arl facilities and capabilities available to support ... systems. challenges • integration with...

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APPROVED FOR PUBLIC RELEASE; DISTRIBUTION IS UNLIMITED Title Semi-Automated Probe Station with thermal chuck and with access to VNAs, ARBs, power supplies, and a laser trimming system MAT-058 RF MEMS Technology S&T Campaign: Materials Research Electronics MEMS Jeffrey S. Pulskamp (301) 394-0016 [email protected] Research Objective Explore microelectromechanical systems (MEMS) technology solutions to enable frequency agile components for cognitive RF systems including tactical radios, next generation radar, and electronic warfare systems Challenges Integration with CMOS and high aspect ratio metal MEMS processes Novel processing methods such as 3D conformal deposition techniques (e.g. ALD) and multi-layer piezoelectric stacks Tunable, frequency agile components and controlling substrate loss effects Integrated wafer level packaging ARL Facilities and Capabilities Available to Support Collaborative Research Specialty Electronic Materials and Sensors Cleanroom (SEMASC) 15,000 ft 2 fabrication facility Only open R&D facility in US with full suite of piezoelectric material deposition, fabrication, device modeling, and characterization infrastructure and expertise RF MEMS characterization laboratory including vector network analyzers (~30 kHz to 67 GHz), spectrum analyzers, and semi-automated probe stations (with integrated temperature controlled wafer chuck) MEMS actuator characterization laboratory (high speed video, laser doppler vibrometer (DC to 1.2 GHz), probe stations, etc) Complementary Expertise/ Facilities/ Capabilities Sought in Collaboration RF MEMS Design and Characterization Advanced MEMS Packaging (wafer level and heterogeneous) System level integration Automated CSD & Sputtering Endpoint Assisted Ion- Milling and Reactive Ion Etching Only flexible production capable facility in US Electro - mechanical Modeling & Design 18 20 22 24 26 -30 -25 -20 -15 -10 -5 0 Frequency [MHz] |S 21 | [dB] Resonator Data Unmatched Resonator Data Matched Ideal Resonator Matched Inductors Varactors Switches Filters Devices to Enable Adaptability/Reconfigurability Resonators Materials and Fabrication

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Page 1: ARL Facilities and Capabilities Available to Support ... systems. Challenges • Integration with CMOS and high aspect ratio metal MEMS processes • Novel processing methods such

APPROVED FOR PUBLIC RELEASE; DISTRIBUTION IS UNLIMITED

Title

Semi-Automated Probe Station with thermal chuck and with

access to VNAs, ARBs, power supplies, and a laser trimming

system

MAT-058

RF MEMS Technology

S&T Campaign: Materials ResearchElectronics

MEMS

Jeffrey S. Pulskamp(301) [email protected]

Research ObjectiveExplore microelectromechanical systems (MEMS) technology solutions to enable frequency agile components for cognitive RF systems including tactical radios, next generation radar, and electronic warfare systems

Challenges• Integration with CMOS and high aspect ratio

metal MEMS processes• Novel processing methods such as 3D conformal

deposition techniques (e.g. ALD) and multi-layer piezoelectric stacks

• Tunable, frequency agile components and controlling substrate loss effects

• Integrated wafer level packaging

ARL Facilities and Capabilities Available to Support Collaborative Research• Specialty Electronic Materials and Sensors Cleanroom

(SEMASC) 15,000 ft2 fabrication facility• Only open R&D facility in US with full suite of

piezoelectric material deposition, fabrication, device modeling, and characterization infrastructure and expertise

• RF MEMS characterization laboratory including vector network analyzers (~30 kHz to 67 GHz), spectrum analyzers, and semi-automated probe stations (with integrated temperature controlled wafer chuck)

• MEMS actuator characterization laboratory (high speed video, laser doppler vibrometer (DC to 1.2 GHz), probe stations, etc)

Complementary Expertise/ Facilities/ Capabilities Sought in Collaboration• RF MEMS Design and Characterization• Advanced MEMS Packaging (wafer level and

heterogeneous) • System level integration

Automated CSD & Sputtering

Endpoint Assisted Ion-Milling and Reactive Ion

Etching

Only flexible production capable facility in US

Electro-mechanical Modeling & Design

18 20 22 24 26-30

-25

-20

-15

-10

-5

0

Frequency [MHz]

|S21

| [dB

]

Resonator Data UnmatchedResonator Data MatchedIdeal Resonator Matched

InductorsVaractors

Switches

Filters

Devices to Enable Adaptability/Reconfigurability

Resonators

Materials and Fabrication