fundamentals of multichip modules and packaging · pdf filesystem packaging methods (a)...

Fundamentals of

Multichip Modulesand Packaging Technologies

MCM

• Advanced VLSI Packaging (AVP)• MCM-D• MCM-C• MCM-L

System Packaging Methods

(a) System-on-a Chip or Wafer Scale Integration

(b) Multichip Module

(c) Single Chip Packagingv= velocity of Propagation C = Speed of LightE= Relative Dielectric Constant

Multi-chip Module

4

AT&T Bell Labs.1983-1988.

Schematic Representation of Multi-layered Thin–Film Polymide Substrate (MCM-D)

Number of Layers Versus effective Trace Density for Various Multichip Module Substrate Technologies and Trace Pitches (line plus gap in mils.)

The Penalty Factor is assumed to be less than 10%.]

MCM Fractional Yield as a Function of the KGD Probability

KGD = Known Good Die

Motherboard for iPhone 4

MCM in 1987

A4 in 2010

Xilinx Virtex 7 with 2.5D tiling, 2011.

Deep Reactive Ion Etching (RIE)

Case Western Reserve Univ. MEMS Website;http://mems.cwru.edu/

Advanced Micro Machines Website;http://www.memslink.com/

DARPA Microsystems Technology Office, MEMS Website; http://www.darpa.mil/MTO/MEMS/

© V. M. Bright and K. Ishikawa, 2001

Why 2.5D Packaging?

Xilinx calls this assembly “SSI” (stacked system interconnect) and this approach to large-FPGA assembly provides two big benefits according to Liam Madden, the Xilinx corporate VP of FPGA development and silicon technology. “We can get many more connections within the silicon than you can with a system-in-package. [There are “more than 10,000 routing connections between FPGA slices.] But the biggest advantage of this approach is power savings. Because we are using chip interconnect to connect the dice, it is much more economical in power than connecting dice through big traces, through packages or through circuit boards,” says Madden in the Xcell Journal article.

MCM

• Advanced VLSI Packaging (AVP)• MCM-D• MCM-C• MCM-L

Schematic Representation of Multi-layered Thin–Film Polymide Substrate (MCM-D)

MCM

• Advanced VLSI Packaging (AVP)• MCM-D• MCM-C• MCM-L

Thermal Conduction Module (IBM 3081)

500 WattsWater-cooled

16

Thermal Conduction Module

17

Schematic Representation of Low Temperature, Co-fired Ceramic (LTCC) MCM

The Improvement of Wire Length and Number of Connections For IBM’s Thermal Conduction Module (an) MCM Versus the Same System

Implemented in Single Chip Packages

Line Width Versus Packaging Efficiency For Various Packing Styles

Single chip module

System on packagesystem on chip

Chip area/Substrate area

MCM

• Advanced VLSI Packaging (AVP)• MCM-D• MCM-C• MCM-L

Examples of Multi-Chip Module

Central Processing

Unit

Individuality Packaged

Microprocessor such as those

used in a Personal Computer

The Major Steps in theFabrication of Multi-layer PWB ’s

23

A Typical Printed Wiring Board Configuration

24

Production of PWB Laminates

25

Schematic Representation of a Built–up MCM-L

26

PCB for iPhone 4

27

MCM Relative Cost Versus Module I/O for the Various MCM Technologies

Motherboard for iPhone 4

MCM in 1987

A4 in 2010

Xilinx Virtex 7, 2011