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ACCELERATIONINCLINOMETERS

9/22/2016


TS family Tilt sensors

Colibrys / Confidential / Tilt presentation2

5. Introducing

TS9001:• Product architecture

• Specifications: bias

performance, bias

stability

• Competitive landscape

1. Colibrys

MEMS

technology

2. What is tilt

measurement?

3. Applications 4. TS family

products

specifications

6. Conclusions 7. Sources of

information

8. Annexes



OUR VISION

World leader for high-end, robust MEMS

sensors, supported by a commitment of

excellence over the long term

Partner of choice for who wants to pioneer in

innovative high performance MEMS



OUR MISSION

Being the strategic partner for MEMS

technology within the Safran group, Safran

Colibrys is a worldwide leader in the high-end

MEMS accelerometer market


MEMS capacitive technology


MEMS • Silicon micro-machined sensor chip

• High-end dual side alignment and photolitho

• 3 wafers assembly by silicon fusion bonding (SFB) 3D Bulk Technology

ADC

MEMS ASIC

Mechanics• Spring-mass system

• Large mass and small gap

• Controlled gas damping

1

2


Colibrys key differentiation: Bulk micromachining


Surface micro-machining Bulk micro-machining

Sensor design- In plan

displacement

- Out of plan

displacement

Gap control

- Thin proof mass

- Gap control by photolithography and

DRIE etching (precision 17%)

- Gap of ~4 to 6µm ±10’000Å

- Thick proof mass

- Gap control by oxide growth (precision 1.5%)

- Gap of ~2µm ±300Å

Mass- 0.03 to 0.3 milligrams

- Larger noise and lower stability

- 5 to 15 milligrams

- Much lower Brownian noise and better

stability due to larger mass

Capacitor- 2 x 2 to 5pF


- 2 x 15 to 50pF

- Much larger capacitances: required for

low noise and high stability

Manufacturing

- Smaller in size

- Up to three axis

possible with one

single die

- Monolithic

- MEMS above IC

- Rapid etching due to small thickness of

the mass (thickness ~5 to 10µm)

- Lower manufacturing cost

- Larger in size

- Only one axis

- Hybrid assembly

- Longer etching time

due to mass thickness (>350µm).

- More expensive and larger but better

performances (no compromises)


Colibrys key differentiation: Bulk micromachining


Surface micro-machining Bulk micro-machining

Sensor design- In plan

displacement

- Out of plan

displacement

Gap control

- Thin proof mass

- Gap control by photolithography and

DRIE etching (precision 17%)

- Gap of ~4 to 6µm ±10’000Å

- Thick proof mass

- Gap control by oxide growth (precision 1.5%)

- Gap of ~2µm ±300Å

Mass- 0.03 to 0.3 milligrams


- 5 to 15 milligrams

- Much lower Brownian noise and better

stability due to larger mass

Capacitor- 2 x 2 to 5pF


- 2 x 15 to 50pF

- Much larger capacitances: required for

low noise and high stability

Manufacturing

- Smaller in size

- Up to three axis

possible with one

single die

- Monolithic

- MEMS above IC

- Rapid etching due to small thickness of

the mass (thickness ~5 to 10µm)

- Lower manufacturing cost

- Larger in size

- Only one axis

- Hybrid assembly

- Longer etching time

due to mass thickness (>350µm).

- More expensive and larger but better

performances (no compromises)

Bulk micromachining combined with hybrid

assembly offer the best opportunity for high-end

performances


What is Tilt?

Tilt is an angle of object inclination with respect to terrestrial

gravity vector (1G).

Fig. 1. tilt angle

What is Tilt measurement?


)cos(1][ gga

Fig. 2. Tilt sensor output vs rotation at 360°

Tilt sensor position



STANDARD PERFORMANCES: TS9001 – 1GSTATIC MEASUREMENTS UP TO +/-90°

Geotechnical monitoring of critical locations: in-place

inclinometers

Civil Engineering: survey and SHM

Railways: train positioning systems

Military: levelling antennas



STANDARD PERFORMANCES TS8002 – 2GSTATIC 3D MEASUREMENTS OR VIBRATION ENVIRONMENTS

Drilling: logging while drilling (LWD)

Railways: train tilt systems

Naval – Military: sonar towed arrays antenna

Industrial: construction machines



HIGH PERFORMANCES: TS1000T – 2,5,10G ENERGY SECTOR, HIGH TEMPERATURE

High precision tilt measurement is required for harsh

environments, high depth exploration in Energy market - Oil and

Gas extraction, Fracking, Mining...

TS1000T target applications in Energy market :

MWD (Measurement While Drilling)

HDD (Horizontal Directional Drilling)

Orientation of borehole logging instruments.


HDD,

orientation of

logging

instruments

How to choose an accelerometer for the energy market?


Sectors of energy applications

- 40°C + 125°C

Borehole

surveyWireline,

inplane,

inclinometers

Measurement

While Drilling

(MDW)

Logging

survey

< 0.1° all error, EOL

< 0.5-1° all error, EOL

System accuracy


TS family products: specifications


Tilt measurement

key parameters

What does it define for

tilt measurement ?

Bias long term

stability

System long lifecycle without re-

calibration;

maintenance economy;

long term accuracy

Non linearity Better SF accuracy

Noise Resolution – lowest acceleration

measured

Reliability of

parameters

Long lifecycle, repeatability of

performances, tight spread

Consumption Adapted for autonomous

system, especially for civil

Engineering

Colibrys Tilt Products

DatasheetUnit TS9001.D TS8002.D TS1002T

Range Typ. (1σ) +/- 1 g (+/-90°) +/- 2g +/- 2g

Bias temperature

coeficient

°/°C <0.006 0.012 0.0086

Bias Long term stability ̽ ° < 0.043 < 0.086 <0.114

Scale factor mV/g 2000 1000 1350

Scale factor temperature

coeficient

ppm/°C 100 100 120

Scale Factor long term

Stability (one Year)

ppm 300 300 1000

Resolution @ 1Hz ° 0.0025 0.0057 0.0004

Noise (in Band) [°/√Hz] 0.0005 0.001 0.0004

Non- Linearity % FS <1 <1 < 0,3

Operating temperature [°C] -40 to 125°C -40 to 125°C - 50+175

Shock (single shock) [g] 6000 6000 6000

Consumption mW 2 2 9.9

Package LCC20 LCC48 LCC20

* the test conditions for the TS1000T are more severe

compared to other Colibrys sensors


The main differentiation factor of Colibrys sensors – accurate functioning in harsh

environments, performance long term stability, high reliability

Those features are indispensable for tilt applications in 4 targeted by TS Family

Markets :

Essential Tilt applications for TS product family


Energy Civil

Engineering

Military Railways



INTRODUCTION OF TS9001 Architecture


MEMS sensor

> 3D bulk-die

> Optimized for bias stability

> Patended soft die attach process

Stability

Low noise ASIC

> Analog output 0.5-4.5 V

> Low consumption < 400 UA

> Ratiometric output

> Microcontroller for calibration datas

> Ext. temperature sensor

LCC Substrate

> Leadless ceramic package

8.9 mm x 8.9 mm

Finishing: W/Ni/Au

Hermetically sealed

TS9001 sensor architecture




EACH PRODUCT IS FULLY TESTED

BEFORE DELIVERY TO THE CUSTOMER

CALIBRATIONSBias

Scale factor

Non linearity

Frequency response

MEASURESBias & scale factors

temperature coefficient

on tumble tests

Operating current

consumption

Non linearity



A LONG-TERM RELATIONSHIP Long-term supply guarantee

Financial back-up by an international SAFRAN group

Guarantee of product performance proved by track records

Technical expertise

Customized terms & conditions

Excellence in operations and service

Supply chain efficiency

Custom design solution



TS FAMILY TARGET SECTORS FOR TILT

MEASUREMENT ARE:

Energy Railway

Civil Engineering Military

Where accurate functionning in harsh environnements,long-term stability of performances are mandatory forSystem confidence

TS FAMILY EXISTS IN:

Standard temperature up to 125 °C

High performance and temperature up to 175°C



ALL DOCUMENTATION YOU NEED IN

ONE CLICK:

Datasheets TS9001, TS8002, TS1000TRecommended circuit

Functional Block Diagram

SMD, handling recommandations

Application Notes:Train Positioning

Drilling

Tilt survey

www.safran-colibrys.com

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