south east asia · lighting the way: leds in smt production pec (printed electronic circuit)...

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Volume 1 Number 4 Winter 2010

NEW PRODUCTS

INDUSTRY NEWS

INTERNATIONAL DIARY

South East AsiaSouth East Asia

Lighting the way: LeDs in sMt proDuction

pec (printeD eLectronic circuit) process for LeD interconnection

LeD bin vaLiDation anD traceabiLity

printeD eLectronics for fLexibLe soLiD state Lighting

N ChandramohanInterview Inside

Covering India, Thailand, Malaysia, Singapore, The Philippines and Hong Kong

www.globalsmtindia.in

Global SMT & Packaging Southeast Asia – Winter 2010 – 1www.globalsmtindia.in

Contents

ContentsGlobal SMT & Packagingis published monthly

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articles are not necessarily those of the editors or the publisher.

ISSN No. 1474-0893 © Trafalgar Publications Ltd

Designed and Published by Trafalgar Publications Ltd,

Bournemouth, United Kingdom

Volume 1, No. 4

Winter 2010

32

14

2 You’ll be seeing more of us next year Debasish P. Choudhury

TechNology Focus

10 PEC (printed electronic circuit) process for LED interconnection

Mike DuBois, Caledon Controls Ltd

14 Printed electronics for flexible solid-state lighting Marc Chason, Marc Chason and Associates, Inc.

20 LED BIN validation & traceability Dan Hodgman, Methode Electronics

34 Lighting the way: LEDs in SMT production Zachery Shook, Count On Tools, Inc.

BusINess Focus

28 What’s the future of the Indian electronics manufacturing industry? Pradeep Chakraborty & Usha Prasad

specIal FeaTures

32 Interview—N Chandramohan, Juki India Pvt. Ltd38 electronica India & productronica India 2010: Undoubtedly the numero uno business platform in South East Asia 39 10th edition of GlobalTRONICS hosted over 50% new exhibitors

REgULAR COLUMNS

24 Holiday wishes for a “normal” 2011 Walt Custer and Jon Custer-Topai

OTHER REgULAR

FEATURES

4 Industry News40 New Products46 Association News48 International Diary

10

South East Asia

With demand growing for LEDs in electronics, companies in the SMT industry are expanding their manufacturing capabilities to meet it.

2 – Global SMT & Packaging Southeast Asia – Winter 2010 www.globalsmtindia.in

Editorial

Debasish P. ChoudhuryEditor

Editorial OfficesEuropeGlobal SMT & PackagingTrafalgar Publications LtdUnit 18, 2 Lansdowne CrescentBournemouthDorset BH1 1SAUnited KingdomTel: +44 (7766 951665E-mail: [email protected]: www.globalsmt.net

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Editor-in-ChiefTrevor GalbraithTel: +44 7924 581 523 (Europe)Tel: +1 (239) 245-9264 x101 (US)E-mail: [email protected]

Managing EditorHeather LackeyTel: +1 (239) 245-9264 x105E-mail: [email protected]

Editor Debasish P. ChoudhuryTel: +91 120 [email protected]

Circulation & SubscriptionsKelly Grimm Tel: +1 (239) 245-9264 x106E-mail: [email protected]

AdvertisingAmericas—Derek Laborie (print & video)Tel: +1 (239) 245-9264 x102Mobile: +1 (603) [email protected]

Sandy Daneau (digital)Tel: +1 (239) 245-9264 x104 Cell: +1 (603)[email protected]

Europe—Andy KellardTel: +44 7766 [email protected]

Asia/Pacific— Debasish P. ChoudhuryTel: +91 120 [email protected]

Frankly, “astounding” is the word that best describes India’s LCD TV sales in October 2010. The total LCD TV shipments during this one month, which coincided with the great Indian festival of Diwali, almost matched up with the total LCD TV shipments of 2008, when 745,000 LCD TVs were shipped in the entire year. It seems everyone wanted to erase the memories of the slowdown days.

As the year draws to a close, we can feel the excitement in the air. Christmas parties, vacations and the impending New Year bashes are the central points of our discussions now-a-days. Christmas sales, which a couple of years back were alien to Indian retail industry, have gained acceptance due to aggressive consumerism riding on India’s near 9% GDP growth this fiscal.

But in this hour of celebration the biggest shock was the postponement of the COMPONEX NEPCON India 2010 show, originally scheduled during mid December in New Delhi. COMPONEX NEPCON, which was till 2009 considered to be a must-attend electronics manufacturing supply chain show in India, lost its clout due to Reed Exhibitions’ failure to organise the show in February 2010. Now, it will be co-located with the maiden EFY Expo scheduled in February 2011 in New Delhi. The interesting aspect of this handshake is the launch of a brand new trade show in February 2012 in New Delhi. We will keenly watch its evolution in the Indian electronic landscape.

At the same time, it is heartening to see LED Expo, the only dedicated trade show for the LED industry in India, to be held during 3rd week of December in New Delhi, receive an overwhelming response from the global LED eco-system. The LED show will now cover all the standalone halls in Hall 7 at Pragati Maidan. It once again shows how favourable government

policies influence businesses around the world.

At present, all LED chips are imported from countries such as Japan, Korea, Germany and the US, and the prices are high due to low consumption, thereby prohibiting widespread usage. If we take into account the current consumer LED demand projections, the industry estimates the local manufacturing capacities in India wouldn’t come up before 2016. But the real action in the LED industry will come when the domestic manufacturing scenario heats up.

Let me share with you an interesting fact! In 2009, the world produced an estimated US$ 1,620 billion of electronic equipment. After the painful recession of 2009, growth resumed significantly in 2010, with SE Asia driving the electronic equipment rebound, which includes China & Taiwan. We, at Trafalgar Publications Ltd. are also buoyed by this feel-good factor and have decided to increase the frequency of our magazine next year. In 2011, Global SMT & Packaging SE Asia edition will be a bi-monthly, with more news, reviews, interviews, technical articles, columns, etc., to increment your desire for manufacturing technology excellence.

I expect 2011 will be a brilliant year for Indian electronics industry, and SE Asia will continue to drive the growth of the global electronic equipment production.

Before I conclude, a heartiest ‘Thank You’ to all our readers, advertisers, columnists and subscribers for a success launch of the SE Asia edition of Global SMT & Packaging magazine.

I wish you all Merry Christmas, and a fantastic New Year 2011!

—Debasish P. Choudhury

You’ll be seeing more of us next year

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Broadcom engineer receives prestigious Ieee alexander graham Bell Medal Dr. Arogyaswami Paulraj, who recently joined Broadcom Corporation from Beceem Communications, has been named the recipient of the Institute of Electrical and Electronics Engineers’ (IEEE) Alexander Graham Bell Medal, the organization’s most prestigious honor. In its award citation, the IEEE’s Board of Directors said that in its efforts to recognize “exceptional achievements in our profession,” Dr. Paulraj was selected “for pioneering contributions to the application of multiantenna technology to wireless communications systems.” www.broadcom.com

element14 offers latest ac/Dc leD solutions from recoM element14, formerly known as Farnell Electronics India (P) Limited, the industry’s first fusion of commerce and online community supporting millions of engineers and purchasing professionals worldwide, announced the latest addition of RECOM power solutions, a new range of high-efficiency constant current LED drivers in the power range of 12 and 20 Watt to its extensive product portfolio. With this enhanced offering of cutting-edge power solutions in the form of a new range of constant current LED drivers in the power range of 12 and 20 Watt, element14 has taken its partnership with RECOM Asia even further to offer the latest and most innovative solutions to meet the needs of electronic design

engineers and maintenance and repair professionals across the Asia Pacific. www.element14.com

syrma Technology expands presence in India Syrma Technology, a Chennai-based electronics manufacturing services (EMS) partner, has added a new facility in the Krishnagiri District of Tamil Nadu, approximately 110 kilometers from Bengaluru, India, to accommodate strong demand for the company’s custom RFID tag solutions and its telecommunications infrastructure services. Syrma is the manufacturing arm of The Tandon Group, a leader in helping global OEMs successfully bring products and services to the fast-growing Indian market. Syrma will be adding a total of 20,000 square feet of space and will add approximately 200 jobs by December. The company established the Chennai site in 2006 to provide end-to-end electronics manufacturing services for the industrial, medical, defense and telecommunications industries. www.syrmatech.com, www.tandongroup.com

MIrTec europe appoints accurex as its exclusive distributor for India MIRTEC appointed Accurex Solutions Pvt Limited as its exclusive distributor for India. Accurex brings with them more than fifteen years’ experience in sales and service of automatic optical systems. Accurex is headquartered in Bangalore and has branches in New Delhi, Hyderabad, Chennai and Mumbai with a reputation as one of the best after-sales

service organizations in the Indian market. With a team of well-trained service and sales professionals of Accurex and the unmatched systems of MIRTEC, this partnership will certainly be a force to watch. www.mirteceurope.com, www.accurexsolutions.com.

cTs incorporates in India to pursue opportunities in a rapidly growing eMs market US-based EMS provider CTS Corporation has formally incorporated as a business in India. The new subsidiary, CTS India Private Limited, located in Haryana, India, near New Delhi, will allow CTS to operate with full manufacturing, sales and service capabilities within India.

CTS has also captured new business for a customized small engine throttle position sensor (SETPS) from one of India’s leading and diversified engine and construction equipment manufacturers. Production is expected to begin in the fourth quarter of 2010 with sales of approximately $2.5 million over its multi-year program life. www.ctscorp.com

lg electronics India’s managing director felicitated with Man of electronics award Moon B Shin, managing director, LG Electronics India, received the “Man of Electronics” Award during the 31st annual Consumer Electronics and Appliances Manufacturers Association (CEAMA) function. Mr. Shin received “Man of Electronics” prestigious award for an outstanding performance and extraordinary contribution made in the promotion and development of Indian Consumer Electronics Industry. LG, which is the market leader in durable industry, is today a $2.9 billion company and is targeting to achieve $ 10 billion sales by 2015. LG reported year-on-year growth of 30% this year and is confident that the high demand will last till the remaining year attributing factors such as rising incomes, positive economic forecasts, bright job prospects and hence, high consumer confidence. At the occasion were present eminent dignitaries including Dr. Y.V. Verma, president, CEAMA; Mr. Rajiv Bajaj, hony. secretary, CEAMA; Mr. Ravinder Zutshi, immediate past

Industry NewsIndustry News

Frontline electronics of pune invests in cyberoptics’ inspection systems CyberOptics Corporation, a leading SMT inspection solutions provider, announces that Frontline Electronics Ltd has purchased its QX500™ and SE350™. The systems are scheduled to be delivered to Frontline’s plant in India in September 2010.

“We are so pleased to have received this order from a local leading EMS facility with a strong commitment to the growth of the Indian electronics market. This marks a significant milestone for CyberOptics in India and we are confident that this is the start of a long relationship with Frontline Electronics,” said Sean Lee, CyberOptics’ South Asia Sales Manager. www.frontlineelectronics.com, www.cyberoptics.com


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Industry News

president CEAMA, and P N Dhoot, past president CEAMA to highlight the recent developments and observations related to the industry.

elcoteq Bangalore rewarded in elcINa-eFy Business excellence award 2010 Elcoteq’s Bangalore factory has received the second prize in the “ELCINA-EFY Business Excellence Award 2010.” The competition is initiated and organized by ELCINA (Electronics Industries Association of India) and EFY (Electronics for You) to encourage and boost the innovation culture in the electronics industry in India.

Elcoteq Bangalore applied for the Business Excellence -category in the competition for years 2009-2010, where the criterion is built on the EFQM model.

India’s mobile phone penetration to reach 97 percent in 2014, says isuppli Cell phone ownership has become near ubiquitous in India, with wireless subscriptions in 2014 expected to amount to more than 97 percent of the country’s population of 1.26 billion, according to the market research firm iSuppli Corp. By the end of this year, total wireless subscriptions are projected to reach 766.0 million—45.9 percent higher than the 525.1 million subscribers counted at the end of 2009, iSuppli mobile industry forecasts show.

The pace of growth for the future shows little sign of slackening. Subscriber numbers will continue to increase during the next four years, topping the 1 billion mark by 2012. By 2014, mobile teledensity—a measure of cell phone availability—likely will reach 97.4 percent per 100 persons. www.isuppli.com

DeK continues to partner with Maxim sMT to capture Indian market DEK is extending its partnership with Maxim SMT in India. Under the franchise agreement, Maxim SMT will continue to distribute DEK’s equipment and manufacture the cutting-edge VectorGuard® stencils under licence from DEK, incorporating electroformed foils, laser-cut nickel foils and plastic stencils, to meet growing market demands across India.

Headquartered at New Delhi and supported by branch offices at Chennai, Bangalore and Pune, Maxim SMT is one of the largest SMT companies in the

country and is well positioned to help manufacturers throughout India gain a distinct competitive advantage through the use of DEK’s pioneering stencil system. In addition, Maxim SMT is well equipped to support many of DEK’s customers who have already moved their manufacturing plants to India. www.dek.com

asys Technology Days smashes previous records Expectations were exceeded as 180 customers and channel partners from all over the world attended the two-day program at ASYS Global Headquarters in Dornstadt, Germany. Visitors were treated to presentations on new technologies interwoven with workshops and machine demonstrations. The highlights include the launch of a new “INSIGNUM” family of laser markers, which utilizes the company’s research in the area of lasers and includes four machines types from basic to advanced flexible high speed units.

Additionally, new Laser Depaneling machines were introduced coupled with new flexible options for mechanical routers. In the area of new technologies, the company unveiled its plans for the LED market segment with a new Singulation System that replaces the traditional sawing process. www.asys-group.com

Koh young’ ceo, Dr. Kwangill Koh, receives south Korean government award Dr. Kwangill Koh, founder and CEO and president of 3D inspection technology leader Koh Young, was recently honored by the government of South Korea, and Korean industry leaders, for his achievements in making his company a dominant force among technology companies both domestically and globally.

Awarded by the government of South Korea, the Tin Tower Order of Industrial Service Merit—The Best Venture Company, recognized Dr. Koh for his outstanding contribution to the government’s industrial development and contributions to the Korean economy. The medal was presented to Dr. Koh in ceremonies on October 19, 2010. The award recognized that “Kwangill Koh, the CEO of Koh Young Technology, Inc., highly contributed to increased competitive advantages of Korea by providing the first high-speed 3D inline solder paste inspection systems to worldwide electronics manufacturers.” www.kohyoung.com

Bridgestone, Delta electronics to develop next-generation electronic paper products Bridgestone Corporation and Delta Electronics of Taiwan entered into a joint agreement to develop and manufacture the next generation of electronic paper products and applications. The development will provide valuable synergies between Bridgestone’s Quick Response Liquid Powder Display (QR-LPD) technology and Delta’s core competencies in the areas of energy solutions and imaging technology. QR-LPD is a bistable, reflective display technology that uses airborne, electronically switchable powder particles of extremely high fluidity. The results are paper-like visibility, wide viewing angles, fast response times and ultra-low power consumption. www.deltaww.com

Test advantage hardware announces new director of sales for the asia pacific region Test Advantage Hardware, LLC, a newly acquired subsidiary of Boston Semi Equipment, LLC (BSE Group), has hired Richard Huang as director of sales for the Asia Pacific region. Huang will focus on expanding the Arizona, U.S.-based company’s leasing portfolio and supporting the growth of its hardware sales business throughout Asia.

“The Asia Pacific region continues to experience strong growth across a broad spectrum of equipment requirements,” said Colin Scholefield, executive vice president of the BSE Group. www.testadvantage.com, www.bsegroup.com

Nexray of singapore wins the B.I.D. International star award for Quality in geneva Nexray Pte Ltd, a leading electronics manufacturing technology solutions company based in Singapore, received the B.I.D International Star Award for Quality at the 35th International Star Award for Quality (ISAQ) Convention in Geneva on 6th September 2010. B.I.D. International Star Award for Quality includes a trophy that B.I.D. presents to those companies from around the world that best adhere to excellence and innovation in their practices, putting quality first.

The companies awarded at the gathering in Geneva were distinguished not only for their business success, but for their dedication to continuous improvement, abiding by the principles of the B.I.D.-created QC100 model of Total Quality Management. www.nexray.biz


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PEC (printed electronic circuit) process for LED interconnection

Higher wattage LEDs/power components or their placement in higher densities requires a larger dissipation of heat in a more effective way.

The following is quoted from Canadian Electronics magazine:

“With rapid advancements in power reduction, and minimizing and controlling LED heat, it is expected that future applications will use less-expensive, rigid aluminum-backed printed circuit boards for proper heat dissipation and move towards more cost-effective flexible circuits. This is also being driven by signal and display applications, where most of the future LED growth is expected.”

—Gijs Werner, FCI

PCB mounting of LEDs has to date been limited to mechanical interconnection or the use of printed circuits boards built on thermally conductive copper clad aluminum substrates.

These laminated substrates which are available from several specialty laminate manufacturers, typically consist of a copper foil that is laminated to the aluminum using a glass cloth impregnated with heat conducting additive filled epoxies. The cloth offers small window openings between the weave patterns where the filled epoxies can make contact with the both the

copper foil and the aluminum to transfer heat. The glass cloth, which comprises 50 percent of the prepreg, significantly reduces the thermal conductivity. Additionally, the existing available thermal prepregs are thicker at 100 microns (.004 mils), which increases the effective thermal resistance limiting the maximum watts per square inch dissipation.

A printed circuit board manufacturer would employ this laminate material, laminating photo-imageable etch resist, exposing with UV light then developing to form a circuit image, then etching away unwanted copper to produce circuit traces. All exposed aluminum must also be well masked off, a time- and material-consum-ing task.

printed electronic inksEnhanced thermally conductive inks are much more versatile.

They can be used to make a more

Keywords: Adhesives, Packaging, Modified Polycarbamin Acid Derivates, mCD

PCB mounting of LEDs has to date been limited to mechanical interconnection or the use of printed circuits boards built on thermally conductive copper clad aluminum substrates. This paper discusses the use of enhanced thermally conductive inks for LED interconnection.

Mike DuBois, Caledon Controls Ltd., Mississauga, Ontario, Canada


Figure 1. Copper clad aluminum substrate.

Figure 2. Etched copper circuit trace on thermal dielectric & actual etched circuit; 60X.



efficient thermally conductive copper clad aluminum laminate substrate by the PCB fabricator themselves (Figure 1) or could used by selectively printing both the dielectric and conductive traces to make a thermally conductive circuit by anyone with a silk screen printer and a thermal oven (See Figure 3).

Using CCD-120A thermally conduc-tive dielectric ink with its nano technol-ogy enhanced formulation in making PCB boards or even making copper clad aluminum circuit laminate will deliver lower thermal resistance than that of other currently available copper clad aluminum substrates.

copper-clad aluminumThe thermally conductive B-stage ink is applied to the surface of either the copper foil or the aluminum and is semi cured (B-Stage) using a thermal oven. Application is typically a silk screening operation to deposit a thin film of thermal ink approximately .001” thick. The ink is then baked at 250˚F for 20-30 minutes, at which time the material reaches the desired

B-stage cure.The coated B-stage aluminum is lami-

nated with the copper foil of choice using a typical vacuum-assist laminating press and fully cured under pressure.

The end result is a thin layer only 25 microns thick of the thermal mate-rial sandwiched between the copper and aluminum. With this version of a copper clad aluminum, the B stage thermal ink offers lower thermal resistance, because the surface area contact and the thick-ness of the deposit. As well, the pressure of the lamination cycle constricts the ink allowing a closer contact between thermally conductive ceramic particles increasing the thermal conductance. A one mil thick layer of thermal ink properly applied has a 2500 volt rating.

Processing the panel to make a simple single-sided circuit is a done by the time-honored “print and etch” method requiring PCB fabrication equipment and wastewater treatment facilities because of the copper etching process.

Figure 2 shows the etched circuit trace paths on the Thermally Conductive dielec-

tric. Adhesion to aluminum with our 2 w/mc ink is excellent; the thermal dielectric has a hard surface due to its high ceramic content but can accept a coat of solder-mask before the final cure. A compatible solder mask could later be applied.

print-only circuits A selectively deposited thermal conductive ink on the aluminum offers the benefit of being deposited only where thermal heat transfer is needed, reducing consumables costs when compared to the currently popular copper clad aluminum substrate, which has full coverage of the underlying surface with the glass cloth impregnated with heat conductive material.

The circuit traces are screened on

Figure 3. Silver trace on selective print thermal dielectric.

Figure 4. Heat radiating comparison.



using new nano silver solderable inks. The net result is that by using a thermal ink selectively applied under the silver traces, less of the thermal material is used per the same overall area yet will deliver better heat transfer capability because it is thinly applied.

Building a printed circuit utilizing the print-only process can not only simplify the manufacturing, but it will reduce its costs. Print-only is manufactured with a full ad-ditive green technology that will in the end deliver better heat transmission perfor-mance. No etching equipment is required.

print only Printing the thermal dielectric ink selectively where needed and then printing electrically conductive traces on top the thermal dielectric with low resistance

silver ink reduces costs, as the dielectric is applied only where needed (Figure 3).

Screen printing a slightly wider surface area than that of the conductors, then cur-ing the dielectric at a temperature of 250˚F for 30 minutes establishes a non-tacky but yet uncured surface, which is then over-printed with the silver conductive traces. The silver ink is then cured at 150˚C for 30 minutes, which fuses the silver trace into a solid metal track. A compatible solder mask can be applied and tack dried, followed by an overall full encompassing a cure of 300˚F for 60 minutes, which forms the final circuit. Using thermal/silver ink combinations offers many more build op-tions and cost concession possibilities.As there is no requirement to etch and therefore no need to mask off the aluminum when etching or processing,

labor is tremendously reduced. When utilizing the silver ink trace

technology, assembling and soldering the components requires a lower temperature solder which is typically used in assembly houses.

The thermal characteristics are vastly improved over that of a normal copper-clad aluminum etched type circuit. The area of the aluminum that is not covered by the dielectric material and silver traces has a larger thermal conductance (380 w/mc) than the aluminum with a layer of 2 w/mc thermal material.

Figure 4 shows a comparison between three heat conducting and dissipating constructions. Clearly evident is the larger amount of exposed aluminum made pos-sible with an all printed version of the board and the resulting superior heat dis-

Figure 5. PECs developed LPI dielectric. Figure 6. PEC 4 mil lines/space flush silver.

Figure 6. PEC 4 mil lines/space flush silver.



sipation available.

printed electronics versatilityUsing ink technology, more complex circuit boards can be manufactured by using the more advanced and “green” PEC technologies described below.

Thermally conductive PEC processSilk-screen-coating the aluminum with thermally conductive dielectric, a second layer of a specially formulated LPI dielectric ink is deposited at some 1 to 1.2 mil thickness depending on screen mesh selections. If desired, extra layers of the dielectric will provide for thicker conductor lines.

Tack-cured and then exposed using ordinary UV exposure units, the LPI is spray developed on typical developing equipment and chemistry. What remains is a coating on the substrate with trenches and pad openings (Figure 5).

A thermally conductive PEC’s third component is a nano technology silver con-ductive ink that is applied onto the surface of the LPI. Filling of the trenches and pads is accomplished and the conductive ink is cured. The ink fuses into a solid mass with a slight deposit on the surface of the LPI, which is easily removed (Figure 6).

The next step is a repeat of the second, except that this interconnection layer will be a via formation layer only. Coat, tack, expose, develop and silver fill.

Because the LPI is never stripped off and the entrenched silver conductive ink is level with the top of the LPI, everything conductive is flush to the dielectric.

The same process is repeated again for the second conductive layer.

The result is that the interconnect “vias” are buried, and there is a 100% metal connection to the first layer. In the end, anything reliability-wise to a PCB PTH interconnect has been eliminated.

The process is repeated for as many layers as is required by design. The last top layer has pads left exposed for component mounting. All circuitry and interconnec-tions are buried.

Versatile, boards can be configured to use the PEC full additive process even on two sides of the aluminum if desired or build multilayer circuits all on one side of the aluminum backing.

Figure 7 shows a typical PEC build configuration: A multilayered, single-sided thermally conductive PEC technology PCB. Designs could be altered a number of ways, allowing many new interconnect possibilities.

conclusionIn summary, using printed electronic ink products and processes to manufacture high performance thermally conductive circuit boards offers clear advantages in manufacturing flexibility, performance and cost.

When using these inks in the full addi-tive print only process or the PEC method, these high performance heat-dissipating circuits are also environmentally friendly.

Mike is an industry veteran going back to military board manufacturing using shoe eyelets

for interconnection of layers. Joining the ranks of Caledon Controls, a growing distribution

firm, Mike is involved in diversification efforts and searching for alternative PCB processing

methods.


Printed electronics for flexible solid-state lighting

IntroductionBy various estimates, lighting is one of the largest U.S. consumers of electrical power1. Around the world, significant economic and environmental pressures are driving major energy saving efforts with respect to lighting technology. One area receiving a great deal of attention for replacing general lighting sources, i.e., incandescent lamps, fluorescent lamps and compact fluorescent lamps (CFL), is Solid State Lighting (SSL). The excitement with SSL arises from the rapid performance increase demonstrated by crystalline LED-based lighting technology.

Globally, industrial investments and government funded activities are supporting R&D and manufacturing development. The result has been SSL lamp performance that in some cases is equal to or better than existing incandescent and fluorescent lamps. LED-based lamps are now commercially available and in many cases is cost competitive with incandescent and fluorescent lighting systems based on life-cycle assessments. Furthermore, the long lived SSL product can produce additional cost savings through reduction of maintenance costs.

Following Holonyak’s2 1962 announcement of the first light-emitting diode, LED efficacy has dramatically increased over time, Figure 13. Efficacy, the ratio between the amount of light that a source generates relative to its energy input, is measured in lumens per watt, (lm/W). During this time, the incumbent incandescent lamp efficacy has plateaued at a relatively low level. While the various fluorescent technologies have demonstrated increased efficacy, their growth has not been as rapid as that for the LEDs.

In addition to increased performance, LED cost has rapidly decreased. Haitz’s Law (Figure 2), analogous to Moore’s Law for ICs, demonstrates how the cost of LED lighting decreases (cost per lumen) while the efficacy increases (lumens per watt) over time4. Note that the “flux/package” trend is increasing faster than the historical trend.

Organic-LED (OLED) is also undergoing rapid development, but is several years behind the LED-based technology. In contrast to point source LED luminaires, OLED products are dispersed light sources, which promise

Keywords: Solid State Lighting, SSL, OLED

Printed electronics technologies are being introduced as competitors to crystalline semiconductor technologies in several applications, including logic circuits, photovoltaic cells and light emitting diodes (LED). Near term solid-state lighting (SSL) products based on LED technologies are entering the general illumination market. These SSL products use conventional SMT processes in a four-level assembly hierarchy to fabricate light engines for incorporation into luminaires. In parallel with LED device development, printed electronics technologies are also moving forward using ink-based systems to fabricate organic-LEDs (OLED). However, the OLED assembly hierarchy used to fabricate light emitting structures is significantly different from that for LED-based devices. This paper will compare LED and printed OLED assembly technologies, discuss available printing technologies and ink systems for OLED structures and address OLED fabrication and assembly issues.

Marc Chason, Marc Chason and Associates, Inc., Schaumburg, Illinois, USA


This paper was originally presented at SMTAI International 2010 in Orlando, Florida.

Level Assembly Step Comments

3 System level assembly Luminaire assembly Product is sold to end customer

2 Package on board Light Engine—SMT assembly processes

1 LED in package Light Engine—SMT assembly processes

0 LED Device Light Source—Focuses on LED fabrication at the wafer level

Table 1. LED assembly hierarchy.

Level Assembly Step Comments

3 System level assembly Assembly of luminaire Product is sold to end customer

2 Interconnects, leads & packaging

1 OLED Device Integration with R2R processes

0 Focuses on printing/vapor deposition of OLED

Table 2. OLED assembly hierarchy.



new lighting paradigms. Developed by Kodak5 in the 1980s, OLED devices were initially fabricated using vapor deposition processes. The opportunity to use printing processes for OLED fabrication opens up new opportunities.

Presently, OLED efficacy is lower than that for LED product, but is rapidly increasing. It is too soon to know whether OLED products will follow Haitz’s Law.

ssl assembly hierarchiesLED assemblyLED-based SSL assembly follows a 4 level assembly hierarchy, Table 1.

LED assembly uses a broad range of SMT processes and unique materials. Following die singulation and light-emission testing, binned die (based on light quality) are assembled into a light source. A Level 1 LED assembly is depicted in Figure 36. Ultimately, the light engine is

placed in a luminaire.

OLED assemblyIn contrast to LED assembly, OLED assembly follows a very different assembly process, Table 2. While this is still a four-level assembly hierarchy, Levels 0, 1 and 2 are merged into a comprehensive assembly step since OLED fabrication intrinsically produces the light source (Level 0), and light engine (Level 1 and 2) in an interrelated process, not as a series of discrete assembly steps, which defines LED SSL assembly.

This OLED assembly hierarchy arises from the nature of the OLED device, which is different from that for a crystalline based LED. A typical OLED light source fabricated on a glass substrate, shown in Figure 47, is composed of a stack of thin films (usual total thickness of 100-200 nm) situated between planar

electrodes, with at least one transparent electrode to enable light to exit the OLED structure. Descriptions of the various layers are described in Table 3.

Visible light is created when electrons and holes, driven by an applied voltage across the electrodes, combine in the OLED layers. A luminaire is formed when the OLED is assembled into a structure that protects the OLED from physical and environmental damage as well as supplying it with electrical energy and control functions.

SSL OLED technology began as a display technology. In addition to developing the materials and fabrication processes to produce displays, lithography capable of sub-millimeter resolution was also required for forming small pixels with the OLED material sets. While requiring similar OLED materials and substrates, SSL requires lower resolution lithography (i.e., the pixels are larger) so that a critical display manufacturing step is removed from the lighting path. The result is a significant fraction of the manufacturing cost is reduced for a luminaire relative to a display, while concurrently increasing manufacturing throughput and yields.

oleDs for solid-state lightingAs noted in the OLED assembly hierarchy, Levels 0, 1 and 2 are strongly interrelated. This interrelation is made more complex by multiple options available for producing the OLED device. These include:

• Vapor deposition vs. printed processes

• Flexible substrate vs. rigid substrate• Reel-to-reel (R2R) vs. sheet fed

processing

While some OLED material systems can be

Figure 1. Historical and predicted light source efficacies. Figure 2. 2010 version of Haitz’s Law.

Figure 3. Level 1 LED package assembly.



vapor deposited, this paper will generally focus on those technologies that use printing technologies for fabricating the OLED. We will discuss vapor deposited processes for comparison purposes.

OLED materials have a rich developmental history which is described in other publications8. The materials span multiple spaces of the OLED fabrication process and continue to undergo rapid development. This development is intimately tied to the chosen deposition process and substrate properties. Furthermore, these processes are strongly correlated with the associated ink technology.

OLED light emitting material systemsPrintable OLED inks are available from a number of commercial suppliers. Polymer OLED materials (polymer light emitting diode, or PLED) are a class of polymers that emit light and are solution proccesable. Alternatively, vacuum thermal processes are typically used to deposit small molecule OLED (SMOLED) materials.

In addition to the light emitting materials that form the OLED PN junction, additional materials are used to enhance OLED performance. For example, inks have been developed for Hole Transport and Electron Transport functions.

LED-based solid-state lighting produces white light by mixing light from red, green and blue LEDs, or by using phosphors to convert blue or UV LED light to white light. Similar schemes can be used with OLED devices. Various OLED constructions have been developed to realize white light sources. Figure 5 shows a vertically stacked “hybrid tandem” OLED structure for producing white light9, where the OLED structures are deposited on top of each other. Light is produced in the two junction regions and exits the OLED through the transparent anode side. An alternative structure that spreads the light emitting structures along the substrate is depicted in Figure 610.

In the horizontally arranged OLED structures, the red, green and blue light sources are positioned next to each other rather on top of each other. This reduces the number of vertical layer depositions.

OLED substrate material systemsThe OLED light emitting structures are encased between two electrodes, one of which needs to be transparent so that the generated light can exit the OLED structure. The transparent electrode is usually the anode. Rigid OLED devices are typically fabricated on glass coated with a transparent conductive oxide (TCO), usually Indium Tin Oxide (ITO). Flexible anodes are fabricated on polymer substrates similarly coated on one side with ITO. PET (polyethylene terephthalate) and PEN (polyethylene naphthalate) polymers have been used for substrates. The cathode is typically a low work function metal foil, for example aluminum or calcium.

OLED light emitting materials are extremely sensitive to water vapor and oxygen. For commercial devices11, typical water vapor transmission rates (WVTR) are <10-6 g×m-2×day-1 while those for oxygen transmission rate (OTR) are <10-5 cc×m-

2×day-1. These requirements limit the available organic substrates that can be used for OLED production due to their poor hermeticity values. To address this concern, the industry is developing barrier layers to provide increased environmental protection. In addition to hermetic polymer surfaces the polymer edge seal must also be hermetic. Dessicants can be added to the OLED structure to absorb water vapor and oxygen that may penetrate the surfaces, or scavenge those gases

Figure 4. Assembly structure for OLED-based device.

Layer Function

Metal Cathode Low work function material

Electron Transport Layer Transport electrons to organic emit-ters; block hole transport

Organic Emitters Electron/hole recombination and light emission

Hole Injection Layer Transport holes to organic emitters; block electron transport

Anode Transparent conductor

Glass Substrate

Table 3. Description of OLED Layers (from Figure 4).

Figure 5. Vertically stacked OLED structures for producing white light.

Figure 6. Horizontally positioned OLED structures for producing white light.



remaining following assembly.Light extraction from the OLED device

is a primary concern for increasing OLED panel efficiency and luminaire efficacy. In conventional OLEDs, it is estimated that only 20% of the generated light exits the OLED due to refractive index mismatch12. Films that redirect light between the substrate and the electrode can be used to enhance light output. Photonic crystals can provide improved coupling to enable light to exit the OLED.

OLED printing processesSMT assembly makes use of various printing and deposition processes in the production of electronic products, e.g., solder paste screen printing, conformal coating, conductive adhesive dispensing, etc. Printing technologies for OLED technology embrace a number of printing technologies that move beyond the typical SMT space. The ability to print many of the materials that comprise an OLED SSL device makes such fabrication a compelling value proposition.

The OLED substrate will determine whether R2R or sheet fed processes will be feasible. Rigid glass substrate systems require sheet fed processes, while flexible substrates such as polymer and metal foils can be used with either process. While R2R printing produces long sheets of OLED material the OLED devices still need to be excised from the web. Depending upon the manufacturing flow and subsequent processing steps, sheet fed printing that produces near-net final shapes may be as cost effective as R2R printing with its subsequent slitting and excising steps. Engineering analysis is required to determine the optimum system.

OLED printing techniques can be differentiated by the method they use to feed the substrate to the printing process. R2R processes print on long continuous material films, while sheet fed printing uses individual sheets in discrete sizes. Relative to sheet fed processes, R2R processes minimize the load/un-load time between printing stations. However, sheet fed processes can be made to mimic R2R printing with inline techniques.

A simplified R2R process flow for producing an OLED light source is depicted in Figure 713. In this schematic diagram, the transparent substrate is printed with the anode layer and then successive layers of functional inks are in-line printed to produce the OLED structure. For white light production, red, green and blue emissive layers can

be printed, but if a single light color is required then only printing that ink would be necessary. White light can also be produced by printing a blue light emissive layer and adding a phosphor layer that converts the blue light to white light, which is similar to crystalline LED SSL practices. Within this basic process flow numerous permutations are possible to address cost effective manufacturing. The encapsulation and completed module steps will be discussed in later sections.

Gravure, flexographic and slot-die coating processes can be used to print or coat the inks to produce an OLED device. An alternative to these printing processes are inkjet printing processes. While the first three processes require contract between dispensing equipment and the substrate, inkjet printing is a non-contact process. Inkjet printing processes have been developed for fabricating OLED displays14, Figure 8. An OLED suitable for SSL applications could be simpler to produce since it would not require the polysilicon TFT and the pixel sizes could be larger.

Screen-printing technology (which is an SMT staple) uses a masked screen to determine the location where the ink will be deposited. With both flat bed and rotary machines available, it has wide applicability because it can print on many types of surfaces and substrates

and is compatible with a wide range of ink viscosities. It is suitable for printing relatively thick layers to produce electrical conductors and dielectric layers. These are required: a) to produce interconnects between the OLED light engine and power sources, b) to generate printed bus bars to bring electrical power to the OLED pixels, c) to provide conductors for control lines to offer unique features and d) to provide insulating layers where appropriate. Bus bars and interconnect conductors can be formed from silver or carbon inks. Silver inks have higher conductivity while carbon is lower cost. Bus bars and interconnect lines must be positioned so that they offer the lowest shadowing effects.

OLED encapsulation processesIn an OLED SSL device, the OLED light source generates the light (Assembly Level 1 and 2) while the light engine (Assembly Level 2) enables it to couple to the luminaire. Assembly Level 2 must provide the light engine environmental protection (e.g., humidity resistance, oxygen resistance, etc.) and physical protection (e.g., abrasion resistance, etc.). Assembly Level 2 also provides the opportunity for improving light extraction.

Printed OLEDs are thin structures with electrodes on the top and bottom surfaces. Since the separation distance between the electrodes is small and the

Figure 7. Schematic of a R2R OLED printing process.

Figure 8. Schematic of an inkjet OLED printing process.

Figure 9. Left—Osram ORBEOS product. Right—Philips Lumiblade product.



flexible substrate materials tend to be soft, care must be taken when cutting and excising OLED devices from the web. Electrode surfaces cannot come in contact with each other (e.g. due to edge smearing) since they would generate an electrical short and cause device failure. Mechanical cutting tools or cutting lasers can be used if they don’t leave burrs.

Encapsulation of OLED light engines via hermetic barriers is highly advantageous to ensure long product lifetime. Most barrier systems follow a multilayer approach. Laminate films are comprised of thin polymer layers interspersed with thin ceramic layers to provide hermeticity and maintain flexibility. Coating processes also use a multilayer approach with the hermetic film built up with polymer layers and ceramic layers.

Numerous companies are developing barrier films that can be applied via printing/coating or film lamination processes. In addition to offering protection against water vapor and oxygen, these encapsulation layers must also offer abrasion resistance and provide physical protection to the light engine. If they can’t supply these attributes within one barrier film, then additional layers need to be applied that meet the product requirements.

OLED device surfaces have a higher

refractive index than air, which coupled with a planar emitting surface leads to low light out-coupling. Techniques are being pursued to increase light out-coupling by modifying the OLED surface with micro lenses, surface roughening and quantum optics15.

OLED luminaireConnecting power lines to the OLED device requires a mechanical/electrical connection stable over temperature, that is formed at low temperatures or localized high temperatures, and is mechanically compatible with a flexible substrate. The low temperature requirement arises because several of the OLED material systems cannot take high heat levels, so conventional reflow soldering processes are precluded. Localized contact soldering techniques such as thermodes or hear bars, or laser soldering are potential candidates. Conductive adhesives (anisotropic and isotropic may be useful in these circumstances. Mechanical connectors may offer an alternative approach.

Luminaires using vapor deposited OLED light engines are available from Osram16 and Philips17, Figure 9.

A cross-section schematic of the Philips Lumiblade device18 is shown in Figure 10. This luminaire is fabricated on a rigid glass substrate with a vapor deposited OLED and a back cover to seal the device. To help reduce oxygen and water vapor effects, a getter is encapsulated with the OLED.

The performance of printed OLED luminaires lags that for vapor deposited ones, but they are rapidly improving. A number of companies are working to develop printed OLED devices. For example, GE is developing a R2R process, depicted in Figure 11, for fabricating printed OLEDs19. They fabricate an OLED light engine by laminating together “half-devices” printed on flexible substrates.

An example of printed OLED devices fabricated via a printing process using flexible substrates is shown in Figure 1220.

OLED value chainMost incandescent and fluorescent lamps are commodity products. LED and OLED SSL products will be able to command premium pricing in their initial roll-out, but they will ultimately participate in a commodity market. In this value chain, cost will be a critical factor as they compete against the incumbent technologies. Manufacturing technologies that drive toward low cost solutions will be critical toward ultimate market success. OLED printing technologies, based on commercial processes and equipment sets, can help realize a low manufacturing cost structure.

Also in this value chain, new supply chains and distribution channels are developing. Printing companies are learning how to design and manufacture electronic products and test their performance. These are skills that the SMT manufacturers have in abundance, but interestingly are not presently particularly active in this new value chain creation. Many of the assembly equipment sets, test equipment and manufacturing protocols that the SMT industry routinely uses could be transferred to the SSL industry and open up new sources of revenue.

conclusionSSL products based on LED technology are beginning to enter the commercial marketplace, while OLED technology is several years behind for broad market entry. The ability to print OLED devices on flexible substrates will provide a powerful impetus to realize low cost OLED luminaires. Numerous printing processes are amenable to OLED production, and in

Figure 10. Cross section of Philips Lumiblade device. Figure 11. Schematic diagram of GE lamination process for OLED fabrication.

Figure 12. Example of printed flexible OLED devices.

continued on page 23


Title


LED BIN validation & traceability

The electronics industry continues to experience a prolific increase in the use of light emitting diodes (LEDs). Since the 1960s, LED efficiency and light output have doubled every 1.5 years, following a trend similar to Moore’s law. Modern LEDs offer many advantages over incandescent light sources including power efficiency, long life, small size, fast switching and robustness. This has resulted in the wide scale adoption of LEDs for vehicle instrument clusters, warning signs, vision systems and other critical lighting applications.

With this trend comes a significant new challenge for the PCB assembler. LED suppliers package surface mount LEDs based on a brightness index number (BIN). This is a multi-digit code indicating the LED’s brightness and color. The BIN code is indicated on the reel label. It is a separate data field from the component part number (PN). Two reels containing the same LED PN do not necessarily feature the same BIN. LEDs with the same PN and BIN appear identical when illuminated. However, if the BIN doesn’t match the brightness and/or coloring of the emitted light may be noticeably different. Mixing different BINs on the same production unit is often unacceptable. In other cases the product design permits certain combinations of different BINs (color or brightness), or specifies a pairing between the LED BIN and adjacent component

PNs (resistors usually). The rules vary from product to product, resulting in a logistical nightmare for the PCB assembler.

Material availability and costsIf the mixing of BINs introduces such a headache on the assembly floor, then why not demand LED suppliers to only provide a specific BIN for each component PN? This is a logical question. The answer is related to three factors that have a huge impact on any PCB assembler’s bottom line: material availability, lead time and cost.

For LED manufacturers the goal is to increase end-product consistency, but currently it is impossible to economically produce any specific BIN with high levels of consistency from batch to batch. There are several LED manufacturing issues that contribute to this dilemma. These issues are well documented in industry literature, and a detailed explanation is beyond the scope of this article. They include challenges in controlling both the wavelength of the LED die and distribution of the phosphor during the LED manufacturing process1.

To provide a specific BIN for each LED PN, the LED supplier would have no alternative other than manual sorting. This comes with a surcharge of course. Sole sourcing in this manner can result in a three to four times increase in LED component cost. In one observed example, the additional premium to source specific LED BINs for an automotive cluster assembly was estimated at over $100K per year for a single SMT line. Extrapolate that to a typical factory with four to six SMT lines and the additional material costs become staggering. Another factor to consider: LED suppliers cannot guarantee long term availability of any particular BIN in high volume. As a result of these constraints, PCB assemblers typically cannot afford to source specific BINs. Instead they must strive to establish effective internal procedures for managing

Keywords:LED, BIN, TTC, Material Tracking, Setup Validation, Traceability, Process Control, RFID, Lean, Manufacturing Software, Poke Yoke

The increased use of LEDs introduces significant new challenges for the electronic PCB assembler. Separate reels containing the same part number may each have a different brightness index number (BIN). The potential for aesthetic defects is introduced if the BIN from one reel to the next is incompatible. Traditional methods for component traceability and line setup validation are not sufficient to assure quality. This paper introduces a new approach that Methode Electronics deployed for a leading automotive OEM. The system delivers a higher level of process control and traceability during PCB assembly and integrates with functional test to enable automatic product calibration.

Dan Hodgman, Methode Electronics, Automotive Electronic Control Division, Southfield, Michigan, USA


Figure 1. Surface Mount LEDs commonly used in instrument clusters.



different BINs on the assembly floor. Fortunately there are industry

standards, such as NEMA SSL 3-2010, that establish bin structures while promoting continuity amongst suppliers2. This helps the PCB assembler in that they can at least identify the BIN associated with each reel. On a reel of SMT LEDs, the BIN code is typically included within a barcode or 2D matrix on the supplier label, to facilitate data acquisition by a material tracking system (Figure 2).

automotive oeM requirements To meet automotive OEM traceability and quality specifications, Methode sought a higher level of SMT line setup validation than traditionally available. Instead of simple validation based on component PN only, Methode specified the additional requirement to validate based on the LED BIN, to ensure that only compatible BINs are placed onto any given PCB in accordance with design specifications. Traditional validation solutions compare the actual line setup to a static recipe (i.e. the PNs and assigned feeder slots in the placement machine program). The additional requirement to validate based on BIN introduces a new requirement; dynamic setup validation. Why dynamic? Because the correct BIN to load into the machine at any given time may depend on the other BINs presently loaded on the machine, or whether there are partially populated PCBs in the placement machine during reel replenishment. The required solution would also include control systems for physically preventing the machine from placing components whenever the risk of a BIN mismatch or component PN error is present.

Methode’s customer also demanded Traceability for every component Lot Number (LN) for each serialized PCB. Again, traditional methods would fall short of expectations. To provide proof of compliance to the customer’s design specifications, Methode specified that the traceability data must also include the BIN code for every LED placed onto each PCB.

Their customer’s traceability specifications also require data storage and accessibility over a 15 year period.

An additional goal was to eliminate variability between individual product units. Accomplishing this would require a traceability system that could integrate with their functional test equipment to enable automatic product tuning and calibration.

After a thorough analysis of potential suppliers, Methode Electronics partnered with a leading supplier of track-trace-control (TTC) solutions for the electronics manufacturing industry. The partner delivered TTC software modules for line setup validation (Figure 3) and lot code traceability that account for the LED BIN codes used during SMT assembly.

ensuring data integrity “Garbage In, Garbage Out” is a catch phrase that definitely applies to TTC systems. Methode understood it would be pointless to implement TTC SW without checks and balances to ensure 100% data capture and accuracy3. For this reason, sources of data loss and error were eliminated wherever possible.

When tracking serialized products, a common source of data loss comes from the need to capture each PCB serial number at scan points along the assembly line. In such applications, the PCB S/N is typically denoted by a barcode or 2D data matrix symbol. The PCB S/N can easily be missed due to quality issues associated with the creation and placement of the S/N identifier, or if scanners along the line are not properly adjusted during product changeover. The risk of data loss is greater in higher mix environments with frequent product changeovers and a wide variety of PCB form factors.

Product flow controllers (PFCs) were implemented to control the SMEMA handshake between conveyors and placement equipment. The PFC only allows product transfer when the TTC SW confirms a successful scan of the product serial number (Figure 4). Thus, Methode can assure their customer a 100% read rate of PCB S/N. The PFCs are also used to prevent product transfer when the TTC system detects a downstream line set-up discrepancy, or potential BIN mismatch, thereby preventing defects.

Another typical error stems from mistakes made by production operators when manually associating feeders with feeder locations on the placement machine. To poke yoke the setup and replenishment processes, Methode deployed RFID technology to convert their placement equipment into the smart feeder variety. A low cost RFID tag was attached to each feeder and an RF antenna array was installed on each feeder bank,

Figure 2. LED BIN code included in 1D or 2D barcode on supplier label.

Figure 3. Line setup validation SW accounts for LED BIN as well as PN.



to automatically detect and identify the feeder at each slot (Figure 5). In addition to defect prevention, the smart feeder system automatically collects accurate traceability data during machine setup and replenishment. The deployment of smart feeders also increased productivity by replacing manual validation of line setup. By automating what was previously a manual procedure, Methode shaved 12 minutes off the average line changeover time. With three changeovers typical over a 21-hour work day, this efficiency gain equates to 36 additional minutes of productive line runtime per day.

Machine monitoring: low level alarmsThe TTC system is directly integrated with the placement machine’s software. This allows critical real-time production data to be shared between both systems yielding numerous benefits. For example, the machine will stop whenever there is a PN related setup error. Holding the machine in cycle stop until the fault is cleared.

Integration with the machine’s SW also allows the TTC system to accurately track component consumption, including all miss picks and rejected components, enabling proactive material management. The system issues an alarm when the remaining quantity of components on any reel becomes lower than a set threshold.

When a low quantity alarm is issued for an LED, the PFC upstream from the placement machine prevents additional boards from entering the machine. The operator is prompted to choose between replacing the low reel immediately, or resuming production with the current setup: • If the operator chooses to resume

production using the current setup, the

system allows one additional PCB to enter the machine. – This choice makes sense when

there are enough LEDs remaining in the low reel for one more PCB, or if the operator has a replacement reel in hand that contains a compatible BIN to the one that is low.

• The error will come back for each subsequent PCB, until the Low LED Qty alarm is cleared.

• The Low LED Qty alarm is cleared when the low reel is removed from the machine and replaced with a new reel.

If there are PCBs within the machine when a reel of LEDs is replaced, the system will confirm that the new reel’s BIN code is compatible to the one it replaced. If by accident the operator used an incompatible BIN, the TTC system will issue an error and trigger the machine’s cycle stop circuit. This makes it impossible for the machine to place any incompatible BINs onto partially populated PCBs.

If there are no PCBs within the machine when a reel of LEDs is being replaced, the system will permit any allowable BIN for that product, provided of course that the PN is also correct.

complete traceabilityFor each PCB S/N, a traceability report (Figure 6) may be generated that includes the following information:• Time stamp for start and end of SMT

placement process.• Operator ID • PN and LN for each reel used.• BIN for each LED reel used

Conversely, for any given reel, a traceability report may be generated that lists all affected PCB S/N.

automatic product calibrationThe system described above ensures that any particular product only contains correct PNs and compatible LED BINs. However, it alone could not make separate

Figure 4. Product flow control (PFC) assures data integrity while preventing defects.

Figure 5. RFID smart feeders to poke yoke setup and reduce changeover time.

Figure 6. Detailed traceability report including LED BIN code data for every reel.

Figure 7. Automated calibration eliminates product variability.



production units identical in performance. For example a unit assembled using BIN code “A” will emit a different intensity than one assembled using BIN code “B”. To maximize customer satisfaction, Methode took additional steps to eliminate variability between product units. To achieve this, the functional test process was integrated with the traceability database (Figure 7) and equipped with algorithms for automatic product calibration based on the BIN placed on the serialized PCB assembly. When a PCB assembly is placed into the tester its S/N is immediately scanned. The test SW then harvests the traceability data for that specific production unit from the traceability database. The product is automatically calibrated based on the particular LED BINs used to assemble it. This results in identical lighting characteristics for every unit leaving the factory.

conclusions Methode Electronics overcame the challenges associated with LED BIN validation and traceability on the factory floor, through the deployment of a track-trace-control system. Observed benefits

include:• Optimal pricing and availability of

LEDs because they can source a wide range of BIN intensities for each LED PN.

• Reduced inspection and rework costs through assurance that each product contains correct PNs and compatible LED BIN codes.

• Error-proof and automated system performance through the use of RFID smart feeders and product flow controllers.

• Faster set-up times resulting in 32 additional minutes of productive line runtime per day.

• Traceability data reporting and archiving in compliance with automotive OEM requirements, and including LED BIN data for each product serial number.

• Proactive material management such as low level alarms on the factory floor.

• Elimination of product variability through automated calibration.

The system has exceeded its intended purpose and customer satisfaction has been enhanced.

references 1. LEDs Magazine (2009, December),

Industry News: Cree EasyWhite bins simplify LED design, improve color consistency.

2. NEMA: National Electrical Manufacturers Association (2010, April), Standard SSL 3-2010 “High-Power White LED Binning for General Illumination.”

3. DeCaire, Mitch (2006, March) Traceability Data Integrity – Challenges and Solutions, SMT Magazine.

Dan Hodgman is global manager for electronics assembly with Methode Electronics, Inc. (www.methode.com). Mr. Hodgman has over 17 years

experience in electronics assembly and a B.S. in physics from Central Michigan University.

He may be contacted at 24585 Evergreen Rd, Southfield Mi 48075; 248-603-2105; email:

[email protected].

Printed electronics for flexible solid-state lighting— continued from page 18

this nascent stage, value chains and supply chains are undergoing rapid development. SMT assembly processes could offer much support to this growing industry.

As distributed light sources, OLEDs will open up new lighting paradigms for the lighting designer, lighting engineer and architect. With widespread installation, they should reduce the energy required to light our society while providing new lighting sources to complement the traditional point source devices.

references1. http://www.nglia.org 2. Holonyak and Bevaqua, Applied

Physics Letter, Volume 1, 1962, pp 82-83

3. US DOE Solid-State Lighting Research and Development: Multi-Year Program Plan, March 2010, p.23

4. US DOE Solid-State Lighting Research and Development: Multi-Year Program Plan, March 2010, p.29

5. C. W. Tang, S. A. VanSlyke, Organic electroluminescent diodes, Appl. Phys. Lett. 1987, 51, 913

6. LUXEON Rebel Board Design and Assembly Application Brief AB32 (10/08)

7. https://www.msu.edu/~nobleda3/pages/How%20Oled%20Works.html

8. “Flexible Solid State Lighting: Technology, Manufacturing, and Market Assessment”, FlexTech Alliance Report, Released May 19, 2009

9. Eastman Kodak, SID Tech Symp 54-2 (2008)

10. Anil Duggal (GE Global Research), FlexTech Alliance Conference 2009

11. http://apps1.eere.energy.gov/buildings/publications/pdfs/ssl/clausen_vancouver09.pdf

12. Dr Jonathan Halls – “Polymer OLED Technology Fundamentals, Status & Prospects” CDT SID 2008, http://www.cdtltd.co.uk/resources/279.asp

13. “Organic Light Emitting Devices for Solid-State Lighting”, Franky So, Junji Kido, and Paul Burrows, MRS Bulletin, July 2008, Vol. 33, No. 7,

14. http://www.oled-display.net/oled-inkjet-printing

15. Dr Jonathan Halls – “Polymer OLED Technology Fundamentals, Status & Prospects” CDT SID 2008, http://www.cdtltd.co.uk/resources/279.asp,

16. http://www.osram-os.com/osram_os/EN/Press/Press_Releases/Organic_LED/ORBEOS-OLED-light-source.jsp

17. http://www.lighting.philips.com/in_en/global_sites/led_lighting/information/oled/index.php?main=gb_en&parent=1&id=in_en_led_lighting&lang=en

18. http://www.lighting.philips.com/in_en/global_sites/led_lighting/information/oled_lumiblade.php?main=gb_en&parent=1&id=in_en_led_lighting&lang=en

19. Anil Duggal (GE Global Research), FlexTech Alliance Conference 2009

20. http://www.grcblog.com/?cat=19


Crystal ball: second half 2010 and 2011

Electronic equipment revenues rose globally about 14% in 3Q’10 vs. 3Q’09 (Chart 1) based upon “almost complete” composite 3Q results of 70 major OEMs representing over 50% of the world’s sales. The ratio of inventories/sales held steady for OEMS, dropped for major EMS companies, rose slightly for semiconductor producers and jumped significantly for electronic component distributors (Chart 2).

All tiers of the electronic food chain grew in 3Q’10/3Q’09 (Chart 3) with the possible exception of medical equipment (data still incomplete).

Although third quarter growth was strong, signs of slowing are now pervasive—both due to normal seasonality and generally softer demand. Europe’s electronic equipment sales dipped in September (Chart 4) with reports of further softness through at least mid-November.

Taiwan/China (Chart 5) peaked in September (normal seasonality) and is now headed into a post holiday slow season.

Japanese electronics output remains weak and U.S. electronic equipment orders eased slightly in September (Chart 6).

Not surprisingly world semiconductor shipment growth (Chart 7) is dropping quickly from its +60% peak in March 2010.

Using the global PMI (Purchasing Managers’ Index) as a leading indicator, it would appear that the entire world electronics “food chain” will reach “zero 3/12 growth” again in early 2011 (Chart 8).

Fortunately the global PMI rose again in October (Chart 9), suggesting that this year’s electronics post-holiday seasonal decline will be not too severe and the electronics expansion will resume by 2Q’11.

After this winter’s slowdown we expect “normal” growth in 2011 (Chart 10).

Happy Holidays!

end marketsElectronics equipment growth will outpace worldwide GDP by a factor of more than two-to-one over the next five

years, while PWB growth will be even higher.—Henderson VenturesWorldwide enterprise IT spending is forecast to reach $2.5 trillion in 2011, a 3.1% increase from 2010 spending of $2.4 trillion.—GartnerComputer related:• Worldwide PC shipments grew 7.6%

q/q in 3Q’10 to more than 88.3 mil-lion units.—Gartner

• Apple’s iPad adoption rate is fastest ever, passing DVD players; current sales rate is about 4.5 million units per quarter.—Bernstein Research

• Worldwide tablet sales are expected to grow from 19.5 million units in 2010 to 54.8 million units in 2011.—Gartner

• Hard drive makers will see 4Q’10 ship-ments flat or drop sequentially on weak back-to-school demand

• Hybrid hard-disk drive market is expected to reach 600 million units in 2016.—Objective Analysis

Mobile communications:• Handset shipments reached 346.2 mil-

lion in 3Q’10 and are on target to hit

Walt Custer and Jon Custer-Topai

Holiday wishes for a “normal” 2011

Chart 1. Chart 2.

Electronic Equipment SuppliersComposite of 70 Public Companies

Revenue, Net Income & Inventory

1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 300 01 02 03 04 05 06 07 08 09 10

0

50

100

150

200

250

-50

$ Billion

Revenue 134 138 143 150 128 134 126 135 120 123 124 136 126 132 137 155 148 156 154 173 159 164 166 182 170 178 183 202 187 199 208 231 210 222 220 213 184 194 202 228 211 219 229Income 11 11 10 7 -1 -5 -12 -1 2 -12 -1 0 5 4 7 10 10 11 11 14 12 13 13 20 14 10 16 19 17 20 18 18 17 16 15 -5 8 12 15 21 17 20 24

Inventory 57 59 63 65 66 60 53 48 46 44 43 40 39 40 39 39 41 42 43 42 43 43 44 43 46 48 51 50 50 53 54 54 57 58 59 54 50 49 49 49 50 53 55

+14%

20101117

Computer 11, Internet 5, Storage 7, Communication 11, SEMI 13, Medical 6, Instruments 11, Military 6

Preliminary 3Q'10 estimate based upon partial data

Inventory/Sales RatioLarge Component Distributors, Semiconductor, EMS &

OEM Companies

3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 100 01 02 03 04 05 06 07 08 09 10 11

CY

0.200.250.300.350.400.450.500.550.600.650.700.750.800.85

Quarterly Inventory/Sales ($)

SemiconductorEMSOEMComponent Distrib

20101117

4 Component Distributor, 18 Semiconductor, 12 EMS and 69 OEM Company Composite

EMS

Chips

OEM

Distr




1.34 billion in 2010.—ABI Research• Worldwide smart phone unit sales and

market share in the 2Q10, by operating system—Gartner

• Mobile phone subscribers will reach 5.3 billion by the end of the year.—International Telecommunications Union

Consumer electronics:• DSLR-like camera shipments will reach

4.5 million units in 2011.• Global e-book reader sales will reach

20-25 million units in 2011.—E Ink chairman

• Pico and pocket projectors market grew from about 45,000 units in 3Q’09 to more than 100,000 units in 3Q’10.—Pa-cific Media Associates

• Global LCD TV market is growing despite weakness in North America; LED-backlit set to take lead in 2011.—DisplaySearch

• 3D TV market is expected to represent 3% of the overall TV shipment in 2010 with 6.2 million units sold. They will

become mainstream by 2014 with 90 million+ shipments.—DisplaySearch

• Global connected television shipments are expected to grow to about 200 million units in 2015, with strongest growth in the North American mar-ket.—TrendForce

• U.S. sales of Xbox 360 Kinect sen-sors and PlayStation 3 move motion controllers will surpass 4.5 million this holiday season.—IDC

• Worldwide digital set-top box market will grow from 205 million in 2010 to 226 million in 2015.—ABI Research

eMs, oDM & related assembly activityCentral and Eastern European market is approximately US$85B and growing rapidly to $100B as contract manufacturers and component companies expand their presence—Technology ForecastersArtaflex was acquired by team of EMS industry veterans led by Paul Walker, the

founder and former CEO of SMTC.Asetronics expanded its LED placement capacities with a new SMT line with SIPLACE D2 and SIPLACE D1 machines.Assembly House purchased a BGA install and rework (reballing) machine and Scienscope 3D x-ray inspection system.AU Optronics:• setting up a LCD module and system

assembly plant in Russia with TPV Technology.

• received a LCD-TV assembly order from Sony.

AWS Group added package on package (PoP) assembly capabilities.Benchmark Electronics:• completed a full quality system inspec-

tion technique audit at its Thailand Facility for Class III medical device manufacturing capabilities.

• spent MYR 50 million (EUR 11.5 mil-lion) to acquire land & equipment in Malaysia from Pentamaster.

Borisch Manufacturing laid off 130 hourly

Global "Electronic Foodchain" Growth 3Q'10 vs. 3Q'09

143

3012

-00

2021

1376

2616

3421

2830

1344

Electronic EquipmentMilitary

Business & OfficeInstruments & Controls

MedicalCommunication

InternetComputer

StorageSEMI Equip

Semiconductors (SIA)Passive Components

Component DistribEMS-Large (w/o Foxconn)

EMS-MediumODMPCB

PCB Process Equip0 20 40 60 80 100-20

% Change

20100829

US$ equivalent at fluctuating exchange; based upon industry composites including acquisitions

European Computer, Electronic & Optical products Production

Eurostat, C26 category, EU 27 countries

1 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 71098 99 00 01 02 03 04 05 06 07 08 09 10

CALENDAR YEAR

80

90

100

110

120

130Index (2005=100), Seasonally Adjusted

20101117

Chart 3. Chart 4.

Taiwan/China Electronic Equipment ProducersComposite of 101 Manufacturers

1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 91102 03 04 05 06 07 08 09 10

CALENDAR YEAR

0

200

400

600

800NT$ (billions)

20101111

Taiwan listed companies, often with significant manufacturing in China

2009/2008 up 3%

US Electronic Equipment Orders & ShipmentsCommunications, Computer, Military, Instruments

http://www.census.gov/indicator/www/m3/

1 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 71098 99 00 01 02 03 04 05 06 07 08 09 10

CALENDAR YEAR

14

16

18

20

22

24

26

28

30

32

34$B (Monthly Orders - Seasonally Adjusted)

OrdersShipments

20101111

Chart 5. Chart 6.



and salaried employees in Kentwood, Michigan.Cencorp appointed Henrikki Pantsar as R&D director.Compal Electronics is investing US$500 million to build a laptop facility in Chengdu, China in April 2011.Computrol purchased an Essemtec Tucano in-line screen printer.CTS EMS is adding 30,000 SF in Ayutthaya, Thailand, to expand its value add services, providing complex box build and high level mechanical assembly.Datest installed new dual-sided SPEA 4060 flying probe system in Fremont, California.Dell will close its 750,000 SF facility in Winston-Salem, North Carolina.DSM Computer is expanding its production capacity in Munich, Germany.Elcoteq: • appointed Olli-Pekka Vanhanen VP,

business control and accounting, and member of the management team.

• received assembly, test and supply chain

processes outsourcing contract from Sarantel.

Elite ES is moving its U.S. headquarters to 50,000 SF building in the Walter Brown II industrial park and is investing $2.5 million in upgrades.EN ElectronicNetwork Hersfeld GmbH passed ISO/TS 16949 (automotive) and DIN EN ISO 13485 (medical) recertification audits.Enics added 100 temporary workers in Estonia.Èolane acquired 85% of Assiopôle.Express Manufacturing introduced package on package assembly packaging technology that vertically stacks a discrete controller and memory BGA components.Flextronics: • will hire 12,000+ engineering and

manufacturing employees for its new Flextronics Computing facility in Wu-zhong, China.

• Global Services opened a 240,000 SF facility in Milan, Italy, and a 20,000 SF

facility in Delhi, India.• Medical opened a dedicated 180,000

SF facility in Senai, Johor, Malaysia.• opened a 1 million SF computing facil-

ity in Wuzhong, its fourth in China.• partnered with ASSET® InterTech

to accelerate the adoption of the new IEEE P1687 Internal JTAG standard.

Foxconn:• spent NT$825 million to acquire 33

million shares in Chi Lin Technology. • postponed building of a new mobile

phone plant in Vietnam until 2011. • will invest US$261 million to set up

two new subsidiaries and add invest-ment in five existing subsidiaries in China.

• will build a $2 billion LCD plant in Chengdu, China.

• had 500 workers in Tamil Nadu ar-rested for attending a strike.

Gargnäs Production Link changed its name to PanLink AB.Hanza recruited Thomas Lindström as sales & marketing manager.

Global Semiconductor Shipments3-Month Growth Rates on $ Basis

Total $ Shipments from All Countries to an AreaSIA website: www.sia-online.org/

1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 984 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10

0.4

0.6

0.8

1

1.2

1.4

1.63/12 Rate of Change

1

2 3

4

5

6

7

8

9

10

20101112

11 12

13

World Global PMI, Electronic Equipment, PCB & Semiconductor Shipments

Converted @ Constant 2008 Exchange Rates

3 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 900 01 02 03 04 05 06 07 08 09 10

CALENDAR YEAR

0.5

0.7

0.9

1.1

1.3

1.5

3/12 rate of change

PCB "0" Growth SIAEl Equip Global PMI

Source: Custer Consulting Group

20101112

Chart 7. Chart 8.

Global "Purchasing Managers" Index

JPMorgan

1 2 3 4 5 6 7 8 9 101112 1 2 3 4 5 6 7 8 9 101112 1 2 3 4 5 6 7 8 9 101112 1 2 3 4 5 6 7 8 9 101107 08 09 10

32

34

36

38

40

42

44

46

48

50

52

54

56

58DIFFUSION INDEX

0

10

20

30

40

50

60

EXPANSIONCONTRACTION

20101112

Global "Electronic Foodchain" Outlook 2011 vs 2010

3

7

6

6

10

Combined GDP

Electronic Equipment

Rigid & Flex PCBs

Semiconductors

Semi Capital Spending

0 2 4 6 8 10 12-2% Change

20101117

Henderson Ventures

Gartner

Henderson Ventures

Custer Consulting Group

SIA

Chart 9. Chart 10.



Hawk Electronics purchased a Speedprint Technology SP210avi stencil printer.IBM cut 190 jobs from its server manufacturing line in Ireland and moved operations to China.IEC Electronics appointed Jeffrey Schlarbaum president and Donald Doody as executive VP.IMI acquired PSi Technologies.Incap closed its Vuokatti, Finland, factory and centralized its European electronics manufacturing in Estonia.Innocore Gaming was acquired by Advantech for £3.3m and re-named Advantech-Innocore.Jabil expanded its workforce in Tiszaújváros, Hungary, to 7,500.JJS Electronics received AS9100 certification for its manufacturing sites in Lutterworth, UK, and Chomutov, Czech Republic.Kingfield Electronics celebrated 25 years of contract manufacturing services.Kitron Microelectronics: • Jönköping, Sweden, received orders

for complex mechatronics products containing motion mechanics and electronics valued at NOK 20 million per year.

• secured NOK 34 million (EUR 4.2 mil-lion) manufacturing order from Saab Dynamics for complex control systems for missile control.

Melecs hired 200 workers from Lite-On’s closed Gyor, Hungary facility.NBS installed Juki Automation Systems RFID-based intelligent feeder and materials management system in Santa Clara, California.PartnerTech:• split operations into two areas of exper-

tise: Systems Integration & Enclosures and Electronics.

• appointed Peter Nilsson executive VP of operations for electronics and Dan Turecek exectutive VP of operations for systems integration and enclosures.

Plexus • named Steve Frisch its EMEA regional

president.• will begin construction on 160,000-

215,000 SF manufacturing facility in Oradea, Romania, in 2011.

Probe Manufacturing secured $475,000 medical device manufacturing contract.Rimaster AB opened a customer service office in Belgium to serve Germany, France and the Benelux markets.Robat UK appointed Sean Eley sales director.Saline Lectronics purchased a FX-3 XL chip shooter from Juki.Sanmina-SCI division Viking Modular Solutions’ Foothill Ranch, California,

facility earned AS9100 Aerospace certification.Scanfil EMS Group merged with Ojala-Yhtyma.Selteka invested in Momentum paste printer from MPM Speedline.Seprolec:• moved into the business park ‘Les

Neuvillières’ in Vire, France.• purchased new Viscom AOI inspection

S3088-II.Shinsei Denshi established a PCBA factory in Cikarang, West Java.SMS (Woburn, MA) ended operations.SMT-ASSY Electronique added a desktop AOI system from MIRTEC.SMTC • achieved ISO 13485 certification at its

San Jose, Toronto and Mexico facili-ties.

• added 5DX x-ray, AOI and flexible SMD placement equipment in San Jose, California.

Spinner GmbH reorganized and changed its name to WiRan Sp. z o. o. and became independent.Stellar Manufacturing relocated from North Andover, Massachusetts, to Haverhill, Massachusetts.Syrma Technology added 20,000 SF and 200 jobs in Tamil Nadu, India.Uni-source Assembly is building a $1.2 million plant in Amery, Wisconsin.Victron added full suite of services from PCBA to system assembly and order fulfillment logistics in Rosarito, Mexico.Wistron will hire 1,000 workers for newly expanded Brno, Czech Republic, operations.YAMAHA installed an entire SMT assembling line from screen printing to final inspection at its Hamamatsu plant.ZyXEL Communications will spin off its ODM business unit as an independent company, Mitrastar Technology on January 1, 2011.

Materials & process equipmentTotal “cumulative” installations of direct imaging (maskless) systems may top 800-850 units by year end 2010.—Dr. Hayao NakaharaGlobal market for SMT equipment will exceed US$5.5 billion by 2015.—Global Industry AnalystsAdeka began mass production of its cerium-free etchants.APS Novastar introduced SMTrue smart feeders for its vision-based automated pick & place machines.Arlon introduced MultiClad HF halogen-free, low-loss multilayerable thermoset laminate and prepreg for microwave and

high-frequency PCBs.Corning received a FlexTech Alliance grant to develop commercially viable methods for continuous production of printed electronics on flexible glass substrates.DEK and Irisys developed a robust, fine-pitch, isotropic conductive adhesive interconnection process.Dow Chemical chairman and CEO Andrew Liveris was named president of International Council of Chemical Associations.Dow Electronic Materials is building a new manufacturing site in Zhangjiagang, China to expand capacity for its PCB, electronic and industrial finishing, and photovoltaic markets.Endicott Interconnect Technologies introduced new LCP laminates.Furukawa Electric developed solderable aluminum wire.GE Healthcare acquired Orbotech’s medical solutions business.Hary Manufacturing acquired AMI Precision’s screen printers and automatic printing systems assets.Henkel is expanding adhesive production in Central and Eastern Europe and investing EUR 14.7 million in a new production facility in Tatabánya, Hungary.Hover-Davis appointed Lance Dumigan business development manager.Indium named Karthik Vijayamadhavan technical manager in Europe and Todd Ellenor metallurgical process engineering manager.IPTE began shipping MaxPan4 PCB panelization machines.Isola Group celebrated its 50th IPC membership anniversary.Iteq plans will build new production base in Xiantao City in Hubei, China.MacDermid implemented a metal surcharge on selected products in the Greater China Region.Maskless Lithography named Hakuto its exclusive Asian distributor.Milara named Technica, U.S.A., its representative for the West Coast and Colorado.MIRTEC appointed Techmet as its exclusive distributor for South Africa.MPK Kemmer PCB Tools named Global Technology its exclusive representative in Italy.Nihon Superior merged its existing technology center with its newly opened R&D center in Osaka, Japan.Nordson: • acquired Micromedics.• promoted Greg Wood to VP of its

continued on page 44


Addressing package advancement challenges with innovative contactor probe technology

Rapid growth and usage of electronic applications is ripening the need for wide-scale electronics manufacturing. This, in turn, will develop the need and demand for electronics and semiconductor manufacturing in India in the long run.

As per the ISA-Frost & Sullivan India Semiconductor Market Report 2009-11 update, the India semiconductor market grew 15.6 percent in 2009. Telecom infrastructure development related domestic semiconductor consumption is likely to grow by a massive 132.5 percent from 2009 to 2011.

The report states that wireless handsets, 3G networks, WiMax, notebooks, set-top-boxes (STBs) and smart cards will primarily drive the semiconductor market in India. So far so good!

Now is the time to gaze into the crystal ball, so to speak, and try and judge what the coming future will look like for the Indian electronics manufacturing industry.

lot more needs to be done!A lot more needs to be done to really and significantly boost electronics manufacturing in India. For instance, products have to be designed and produced in India, ‘right’ policies must be created, export-import procedures need to be eased, and so on.

Vivek Sharma, regional VP, Greater China & South Asia region, India Operations and director, India Design Centre, STMicroelectronics, says, “The real need at the moment is to boost the industry by incentivizing and developing the right policy framework, and by promoting products that are specifically designed for India.”

Industry leaders also feel there is a need to create right policies and ease the

import and export procedures to provide the required impetus for electronics manufacturing.

Adds Neeraj Paliwal, managing director, NXP Semiconductors: “It still takes weeks to get consignments out of the clutches of customs, and this is the biggest bottleneck. The customs department needs to be transparent and modernize their systems. To compete with world class manufacturing, infrastructure facilities like power, roads and ports should be upgraded. These issues should be tackled on war footing.”

The cost for electronics manufacturing is still quite high as compared to China, feels Paliwal. “The technology in itself is not as advanced. Electronics manufacturing has reached a high level of automation, which makes it feasible to reduce cost. This is also the reason why it may not be economically advantageous to have this in India as the process is

What’s the future of the Indian electronics manufacturing industry?


Pradeep Chakraborty & Usha Prasad

“The real need at the moment is to boost the industry by

incentivizing and developing the right policy framework.”—Vivek

Sharma, STMicroelectronics

“The growth drivers for electronics manufacturing in India are wireless handsets,

communications, IT and office automation, which together will account for almost three-fourths

of both the semiconductor TAM and TM by 2011.”—

Poornima Shenoy, ISA

“If we focus on enabling the top two applications in

local manufacturing then we can boost local electronics

manufacturing in a big way.”—Sanjeev Keskar, Sierra India



not labor-intensive. However, low end PCB manufacturing and assembly is still possible to be done in India.”

He calls for extending additional support to locally manufactured products—in terms of tax concessions, faster logistics and import of components.

Key issues that need to be addressedAs per the ISA-Frost & Sullivan update, the manufacturing index of three major market segments was less than 50 percent in 2009. While IT and Office Automation is at 32 percent, telecom at 28 percent and consumer electronics at 41 percent. These three segments contribute to $3.3bn out of $5.4bn of the total market (TM) in 2009, which is more than 60 percent of the TM.

“If we focus on enabling the top two applications in local manufacturing from the above mentioned three market segments,” says Sanjeev Keskar, managing director, sales, PMC, Sierra India, “then we can boost local electronics manufacturing in a big way.”

Poornima Shenoy, ISA president, cites establishing a National Electronics Mission, promoting existing clusters and creating new ones, encouraging products specifically designed for India, creation of an R&D fund, creation of a manufacturing value addition fund, rationalization of tax structure and promoting skill development as some of the key issues that need be looked into to boost the electronic manufacturing industry in India.

Shenoy highlights the current growth drivers for Indian electronics ecosystem as following:

• Growth in per capita income and corporate spend on electronics.

• Government focus on infrastructure.

• Increasing spend on IT equipment.• Need for innovative products at

low cost.• Intellectual property (IP) in India.

Developing next generation IpWhen we talk of IP, we should understand that the only community that can perhaps develop IP for the next generation is the academia and institutes. This was stressed by Dr Rajat Gupta, managing director, Beceem Communications Pvt. Ltd., during CDNLive India 2010 University Conference in Bangalore.

India is known to be an attractive market. Its 50 million+ middle class can well become the preferred target

for all product companies in the world. In this context, what can the academic community do to stimulate product development in India? How can they engage in early technology development?

Gupta highlighted the need for understanding the multiple layers involved in IP creation. For instance, he said that, in foundation IP, standard cell library and I/O library are at the core. “Once you start building, people will realize that there are lots of interesting things to learn.”

esDM in IndiaNow, there has been a lot of talk about electronics system design and manufacturing (ESDM) in India over the past one year. Instead of being “easier to say, but difficult to manage,” the ESDM initiative should boldly reflect the message—“Electrifying start to dreams of many (in India)” with suitable action! ESDM’s real test has just begun! A clear roadmap needs to be in place to achieve sustainable growth ahead.

Paliwal says: “Competencies and expertise are still bifurcated into hardware (board), VLSI (IC) and software. System design expertise is still extremely rare. There is a need to focus on system architecture and design competencies in academic institutes, and Special Manpower Development Programme (SMDP) is the need of the hour. The design ecosystem is well maturing, while a lot needs to be done on the manufacturing ecosystem perspective.”

According to Ernst and Young Strategy Report on India “Electronics Systems, Design and Manufacturing Ecosystem,” currently the demand in the Indian market stands at $45 billion and is projected to grow to $125 billion by 2014 and $400 billion by 2020. The report states that India currently employs 4.4 million people in the electronics industry, which will grow to 16.1 million in 2014 and 27.8 million in 2020.

Adds Keskar, “We are already doing well, and we are the leader in semiconductor VLSI design/embedded software and hardware development. The

area for improvement in manufacturing, as mentioned above, is that we need to have focus initiatives to attract/enable local manufacturing of high volume and high growth products in India.”

likely hot areas in Indian electronics sectorMobile devices, STBs, personalized healthcare devices such as glucose meters, BP monitors, digital thermometers, and audio/video devices like MP3 players, identification (RFID smart cards) and automobile immobilizer applications are some hot areas that will grow significantly in the coming year.

“Consumer products and mobile phones—owing to their major consumption demand, and industrial products, due to scope of local value addition, also add to the list,” says Paliwal.

As per ST’s Sharma, the hot areas for electronics sector in 2011 include:

• Communication infrastructure and wireless handsets.

• Computers—desktops, notebooks, servers, memory, printers, etc.

• Consumer electronics—STBs, LCD/LED TVs etc.

• Industrial applications—energy metering, power inverters etc.

• Lighting.

Top five trends for 2011As per NXP’s Paliwal, the top five trends will be:

• More system level design and development from IP/block level design and development.

• More designs for local/emerging applications rather than for US/Europe.

• More designs/products towards green energy (solar, wind etc.).

• Big players like Philips/Siemens/GE conceiving and developing low cost individual products in emerging countries—a move from big hospital equipment—leading to use of more ICs.

• Mobile and portable devices pushing up usage of ICs in audio, video and sensor application domains.

According to Sharma, the top trends in 2011 will focus on:

• Growing local markets and rising consumption levels.

• Emerging entrepreneurship activity and innovation.

• ESDM.

India’s 50 million+ middle class can well become the preferred target for all product companies in the world.



• Leapfrogging technologies.• Products “Made in India” for

India.

According to Keskar, the hot areas and top trends in the Indian electronics scenario is based on each one of the market segments.

IT and office automation: Netbooks or smart books for Internet access.

Telecom: This is the fastest growing segment with 3G and BWA infrastructure deployment. Also, the government’s initiative toward broadband penetration will drive growth in new applications like GPON.

• Mobile phone: With 3G, demand for smartphones will be very high.

• Consumer: LCD/LED TV will be driving growth of consumer segment.

• Automotive: Products/applications development for hybrid vehicle or electric vehicle will be a large opportunity.

• Industrial: Alternate energy, solar and LED lighting will be growth drivers.

outlook for Indian semiconductor/electronics industry for 2011The global semiconductor industry has recovered after declining by around 9 percent in 2009 from 2008 levels and is growing in 2010. As per industry estimates, it can reach close to a level of the $300 billion mark in 2010. This would result in over 25 percent growth in 2010 from a year before—surely, a very robust bounce back.

According to ST’s Sharma, the Indian semiconductor industry showed much more resilience. In 2009, it grew by around 15 percent as per ISA-F&S Sullivan report and is forecasted to grow by 20 percent in 2010. The resilience issupported by the fact that there is still a large discrepancy in local consumption levels as compared to world consumption levels.

For example, electronics consumption levels in India are still in the range of around 3 percent of world’s consumption, whereas it has over 16 percent world’s population living here, which ensures that the local growth levels remain higher than world growth levels.

“This demand is fuelled by fast growing applications in various domains such as wireless handsets, consumer goods including LCD/LED TVs, STBs, industrial applications such as energy efficient lighting, automotive, computers and peripherals, etc. Also, fast emerging new economies and rapidly rising consumption levels in countries such as China and

India have helped in the recovery of this segment from the downturn of last year,” says Sharma.

However, Paliwal at NXP says that “the focus will be on more design and development of IC and embedded systems from specs to prototypes. We cannot anticipate much change in the manufacturing issues and also no major IC or solar fab will come up in near future.

“Semiconductor manufacturing is still quite some years away. This is mainly due to the fact that infrastructure is not to a level that is required for semiconductor industry. We lack readily available skilled labor in this area. Competency in the TPE and failure analysis area is not that strong, which is required for any semiconductor manufacturing unit. In addition, the investment required is very high and it is difficult to compete with sites like Singapore and Taiwan.”

ISA’s Shenoy notes that “the growth drivers for electronics manufacturing in India are wireless handsets, communications, IT and office automation, which together will account for almost three-fourths of both the semiconductor TAM and TM by 2011.”

According to the ISA, the semiconductor products that are likely to drive revenues are:

• Memory driven by intelligent consumer electronic appliances—the need for higher memory capacities in telecom infrastructure equipment and the usage of higher capacity add-on cards in imaging products;

• ASSP (application specific standard products) driven by SoC (system-on-chip) solutions for handsets rapidly growing markets of LCD TVs and LCD monitors; and

• Microprocessors driven by wireless handsets and telecom equipment.

I was looking at a mailer from one of the industry consluting groups about an upcoming event. Some of the trends to be discussed include:

• Netbooks will sell roughly 35 million units in 2010. How close to zero will tablet computers reduce this in 2011? What will happen in 2012?

• What effect will new processors from Intel and AMD have on the PC market?

• Is FTTC just one more attempt to strangle user demands for decent bandwidth? How long can the Internet backbone take the growth in traffic?

• Where is the server and cloud computing going? Welcome to the 400-pound gorilla that doesn’t care what Microsoft or Intel think!

• With the success of LED backlit TVs, are OLED TVs a dying breed?

How many of these products will be actually manufactured in India? Will we see Indian giants along the lines of Huawei or ZTE? Will some high-end research activities get triggered off in India in 2011?

We will be closely monitoring the trends and segments as the New Year unfolds. Looks like it will be an interesting 2011! Happy new year, everyone!

Pradeep Chakraborty is publisher and author of Pradeep Chakraborty’s Blog, and

Usha Prasad is co-author and associate, Pradeep Chakraborty’s Blog.

Electronics consumption levels in India are still in the range of around 3 percent of world’s consumption, whereas it has over 16 percent world’s population.


Title

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Addressing package advancement challenges with innovative contactor probe technology

In 2006, Juki started its direct operations in the SMT business in India. How has your journey been so far? The last four years have seen the consolidation of our business through effective after-sales service and application support. We have been building our image as one of the major players in India.

To this effort, we now stock spare parts in India worth Rs. 4 million. This enables us to give quick responses to customers as and when they require.

Our engineers are sent to Japan periodically to upgrade their knowledge and improve their service ability and quality. It enables us to offer high quality service to manufacturers.

Can you give us an overview of the prod-ucts offered by Juki India? What is the installed base of Juki machines in India to date? We have various models of machines, starting from an entry level JX 100 to a high-speed chip shooter capable of 74,000 CPH and the latest models of KE 1080 AND KE 2080 Flexi mounters.

As of today, we have an installed base of about 180 machines in the market. In the last four years, we have added about 125 new machines to various segments of the industry.

Juki competes very successfully in the high-volume and mid-volume market. What do you offer customers at entry level? As I have mentioned earlier, our JX 100 has caught the imagination of the Indian customers, and it is priced very effectively. The JX 100 is also sought after in the manufacturing of LED, CFL, battery chargers and small EMS. This model helps

Interview—N Chandramohan, Juki India Pvt. Ltd

Interview

Juki, the surface mount technology (SMT) giant from Japan, is a name to reckon with when it comes to global installations of pick and place machines. With more than 180 machines installed in India and 20,000+ installations worldwide, Juki is a clear leader. Debasish Choudhury spoke with N Chandramohan, country head (SMT Division), Juki India Pvt. Ltd.


Interview

us introduce our brand to these customers and give them access to the JUKI quality and service experience.

At the productronica India 2010 show in Bangalore, JUKI India launched the latest award-winning FX-3 pick and place machine. What kind of customer response you have received so far? The response from the show has been overwhelming. The FX 3 and our FX2 attracted a lot of attention. The new FX-3 modular design places up to 60,000 CPH (IPC spec), featuring multi-nozzle laser heads for components ranging from 01005 to 33 mm sq. We have many enquiries for these now. Most of the customers of FX3 are large volume customers where they are looking for a high-speed chip shooter that also offers flexibility.

The LED sector has emerged as a poten-tial high growth area in the electronics industry. Do you have any solutions for this segment? For LED, we can offer JX 100 at entry level and also we can offer FX 3XL for high-speed mounting. Recently, 20 FX 3XL machines were sold to a single customer in Germany who is a large manufacturer in

the LED business.

Selective soldering has grown substantial-ly in recent years as manufacturers find it much more versatile for the high-mix environment. What does JUKI offer in this area? Unfortunately, Juki India does not currently offer this product range in India. These are available only in Europe and USA.

What technology trends in the placement process are you seeing today? In the past, speed and CPH were important to customers. Now customers are looking at yield and accuracy with a focus on zero defect and first-time yield. We have introduced new software to tackle small chips for high accuracy placement. It’s called OPASS—Offset Placement After Solder Screen Printing. This helps ensure accurate placement even if the solder printing is misaligned.

What are the strengths of Juki vis-a-vis its competitors in the Indian market? Each of the competitors has their own strengths. JUKI’s concept of modularity, ease of use and its lowest cost of ownership

have made us one of the largest players in the world market.

How do you rate India’s SMT market compared to other emerging markets in the SE Asia? Indian market has shown the potential, but is yet to deliver the volumes. There is hope that in the next couple of years it will grow faster than what is expected.

—Debasish Choudhury

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Tel: +91-11-27855016, 27854247, Fax: +91-11-27854247email: [email protected], Vinod Aneja: +91 9811016242


Lighting the way: LEDs in SMT production

Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable solutions for its addition into today’s electronic devices. LEDs have become an alternative light source to conventional incandescent and fluorescent bulbs. The electronics manufacturing industry sees the greatest benefits from the small size and lower power consumption of today’s LEDs.

There also is the recent trend to “go green” and use “green technology” in consumer and commercial electronics. LED components offer high brightness and power efficiency for electronics manufacturers. LEDs also offer lower

carbon emissions than traditional technologies such as incandescent and halogen lighting. This aspect has made LED lighting popular with government organizations, which are now installing LED lighting in public places and government offices worldwide.

When used for illumination purposes, LEDs are more cost-effective than traditional lighting sources. Thus, the global LED component market is witnessing an increasing demand. As a result, companies in the surface mount technology (SMT) industry are expanding their manufacturing capabilities to meet this demand. High brightness LED

Keywords: LEDs, Pick and Place, Automating Assembly, Component Handling, Scaling Production

With demand growing for LEDs in consumer and commercial electronics, companies in the surface mount technology (SMT) industry are expanding their manufacturing capabilities to meet it. The range of new and potential applications for LEDs in electronics is practically endless. In order for electronics manufacturers to get these LEDs into their products, they must use one of two methods: hand assembly or automated assembly. This article discusses the challenges that EMS companies face when trying to place LED components in SMT production.

Zachery Shook, Count On Tools, Inc., Gainesville, GA, USA




components currently are experiencing high growth as the backlighting application in TVs is shifting from traditional CCFL technology to LED technology. The range of new and potential applications for LEDs in electronics is practically endless.

In order for electronics manufacturers to get these LEDs into their products, they must use one of two methods: hand assembly or automated assembly. Hand assembly is where skilled technicians carefully place individual LED components onto circuit boards using specialized tooling. This is a long, tedious process that can slow the production rates of electronic devices and tie up major labor resources. On the other hand, automated assembly uses the company’s existing SMT equipment to quickly and efficiently place thousands of LED components every hour. Most SMT equipment is capable of placing multiple components on a circuit board at one time, increasing the overall production rates while decreasing labor costs. Obviously, the goal of a high-volume electronics manufacturing company would be to transition assembly into automated production.

No SMT equipment can place components accurately or run efficiently without quality nozzles and feeders. These two factors are the core of the pick-and-place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result. An increase in defects means a decrease in production, costing the company more money over a short period of time. Proper feeder and nozzle selection is critical, especially with the current market growth and technological advancements in SMT equipment.

At first sight, the principle of using vacuum pressure and precision nozzles to enable component placement are basic and straightforward. It is a process that is repeated in every type of SMT equipment. There are five distinct stages of the pick-and-place process:1. Picking—components are withdrawn

from a feeder or tray by a vacuum nozzle.

2. Holding—components are steadied for rapid movement while the machine detects proper alignment.

3. Transport—components are transferred from the picking location to the PCB for assembly.

4. Placement—components are lowered to their specific location on the circuit board.

5. Release—components are released by the nozzle, which returns to the picking area to restart the process.

Nozzles are the first and last thing to touch all components placed, and they move tens of thousands of these parts every hour. With components sizes reaching microscopic proportions, nozzle manufacturers must strive to maintain precision tolerances and exact dimensions in their designs. These nozzles are required to hold the part during transport to the board while the machine is moving and/or rotating at high speeds. Electronics manufacturing service (EMS) providers must use this technology to get LED components into their customer’s products.

Debron Industrial Electronics, Inc., is an EMS provider specializing in high-technology electronic assemblies, printed circuit board assemblies, electronic wiring, cable assemblies and box build. The company caters to several customers specializing in cutting-edge LED technologies, who rely on Debron’s expertise to develop, document, implement and sustain their manufacturing processes. When one of the company’s customers needed a product that required the placement of LED components in its design, Debron decided to move forward with the automated assembly process.

Since making the transition, Debron has helped several of its customers to fully automate the production of products that previously had been assembled by hand. The company was able to do this by creating custom pick-and-place trays for LEDs that were available only in bulk for hand assembly. Debron also has been working with tooling companies such as Count On Tools to develop custom pick-and-place nozzles that enable LEDs to be picked, vision centered and placed with high-speed, automated SMT assembly equipment. Streamlining the automated placement process has allowed Debron to free needed manpower to use in other areas of the assembly process.

As with any new project, there are some challenges associated with the placement of LED components in the SMT production environment. It is the goal of the EMS provider to overcome each of these obstacles to cut production costs and provide quality product to its customers and their end users. Some of the major challenges that EMS companies face when trying to place LED components in SMT production include:

1. Component handling in the feeder. During the picking process, LED components are withdrawn from the feeder by a vacuum nozzle. SMT technicians must ensure that the LED components are correctly positioned in the feeder pocket to guarantee that pick-up is achieved and that the LED is properly handled during the transport stages. Slop in the pocket may require nozzle centering during the picking process while excessively fast advancements of the feeder may skew the part in the pocket, preventing component pick-up.

2. Component handling on the nozzle and proper nozzle selection. Some LED technologies, such as CREE® LED components, require special handling operations to prevent damage to the optical lens. They must avoid placing mechanical stress on the LED lens by not touching the optical surface during the component picking or placement processes. This eliminates the possibility of degraded performance from the LED after the circuit board is assembled. Proper nozzle selection also is important for the transport and placement processes. Not only does the SMT nozzle have to pick the component, it also must move

Figure 2. LED nozzle.

Figure 3. LED nozzle.



it to the board and accurately place it. Most LED suppliers work directly with nozzle and tooling manufacturers, like Count On Tools, to develop nozzle designs that meet their individual process requirements.

3. LED sensitivity. The fragile optical surface is not the only issue with the use of LEDs in SMT production. Early LED designs were very temperature-sensitive, forcing assembly using unconventional methods, such as hand assembly. LEDs often were bonded to heat dissipative substrates using

conductive epoxies or low-temperature solders. This required special assembly processes that lengthened the manufacturing process, increasing product build costs.

4. Scaling up to high-volume production. As LEDs become more robust, assembly via means of more conventional assembly processes, such as automated SMT equipment, allows EMS companies like Debron to focus on other challenges, such as repeatable part picking and vision centering, as well as effectively increasing

throughput and minimizing defects. Repeatable performance is the major challenge with scaling up to high-volume production. EMS providers must strive to maintain a high level of performance to keep their production on track to meet customer demands. This requires fine tuning the assembly process.

As with any problems in a production environment, there is always a solution. By capitalizing on its current knowledge of SMT production and partnerships with quality suppliers, Debron was able to overcome most of the challenges associated with this process. Debron developed custom trays for the LED components to allow for more accurate picking and transport processes while eliminating issues with component handling in the feeder. It also worked with its equipment manufacturers and custom tooling manufacturers such as Count On Tools, Inc. to develop custom SMT pick-and-place nozzles that increase LED/nozzle compatibility, allowing for greater placement accuracy and increased throughput.

Due to the partnership with Count On Tools, Inc., Debron was able to fine tune its automated assembly process and scale up to high-volume production of LEDs. Using the custom nozzle that it purchased from Count On Tools, Inc., Debron was able to reduce LED fallout to 2.3 percent. Defect rates dropped significantly and first pass yields increased steadily up to 99.4 percent.

The latest LED technology opens up wide areas for new applications, new technical possibilities and reduced costs in both the SMT and electronics manufacturing industries. Today, many companies are crossing traditional business boundaries and streaming into the LED lighting market. This, in turn, has created a large demand for LED use in general markets and not the traditional niche applications. By partnering with component manufacturers and nozzle/tooling suppliers, EMS companies like Debron can guarantee success by lighting the way for customers seeking LEDs in their SMT production.

Figure 4. CREE LED component.


Medical electronics—manufacturing potential, challenges & roadmap


Show Report

electronica India and productronica India, held from September 7-10, 2010 at the Bangalore International Exhibition Center (BIEC), witnessed an overwhelming response from the Indian and international electronic industry. Once again, the fairs stamped their authority by being the largest trade fairs for electronic components, assemblies, materials and production equipment in the South East Asia.

This year, the show attracted 331 direct exhibitors and, with represented companies, totalled 869 exhibitors, which showed an increase of 21% participants. The total exhibit space covered an area of 13,000 sqm., with dedicated display space for production technologies and electronic components in two separate halls in BIEC, a significant 30% increase in exhibition space over the previous year. The exhibitors were mostly satisfied with the quality as well as the quantity of visitors. According to the organiser, MMI India, the show attracted over 12,245 visitors, which means an increase of 18% visitor turnout.

“Bangalore should become the electronics hardware capital of India,” said Ananth Kumar, Member of Parliament and former Union Minister for Urban Development, Government of India, while speaking at the show’s opening press conference. “Bangalore should not only be

known as the software capital and Silicon Valley of India. India also needs hardware parks, besides software parks.” India needs hardware parks that should be more like multiplexes. India and specifically, Karnataka, has a major role to play in developing a strong electronics hardware industry and become a key global player. Ananth Kumar cited

some figures, mentioning that hardware production and exports mainly emanated from three areas: Bangalore, Delhi and Mumbai. Of the $40 billion worth of exports of hardware from India, $10 billion came from Karnataka, while Mumbai and Delhi accounted for $15 billion each. Besides inaugurating the show, Ananth Kumar also made a tour and expressed his satisfaction at the participation of large number of international exhibitors in electronica India and productronica India 2010 show.

This year’s exhibitors came from over 25 countries, with a strong presence from Japan, Switzerland, USA, Italy, Spain, Korea, Malaysia and Hong Kong. Germany, UK, China, Singapore and Taiwan were represented with their own Country Pavilions at the show. The Indian Printed Circuits Association (IPCA), a strategic partner of MMI India, increased its exhibition space by 55% at this year’s show.

The exhibition also witnessed high participation from key international companies. Among others, Agilent Technologies, American Tec, ASYS Group, Bergen Associates, Bergen Systems, EMST Marketing, EPCOS, iNetest Technologies, Infineon technologies, Juki India, Leaptech, MAXIM SMT Technologies, NMTronics, NXP Semiconductors, RS Components, TATA Power, TYCO Electronics and SONY displayed their state-

of-the-art technology and products.

The show featured a special focus area on LED and solar technologies. There were also two high profile international conferences conducted at electronica India and productronica India. The “Conference on Contract

Manufacturing: The Indian Perspective” held on 7th September 2010 saw delegates from companies like National Instruments, Indium Corporation, Atotech, Firan Technology and HCL Technologies, to name a few. They discussed various topics on trends, new technologies, opportunities and requirements of the Indian EMS/contract manufacturing industry.

The second conference on 8th September 2010, the “Symposium on the Trends and Future Requirements in Automotive Electronics,” had delegates from Freescale, Infineon, TYCO, First Sensor, Mahindra Satyam, Robert Bosch, AUTOSAR, NXP, Atrisys and TATA Motors speak at the conference. Over 145 delegates attended both conferences.

Already 42% of the exhibitors have rebooked themselves for electronica India and productronica India 2011, a great success on which Norbert H. Bargmann, Deputy CEO of Messe München International commented: “Having seen the response to this year’s edition of the exhibition, India is emerging as an important port of call for companies from around the world. This country has one of the fastest growing economies of the world and has made its presence felt in the international trade fairs and exhibition industry.”

“With the high growth that the electronics sector has witnessed, as well as the huge opportunity over the past few years, platforms such as electronica

India and productronica India will play a vital role in the future of this industry,” said Mr Darryl Dasilva, CEO Messe München International India. “It is an absolute pleasure to be able to organise one of the biggest events in this sector, and I look forward to many more successful years in the future with the support of our

participants.”The next electronica India and

productronica India will take place in New Delhi from September 13-16, 2011 at Pragati Maidan, New Delhi.

electronica India & productronica India 2010: Undoubtedly the numero uno business platform in South East Asia

electronica India & productronica India 2010: Undoubtedly the numero uno business platform in South East Asia


Held from 13-15 September at the all new venue of Sands Expo and Convention Centre in Singapore, the 10th edition of GlobalTRONICS 2010 saw 30% more new products on showcase from 50% of the exhibiting companies. Long recognised as the show not to be missed by the industry professionals in Southeast Asia, GlobalTRONICS 2010 has reinforced as the perfect platform for industry professionals to gain first-hand experience on more than 81 new products and services that were launched in the market, all under one roof.

This year, 53% of the exhibiting companies were first-timers at GlobalTRONICS. These companies were participating alongside repeat exhibitors such as BTU, Chip Hua, Dou Yee, Fuji Machine, Long Shine, Tamura, TransTechnology and Trimech. Also on display were green products from 29 companies, photovoltaic products from 9 companies and semiconductor products from 19 companies at the show.

“The recovery in the market is evident with more new products being introduced at GlobalTRONICS this year,” said Michelle Lim, managing director of event organizer Reed Exhibitions. “We are also happy to note that there are 237 companies from 22 countries at GlobalTRONICS, with international presence from China, Germany, India, Japan, Malaysia, Singapore, South Korea, United Kingdom, United States and Taiwan.”

The major highlight of the show was the Printed Electronics Conference, with the theme “Emerging Opportunities in

Printed Electronics—Product Design and Manufacturing,” which was held alongside the exhibition on the first day. It was a first time collaboration with SIMTech and SPRING Singapore. Ten companies also showcased their printed electronics products and capabilities in the Printed Electronics Showcase held alongside the conference.

Another learning platform at GlobalTRONICS was the Supply Chain Security in Global Logistics Conference organized by Singapore Institute of Materials Management (SIMM), held on the second day. Participants could understand more about supply chain security issues that global players in logistics industry are facing and learn about issues faced in supply chain security, supply chain security implementation and the ISO standards for supply chain security. Prominent speakers included Danny Tan from Llyod’s Register, Jason Teo from Infineon Technologies Asia Pacific Pte Ltd, Jerry Tng from Global PTM Pte Ltd, Mohamed Feroz from Singapore Customs, Roman Luth from Schenker Asia Pacific and Seow Aik Meng from IBM Singapore

Pte Ltd.“GlobalTRONICS is established

and well-recognised as the electronics manufacturing event for the industry,” said Wim Van Riet (CEO) from Interflux Singapore Pte Ltd & DIMA Group Asia Pte Ltd. “We do not want to miss out on it, and with the market recovery, it is timely for us to participate in this exhibition for the first time. GlobalTRONICS is a barometer for us to test the Southeast Asian market.”

According to the organisers, GlobalTRONICS 2010 attracted over 5000 attendees over three days. The next edition of GlobalTRONICS will be held from 19-21 September 2012 at SUNTEC Singapore.

Show ReportShow Report

10th edition of GlobalTRONICS hosted over 50% new exhibitors

10th edition of GlobalTRONICS hosted over 50% new exhibitors

New trade show for Indian electronic industry to launch in 2012Reed Exhibitions India, organiser of COMPONEX NEPCON India 2010, and the EFY Group announced plans to launch of a brand new trades how for the Indian electronics industry. The new event, which will be held in February 2012, will combine the strengths of Componex Nepcon India and Electronics For You Expo, trade show brands owned by Reed Exhibitions India

and the EFY Group respectively.The new trade show will offer the

Indian electronics industry the best choice of global and local manufacturing and technology as well as a number of educational and practical opportunities including live demo lines, conferences and workshops, product and technology showcases and roundtable events.

The new event will be officially announced on 17th February 2011 to coincide with the start of Electronics For You Expo 2011, which will be held from 17-19 February 2011. “Since we’ve tied up with EFY, we’ve decided not to conduct our 2010 edition of Componex Nepcon, but to move our exhibitors to EFY Expo 2011.”

Title


seho solder nozzles reduce process-related soldering defectsSEHO Systems GmbH expanded its range of nozzle geometries for wave soldering machines.

SEHO’s range of nozzle geometries provides the ideal nozzle concept for every application, from single solder nozzles to a combination of different nozzle geometries. The nozzles significantly reduce typical soldering defects such as insufficient fillings, open solder joints and soldering bridges.

All SEHO solder nozzles are suitable for processing lead-free solder alloys. The nozzles can be changed quickly via bayonet couplings in order to minimize retooling and maintenance times. www.seho.de

BpM Microsystems offers 8th generation automated programming solutionBPM Microsystems is releasing its 8th generation automated programming system, the model 3800. The model 3800 supports microcontrollers, NAND flash, NOR flash, Serial flash, Managed NAND flash, E/EPROM, flash EPROM, and other technologies with densities up to an 8 Eb theoretical limit.

The model 3800 uses the same design as BPM Microsystems’ 3000 series device handling system. Integrated into the 3800 is the LaserAlign™ sensor from CyberOptics®, which assures repeatable pick-and-place accuracy and high performance during the programming process. www.bpmmicro.com

MyDaTa boosts performance remotelyMYDATA is offering a new service, MYRemote Performance. The service is available to all MYDATA equipment users, and operates on a twelve-month contract. It includes an initial on-site audit of the user’s machine lines, feeder inventory, current methods of working and jobs. Once this audit has been completed, monthly reports are electronically sent to MYDATA, where they are analyzed by SMT engineers.

As an additional benefit for users, MYDATA provides a quarterly report, including historical performance data and details of improvements that have been gained. www.mydata.com

scs precisioncoat features new potting capabilitiesSpecialty Coating Systems announced that potting capabilities are now available on the SCS Precisioncoat spray coating and dispense system.

The Precisioncoat potting platform dispenses potting materials in a wide variety of applications to seal, stabilize and/or protect applications throughout the automotive, electronics, energy, lighting, industrial and military/aerospace industries.

The PC-controlled system allows users to control the volume of material dispensed. The potting platform can be configured with one head or multiple heads, and can dispense one- or two-part materials. www.scscoatings.com

Manncorp’s new defluxer/evaporator transforms waste water into safely disposable materialThe Trident III automatic PCB cleaner by Manncorp has been made greener with a new zero-discharge evaporator, the Trident III-ZD. The evaporator processes waste fluid continuously at the rate of 13 gallons per hour and converts it into a disposable substance, and treats lead-free, water-soluble and no-clean pastes.

System intelligence is provided by a Windows® PC with 16-inch touch-screen monitor, wireless network capability and bar code reader. New software permits users to set parameters for wash, rinse and dry. www.manncorp.com

Future-proof and cost-effective: sIplace makes dual-track feeders 01005-capableCompared to standard 8 mm feeders the SIPLACE dual-track feeders feature

New Products

New productsNew Products

seika Machinery introduces offline programming for sayaka saM-cT23Q routerSeika Machinery, Inc., announced that offline programming is available for the Sayaka SAM-CT23Q tabletop router. The SAM-CT23Q offers a fixture–based, highly efficient dust vacuum system, using a 40,000 rpm spindle to separate PCBs from panels. The software allows creation and editing of position and program data, as well as reading of PCB drawing data. Offline programming can save and read data files created with the program, and files can be sent, received and edited by PCs connected to the router. www.seikausa.com


New Products

not only a significantly better price-performance ratio per track, but with the introduction of SIPLACE’s new machine software, the 2 x 8 mm X-feeders are now 01005-capable and feature a corresponding increase in investment protection.

In the future, the dual-track versions of SIPLACE’s intelligent X-feeders will be able to handle the increasing amount of 01005 components, ensuring secure and reliable processing of these components. www.siplace.com

Nordson eFD’s new Backpack™ valve actuator improves dispense valve speed and accuracyEFD has introduced an new device for improving productivity of EFD dispense valves, the BackPack™ Valve Actuator. The BackPack mounts onto the solenoid used to open and close the valve directly

on the valve’s air cylinder, rather than on a separate fixture. This makes it possible to achieve valve actuation speeds as short as 5-6 milliseconds and cycle rates as high as 800 per minute. www.nordsonefd.com

acculogic introduces Flying scorpion Fls940sxi high-performance flying probe test systemAcculogic, Inc. introduces the new single-sided, low-cost version of its successful Flying Scorpion FLS900-series. The FLS940Sxi flying prober delivers the short programming times and high fault coverage of traditional test applications.

The FLS940Sxi adds a lower cost solution to the already powerful Scorpion Flying Probe Tester line, and offers all the test capabilities of the double-sided FLS980Dxi in a single-sided configuration. The Acculogic FLS940Sxi Flying Prober will begin shipping in January 2011. Availability is 6-8 weeks ARO. www.acculogic.com

universal leD-feeder for ThTFritsch presents its upgraded LED-feeder for feeding and cutting through wired LEDs.

The feeder isn’t just used for

placement of wired LEDs on its own machine line, “placeALL®,” but is also compatible with other machine brands, such Samsung machines

The feeder can also be used as a standalone variant; an automatic feed rate starts after the illuminating diode is removed. The feeder controls the direct axis and the cross axis of an LED and provides the next illuminating diode automatically. www.fritsch-smt.com

Full-featured value boundary-scan developers suiteJTAG Technologies announces a new economically-priced software and hardware system for board-level and system designers looking to benefit from a boundary-scan test and programming strategy.

JTAG Technologies’ ProVision Designer Station offers a low entry


New Products

price yet retains key features such as automatic test program generation for interconnections and in-system programming for devices, and is ideal for the preparation of all boundary-scan tests that might be used in the design environment and beyond. www.jtag.com

leD uV curing system for electronic and optical componentsHamamatsu Photonics introduced the new LC-L2 range of UV curing systems. The new addition features higher power UV LEDs, and are highly durable, with a 20000 hour LED lifetime.

When used for UV adhesive curing, the LC-L2 allows curing of electronic and optical components in seconds. The LC-L2 system allows RS-232C computer-controlled curing cycles for different electronic processes. The LC-L2 is also suitable for a variety of spectroscopy and general UV applications requiring high quality, high brightness UV light sources. www.hamamatsu.co.uk

count on Tools offers Manncorp sMT NozzlesCount On Tools Inc. now provides custom

engineered nozzles for the complete line of Manncorp MC-Series pick-and-place equipment.

All nozzles are guaranteed to function properly with the original equipment. Every nozzle manufactured by Count On Tools comes standard with a 100% satisfaction guarantee. If any customer is not 100% satisfied with the performance or quality of a product, Count On Tools will replace it or offer a full refund. www.cotinc.com

BesT Inc launches New rework stencilBEST Inc. has released the new “StikNPeel” single use flexible rework stencils.

These adhesive-backed stencils offer several advantages, such as the improved quality of the paste print as the adhesive holds the stencil coplanar to the board during printing.

These stencils are made from a specialty Mylar material and are available in 4, 5 and 6 mil thicknesses. Each stencil is cut to order. The maximum size of the stencils are 4” x 4,” and are available in packages of (20) pieces. www.solder.net

New MINI hawk imager for direct part mark readingMicroscan announces a new three-megapixel resolution configuration in the MINI Hawk series of compact direct part mark imagers. The MINI Hawk is

designed for reading small 2D direct part marks used in medical device and electronics manufacturing industries. The MINI Hawk makes it easy for electronics and other manufacturers and their suppliers to read these codes. The imager can also consistently read symbols that are damaged, distorted or otherwise challenging. www.microscan.com

FcT assembly debuts no-clean leaded solder pasteFCT Assembly introduces the NC676 no-clean, halogen-free leaded solder paste. The paste is compatible with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes.

NC676 features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. The no-clean paste leaves a colorless residue that is penetrable, maximizing pin testability and results in clear, bright tin/lead solder joints on all common pad finishes. www.fctassembly.com

Dual-monitor option released for ace selective soldering systemsA new dual monitor feature just released for ACE selective soldering machines gives the operator a large, high resolution image of any or all camera functions on one monitor, as well as a larger, easy-to-read display of all machine function or programming screens on another adjacent flat-screen monitor. The dual monitor option provides easier to read process monitoring and better, clearer views of specific soldering sites and more precise setup and alignment. The new feature is

New drive system speeds printing for electronics manufacturingEssemtec introduces its new automatic stencil printer, the Tucano. Compared to other printers of its class, the Tucano provides reliability and price advantages, due to its XY drive system for the vision camera, 2D inspection, stencil cleaning, stencil feeding system and PCB stopper, while only using one single–drive system.User guidance for setting up a new printing process is complete and is supported with easy–to–understand graphics. www.essemtec.com


Title


New Products

available standard on all KISS 104 systems, and is available as an option on Kiss-102 and KISS-103 systems. www.ace-protech.com

ecD responds to increase in vapor phase soldering with pTp® Vp-8 thermal profiling kitECD announced that it has released the PTP® VP-8 thermal profiling kit for vapor phase soldering.

The PTP® VP-8 is a complete thermal profiling solution, using M.O.L.E.® MAP software in combination with the PTP® Vapor Phase profiler from globalPoint ICS GmbH. This pairing provides all the power and analytics needed to characterize and verify the key process parameters for complex, disparate, or high-mass PCB assemblies. www.ecd.com

DeK proactiv revolutionizes paste transfer efficiencyDEK has launched ProActiv, a process technology designed to enable electronics manufacturers to increase miniaturization. Each ProActiv installation contains a control subsystem and a set of squeegees featuring embedded electronics. ProActiv

energizes the paste, causing the paste to be more compliant, and improving the packing density of solder particles into apertures and enhancing the bond between those particles. This transforms solder paste transfer efficiency to deliver incremental improvements in quality, yield and throughput. www.dek.com

christopher associates offers Koki surface mount adhesiveChristopher Associates now carries Koki’s surface mount adhesives. The silica-filled epoxies are ideal for chip attachment during wave solder and double-sided

reflow. The adhesives offer both ease of dispense and high bond strength and are compatible with Fuji, Asymtek, Panasonic, Camelot, Siemens and most other machines. A printable version in DEK Proflo heads also is available. www.christopherweb.com

Multi-seals offers halogen free poly-form flexible adhesive preformsMulti-Seals Inc. introduced the F08 poly-form™—a flexible preform adhesive that meets the International Electrochemical Commission’s halogen-free requirements. Multi-Seals F08 poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass, and the adhesive placement is highly consistent from bond to bond. The durability and flexibility of F08 poly-forms facilitates manual and automated handling and increases production rates. F08 can be pre-shaped in multiform configurations. www.multi-seals.com

Advanced Technology Systems segment in Asia.

Orpro Vision named Wolfgang Runte regional sales manager for Germany.Park Electrochemical appointed George Pinzon director of OEM marketing, Paul O’Neill aerospace business development and program manager and Richard Price technical director—aerospace products.Polar Instruments appointed Neil Chamberlain as signal integrity product manager, in addition to his existing role as European sales manager.SMT International appointed John Snyder as VP to assist with business development for AMTECH solder paste.Taiflex is adding an additional 100,000 SF/month capacity to its current total FCCL capacity of 1.3 million SF.Taiyo America named Haruomi Yoshimoto as president.Technic ‘Advanced Technology Division’ released its Technistan W high speed, pure tin electroplating process for wire plating.Tektronix set up Tektronix Service Solutions as single-source for calibration and repair services.Topoint began trial operations at its drilling plant in Qinghuangdao, China.University of Delaware researchers

developed soy plastics targeted for electronic circuit boards.Vitronics Soltec appointed Seica France its representative and distributor for France.ZESTRON hired Sal Sparacino as technical marketing manager.

semiconductor & other componentsGlobal semiconductor sales are projected to grow at a 13.4% CAGR from $300.5 billion in 2010 to $318.7 billion, followed by an increase of 3.4% to $329.7 billion in 2012.—SIASemiconductor revenues are pointing towards 22-24% y/y growth in 2010 and showing 8-9% expansion in 2011.—IDCSilicon wafer shipments are projected to jump 39% in 2010 but will grow only 6% in 2011.—SEMIGlobal market for power management and driver ICs is expected to grow by 20% to over US$12 billion in 2010—IMS ResearchGlobal sensors market will reach $74.2 billion by 2015.—Global Industry AnalystsSmartphone IC market will grow from $20 billion in 2010 $42 billion in 2014.—IC InsightsWorld connector industry will achieve sales of USD 42,956 million in 2010, an

increase of 24.9% over 2009.—Bishop & AssociatesTop 10 connector makers in 2009 (Bishop & Associates):

1. Tyco Electronics2. Amphenol3. Molex4. JST5. FCI6. Yazaki7. Foxconn8. Hirose9. JAE10. Sumitomo

Walt Custer is an independent consultant who monitors and offers a daily news service

and market reports on the PCB and assembly automation and semiconductor industries. He

can be contacted at [email protected] or visit www.custerconsulting.com.

Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the

corporation’s market research and news analysis activities. Jon is a member of the IPC and active in the Technology Marketing Research Council.

He can be contacted at [email protected].

Holiday wishes for a “normal” 2011— continued from page 27


Show Preview: electronica and productronica India 2010

elcINa-eFy awards for 2009-10 presented in New Delhi The 35th ELCINA-EFY Awards for Excellence in Electronics Hardware Manufacturing & Services for 2009-10 were given away to the winners during the annual presentation ceremony at India Habitat Centre, New Delhi, on 24th September 2010.

Earlier this year, ELCINA entered into a partnership with EFY Group to promote India’s oldest and most valued awards for the electronics industry. From 2010, the ELCINA’s Annual Awards for Excellence in Electronics Hardware Manufacturing & Services is rechristened as the ELCINA-EFY Awards.

The awards were presented by R Chandrashekhar, Secretary, Department of Telecom, Ministry of Communications & IT, who was the chief guest of the evening.

This year’s “Electronics Man of the Year” award went to Ajay Chowdhry, founder—HCL, chairman & CEO of HCL Infosystems, for his immense contribution to Indian electronics and IT industry for over four decades. The other notable awardees were Bharat Electronics Ltd., Elcoteq Electronics (India) Pvt Ltd, Epcos India Pvt Ltd, Jabil Circuits India Pvt Ltd, Sahasra Electronics Pvt Ltd, Su-Kam Power Systems Ltd and Vishay Components India Pvt Ltd.

ELCINA was the first organisation in India to institute annual awards for excellence in electronics, 34 years ago. www.elcina.com

robert D. John re-elected president of elcINa for 2010-11 At the 42nd Annual general meeting and the subsequent executive committee meeting of the association held in New Delhi on 24th September 2010, Robert D. John was re-elected as the new ELCINA president for the year 2010-11. Mr. John is director & CEO of Amphenol Interconnect India Pvt Ltd, Pune. Amphenol. www.elcina.com

Ipc opens India office and electronics manufacturing training facility Extending its training and knowledge-based resources and services to Indian electronics manufacturing facilities on a local level, IPC—Association Connecting Electronics Industries® has opened its first office in India. Located in South Bangalore, close to the well-known Electronics City, IPC India, a wholly owned subsidiary of IPC, will be under the leadership of managing director Mr. Akshinthala Vijayendra.

The initial focus of Vijayendraís activities will be on bringing additional training, conferences and services to India. For three years, IPC and the Indian Printed Circuits Association (IPCA) have worked cooperatively on the Industry Association Training Center (IATC).

Over the next few months, Vijayendra will be responsible for hiring critical staff positions to support IPC initiatives in addition to meeting with representatives from local industry to determine what additional services and resources are needed from IPC. He will also continue to coordinate and support the IATC and will look for opportunities to involve local manufacturing operations in IPC global standardization activities.

The IPC India office is located at #728, 10th Main, 4th Block Jayanagar, Bangalore 560011. Vijay can be reached at +91 (0)80-41570637 or [email protected]. www.ipc.org

The leD manufacturers association, leDMa, officially launched in New Delhi The LED Manufacturers Association (LEDMA), formed in August to address the issues of the growing LED industry and to make people aware of the future lighting technology, was formally inaugurated by the Union Minister of State for Power Hon’ble Shri Bharatsinh Solanki in New Delhi on 22 September 2010.

LEDMA also seeks to draw the Government’s attention towards subsidy for LED lighting products and hopes to help waive-off of taxes as in the case of solar products in the country.

Addressing the gathering Dr. M V Ramanarao, President LEDMA said, “I take this opportunity to say that The Association will regulate the working of

the Indian LED industry to ensure its quality product delivery, adherence to international standards and its success in the long run.”

Along with the inauguration the Hon’ble Chief guest launched the LEDMA website. www.ledma.org

ashwini aggarwal appointed executive director of MaIT MAIT, the apex body representing the interest of IT hardware industry in India, appointed Mr Ashwini Aggarwal as its new executive director. Ashwini comes to MAIT with over 27 years of industry experience, 18 years in Hewlett-Packard in several important and developmental roles. More recently, he has worked with Omnicom Media Group, in their group company CPM India, as vice president, strategic initiatives. An M.Sc. in Physics and Electronics with distinction from St. Stephens College and an MBA from FMS, University of Delhi, Mr Aggarwal has rich and diverse experience in the IT Industry having handled peripherals, personal computers, mini and mainframe computers across consumer and commercial user segments. www.mait.com

Mukund l. shah is new president of Ipca Indian Printed Circuits Association (IPCA) held its Annual General Body Meeting on 9th September 2010 and elected the new office bearers for 2010-11. At the meeting, Mukund Shah of Genus Electrotech was elected as president for the biennium 2010-12.

IPCA will host its annual Expo 2011 - an annual international trade show on printed Circuit Board industry, EMS, allied equipment, products, services and business in KTPO Trade Centre, Bangalore from 3-5 August 2011. The event includes IPCA’s Silver Jubilee celebration on 4th August 2011 as well. www.ipcaindia.org

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The Global Assembly Journal for SMT and Advanced Packaging Professionals

Volume 1 Number 1 Spring 2010

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Global SMT &

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Southeast AsiaSoutheast Asia

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