Download - 3D IC Technology
![Page 1: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/1.jpg)
3D IC technology
![Page 2: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/2.jpg)
Contents• Introduction• Why 3D IC• Motivation• 2D, 2.5D, 3D• Advantages• Challenges• Conclusion
![Page 3: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/3.jpg)
Introduction
Could be Heterogeneous… “Stacked” 2D (Conventional) ICs
![Page 4: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/4.jpg)
Why 3D IC?
2D 3D
![Page 5: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/5.jpg)
Motivation• Interconnect structures increasingly consume more of the power
and delay budgets in modern design• Solution: increase the number of “nearest neighbors” seen by each
transistor by using 3D IC design• Smaller wire cross-sections, smaller wire pitch and longer lines to
traverse larger chips increase RC delay.• RC delay is increasingly becoming the dominant factor
![Page 6: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/6.jpg)
2D
![Page 7: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/7.jpg)
2.5D
![Page 8: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/8.jpg)
3D
![Page 9: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/9.jpg)
Advantages• Footprint• Cost• Shorter interconnect• Power• Heterogeneous integration
![Page 10: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/10.jpg)
Challenges• Cost• Heat• Design complexity
![Page 11: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/11.jpg)
Conclusion• The 3D-IC seems to be the avenue for future development in
μelectronics industry• 3D IC design is a relief to interconnect driven IC design• Researches are still going on in this sector for the better
enhancement and application of this technology
![Page 12: 3D IC Technology](https://reader035.vdocuments.us/reader035/viewer/2022062823/5873ad1c1a28aba3548b6623/html5/thumbnails/12.jpg)
THANK YOU