3D IC technology

Contents• Introduction• Why 3D IC• Motivation• 2D, 2.5D, 3D• Advantages• Challenges• Conclusion

Introduction

Could be Heterogeneous… “Stacked” 2D (Conventional) ICs

Why 3D IC?

2D 3D

Motivation• Interconnect structures increasingly consume more of the power

and delay budgets in modern design• Solution: increase the number of “nearest neighbors” seen by each

transistor by using 3D IC design• Smaller wire cross-sections, smaller wire pitch and longer lines to

traverse larger chips increase RC delay.• RC delay is increasingly becoming the dominant factor

2D

2.5D

3D

Advantages• Footprint• Cost• Shorter interconnect• Power• Heterogeneous integration

Challenges• Cost• Heat• Design complexity

Conclusion• The 3D-IC seems to be the avenue for future development in

μelectronics industry• 3D IC design is a relief to interconnect driven IC design• Researches are still going on in this sector for the better

enhancement and application of this technology

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