Tube-to-Chip soldering

Georg Nüßle

µcool weekly 2November 8, 2012

Paper

Following the recipe from:

“Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices”Edward R. Murphy et al., The Royal Society of Chemistry, 2007

µcool weekly 3November 8, 2012

Soldering to PCB

• Tube 1/16” stainless steel, Swagelok ferrule: big part stainless steel, small part brass • Was successful, no solder around at the tube

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Soldering to Chip with Goldlayer• Chip: 100µm Si with 20nm Ti and 200nm Au• Was successful too• Reinforcement for pressure test, chip was glued on thick Si piece

µcool weekly 5November 8, 2012

Pressure Test• NanoPort/steel tube combination failed at 78 bar• Test object was ejected, which led to a brake off of the Si chip from the reinforcement• Si part under the the soldering seemed to be intact• Second pressure test, Si chip breaks at 37 bar, solder is unharmed, no solder in tube

µcool weekly 6November 8, 2012

Outlook

Test soldering with microfluidic device and prove that the tube is not blocked by solder.