module or viacompensating leads, you can use internal temperature compensation. Eachchannel group can use a thermocouple type supported by the analog moduleindependently of the other channel groups.

Fig. 12: Connection of thermocouples with internal compensation to an isolated analog input module

When you input signals from 4-wire transducers, thermocouples or resistance--type thermometers, the not used inputs of the respective channel group must beshort-circuited and connected to the MANA terminal. If not used, the Comp inputmust be jumpered.

Not used analog inputs should be deactivated via parameterization. Thisshortens the cycle time of the module.

2-wire transducers need the connection of MANA to M. Not used channels needno connection because of the existing shunt to MANA.

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SIM 331-7KB01 Module, AI 2 * 12 bit

Order No.: 6ES7 331 - 7KB01-0AB0

Features:� 2 inputs in a channel group� Measured value resolution (depending on the integration time selected)� 9 bit + sign� 12 bit + sign� 14 bit + sign� Measurement type selectable for each channel group:� Current� Resistor� Temperature� Optional measurement range selection for each channel group

� Electrically isolated from the CPU

� Electrically isolated from the load voltage (not with 2--wire transducer)

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Connections of the module SIM 331-7KB01; AI 2 * 12 bit for process signals

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Connections of the module SIM 331-7KB01; AI 2 * 12 bit

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SIM 331-7KF01 Module, AI 8 * 12 bit

Order No.: 6ES7 331 - 7KF01-0AB0

Features:

� 8 inputs in 4 channel groups

� Measured value resolution selectable for each group (depending on theintegration time selected)

� 9 bit + sign� 12 bit + sign� 14 bit + sign� Measurement type selectable for each channel group:� Current� Resistor� Temperature� Free selection of measurement range for each channel group


� Electrically isolated from the load voltage (not with 2-wire transducer)

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Connections of the module SIM 331-7KF01; AI 8 * 12 bit for current and voltage measurement

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Connections of the module SIM 331-7KF01; AI 8 * 12 bit for resistance thermometers

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SIM 331-7NF00 Module, AI 8 * 12 bit

Order No.: 6ES7 331 - 7NF00-0AB0

Features:

� 8 inputs in 4 channel groups

� Measured value resolution selectable for each group (depending on theintegration time selected )

� 15 bit + sign

� Measurement type selectable for each channel group:� Current


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Connections of the module SIM 331-7NF00; AI 8 * 12 bit for resistance thermometers

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Analog Output Module SM 332, AO 4 * 12 Bit

Order No.: 6ES7 332 - 5HD01-0AB0

Features:

� 4 outputs in 4 channel groups

� The outputs are selectable by channels as� Voltage output� Current output� Resolution 12

� Electrically isolated from the CPU and load voltage

The associated FB in the AP is the FB75 (ANAAUS). The setting of the functionblock parameter “Analog input range” is independent from the HW setting of theSIM332 selected to 0...20mA.

Connections of the module SIM 332; AO 4 * 12 bit.

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� During normal redundant operation (functioning master and standby) what isthe status of the CPU 948R’s RUN and STOP LEDs…..

� On the Master?

� On the Standby?

� What 2 Interface Modules are connected to make up the redundancy linkbetween the CPU 948Rs?

� What Interface Module is used to connect the ET 200 stations?

� What is the maximum number of IM 153 modules that can be connected to anAP?

3

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� What bus is used to connect the ET 200M stations to the TXP AutomationProcessor?

� What is the maximum number of input and output bytes per ET 200M station?

� If a single IM 308C chain has 6 stations connected to it which L2 connectorsin the chain need to be terminated?

� Draw a diagram of a redundant AS 620 B system depicting all InterfaceModules down to the ET 200M stations and all necessary connections

� What are the 5 different uses of the SIM 323 module?

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� What SIM module would be used to connect 8 24 VDC single contact inputs?

� What SIM module would be used to connect 4 type K thermocouples?

� Turn off the power to your AS 620 and remove the I/O cards from the ET 200station

� Remove and reinstall one of the bus units

� Reassemble the ET 200 station observing the coding keys on the terminatingconnectors

3

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� Turn the power back on and observe the CPU 948 LEDs on startup

� What sequence did the LEDs go through?

� What is the status of the LEDs after complete startup?

� What does this indicate?

� Perform a “Cold RESET” on the CPU 948

� How is this accomplished?

� Is the user program running in the CPU afterwards?

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AS 620T & Exercise 3

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Copying of this dodamages. All right

w
AS 620 T Hardware Overvie
Training Centercument, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment ofs are reserved in the event of the grant of a patent or the registration of a utility model or design.

1

4

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Rack Layout

� Either 12 or 24 slot racks (SR12 or SR24)� Power Supply w/back-up battery� Outputs for “Power Supply OK” & “Fan OK”� 2 back plane buses: L and C� PM6/PM5 (Processor Module)� EM11 (I/O Board)� CS12 (Fiber Optic Coupling)� CS22 (Fiber Optic Coupling)� CS7 (Carrier Module)� SS52 (Interface Board)� CSH11 (Communication Board)

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L & C Bus� Features

� The L bus (local bus) is dedicated to processor and I/O tasks� The C bus (communication bus) is dedicated to communications tasks

C bus connection

L bus connection

CS7 plug in for SSx cards. Note: The CS7 has Cand L bus connection.

SS connection

4

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PM6 Processor

� Central Processing Unit for general open and closed-loop control tasks with high computationalrequirements

� Features

� 8 on-board digital inputs

� 64/128 MHz, 32/64 bit RISC processor

� 8 Mbyte DRAM (16Mb version)

� 256 Kbyte SDRAM

� Cache: 16 Kbyte program, 16 Kbyte data

� Clock pulse (external/internal):

� 32 MHz for local periphery

� 64 MHz for DRAM accesses

� Program memory module

� MS5 - 2 MB flash EPROM, 8 KB EEPROM

� MS55 - 2 MB RAM, 8 KB EEPROM

� MS51 - 4 MB Flash EPROM, 8 KB EEPROM

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PM6 (Display Codes)

The following display codes are displayed in the LED window of theprocessor:

Display Operating and error status1..8 Configured number of the CPUA Display caused by the user software (configuring)

-Initialization phase. Indivudual initialization steps are displayed with increasing numbers during run - up phase.

. 5V available; no program is being executed

0

Initialization error due to erroneous or incorrectly inserted modules for the actual software which has been configured: flashing "0" -> Error on this module; steady "0" -> Error on other modules or error when loading system software

bMonitoring error (e.g. missing, discharged buffer battery, overload on binary outputs)

C Erroneous configured communications or connectionE Operating system alarms, generally, time overrun

H

Fatal system error due to hardware or software problems which resulted in a program crash: flashing "H" -> fault/error on this module; steady "H" -> Fault/error on another module

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PM6 (Front panel and indications)

S1 Button

• Used to delete error displays

• Used with function block ASI as a binary input signal for trip resets

Program memory module

• MS5 - 2 MB flash EPROM, 8 KB EEPROM

• Used for storing user program

X1

• Serial interface RS-232

X5

• Binary Inputs BI1 - BI8

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Copying of this document, and giving it to others and usdamages. All rights are reserved in the event of the gran

EM11 I/O Board

Features

• digitize analog inputs with A/D or V/F/D converters

• binary I/O {in steam turbine governors only)

• 16 display LEDs

• Output analog voltage signals

Training Centere or communication of the contents, are forbidden without express authority. Offenders are liable to the payment oft of a patent or the registration of a utility model or design.

7

X5

• for incremental encoding

X6

• Digitize analog voltage signals

• 4 A/D channels

• 4 V/F/D channels

• Digital/Analog conversion (2 channels)

X7

• 16 binary inputs.

• 4 binary outputs for signal states of X5

LEDs

• H10/H20

• H10 byte with Red LEDs (H11-H18)

• H20 byte with Yellow LEDs (H21-H28)

4

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CS12 (Fiber Optic Coupling – Master)

X5

• Receiver

X6

• Transmitter

Features

• Master FO communications link between 2 racks for redundancy

• Can only be used on sub-racks with L and C buses Availability

• Can be used with expansion slots (ICS1 & ICS2) to control up to 8slave racks

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CS22 Fiber (Optic Coupling - Slave)

Features

• Slave FO communications link between 2 racks for redundancy

• Can only be used on sub-racks with L and C bus

X5

• Receiver

X6

• Transmitter

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CS7 (Carrier Module)

• H10/H11• amber and green LED

• X10/X11• double test socket

• Slot X1• Interface module slot

Features• Relieves processor board of communications tasks• Can accommodate up to 3 interface modules• Occupies 2 slots







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SS52 (Interface board – PROFIBUS)

Features

• Interface board for PROFIBUS protocol (SINEC L2)

X5

• DB9 RS485 interface

LED H10/H20/H30

LED H11/H21/H31 Function

dark dark processor not initializeddark lit no data basis in the ringdark flickers without data basis

flashing dark initialization erroneous

lit darkinitialization completed No bus connection

lit lit "in the ring"

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CSH11 (Support Board)

Features

• Plant Bus connection for communications with AS 620 B & OM 650systems

Front Panel Connectors

• Red and Green LEDs

• Switch ADM,Run,STP

• ADM allows resetting CSH11 via reset button

• Run > STP interrupts communication

• STP > Run establishes communication

• Reset button

• X5

• SINEC NML Programmer port

• X6

• Plant Bus connector cable port

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CSH11 (Support Board)

LED Red (STP)

LED Green (Run) Function

dark lit Run with data basisdark flashing NSAP addresslit dark Stoplit flashing Interrupt

lit litWaiting for synchronization with the monitor process in the host

dark darkInternal intermediate status of the CP

flashing dark Fatal CP error

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Rack OK

Power Supply OK Fan OK

24 V RK OK

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Training CenterCopying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liadamages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design.

Master Rack Feedback

Binary input

EM1 Rack

EM1 RackRibbon to

Outputs a 1 if master; 0 ifslave

4

Outputs a 1 if master; 0 ifslave

ble to the payment of15

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Processor Commmunictaions Using CS12 toCS22 FO Coupling

Transmit/Recieve

Receive/Transmit

Rack "A" Rack "B"

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AddFEM Unit Interface

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AddFEM LED’s

There are 3 groups of LEDs

Each group has 4 LEDs

There are 2 types of LEDs:

Error LEDs are red and on the left side

Status LEDs are green or yellow and are located on the right side

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AddFEM Light Explanation

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AddFEM Light Information Key

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AddFEM Connections

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Connections X4 & X5: Pin assignments forAnalog inputs and Outputs

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Connectors X6 and X7: Pin Assignments forDigital Inputs and Outputs

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COM PROFIBUS

COM Profibus is used for:

Configuring the communication port

Setting up the network

Setting up the AddFEM I/O

Setting station addresses

Figure above shows the COM Profibus configuration screen as shown onthe PG740

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COM Profibus GSD File

The GSD file shows a graphical representation of the Profibus network.It will show the DP master and all of the AddFEM slaves along with all the station addresses.

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COM PROFIBUS: Parameterization of theOperating Mode for AddFEM

Parameterization is done via menu selections from within the COM Profibussoftware:

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COM PROFIBUS: Parameterization of theAnalog Inputs/Outputs for AddFEM

Analog Inputs 1-6 can be parameterized as current or voltageAnalog Inputs 7-12 can be parameterized as only current

Analog Outputs 1-4 can be parameterized as current +/- 30 MaAnalog Outputs 5-8 can be parameterized as current +/- 20 Ma

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COM PROFIBUS: Parameterization of theAnalog Input Filters for AddFEM

Filters can be used to suppress unwanted signals on the Analog inputs

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AddFEM Connections to Profibus

If a connector has only one wire, it should always be connected to the connector withthe arrow pointing into the connector housing

The terminating resistors should only be turned on at the two ends of each run

When connectors are “piggy backed” all rules for terminating resistors are reversed

Other end of bus

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AddFEM General Troubleshooting

Symptom:No communication to an AddFEM module, but there is communicationon other AddFEM modules

Solution:Check that terminating resistors are correctly set on all connectors,and check that Profibus cables are correctly terminated in theconnectors

Symptom:If EXTF light is active

Solution:Check that all current loops are complete, and check that there are noshort circuits on both analog and digital I/Os

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Fast I/O Redundancy: 501CT Concept

Redundant AP connectionsOne AddFEM module failure initiates a trip

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Example of CT Redundancy (1)

In this example, the Governor System is in fault free operation; Green is usedto show the master; Orange is used to show the slave

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If the connection to the third AddFEM module on bus A is removed...

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The AddFEM module 3 will switch from A bus master to B bus master

This changes the status bits sent back to the Simadyn Processor

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Simadyn racks A and B receive status that AddFEM module 3 switched for A to B

Simadyn rack A switches from Master to Slave, and Simadyn rack B from Slave toMaster

The Governor software sends a life bit that tells whether it is the Master or Slave (thisis a special Hex Code) to the AddFEM modules...

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The AddFEM modules receive the Hex Code and switch to bus B

The AddFEM modules always select the bus channel that is the system Master,unless that channel is faulty

If either of the Simadyn racks do not switch, or either of the AddFEM modules donot switch, the turbine is tripped due to double failure

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� Where is the user program stored for the AS620T processor?

� What are the different uses of the L and C busses?

� What I/O module is used for direct access to the processor (no L or C busconnection)?

� What is the EM11 card used for?

� What 2 modules make up the redundancy link between the 2 processors?

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� What card is used to connect the AS620T to the Plant Bus?

� How is data sent from the AS620T to the OM650 PU?

� What is the AddFEM Module used for?

� Which tool is used to set up the AddFEM unit?

� On a separate sheet of paper draw a diagram of a complete redundantAS620T including all input and output modules

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SIMATIC H1 Plant Bus& Exercise 4/5

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SIMATIC H1 Plant Bus

Access Mechanism

All busses in TXP use the Carrier Sense Multiple Access Collision Detection(CSMA/CD) access mechanism. Both the electrical and optical versions of theIndustrial Ethernet CSMA/CD bus are based on the baseband transmissionprocedure whereby the information to be transferred is directly superimposedonto the transmission medium, which means no high-frequency carrier signalmodulation is used. The CSMA/CD access mechanism allows one transmissionchannel to be shared by all connected stations.

The CSMA/CD access mechanism is described in the Ethernet specificationIEEE 802.3 (1st edition 1985) and its extension (2nd edition 1989). Thisinternationally used standard initially only covered electrical coaxial CSMA/CDbusses. Then CSMA/CD busses with new transmission media such as FiberOptic and twisted-pair cabling were developed and used.

The bus components required are based on the extended IEEE 802.3 standardand allow different types of CSMA/CD busses to be used.

The SIMATIC NET Industrial Ethernet is based on the Open SystemInterconnection (OSI) reference model of the International StandardizationOrganization (ISO). Figure 1 illustrates the 7 layers of the OSI model:

5-7 See section on communication protocols4 Transport Reliable data

transmissionConnection/disconnectionAcknowledgementSegmentation

ISOtransport

3 Network Communicationbetween busses

Addressing of otherbusses

ISO networkTCP/IP

2 Data Link Access mechanismto the transmissionmedium

CSMA/CDmechanismChecksumcalculation

Data Link

1 Physical Physicalspecification of thetransmissionmedium

Coaxial/FO cabling Physical

Fig. 1: OSI 7 layer reference model

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In the SIMATIC NET Industrial Ethernet the layers 1 (physical layer) and 2a(media access control) conform to the IEEE 802.3 standard. These layers specifythe physical features of the transmission medium and the access mechanism ofthe stations to the transmission medium.

Carrier Sense and Multiple Access

On a CSMA/CD bus, all nodes connected to the bus check, or sense, what isbeing sent on the bus. Each node at any time has the right to access thetransmission medium provided that the bus is not being used by another node. Inother words, “listen while talking”.

Carrier SenseEvery node checks the bus for a carrier. Transmission is only attempted ifthe transmission medium is not being used by another node.

Multiple AccessEach node controls its own bus access independent of other nodes.

As soon as a node starts transmitting data on the bus the transmission mediumis blocked for all other nodes. The nodes sense the data on the bus and are ableto receive but cannot send data themselves.

If a station wants to send data while data is being transmitted by another stationit waits until the packet currently being sent has been received. After a GAP timeof 9.6 microseconds it can start sending data. Figure 2 depicts Carrier Sense:

Fig. 2: Carrier Sense

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Collision Detection

If several nodes are waiting to send data packets on the bus the possibility existsthat two or more stations transmit their data simultaneously to the transmissionmedium since they found the medium to be available at approximately the sametime.

As the data packets of these nodes are sent simultaneously a so-called collisionoccurs on the transmission medium. The colliding data packets are destroyedand lost. Once a transmitting node detects a collision, it stops sending dataimmediately. Data packets that were lost must be re-transmitted after a collision.Figure 3 illustrates collision detection:

Fig. 3: Collision Detection

The node that first detects the collision sends a jam signal, which makes it easyfor other stations to also detect the collision, and then stops its own transmissionprocedure.

A node must still be transmitting data in order to be able to detect a collisionwith its own signal. IEEE 802.3 defines a maximum propagation time of 25.6 µsfor a signal to travel from one end of the bus to the other and back. In order toallow the sender to detect a collision with a signal from a node which is themaximum permissible distance away, the minimum transmission time must be51.2 µs (= twice the single-direction signal propagation time).

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Data traffic between two stations can also include data packets that would betoo short to fill the minimum transmission time, such as, acknowledge packets.These packets would be supplemented up to the required minimum length of 64bytes:

(64 bytes = (512 bits x 100ns) =51.2 µs)

This procedure is called padding.

Fig. 4: Collision after the maximum propagation time

Retransmission after a collision

In order to prevent all nodes waiting to transmit data from sending data at thesame time after a collision the stations delay retransmission for some randomlength of time within a specific time interval.

The maximum number of retransmission attempts is 16. After the waiting periodthe nodes attempt to transfer the data again. The node with the shortest waitingperiod is the first to transfer while the others retry after different waiting periods.

After the 16th collision, no further retransmission attempt is made and a signal isissued to the next higher protocol layer.

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The CSMA/CD access mechanism for access to the transmission medium isalways the same no matter whether the bus uses electrical, optical or mixedcabling. The only differences between these busses are the physicalrepresentation of the data signals on the transmission medium as electrical orlight signals and the transmission media and bus components used.

Designation ValueBit time at 10 Mbps 100 nsMinimum packet length 512 bits (64 bytes) = 51.2 µsMaximum packet length 12,144 bits (1,518 bytes)Maximum transmission time Approximately 1.214 msGAP time 9.6 µsJam signal 32 bitsMaximum number of retransmission attemptsafter a collision

16

Maximum waiting period up to the 10th – 16th

retransmission attempts52.4 ms

Maximum theoretical bus length Approximately 4,520 m

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Communication Protocols for the Plant Bus

Communication on the plant bus is based on the ISO/OSI 7-layer model for opencommunication. The layer model is a widely used and accepted architecturalscheme that allows communication in a varied device environment. The layersresult from the specification and grouping of the different communicationfunctions, each of which plays an important role in implementing communication.Each layer serves the layer above and uses the services of the layer below, ifthey exist.

Communication protocols describe the rules, structures and procedures thathave to be applied during communication among bus participants. They arespecified in binding documents, such as ISO, IEEE, and ANSI, or widely usedstandards, such as, RFCs of the Department Of Defense.

In order for two bus participants to be able to intercommunicate thecorresponding protocol stack must be implemented and the protocol parametersto be used must be specified (the OSI layers used, addresses, number and typeof connections, data lengths, etc.). Figure 5 is a graphical representation of theOSI 7-layer model:

Fig. 5: The ISO/OSI 7-layer model

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The Protocols Used

The table below shows the protocols used for communication between thevarious systems connected to the plant bus in TXP:

Protocollayeraccordingto ISO/OSI

AS 620 –OM 650

AS 620 –AS 620

AS 620 –DS 670

AS 620 –ES 680

AS 620 –Std. S5(ancillaryplant sys.)

AS 620 -SIMADYN

As 620 –CP 581

SIMATICNETreal-timetransm.

765

APRED APRED APRED AS511 APRED AP (STF) APRED

4 ISOtransport

ISOtransport

ISOtransport

ISOtransport

ISOtransport

ISOtransport

ISOtransport

3 ISOnetwork

ISOnetwork

ISOnetwork

ISOnetwork

ISOnetwork

ISOnetwork

ISOnetwork

Empty

2 ISO Data Link1 IEEE 802.3

AP (STF) Automation Protocol/SINEC Technological Functions: higherprotocol functions based on the AP protocol from Siemens(OSI layers 5 through 7, no redundancy functions)

APRED Siemens implementation of the OSI layers 5 through 7(redundancy protocol, based on the AP protocol)

AS511 SIMATIC S5-specific protocol for remote programming andremote diagnosis of SIMATIC S5 devices

SIMATIC NETSiemens Network Architecture: SIEMENS implementation of theISO/OSI model for industrial communication

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Star Couplers

In TXP, star couplers are the center of the Industrial Ethernet bus. The varioustransmission media are coupled to the star couplers via plug-in type interfacecards. The figure below shows a typical Fiber Optics Industrial Ethernet bus withstar couplers:

Fig. 12: Industrial Ethernet bus with star couplers

TXP uses several types of star couplers: undivided AC, divided AC, undivided24V DC, and divided 24V DC. Of course, the undivided types are used wherethere is no redundancy requirements and the divided types for redundantconfigurations.

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Each type of star coupler comes with two power packs:

• The power packs of all star couplers operate with shared load• Each power pack is able to provide the star coupler with power if the other

power pack fails• All power packs can be removed and inserted under voltage (hot swapping).

For availability reasons, the redundant voltage supplies to the star couplers mustbe connected to separate supply voltages.

The figure below shows the front and rear views of a 24V DC divided starcoupler, which contains two star couplers each provided with a plug-in powerpack on the left-hand side. Both power packs operate with shared load and theyboth have a green LED to indicate power ON.

Fig. 13: Front view

Fig. 13.1: Rear view

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Star Coupler Equipment

Star couplers are equipped with interface cards, management cards orsupervisory modules as required. The plug-in slots that are not assigned must becovered by dummy plates to ensure optimal shielding and convection.

Fig. 14: Slot assignments of star coupler

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- Power packs:The power packs can only be plugged into the provided plug-in slots

- Interface cards:The plug-in slots for the various types of interface cards are freelyselectable.

- Management cards or supervisory modules:

Each star coupler provides a specific plug-in slot (the divided star couplerprovides two) for the insertion of a management card or supervisorymodule. If no management card/supervisory module is required the plug-in slot can also be used to plug in an interface card.

The power packs, interface cards, management cards and supervisory modulescan also be inserted and removed during operation while the star coupler isunder voltage.

Two star couplers are always connected via a Fiber Optic path. Each star couplermust contain an optical interface card for this path. The following opticalinterface cards are available:• OYDE-S....• ECFL2• ECFL4

Figure 14 depicts the basic principle of star coupler connections:

Fig. 14: Basic principle of star coupler connections

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Polarity of FO Cables

FO paths always require two fibers: one for the transmission and one for thereceive direction. The following principle applies if two devices are connected viaFO cables:

From ToDevice 1 transmission port Device 2 receive portDevice 1 receive port Device 2 transmission port

The receive and transmission ports on the FO interface cards and opticaltransceivers are identified as follows:

Reversal of the polarity of the transmission and receive direction is indicated by aflashing red CD-LED on the interface card front panel (low light).

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Virtual Ring Theory

The single-fault tolerance implemented in the TXP bus system is based on thevirtual ring principle whereby the star couplers are connected to a ring via FOpaths. At one point in this ring the FO connection between two star couplers isoperated in the redundant mode. During fault-free operation this path is openand thus provides the line topology required for operating a CSMA/CD bus. Allthe other paths are normal FO paths and are not redundant.

The redundant mode of a FO path can be implemented using various interfacecards. Figure 15 shows the virtual ring concept during normal operation:

Fig. 15: Virtual-ring (normal operation)

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The monitoring logic on the interface card, whose port is set in the redundantmode, monitors the virtual-ring for interruptions. The redundant path that hadbeen open up to the time the interruption occurred is then closed andcommunication is possible in both directions to the location of the interruption.Figure 16 shows the virtual-ring concept during abnormal operation:

Fig. 16: Virtual ring (redundant path is activated)

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Practical set-up

The redundant FO path is selected during the planning phase and implementedduring setup. The required settings on the pair of interface cards, whichterminate both sides of the redundant path, depend on the type of interface cardused. In the figure below, the redundant path is implemented using a pair ofOYDE cards. (Some of the OYDE cards in this example are inserted intomanagement plug-in slots that can also be used for interface cards if nomanagement is required).

Fig. 17: Redundant path with a pair of OYDEs.

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Interface Cards and Management Modules for Star Couplers

TXP uses the following interface cards, management cards, and supervisorymodules for star couplers:

Interface cards:

Twisted-pair ports

ECTP3

AUI ports

ECAUI

Multi-mode FO ports

OYDE-S µCECFL2ECFL4

Management cards/supervisory modules:

MIKEHSSM or HSSM2

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ECTP3

The multi-port twisted-pair interface card ECTP3 allows three terminating deviceswith twisted-pair (TP) interface or TP transceivers to be connected to theIndustrial Ethernet bus via TP cable segments. Participants connected to the cardand which have faults are separated from the bus.

The interface card ECTP3 can be inserted and removed online. The card is notprovided with a fuse. Figure 18 shows the front panel of the ECTP3 card followedby a table listing the meaning of the LEDs:

Fig. 18: The ECTP3 front panel

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LED response

Meaning of theLED

LEDcolor

No Error Error Remarks

Card-levelindicatorDA (Data) Yellow Briefly lit Data is sent to the basic system bus

by one of the three portsP/MGMT (Power/Management)

Green/Yellow

Yellow steadylight

Supply voltage for the star coupler ispresent

P/MGMT (Power/Management)

Green steadylight

Management is active

DIS (Disable) Yellow Steady light Card is separated from the systembus

Port-levelindicatorsLS (Link Status) Green Steady light Link status of the port is OK, the

connection to the participant isestablished

LS (Link Status) Not lit Link Status of the port is not OKCD/DIS (CollisionDetection/Disable

Red/Yellow

Red, briefly lit Collision has occurred

CD/DIS (CollisionDetection/Disable

Red steadylight

Port is segmented


Yellow steadylight

Port was blocked in the send andreceive direction

DA (Data) Yellow Briefly lit Data is received at the portMDI (port 1 only) Yellow Not applicable to TXP

Fig. 18.1: Meaning of ECTP3 front panel LEDs

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ECAUI

The twin transceiver card ECAUI allows two terminating devices to be connectedvia AUI port. Faulty terminating devices are separated from the bus system.The ECAUI interface card can be inserted and removed online. The card is notprovided with a fuse. Figure 19 shows the front panel of the ECAUI card followedby a table listing the meaning of the LEDs:

Fig. 19: The ECAUI front panel

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LED response

Meaning of theLED

LEDcolor


Card-levelindicatorP/MGMT(Power/Management)

Green/Yellow

Green steadylight

Supply voltage is present,management is active

P/MGMT(Power/Management)

Yellow steadylight

Management card is not inserted


Yellow steadylight

Connection to the management cardis interrupted

DA (Data) Yellow Briefly lit Data is sent to the basic devicessystem bus

DIS (Disable) Yellow Steady light Card is separated from the systembus by management

Port-levelindicatorsP1, P2(Power1, Power2)

Green Steady light Supply voltage of the terminatingdevice connected is present

P1, P2(Power1, Power2)

Not lit No AUI cable connected to the port


Red/Yellow



Red steadylight

Port was blocked in the send orreceive direction


Yellow steadylight

Port was deactivated by management

DA (Data) Yellow Briefly lit Data is received at the portSQE Test Yellow Not lit SQE test is switched off for this port

Fig. 19.1: Meaning of ECAUI front panel LEDs

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OYDE-S µC

The FO interface card OYDE-S µC allows a star coupler or an optical transceiverto be connected to the Industrial Ethernet bus.The interface card OYDE-S µC can be inserted and removed under voltage. Thecards are not provided with a fuse. Figure 20 shows the front panel of the OYDE-S card followed by a table listing the meaning of the LEDs:

Fig. 20: The OYDE-S front panel

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LED response

Meaning of theLED

LEDcolor


Card-levelindicatorP (Power) Green Steady light Supply voltage is presentP (Power) Flashing light Redundant mode (card is in standby

mode)CD (CollisionDetection)

Red Briefly lit Collision has occurred

CD (CollisionDetection)

Steady light Jabber control is active or partitioning


Flashing light Low light (cable interrupted)


Flashing lightlight/dark

Low light and partitioning

DA (Data) Yellow Irregularly lit Data is received via FO cable

Fig. 20.1: Meaning of OYDE-S front panel LEDs

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ECFL2

The FO interface card ECFL2 allows one more star coupler and a bus participant,or two bus participants to be connected to the Industrial Ethernet bus.The ECFL2 interface card can be inserted and removed online. The card is notprovided with a fuse. Figure 21 shows the front panel of the ECFL2 card followedby a table listing the meaning of the LEDs:

Fig. 21: The ECFL2 front panel

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LED response

Meaning of theLED

LEDcolor



Green/Yellow

Green steadylight

Supply voltage from the star couplerpresent, management is active


Yellow steadylight



Yellow steadylight


DA (Data) Yellow Irregularly lit Data is sent to the star couplersystem bus


Port-levelindicatorsLS (Link Status) Green Steady light Normal mode: the FO connection of

this port is okay and activeRedundant mode: the FO connectionof this port is okay, the port is active

LS (Link Status) Flashing light Redundant mode: the FO connectionof this port is okay, the port is in thestand-by mode

LS (Link Status) Not lit The FO connection is not in orderCD/DIS (CollisionDetection/Disable

Red/Yellow



Red steadylight



Yellow steadylight


DA (Data) Yellow Irregularly lit Data is received at the port

Fig. 21.1: Meaning of ECFL2 front panel LEDs

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ECFL4

The ECFL4 FO interface card allows a star coupler and additionally three busparticipants, or up to four bus participants to be connected to the IndustrialEthernet bus. The ECFL4 interface card can be inserted and removed online. Thecard is not provided with a fuse. Figure 22 shows the front panel of the ECFL4card followed by a table listing the meaning of the LEDs:

Fig. 22: The ECFL4 front panel

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LED response

Meaning of theLED

LEDcolor



Green/Yellow

Green steadylight

Supply voltage from the star couplerpresent, management is active


Yellow steadylight



Yellow steadylight


DA (Data) Yellow Irregularly lit Data is sent to the star couplersystem bus


Port-levelindicatorsLS (Link Status) Green Steady light Normal mode: the FO connection of

this port is okay and activeRedundant mode: the FO connectionof this port is okay, the port is active

LS (Link Status) Flashing light Redundant mode: the FO connectionof this port is okay, the port is in thestand-by mode

LS (Link Status) Not lit The FO connection is not in orderCD/DIS (CollisionDetection/Disable

Red/Yellow



Red steadylight



Yellow steadylight


DA (Data) Yellow Irregularly lit Data is received at the port

Fig. 22.1: Meaning of ECFL4 front panel LEDs

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The Management Card MIKE

The management card MIKE is used in TXP in conjunction with the diagnosticsystem DS670 for star coupler and LAN diagnosis. MIKE provides all informationrequired for evaluation in the DS670.TXP uses the flash variant of MIKE, i.e. the MIKE operating system is alreadystored in the EPROM. Figure 23 shows the front panel of the MIKE card. Adetailed listing of the LEDs is in the “Bus System” manual.

Fig. 23: The MIKE front panel

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The Star Coupler Supervisory Modules HSSM and HSSM2

The supervisory modules HSSM (Hub Status Supervisor Module) and HSSM2provide defined fault alarms and warnings from the star coupler as hardwaresignals. These signals can be incorporated into the existing TXP alarm strategyvia the automation cabinets.Either module can be used as an alternative to MIKE management card, but justas for the MIKE they must be inserted into the far right plug-in slot in theundivided and in the far right plug-in slots in each half of the divided starcoupler.Either module can be inserted and removed online (after insertion a self-testmust be activated). The cards are not provided with fuses. Figure 24 shows thefront panel of the HSSM module and the pin-out of the front panel connectorfollowed by a table listing the meaning of the LEDs:

Fig. 24: HSSM front panel and pin-out of connector

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LED response

Meaning of theLED

LEDcolor


Card-levelindicatorHUB OK (starcoupler OK)

Green Steady light Star coupler common alarm, OK

HUB OK (starcoupler OK)

Not lit Star coupler common alarm, not OK

HSSM OK Green Steady light Supervisory module is ready foroperation

HSSM OK Flashing light HSSM hardware faultHSSM OK Not lit Supervisory module being initialized

or self-test is activeERRORInterface

Red Steady light Interface cards signal fault or self-testis active

ERROR Fan Red Steady light Fan fault (irrelevant to the ASGE..) orself-test is active

LOAD 1-40 Yellow Lit Current mains load in %LOAD 1-40 Steady light Self-test is active

Fig. 24.1: Meaning of HSSM front panel LEDs

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Compact star couplers OLM ( Optical Link Module )

As far as availability and transmission reliability are concerned, the OLMs havethe same features as star couplers:

• Use of redundant optical paths

• 2 separate feed-ins for the voltage supply

• Diagnosis via LEDs

• Alarm contact for fault signaling ( same as the supervisory moduleHSSM for star couplers )

Interfaces:

• Two optical ports for connection to other modules (analogous tothe star coupler)

• Three industrial twisted-pair ports (ITP) to connect terminatingdevices

The optical ports can be used for the interconnection of several OLMs to form aredundant optical ring, or OLMs can be incorporated into an existing redundantoptical ring containing star couplers.

The industrial twisted-pair ports are used to connect, via ITP cable, up to threeterminating devices which have an ITP port, or terminating devices which havean AUI interface and twisted-pair transceiver TPTR.

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Fig. 13.2 Front and side view of an OLM

Fig. 13.3 Bottom and top view

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Fig. 13.4 Meaning of the LEDs

DIP switch Position MeaningLA1 ON

OFFAlarm link status port 1 (ITP) is OK activatedAlarm link status port 1 (ITP) is not OK deactivated

LA2 ONOFF

Alarm link status port 2 (ITP) is OK activatedAlarm link status port 2 (ITP) is not OK deactivated

LA3 ONOFF


LA4 ONOFF


LA5 ONOFF


R5 ONOFF

Port 5 is in the redundant modePort 5 is in the normal mode

Fig. 13.5 DIP switch block mounted in the OLM housing

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Coda

Optical Switch Modules (OSM) and Electrical Switch Modules (ESM)

The Optical Switch Modules(OSM) and the Electrical Switch Modules (ESM)permit switched networks with speed upto 100 Mbit/s. By segmentation the loadin existing network can be separated which increases performance. Redundancyis incorporated in the OSM and ESM modules, enabling the design of redundantIndustrial Ethernet ring structures.

The design of an optical ring requires OSMs with 2 FO ports. ESM’s also permitthe design of rings with copper cables (ITP standard cable). These electricalrings are designed with 2 twisted-pair ports. The data rate in the ring is 100Mbit/s and up to 50 OSMs or ESMs per ring may be used. In addition to the 2-ring ports, the OSM and ESM have 6 more ports to which terminal devices andnetwork segments can be connected. These ports are available either as 6x ITPor 6x RJ45 interface.

As with the star couplers (HSSM) monitoring of the modules can be done via asignaling contact and interrogation via the DS670 is also permitted, as with theMike card. Furthermore, OSM and ESM are prepared for the integration innetwork management systems on the basis of SNMP (Simple NetworkManagement Protocol) and web-based management.

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Training Centerpying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment ofmages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design.

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ig 13.6 Front view of an OSM Module

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Fast Ethernet

The benefit of Fast Ethernet is that it has all the features of the classic Ethernetstandard with a data rate increased by a factor of 10 to 100Mbps. The dataformat, the CSMA/CD protocol and the glass fiber-optic cables and cat 5 twistedpair cables are identical in both systems, but if you wish to utilize the full potentialof high speed performance with glass fiber link switched technology must beused.

The table below shows typical properties for a 6 port ITP OSM, which wouldutilize the 2 FO ports to make a redundant ring connection.

Properties of the OSM ITP62Electrical ports 6 x 10/100 Mbps auto-negotiation ports

with ITP connection (sub-D 9 pinfemale)

Optical Ports 2 x 100 Mpbs FO ports (full duplex)BFOC female connector

Maximum distance between two OSM’s 3000m (multimode graded-index fiber)Maximum ring span with 50 OSM’s 150 km

Switching Method

Switching Increases the Transmission Capacity and Span of a Network

The limited capacity due to the baseband transmission method and the limitedspan due to the CSMA/CD protocol means that an Ethernet network in a largeplant with a large volume of traffic often reaches its limitation, we call this the“meltdown point”. Using switching technology, network’s limits can be extendedconsiderably.

Basics of switching.

Networks operating at the physical layer such as star couplers, OLM’s and ESM’spass on received data transparently. This means that all data received at a portare output again to all other ports regardless of the content. This obviously slowsdown the network and is less efficient. Network components with a switchingfunction froward data from sender to receiver directly based on the source anddestination address information.

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Address Filtering

By analyzing the data traffic, a switch automatically learns which Data TerminalEquipment (DTE) is obtainable by checking its ports, this method is known as“tech-in-mode”. To enable it to carry out this function it enters the destinationaddress in an address table which is maintained for each port. Therefore onlydata entered for DTE’s in other subnets are switched from the input port to theappropriate output port of the switch. The switch is capable of handling severalsuch data flows at the same time provided they do not have the same port astheir destination.

Filtering of the data traffic based on the source and destination address, meansthat data will only be transmitted on the path on which they will reach thereceiver. This means that the entire network is used for more efficiently.

As well as having the ability to learn address’s that are attached to the OSM/ESMit also has the capability of monitoring the age of the addresses it has learnt.Address entries that exceed a certain age (aging time on the OSM/ESM is 40seconds) are deleted. If a packet is received by an OSM/ESM for which there isno address entry, the OSM/ESM will distribute it to all ports.

Redundant Ring Structure

As with star couplers and OLM’s a redundant ring structure can be implementedwith the OSM/ESM. Like the star coupler a redundant path is configured in thesystem, but in OSM’s and ESM’s it is known as a redundancy manager (RM). Sowith the aid of one OSM functioning as the RM, both ends of an optical bus madeup of OSM’s are connected together using the ports 7 and 8.

The RM monitors the OSM bus connected to it, close the bus if it detects aninterruption and therefore reestablishes a functioning bus configuration. Amaximum of 50 OSM’s are permitted in an optical ring. This allows areconfiguration time of less than 0.3s to be achieved. The RM mode is activatedon the OSM by a DIP switch which is located on the upper casing of the OSMmodule. The DIP switch is titled RM and has a selection for ON or OFF.

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Example of a redundant ring structure is shown below:

From the above example you can see that one OSM has been designated theredundant manger (RM). Under normal operation the information will be routedvia the shortest path from sender to reciever. If however the normal route weredisrupted the OSM in RM mode will detect the distirbance and will dynamicallyre-route the information. An example of this is shown on the next page.

APOSM in

RM-mode

PU

Plant Bus

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OSM in RM mode redirects the data in the case of a distirbance or break in thenormal path:

The OSM is capable of reconfiguring a redundant path within 0.3 seconds.

APOSM in

RM-mode

PU

Plant Bus

Data Flow

Redirected data

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RM – Redundancy Manager (green LED)

Status Meaning

LitThe OSM/ESM is the operating in the redundancy managermode. The ring is operating free of errors, in other wordsthe redundancy manager does not allow traffic through butmonitors the ring.

Note: One OSM must operate in the redundancy managermode (and only one) in each OSM/ESM ring.

Not lit The OSM/ESM is not in the redundancy manager mode

FlashingThe OSM/ESM is in the redundancy manager mode and hasdetected a break on the ring. The OSM/ESM makes theconnection between the two ring ports so that a functionalbus configuration is reestablished

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Communication Processors

In TXP the bus participants are connected to the terminal and plant busses viatheir own interface modules which are also termed communication processors.The Plant bus communications processors are shown in the following table:

System Communication processorAS 620 CP 1430OM 650 CP 1413ES 680 CP 1413DS 670 CP 1413

The CP1430 Communication Processor

The CP1430 communication processor connects the TXP automation systemAS620 to the Industrial Ethernet bus. Figure 25 shows the CP 1430 card:

Fig. 25: CP 1430

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The CP 1430 can be directly plugged into the AS 620 central rack. For redundantconfigurations a CP 1430 is inserted into each rack. The structure of the card isas follows:

• It has a single width European format and no fan• Bus connection is via a 15-pin Sub-D socket with automatic changeover

between the AUI interface and the Industrial twisted-pair interface (combinedinterface)

• The programming interface is located on the front panel• Run/stop switch and operating status LEDs are available on the front panel

The functions of the CP 1430 are listed below:

• To handle the message transmission including layer 7 of the ISO model,freeing the automation system from the communication tasks

• Time synchronization (can be configured as time master for the bus)• To support test and diagnostic functions• Integrated AUI and industrial twisted-pair interface• Connection parameters configured using the ES680

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The CP1413 Communication Processor

The CP1413 communication processor allows the TXP operation and monitoringsystem OM650, the engineering system ES680 and the diagnostic system DS670to be connected to the plant bus. Figure 26 shows the CP 1413 card:

Fig. 26: CP 1413

Structure

The card has the short PC-AT format and is connected to the Industrial Ethernetbus via AUI interface. The card has a built-in 15V-voltage supply to feed theelectrical or optical transceiver via the AUI interface. Several CP1413 modulescan be operated side by side in a computer.

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Functions

• To handle the transport and user-oriented protocol layers 1 through 7 of theISO 7 layer model

• To handle redundant communications• SIMATIC NET TF user interface• Configuration of the connection parameters using ES680• Data transfer between the host computer and the CP1413 via UNIX interface

module drivers• Communication with the plant bus via the SINEC technological functions

(STF)

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� What 2 layers of the SIMATIC NET Industrial Ethernet conform to the IEEE802.3 standard?

� What is the difference between a token ring network and a CSMA/CDnetwork?

� What happens to a data packet after a collision?

� How does a bus participant respond to a data collision?

� What 4 protocols did Siemens create for use on the Plant Bus?

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� Which of these protocols is used for AS <-> OM communications?

� Which TXP component does not evaluate synchronous time on the plant bus?

� Which card on the Plant bus is used for time master when no bus clock ispresent?

� Which 2 TXP components communicate with one another using the AP (STF)protocol?

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� What transmission medium is required for the redundant path on the PlantBus?

� How is a “virtual ring” established in the bus system of TXP?

� What types of star coupler modules are used for the redundancy path in thevirtual ring?

� Which star coupler modules can be swapped on-line?

� With which TXP component is the MIKE management card used and for whatpurpose?

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� What is the main purpose of the Hub Status Supervisor Module?

� What bus speeds may be optained by using OSM modules?

� How does the operation of an OSM differ from that of a star coupler?

� How is redundancy in the virtual ring set up with OSM’s?

� What is the communications processor in the AS 620 called?

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� What is the communications processor in the ES 680 called?

� Locate the CP 1413 cards on the back of your OM computer and the ES 680workstation

� On a separate piece of paper draw a sketch of a typical Plant Bus includingall possible participants (when applicable list the appropriate communicationscard(s))

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Ethernet Terminal Bus& Exercise 6

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Terminal Bus TXP separates communications tasks between two busses: terminal bus and plant bus. The previous chapter described the tasks of the plant bus. This chapter will cover the tasks of the terminal bus. The figure below shows the components within TXP that are attached to the terminal bus:

Terminal bus

ESESSUSUPU2PU2PU1PU1

OT1OT1 OT2OT2 OT3OT3 OT4OT4 OT5OT5

AS3AS3 AS4AS4AS2AS2AS1AS1

Plant bus

DS

Fig. 1: Terminal bus and Plant bus components The OM 650 components that are attached to the terminal bus are Operating Terminals (OT), Processing Units (PU), and Server Units (SU). The ES (engineering system) and DS (diagnostic system) are also connected to the terminal bus. Like the plant bus, the terminal bus at the hardware level is an Ethernet bus using the same access mechanism as the plant bus: CSMA/CD. The protocols used at the terminal bus level come from the TCP/IP suite of protocols. Therefore, the terminal bus is the same type of bus that is commonly used in office networks and The Internet. TCP/IP Basics In the 1960’s, the United States government agency DARPA (Defense Advanced Research Projects Agency) funded research on how to connect computers in order to exchange data among them. The purpose of this research was to build command and control functions in case of a nuclear “incident.”


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TXP-HW Course The idea was to be able to move data across the network even if parts of the network became disrupted. For example, if a network link were taken out by enemy attack, the traffic on that link would automatically be rerouted to a different link. This reliable scheme is called dynamic rerouting and is useful to modern day networks that aren’t affected by nuclear attacks, such as, if a network link is cut in a power plant the data is still able to reach it’s destination via a different route. Several California Universities did additional research while a Massachusetts firm built the first test network, called ARPANET (Advanced Research Projects Agency NETwork), which connected academic and military research centers. In the mid 1970s, the network had grown enough that DARPA began to investigate the possibility of building and connecting additional networks. The need for more network capacity drove research into technologies such as Ethernet and token ring, as well as satellite and radio communications. As ARPANET grew larger and larger it became increasingly harder to manage, so it was split into two separate networks called MILNET (for military installations) and a new ARPANET for civilian sites. Since both networks still needed to be connected the Internet Protocol connected the two by routing traffic from one network to the other. DARPA funded the development of a whole set of protocols for communication on the ARPANET, which is now known as the suite of protocols named for two of it’s parts: TCP/IP, which stands for Transmission Control Protocol / Internet Protocol. The protocols were designed to support multiple connected networks. Even though there were only two networks to begin with, IP was from the beginning capable of connecting thousands of networks. This capability is one of the reasons TCP/IP is still so popular today. When the UNIX operating system was being developed at the University of California at Berkeley, they added TCP/IP into their software distribution kit, which spawned a rapid growth spurt of TCP/IP, especially in academic environments. In the early 1980s, the Secretary of Defense mandated that all computers connected to the ARPANET had to use TCP/IP. Because of a technical limitation, the ARPANET was limited to 256 computers and as a result several other networks sprouted up to handle the traffic: • CSNET, the Computer Science Network • HEPNET, the High Energy Physics Network • NSFNET, the National Science Foundation Network • JNET, the Japanese Computer Network All of these networks were, and are today, interconnected by means of the TCP/IP protocol suite.


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One of the biggest strengths of TCP/IP is that it is independent of all the available alternatives. Following is a list of advantages: • It’s independent of the network topology (ring, star, etc.) • It’s independent of the transmission medium (wire, satellite, etc.) • It’s independent of specific vendors • It’s independent of the operating system and computer hardware (UNIX,

Windows NT, etc.) TCP/IP ties networks and The Internet together, regardless of the hardware and software used to build those networks. It is commonly thought that TCP/IP is only for linking UNIX computers because it has been included in UNIX for so long, but this is not true. TCP/IP runs on and connects just about everything. There are other network protocols, such as IBM’s and Novell’s, but no protocol connects as many different hardware and software platforms as TCP/IP. The Protocols of TCP/IP The protocols of TCP/IP stack up in layers, also, similar to the OSI Reference Model, but TCP/IP has fewer layers. The table below lists the layers associated with TCP/IP and the protocols that are used in each layer:

TCP/IP layer OSI layer TCP/IP Protocols - Physical - - Data link -

Internet Internet IP, IPNG, ICMP, ARP, RARP Transport Transport TCP, UDP

Application Session, Presentation, Application

RPC, SMTP, FTP, TFTP

The physical and data link layers are not directly related to TCP/IP because it is software that is independent of the underlying hardware. The internet and transport layers are analogous to the OSI’s same layers. The application layer combines the session, presentation, and application layers of the OSI model. List of TCP/IP Protocols IP – Internet Protocol IPNG – Internet Protocol Next Generation ICMP – Internet Control Message Protocol ARP – Address Resolution Protocol RARP – Reverse Address Resolution Protocol TCP - Transmission Control Protocol UDP – User Datagram Protocol RPC – Remote Procedure Call SMPT – Simple Mail Transfer Protocol FTP – File Transfer Protocol TFTP – Trivial File Transfer Protocol


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TXP-HW Course The ISO / OSI seven layer model Following is a brief description of each layer: Layer 1: The physical layer

This layer is pure hardware, including cable, satellite, or other connection medium, and the network interface card. This is where electrical signals move around on the network.

Layer 2: The data link layer

This is another layer where hardware is involved. This is the layer that splits data into packets to be sent across the connection medium. Ethernet or token ring wiring gets handled at this layer. Once the data is on the wire, the data link layer handles any interference by not allowing the data to become garbled.

Layer 3: The network layer

This is the first place on the OSI model where a TCP/IP protocol fits into the equation. IP is the TCP/IP protocol that works at this layer. This layer gets packets from the data link layer and sends them to the correct network address. If more than one possible route is available for your data to travel, the network layer figures out the best route. Without this layer, the data would never get to the right place.

Layer 4: The transport layer

Though the network layer routes data to its destination, it cannot guarantee that the packets holding the data will arrive in the correct order or that they won’t have picked up any errors during transmission. That’s the transport layer’s job. TCP is one of the TCP/IP protocols that work at the transport layer; UDP (User Datagram Protocol) is another one. The transport layer makes sure that the packets have no errors and that all the packets arrive and are in the correct order. Without this layer, the network could not be trusted.

Layer 5: The session layer

The other protocols that make up TCP/IP sit here on Layer 5 and above. This layer establishes and coordinates a session, which is the name for a connection between two computers. Before two computers can move data between them a session must be established.


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Layer 6: The presentation layer

The presentation layer works with the operating system and file system. Here’s where files get converted from one format to another, if the participants use different formats. Without the presentation layer, file transfer would be restricted to computers with the same file format.

Layer 7: The application layer

This is the layer where our work is done, such as requesting to transfer a file across the network. Without the application layer, no data to be sent or messages could be created and the computer wouldn’t know what to do with any data that gets sent to it.


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TXP-HW Course Terminal Bus Communications Processors The TXP components that connect to the terminal bus are the ES 680 engineering system, the OM 650 SU server unit, the OM 650 PU processor unit, the OM 650 OT operating terminal, and the DS 670 diagnostics system. The communications processors used in these components are 3COM Etherlink III cards. It is a standard “off-the-shelf” Network Interface Card (NIC) that plugs into an ISA slot on the motherboard of all the PCs. In the case of the ES 680 it is built into the motherboard. The figure below shows the 3COM Etherlink III card:

Fig. 2: 3COM Etherlink III module


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Data Exchange between TXP nodes over the Terminal Bus As seen in figure 1 on page 1, all components of TXP are connected to the terminal bus with the exception of the automation systems. There are several communication paths over the terminal bus between the TXP nodes. Following is a brief summary of those communication paths. ES <-> SU The ES is used to engineer all data for the DCS. When building up the logic for the automation systems, there are many signal definitions created. These signal definitions, or point descriptions, are gathered in a central database that is called the BDM database. This database, after compilation, needs to be transferred from the ES to the SU where it permanently resides. The terminal bus connection between the ES and SU is used for this transfer. ES <-> PU All the alarm handling and any calculation logic are built up on the ES. After compilation, this data needs to be transferred to the PU. The terminal bus connection between the ES and PU is used for this transfer. ES <-> OT All graphics that are created on the ES, after compilation, need to be transferred to the OTs. The terminal bus connection between the ES and OT is used for this transfer. ES <-> DS The terminal bus connection between the ES and DS is used by the DS to extract the engineering data it needs to build up its graphics for diagnosing the entire DCS from the DS terminal. There are no dynamic connections between the ES and other terminal bus participants. It is only used to transfer data from the ES to the other participants.


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TXP-HW Course OT <-> SU Whenever a graphic is called up on an OT screen, any text descriptions that are attached to a tag are extracted from the BDM database on the SU. Whenever a trend screen is called up on an OT screen, the dynamic data contained in the trend is extracted from the Long Term Archive on the SU. Whenever a log is built on the OT the data is extracted from the Long Term Archive residing on the SU. All of this data exchange is done over the terminal bus. OT <-> PU All TTDs, or events, in TXP are transferred from the automation systems they were generated in to the PU assigned to that particular AS. When a graphic is called up on an OT screen, all the dynamic data that appears on the screen comes from this gathering of events in the PU via the terminal bus connection. All alarm-handling functions are handled by the PU via function blocks for the particular automation systems that contain the alarms. These alarms are shown to the operator via the terminal bus connection between the OT and PU. DS <-> PU, SU, OT The DS extracts all diagnostic data from buffers in the PU, SU, and OT and builds up its graphic displays using the terminal bus connection.


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TXP-HW Test/Exercise 6

What does TCP/IP stand for?

Who initiated the development of the TCP/IP suite of protocols?

Which TXP components are connect to the Terminal Bus?

Which TXP components other than the ES 680 communicate with it via the

Terminal Bus? Why does an OT have to communicate with an SU over the Terminal Bus?


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TXP-HW Course Why is an OT not connected to the Plant Bus?

If the SU and PU functionality’s were combined in one UNIX computer, would

this computer have: A. Only a CP 1413 B. Only a 3COM Etherlink III C. Both a CP 1413 and a 3COM Etherlink III Locate the 3COM Etherlink III card on your OM computer


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Reading I&C Drawings

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Reading I&C Drawings

Introduction

Siemens Westinghouse will typically supply drawings as part of the projectdeliverables. The drawings incorporate terminology and symbology that may beunfamiliar to some users. This section will provide the student with someinformation on how to read and understand these drawings.

KKS

Unless specified differently by the customer, all Siemens Westinghouse drawingsand documentation will incorporate the Kraftwerk KennzeichenSystem (KKS)which is German for “Power Plant Identification System”. KKS tags are used torepresent drawings, equipment, and locations.

Pictured below is a typical description of a KKS drawing (Figure 1).

Figure 1. KKS Designation of Power Plant Drawing

KKS Designation of Equipment Mounting Location

In Figure 2 an example of a KKS structure for identification of mounting locationis shown. The prefix "+" is used to represent mounting location information. The"." between CJP02 and DC015 is used to identify that DC015 is a modulelocation within the cabinet CJP02. This identifier is used in the I&C manuals.

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Identification of Mounting Location

+ 1 UBA01 CJP02 . DC015

Module locationTier = DCSlot = 015

Cabinet NumberTXP Cabinet 2

LocationElectrical Container 1

Unit 1

Mounting Location Identifier

Figure 2 - Identification of Mounting Location

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Figure 2 shows the overall structure of the KKS mounting location, but in mostcases the numbers used within the drawings are abbreviated in some form oranother. The following list provides some other examples of mounting locationsthat are commonly used in the I&C manuals:

+CJP02 This type of number is normally used to identify the cabinet. It canbe found in the drawing title block or on the drawing itself. Theprefix "+” in this case represents the unit number in which thisdrawing pertains.

+.DC015 This type of number is used to identify a module. The prefix "+” inthis case represents both the Unit and the cabinet number. Thecabinet number in these cases can be found in the title block of thedrawing.

+.XD007 This type of number is used to identify a Termi-point connection.Below this number the letters A to H would be listed to showconnection points for the individual signal. The prefix "+" in thiscase represents both the Unit and the cabinet number in which thetermi-point is physically located. The cabinet number in these casescan be found in the title block of the drawing.

Types of Drawings

A typical TXP installation should come with (but not limited to) the followingdrawings:

� Cabinet Assembly� Power Distribution� Wiring Diagrams (a.k.a. Elementaries)� Control Room Layout� Bus Layout and Terminations� System Layout and Connections

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Cabinet Assembly Drawings

Cabinet assembly drawings typically show the cabinet profiles, location of equipment inthe cabinet, terminal block layout, and any special instructions required for the assemblerto build the cabinet.

Cabinets are typically organized in stations, sometimes referred to as racks or nests byother vendors. A station may contain an I/O rack such as an ET200, or it may containequipment from another vendor. I/O stations generally have slots, where the individualmodules are installed.Figure 3 is a typical drawing showing the cabinet and layout of the stations. Figure 4depicts the individual stations in greater detail, indicating item number of parts andindividual module locations or slots.

Power Distribution Drawings

Power distribution drawings show the user how each individual module in thestation is powered. Power to cabinets can be distributed from a single cabinet ordistributed individually. The example in Figure 5 is a cabinet fed redundantlyfrom a single cabinet.

The first drawing in the set shows the feeds from the power distribution cabinetwired into terminal blocks with a KKS label. Protection circuitry and alarms arealso shown on the drawing (Figure 5). Thereafter, there will be a drawing foreach individual station in the cabinet showing the power distribution wiring foreach SIM module and the field bus or L2 connection (Figure 6).

Wiring Diagrams or Elementaries

Wiring diagrams may be required to show (1) internal cabinet wiring and/or (2)field-to-cabinet wiring, similar to an ISA loop sheet (Figure 7). These drawingsmay also be generated from the TXP ES680 and are called MSR drawings.

Bus Connection Drawing

Bus connection drawings show the L2 or Profibus connections required for eachstation from end to end. These should correspond to the L2 bus label shown onthe power distribution drawings. Figure 8 is an example of a typical busconnection drawing.

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Field SideCabinet Side

Module IntermediateTerminal

Field Cable

Figure 3. MSR (loop) Drawing

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Loading Procedures& Exercise 7

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Loading Procedures AS 620 CPU 948 If the “SYS FAULT” light on the CPU 948 is on, the card must be changed. To change the CPU 948 card proceed as follows: (There are no dip switch settings on the CPU 948) Step Action required Result (LEDs on CPU) 1 Power down rack containing

desired CPU

2 Remove CPU 3 Insert new CPU with mode

selector switch set to STOP

4 Power on rack - Red STOP LED On - Red INIT LED briefly On - Red BASP On

5 Hold the RESET switch in the OVERALL RESET position while switching the mode selector switch from STOP to RUN then release the RESET switch

1. Red STOP LED On Red BASP LED On Green RUN LED On

2. Red STOP LED On Green RUN LED Off BASP LED On

6 Hold the RESET switch in the “RESET” position while switching the mode selector switch from "STOP” to “RUN” Then release the reset switch.

CPU as master: 1. Red STOP LED On

Green RUN LED On 2. Green RUN LED On 3. Red BASP Off CPU as standby 1. Red STOP LED On

Green RUN LED On 2. Red STOP LED Off

Green RUN LED Off 3. Red STOP LED blinks

Green RUN LED blinks 4. Green RUN LED On 5. Red STOP LED briefly On 6. Green RUN LED blinks

Red BASP LED Off Note: If replacing a CPU in a redundant system, once the general reset is finished the now reserve CPU will automatically backup from the master.


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TXP-HW Course The AP should be in run mode before a code transfer is attempted. This is indicated by a steady green run light on the master and a flashing green run light on the standby processor. To load the program in the CPU proceed as follows: From the main ES 680 menu click on Transfer then AP then Load AP (offline) as below:

The following menu will appear:

Type in the desired AP number, the name of a protocol file (for later perusal), and select User and system software, then click on OK.

Training Center Copying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design. 2 2

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A check on the previously generated code will now be carried out, if the code is suitable for transfer you will be prompted, as shown below, to confirm that you really wish to load code to the AP offline.

Click on Yes to begin the loading of code offline to the selected AP. The ES680 will attempt to connect to the AP. An error message at this point will indicate that an AP reset is required and then the transfer will need to be reattempted. Up to three overall reset and general reset combinations may be required before the AP is ready to accept the code, even if the indicating lights on the AP show a running condition. At this point the offline handler will take control of the AP and place it in stop. First it will down load code to the master (A) then it will update the slave (B) CPU. When the process is complete a pop-up window will appear stating that the down load is complete. You will need to acknowledge this message by clicking on the close button in the pop-up window.


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TXP-HW Course CP 1430 1. Change CP1430 (there are no jumpers to set on the CP 1430)

• Switch the rack off containing the desired 1430 card • Pull the old CP1430 card • Put in the new card • Put the Run/Stop-switch into the “Run”-position • Switch the rack on

2. Obtain MAC-addresses

• Launch FUP editor • Open the YDH-drawing • Click on the symbol of the CP1430 you want to change • Open the module properties mask • Read the MAC-addresses. Address 1 is for the primary rack, address 2 for the

standby rack 3. Initialize new CP1430

• Hook up the PG740 to the CP1430 • Start the S5-software • In the main menu line: select: “Change->others” • Select the directory COM1430, if not already selected • Select SINEC NCM COMs in this directory • Type in a file name where prompted (must begin with A; e.g. Atest) • Select “CP-Functions” then “Stop” from the main menu line. The “Stop”-light at the

CP should go on • Select “Edit” then “CP Init” from the main menu line. Editing of the fields should be

possible • Enter the MAC-address and the Basis SSNR (232 for the primary rack (AP A),

236 for the standby rack (AP B)) and hit F7 (ok) • If the CP 1430 is to be set up as the Clock Master, Select “Edit” then Clock Init”

from the main menu line. • Set the Clock Master Field to Y for yes and hit F7 (ok).


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• Select “CP-Functions then Start” from the main menu line. Both the “RUN” and “STOP” LEDs should be on indicating the CP is not synchronized with the CPU

• If the CP 1430 is Clock Master, Select “Utilities” then “Clock Functions” • Press F2 to set time. Enter the current date and time (Winter time of the local time

zone must be set; date is in DDMMYY format) Afterward, LAN code needs to be downloaded to the new CP. It can be done with the Offline Load of the AP or separately. To accomplish this proceed as follows: From the main ES 680 menu click on Transfer then LAN then AP as below:


Type in the desired AP number and a protocol file name (for later perusal, then click on OK


5

TXP-HW Course IM 324R To change the IM 324R card proceed as follows: • Power down rack containing IM 324R (primary rack) • Remove old card • Set jumper switches on new card (see figure below)

There is only one jumper setting that needs to be checked on this card: Jumper 1-2 of X101 Inserted for AG S5-155H All other jumpers In delivery state • Insert new card • Power rack on There is no code to transfer to this card


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IM 304 The IM 304 card is used to connect the secondary rack to the primary rack for redundancy, connecting both the primary and secondary racks to the expansion rack or connected out to a EU902 FUM rack. To change the IM 304 card proceed as follows: • Power down rack containing IM 304 • Remove old card • Set jumper switches on new card (see figure below)

X11 jumper (for cable connection with IM 324R or IM 314R)

-State upon delivery: for up to 100 m cable length: Jumper 3-4 -For IM 304 - IM 324R connection only in an AG S5-155H: Jumper 1-2

X21/X22 switch (to enable interfaces for the connection with IM 324R or IM 314R) -State upon delivery with disabled interfaces: X21 ”OFF” / X22 ”OFF -For connection IM 304 with IM 324R (AG S5-155H): X21 ”ON” / X22 ”OFF” -For connection IM 304 with IM 314R (EG 185U): X21 ”ON” / X22 ”ON”


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TXP-HW Course X14 jumper switch (defines the minimum number of inoperable interfaces for

the ’inoperable I/O’ message) -State upon delivery for 1 inoperable interface Jumper 1-2 -for 2 inoperable interfaces Jumper 2-3

X15 jumper switch (defines onward routing of the ’inoperable I/O’ message) -State upon delivery -”Inoperable I/O” message is routed onwards Jumper 1--2 -”inoperable I/O” message is not routed onwards No jumper

• Insert new card • Power rack on There is no code to transfer to this card Additional information for connection of IM304 to IM614 in EU902 FUM rack. Jumper settings: The connection of the function modules to the automation processor requires jumpers on the IM304 interface madule and encoding switches in the EU 902 rack to be set. • IM304 (interface to EU 902 FUM rack)

The length of the link between the IM304 and the last IM614 interface mdule in the bus chain must be set on the x!! jumper soclet on the IM304 interface module.

The X3 of the IM304 interface module must be de-activated via the associated switch on the front panel if an IM 614 interface is connected ( switch position OFF from X22)


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On the IM 304 module X11 defines the distance between IM 304 and IM 614 interface modules.

The figure above shows how to select the distance between the IM304 and IM614 with the X11 jumpers on the IM304 module. IM 314R To change the IM 314R card proceed as follows: • Power down rack containing IM 314R (expansion rack) • Remove old card • Set jumper switches on new card (see figure below)


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TXP-HW Course Jumper settings:

Jumper 1-2 of X5 Inserted Jumper 1-2 of X7 Must be removed Jumper 2-3 of X7 Inserted Jumper of X10 Inserted Jumper of X101 Inserted

S1 switch settings:

Contacts 1 ... 6 OFF, OFF, OFF, OFF, OFF, ON • Insert new card • Power rack on There is no code to transfer to this card


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IM 308-C To change the IM 308-C card proceed as follows: • Power down rack containing IM 308-C • Remove old card • Set jumper switches on new card (see figure below)

Jumper X9 and X10 settings:

X9: the jumper must be set to position “1-2” for TXP X10 Position “1-2” if the PROFIBUS-DP interface is operated as

grounded Position “2-3” if the PROFIBUS-DP interface is operated as non-grounded

• Insert new card • Power rack on


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TXP-HW Course If a new Memory card needs to be programmed proceed as follows: From the main ES 680 menu select Generators, then AP, then Create ET200 Memory Card for Field devices as shown below:


Type in the desired AP number then click on OK. The following window should appear if the generation of data was successful:


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After completion of this compiler a file will exist for each IM 308-C card in the chosen AP with the following naming convention: A0001_01.pbp. The A0001 denotes the AP number (1 in this case), the _01 denotes the line number of the IM 308-C card (also 1 in this case). To view where the file is stored you need to choose Edit, then View/Print from the ES680 menu bar as shown below:

Click on Code Generating from the next window, shown below.


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TXP-HW Course Select the desired AP number (ag0001 in this case)

then transfer and the ET200 datafile (A0001_01.pbp in this case) will be as

shown below:

This is the file location for the IM308-C memeory card


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To be able to program the memory card this file must be put on the PG 740 via a floppy disk. To accomplish this proceed as follows: • Open a UNIX shell (click on the desktop with the right mouse button, and

select X Terminal as shown below).

• Type ‘cd listen/as/agxxxx/transfer’ then enter (agxxxx will be the number of

the AP you are working with i.e ag0001 in this case). After you hit enter you will come back to the prompt. Now type ‘ls –l’ to observe the filename you want to transfer to the floppy disk. An example is shown below:


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TXP-HW Course • With a blank floppy disk in the drive type:

For ES 680 HP workstations: ‘copyIM308Cfiles <AS Number>’ then enter (e.g. copyIM308Cfiles 1) For SCO UNIX machines: ‘doscp <filename> a:’ then enter (the filename is the name you listed in the step above) An example is shown below:

• When finished remove floppy from drive and insert into PG 740 floppy drive • On the PG 740 start the COM PROFIBUS software • In the main menu click on File then Import then ASCII File • Select the a drive and double click on the .pbp file • A Result of Conversion window will appear stating ‘no error, no warning’ • Click on OK • A window will appear showing the Overview of Master Systems, as shown

below.


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• Highlight the IM308-C card by clicking on it once, failing to do this will result in not being able to export the file to the memory card in the steps below.

• With the new memory card inserted in the MEM CARD slot (right-hand side), on the PG click on File then Export then Memory Card

• In the next screen change the user defined time to 0.20 seconds • With the rack containing the IM308 C card powered down, Insert new memory

card into IM 308-C card • Power the rack on and switch IM 308-C card to RUN The table below lists the meanings of the mode selector switch on the IM 308-C card: Designation Function

The mode selector switch is a three position switch:

RN (RUN): normal operation; IM 308-C reads the inputs of the slaves and sets the outputs

ST (STOP): IM 308-C does not exchange data with the slaves; it may, however, receive the token (send authorization) from another master on the bus and pass on the token (not applicable in TXP)

Mode selector switch

OFF: IM 308-C does not exchange data with the slaves and cannot receive token from another master (not applicable in TXP)


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TXP-HW Course The table below lists the meaning of the BF LED on the IM 308-C: BF Meaning Remedy Off Data exchanged with all

parameterized slaves -

On Bus fault1 (physical fault) Check: Whether there is a short circuit on the data lines of the PROFIBUS The parameters set with COM PROFIBUS (different baud rates)

Flashes No exchange of data with at least one slave which is assigned to an IM 308-C master

Check whether the bus cable is connected to the IM 308-C Wait until the IM 308-C has powered up. If LED does not cease flashing, check the DP slaves or interpret the diagnostics report for the DP slaves.

1 During power-up, the RN, OF, and IF LEDs light up along with the BF LED for approx. 0.5 seconds The table below lists the meaning of the RN, OF, and IF LEDs on the IM 308-C: RN OF IF Meaning Remedy On On On IM 308-C is powering up (BF

LED on also) -

On Off Off Status in Run: IM 308-C reads the slave inputs and sets the outputs.

-

Flashes Off Off IM 308-C parameterizes all slaves on the bus and checks their address-ability Status is Clear: Afterwards, the IM 308-C reads the inputs but sets all outputs to “0”.

-


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ET200M IM 153-2 To change an IM 153-2 module proceed as follows:

• If station is non-redundant, power down the ET 200 station, otherwise,

remove faulty module with the backup module in place

• Disconnect L+ and M leads to module

• Unplug the PROFIBUS connector from the front of the module

• Loosen screw on the bottom of the module and remove it

• Set DIP switch address (located on front of the module; see figure below)


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TXP-HW Course

Bus address DIP switch • Insert module onto DIN rail and tighten the fastening screw at the bottom

• Reconnect the L+ and M leads

• Plug the PROFIBUS connector back into module


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ET 200M I/O modules All of the ET 200M I/O modules can be replaced online. Proceed as follows: • Remove terminating strip on the front of the module by depressing the button

on top while pulling the terminal strip away (see figure below)

ET 200M I/O terminating connector • Loosen screw on the bottom of the module and remove it

• Insert new module

• Tighten screw on the bottom of the module

• Plug in terminating connector


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TXP-HW Course H1 Star Coupler Cards Following is a list of applicable star coupler cards and their respective jumper settings. All Star Coupler cards can be changed online. ECTP3 The figure below shows the ECTP3 PCB followed by a list of jumper settings:

Switch/jumper settings The ECTP3 interface card can be used with the as-delivered status. The following are the settings, which are relevant for TXP and should be used to check the card settings. Group disable (separate the ECTP3 interface card from the star coupler system bus)

In TXP, the 6-fold switch unit DIP6 remains in the OFF position (Group enabled, this is also the status upon delivery) The switches 1-5 are irrelevant to TXP

MDI/MDI-X mode

All jumpers in the jumper unit must be plugged into the MDI-X side for TXP (status upon delivery)


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ECAUI The figure below shows the ECAUI PCB followed by a list of jumper settings:

Switch/jumper settings Setting the SQE test

In TXP the SQE test (tests the collision detection circuit) must be switched off. SW1, switch 1 and switch 2 must be set to "OFF" (this is the status upon delivery).

Activating the port shutdown

The port-shutdown must be switched off in TXP. SW1, switch 3 and switch 4 must be set to "OFF" (this is the status upon delivery). Switch 5 of SW1 is irrelevant to TXP.


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TXP-HW Course OYDE-S µC The figure below shows the OYDE -S PCB followed by a list of jumper settings:

Diagnosis LEDs on the PCB The PCB LEDs are only visible if the plug-in slot to the right of the interface card is not occupied. If the red front-panel CD-LED shows steady light the PCB LEDs 2-5 indicate a specific diagnosis of the present fault. The following table lists the faults indicated by the LEDs: LED no. Response Description 1 Red light Fragment extension is active 2 Red light Send and receive paths in the send direction

are blocked since data packet is too long (jabber control is active)

3 Yellow light Segmentation due to more than 64 subsequent collisions

4 Red light Receive path in the receive direction is blocked since data packet is too long

All Off Separated on the management station’s request


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Switch settings The transmitter power, IDLE/low light, and operating mode are set via switch unit SW1. How to set the optical transmitter power The optical transmitter power of the OYDE-S µC must be adapted to the length of the FO cable used. It is set by the switches 1, 2, and 3 of SW 1. The transmitter power can be set in three ratings. OYDE-S µC interface cards interconnected via an FO path must be set to the same optical transmitter power. The ratings are listed in the table below:

Transmitter power rating

Launchable optical power

Typical bridge-able distance

SW1, switch 1

SW1, switch 2

SW1, switch 3

Rating 1 12 dBm Up to 2,000m On Off Off Rating 2 (status upon delivery

18 dBm Up to 4,000m On On Off

Rating 3 22 dBm Up to 4,500m On On On IDLE/low light function The IDLE/low light function is set using SW1, switch 4: The switch setting required in TXP is "off" (this means, “low-light enabled“ and is the status upon delivery). This setting must not be changed.


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TXP-HW Course Operating mode The operating mode of the OYDE-S µC interface card is set using SW1, switches 5, 6, and 7 according to the following table: Operating mode TXP setting if…. SW1,

switch 4 SW1,

switch 5 SW1,

switch 6 SW1,

switch 7 Standard operating mode (status upon delivery)

…a normal FO path is to be operated via this OYDE-S µC (i.e. an FO path which connects bus participants or another star coupler)

Off

Off

Off

Off

Redundant mode …a redundant FO path is to be operated via this OYDE-S µC (i.e. an FO path between two star couplers which closes the virtual ring)1

Off

Off

Off

On

1 The OYDE-S µC modules located at both ends of a redundant FO path must both be switched to the redundant mode. Additional switches/jumpers In addition to the switches described above no additional switches must be operated and no additional jumpers inserted on the OYDE-S µC interface card. The settings of the other switches/jumpers on the PCB must retain their status supplied upon delivery and must not be changed. Switch 8 of SW1 is irrelevant to TXP.


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ECFL2 The figure below shows the ECFL2 PCB followed by a list of jumper settings:

The table below lists the DIP2 switch settings: Operating mode

TXP settings if… Setting for port 1 Setting for port 2

DIP2, switch 1

DIP2, switch 2

DIP2, switch 3

DIP2, switch 4

Standard operating mode (status upon delivery)

…a normal FO path is to be operated via this ECFL2 (i.e. an FO path which connects a bus participant or another star coupler)

On

Off

On

Off

Redundant mode 2

…a redundant FO path is to be operated via this ECFL2 (i.e. an FO path between two star couplers which closes the virtual ring)1

On

On

On

On

1 Only one port at one ECFL2 of the two connecting ports of the ECFL2 modules located at both ends of a redundant FO path must be switched to redundant mode 2. The other ports remain in the standard operating mode. Note The switch S5 of DIP2 and the entire DIP1 are irrelevant to TXP.


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TXP-HW Course ECFL4 The figure below shows the ECFL4 PCB followed by a list of jumper settings:



DIP2, switch 1

DIP2, switch 2

DIP2, switch 3

DIP2, switch 4


…a normal FO path is to be operated via this port of the ECFL4 (i.e. an FO path which connects to another bus participant or to another star coupler)

On

Off

On

Off

Redundant mode 2

…a redundant FO path is to be operated via this port of the ECFL4 (i.e. an FO path between two star couplers which closes the virtual ring)1

On

On

On

On


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DIP3, switch 1

DIP3, switch 2

DIP3, switch 3

DIP3, switch 4


…a normal FO path is to be operated via this port of the ECFL4 (i.e. an FO path which connects to another bus participant or to another star coupler)

On

Off

On

Off

Redundant mode 2

…a redundant FO path is to be operated via this port of the ECFL4 (i.e. an FO path between two star couplers which closes the virtual ring)1

On

On

On

on

1 Only one of the two ECFL4 modules located at both ends of a redundant FO path must be switched to redundant mode 2. Note The switch S5 of DIP2, DIP3, and the entire DIP1 are irrelevant to TXP.


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TXP-HW Course HSSM and MIKE cards The HSSM and MIKE cards are for special applications only. Please refer to the product manuals provided with the project. Interface Module for PROFIBUS--DP (Optical Network Component) If more than one station (up to 8) is involved, the PROFIBUS--DP bus system is set up for example as a ring network. AP and ET 200 stations are connected via Optical Link Modules (OLM) (see figure below). The OLM connects either to copper core cables or to fiber--optic cables. IM 308--B/C modules and ET 200 stations are connected via copper core cables. Fiber--optic cables may be used for the connections between the OLMs. These optical leads may be made from plastic or glass. The maximum cable length is 1,400 me-ters for glass fiber--optic and 25 meters for plastic leads (provided that the bus components are used that are specified for PROFIBUS--DP (FO) in the IK 10 catalog /19/). Please refer to the applicable documents /12/, /19/ for further information.

Connecting ET 200 stations via PROFIBUS--DP OLM


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� Assemble your AS 620 system based on the YDR diagrams

� Configure the CP 1430 communications processor for your AS 620

� Configure the IM 308 card for your ET 200 station

� Install the CPU 948R processor in your AS 620

� Power up your AS 620 and load all necessary code

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TXP-HW Course


TXP-HW Course


Preventive Maintenance& Exercise 8

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9

Preventative Maintenance

Maintenance of AS 620 Components

Replacing the Lithium Battery in the Central Rack ZG 155H

WarningLithium batteries can explode when incorrectly handled. If they are not properly disposedof toxic substances may be released. So please note: Do not throw new or dischargedbatteries into open flames and do not solder the cell body. Do not recharge the battery!Only the replacement batteries from SIEMENS should be used. This will ensure that yourbattery is short-circuit proof. The Lithium battery is subject to the regulation for dangerousgoods. When shipping batteries reuse the original packing material. Old batteries shouldbe returned to the manufacturer/recycler or properly disposed of as toxic waste. Theregulations for the transportation of dangerous goods must be observed.

Caution:Be sure to use the correct polarity when installing the batteries!The batteries can be replaced without data loss if the power supply unit is switched on.The left LED is allocated to the left battery and the right LED to the right battery.

Procedure:

�� Open the black battery lid located at the top of the module front panel

�� Replace the empty battery

�� Ensure correct polarity

�� Close the battery door

�� Press the "Reset" key of the power supply module (the yellow "Fault" LED goes out)

To be carried out when?- If necessary ��battery failure ��indicated by: "Fault" LED + OM alarm

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Replacing the fan in the ZG 155H

The fan can be replaced without data loss if the power supply unit is switched on.

Procedure:

� Open the two quick-release locks at the front of the row of fans by turning a screwdriverin the anti-clockwise direction a quarter turn (see Figure below)

� Grasp the bottom cover plate with both hands, press it slightly down and completelyremove it from the row of fans

� Unlock the fan to be replaced by pressing the fan handle away from the casing usingyour thumb

� Remove the fan to be replaced (the other two fans increase their load). Insert the new fanuntil it latches into position (see Figure on next page). The associated red "F X" LED ofthe fan automatically goes out

� Insert the bottom cover plate and press it upwards� Tighten the quick-release locks by turning a screwdriver in clock-wise direction a quarter

turn

Fan insert for ZG 155 H, for item a please refer to another chapter

FAN 3FAN 2FAN 1

To be carried out when?- Every 50,000 h and- If necessary ��fan failure ��indicated by: LED "F 1 or "F2" or "F3"+ OM alarm

Note:The existing three fans work in 2-out-of-3 redundancy, which means that the failure of onefan is tolerated. In which case the other two fans increase their load

TXP-HW Course

Coda

Fan insert including fan

Replacing the dust filter in the ZG 155H

T

P

�

�

�

�

Fi

FAN

To be carried out when?- Annually and- If necessary ��indicated by: the red LEDs "F1", "F2", "F3".

Training Centerpying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment ofmages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or design.

3

9

he dust filter can be replaced while the ZG is in operation

rocedure:

Open the two quick-release locks at the front of the row of fans by turning a screwdriverin the anti-clockwise direction a quarter turn (see Figure below)Grasp the bottom cover plate with both hands, press it slightly down and completelyremove it from the row of fansFlip the filter cassette downward and remove it by pulling it forwardThe filter frame is fastened to either the bottom cover plate or to the far edge of thebottom cover plate by snap hinges and snaps. The filter mats are attached to the filterframe. To remove the filter frame proceed as follows:

lter frame in the fan insert

FILTERFRAME

COVER

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4

� The filter frame can then be removed from the snap hinges� Install the new filter frame in the reverse order� Put the bottom cover plate back in and press it upwards� Tighten the quick-release locks by turning a screwdriver in the clock-wise direction a

quarter turn (see Figure above)

Power supply module 6ES5955 (for ZG/EG 155H)

Switch off the power supply before you remove or insert the module!

� In a redundant AP, replacement can be carried out while the AP is in operation.This does not apply to single-channel couplings to SIM components (F SIM, BSIM), ancillary plant systems and AS620 T (SIMADYN). In a non-redundant AP,replacement leads to a failure of the AS functions.

� If the automation device (ZG or EG) has an IM 308 for coupling ET 200 stations,the IM 308 must be switched to "STOP" prior to switching off the power supply!Otherwise outputs on the ET 200 might stay set thus leading to hazardous plantstatuses! After switching on the power supply the IM 308 must be switched backto "RUN"

Replace the module as follows:

� Switch off the voltage supply to that half of the sub-rack containing the defectivevoltage supply module (make sure you switch off the correct miniature circuitbreaker!). Provide all cables connected to the front-panel connections with labelsor refer to the TELEPERM XP AS 620 system manual 6DP6200-1DA01, section10 "Setting up, Installation" for the wiring

� Loosen the cables. Rotate the lower screw by 90° to unlatch the module and pullthe lug to remove the module from the central device

� Set the configuration switch located at the right-hand side of the power supplymodule to the desired position on the new module. The meaning of the switchpositions is shown in the Figure on the next page

� Push the Lithium batteries in observing correct polarity

� Plug the new module into the plug-in slot of the defective module and properlyconnect all cables to the front-panel connections according to your labels or asdescribed in the TELEPERM XP AS 620 system manual 6DP6200-1DA01,register 10 "Setting up, Installation"

� Switch on the voltage supply of the central device (indicated on the CPU 948 bythe red "Stop" LED flashing and the red "BASP" LED steady lit

� Carry out a general reset on the CPU: Keep the "reset" switch in the "reset"position while changing the operating mode switch from "RUN" to "STOP" andback to "RUN" again

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9

� In redundant APs a restart is initiated followed by an automatic update from thestill intact redundant partner. After the update the green "RUN" LED startsflashing. Basic initialization of the CP 1430 will have to be performed (aprogrammer with COM 1430 is required) and then a LAN transfer from theES680. In non-redundant APs overall code from the ES 680 must also betransferred into the AS

·

Configuration switches and their settings (default in bold letters)

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6

Maintenance of Bus Components

Note:To clean the casing of bus components either use a vacuum cleaner or wipe it using asoft, dry cloth. Do not use water or solutions. Fan and fan grilles shall be cleaned using avacuum cleaner only

The table below lists the regular maintenance activities for the bus components:

Device Affected Checks/maintenance Maintenance intervalStar coupler Ventilation slots at

the bottom and topof the star couplercasing

Ensure free air flow in and out,vacuum off accumulated dust ifpresent

Once per year

Voltage supply Check the power supply cable forfirm connection. Inspect the supplycables for proper installation,tension relief or damage

Once per year orimmediately afterinstallation work in thevicinity

Power packs Visually inspect the operationLEDs of the power pack

Once per year

Dummy plates Check for completeness andproper installation

Once per year

Star couplerinterfacecards

Connections Check the LAN cables (FO cable,drop cable, and/or ITP cable) forfirm connection


Unused FO ports Check whether dummy plugs arepresent on the unused FO ports

Once per year

OLM Fastening Check the installation of the snap-on top-hat profile rail and theOLMs

Once per year

24V voltagesupply

Check the terminal base, the cablefastening and the installation


Connections Check the LAN cables (FO andITP cable) for firm connection andinstallation


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9

Maintenance of OM 650 and ES 680 Components

As discussed in earlier chapters all OM 650 components and the ES 680 arecomputer-based components. Depending on the environment the computers arein, dust can accumulate on the internal components of the computer. Periodicremoval of this dust should be a part of the preventive maintenance plan.

Documentation of the I&C system computers in a plant forms an integral part ofthe I&C system maintenance. However, the computer hardware and software aresubject to upgrading and updating. All hardware and software changes must bedocumented.Siemens Westinghouse recommends that a profile of each TXP computer is keptdescribing the status of the current equipment of the computers (see below).

Computer Profile

Plant: Administrator:Phone:

Common DataComputer type: Date of installation:

Host name: IP address:

LAN 1 address: LAN 2 address:

HW serial no.: Software ID:

HW equipment:

Hard drives: RAM: Tape device:

Software InstallationFunction:

Operating system:� Ingres release: license:� ES 680 release: license:� Dynavis X release: license:

Logins and PasswordsLogin Password User

� root system administrator� ingres ingres administrator� txpom OM650 administrator � txpes ES680 administrator� <project login> Project administrator

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Proceed as follows to determine the values of the fields in the computer profile:

Host name

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationFrom UNIX shell type ‘hostname’ From UNIX shell type ‘hostname’

IP address

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationFrom UNIX shell type ‘ping <hostname>’ From UNIX shell type ‘/etc/ping <hostname>’

LAN address 1 and 2

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationLocated in equipment documentation providedwith project or contact the Assembling Center

From UNIX shell type ‘/etc/lanscan’

HW serial no.

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationPrinted on back of machine Printed on back of machine

HW equipment: Hard drives

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationLocated in equipment documentation providedwith project or contact the Assembling Center

Located in equipment documentation providedwith project or contact the Assembling Center

HW equipment: RAM

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationReboot machine:� logged in as root type: ‘init 6’

Reboot machine:� logged in as root type: ‘shutdown –r –y 0’

Software Installation

OM 650/ ES 680 PC (SU, PU, OT, etc.) ES 680 workstation� Operating system: SCO Open Server 5.0.4

w/patches Ingres release: from an Hptermtype: ‘sql <database name>’

� Ingres license: Type ‘ingprenv’ write downII_AUTHORIZATION

� ES 680 release: upper right-hand corner ofmain menu

� ES 680 license: in file/Install/txpes/sw/sw7.0.SCO/config/lizenz/STARTMENU

� DYNAVIS-X release: DYNAVIS-X Domain rel.in MMI editor protocol window

� DYNAVIS-X license: in file/install/dyx/etc/DYNAVIS.LIC.<machine name>

� Operating system: HP-UX 10.20 w/patches� Ingres release: from an Hpterm type: ‘sql

<database name>’� Ingres license: Type ‘ingprenv’ write down

II_AUTHORIZATION� ES 680 release: upper right-hand corner of

main menu� ES 680 license: in file

/Install/txpes/sw/sw7.0.HP800/config/lizenz/STARTMENU

� DYNAVIS-X release: DYNAVIS-X Domain rel.in MMI editor protocol window

� DYNAVIS-X license: in file/install/dyx/etc/DYNAVIS.LIC.<machine name>

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Logins and Passwords

OM 650 PC (SU, PU, OT, etc.) ES 680 workstationroot: roots1txpom: /1txpomtxpes: /1txpes

root: <machine model no.> (e.g. 715/80hp)ingres: ca123project admin: (given at turn-over)

In addition to a profile of every computer, backups should be made of data storedon the individual component. Proceed as follows to make backups of pertinentdata:

OM 650 (SU, PU, OT, CU) Hard Drive Backup

Boot and root diskettes of SCO version 5 are available from the AC which allowyou to save or restore the entire hard disk content of a PC including version 3.

Note: The SCSI-ID 2 must be set before POWER ON of the external drive if it can be set at theexternal DAT drive!Due to the initializing procedure on the SCSI bus it may occur that the call-up is rejected up totwice when addressing the DAT drive and a HW fault alarm is output! If the hardware is intactthe third attempt normally is successful.

Requirements:

� OM component with a DAT drive (DAT tape 120m) (internal DAT or external DAT with SCSI address 2)� Ensure that the OM component is shut down and switched off

To Generate a backup tape (OT, PU, SU, CU):

� Insert the boot diskette SCO R5.0.4 and switch on the machine => Boot fromdiskette

� On boot: Press the RETURN key => Starts booting� Follow the dialog and then insert the ROOT diskette SCO R 5.0.4� Om.Backup => Backup generated� haltsys => Shut down the machine

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To load the backup tape (OT, PU, SU, CU):

� Insert the boot diskette SCO R5.0.4 and switch on the machine => Boot fromdiskette

� On boot: Press the RETURN key => Starts booting� Follow the dialog and then insert the ROOT diskette SCO R 5.0.4� Om.Restore => Restore is generated� haltsys => Shut down the machine

ES 680 Database Backup

Command Sequence for Creating a Database Backup

� Log in as project administrator� Exit out of TXP ES 680 software� Type ‘esMonitor.sh stop’� mkdir <backup directory> (e.g. /tmp/save; observe the free disk space!)� cd <backup directory>� unloaddb -c <project name>� unload.ing

The backup so created can be saved on tape with the following commands:

� With the current directory one level above backup directory (e.g. ifbackup directory is /tmp/save current directory must be /tmp)

� Type ‘tar cfv /dev/rStp0 <backup directory> (e.g. tar cfv /dev/rStp0save)

Command sequence for loading a database backup

� Log in as project administrator� Exit out of TXP ES680 software� Read in the tape with the backup under the same path as used for reading

out (e.g. /tmp/save)� With the current directory /tmp type ‘tar xfv /dev/rStp0’

� Type ‘esMonitor.sh stop’� destroydb <database name>� createdb -d<database name> <database name>� cd <backup directory>� reload.ing

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� Locate the Lithium batteries on your 155 rack

� Remove and replace one of the fans in your 155 rack

� Fill in the necessary information on the computer profile sheet for both theOM CU and ES workstation (if applicable)

� Perform a database back-up of the ES 680 database 9

TXP-HW Course


TXP-HW Course


Trouble Shooting & Exercise 9

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Troubleshooting Troubleshooting of AS 620 components On occurrence of component faults the DS 670 provides information about the fault location and the present fault in an optimal manner. If a DS 670 is not present the lamp alarms and LEDs of the components described below can be used to determine which necessary fault elimination measures are required. Central rack (ZG) and Expansion rack (EG) 155H Indicated by: Yellow ‘Fault’ LED on the power supply module is lit and OM Alarm ⇒ Replace the Lithium battery Indicated by: the RED LEDs ‘F1’, ‘F2’, or ‘F3’ are lit and OM Alarm ⇒ Replace the fan Indicated by: the RED LEDs ‘F1’, ‘F2’, or ‘F3’ are lit ⇒ Replace the dust filter Indicated by: the RED LEDs ‘F1’, ‘F2’, or ‘F3’ are flashing ⇒ Replace the dust filter Indicated by: the green ‘5V’ LED on the power supply module is not lit ⇒ Check the voltage supply. If it is O.K. replace the power supply module. Indicated by: the green ‘24V’ LED on the power supply module is not lit ⇒ Check the voltage supply. If it is O.K. replace the power supply module. Indicated by: Fan shutdown and none of the red LEDs ‘F1’ ,’F2’, and ‘F3’ on the fan insert front are lit ⇒ Replace the fuse in the fan insert.


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TXP-HW Course CPU 948 Indicated by: the RED ‘SYS FAULT’ LED is lit ⇒ Replace the CPU 948 Indicated by: the RED ‘STOP’ LED is lit and the RUN/STOP switch is in the RUN position ⇒ Check I&C ASD ⇒ De-energize the Central rack; wait for approx. 1 min.; Re-energize the rack;

execute a general reset and restart switches; CPU should go to RUN again ⇒ In all other cases please contact Siemens Westinghouse HOTLINE IM 304 Indicated by: the RED ‘FAULT’ LED is lit since the connection to the partner module is interrupted ⇒ Check the 721-connector cable. If it is okay replace the IM 304 IM 324R Indicated by: the green ‘ON’ LED is not lit ⇒ Check the voltage supply of the Central rack, If it is okay replace the IM 324R CP 1430 Indicated by: the RED ‘FAULT’ LED is lit ⇒ Replace the CP 1430 Indicated by: the green ‘Fault15V’ LED is not lit ⇒ Check the Central rack (source of the 15V voltage supply). If it is okay replace the CP 1430 Indicated by: the RED ‘STOP’ LED is lit and the RUN/STOP switch is set to RUN ⇒ Determine the status using the PG 740 and COM 1430; Invoke COM 1430 -> CP functions -> Status -> if status is STOP -> set to RUN


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IM 308 Indicated by: the RED ‘IF’ LED is lit ⇒ Replace the IM 308 Indicated by: the RED ‘BF’ LED is lit ⇒ The connection to the subordinate station has failed. Voltage failure of the subordinate station IM 314 R Indicated by: the green ‘ON’ LED is not lit ⇒ Check the voltage supply of the expansion rack. Check 721-connector cable. Troubleshooting of Bus components The TXP bus system consists of: • Transmission media (optical virtual ring, optical or copper cables in star

configuration) • Active bus components (star couplers, OLMs, CPs, bridges) • Software (drivers, CP databases, operating software for the bridge and MIKE) • Time components • Communications functions (protocol procedures) Faults that occur within these component groups are signaled either directly or indirectly. The tables below list possible fault causes and alarm locations:


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TXP-HW Course Cabling Fault Possible cause Signaled via.. Interruption • Loose

connections/plugs • Torn apart • Crush • Strain too high • Wrong polarity

• Interface card LEDs1 • DS 670 (optional) • ASD via HSSM (optional) • ASD, indirectly

(connection failure)

Fault due to failing to meet installation, commissioning, operation, or planning guidelines

• Minimum bend radius limit exceeded

• Excessive length • Impermissible

extension • Electromagnetic faults • Equalizing currents on

the shield (insufficient ground potential equalization)

• Interface card LEDs1 • DS 670 (optional)

Star Couplers Fault Possible cause Signaled via.. Voltage supply failure • Power pack failure

• Failure of supply voltages

• Blown fuse


(connection failure) Fault due to failing to meet installation, commissioning, operation, or planning guidelines

• Minimum bend radius limit exceeded

• Excessive length • Impermissible

extension • Electromagnetic faults • Equalizing currents on

the shield (insufficient ground potential equalization)

• Interface card LEDs1 • DS 670 (optional) • ASD, via HSSM (optional) • ASD, indirectly

(connection failure) • ASD, directly (blown fuse)

Module failure • Back-panel bus failure • Interface card LEDs1 • DS 670 (optional) • ASD, via HSSM (optional) • ASD, indirectly


• Overheating • Interface card LEDs1 • DS 670 (optional) • ASD, via HSSM (optional) • ASD, indirectly

(connection failure) 1See chapter 4 of this manual for meaning of LEDs on individual cards


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Optical Interface cards Fault Possible cause Signaled via.. Module failure • Failure of

send/receive section of the optical ports

• Reduced performance of the send/receive section

• Partial/total failure of the module logic




• Wrong switch setting • Interface card LEDs1 • DS 670 (optional) • ASD via HSSM (optional) • ASD, indirectly

(connection failure) Electrical Interface cards Fault Possible cause Signaled via.. Module failure • Failure of

send/receive section of the electrical ports




• Wrong switch setting • Interface card LEDs1 • DS 670 (optional) • ASD via HSSM (optional) • ASD, indirectly

(connection failure) Supervisory Module (HSSM) Fault Possible cause Signaled via.. Module failure • Partial/total failure of

the module logic • HSSM LED • ASD via HSSM (optional)


• Wrong switch setting • Faulty connection of

the relay outputs

• HSSM LED • ASD via HSSM (optional)

Management card (MIKE) Fault Possible cause Signaled via.. Module failure • Partial/total failure of

the module logic • MIKE LEDs • DS 670 (optional)

Program fault • Program fault • MIKE LEDs • DS 670 (optional)


• Faulty address setting • Faulty

parameterization

• MIKE LEDs • DS 670 (optional)


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TXP-HW Course OLM (Optical Link Module)

• Fault • Possible cause • Signaled via • Voltage supply failure • Failure of the supply

voltages • Blown fuse • Power failure

• Module LEDs • ASD via alarm contact

(optional) • ASD, indirectly

(connection failure) • ASD, directly

(blownfuse) • Module failure • Send/receive section

failure of the optical ports

• Send/receive section failure of the electrical ports

• Reduced performance of the optical send/receive section



(optional) • ASD, indirectly


OSM (Optical Switch Module)

• Fault • Possible cause • Signaled via • Voltage supply failure • Failure of the supply

voltages • Blown fuse • Power failure


(optional) • DS670 (optional (1)) • Telnet or browser

SMTP • ASD, indirectly

(connection failure) • ASD, directly

(blownfuse) • Module failure • Send/receive section

failure of the optical ports

• Send/receive section failure of the electrical ports

• Reduced performance of the optical send/receive section



(optional) • DS670 (optional (1)) • Telnet or browser

SMTP) • ASD, indirectly



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Troubleshooting of OM 650 components Each OM computer has an extensive collection of software troubleshooting tools installed on them. All of these tools can be found under the login txpom in the search path. Following is a few of the most commonly used tools that are used to locate communications problems within the OM system: PL – Indicating the Status of the OM Components and OM Managers Syntax PL [-t] [-1] DESCRIPTION The current statuses held by the infrastructure are indicated for the OM components and the object managers. The indication is from the view of the local OM component, i.e. the OM component on which PL has been invoked. If option -1 is not provided, the representation is updated in a 6-seconds cycle. To deselect cyclic output press the Del key If option –t is selected the time synchronization status is displayed as shown in the example below: w01cu1 SyncState: OK StLTK OmKomp Time StOMK MMI ASR MAC ARC BDM LZA NTB PRT akt w01cu1 okay fue fue fue fue fue fue fue fue fue In this example, w01cu1 is the hostname of the OM component. The Time column indicates that the time synchronization is okay. The fue status of the individual object managers denotes that all are running properly. If all object managers are not fue please contact the HOTLINE for assistance. pas – indicates starting anf – indicates initialization fue – indicates running Master akt – indicates active standby abg – indicates not working


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TXP-HW Course rdb – Reading out the AS620B Component Status Syntax rdb DESCRIPTION For basic troubleshooting of AS communication problems, only use function 3 without checking with the HOTLINE first. Although the other functions are not blocked they should only be used by HOTLINE personnel. FUNCTION 3: This function is used to indicate the status of the

communication connections to the AS620B at a point in time Example of function 3: TXP system comprising four AS620B components in total: AS1 AS2 AS3 AS4. The AS2 component is not available. rdb <RETURN> 3 Function 3 3 3-second cycle 0 No storage in a file Output: AS index

Status TTD Tel No.

Anz. GAanf

Update ToSS

00 fc000710 1423 0 1 01 08000008 0 0 0 02 f4000710 4628 1 589 03 ec000710 2904 0 6 The status word fc000710 indicates all communications with the associated AS are functioning correctly. If the status word does not show fc000710 the HOTLINE should be contacted for assistance.


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� Power on your OM system and determine whether all of the Object Managersare running properly. What program is used to accomplish this?

� Determine the status of the connection with the AS 620. What tool is used toaccomplish this?

� While monitoring the connection unplug the plant bus cable from the CP1430. What did the status change to?

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TXP-HW Course


Glossary of Terms

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Glossary of Terms:

Abbreviation Definition

AP Automation Processor

AS620B Automation System (Basic)AS620F Automation System (Fail Safe)AS620T Automation System (Turbine Controller)

ARC Short Term Archive

ASR Automation System Representative

AUI Attachment Unit Interface

BDM Text Data-base Manager

CPU Central Processing Unit

CSMA/CD Carrier Sense Multiple Access / Collision Detection

CU Compact Unit

DAT Digital Audio Tape

DS Diagnostic Station

DTE Data Terminal Equipment

ES Engineering Station

ESM Electrical Switching Module

F.O Fiber Optic

FTP File Transfer Protocol

FUM Function Module

GUI Graphical User Interface

ISO International Organizations for Standards

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ITP Industrial Twisted Pair

LAN Local Area Network

LZA Long Term Archive

MAC Media Access Control (Ethernet MAC Address)

MMI Man Machine Interface

MMT Multi Media Terminal

NIC Network Interface Card

NTB Notebook

OLM Optical link Module

OSM Optical Switching Module

OSI Open Systems Interconnection

OT Operating Terminal

PRT Log Function

PU Processor Unit

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RAM Random Access Memory

ROM Read Only Memory

SCSI Small Computer System Interface

SCO Santa Cruz Operating System

SIM Signal Input Module

SU Server Unit

TCP/IP Transmission Control Protocol/ Internet Protocol

TFTP Trivial File Transfer Protocol

TTD Time Tagged Data

TSAP Transport Service Access Points

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spp2- siemens txp hw manual

Documents

actual use

specific use

use of circuits

t exercise

troubleshooting exercise

b exercise

txp control system

txp hardware course