moxa embedded solution on iec 61850

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    Moxa Embedded Solution on

    IEC 61850

    Moxa SystemsAugust, 2009

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    Confidential

    Theme

    IEC 61850 with Smart Grid

    Substation Automation Empowered

    By IEC 61850

    Moxa Solution Summary

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    Future of Power: Smart Grid

    Everything is now based on electricity Computers, Networks, Telecom, Medical,

    Electric grid produces at least 40% of CO2

    emissions Aging electric grid contributes a 20% power

    loss while delivering to end user

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    Smart Grid Infrastructure

    Electricity Dispatching

    Control Center

    Power

    Generation

    Transmission Distribution

    Substation Automation

    Customers

    Distributed Energy Integrated

    Advanced Metering Infrastructure

    Source: EPRI Intelligrid

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    Substation Automation in Smart Grid

    Electricity Dispatching

    Control Center

    Electricity consumption, switchboard

    operation, information gathering, station

    decision making feedback

    Grid intelligence strategic decision,

    T&D automated management

    Substation

    Source: EPRI Intelligrid

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    Current Power Automation Protocols

    ModBus

    ModBus

    IEC 60870-5

    DNP 3.0

    DNP 3.0

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    Protocol Trend for Power Automation

    Newton Evans: 2005-2007

    IEC 61850 is the

    trend

    54

    4

    6

    52

    28

    6

    28

    2

    10

    16

    12

    10

    12

    6

    0

    20

    40

    60

    80

    IEC6

    0870 -103

    IEC61850 DNP

    Serial

    Modbus

    Serial

    DNP LAN Other

    TCP/IP

    IEC6

    0870 -104

    Current Planned

    Migrating toEthernet-based

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    Future Power Automation Protocols

    ModBus

    ModBus

    IEC 60870-5

    DNP 3.0

    DNP 3.0

    ModBus/TCP

    ModBus/TCP

    IEC 61850

    DNP 3.0

    LAN

    DNP 3.0

    LAN

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    Substation Automation Empowered

    By IEC 61850

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    Benefits of IEC 61850 Power

    Substation

    IEC 61850

    Protocol Integration

    Easy

    MaintenanceTime to Market

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    Moxa Offering

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    Moxa Embedded Solution

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    Lead with IEC61850-3 Certified

    Embedded ComputerDA-681

    DA-681-I-DPP-TIEC 61850-3 Test

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    Using DA-681 in IEC61850-3 Substation

    Requirements IEC61850-3 certified hardware

    Multiple LANs to connect IED device and communicatedispatch control center

    Requires 100-240 AC/DC power input

    19-inch rackmount, fanless design

    Benefits The DA-681 has 6 LANs for network redundancy and

    centralized communication

    Excellent patented heat dissipation design for use in

    -40 ~ 75Cenvironments

    Serial port with isolation protection for integrating legacy RTUinto IEC 61850 substation

    Dual power design to connect simultaneously to 100 VDC and240 VAC power sources

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    Features Briefing

    Intel x86 1GHz CPU with 910GMLE chipset

    Built-in DDR2 SDRAM and industrial-grade

    DOM

    19-inch rackmount installation, 1U high

    6 Ethernet ports for network redundancy 2 USB 2.0 Host, supporting system boot up

    4 Serial 232 & 8 RS-485 ports (wide baud rate)

    CF/SATA interfaces for storage expansion

    100 to 240V AC/DC power input

    Dual power for redundant application

    (DP/DPP model only)

    Fanless and low power consumption design

    http://images.google.cn/imgres?imgurl=http://web-hosting.tophostingcenter.com/images/penguin.jpg&imgrefurl=http://web-hosting.tophostingcenter.com/%3Fp%3D84&h=357&w=300&sz=10&hl=zh-CN&start=2&um=1&tbnid=mBkJW-0aoDfdbM:&tbnh=121&tbnw=102&prev=/images%3Fq%3Dlinux%2Bpenguin%26um%3D1%26complete%3D1%26hl%3Dzh-CNhttp://images.google.com.tw/imgres?imgurl=http://www.microsoft.com/resources/sharedsource/graphics/wEmbedCE.jpg&imgrefurl=http://www.microsoft.com/resources/sharedsource/licensing/windowscep.mspx&h=91&w=140&sz=34&hl=zh-TW&start=18&tbnid=PSYbEjOPNoMiOM:&tbnh=60&tbnw=93&prev=/images%3Fq%3Dwindows%2Bembedded%2Blogo%2Bsite:www.microsoft.com%26gbv%3D2%26svnum%3D10%26complete%3D1%26hl%3Dzh-TW%26sa%3DGhttp://images.google.com.tw/imgres?imgurl=http://www.ctse.cefetpr.br/images/winxpe_logo.gif&imgrefurl=http://www.ctse.cefetpr.br/technology/winxpe.htm&h=251&w=335&sz=18&hl=zh-TW&start=2&tbnid=SFUJlPHy93ZGRM:&tbnh=89&tbnw=119&prev=/images%3Fq%3Dwindows%2Bembedded%2Blogo%26gbv%3D2%26svnum%3D10%26complete%3D1%26hl%3Dzh-TW%26sa%3DG
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    Challenges to Certify IEC 61850-3

    Function Test

    EMC Test

    Wide Temperature Test

    Anti-Vibration Test

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    Unique Design to Conquer EMC Test

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    Wide Temperature Know-How

    Thermal Placement

    Optimization of

    Components Natural-Convection

    Chamber to Test

    Wide TemperatureComponents Database

    Optimal Heat Transfer

    Methods

    Self Warming System

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    Special Heat Dissipation Design

    L-Type for Heat Dissipation

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    System Throttling Design

    High Temperature Solution: Dynamic Throttling Technique

    time

    User

    Configurable

    insid e B IOS

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    120 hours Uninterrupted Testing

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    Production Quality Management

    (Dynamic Burn-in)

    High temp. (55~75dc)

    Pilot Run 24~48hrs

    Over 80% function test items are covered during burn-in test program.

    Monitoring programs control the entire burn-in status,

    and show the data for analysis.

    Room temp. (30~40dc)

    Mass Production 4~24hrs

    Wide temp. (-40~85 dc)

    W/T Product screen 24 hrs

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    Anti-Vibration Tolerance Test

    50 G Anti-Shock

    5-500 MHz Anti-Vibration

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    Summary

    IEC 61850 is the trend in modern power substation

    to integrate different standards in

    Relay, Control, and Metering equipments

    DA-681 is the best solution to fit in

    Communication Processor and Back-end Host

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    Thanks!