the datasheetarchive - datasheet search engine phone, camera, pda, notebook coupling into light...
TRANSCRIPT
SPECIFICATION
ITEM WHITE SIDE VIEW LED
MODEL SWAF07
CUSTOMER
Customer
Approved by Approved by Approved by
/ / /
Supplier
Drawn by Checked by Approved by
/ / / SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00 SWAF07
Contents
1. Features
2. Applications
3. Absolute Maximum Ratings
4. Electro-Optical Characteristics
5. CIE Chromaticity Diagram
6. Characteristic Diagram
7. Reliability
8. Precautions
9. Soldering Profile
10. Outline Dimension
11. Packing
12. Reel Packing Structure
13. History
02 02 03 03 04 06 08 09 10 11 12 13 14
SEOUL SEMICONDUCTOR CO., LTD.
1 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
1. Features Package: SMT Solderability
Dimension : 3.8 × 1.05 × 0.6 (mm)
Low Thermal Resistance
RoHS Compliant, Lead Free
Suitable for Small Applications
Own Patent Reserved
SWAF07 is Very Useful Side View LED in Back Light Unit Application
2. Applications Flat Backlighting (LCD, Display)
Mobile Phone, Camera, PDA, Notebook
Coupling into Light Guide Panel
AV Systems
SEOUL SEMICONDUCTOR CO., LTD.
2 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
3. Absolute Maximum Ratings (Ta = 25°C)
Parameter Symbol Value Unit
Power Dissipation Pd*1 120 mW
Forward Current IF 30 mA
Peak Forward Current IFM*2 100 mA
Reverse Voltage VR 5 V
Operating Temperature Topr -30 ~ +85 °C
Storage Temperature Tstg -40 ~ +100 °C
Junction Temperature Tj 125 °C
*1 Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product. *2 IFM conditions : Pulse width TW ≤ 0.1ms, Duty ratio ≤ 1/10
4. Electro-Optical Characteristics (Ta = 25°C)
Item Symbol Condition Min Typ Max Unit
Rank Y 2.7 - 3.0 Rank Z 3.0 - 3.3 Forward Voltage*
Rank A
VF IF = 20 mA
3.3 - 3.7
V
Reverse Current IR VR = 5 V - - 50 µA Rank J1 1100 - 1200 Rank J2 1200 - 1300 Rank J3 1300 - 1400 Rank J4 1400 - 1500 Rank J5 1500 - 1600 Rank J6 1600 - 1700 Rank J7 1700 - 1800 Rank J8 1800 - 1900
Luminous Intensity*1
Rank J9
IV IF = 20 mA
1900 - 2000
mcd
Viewing Angle *2 2θ1/2 IF = 20 mA 120 ˚ x 0.264 - 0.296 Rank b y 0.248 - 0.295 x 0.287 - 0.311
Rank e y 0.276 - 0.315 x 0.307 - 0.330
Color Coordinates *3
Rank f y
IF = 20 mA
0.294 - 0.339
-
*1 luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED
package. Luminous Intensity Measurement allowance is ±10%. *2 θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. *3 Measurement Uncertainty of the Color Coordinates is ±0.01 * Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at
20mA within the maximum ratings shown above. All measurements were made under the standardized environment of Seoul Semiconductor.
SEOUL SEMICONDUCTOR CO., LTD.
3 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
5. CIE Chromaticity Diagram
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.80.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
460470
475480
485
490
495
500
505
510
515520525
530535
540545
550555
560565
570575
580585
590595
600610
620630830
y C
oord
.
x C o o r d .0.24 0.26 0.28 0.30 0.32 0.34 0.36
0.22
0.24
0.26
0.28
0.30
0.32
0.34
0.36
e
f
b
y C
oord
.
x C o o r d .
Luminous Intensity
Ranking by Color Coordinates Ranking by Luminous Intensity
RANK Min Max Unit
b e f
J1 1100 1200 √ J2 1200 1300 √ √ J3 1300 1400 √ √ √ J4 1400 1500 √ √ √ J5 1500 1600 √ √ √ J6 1600 1700 √ √ √ J7 1700 1800 √ √ √ J8 1800 1900 √ √ J9 1900 2000
mcd
√ * The Checked ranks are available
Color Rank (IF = 20 mA, Ta = 25°C)
B e f x y x y x y
0.264 0.267 0.296 0.276 0.311 0.294 0.280 0.248 0.311 0.294 0.330 0.318 0.296 0.276 0.307 0.315 0.330 0.339 0.287 0.295 0.287 0.295 0.307 0.315
SEOUL SEMICONDUCTOR CO., LTD.
4 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
6. Characteristic Diagram
Forward Current vs. Forward Voltage Intensity vs. Forward Current
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
1
10
Ta = 25OC
Forw
ard
Cu
rren
t [m
A]
Forward Voltage [V]
0 5 10 15 20 25 30 350
200400600800
100012001400160018002000220024002600
Ta = 25OC
Inte
nsi
ty [
mcd
]
Forward Current [mA]
Forward Current vs. Ambient Temperature Radiation Diagram
-30 -15 0 15 30 45 60 75 900
5
10
15
20
25
30
Forw
ard
curr
ent
[mA
]
Ambient temperature [oC]
-100 -80 -60 -40 -20 0 20 40 60 80 1000.0
0.5
1.0 Ta = 25OC x axis y axis
Inte
nsi
ty
Theta [o]
y x
SEOUL SEMICONDUCTOR CO., LTD.
5 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
Color Coordinate vs. Forward Current Spectrum
0.288 0.290 0.292 0.2940.283
0.284
0.285
0.286
Ta = 25OC
1 mA
30 mA
y C
oord
.
x Coord.
400 500 600 700 800
Ta = 25OC IF = 20 mA
Inte
nsi
ty [
%]
Wavelength [nm]
Forward Voltage vs. Ambient Temperature Color Coordinate vs. Ambient Temperature
-45 -30 -15 0 15 30 45 60 75 900.94
0.96
0.98
1.00
1.02
1.04
1.06 IF = 20 mA
V F
/ V F
[2
5OC
]
Ambient Temperature [oC]
0.296 0.298 0.300 0.302 0.3040.282
0.284
0.286
0.288
0.290
0.292
IF = 20 mA
y C
oord
.
x Coord.
25oC
85oC
-30oC
SEOUL SEMICONDUCTOR CO., LTD.
6 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
Relative Luminosity vs. Ambient Temperature Allowable Forward Current vs. Duty Ratio
-30 -15 0 15 30 45 60 75 900.7
0.8
0.9
1.0
1.1
1.2
I v /
I v
[25o C
]
Ambient Temperature [oC]
1 10 100
20
40
60
80
100
120
Ta = 25OC
Allo
wab
le F
orw
ard
Cu
rren
t [
mA
]
Duty Ratio [%]
SEOUL SEMICONDUCTOR CO., LTD.
7 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
7. Reliability
(1) TEST ITEMS AND RESULTS
TEST ITEM Test conditions Note Number of Damaged Reference
Life Test 1 Ta = 25°C; IF = 20 mA 1000 hr 0/20 EIAJ ED-4701 100 101
Life Test 2 Ta = 25°C; IF = 30 mA 500 hr 0/20 EIAJ ED-4701 100 101
Thermal Shock -30°C ~ 85°C (30 min) (30 min)
20 cycle 0/50 EIAJ ED-4701 300 307
High Temperature Life Test Ta = 85°C; IF = 5 mA 1000 hr 0/20 -
Low Temperature Life Test Ta = - 30°C; IF = 20 mA 1000 hr 0/20 -
High Temperature Storage Ta = 100°C 1000 hr 0/50 EIAJ ED-4701 200 201
Low Temperature Storage Ta = - 40°C 1000 hr 0/50 EIAJ ED-4701 200 202
High Humidity Heat Life Test Ta = 60°C; RH = 90%, IF = 20 mA 500 hr 0/20 EIAJ ED-4701 100 102
Humidity Heat Load Ta = 85°C; RH = 85% 1000 hr 0/50 EIAJ ED-4701 100 103
Resistance to Soldering Heat Tsld = 260°C, 10 sec Pre treatment; 30°C, 70%, 168 hr 2 time 0/50 EIAJ ED-4701
301 302
Solder ability (Reflow Soldering)Tsld = 215±5°C, 3 sec (Lead Solder)
1 time over 95% 0/50 EIAJ ED-4701
303
Temperature Cycle - 40°C ~ 25°C ~ 100°C ~ 25°C (30 min) (5 min) (30 min) (5 min)
100 cycle 0/50 EIAJ ED-4701 100 105
Moisture Resistance Cycle 25°C ~ 65°C ~ - 10°C RH = 90%, 24 hr / 1 cycle 10 cycle 0/50 EIAJ ED-4701
200 203
(2) CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgment Item Symbol Test Condition
Min. Max.
Forward Voltage VF IF = 20 mA - U.S.L × 1.2
Reverse Current IR VR = 5 V - U.S.L × 2.0
Luminous Intensity IV IF = 20 mA L.S.L × 0.5 -
U.S.L. : Upper Standard Level, L.S.L. : Lower Standard Level
SEOUL SEMICONDUCTOR CO., LTD.
8 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
8. Precautions
(1) Storage conditions
Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.
a. Keep it at a temperature in the range from 5°C to 30°C and at a humidity of less than 60% RH.
In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas.
(2) After opening the package
When soldering, this could result in a decrease of the photoelectric effect or light intensity.
a. Soldering should be done right after mounting the product.
b. Keep the temperature in the range from 5°C to 40°C and the humidity at less than 30%.
Soldering should be done within 7 days after opening the desiccant package.
If the product has been exposed for more than 7 days after opening the package or the indicating color
of the desiccator changes, the product must be baked at a temperature between 60°C and 65°C for 10 to
12 hours.
An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry
atmosphere.
(3) Precautions for use
Any external mechanical force or excessive vibration should not be applied to the product during cooling
after soldering, and it is preferable to avoid rapid cooling.
The product should not be mounted on a distorted part of PCB.
Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and
surge damage, and all devices and equipments must be grounded to the earth.
(4) Miscellaneous
Radiation resistance is not considered.
When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used
and IPA(Isopropyl Alcohol) must be used.
When using the product, operating current should be settled in consideration of the maximum ambient
temperature.
Its appearance or specification for improvement is subject to change without notice.
SEOUL SEMICONDUCTOR CO., LTD.
9 SSC-QP-7-03-44(갑)
-7-03-44(갑)
Rev. 1.00 SWAF07
9. Soldering Profile
The LED can be soldered in place using the reflow soldering method.
(1) Lead solder
Preliminary heating to be at maximum 210°C for maximum 2 minutes.
Soldering heat to be at maximum 240°C for maximum 10 seconds.
0 15 30 45 60 75 90 105 120 135 150 165 180 1950
40
80
120
160
200
240
280
Soldering Times [sec]
Dev
ice
Surf
ace
Tem
pera
ture
[o C]
(2) Lead-free solder
Preliminary heating to be at maximum 220°C for maximum 2 minutes.
Soldering heat to be at maximum 260°C for maximum 10 seconds.
0 15 30 45 60 75 90 105 120 135 150 165 180 1950
40
80
120
160
200
240
280
Dev
ice
Surf
ace
Tem
pera
ture
[o C]
Soldering Times [sec]
(3) Hand Soldering conditions
Not more than 5 seconds @MAX 300°C, under Soldering iron.
SEOUL SEMICONDUCTOR CO., LTD.
10 SSC-QP
Rev. 1.00 SWAF07
10. Outline Dimension ( Tolerance : ±0.2, Unit : mm )
[Bottom View]
<Recommended solder Pattern>
Cathode
Cathode Mark
Anode
Mold Gate
SEOUL SEMICONDUCTOR CO., LTD.
11 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
11. Packing ( Tolerance : ±0.2, Unit : mm )
Label
180
13 ±0.3
60
22
2 ±0.2
+1
-0
15.4
13+0-3
-0+0.2
±1.0
12.0
±0.0
2
4.0±0.1
Anode
Cathode
+0.1-0 2.0±0.05
4.0±0.1
SECTION B-B'
(1) Quantity: 3500 pcs / Reel
(2) Cumulative Tolerance: Cumulative Tolerance / 10 pitches to be ±0.2 mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1 - 0.7 N when the cover tape is turned off from
the carrier tape at 10° angle to be the carrier tape
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SEOUL SEMICONDUCTOR CO., LTD.
12 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
12. Reel Packing Structure
LOT NUMBER : XXXXXXXX
SWAF07 X
SSC PART NUMBER : XXXXXXXX
Material : Paper(SW3B(B))
SEOUL Semiconductor EcoLight
245 (mm)
AcricheRoHS
TUV
220 (mm)
MADE IN KOREA
TYPE
7inch
142 (mm)
SIZE (mm)
245 220245 220
a b14280
c
Reel
Barcode Label
QUANTITY : XXXX
RANK :
Outer Box Structure
XXX
Humidity indicator
Desiccant
Aluminum Vinyl Bag
Lot Number
The lot number is composed of the following characters;
SWAF07 ○□□◎◎ ◇◇◇
Symbol Meaning Example
○ Year 8 for 2008, 9 for 2009 ‥‥
□□ Month 01 for Jan., 02 for Feb., ‥‥ 12 for Dec.
◎◎ Day 01, 02, 03, 04, 05, ‥‥ 27, 28, 29, 30, 31
◇◇◇ Number 001, 002, 003, 004, 005, 006, 007 ‥‥
SEOUL SEMICONDUCTOR CO., LTD.
13 SSC-QP-7-03-44(갑)
Rev. 1.00 SWAF07
13. History
Rev. No. Contents Date
1.00 - The institution of New Spec. 2008. 06. 03
Published by SEOUL SEMICONDUCTOR CO., LTD. http://www.seoulsemicon.com 148-29, Gasan-Dong, Geumcheon-Gu, Seoul, 153-801. South Korea © All Right Reserved.
SEOUL SEMICONDUCTOR CO., LTD.
14 SSC-QP-7-03-44(갑)