siemens d900 commissioning itmn offline
DESCRIPTION
SIEMENS D900/1800 ITMN:OfflineTRANSCRIPT
Commissioning
System
ITMN - OFFLINE
A30808-X3063-A403-2-7630
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ITMN - OFFLINE CommissioningSystem
Copyright (C) Siemens AG 1997
Issued by the Public Communication Network GroupHofmannstraße 51D-81359 München
Technical modifications possible.Technical specifications and features are binding only insofar asthey are specifically and expressly agreed upon in a written contract.
Important Notice on Product SafetyElevated voltages are inevitably present at specific points in this electrical equipment. Some of theparts can also have elevated operating temperatures.
Non-observance of these conditions and the safety instructions can result in personal injury or in prop-erty damage.
Therefore only trained and qualified personnel may install and maintain the system.
The system complies with the standard EN 60950. All equipment connected has to comply with theapplicable safety standards.
!
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IssuesChange indications (Ind.):
N = new; G = modified; 0 = deleted;
Document Titel Page(s) Issue/Ind.
Register ADMIN
ITMN - OFFLINE . . . . . . AD . . . . . . . . . . . . . . . . . . . . . . . . . 1... 12 2 GITMN - OFFLINE . . . . . . IN . . . . . . . . . . . . . . . . . . . . . . . . . . 1... 6 2 G
Register TL
ITMN - OFFLINE . . . . . . TL . . . . . . . . . . . . . . . . . . . . . . . . . 1... 2 2 G
Register PROC
ITMN - OFFLINE . . . . . . PROCIN. . . . . . . . . . . . . . . . . . . . . 1... 2 2 GITMN - OFFLINE . . . . . . PROC:CCG . . . . . . . . . . . . . . . . . . 1... 20 2 GITMN - OFFLINE . . . . . . PROC:MBB . . . . . . . . . . . . . . . . . . 1... 12 2 GITMN - OFFLINE . . . . . . PROC:SYP . . . . . . . . . . . . . . . . . . 1... 44 2 GITMN - OFFLINE . . . . . . PROC:SN . . . . . . . . . . . . . . . . . . . 1... 30 2 GITMN - OFFLINE . . . . . . PROC:CCNC_CCS7 . . . . . . . . . . . 1... 10 2 GITMN - OFFLINE . . . . . . PROC:LTG . . . . . . . . . . . . . . . . . . 1... 22 2 GITMN - OFFLINE . . . . . . PROC:DAS300 . . . . . . . . . . . . . . . 1... 6 2 GITMN - OFFLINE . . . . . . PROC:DSU . . . . . . . . . . . . . . . . . . 1... 16 2 GITMN - OFFLINE . . . . . . PROC:MODEM . . . . . . . . . . . . . . . 1... 6 2 GITMN - OFFLINE . . . . . . PROC:DLUB . . . . . . . . . . . . . . . . . 1... 22 2 GITMN - OFFLINE . . . . . . PROC:TESMOD2E . . . . . . . . . . . . 1... 22 2 NITMN - OFFLINE . . . . . . PROC:DLUD . . . . . . . . . . . . . . . . . 1... 20 2 NITMN-OFFLINE . . . . . . . PROC:CP113 . . . . . . . . . . . . . . . . 1... 36 1 0ITMN - OFFLINE . . . . . . PROC:CP113D . . . . . . . . . . . . . . . 1... 40 2 NITMN - OFFLINE . . . . . . PROC:MTD_STC2922 . . . . . . . . . 1... 6 2 NITMN-OFFLINE . . . . . . . PROC:CP113C . . . . . . . . . . . . . . . 1... 38 1 0ITMN - OFFLINE . . . . . . PROC:CP113C/CR . . . . . . . . . . . . 1... 54 2 NITMN - OFFLINE . . . . . . PROC:MTD_STC2925 . . . . . . . . . 1... 4 2 GITMN - OFFLINE . . . . . . PROC:MTD_HP . . . . . . . . . . . . . . 1... 8 2 G
Register TAB
ITMN - OFFLINE . . . . . . TABIN . . . . . . . . . . . . . . . . . . . . . . 1... 2 2 G
Register APP
ITMN - OFFLINE . . . . . . APP . . . . . . . . . . . . . . . . . . . . . . . . 1... 2 2 G
This document consists of a total of 368 Pages
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Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 11.1 Overview of functional areas and subsystems . . . . . . . . . . . . . . . . . . . . IN - 11.2 CE Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 21.3 Required knowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 21.4 Locating Modules and Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 21.5 Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 31.6 List of Universal Measurement and Test Equipment . . . . . . . . . . . . . . . IN - 31.7 System Voltages in the SSS-NE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 31.8 Error Reports on the Installation Test Manual . . . . . . . . . . . . . . . . . . . . IN - 41.9 Dealing with Defective Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 41.10 Procedure in the Event of Faults. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 41.11 Procedure in the Event of Serious Faults . . . . . . . . . . . . . . . . . . . . . . . . IN - 41.12 Checking the Scope of Delivery and the Installation Work . . . . . . . . . . . IN - 51.13 Interpretation of Exchange Configuration Documents . . . . . . . . . . . . . . IN - 6
2 Task List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL - 1
3 Procedures (PROCIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROCIN - 13.1 Off-line Installation of Common Clock Generator . . . . . . . . . . PROC:CCG - 13.2 Off-line Installation of Message Buffer . . . . . . . . . . . . . . . . . . PROC:MBB - 13.3 Off-line Installation Test of the System Panel . . . . . . . . . . . . . .PROC:SYP - 13.4 Off-line Installation of Switching Network . . . . . . . . . . . . . . . . . .PROC:SN - 13.5 Off-line Installation of Common Channel Signaling
Network Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 13.6 Off-line Installation of Line Trunk Groups . . . . . . . . . . . . . . . . .PROC:LTG - 13.7 Test Procedure for DAS 300. . . . . . . . . . . . . . . . . . . . . . . PROC:DAS300 - 13.8 Off-line Installation of Data Service Unit . . . . . . . . . . . . . . . . . PROC:DSU - 13.9 Off-line Installation of modems for 3.1 kHz
audio bearer services . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MODEM - 13.10 Off-line Installation of Digital Line Unit
(Frames D / E / F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DLUB - 13.11 Testing DLUB with the TESMOD2E . . . . . . . . . . . . . . PROC:TESMOD2E - 13.12 Off-line Installation of Digital Line Unit
(Frames G / E / F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DLUD - 13.13 Off-line Installation of CP113D . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 13.14 Switching on MTD STC 2922 of Storage Tek . . . . . .PROC:MTDSTC2922 - 13.15 Off-line Installation of CP113C/CR . . . . . . . . . . . . . . . PROC:CP113C/CR - 13.16 Switching on MTD STC 2925 of Storage Tek . . . . . .PROC:MTDSTC2925 - 13.17 Switching on the MTD HP 88781A of Hewlett Packard . . .PROC:MTDHP - 1
4 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TABIN - 1
5 Appendix (APP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . APP - 1
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IllustrationsFig. 1.1.1 Functional areas in a network node together with the subsystems . . IN - 1
Fig. 1.4.1 Meaning of the test points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 3
Fig. 2.1.1 Installation Test Sequence of Register OFFLINE . . . . . . . . . . . . . . .TL - 1
Fig. 3.0.1 Elements used in the procedures . . . . . . . . . . . . . . . . . . . . . . PROCIN - 2
Fig. 3.1.1 Rack: MB/CCG(Fuse Assignment for CCG). . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 2
Fig. 3.1.2 Rack: SN/MB/LTGM(Fuse Assignment for CCG). . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 3
Fig. 3.1.3 Rack CE(Fuse Assignment for CCG). . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 4
Fig. 3.1.4 Standard cabling CCG(A) in F:MB/CCG(B)(Plesiochronous mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 8
Fig. 3.1.5 Standard cabling CCG(A) in F:MB/CCG(B)(Synchronous mode with 2,048 MHZ) . . . . . . . . . . . . . . . . PROC:CCG - 9
Fig. 3.1.6 Standard cabling CCG(A) in F:SMSC(C)(Plesiochronous mode) . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 10
Fig. 3.1.7 Standard cabling CCG(A) in F:SMSC(C)(Synchronous mode with 2,048 MHZ) . . . . . . . . . . . . . . . PROC:CCG - 11
Fig. 3.2.1 Rack: MB/CCG(Fuse Assignment for MB) . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 2
Fig. 3.2.2 Rack: SN/MB/LTGM(Fuse Assignment for MB) . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 4
Fig. 3.2.3 Rack CE(Fuse Assignment for MB) . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 6
Fig. 3.3.1 Rack R:MB/CCG(Fuse Assignment for SYP) . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 2
Fig. 3.3.2 Rack R:CE (Fuse Assignment for SYP). . . . . . . . . . . . . . . .PROC:SYP - 3
Fig. 3.3.3 Rack R:SE (Fuse Assignment for SYP). . . . . . . . . . . . . . . .PROC:SYP - 4
Fig. 3.3.4 Position of the SYP in the EWSD system . . . . . . . . . . . . . .PROC:SYP - 6
Fig. 3.3.5 Location of the USER-PROM on module COM:SYPC . . . .PROC:SYP - 8
Fig. 3.3.6 Location of the USER PROM on module PU:SYCR.. . . . . .PROC:SYP - 8
Fig. 3.3.7 Overview of system panel connections in F:SYPC . . . . . . .PROC:SYP - 9
Fig. 3.3.8 Overview of system panel connections in F:SMSC(C) . . .PROC:SYP - 10
Fig. 3.3.9 Front view of the system panel display SYPD . . . . . . . . . .PROC:SYP - 12
Fig. 3.3.10 SYPD modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 13
Fig. 3.3.11 Options for the connection of the systempanel display SYPD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 15
Fig. 3.3.12 E&M signaling (4-wire transmission) . . . . . . . . . . . . . . . . .PROC:SYP - 16
Fig. 3.3.13 Loop signaling (2-wire transmission) . . . . . . . . . . . . . . . . .PROC:SYP - 17
Fig. 3.3.14 SYPD E&M grounding on T/RM:SYPC . . . . . . . . . . . . . . .PROC:SYP - 18
Fig. 3.3.15 SYPD E&M grounding on T/RM:SYCR . . . . . . . . . . . . . . .PROC:SYP - 19
Fig. 3.3.16 Block diagram of the SYPD and its interfaces . . . . . . . . . .PROC:SYP - 21
Fig. 3.3.17 R/T and E+M interfaces in F:SMSCfor SYPD-0 - SYPD-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 22
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Fig. 3.3.18 R/T and E+M interfaces in F:SYPCfor SYPD-0 - SYPD-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SYP - 23
Fig. 3.3.19 R/T and E+M interfaces in frame SYPCfor SYPD-5 - SYPD-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SYP - 24
Fig. 3.3.20 Methods of connecting alarm lines to the MDF. . . . . . . . . PROC:SYP - 26
Fig. 3.3.21 Alarm inputs on the backplane connector of cable 223(32 wires) from the MDF to the SYP (module RM:EA) . . . PROC:SYP - 27
Fig. 3.3.22 Alarm inputs on the backplane connector of moduleT/RM:SYCR from the MDF to the SYP . . . . . . . . . . . . . . . PROC:SYP - 28
Fig. 3.3.23 Assignment of external alarms on the horizontal MDF . . . PROC:SYP - 28
Fig. 3.3.24 Assignment of external alarms on the vertical MDF . . . . . PROC:SYP - 29
Fig. 3.3.25 Connections on the jumper field for alarm output . . . . . . . PROC:SYP - 31
Fig. 3.3.26 Connector pin assignment for alarm forwarding on module TXA:SYPC. . .PROC:SYP - 32
Fig. 3.3.27 Connector pin assignment for alarm forwardingon module T/RM:SYCR . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SYP - 33
Fig. 3.4.1 Rack R:CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SN - 2
Fig. 3.4.2 SN Fuses / Frames and Modules in R:CE . . . . . . . . . . . . . . PROC:SN - 3
Fig. 3.4.3 R:SN(B)/LTGG cable routing from above . . . . . . . . . . . . . . . PROC:SN - 4
Fig. 3.4.4 R:SN(B)/LTGG cable routing from below . . . . . . . . . . . . . . . PROC:SN - 5
Fig. 3.4.5 R:SN(B)/LTGM cable routing from above . . . . . . . . . . . . . . . PROC:SN - 6
Fig. 3.4.6 R:SN(B)/LTGM cable routing from below . . . . . . . . . . . . . . . PROC:SN - 7
Fig. 3.4.7 R:SN/MB/LTGM cable routing from above . . . . . . . . . . . . . . PROC:SN - 8
Fig. 3.4.8 R:SN/MB/LTGM cable routing from below . . . . . . . . . . . . . . PROC:SN - 9
Fig. 3.4.9 R:TSG(B)/LTGG cable routing from above. . . . . . . . . . . . . PROC:SN - 10
Fig. 3.4.10 R:TSG(B)/LTGG cable routing from below . . . . . . . . . . . . . PROC:SN - 11
Fig. 3.4.11 R:TSG(B)/LTGM cable routing from above. . . . . . . . . . . . . PROC:SN - 12
Fig. 3.4.12 R:TSG(B)/LTGM cable routing from below . . . . . . . . . . . . . PROC:SN - 13
Fig. 3.4.13 R:SN/MB/LTGM cable routing from above . . . . . . . . . . . . . PROC:SN - 14
Fig. 3.4.14 R:SN/MB/LTGM cable routing from below . . . . . . . . . . . . . PROC:SN - 15
Fig. 3.4.15 Frame SSG(B) for SN (126 LTG) . . . . . . . . . . . . . . . . . . . . PROC:SN - 16
Fig. 3.4.16 Frame SSG(B) for SN (252 LTG..504 LTG) . . . . . . . . . . . . PROC:SN - 16
Fig. 3.4.17 R:SSG(B)/LTGG cable routing from above. . . . . . . . . . . . . PROC:SN - 17
Fig. 3.4.18 R:SSG(B)/LTGG cable routing from below . . . . . . . . . . . . . PROC:SN - 18
Fig. 3.4.19 R:SSG(B)/LTGM cable routing from above . . . . . . . . . . . . PROC:SN - 19
Fig. 3.4.20 R:SSG(B)/LTGM cable routing from below. . . . . . . . . . . . . PROC:SN - 20
Fig. 3.4.21 R:SN/MB/LTGM with F:SSG(B) cable routing from above . PROC:SN - 21
Fig. 3.4.22 R:SN/MB/LTGM with F:SSG(B) cable routing from below . PROC:SN - 22
Fig. 3.5.1 Rack R:SILTD . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCNC:CCS7 - 4
Fig. 3.5.2 Rack R:CCNP/SILTD. . . . . . . . . . . . . . . . . . . . . . PROC:CCNC:CCS7 - 5
Fig. 3.6.1 Fuse Assignment of R:LTGA . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 2
Fig. 3.6.2 Fuse Assignment of R:LTGB . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 3
Fig. 3.6.3 Fuse Assignment of R:LTGC . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 4
Fig. 3.6.4 Fuse Assignment of R:LTGC/CR . . . . . . . . . . . . . . . . . . . . PROC:LTG - 5
Fig. 3.6.5 Fuse Assignment of R:LTGD . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 6
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Fig. 3.6.6 Fuse Assignment of R:LTGF . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 7
Fig. 3.6.7 Fuse Assignment of R:LTGG. . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 8
Fig. 3.6.8 Fuse Assignment of R:LTGG:OSS . . . . . . . . . . . . . . . . . . .PROC:LTG - 9
Fig. 3.6.9 Fuse Assignment of R:SNB/LTGG(Cable routing from above) . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 10
Fig. 3.6.10 Fuse Assignment of R:SNB/LTGG(Cable routing from below). . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 11
Fig. 3.6.11 Fuse Assignment of R:LTGH. . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 12
Fig. 3.6.12 Fuse Assignment of R:LTGM. . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 13
Fig. 3.6.13 Fuse Assignment of R:SNB/LTGM(Cable routing from above) . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 14
Fig. 3.6.14 Fuse Assignment of R:SNB/LTGM(Cable routing from below). . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 15
Fig. 3.6.15 Fuse Assignment for R:SN/MB/LTGM(Cable routing from above) . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 16
Fig. 3.6.16 Fuse Assignment for R:SN/MB/LTGM(Cable routing from below). . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 17
Fig. 3.7.1 Digital announcement system DAS 300 . . . . . . . . . . . PROC:DAS300 - 1
Fig. 3.7.2 Digital announcement system DAS 300 (rear view) . . PROC:DAS300 - 2
Fig. 3.8.1 R:DSU, Configuration A-B-B-Modem. . . . . . . . . . . . . . . . . PROC:DSU - 2
Fig. 3.8.2 Connection of DLU to two LTG . . . . . . . . . . . . . . . . . . . . . PROC:DSU - 6
Fig. 3.8.3 Wiring between DIU:DLU and LTU . . . . . . . . . . . . . . . . . . PROC:DSU - 7
Fig. 3.8.4 Connection path from DLU to LTE. . . . . . . . . . . . . . . . . . . PROC:DSU - 8
Fig. 3.8.5 Connection path from LTG to LTE. . . . . . . . . . . . . . . . . . . PROC:DSU - 9
Fig. 3.9.1 R:DSU, Configuration A-B-B-Modem. . . . . . . . . . . . . . PROC:MODEM - 2
Fig. 3.9.2 R:Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MODEM - 3
Fig. 3.9.3 Frame F:Modem (GPT) . . . . . . . . . . . . . . . . . . . . . . . . PROC:MODEM - 4
Fig. 3.9.4 Frame F:Modem (NEUHAUS) . . . . . . . . . . . . . . . . . . . PROC:MODEM - 5
Fig. 3.10.1 Sicherungszuordnung R:DLUB (D-E-D-E). . . . . . . . . . . . PROC:DLUB - 2
Fig. 3.10.2 Sicherungszuordnung R:DLUB (D-E-D-D). . . . . . . . . . . . PROC:DLUB - 3
Fig. 3.10.3 Sicherungszuordnung R:DLUB (D-E-D-F) . . . . . . . . . . . . PROC:DLUB - 4
Fig. 3.10.4 Configuration of ’Remote Shelter DLU 400’. . . . . . . . . . . PROC:DLUB - 6
Fig. 3.10.5 Configuration of ’Remote Shelter DLU 700’. . . . . . . . . . . PROC:DLUB - 7
Fig. 3.10.6 Connection of DLUB to two LTG . . . . . . . . . . . . . . . . . . . PROC:DLUB - 9
Fig. 3.10.7 Wiring between DIU:DLU and LTU (DIU120A) . . . . . . . PROC:DLUB - 10
Fig. 3.10.8 Numbering method on F:LTGM . . . . . . . . . . . . . . . . . . . PROC:DLUB - 11
Fig. 3.10.9 Wiring between DIU:DLU and LTU (DIU30D) . . . . . . . . PROC:DLUB - 12
Fig. 3.10.10 Connection path from DLUB to LTE . . . . . . . . . . . . . . . PROC:DLUB - 12
Fig. 3.10.11 Connection path from LTG to LTE. . . . . . . . . . . . . . . . . PROC:DLUB - 13
Fig. 3.11.1 TESMOD2E -Overview . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 1
Fig. 3.11.2 Memory organization for DLUC and TESMOD2E . PROC:TESMOD2E - 2
Fig. 3.11.3 Input and display panel . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 5
Fig. 3.12.1 Fuse Assignment R:DLUD (G-E-G-E) . . . . . . . . . . . . . . . PROC:DLUD - 2
Fig. 3.12.2 Fuse Assignment R:DLUD (G-E-G-G) . . . . . . . . . . . . . . . PROC:DLUD - 3
Fig. 3.12.3 Fuse Assignment R:DLUD (G-E-G-F) . . . . . . . . . . . . . . . PROC:DLUD - 4
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Fig. 3.12.4 Configuration of ’Remote Shelter DLU 400’ . . . . . . . . . . .PROC:DLUD - 6
Fig. 3.12.5 Configuration of ’Remote Shelter DLU 700’ . . . . . . . . . . .PROC:DLUD - 7
Fig. 3.12.6 Connection of remote DLUD to two LTG . . . . . . . . . . . . .PROC:DLUD - 9
Fig. 3.12.7 Wiring between DLUS and LTU (DIU120A) . . . . . . . . . .PROC:DLUD - 10
Fig. 3.12.8 Numbering method on F:LTGM . . . . . . . . . . . . . . . . . . .PROC:DLUD - 11
Fig. 3.12.9 Wiring between DLUS and LTU (DIU30D) . . . . . . . . . . .PROC:DLUD - 12
Fig. 3.12.10 Connection path from DLUD to LTE . . . . . . . . . . . . . . . .PROC:DLUD - 12
Fig. 3.12.11 Connection path from LTG to LTE . . . . . . . . . . . . . . . . .PROC:DLUD - 13
Fig. 3.13.1 Overview: Hardware belonging to the CP-Complex . . . PROC:CP113D - 5
Fig. 3.13.2 Overview of Interfaces B:CMY . . . . . . . . . . . . . . . . . . . PROC:CP113D - 6
Fig. 3.13.3 Module Connectors and numbering . . . . . . . . . . . . . . . PROC:CP113D - 7
Fig. 3.13.4 Coding switch on module MUH:1088 . . . . . . . . . . . . . . PROC:CP113D - 8
Fig. 3.13.5 Rack R:CP113A - Variant A . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 9
Fig. 3.13.6 Rack R:CP113B - Variant A . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 10
Fig. 3.13.7 Rack R:DEVD - Variant A . . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 11
Fig. 3.15.1 Overview: Hardware belonging to the CP-ComplexPROC:CP113C/CR - 5
Fig. 3.15.2 Overview of Interfaces B:CMY . . . . . . . . . . . . . . . .PROC:CP113C/CR - 6
Fig. 3.15.3 Overview IOPs (DE5/2). . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 7
Fig. 3.15.4 Overview IOPs (DE5/4) Part 1 . . . . . . . . . . . . . . . .PROC:CP113C/CR - 8
Fig. 3.15.5 Overview IOPs (DE5/4) Part 2 . . . . . . . . . . . . . . . .PROC:CP113C/CR - 9
Fig. 3.15.6 Cabling of the 230V inverter DCIRC . . . . . . . . . . .PROC:CP113C/CR - 10
Fig. 3.15.7 230V AC-Connectors on Inverter DCIRC . . . . . . .PROC:CP113C/CR - 11
Fig. 3.15.8 Fan Alarm Cabling in CP113C/CR . . . . . . . . . . . .PROC:CP113C/CR - 12
Fig. 3.15.9 SCSI bus cabling for MDD, MOD and MTD(CP113C/CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 13
Fig. 3.15.10 SCSI bus cabling of 2 MTDs (CP113C/CR) . . . . .PROC:CP113C/CR - 14
Fig. 3.15.11 SCSI bus cabling with MDD and MOD(CP113C/CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 15
Fig. 3.15.12 F:DEVF front view. . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 16
Fig. 3.15.13 F:DEV(F) rear view with cabling to:MDD, MOD and MTD (CP113C/CR) . . . . . . . . . .PROC:CP113C/CR - 16
Fig. 3.15.14 Overview of MP:CP113C . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 18
Fig. 3.15.15 Normal display of MP:CP113C . . . . . . . . . . . . . . .PROC:CP113C/CR - 18
Fig. 3.15.16 Rack R:CP113C . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 20
Fig. 3.15.17 Rack R:CP113 CE . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 21
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TablesTab. 3.1.1 CCG Racks and Frames . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 5
Tab. 3.1.2 Types of submodules and concerning referencefrequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 5
Tab. 3.1.3 Submodules and specification of CCGxxA . . . . . . . . . . . . PROC:CCG - 6
Tab. 3.1.4 Necessary Submodules for CCGxxA. . . . . . . . . . . . . . . . . PROC:CCG - 6
Tab. 3.1.5 Terminals for cross-joint cable 570-802/570-804. . . . . . . . PROC:CCG - 7
Tab. 3.1.6 Terminals for reference clock cables . . . . . . . . . . . . . . . . . PROC:CCG - 7
Tab. 3.2.1 Fuse Assignment R:MB/CCG Basic Rack . . . . . . . . . . . . . PROC:MBB - 3
Tab. 3.2.2 Fuse Assignment R:MB/CCG Extension Rack . . . . . . . . . PROC:MBB - 3
Tab. 3.2.3 Fuse Assignment R:SN/MB/LTGMBasic Rack / Extension Rack . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 5
Tab. 3.2.4 Fuse Assignment R:SN/MB/LTGM Extension Racks . . . . PROC:MBB - 5
Tab. 3.2.5 Fuse Assignment R:CE . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 7
Tab. 3.2.6 Capacity stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 7
Tab. 3.3.1 Explanations on E&M and loop signaling. . . . . . . . . . . . . .PROC:SYP - 17
Tab. 3.3.2 Mounting locations of SYPD connections on F:SYPC(A) .PROC:SYP - 34
Tab. 3.3.3 Mounting locations of SYPD connections on F:SMSC(C) .PROC:SYP - 34
Tab. 3.5.1 LEDs on M:PU:SIMP (M:PMU:SIMP) . . . . . . . . . .PROC:CCNC:CCS7 - 1
Tab. 3.5.2 LEDs on M:MH:SIMP. . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 1
Tab. 3.5.3 LEDs on M:SIPA . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 1
Tab. 3.5.4 LEDs on M:PU:CPI (M:PMU:CPI) . . . . . . . . . . . . .PROC:CCNC:CCS7 - 2
Tab. 3.5.5 LEDs on M:SILTC . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 2
Tab. 3.5.6 LEDs on M:SILTD . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 2
Tab. 3.5.7 Fuse assignment R:CCNP/SILTD(shielded or unshielded version) . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 3
Tab. 3.5.8 Fuse assignment R:CCNP/SILTD(partially shielded version) . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 3
Tab. 3.5.9 Fuse assignment R:SILTD. . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 3
Tab. 3.8.1 Equipment list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DSU - 3
Tab. 3.8.2 Mounting location list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DSU - 4
Tab. 3.10.1 Assignment of primary fuses . . . . . . . . . . . . . . . . . . . . . . PROC:DLUB - 7
Tab. 3.10.2 Assignment of secondary fuses . . . . . . . . . . . . . . . . . . . . PROC:DLUB - 8
Tab. 3.10.3 Pin numbers for PCM30 connectors of DIU120A . . . . . PROC:DLUB - 10
Tab. 3.11.1 Switch functions . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 3
Tab. 3.11.2 Key functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 4
Tab. 3.11.3 Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 4
Tab. 3.11.4 Switch functions . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 6
Tab. 3.11.5 Test codes and test routines . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 7
Tab. 3.11.6 Basic switch settings on control panel . . . . . . . . . PROC:TESMOD2E - 10
Tab. 3.11.7 Basic switch settings on the input and displaypanel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 10
Tab. 3.11.8 Mounting locations for module typesQ965, Q1101, Q838 . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 10
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Tab. 3.11.9 Mounting locations for module typesQ1103, Q1192 . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 11
Tab. 3.11.10Mounting locations for module type Q1338 . . . . .PROC:TESMOD2E - 11
Tab. 3.11.11DCC ID-Bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 11
Tab. 3.11.12Flag-Bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 12
Tab. 3.11.13Module ID-Bytes . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 12
Tab. 3.12.1 Assignment of primary fuses. . . . . . . . . . . . . . . . . . . . . . .PROC:DLUD - 7
Tab. 3.12.2 Assignment of secondary fuses . . . . . . . . . . . . . . . . . . . .PROC:DLUD - 8
Tab. 3.12.3 Pin numbers for PCM30 connectors of DIU120A . . . . . .PROC:DLUD - 10
Tab. 3.13.1 Coding switch settings . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 8
Tab. 3.13.2 Fuse Assignment of R:CP113A (Variant A) . . . . . . . . PROC:CP113D - 12
Tab. 3.13.3 Fuse Assignment of R:CP113B (Variant A) . . . . . . . . PROC:CP113D - 12
Tab. 3.13.4 Fuse Assignment of R:DEVD (Variant A) . . . . . . . . . . PROC:CP113D - 13
Tab. 3.13.5 Fuse Assignment to Fans . . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 13
Tab. 3.13.6 Overview: OEM-Devices / IOPs / frames . . . . . . . . . . PROC:CP113D - 14
Tab. 3.13.7 Sequence for Switching on the Frames . . . . . . . . . . . PROC:CP113D - 14
Tab. 3.13.8 Displays after successful Hardware Startup . . . . . . . . PROC:CP113D - 15
Tab. 3.15.1 Modules with front connector for MP:CP113C . . .PROC:CP113C/CR - 17
Tab. 3.15.2 Key functions of MP . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 19
Tab. 3.15.3 Fuse Assignment R:CP113C . . . . . . . . . . . . . . . .PROC:CP113C/CR - 22
Tab. 3.15.4 Fuse Assignment R:DEVB . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 23
Tab. 3.15.5 Fuse Assignment to fans . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 23
Tab. 3.15.6 Fuse Assignment for R:CE (CP113 Compact Rural) PROC:CP113C/CR -23
Tab. 3.15.7 Memory organization . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 25
Tab. 3.15.8 Sequence for switching on the modules R:CP113C . PROC:CP113C/CR -25
Tab. 3.15.9 Sequence for switching on the modules R:CE . . .PROC:CP113C/CR - 26
Tab. 3.15.10Displays after successful Hardware Startup . . . . .PROC:CP113C/CR - 27
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1 Introduction
1.1 Overview of functional areas and subsystems
Fig. 1.1.1 Functional areas in a network node together with the subsystems
Coordination
CP
Common channel signaling
DLU
LTG
LTG
Access Switching
SN
CCNC
SYP
MB
CCG
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1.2 CE Declaration of Conformity
1.3 Required knowledge
No specialist knowledge is required to carry out installation testing of a system with fault-free hardware and software. The experience described below is generally sufficient.
• Basic training on SSS-NE (EWSD)
• Practical experience in the operation of SSS-NE (EWSD systems) and clearance ofsimple faults
• General knowledge of how to use D900/D1800 documents such as maintenancemanuals, command manual, hardware documents
• Handling of fault reports:
– Hardware fault reports
– Software fault reports
– Document error reports
1.4 Locating Modules and Test Points
The term "mounting unit" is abbreviated to MUT and "mounting location" to MOLOC.The black fast-on connector point to the right of the wrapping field is marked "202”, andthe one to the left of the wrapping field "205".
iAttention !The CE Declaration of Conformity for the product will be fulfilled if the construction andcabling is undertaken in accordance with the manual and the documents listed therein,e.g. mounting instructions, cable lists. Where necessary account should be taken ofproject-specific documents.
Deviations from the specifications or unstipulated changes during construction, e.g. theuse of cable types with lower screening values can lead to violation of the CE require-ments. In such cases the conformity declaration is invalidated and the responsibilitypasses to those who have caused the deviations.
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Fig. 1.4.1 Meaning of the test points
In multiple statements the individual figures are separated by a slashe.g.: 03/05 A 205 19.
1.5 Test Equipment
The test equipment required for fault clearance is specified in the descriptions of the indi-vidual systems. A comprehensive list of these devices can be found in the list ofuniversal measurement and test equipment.
1.6 List of Universal Measurement and Test Equipment
The details relate to devices which are necessary for the installation of an EWSDsystem. Devices from other manufacturers can be used in place of those given here, aslong as their specifications are equivalent.
• Digital multimeter, e.g. Siemens VMG-3
• Continuity tester, e.g. Cirtest PS 12
• Test headset 600/10000 ohms
1.7 System Voltages in the SSS-NE
All the system units in an EWSD exchange require a system voltage of -40V to -75V(peak -80V).
This means that all units which are operated via voltage converter or inverters can workwith this system voltage. These units include:
CP, MB, CCG, SYP, SN, CSC, LTG, DLU
Exceptions: All load circuits which access the system voltage directly. Care must betaken here to ensure that the system voltage tolerances prescribed by the manufac-turers are observed.
Meaning of the test points (SIVAPAC) e.g:(Rear of module frame)
Mounting units
Row in module frame
Mounting location
Terminal (wire wrap pin)
03 A 205 19
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e.g.: DAS = Digital announcement unit
1.8 Error Reports on the Installation Test Manual
Incorrect or unclear sections of the ITMN should be described in detail in a documenterror report.
The error report must be sent to TAC or VI.
1.9 Dealing with Defective Modules
If a module should prove to be defective, it should have a form attached to it (e.g. hard-ware fault report as supplied by the relevant administration) containing the followinginformation:
1. Name and code number of the module or OEM device
2. Description of the fault
The module/OEM device should then be sent to the repair center in an EWSD modulebox or OEM-device container together with the form.
If possible, magnetic tape devices should be repaired on site by trained technicians.
1.10 Procedure in the Event of Faults
If faults occur in on-line operation, the system messages should be interpreted bymeans of the Maintenance Manual (MMN) and/or the Command Manual (CML).
Hardware faults should be localized and cleared in accordance with the instructions inthe Maintenance Manual.
1.11 Procedure in the Event of Serious Faults
Serious faults are those which are not dealt with in the MMN. They include:
– short circuits, breaks in cables
– short circuits, breaks in the backplane wiring (wire wrapping, cables, foreign mate-rial)
– multiple faults
– faults where the MMN instructions are insufficient
– software errors (general programs, exchange-specific data memories)
If there is a malfunction in a unit, this should normally be reported first to the specialistin the installation test team, and then to the higher-level Technical Assistance Center(TAC).
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If the installation technician is not qualified to eliminate serious faults, a fault report mustbe filled out, providing the following information in detail:
– description of the test step attempted
– description of the system response, if possible including the fault printouts
– description of any system activities taking place at the same time, e.g. work done byother testers during modifications to hardware or software, or activities on subscriberstations, test desk
– tracer logs (if applicable)
1.12 Checking the Scope of Delivery and the Installation Work
Compare the parts list in the contract with the delivery documents and the assembledexchange, with reference to the exchange-related documentation.
• Check the installation work
The following installation work must be carried out before testing:
– The EWSD racks are assembled
– The internal cabling of the system is completed
– The system voltage of -48V/-60V is connected and constantly available (theemergency power supply system is operational)
– The EWSD racks are equipped with the current hardware/firmware (see AKUHWlists)
• Check the software
The following should be observed:
– The system APS must be available and released by the department responsiblefor system acceptance
– System-specific exchange acceptance DATABASE on magnetic tape
– Floppy disks containing the software required for PC installation (see MMN:PCRegister BASIS)
– Project-specific user-EPROM or standard PROM for SYPC
– Test diagnostic command file
• Check the documentation
Check that the exchange-related documentation is complete. The following are themost important documents:
– DOL - Document list
– SUP - Survey plan
– SUL - Survey list
– LP - Equipment layout plan
– LL - Layout list
– EP - Equipment plan
– EL - Equipment list
– AL - Allocation list
– CLL - Cable laying list
A check should also be made, using superordinate documents, to ascertain thatdocuments which are not system-specific are complete and up-to-date.
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This applies in particular to: Manuals
• Check the equipment
The main points for a visual check in an EWSD exchange are:
– Check that the racks are complete by comparing with the equipment lists
– Check that the test and auxiliary equipment is complete and functions correctly
– Check the input/output devices and the background memory
– Check that the system tapes and data tapes are complete, and also the correctiontape if applicable
• Visual check of the entire system
– The cabling and positioning of the modules should be checked against the instal-lation instructions for the individual system components.
– Check that the modules are firmly in position.
1.13 Interpretation of Exchange Configuration Documents
For overview and interpretation of the exchange configuration documents seeOGL:ECD.
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2 Task List
2.1 Installation Test Sequence of Register OFFLINE
Fig. 2.1.1 Installation Test Sequence of Register OFFLINE
Manual MMN:DSU/DLUB/DLUD, TAB, MOD
Manual MMN:PC Register BASIS
The CCG has a special position in the installation test sequence.When it is tested, check wether the reference frequency(ies) is (are)already switched on.- Wiring of a CCGxxA module- Plesiochronous mode/ synchronous mode- Waiting times before testing(The CCG should be switched on as early as possible so that thequartz crystals can temperature-stabilize as soon as possible.
Installation test of SYP and plug in the USER-PROM
Test of the SNMalfunctions caused by cabling faults (cross joint cable), must belocated by means of diagnosis
Installation test of CCNC
Installation test of LTG
Maintenance of DSU/DLUB/DLUDThe section MOD is used to set switches of DSU/DLUB/DLUD
Installation test of CPThe section MMN:PC Register BASIS is used for startup of the PC
Part in the ITMN-OFFLINE
The INTRO section contains basic information
Content
Introduction
Installation test of DAS 300
CCG
MBB Installation test of MB(B)
SYP
SN
LTG
DAS 300 TEST
DSU DLUB
TESMOD2E
CP113C/CR
DLUD
CCNC:CCS7
CP113D
MODEM
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3 Procedures (PROCIN)
Notes on module replacement:
• Precautionary measures for electrostatic-sensitive componentsAll modules are equipped with electrostatic-sensitive components (ESD symbol).For this reason the precautionary measures for electrostatic-sensitive componentsmust be observed when extracting and inserting modules.When replacing modules, the maintenance personnel must wear a conducting wrist-strap to discharge static. Before modules, leads or components are touched, thewrist-strap must be connected via a flexible lead to the ground potential of the rack.It is important to note that the conducting parts of the banana plug must not betouched while the lead is being plugged in (bridging of the leakage resistance).Further information can be found in the brochure “Safety Instructions for Personneland for Products as per EN 60950” (A30808-X3008-X280-*-7619).
• Extracting and inserting modulesWhen replacing modules it is essential that the special tool provided (C39300-A195-C70) should be used both for extracting and for inserting modules.Faulty modules that have been removed must be marked as faulty, and they must behandled just as carefully as new modules.For transportation to a repair center the faulty modules must be marked and packedin accordance with the precautionary requirements for electrostatic-sensitivecomponents.Further information can again be found in the brochure “Safety Instructions forPersonnel and for Products as per EN 60950” (A30808-X3008-X280-*-7619).
• Replacement modulesThe replacement module must be identical with the original module (same codenumber both for HW/FW and for functional status). In exceptional cases theFunctional Level List can be used to determine whether the functional status of thereplacement module (as regards HW/FW) is compatible with that of the originalmodule.If there are switches or other control elements on the module, they must be set asthey were on the extracted original module.
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3.0.1 Explanations of the Procedure Elements
Fig. 3.0.1 Elements used in the procedures
12 Decision block
Must clearance of this fault be postponed (e.g. because no sparemodules available)?
Commentary are always written in italics
b CONF SN:SN=sn,OST=STB;
ERROR MESSAGE DURING CONFIGURATION OF MCH-0-ltg MMN:MCH50-zzzz
To evaluate the system output, see
Continue according to the system reaction:
- EXEC’D..................................................................................................
- NOT EXEC’D..........................................................................................
- else.........................................................................................................
i....PROC:SN001
h.......18h.......19
Y h .....13
N h .....16
.....AL:SN
Block number
Commentary(in italics)
MML commandinput
MML mask(Courier
Multiplebranch
Branch symbol
Yes/Nobranch
Branch dest.(block number)
Block
Reference todocument withadditionalinformation
Branch symbolwith reentry
13 Decision block
typeface)
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3.1 Off-line Installation of Common Clock Generator
CCG
3.1.1 Documents
The following documents are required as references
– Maintenance Manual MMN:CCG / MMN:CCG for CDE
– AKUHW Lists
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3.1.2 Rack MB/CCG(Fuse Assignment for CCG)
Fig. 3.1.1 Rack: MB/CCG(Fuse Assignment for CCG)
A
B
F:MB/CCG(A) orF:MB/CCG(B)
CD
Fuse panel
MUT02
MUT03
MUT06
MUT07
MUT08
MUT09
MUT01
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
02
12
FU
MOLOC A119 or A121 (CCG)
MOLOC A119 or A121 (CCG)
MUT05
MUT04
F:MB/CCG(A) orF:MB/CCG(B)
F:SYPC(A)
F:MB/CCG(A) orF:MB/CCG(B)
F:MB/CCG(A) orF:MB/CCG(B)
SYPD (or empty)
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3.1.3 Rack SN/MB/LTGM(Fuse Assignment for CCG)
Fig. 3.1.2 Rack: SN/MB/LTGM(Fuse Assignment for CCG)
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
D
F:TSG(B), F:SSG(B)or F:LTGM(A)
Fuse panel
C
DFU
F:TSG(B), F:SSG(B)or F:LTGM(A)
MOLOC A121 (CCG)
MOLOC A121 (CCG)
F:MB/CCG(B)
F:TSG(B), F:SSG(B)or F:LTGM(A)
F:TSG(B), F:SSG(B)or F:LTGM(A)
F:MB/CCG(B)23
09
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3.1.4 Rack CE(Fuse Assignment for CCG)
Fig. 3.1.3 Rack CE(Fuse Assignment for CCG)
C
DF:SMSC(C)-0
F:SMSC(C)-1
F:PIOP(A)
F:PBC(A)
F:PBC(A)
F:DEV
Fuse panel / AD:RAL
MUT02
MUT04
MUT03
MUT06
MUT09
MUT10
C
D
C
D
C
D
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
04
25
FU
MOLOC C153 (Supply for CCG-0)
MOLOC C153 (Supply for CCG-1)
292721 2523 31 33
30282622 3224
F:PIOPA)C
D
Air circulator
MUT11
MUT07
MUT05
MUT08
MUT01
Air circulator
Air circulator
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3.1.5 CCG Racks / Frames / Modules
The CCG consists of 4 modules which can be located in the following racks / frames:
The modules are:
– M:CCGB
– M:CCGD
– M:CCGxxA
– M:DCCCR
In accordance with the environmental requisites of the EXCH the CCG can be used inthe following operating modes:
– plesiochronous mode
– synchronous mode
The module M:CCGxxA has to be equipped with different submodules according to thenumber of reference frequencies and the operating mode used.The use of two submodules is standard. One CCGxxA module with two submodules canprocess two reference frequencies.
3.1.5.1 Submodules for CCGxxAThe type of the submodules used is dependent upon the reference frequencyconcerned:
The dummy xx in the term CCGxxA depends on the submodule used:
Rack Frame Module FrameCode Number
R:MB/CCG F:MB/CCG(A) S30804-B2567
F:MB/CCG(B) S30804-B2641
R:SN/MB/LTGM F:MB/CCG(B) S30804-B2641
R:CE F:SMSC(C) S30804-B2693
Tab. 3.1.1 CCG Racks and Frames
type ofsubmodule
reference frequency
Type1 (D319) 2,048 MHZ / 300 KHZ
Type2 (D320) 5 MHZ / 10 MHZ
Type3 (D337) 1,544 MHZ / 300 KHZ
Tab. 3.1.2 Types of submodules and concerning referencefrequencies
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Depending on the position of the EXCH in the network hierachy, different referencefrequencies have to be used. An overview is given in the following table:
*)In a synchronous digital network, master exchanges are those which receive their refer-ence frequencies directly from a universal frequency standard UFS. UFS standardsgenerate reference frequencies of 5 MHz, 10 MHz, 2.048 MHz and 1.544 MHz,depending on the delivery. The use of a reference frequency of 2.048 MHz is standard.The type of CCGxxA module, i.e. its equipping with submodules, depends on the refer-ence frequency present in each case.
If there is not yet a master exchange with primary standard, or an all-embracing PCMnetwork, the CCG(A) must be operated plesiochronously (island exchange). TheCCG(A) then works with its own accuracy. Every CCGxxA module always generates afrequency of 2.048 MHz, irrespective of which submodules are plugged in and whetherthey are synchronized or not. In this way the CCG-0 can synchronize the CCG-1 if theCCG10A or CCG11A module is plugged in the CCG-1.If CCG22A or CCG33A are plugged in, both modules have to be installed plesiochro-nously.
Submodule 0 Submodule 1 CCGxxA-
Type 1 (D319) Type 1 (D319) CCG11A
Type 2 (D320) Type 2 (D320) CCG22A
Type 3 (D337) Type 3 (D337) CCG33A
Tab. 3.1.3 Submodules and specification of CCGxxA
Exch(s) CCGxxA Input module Reference freq.
Master Exch(s) CCGxxA
*)
Type 1 (D319) 2.048 MHz
Type 2 (D320) 5 or 10 MHz
Type 3 (D337) 1,544 MHz
Slave Exch(s) w. PCM30 CCG11A Type 1 (D319) 2.048 MHz
Slave Exch(s) w. PCM24 CCG33A Type 3 (D337) 1.544 MHz
Tab. 3.1.4 Necessary Submodules for CCGxxA
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3.1.6 Terminals for Cross-joint Cables and Reference Clock Cables
3.1.6.1 Terminals for Cross-joint Cable 570-802/570-804
3.1.6.2 Terminals for Reference Clock Cables
*)No reference clock cables may be plugged in when plesiochronous mode is used,even if they are listed in the cable laying list.
Operating mode F:MB/CCG(A) F:MB/CCG(B) F:SMSC(C)
CCG-0 CCG-1 CCG-0 CCG-1 CCG-0 CCG-1
Plesiochronous modewith synchronization ofCCG1 by CCG0(at least one CCG1xAmust be on CCG1)
B112 A112 B114 A114 D193 C193
Synchronous mode withone reference frequency
A112 A112 A114 A114 C193 C193
Synchronous mode with 2reference frequencies
A112 A112 A114 A114 C193 C193
Tab. 3.1.5 Terminals for cross-joint cable 570-802/570-804
Operating mode F:MB/CCG(A) F:MB/CCG(B) F:SMSC(C)
CCG-0 CCG-1 CCG-0 CCG-1 CCG-0 CCG-1
Plesiochronous mode *) *) *) *) *) *)
Synchronous mode withone reference frequency
A109 ------- A111 ------- C187 -------
Synchronous mode with 2reference frequencies
A109 B109 A111 B111 C187 D187
Tab. 3.1.6 Terminals for reference clock cables
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3.1.6.3 Standard Cabling CCG(A) in F:MB/CCG(B)(Plesiochronous mode)
Fig. 3.1.4 Standard cabling CCG(A) in F:MB/CCG(B)(Plesiochronous mode)
CCG11A
49
50
Submodule 0
A111
A114
B111
2949
50
B114
2,048 MHz
29
49
50
Backpanel
S3 S2 S1
P0 R2 R1
D319
A111
A111
4344
CCG-0
CCG-1
F E D C
Cross-joint-Cable 570-804
2,048 MHz
2,048 MHz
No cable plugged in!
No cable plugged in!
249
250
Submodule 1
229D319
F E D C
4746
CCG11A
49
50
Submodule 0
A111
A114
B111
2949
50
B114
2,048 MHz
29
49
50
S3 S2 S1
P0 R2 R1
D319
43
44
F E D C
249
250
Submodule 1
229D319
F E D C
4746
Backpanel
48
48
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3.1.6.4 Standard Cabling CCG(A) in F:MB/CCG(B)(Synchronous mode with 2,048 MHZ)
Fig. 3.1.5 Standard cabling CCG(A) in F:MB/CCG(B)(Synchronous mode with 2,048 MHZ)
CCG11A
49
50
Submodule 0
A111
A114
B111
2949
50
B114
2,048 MHz
29
49
50
Backpanel
S3 S2 S1
P0 R2 R1
D319
A111
A111
4344
CCG-0
CCG-1
F E D C
Cross-joint-Cable 570-802
2,048 MHz
249
250
Submodule 1
229D319
F E D C
4746
CCG11A
49
50
Submodule 0
A111
A114
B111
2949
50
B114
2,048 MHz
29
49
50
S3 S2 S1
P0 R2 R1
D319
43
44
F E D C
249
250
Submodule 1
229D319
F E D C
4746
Backpanel
48
910
910
ref
ref
Ref 0
2,048 MHZfrom DIU or PRCsymm.
Ref 1
2,048 MHZfrom DIU or PRCsymm.
Clock from:MDF, with cableType 941/ 942
or fromLTG, with cableType 923/ 924
48
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3.1.6.5 Standard Cabling CCG(A) in F:SMSC(C)(Plesiochronous mode)
Fig. 3.1.6 Standard cabling CCG(A) in F:SMSC(C)(Plesiochronous mode)
CCG11A
49
50
Submodule 0
C187
C193
D187
2949
50
D193
2,048 MHz
29
49
50
Backpanel
S3 S2 S1
P0 R2 R1
D319
C187
C187
4344
CCG-0
CCG-1
F E D C
Cross-joint-Cable 570-804
2,048 MHz
2,048 MHz
No cable plugged in!
No cable plugged in!
249
250
Submodule 1
229D319
F E D C
4746
CCG11A
49
50
Submodule 0
C187
C193
D187
2949
50
D193
2,048 MHz
29
49
50
S3 S2 S1
P0 R2 R1
D319
43
44
F E D C
249
250
Submodule 1
229D319
F E D C
4746
Backpanel
48
48
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3.1.6.6 Standard Cabling CCG(A) in F:SMSC(C)(Synchronous mode with 2,048 MHZ)
Fig. 3.1.7 Standard cabling CCG(A) in F:SMSC(C)(Synchronous mode with 2,048 MHZ)
CCG11A
49
50
Submodule 0
C187
C193
D187
2949
50
D193
2,048 MHz
29
49
50
Backpanel
S3 S2 S1
P0 R2 R1
D319
C187
C187
4344
CCG-0
CCG-1
F E D C
Cross-joint-Cable 570-802
2,048 MHz
249
250
Submodule 1
229D319
F E D C
4746
CCG11A
49
50
Submodule 0
C187
C193
D187
2949
50
D193
2,048 MHz
29
49
50
S3 S2 S1
P0 R2 R1
D319
43
44
F E D C
249
250
Submodule 1
229D319
F E D C
4746
Backpanel
48
910
910
ref
ref
Ref 0
2,048 MHZfrom DIU or PRCsymm.
Ref 1
2,048 MHZfrom DIU or PRCsymm.
Clock from:MDF, with cableType 941/ 942
or fromLTG, with cableType 923/ 924
48
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1 Decision Block
When the basic test has been completed, changeover from plesiochronous tosynchronous mode can be made if the reference frequency(ies) is/are available.
– Starting the basic test h...2– Changeover from plesiochronous to synchronous mode h...26
2 Check of System Voltage per Rack Row
Ensure that the main fuses are unscrewed before starting the check
Measure the system voltage for each rack row at the last frame
The operational voltage is dependent upon the charging status of the batteries:
Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6V ... -57V)
Is system voltage -60V (-48V) present? Y h...4N h...3
3 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...2
4 Basic Test (Rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
5 Preparation of Basic Test
Pull reference clock and cross-joint cables ......(see 3.1.6)
6 Information about Basic Test
The basic test must be carried out for CCG-0 and CCG-1 successively. CCGxxAmodules must be handled with great care as the quartz oscillators installed onthe modules are sensitive to shock and impact.
7 Checking the Required CCGxxA Modules
Check that the correct CCGxxA modules are inserted
Information about the required CCGxxA modules ......(see 3.1.5.1)
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8 Checking Switch Settings and Solder Straps
Set only those switches described in the MMN. All other switches are set by themanufacturer.Set DIP-FIX switches according to the hardware currently present.
Check that all the solder straps and DIP-FIX switches of the CCGxxA andCCGB described in the MMN are in the correct position for plesiochronousmode.
......MMN:CCG,TAB LED:CCG
9 Checking DCCs
Pull modules CCGB, CCGD and CCGxxA of the CCG-0 (CCG1), but leave inposition
Screw in the associated fuse:
Fuse assignment in R:MB/CCG ...... (see Fig. 3.1.1)
Fuse assignment in R:SN/MB/LTGM ...... (see Fig. 3.1.2)
Fuse assignment in R:CE ...... (see Fig. 3.1.3)
Switch on the associated DCC
Is the green LED of the DCC lit? Y h...12N h...10
10 Replacing Defective DCC
Switch off defective DCC
Unscrew corresponding fuse
Check that spare module is switched off
Replace defective DCC by spare module
Screw in corresponding fuse
Switch on DCC
Is the green LED of the DCC lit? Y h...12N h...11
11 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...9
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12 Checking CCG Modules
Switch off DCC
Insert all modules of the associated CCG
Switch on DCC
If LED goes dark again, there is presumably a short circuit in the CCG-modules.
– If LED is lit h...18– If LED is dark h...13
13 Prepare Search for Module Suspected of Shorting
Switch of DCC
Pull all modules of the associated CCG
14 Search for Module Suspected of Shorting
Repeat the following steps until all modules of the CCG concerned have beentested.
Switch off DCC of the CCG concerned (if not already done)
Insert first/ next module
Switch on DCC of the CCG concerned
The following system reactions are possible
– Green LED on DCC is lit h...17– Green LED on DCC is not lit h...15
15 Replace Defective Module
Short circuit on the module last inserted
Switch off DCC of the CCG concerned
Replace defective module by spare module
Switch on DCC of the CCG concerned
Is the green LED of the DCC lit? Y h...17N h...16
16 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...17
17 Decision Block
Have all modules already been tested? Y h...18N h...14
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18 Checking LED AL
Is LED AL on module CCGxxA lit? Y h...20N h...19
19 Replacing Module CCGxxA
Switch off DCC
Replace module by spare module
– After replacing the module h...12
20 Decision Block
Have both CCGs already been tested? Y h...21N h...9
21 Plesiochronous Mode
CCG-0 and CCG-1 do not receive an external reference frequency. Duringplesiochronous mode with synchronization of CCG1 by CCG0, only the cross-joint cable may be plugged in. Clock cables must not be plugged in, even if theyare listed in the cable laying list. Plesiochronous mode with synchronization ofCCG1 by CCG0 is possible only if there is at least one CCG11A plugged in theCCG-1.If CCG22A or CCG33A are plugged in, both CCGs have to be run plesiochro-nously.
Is there at least one CCG11A in the CCG1? Y h...22N h...24
22 Plesiochronous Mode with Synchronization of CCG1 by CCG0
Switch off converter DCCCR at both CCGs
Insert cross-joint cable type 570-802 ...... (see Tab. 3.1.5)
Switch on converter DCCCR at both CCGs
LED AL lights approx. 30 minutes
Then In CCG-0 the LEDs P (plesiochronous) and F (free-running) light on thefaceplate of CCG11A-0. In CCG-1 the LEDs A (holdover state A) and REF0 lighton the faceplate of CCG11A-1.
Then the display on the CCG11A-1 changes to synchronous state 4 via hold-over state B. After synchronization the LEDs F and P on module CCG11A-0light up, as do LEDs REF0 and synchronous state 4 on module CCG11A-1.
When both CRA (control range) LEDs light, PLL regulation is working to itslimits. If LED AL also lights up, there is no longer any synchronization.
– If both CRA LEDs are on h...23– If LEDs are dark h...25
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23 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...22
24 Plesiochronous Mode without Synchronization of CCG1 by CCG0
LED AL lights approx.30 minutes
When the LED AL has gone dark, the LEDs P (plesiochronous) and F (free-running) light up
25 Decision Block
End of basic test CCG
Should changeover from plesiochronous mode to synchronous mode be carriedout? (Reference frequency(ies) must be available) Y h...26
N h...END
26 Prerequisites
Subsequent external synchronization of the exchanges must be carried out insequence according to the network hierarchy. Changeover from plesiochronousto synchronous mode is described below for the following basic configuration:
• The CCGs are equipped with CCG11A modules
• 2.048 MHz frequencies of high accuracy must be available for synchroniza-tionThe reference frequencies are derived from a primary frequency standard orfrom the DIU30D/DIU120D of a LTG. The connection with the referencefrequencies is established via symmetrical cables (120 Ohm)
– references of a frequency standard are cabled to the MDF and from thereto the CCG with cable type 941/942
– references of the LTG are cabled to the CCG with cable type 923/924
• Reference cable and cross-joint cable must be available.
The cross joint cable 570 802 in CCG-0 is plugged into the following position:
– B 112 for F:MB/CCG(A)
– B 114 for F:MB/CCG(B)
– D 193 for F:SMSC(C)
The cross joint cable 570 802 in CCG-1 is plugged into the following position:
– A 112 for F:MB/CCG(A)
– A 114 for F:MB/CCG(B)
– C 193 for F:SMSC(C)
• The CCGs are in operating state ACT/ STB
– On CCG11A in CCG-0 the LEDs P and F are lit
– On CCG11A in CCG-1 the LEDs Ref0 (green) and 4 are lit
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27 Checking Cables
Are reference clock and cross-joint cables present? Y h...29N h...28
28 Ordering Cables
Order reference clock and cross-joint cables
29 Synchronization of the Plesiochronous CCG-0
For synchronization of the plesiochronous CCG-0 no switch settings on themodule CCG11A need to be changed because the switches are not located inthe signal line of the reference frequency. I.e. even in plesiochronous mode theCCG detects the reference frequency and synchronizes to it.
Plug the first reference frequency into the following position of the CCG-0
– A109 in F:MB/CCG(A)
– A111 in F:MB/CCG(B)
– C 187 in F:SMSC(C)
System reaction:
– After 2-3 minutes in CCG-0 on module CCG11A the LED REF0 lights green
– LED F is switched off
– LED A is switched on
This means that the CCG-0 accepts the reference frequency because it is inpull-in range
Within one hour the CCG-control runs through the following modes:
– LED A lights (holdover state A)
– LED B lights (holdover state B)
– LED B lights (holdover state B) and LED 1 lights (synchronous state 1)
– The display changes trough synchronous states 2 and 3 to synchronousstate 4
Simultaneously the CCG-1 is synchronized by CCG-0 because of the cross-jointcable between CCG-0 and CCG-1.
If the reference frequency is disturbed during synchronization, the display doesnot go beyond status A. In this case, synchronization must be carried out with areference frequency derived from a rubidium standard (e.g. FTU).
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30 Change Position of Cross-joint Cable
Unplug cross-joint cable 570 802 on CCG-0 from the following positions:
– B 112 for F:MB/CCG(A)
– B 114 for F:MB/CCG(B)
– D 193 for F:SMSC(C)
Plug in cross-joint cable on CCG-0 at the following positions:
– A112 for F:MB/CCG(A)
– A114 for F:MB/CCG(B)
– C 193 for F:SMSC(C)
Now the CCG-1 is not synchronized by the 2.048 MHZ of the CCG-0 anymorebut directly by the reference frequency.The change of the plug positions has to be finished within a time interval of twominutes. Otherwise the CCG-1 changes to holdover mode.
31 Switchover of CCG-0 to Synchronous Mode
b CONF CCG:CCG=0,OST=MBL;command repetition EXEC´D
Switch off CCG-0 converter
Pull module CCG11A
Set switch settings / solder straps to synchronous mode ......MMN:CCG,TAB LED:CCG
Plug in module CCG11A
Switch on CCG-0 converter
LED AL on the module faceplate of module CCG11A lights
After approx. 30 minutes the LED AL is switched off. The LEDs Ref0 (green),Ref1 (red) and A light up. After another 120 minutes the CCG-0 has to beconfigured to STB (If LED1 is lit).
b CONF CCG:CCG=0,OST=STB;command repetition EXEC´D
32 Connecting the second Reference Frequency to CCG-1
Plug the second reference frequency into the following position on CCG-1:
– B109 in F:MB/CCG(A)
– B111 in F:MB/CCG(B)
– D 187 for F:SMSC(C)
In CCG-0 the LED Ref 1 (red) is switched off. The green LED (Ref 0) indicatesthat Ref 0 is synchronizing.
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33 Switchover of CCG-1 to Synchronous Mode
b CONF CCG:CCG=1,OST=MBL;command repetition EXEC´D
Switch off CCG-1 converter
Pull module CCG11A
Set switch settings / solder straps to synchronous mode ......MMN:CCG,TAB LED:CCG
Plug in module CCG11A
Switch on CCG-1 converter
LED AL on the module faceplate of module CCG11A lights
After approx. 30 minutes the LED AL is switched off. The LEDs Ref0 (green),Ref1 (red) and A light up. After another 120 minutes the CCG-1 has to beconfigured to STB (If LED1 is lit).
b CONF CCG:CCG=1,OST=STB;command repetition EXEC´D
END
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A30808-X3063-A403-2-7630 PROC:MBB – 1
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3.2 Off-line Installation of Message Buffer
MBB
3.2.1 Documents
The following documents are required as reference
– Maintenance Manual MMN:MB
– AKUHW Lists
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3.2.2 MB in Rack MB/CCG
3.2.2.1 Rack MB/CCG(Fuse Assignment for MB)
Fig. 3.2.1 Rack: MB/CCG(Fuse Assignment for MB)
A
B
MOLOC A001 (MB-1)
F:MB/CCG(A) orF:MB/CCG(B)
CD
Fuse panel
MUT02
MUT03
MUT06
MUT07
MUT08
MUT09
MUT01
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
04
14
FU
MOLOC A001 (MB-0)
MOLOC A001 (MB-1)
MOLOC A001 (MB-0)
MUT05
MUT04
F:MB/CCG(A) orF:MB/CCG(B)
F:SYPC(A)
F:MB/CCG(A) orF:MB/CCG(B)
F:MB/CCG(A) orF:MB/CCG(B)
SYPD (or empty)
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3.2.2.2 Fuse Assignment R:MB/CCG
Basic system configuration extension frame for SN(252 LTG)
FU 1 11 4 14
MUT 02 03 08 09
UNIT MB-0:MBUS0-0MBUL0-0MBUL0-1
MB-1:MBUS1-0MBUL1-0MBUL1-1
MB-0:MBUS0-1MBUL0-2MBUL0-3
MB1:MBUS1-1MBUL1-2MBUL1-3
Tab. 3.2.1 Fuse Assignment R:MB/CCG Basic Rack
Extension rack for SN (504 LTG)
FU 1 11 4 14
MUT 02 03 08 09
UNIT MB-0:MBUS0-2MBUL0-4MBUL0-5
MB-1:MBUS1-2MBUL1-4MBUL1-5
MB-0:MBUS0-3MBUL0-6MBUL0-7
MB1:MBUS1-3MBUL1-6MBUL1-7
Tab. 3.2.2 Fuse Assignment R:MB/CCG Extension Rack
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3.2.3 MB in Rack SN/MB/LTGM
3.2.3.1 Rack SN/MB/LTGM(Fuse Assignment for MB)
Fig. 3.2.2 Rack: SN/MB/LTGM(Fuse Assignment for MB)
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
D
F:TSG(B), F:SSG(B)or F:LTGM(A)
Fuse panel
C
DFU
F:TSG(B), F:SSG(B)or F:LTGM(A)
MOLOC A001 (MB-0)
MOLOC A001 (MB-1)
08
22
F:MB/CCG(B)
F:TSG(B), F:SSG(B)or F:LTGM(A)
F:TSG(B), F:SSG(B)or F:LTGM(A)
F:MB/CCG(B)
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3.2.3.2 Fuse Assignment R:SN/MB/LTGM
Basic RackCapacity stage until SN
(126LTG)
Basic RackCapacity stage until SN
(252LTG)
FU 8 22 FU 8 22
MUT 04 05 MUT 04 05
UNIT MB-0:MBUS0-0MBUL0-0MBUL0-1
MB-1:MBUS1-0MBUL1-0MBUL1-1
EINH MB-0:MBUS0-1MBUL0-2MBUL0-3
MB1:MBUS1-1MBUL1-2MBUL1-3
Tab. 3.2.3 Fuse Assignment R:SN/MB/LTGMBasic Rack / Extension Rack
Capacity stage until SN (504LTG)
Extension Rack Extension Rack
FU 8 22 FU 8 22
MUT 04 05 MUT 04 05
UNIT MB-0:MBUS0-2MBUL0-4MBUL0-5
MB-1:MBUS1-2MBUL1-4MBUL1-5
EINH MB-0:MBUS0-3MBUL0-6MBUL0-7
MB1:MBUS1-3MBUL1-6MBUL1-7
Tab. 3.2.4 Fuse Assignment R:SN/MB/LTGM Extension Racks
PROC:MBB – 6 A30808-X3063-A403-2-7630
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3.2.4 MB in Rack CE
3.2.4.1 Rack CE(Fuse Assignment for MB)
Fig. 3.2.3 Rack CE(Fuse Assignment for MB)
C
DF:SMSC(C)-0
F:SMSC(C)-1
F:PIOP(A)
F:PBC(A)
F:PBC(A)
F:DEV
Fuse panel / AD:RAL
MUT02
MUT04
MUT03
MUT06
MUT09
MUT10
C
D
C
D
C
D
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
08
27
FU
MOLOC C259 (Supply for MB-0)
MOLOC C259 (Supply for MB-1)
292721 2523 31 33
30282622 3224
F:PIOPA)C
D
Air circulator
MUT11
MUT07
MUT05
MUT08
MUT01
Air circulator
Air circulator
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3.2.4.2 Fuse Assignment MB(B) (R:CE)
3.2.5 Capacity stages
1 Basic Test (Rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
2 Fuse Assignment MB(B)
The fuse assignment to the frames F:MB/CCG(B) / F:SMSC(C) is dependent onthe rack used:
Fuse assignment for switching on the MB in R:MB/CCG ...... (see 3.2.2.2)
Fuse assignment for switching on the MB in R:SN/MB/LTGM ...... (see 3.2.3.2)
Fuse assignment for switching on the MB in R:CE ...... (see 3.2.4.2)
3 Information Block
The MB can be delivered in different capacity stages (According to the capacitystage of the SN):
...... (see Tab. 3.2.6)
Rack CECapacity stage until SN (31LTG)
FU 8 27
MUT 02 04
UNIT MB-0 MB-1
FRAME SMSC-0 SMSC-1
Tab. 3.2.5 Fuse Assignment R:CE
Capacity stage of the SN Capacity stage of the MB(Number of frames)
Frame Type
SN 31 LTG (Rural Exchange) 2 (1 for MB-0 / 1 for MB-1) F:SMSC(C)
SN 63 / 126 LTG 2 (1 for MB-0 / 1 for MB-1) F:MB/CCG(B)
SN 252 LTG 4 (2 for MB-0 / 2 for MB-1) F:MB/CCG(B)
SN 504 LTG 8 (4 for MB-0 / 4 for MB-1) F:MB/CCG(B)
Tab. 3.2.6 Capacity stages
PROC:MBB – 8 A30808-X3063-A403-2-7630
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4 Preparation
Switch off all DCCs of MB(B)
Unscrew all MB fuses
Mounting locations of the corresponding DCCs in R:MB/CCG ......(see Fig. 3.2.1)
Mounting locations of the corresponding DCCs in R:SN/MB/LTGM ......(see Fig. 3.2.2)
Mounting locations of the corresponding DCCs in R:CE ......(see Fig. 3.2.3)
5 Off-line Installation of the first / next Frame for (MB-0)
Screw in fuse of the first / next frame for MB-0
Fuse assignment for switching on the MB in R:MB/CCG ......(see 3.2.2.2)
Fuse assignment for switching on the MB in R:SN/MB/LTGM ......(see 3.2.3.2)
Fuse assignment for switching on the MB in R:CE ......(see 3.2.4.2)
Check that all corresponding modules are plugged in
Switch on corresponding DCC for MB-0
Mounting location of the corresponding DCC in R:MB/CCG ......(see Fig. 3.2.1)
Mounting location of the corresponding DCC in R:SN/MB/LTGM ......(see Fig. 3.2.2)
Mounting location of the corresponding DCC in R:CE ......(see Fig. 3.2.3)
Is the green LED of the DCC lit? Y h...15N h...6
6 Check DCC (MB-0)
Pull all related modules but leave in position
Is the green LED of the DCC lit? Y h...11N h...7
7 Fault Clearance DCC / Fuse (MB-0)
Possible fault cause: DCC or main fuse defective
Switch off the DCC affected
Screw out corresponding fuse
– If fuse is suspect to be faulty h...8– If DCC is suspect to be faulty h...9
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8 Replace Fuse
Replace affected fuse with spare fuse h...10
9 Replace DCC
Replace affected DCC with spare DCC h...10
10 Check Spare DCC / Fuse
Screw in fuse again
Switch on corresponding DCC again
Is the green LED of the DCC lit? Y h...11N h...14
11 Fault Clearance Modules (MB-0)
Insert first / next corresponding module
Is the green LED of the DCC lit? Y h...12N h...13
12 Decision: next Module (MB-0)
Have all corresponding modules already been tested? Y h...15N h...11
13 Replace Module (MB-0)
The module last inserted is suspect to be faulty
Replace module with spare module
Is the green LED of the DCC lit? Y h...11N h...14
14 Special Fault Clearance
Carry out special fault clearance
– Repeat installation test after successful fault clearance h...5
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15 Off-line Installation of the first / next Frame for (MB-1)
Screw in fuse of the first / next frame for MB-1
Fuse assignment for switching on the MB in R:MB/CCG ......(see 3.2.2.2)
Fuse assignment for switching on the MB in R:SN/MB/LTGM ......(see 3.2.3.2)
Fuse assignment for switching on the MB in R:CE ......(see 3.2.4.2)
Check that all corresponding modules are plugged in
Switch on corresponding DCC for MB-1
Mounting location of the corresponding DCC in R:MB/CCG ......(see Fig. 3.2.1)
Mounting location of the corresponding DCC in R:SN/MB/LTGM ......(see Fig. 3.2.2)
Mounting location of the corresponding DCC in R:CE ......(see Fig. 3.2.3)
Is the green LED of the DCC lit? Y h...25N h...16
16 Check DCC (MB-1)
Pull all related modules but leave in position
Is the green LED of the DCC lit? Y h...21N h...17
17 Fault Clearance DCC / Fuse (MB-1)
Possible fault cause: DCC or main fuse defective
Switch off the DCC affected
Screw out corresponding fuse
– If fuse is suspect to be faulty h...18– If DCC is suspect to be faulty h...19
18 Replace Fuse
Replace affected fuse with spare fuse h...20
19 Replace DCC
Replace affected DCC with spare DCC h...20
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20 Check Spare DCC / Fuse
Screw in fuse again
Switch on corresponding DCC again
Is the green LED of the DCC lit? Y h...21N h...24
21 Fault Clearance Modules (MB-1)
Insert first / next corresponding module
Is the green LED of the DCC lit? Y h...22N h...23
22 Decision: next Module (MB-1)
Have all corresponding modules already been tested? Y h...25N h...21
23 Replace Module (MB-1)
The module last inserted is suspect to be faulty
Replace module with spare module
Is the green LED of the DCC lit? Y h...21N h...24
24 Special Fault Clearance
Carry out special fault clearance
– Repeat installation test after successful fault clearance h...15
25 Decision: Next Frame
Have all frames of the MB already been put into service? Y h...ENDN h...5
END
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A30808-X3063-A403-2-7630 PROC:SYP – 1
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3.3 Off-line Installation Test of the System Panel
SYP
3.3.1 Documentation
The following documentation will be needed for reference:
– Maintenance Manual MMN:SYP / MMN:SYP for CDE
– AKUHW lists
– NIMN:SYP for the programming of the USER-PROM
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3.3.2 Rack R:MB/CCG(Fuse Assignment for SYP)
Fig. 3.3.1 Rack R:MB/CCG(Fuse Assignment for SYP)
A
B
F:MB/CCG(A) orF:MB/CCG(B)
CD
Fuse panel
MUT02
MUT03
MUT06
MUT07
MUT08
MUT09
MUT01
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
MUT05
MUT04
F:MB/CCG(A) orF:MB/CCG(B)
F:SYPC(A)
F:MB/CCG(A) orF:MB/CCG(B)
F:MB/CCG(A) orF:MB/CCG(B)
SYPD (or empty)
05
06
07
08
03
09
15
FU
MOLOC A116 (DCCCL) (10A)
MOLOC A001 (DCCCR) (10A)
(SYPD0) (1A)
(SYPD2) (1A)
MOLOC A043 (TXA:SYPC) (1A)
(SYPD1) (1A)
(SYPD3) (1A)
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3.3.3 Rack R:CE(Fuse Assignment for SYP)
Fig. 3.3.2 Rack R:CE (Fuse Assignment for SYP)
C
DF:SMSC(C)-0
F:SMSC(C)-1
F:PIOP(A)
F:PBC(A)
F:PBC(A)
F:DEV
Fuse panel / AD:RAL
MUT02
MUT04
MUT03
MUT06
MUT09
MUT10
C
D
C
D
C
D
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
02
06
FU
MOLOC C101 (DCCCR) (10A)
SYPD0 (10A)
292721 2523 31 33
30282622 3224
F:PIOPA)C
D
Air circulator
MUT11
MUT07
MUT05
MUT08
MUT01
Air circulator
Air circulator
M:T/RM:SYCR and alarm transfer (10A)
MOLOC C101 (DCCCR for CDEX) (10A)
11
23
PROC:SYP – 4 A30808-X3063-A403-2-7630
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3.3.4 Rack R:SE(Fuse Assignment for SYP)
Fig. 3.3.3 Rack R:SE (Fuse Assignment for SYP)
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
A
B
any Equipment
CD
Fuse panel
MUT02
MUT03
MUTxx
MUT01
A
B
A
B
MUT05
any Equipment
any Equipment
18
08
09
17
MOLOC A116 (DCCCL) (10 A)
07
10
16
FU
MOLOC A001 (DCCCR) (10 A)
(SYPD3) (1 A)
(SYPD1) (1 A)
MOLOC A043 (TXA:SYPC) (1 A)
(SYPD0) (1 A)
(SYPD2) (1 A)
MUT04
A
B
F:SYPC(A) orany Equipment
A
B
any Equipment
MUT17
A
B
F:SYPC(A) orany Equipment
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3.3.5 Introduction
The system panel is supplied in a number of different variants, e.g.:
– The SYP can be located in F:SYPC or in F:SMSC(C) (Rural Exchanges)
– with one or two system panel displays
– with or without module TXA:SYPC for the forwarding of alarms (in F:SYPC)
– with CDEX modules built into the frame for the 2.048-MHz clock distribution incl. DCconverters
For the position of the SYP in the EWSD system, see Fig. 3.3.4.
In the installation test phase of an EWSD/MSC network node, the SYP must beplaced in service in a minimum configuration.
All other work, such as the connection of external alarms and additional SYPDs, shouldbe carried out after installation testing or when the node is in service.
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3.3.5.1 Position of the SYP in the EWSD System
Fig. 3.3.4 Position of the SYP in the EWSD system
AC/DC
E&Mtrans-mission
MDF/DDF
SYPD
SYPD
F:SYPC in R:MB/CCG: F:SMSC(C)-0 in R:CE
Alternative
CP/IOP
F:SMSC(C)-1 in R:CE
CP/IOP
AC/DC
E&Mtrans-mission
OMC
MDF/DDF
SYPD
SYPD
OMC
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3.3.6 Requirements for Installation Testing
• The Maintenance Manual MMN:SYP (MMN:SYP for CDE) must be available
• The cable laying list must be available
• If the SYP is located in F:SYPC, the F:SYPC must be equipped with the followingmodules at least:
– DCCCR
– COM:SYPC
– IOC:SYPC
– RM:EA
– T/RM:EAFor mounting locations, see Fig. 3.3.7.
• If the SYP is located in F:SMSC(C), the F:SMSC(C) must be equipped with thefollowing modules:
– DCCCR
– GCGR
– PU:SYCR
– T/RM:SYCRFor mounting locations, see Fig. 3.3.8.
• One SYPD must be connected directly using cable type 225 (e.g. at SYP mountinglocation B034 in F:SYPC / C 135 in F:SMSC(C))
• The power supply is fed to the SYPD via the same cable.Requirement: Fuse for -UE -48/60 V is inserted.
• A programmed USER-PROM is mounted on module COM:SYPC / PU:SYCR (stan-dard PROM with the designation V30113-....) (see Fig. 3.3.5) / (see Fig. 3.3.6).Note:This USER-PROM is pre-programmed for one SYPD-0 and one SYPD-1.If only one SYPD is installed, the double SYP indicator lights up when the SYP isactive and in service, and messages are output stating that the number of SYPDsdoes not match the number of SYPDs programmed in the USER-PROM.
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• ESD safety precautions must be observed, i.e. a grounding bracelet must beworn, for instance.
3.3.6.1 Location of the USER-PROM
Fig. 3.3.5 Location of the USER-PROM on module COM:SYPC
Fig. 3.3.6 Location of the USER PROM on module PU:SYCR.
COM:SYPC
USER-PROM (V30113-J122-A1) EPROM 2732
Standard PROM or Exch. Spec. PROM
PU:SYCR
USER-PROM (V30113-J122-A1) EPROM 2764
Standard PROM or Exch. Spec. PROM
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3.3.6.2 Overview of SYP Connections in F:SYPC
Fig. 3.3.7 Overview of system panel connections in F:SYPC
DCCCR IOC:SYPC
COM:SYPC
RM:EA T/RM:SYPC
0
T/RM:SYPC
1
TXA:SYPC
A001 A013 A019 A025 A031 A037 A043
B2 034 A2 040 A2 034 B2 040 A2 028 B2 028
B2 016B2 010
A2 016A2 010
A2 022 A2 046 B2 046
T/R E1/M1 E2/M2 E3/M3 T/R
E1/M1
E2/M2
E3/M3
2DR
4DR
4DR
4DR
T/R
E1/M1
E2/M2
E3/M3
SYPD0
SYPD1
E&M
E&M
MDFSYPD0-3 SYPD4-7SYPD1 SYPD2 SYPD3
OMC
Optional Optional
Backplane connector:
SYPD0 2-wire only
SYPD1-3 4-wire
EWSD node
SYPC(A)S30804-B2573-
AL1..AL12 AL13..AL24
EDL1..EDL24
External alarmsfrom the MDF1-24 Alarm forwarding to
other OMCs
to the MDF
IOP-0 IOP-1
to/from CP
Backplaneconnector:
SYPD with -UE power supplyvia SYP from the fuse panel
SYPD with internal 220 V ACpower supply
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3.3.6.3 Overview of SYP Connections in F:SMSC(C)
Fig. 3.3.8 Overview of system panel connections in F:SMSC(C)
DCCCR GCGR PU:SYCR T/RM:SYCR
C101 C119 C129 C141
C 135 D141 D 141
D 107D 113
C 107C 113
D 141 D 141
T/R E1/M1 T/R
E1/M1
2DR
4DR
SYPD0
SYPD1
E&M
E&M
MDFSYPD0-1SYPD1
OMC
Backplane connector:
SYPD0 2-wire only
SYPD1 4-wire
EWSD node
SMSC(C)-0S30804-B2693-
AL1..AL8EAI1..EAI8
External alarmsfrom the MDF 1-8
Alarm forwarding toother OMCs
to the MDF
IOP-0 IOP-1
to/from CP
Backplaneconnector:
SYPD with -UE power supplyvia SYP from the fuse panel
SYPD with internal 220 V ACpower supply
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3.3.7 SYPD
Every EWSD exchange is equipped with at least one system panel display (SYPD),which is able to display:
– alarms and indications from specific units in the system
– general system alarms
– the current call-processing load on the processor
– external alarms
Alarms and indications are indicated visually (LED indicators) and audibly (horn) on theSYPD.
The indicators on the SYPD are arranged in three sections:
– system unit alarms
– general system alarms
– external alarms
A front view of the SYPD is shown in Fig. 3.3.9
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3.3.7.1 Front View of the SYPD
Fig. 3.3.9 Front view of the system panel display SYPD
Maint.alarm
Switchingnetwork
Line/trunk groupsLTG
Coordination processorCP
System panelSYP
External alarmsMonth Day Time
Update
Servicealarm
Ext.Equip.
Processorload
ERL
Central unit
Clock
Messagebuffer
Commonchannelsignaling
Test Accept
TGRP alarm
Line lockout
Signalinglink
Callidentification
Trunk groupblocked
Cat. 1
Cat. 2
Systemoperator
ExternalDLU alarms
Admin.alarm
Recovery
Time insecure
HW units MBL
Sig. linksblocked
Alarmsuppression
Labels for the external alarms must be affixed in accordance with thecustomer’s requirements and the programming of the USER-PROM.
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3.3.7.2 SYPD Modules
Fig. 3.3.10 SYPD modules
Loosen screws to access modulesEWA (DC/DC converter) andT/RM:SYPD
Open SYPD:(module DYM:SYPD swung to the side)
Loosen screws to openthe SYPD
SYPD front view:
Open SYPDModule DYM:SYPD and shielding panelswung to the side
T/RM:SYPD
EWA (DCDCInternal horn
Module DYM:SYPD(swung to the side)
Shielding panel and support formodules EWA:SYPD andT/RM:SYPD (attached behind)
1 2
22 11
Hornvolume
Ext. horn1=off2=ON
Int. horn1=off2=ON
Transm. MB1=open2=grounded
Plug position forSYP/SYPD interface
+UE -UE
to external horn
to internal horn
Plug position forSYP/SYPD interface
DC from:ACC (220/110 V AC power supply)or -48//-60 V DC power supply
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3.3.8 Connection of SYPDs
3.3.8.1 GeneralThe system panel displays (SYPD) are controlled by the system panel control (SYPC)or the system panel control rural (SYCR).
In DE4 and DE5 switches, the system panel control is installed in module frameSYPC(A) (B2573) and can be linked to a maximum of 8 SYPDs. This frame can alsoaccommodate up to 10 CDEX modules (Q900) for external synchronization.In DE3 switches (rural exchanges), the smaller system panel control SYCR is used,which can be linked to a maximum of 2 SYPDs. SYCR is installed in module frameSMSC (B2693) together with the clock generator, message buffer and switchingnetwork.
3.3.8.2 Options for the Connection of the System Panel Display SYPDThe SYPD can be installed locally or in a remote location, depending on the application.The transmission medium and cabling required between a remote SYPD and theSYPC/SYCR depends on the distance between them.An overview of the different options is shown in Fig. 3.3.11.Further information on the signaling methods and cabling are shown in Fig. 3.3.12 andFig. 3.3.13.
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Fig. 3.3.11 Options for the connection of the systempanel display SYPD
T/RM:SYPCT/RM:SYCR
(4-wire transmission)Range 2 * 200 Ω= ca. 3km (1)
(4-wire transmission)Range 2 * 200 Ω= ca. 3km (1)
Loop signaling(2-wire transmission)Range 2 * 750 Ω= ca. 11 km (1)
Line leading to carrierequipmentE&M signaling(4-wire transmission)Range 2 * 200 Ω= ca. 3 km (1)
SYPD
SYPD
SYPD
SYPD
DF
FDM/PCMequipment
MDF DF
MDF DF
Maintenance centre
< 3 km
< 3 km
< 11km
FDM/PCM link
FDM/PCMequipment
MDF
Exchange Maintenance room Remote building
with remote power feedmax. 200 m
Every SYPD must have its own power supply (-48/60 VDC or 110/220 VAC).
If a SYPD uses remote power feeding, the maximum range with standard cabling is 200m.
(1) applies to copper lines with a diameter of 0.6mm
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Fig. 3.3.12 E&M signaling (4-wire transmission)
TX
RX
TX
RX
FDM/PCM equipmentSystem panel controlSYPC / SYCR
M/SAB
(MA)
(MB)
TX
RX
TX
RX
System panel displaySYPD
2BR
1
GND
2BR
1
GND
E/SAN
(EA)
(EB)
-UB
-UB
GND GND
E/SAN
(MA)
(MB)
-UB
-UB
GND
GND
E/SAN
(EA)
(EB)
FDM/PCM
link
For explanations see Tab. 3.3.1
FDM/PCM equipment
DISPLAY
MODULE
CONTROL
MODULE
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Fig. 3.3.13 Loop signaling (2-wire transmission)
Explanations:
-UB: Exchange voltage -48/60 V
GND: Ground
RX: Receiver
BR: Switch1= FDM/PCM equipment has ground2= FDM/PCM does not offer ground
TX: Transmitter (fully electronic, transistors as switches)It must be ensured that the voltages to be switched by the transmissionequipment lie in the range -48/-60V.
Tab. 3.3.1 Explanations on E&M and loop signaling
TX
RX
Displaymodule
RX
-UB GND
TX
A (T) (T) A
System panel controlSYPC, SYCR
Two-wire linewith loop signaling
B (R) (R) B
System panel displaySYPD
For explanations see Tab. 3.3.1
CONTROL
MODULE
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3.3.8.3 Location of BR switches on T/RM:SYPC / T/RM:SYCRSwitch BR:
This switch is used to connect the MB-line to ground in Position 2 for the SYPD whichruns via 4-wire method on the transmit side.
This is necessary, for example, if a connected carrier frequency device is not grounded.
Fig. 3.3.14 SYPD E&M grounding on T/RM:SYPC
Range when using E&M signaling (4-wire lines):between SYPC/SYCR and FDM/PCM equipment: each 2*200 ohm (ca. 3 km *))between the two FDM/PCM equipments: varies according to FDM/PCM systembetween FDM/PCM equipment and SYPD: each 2*200 ohm (ca. 3 km *) )
*) applies to copper lines with a diameter of 0.6 mm
Range when using loop signaling (2-wire lines):between SYPC/SYCR and SYPD: each 2*750 ohm (ca. 11 km)(applies to copper lines with a diameter of 0.6 mm)
Explanations:
Tab. 3.3.1 Explanations on E&M and loop signaling
21
3BR
21
212BR
1BR
MB transmission1= open2= grounded
E&M interface 3
E&M interface 2
E&M interface 1
T/RM:SYPC
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Fig. 3.3.15 SYPD E&M grounding on T/RM:SYCR
3.3.8.4 Installing A Second SYPD in the Same BuildingA second SYPD can be connected directly to the SYP using standard EWS cable, butthe length of the cable must not exceed 200 meters.In this case, the SYPD does not need any external power supply from a 220V powerpack or -48/-60V, because it is fed by the SYP. Check that the correct fuse is insertedin the rack for this SYPD.
When using the standard USER-PROM, the SYPDs must be installed as SYPD 0and SYPD 1.
If the MB wire on the transmission side of the 4-wire ports needs to be grounded, thecorresponding switch must be set to position 2 on module T/RM:SYPC (see Fig. 3.3.14)(T/RM:SYCR in F:SMSC(C) (see Fig. 3.3.15)) and on module T/RM:SYPD(see Fig. 3.3.10) .
3.3.8.5 Installing a Second SYPD in Another Building Without TransmissionEquipmentRange:2-wire: 2*750 ohm ca. 11 km4-wire: 2*200 ohm ca. 3kmThe choice of 2-wire or 4-wire line to connect the remote SYPD depends on the distance(see Fig. 3.3.11).
The interfaces of SYP and SYPD are illustrated in: Fig. 3.3.16 - Fig. 3.3.19
21
BR
MB transmission1= open2= grounded
E&M interface
T/RM:SYCR
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The 2-wire or 4-wire transmission lines originate at mounting location A 028 of the SYPand run parallel to the SYP backplane mounting locations on the special MDF terminalstrip.
Caution: It must be ensured that each SYPD has its own transmission link.
When using 2-wire lines, wire R at the SYP is connected to wire R of the SYPD and wireT of the SYP is connected to wire T of the SYPD.
When using 4-wire lines, wire MA at the SYP is connected to wire EA of the SYPD andwire MB of the SYP is connected to wire EB of the SYPD. The connections in the otherdirection are made on the same principle.
Power feeding of the SYPD is either from the -48/-60V exchange voltage or from an inte-gral 110/220V power pack.
Attach labels to the SYPD as described in the procedure.Check the horn setting.
3.3.8.6 Installing a Second SYPD in Another Building With TransmissionEquipmentE&M signaling is used on the link between SYP and SYPD. In other words, the trans-mitting SYP or SYPD sets the input voltage for transmission by means of an electronicswitch to approximately 0V or the original value (usually 48/60V).On PCM links, these signals are carried in channel 16 and converted back into E&Msignals at the other end for transfer to the SYP/SYPD.For this reason, signaling converters are needed in conjunction with PCM links.
In carrier systems, these signals are transmitted outside the voice band (out-bandsignaling).
Range: unlimited
The interfaces of SYP and SYPD are shown in: Fig. 3.3.16, Fig. 3.3.18
Caution: It must be ensured that each SYPD is assigned its own transmission link.
The SYPD is fed either with the -48/-60V exchange voltage or from an integral 110/220Vpower pack.
Attach labels to the SYPD as described in the procedure.Check the horn setting.
If necessary, set the switches for grounding of signal MB in SYP and SYPD.
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3.3.8.7 Block Diagram of the SYPD and its Interfaces
Fig. 3.3.16 Block diagram of the SYPD and its interfaces
T/RM:SYPD
DCC
ACC:SYPD
Option
MAMBEAEBRT
43
4445465556
1314
16
17
DYM:SYPD
B2
A2
4-wire
2-wire
DC fromframe
to/from SYP:
Internal horn
External horn
- UE
- UEDC from OMC
110 / 220 V AC
Standard
DC from transformerand rectifier
Connector pinnumber:
345
615
16535456
57
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3.3.8.8 R/T and E+M Interfaces in F:SMSC for SYPD-0 - SYPD-1
Fig. 3.3.17 R/T and E+M interfaces in F:SMSCfor SYPD-0 - SYPD-1
SYPD 0
SYPD 1
EA= Ear AMA= Mouth A
C 135
Pin 56,57 -UEPin 53,54 GNDto SYPDpower supply
T15
R16
53T
54R
55EA
56EB
57MA
58MB
Module T/RM:SYCRCD 141
to SYPD-0
to MDF / DDF(External SYPDs)
Grounded if signalground is available. Inthis case only the EA orMA signals areconnected
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3.3.8.9 R/T and E+M Interfaces in F:SYPC for SYPD-0 - SYPD-3
Fig. 3.3.18 R/T and E+M interfaces in F:SYPCfor SYPD-0 - SYPD-3
15 T16 R
A2 028
SYP backplaneconnector
SYPD 0
3 EA14 EB1
5 MA16 MB1
SYPD 1
7 EA28 EB2
9 MA210 MB2
SYPD 2
11 EA312 EB3
13 MA314 MB3
SYPD 3
EA= Ear AMA= Mouth A
B2 034
Pin 55, 56 -UEPin 53, 54 +UEto SYPDpower supply
T15
EA3
EB4
R16
MA5
MB6
A2 034
Pin 55, 56 -UEPin 53, 54 +UEto SYPDpower supply
EA3
EB4
MA5
MB6
A2 040
Pin 55, 56 -UEPin 53, 54 +UEto SYPDpower supply
EA3
EB4
MA5
MB6
B2 040
Pin 55, 56 -UEPin 53, 54 +UEto SYPDpower supply
46T
47R
8EA1
9EB1
23MA1
41MB1
30EA2
31EB2
49MA2
50MB2
3EA3
6EB3
45MA3
42MB3
Module T/RM:SYPCA2 031
to SYPD-0 to SYPD-1 to SYPD-2 to SYPD-3
ExternalSYPDs to MDF/ DDF
Pin numbers corre-spond to numbering onthe module backplane!Example: Backplane pin3 is connector pin 43
Grounded if signalground is available. Inthis case only the EA orMA signals areconnected
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3.3.8.10 R/T and E+M Interfaces for SYPD-5 - SYPD-8
Fig. 3.3.19 R/T and E+M interfaces in frame SYPCfor SYPD-5 - SYPD-8
15 T16 R
A2 028
SYP backplaneconnector
SYPD 5
3 EA14 EB1
5 MA16 MB1
SYPD 6
7 EA28 EB2
9 MA210 MB2
SYPD 7
11 EA312 EB3
13 MA314 MB3
SYPD 8
EA= Ear AMA= Mouth A
46T
47R
8EA1
9EB1
23MA1
41MB1
30EA2
31EB2
49MA2
50MB2
3EA3
6EB3
45MA3
42MB3
Module T/RM:SYPCA2 037
ExternalSYPDs to MDF/ DDF
Pin numbers corre-spond to numbering onthe module backplane!Example: Backplane pin3 is connector pin 43
Grounded if signalground is available. Inthis case only the EA orMA signals areconnected.
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3.3.8.11 Installation of More Than 4 SYPDs (only in F:SYPC)Module T/RM:SYPC has interfaces to four SYPDs. Additional SYPDs (maximum 8) canbe connected if another T/RM:SYPC module is installed (see Fig. 3.3.7).
3.3.9 The User EPROM (USMOF)
External alarms can be displayed at the SYPD. The way in which external alarms aredisplayed (alarm priority and lamp address) must be programmed in the user EPROM(USMOF). In addition, it is possible to analyze the duration of alarms by means of timersand raise their priority where appropriate.
To adapt alarm signaling (external alarm inputs) to specific customer requirements,parameter sets are provided which are stored in the user EPROM. Parameters includethe assignment of alarm events to their display and priority in the external alarm section(all other alarms are controlled by the coordination processor CP). It is also defined inthe user EPROM which SYPDs are connected, which one of them is operating as themaster panel, the horn time limit and the CP supervision time.Programming of the USER-PROM is described in NIMN:SYP.
3.3.10 Connection of an External Horn
The same type of horn is used externally and internally (telephone transmitter amplifier).For its connection, see Fig. 3.3.10
3.3.11 Connection of External Alarms to the SYPD
External alarm lines are connected to the MDF special terminal strip and jumpered tothe SYP’s external alarm inputs at the MDF.
The unit issuing the alarm can send signals to the SYP as follows:
• With normally open contact: The unit switches ground to the SYP with its contact
• With normally closed contact: The unit interrupts ground to the SYP with its contact
Connection of alarm lines to the MDF
• With one wire: The other side of the contact is connected to the common ground inthe unit issuing the alarm
• With two wires: One wire is connected to the MDF. The other wire is connected tothe MDF’s common ground.
The SYP ground is connected to the MDF over one wire of the alarm cable.
For a graphical representation of the various connection options see Fig. 3.3.20.
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Fig. 3.3.20 Methods of connecting alarm lines to the MDF
The assignment of connector pins on cable 223 to the MDF is shown in Fig. 3.3.21,Fig. 3.3.23, Fig. 3.3.24:
1-wire:
SYPExternalequipment
1-wire:
SYPExternalequipment
External alarms, closed loop (cl) External alarms, open loop (ol)
2-wire:
SYPExternalequipment
2-wire:
SYPExternalequipment
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Fig. 3.3.21 Alarm inputs on the backplane connector of cable 223(32 wires) from the MDF to the SYP (module RM:EA)
Connectorpin no.
1
20
41
60
Connectorpin no.
A 022
No. of theexternalalarm
EAL 1
EAL 2
EAL 3
EAL 4
EAL 5
EAL 6
EAL 7
EAL 8
EAL 9
EAL 10
EAL 11
EAL 12
EAL 13
EAL 14
EAL 15
EAL 16
EAL 17
EAL 18
EAL 19
EAL 20
EAL 21
EAL 22
EAL 23
EAL 24
notused
notused
Groundfrom SYP
No. of theexternalalarm
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Fig. 3.3.22 Alarm inputs on the backplane connector of moduleT/RM:SYCR from the MDF to the SYP
Fig. 3.3.23 Assignment of external alarms on the horizontal MDF
Connectorpin no.
41
60 20
D 141
No. of theexternalalarm
EAJ 1
EAJ 2
EAJ 3
EAJ 4
EAJ 5
EAJ 6
EAJ 7
EAJ 8
Connectorpin no.
01
EAL1
EAL 8
EAL9
EAL12
EAL13
EAL20
EAL21
EAL24
GND
not usednot used
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Fig. 3.3.24 Assignment of external alarms on the vertical MDF
3.3.11.1 Test of AlarmsAlarm as normally open contact:Apply ground to the corresponding MDF input. The corresponding SYPD LED shouldthen light up.
Alarm as normally closed contact:The SYPD LED is lit when the alarm is programmed as normally closed contact and thealarm input is open. Applying ground switches off the alarm and the correspondingSYPD LED goes off.
3.3.12 Forwarding of Alarms with Module TXA:SYPC / T/RM:SYCR
Module TXA:SYPC or T/RM:SYCR is used to forward alarms from the system panelcontrol. Up to 24 (max.8 in the case of T/RM:SYCR) different SYPD indications can beforwarded to external fault signaling equipment via relays. It is defined in the userEPROM which priorities of alarms (critical, major, minor) on which SYPD indicator areoutput to one or more relays. The assignment of relays to alarm lines (AL) is fixed. Therelays have the same designation as the alarm lines and their contacts are marked al.
EAL1 EAL 8
EAL9 EAL12
EAL13 EAL20
EAL21 EAL24 GND
not used
not used
Groundfrom SYP
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Electrically, there are four ways of forwarding alarms (see also Fig. 3.3.25):
a) contact switches ground on or off
b) contact switches -48V / -60V on or off
c) contact switches a passive loop on or off
d) contact switches an active loop carrying -48V / -60V on or off
Resistors or jumpers must be inserted for each relay or wire pair in the jumper field ofmodule TXA:SYPC / T/RM:SYCR, in accordance with the type of alarm forwarding used,as shown in Fig. 3.3.25 (resistors are included with the rack delivery package).
The position of the jumper field on module TXA:SYPC is shown in: MMN:SYP-TAB .
The position of the jumper field on module T/RM:SYCR is shown in: MMN:SYP for CDE-TAB.
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3.3.12.1 Connections on the Jumper Field for Alarm Output (TXA:SYPC /T/RM:SYCR)
Fig. 3.3.25 Connections on the jumper field for alarm output
=
.8
0.1M
470
-UB
A B
≥ 2K
DB.7
.4
.5
.2
=
.8
0.1M
470
GND “B”
A B
≥ 2K
DB.7
.4
.5
.2
=
.8
0.1M
470
A B
DB.7
.4
.5
.2
=
.8
0.1M
470
-UB
A B
DB.7
.4
.5
.2
.1 .1 .1 .1
DB
-UB
GND “B”
.3.3.3.3
GND “B”
RA RB
RA+RB≥ 2K
R or DB
Receiver≥ 2K
a) Ground
R = 1000 ohm P Wid 51 V39200-Z4102-J or equivalentDB = Wire link-UB = Exchange voltage -48/-60 VGND “B” = Ground B
The link between .7 and .8 must always be inserted. Certain input circuits of external alarm receiversmay require that it be open.
b) Power c) Passive loop d) Active loop
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3.3.12.2 Connector Pin Assignment for Alarm Forwarding (ModuleTXA:SYPC)
Fig. 3.3.26 Connector pin assignment for alarm forwarding on module TXA:SYPC
Connectorpin no.
1
20
41
60
Connector pin no.
A 046
Alarmnumber
AL 1B
AL 2B
AL 3B
AL 4B
AL 5B
AL 6B
AL 7B
AL 8B
AL 9B
AL 10B
AL 11B
AL 12B
notused
notused
notused
AL 1A
AL 2A
AL 3A
AL 4A
AL 5A
AL 6A
AL 7A
AL 8A
AL 9A
AL 10A
AL 11A
AL 12A
notused
1
B 046
AL 13B
AL 14B
AL 15B
AL 16B
AL 17B
AL 18B
AL 19B
AL 20B
AL 21B
AL 22B
AL 23B
AL 24B
notused
notused
AL 13A
AL 14A
AL 15A
AL 16A
AL 17A
AL 18A
AL 19A
AL 20A
AL 21A
AL 22A
AL 23A
AL 24A
notused
60 20
41
notused
Alarmnumber
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3.3.12.3 Connector Pin Assignment for Alarm Forwarding (ModuleT/RM:SYCR)
Fig. 3.3.27 Connector pin assignment for alarm forwardingon module T/RM:SYCR
3.3.13 Notes on Installation Testing of the SYPD
To test the EWSD installation, the SYP equipment and SYPD (in the exchange) mustfirst be tested and placed in service. A remote SYPD cannot be included in the installa-tion test until the customer has installed the required 2-wire or 4-wire transmission linkto the OMC (see also Fig. 3.3.11).
Module TXA:SYPC (S30810-Q759-..) (T/RM:SYCR in F:SMSC) is used for theforwarding of alarms to the OMC or another location. The jumpers on this module aresoldered in when the customer’s requirements have been clarified. Alarms to beforwarded that are not included in the standard USER-PROM must be programmed inaddition.
How external alarms are received (RM:SYPC / T/RM:SYCR) must also be clarified withthe customer. The external alarms must be programmed in the USER-PROM.
Connectorpin no.
41
60
01
20
Connector pin no.
D 141
AL 1A
AL 1B
AL 2A
AL 2B
AL 3A
AL 3B
AL 4A
AL 4B
AL 5A
AL 5B
AL 6A
AL 7A
Alarmnumber
AL 6B
AL 7B
AL 8A
AL 8B
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If only one SYPD is deployed in the exchange, its cable connector is plugged into back-plane mounting location B034 (C135 in F:SMSC(C)) as SYPD 0. If power is supplied viathe exchange voltage, it is fed to the SYPD via the corresponding SYPD fuse in theSYPC If a second SYPD is installed in the OMC as a remote SYPD, then this SYPDmust have its own power pack, because remote feeding from the exchange is notpossible over a distance of more than 200m. If two SYPDs are installed, it must beensured that they are connected to different transmitters/receivers in the modulesT/RM:SYPC / T/RM:SYCR.Cabling from the transmitter/receiver modules T/RM:SYPC / T/RM:SYCR to the MDFruns via the backplane cable at mounting location A028 / D141.Using a 2-wire line, a distance of up to 11 km can be bridged between SYPC and SYPD.Over greater distances, a 4-wire E&M line must be used.(see also Fig. 3.3.11)
1 Basic Test of Rack
Check the rack equipment and revision statuses (issues) against the exchangeconfiguration documents (AKUHW lists), if this has not already been done.
Check that all modules and cables are firmly in place.
Perform a visual inspection of the wire-wrap fields for bent pins, short circuits,contacts and foreign objects.
System panel
MOLOC onbackplane
ofF:SYPC(A)
Transmissionline
Comments
SYPD0 B034 2-wire Remote SYPD or SYPD in the exchange
SYPD1 A040 4-wire Remote SYPD or SYPD in the exchange
SYPD2 A034 4-wire
SYPD3 B040 4-wire
Tab. 3.3.2 Mounting locations of SYPD connections on F:SYPC(A)
System panel
MOLOC onbackplaneof F:SMSC
Transmissionline
Comments
SYPD0 C 135 2-wire Remote SYPD or SYPD in the exchange
SYPD1 D 141 4-wire Remote SYPD or SYPD in the exchange
Tab. 3.3.3 Mounting locations of SYPD connections on F:SMSC(C)
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2 Create Basic State
Note: The assignment of fuses and DCCs depends on the rack used :
If SYP is installed in R:MB/CCG ...... (see Fig. 3.3.1)
If SYP is installed in R:CE ...... (see Fig. 3.3.2)
If SYP is installed in R:SE ...... (see Fig. 3.3.3)
Make sure that all SYP fuses have been unscrewed
Make sure that all SYP DCCs are switched off
3 Connect the SYPD
In the installation test phase of an EWSD/MSC network node, the SYP must beplaced in service in a minimum configuration. In other words, the SYPD must beinstalled in the exchange for the basic test as SYPD0 using cable type 225.
If SYP is installed in F:SYPC ...... (see Fig. 3.3.7)
If SYP is installed in F:SMSC ...... (see Fig. 3.3.8)
Power is supplied to the SYPD via the same cable as soon as the fuse for -UE -48/60 V is inserted.
4 Check Switch Settings
– If SYP is installed in R:MB/CCG:Check the position of the switches on module T/RM:SYPC i ...MMN:SYP, TAB
– If SYP is installed in R:CE:Check the position of the switches on module T/RM:SYCR i ...MMN:SYP for
CDE, TAB
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5 Insert USER-PROM
Caution: ESD safety precautions must be observed, i.e. a grounding braceletmust be worn, for instance.
The USER-PROM supplied on module COM:SYPC / PU:SYCR (standardPROM with the designation V30113-....) is pre-programmed for one SYPD-0and one SYPD-1.If only one SYPD is installed, the double SYP indicator lights up when the SYPis active and in service, and messages are output stating that the number ofSYPDs does not match the number of SYPDs programmed in the USER-PROM.Customer requirements that call for modifications in the USER-PROM shouldnot be programmed into the USER-PROM until after installation testing.
Programming of the USER-PROM is described in: ......NIMN:SYP
Position of the USER-PROM on module COM:SYPC: ......(see Fig. 3.3.5)
Position of the USER-PROM on module PU:SYCR: ......(see Fig. 3.3.6)
Insert the standard PROM or customized USER-PROM on module COM:SYPC/ PU:SYCR.
6 Attach Labels on SYPD
Undo the four screws on the front of the SYPD. ......(see Fig. 3.3.10)
After removing the front, unfasten the light-colored plastic panel behind thetransparent front face and remove it.
Attach the adhesive labels from the supplied label sheet in the marked areas, ifthis has not been done already.The labels for external alarms are not attached until the customized USER-PROM has been produced according to the customer requirements.
......(see Fig. 3.3.9)
7 Insert Fuses
Insert the SYP fuses in the fuse panel:
If SYP is installed in R:MB/CCG ......(see Fig. 3.3.1)
If SYP is installed in R:CE ......(see Fig. 3.3.2)
If SYP is installed in R:SE ......(see Fig. 3.3.3)
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8 Switch on the DCC
Switch on the corresponding DCC
If SYP is installed in R:MB/CCG ...... (see Fig. 3.3.1)
If SYP is installed in R:CE ...... (see Fig. 3.3.2)
If SYP is installed in R:SE ...... (see Fig. 3.3.3)
Is the green LED on the faceplate of the DCC lit? Y h...14N h...9
9 LED not lit
Switch off the DC converter
Check the fuse and replace if necessary
Pull all corresponding modules
Switch the DC converter on again
Is the green LED lit? Y h...11N h...10
10 Fault Clearance
Possible causes of the fault:
• DCC faulty
• Break in the power supply between the fuse and the converter
• Ground connection from frame/DCC to the + bus bar has a break in it
• Short-circuit on the wire-wrap field
Clear the fault
If it is the DCC that is faulty:
– Switch off the DC converter
– Make sure that the spare DCC is switched off
– Replace the faulty DCC with the spare module
After fault clearance, re-insert all modules h...8
11 Identify Faulty Module
One or more modules faulty (repeat the following steps until all modules havebeen tested)
Switch off the DC converter
Insert the first (next) module
Switch the DC converter on again
Is the green LED lit? Y h...13N h...12
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12 Replace Faulty Module
The last module inserted is suspect
Switch off the DC converter
Replace the faulty module with a spare module
When installing a spare COM:SYPC / PU:SYCR module, check the USER-PROM or transfer the USER-PROM from the faulty module.
13 Decision: all Modules Tested
Have all modules now been tested? Y h...8N h...11
14 Decision Block: LED HOLD
Is the HOLD LED on module COM:SYPC / PU:SYCR still lit? Y h...15N h...17
15 Reset Module COM:SYPC / PU:SYCR
Press the RESET key
Is the HOLD LED on module COM:SYPC / PU:SYCR still lit? Y h...16N h...17
16 Replace Module COM:SYPC / PU:SYCR
Module COM:SYPC / PU:SYCR is probably faulty
Switch off DC converter
Replace the faulty module with a spare module
When installing a spare COM:SYPC / PU:SYCR module, check the USER-PROM or transfer the USER-PROM from the faulty module.
– After replacing the module, continue h...8
17 Basic Test (SYPD in the Exchange)
Check the switches on module T/RM:SYPD and, if installed, on moduleACC:SYPD
......MMN:SYP-TAB LED:SYP
Plug in the connecting cable to the SYPC at the SYPD ......(see Fig. 3.3.10)
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18 TEST key (SYPD in the Exchange)
Press the TEST key
Go to one of the following blocks in accordance with the system response
– All LEDs lit, 7-segment displays lit, horn sounding h...22– All LEDs lit, 7-segment displays lit, horn not sounding h...19– Only the 7-segment displays are lit h...20– No LEDs are lit, no 7-segment displays are lit and the horn is not sounding h...21
19 Horn (SYPD in the Exchange)
Check the setting of switch HI on module T/RM:SYPD
Check that the connecting cable to the horn is plugged in correctly
Replace the horn if it is faulty
– Repeat the test h...18
20 Module DYM:SYP Faulty (SYPD in the Exchange)
Pull the connecting cable to the SYPC from the SYPD
Unplug the power cable, if there is one
Replace the faulty DYM:SYP module with a spare module
Insert the power cable, if there is one
Insert the connecting cable to the SYPC in the SYPD
– Repeat the test h...18
21 Check System Voltage (SYPD in the Exchange)
If system voltage is present, the SYP displays light up when the TEST key ispressed. Any other response implies that a fuse or the EWA module is faulty.
Check the system voltage at pins +UE and -UE on module ACC:SYPD, if it isinstalled
Check the fuse (FU) assigned to the SYPD in the fuse panel:
If SYP is installed in R:MB/CCG ...... (see Fig. 3.3.1)
If SYP is installed in R:CE ...... (see Fig. 3.3.2)
If SYP is installed in R:SE ...... (see Fig. 3.3.3)
Check the system voltage in the connecting cable SYPD-SYPC at pins 13 and14 (+UE), 16 and 17 (-UE)
If the system voltage up to the SYPD is OK: Replace module EWA in the SYPD
– Repeat the test h...18
22 UPDATE Key (SYPD in the Exchange)
Press the UPDATE key
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The following system responses are possible:
• Data are transferred from the SYPC / SYCR to the SYPD. The transfer takesabout 1 minute. Displayed statuses are random.The “UPDATE” indicator is lit during the data transfer.
• The indicator does not light
Possible causes could be:
– Fault in the transmission equipment
– Wiring error: Transmitter and receiver transposed
Did the indicator light up? Y h...24N h...23
23 Nonstandard Maintenance
Perform nonstandard maintenance
– Repeat the test after completing nonstandard maintenance h...18
24 End of the Basic Test (SYPD in the Exchange)
End of the basic test for SYPD in the exchange
– For the basic test of the remote SYPDs h...25
25 Basic Test (Remote SYPD)
This test cannot be performed until the remote SYPD is connected over a 2-wireor 4-wire transmission line (E&M) and the USER-PROM has been programmedfor two SYPDs.
If the remote SYPD is operated over a 2-wire line, the remote SYPD is SYPD0and the SYPD in the exchange is SYPD1.If the remote SYPD is operated over a 4-wire E&M line, the remote SYPD isSYPD1 and the SYPD in the exchange is SYPD0.
If SYP is installed in F:SYPC ......(see Tab. 3.3.2)
If SYP is installed in F:SMSC(C) ......(see Tab. 3.3.3)
Check the switches on module T/RM:SYPD and, if it is installed, on moduleACC:SYPD
......MMN:SYP-TAB LED:SYP
Plug in the power cable
Insert the connecting cable to the transmission equipment at the SYPD
A30808-X3063-A403-2-7630 PROC:SYP – 41
CommissioningSystem
ITMN - OFFLINE
26 TEST Key (Remote SYPD)
Press the TEST key
Go to one of the following blocks, depending on the system response
– All LEDs lit, 7-segment displays lit, horn sounding h...30– All LEDs lit, 7-segment displays lit, horn not sounding h...27– Only the 7-segment displays are lit h...28– No LEDs are lit, no 7-segment displays are lit and the horn is not sounding h...29
27 Horn (Remote SYPD)
Check the setting of switch HI on module T/RM:SYPD
Check that the connecting cable to the horn is plugged in correctly
Replace the horn if it is faulty
– Repeat the test h...26
28 Module DYM:SYP Faulty (Remote SYPD)
Pull the connecting cable to the SYPC from the SYPD
Unplug the power cable, if there is one
Replace the faulty DYM:SYP module with a spare module
Insert the power cable, if there is one
Insert the connecting cable to the SYPC in the SYPD
– Repeat the test h...26
29 Check System Voltage (Remote SYPD)
Check the operating voltage of the SYPD
If the system voltage up to the SYPD is OK:Replace module EWA in the SYPD
– Repeat the test h...26
30 UPDATE Key (UPDATE) (Remote SYPD)
Press the UPDATE key
The following system responses are possible:
• Data are transferred from the SYPC to the SYPD. The transfer takes about 1minute. Displayed statuses are random.The “UPDATE” indicator is lit during the data transfer.
• The indicator does not light
Possible causes could be:
– Fault in the transmission equipment
– Wiring error: Transmitter and receiver transposed
Did the indicator light up? Y h...32N h...31
PROC:SYP – 42 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
31 Nonstandard Maintenance
Perform nonstandard maintenance
– Repeat the test after completing nonstandard maintenance h...26
32 End of the Basic Test (Remote SYPD)
End of the basic test for remote SYPD
– For the testing of external alarms h...33
33 Programming the USER-PROM for External Alarms
Clarify with the customer which alarms signaled by external alarm units are tobe indicated with what priority at the SYPD.Both the connection of the alarms to the SYP and the means of forwarding ofthe alarms must be programmed into the USER-PROM.
If the STANDARD-USER-PROM for Deutsche Telekom AG is being used, it isnot necessary to program external alarms because Deutsche Telekom uses auniform signaling concept.
Program the connection and forwarding of external alarms into the USER-PROM, if this has not already been done.
......NIMN:SYP
Label the corresponding SYPD indicators with the adhesive labels from thesupplied label sheet. Labels not included on the sheet must be ordered from theresponsible sales department.
34 Connection of External Alarms
Connect the external alarm units to the MDF. ......(see 3.3.11)
External alarms must be connected on the special terminal strip of the MDF andjumpered to the external alarm inputs of the SYP on the MDF.
For the assignment of connector pins to the MDF terminal points: ......(see 3.3.11)
35 Enter Alarm Texts
External alarms are reported at the OMT-PC with the number of the externalalarm and its name.
The name of an alarm is entered at the OMT-PC when the alarm is created.
Enter the alarm name, e.g. FIRE ALARM, as text no. 1
b Display existing alarm names with DISP ALTEXT.
b Alarm names which are not needed must be canceled with CAN ALTEXT (butonly if they are no longer linked to external alarms).
A30808-X3063-A403-2-7630 PROC:SYP – 43
CommissioningSystem
ITMN - OFFLINE
36 Link Alarm Names to External Alarms
b Link the alarm names to the external alarms with:CR EAL:SITE=EXCH,EAL=...(1-24),TEXTNO=...(1 - x);
Further commands: DISP EAL and CAN EAL
37 Decision Block
Are alarms to be forwarded from the SYPD to another facility (e.g. OMC)? Y h...38N h...END
38 Forwarding of External Alarms
Module TXA:SYPC must be installed for the forwarding of alarms (only inF:SYPC).
Before inserting the jumpers on module TXA:SYPC / T/RM:SYCR, various pointsmust be clarified with the customer:
• Are alarms/indications to be forwarded to the OMC or other facilities (e.g.building security staff). If so, jumpers or resistors must be soldered ontomodule TXA:SYPC / T/RM:SYCR (see MMN:SYP, TAB / MMN:SYP for CDE,TAB).
• How are the alarms to be forwarded?
– Individually: One or more alarms/indications are assigned to a relay onmodule TXA:SYPC / T/RM:SYCR and forwarded by this relay.
– In groups: The alarms are grouped and forwarded.
Example:All critical alarms indicated at the SYPD are assigned as a group to the 1strelay and forwarded.All major alarms are assigned to the 2nd relay and forwarded.All indications are assigned to the 3rd relay and forwarded.
The alarms/indications are assigned to the relays in the USER-PROM.
Deactivate the SYP and switch off the DC converter
Pull module TXA:SYPC / T/RM:SYCR and solder in jumpers or resistors on themodule
...... (see 3.3.12)
Insert module TXA:SYPC / T/RM:SYCR
Check the corresponding fuse
Activate the SYP
Connect the customer’s alarm signaling equipment to the MDF
For alarm forwarding, the USER-PROM must be programmed as specified in: ......NIMN, SYP
PROC:SYP – 44 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
39 Enable Alarm Forwarding
The alarm forwarding function of module TXA:SYPC is only enabled if ALSTAT1or ALSTAT2 is set.
b Check the system settings in the database with command DISP ALMODE
System response:STATUS | HLIM
------------------------------
ALSTAT1 | YES
b If any other status is set, change it with the following command:ENTR ALMODE:STATUS=ALSTAT1,HLIM=YES;
40 Test Alarm Forwarding
In the installation test phase, system error messages must be compared withthe alarms signaled by the signaling facilities.
Trigger alarms to check the alarm forwarding function.
Note:Alarm forwarding is dependent on the SYPD indication and the priority definedfor the alarm.If a single lamp/LED on the SYPD only allows the indication of a major alarm, itis not possible to forward a critical alarm.An alarm is only forwarded as a critical alarm if its priority is defined as critical.
END
A30808-X3063-A403-2-7630 PROC:SN – 1
CommissioningSystem
ITMN - OFFLINE
3.4 Off-line Installation of Switching Network
SN
3.4.1 Documents
The following documents are required as references:
– Maintenance Manual MMN:SN(B)
– AKUHW Lists
3.4.2 Fuse Assignments
There are different fuse assignments for the SN. These assignments depend on:
• The rack used
– R:SN(B)/LTGG
– R:SN(B)/LTGM
– R:SN(B)/MB/LTGM
– R:CE (Rural Exchanges)
• The cable routing for the SN:
– Cable routing from above
– Cable routing from below
• The size of the SN
• The frame to be switched on:
– TSG-frame
– SSG-frame
PROC:SN – 2 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.3 Fuse Assignment for SN (31LTG)(Rural Exchanges)
3.4.3.1 Rack R:CE
Fig. 3.4.1 Rack R:CE
C
DF:SMSC(C)-0
F:SMSC(C)-1
F:PIOP(A)
F:PBC(A)
F:PBC(A)
F:DEV
Fuse panel / AD:RAL
MUT02
MUT04
MUT03
MUT06
MUT09
MUT10
C
D
C
D
C
D
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
10
29
FU
MOLOC C343 (Supply for SN-0)
MOLOC C343 (Supply for SN-1)
292721 2523 31 33
30282622 3224
F:PIOPA)C
D
Air circulator
MUT11
MUT07
MUT05
MUT08
MUT01
Air circulator
Air circulator
A30808-X3063-A403-2-7630 PROC:SN – 3
CommissioningSystem
ITMN - OFFLINE
3.4.3.2 SN Fuses / Frames and Modules in R:CE
Fig. 3.4.2 SN Fuses / Frames and Modules in R:CE
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
10
FU
292721 2523 31 33
30282622 3224
101 113 125 137 149 161 173 185 197 209 221 233 245 257 269 281 293 305 317 329 341
101 113 125 137 149 161 173 185 197 209 221 233 245 257 269 281 293 305 317 329 341
C
D
C
D
F:SMSC-1
F:SMSC-0
TS
MB
0T
SM
B 1
SS
M16
B
TS
MB
3
TS
MB
2
SG
CB
DC
CM
C
TS
MB
0T
SM
B 1
SS
M16
B
TS
MB
3
TS
MB
2
SG
CB
DC
CM
C
29
PROC:SN – 4 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.4 Fuse Assignment for SN (63LTG)
3.4.4.1 Fuse Assignment for R:SN(B)/LTGG
Fig. 3.4.3 R:SN(B)/LTGG cable routing from above
C
DF:TSG(B) (SN-0)
F:TSG(B) (SN-1)
F:LTG
F:LTG
F:LTG
F:LTG
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
C
D
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
FU
MOLOC C331 (Supply for SN-0)
MOLOC C331 (Supply for SN-1)
MUT01
A30808-X3063-A403-2-7630 PROC:SN – 5
CommissioningSystem
ITMN - OFFLINE
Fig. 3.4.4 R:SN(B)/LTGG cable routing from below
A
BF:LTG
F:LTG
F:LTG
F:LTG
F:TSG(B) (SN-0)
F:TSG(B) (SN-1)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
A
B
A
B
A
B
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
FU
MOLOC C331 (Supply for SN-0)
MOLOC C331 (Supply for SN-1)
MUT01
PROC:SN – 6 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.4.2 Fuse Assignment for R:SN(B)/LTGM
Fig. 3.4.5 R:SN(B)/LTGM cable routing from above
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
DF:TSG(B) (SN-0)
F:TSG(B) (SN-1)
Fuse panel
C
D
01FU
MOLOC C331 (Supply for SN-0)
MOLOC C331 (Supply for SN-1)
LTG LTG LTG LTG
32
A30808-X3063-A403-2-7630 PROC:SN – 7
CommissioningSystem
ITMN - OFFLINE
Fig. 3.4.6 R:SN(B)/LTGM cable routing from below
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
F:LTGM(A)
LTG LTG LTG LTG LTG
F:LTGM(A)
LTG LTG LTG LTG LTG
C
DF:TSG(B) (SN-0)
F:TSG(B) (SN-1)C
D
32
MOLOC C331 (Supply for SN-0)
MOLOC C331 (Supply for SN-1)
01
PROC:SN – 8 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.4.3 Fuse Assignment for R:SN(B)/MB/LTGM
Fig. 3.4.7 R:SN/MB/LTGM cable routing from above
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
DF:TSG(B)
Fuse panel
C
D
FU
01
32
F:MB/CCG(B)
F:LTGM(A)
F:LTGM(A)
F:MB/CCG(B)
F:TSG(B)
MOLOC C331 (Supply for SN-0)
MOLOC C331 (Supply for SN-1)
A30808-X3063-A403-2-7630 PROC:SN – 9
CommissioningSystem
ITMN - OFFLINE
Fig. 3.4.8 R:SN/MB/LTGM cable routing from below
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
DF:LTGM(A)
Fuse panel
C
D
FU
F:LTGM(A)
01
32
F:MB/CCG(B)
F:TSG(B)
F:TSG(B)
F:MB/CCG(B)
MOLOC C331 (Supply for SN-0)
MOLOC C331 (Supply for SN-1)
PROC:SN – 10 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.5 Fuse Assignment for SN (126 LTG - 504 LTG) TSG-frame
3.4.5.1 Fuse Assignment for R:TSG(B)/LTGG
Fig. 3.4.9 R:TSG(B)/LTGG cable routing from above
C
DF:TSG(B) (TSG-0-tsg)
F:TSG(B) (TSG-1-tsg)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
C
D
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
FU
MOLOC C331 (Supply for TSG-0-tsg)
MOLOC C331 (Supply for TSG-1-tsg)
MUT01
A30808-X3063-A403-2-7630 PROC:SN – 11
CommissioningSystem
ITMN - OFFLINE
Fig. 3.4.10 R:TSG(B)/LTGG cable routing from below
A
BF:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:TSG(B) (TSG-0-tsg)
F:TSG(B) (TSG-1-tsg)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
A
B
A
B
A
B
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
FU
MOLOC C331 (Supply for TSG-0-tsg)
MOLOC C331 (Supply for TSG-1-tsg)
MUT01
PROC:SN – 12 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.5.2 Fuse Assignment for R:TSG(B)/LTGM
Fig. 3.4.11 R:TSG(B)/LTGM cable routing from above
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
DF:TSG(B) (TSG-0-tsg)
F:TSG(B) (TSG-1-tsg)
Fuse panel
C
D
01FU
MOLOC C331 (Supply for TSG-0-tsg)
MOLOC C331 (Supply for TSG-1-tsg)
LTG LTG LTG LTG
32
A30808-X3063-A403-2-7630 PROC:SN – 13
CommissioningSystem
ITMN - OFFLINE
Fig. 3.4.12 R:TSG(B)/LTGM cable routing from below
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
F:LTGM(A)
LTG LTG LTG LTG LTG
F:LTGM(A)
LTG LTG LTG LTG LTG
C
DF:TSG(B) (TSG-0-tsg)
F:TSG(B) (TSG-1-tsg)C
D
32
MOLOC C331 (Supply for TSG-0-tsg)
MOLOC C331 (Supply for TSG-1-tsg)
01
PROC:SN – 14 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.5.3 Fuse Assignment for R:TSG(B)/MB/LTGM
Fig. 3.4.13 R:SN/MB/LTGM cable routing from above
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
DF:TSG(B)
Fuse panel
C
D
FU
01
32
F:MB/CCG(B)
F:LTGM(A)
F:LTGM(A)
F:MB/CCG(B)
F:TSG(B)
MOLOC C331 (Supply for TSG-0-tsg)
MOLOC C331 (Supply for TSG-1-tsg)
A30808-X3063-A403-2-7630 PROC:SN – 15
CommissioningSystem
ITMN - OFFLINE
Fig. 3.4.14 R:SN/MB/LTGM cable routing from below
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
DF:LTGM(A)
Fuse panel
C
D
FU
F:LTGM(A)
01
32
F:MB/CCG(B)
F:TSG(B)
F:TSG(B)
F:MB/CCG(B)
MOLOC C331 (Supply for TSG-0-tsg)
MOLOC C331 (Supply for TSG-1-tsg)
PROC:SN – 16 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.4.6 Fuse Assignment for SN (126 LTG - 504 LTG) SSG-frame
In SN (126LTG) switching networks only the left half of the SSG module frame isequipped. This is fed by only one DCC.
Fig. 3.4.15 Frame SSG(B) for SN (126 LTG)
In SN (252 LTG..504 LTG) switching networks both halves of the SSG module frame areequipped and each one is fed by a separate DCC.
Fig. 3.4.16 Frame SSG(B) for SN (252 LTG..504 LTG)
DCCMS
EMPTY
SSG EMPTY
DCCMS
SSG
DCCMS
SSG
A30808-X3063-A403-2-7630 PROC:SN – 17
CommissioningSystem
ITMN - OFFLINE
3.4.6.1 Fuse Assignment for R:SSG(B)/LTGG
Fig. 3.4.17 R:SSG(B)/LTGG cable routing from above
C
D
F:SSG(B)
F:LTGG(A)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
C
D
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
11
12
FU
MOLOC C101 (Supply for SSG-0-0
SSG-1-0or SSG-1-2
SSG-1-1or SSG-1-3
F:SSG(B)SSG-0-0
or SSG-0-2SSG-0-1
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
or SSG-0-2)
MOLOC C331 (Supply for SSG-0-1or SSG-0-3)
MOLOC C101 (Supply for SSG-1-0or SSG-1-2)
MOLOC C331 (Supply for SSG-1-1or SSG-1-3)
MUT01
or SSG-0-3
PROC:SN – 18 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
Fig. 3.4.18 R:SSG(B)/LTGG cable routing from below
A
B
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
A
B
A
B
A
B
C
D
C
D
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
11
12
FU
MUT01
F:SSG(B)SSG-0-0
or SSG-0-2SSG-0-1
or SSG-0-3
F:SSG(B)SSG-1-0
or SSG-1-2SSG-1-1
or SSG-1-3
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)MOLOC C101 (Supply for SSG-0-0or SSG-0-2)
MOLOC C331 (Supply for SSG-0-1or SSG-0-3)
MOLOC C101 (Supply for SSG-1-0or SSG-1-2)
MOLOC C331 (Supply for SSG-1-1or SSG-1-3)
A30808-X3063-A403-2-7630 PROC:SN – 19
CommissioningSystem
ITMN - OFFLINE
3.4.6.2 Fuse Assignment for R:SSG(B)/LTGM
Fig. 3.4.19 R:SSG(B)/LTGM cable routing from above
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
32
33
01
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
MOLOC C101 (Supply for SSG-0-0or SSG-0-2)
MOLOC C331 (Supply for SSG-0-1or SSG-0-3)
MOLOC C101 (Supply for SSG-1-0or SSG-1-2)
MOLOC C331 (Supply for SSG-1-1or SSG-1-3)
C
D
F:SSG(B)C
DSSG-1-0
or SSG-1-2SSG-1-1
or SSG-1-3
F:SSG(B)SSG-0-0
or SSG-0-2SSG-0-1
or SSG-0-3
02
PROC:SN – 20 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
Fig. 3.4.20 R:SSG(B)/LTGM cable routing from below
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
FU
32
01
MOLOC C101 (Supply for SSG-0-0or SSG-0-2)
MOLOC C331 (Supply for SSG-0-1or SSG-0-3)
MOLOC C101 (Supply for SSG-1-0or SSG-1-2)
MOLOC C331 (Supply for SSG-1-1or SSG-1-3)
C
D
F:SSG(B)C
DSSG-1-0
or SSG-1-2SSG-1-1
or SSG-1-3
F:SSG(B)SSG-0-0
or SSG-0-2SSG-0-1
or SSG-0-3
02
33
F:LTGM(A)
LTG LTG LTG LTG LTG
F:LTGM(A)
LTG LTG LTG LTG LTG
A30808-X3063-A403-2-7630 PROC:SN – 21
CommissioningSystem
ITMN - OFFLINE
3.4.6.3 Fuse Assignment for R:SSG(B)/MB/LTGM
Fig. 3.4.21 R:SN/MB/LTGM with F:SSG(B) cable routing from above
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
Fuse panelFU
01
F:MB/CCG(B)
F:LTGM(A)
F:LTGM(A)
F:MB/CCG(B)
02
32
33
MOLOC C101 (Supply for SSG-0-0/ SSG-0-2)
MOLOC C101
MOLOC C331
MOLOC C331
(Supply for SSG-1-1/ SSG-1-3)
(Supply for SSG-0-1/ SSG-0-3)
(Supply for SSG-1-0/ SSG-1-2)
C
D
C
D
F:SSG(B)
F:SSG(B)
SSG-0-0
SSG-1-0 SSG-1-1
SSG-0-1
/ SSG-1-3
/ SSG-0-3
/ SSG-1-2
/ SSG-0-2
PROC:SN – 22 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
Fig. 3.4.22 R:SN/MB/LTGM with F:SSG(B) cable routing from below
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
D
F:LTGM(A)
Fuse panel
C
DF:LTGM(A)
F:MB/CCG(B)
F:SSG(B)
F:SSG(B)
F:MB/CCG(B)
FU
01
02
32
33
MOLOC C101 (Supply for SSG-0-0/ SSG-0-2)
MOLOC C101
MOLOC C331
MOLOC C331
(Supply for SSG-1-1/ SSG-1-3)
(Supply for SSG-0-1/ SSG-0-3)
(Supply for SSG-1-0/ SSG-1-2)
SSG-0-0
SSG-1-0 SSG-1-1
SSG-0-1
/ SSG-1-3
/ SSG-0-3
/ SSG-1-2
/ SSG-0-2
A30808-X3063-A403-2-7630 PROC:SN – 23
CommissioningSystem
ITMN - OFFLINE
1 Basic Test (Rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
2 Check Ground Connections
Check whether the ground connections between adjacent racks are correctlyplugged in
3 Decision Block: Capacity stage of the SN
Branch to one of the following blocks according to the capacity stage of the SN
– It is an SN (31 LTG) switching network h...4– It is an SN (63 LTG) switching network h...12– It is an SN (126 LTG.. 504 LTG) switching network h...20
4 Create Basic State (SN (31 LTG))
The location of the SN modules in the SMSC(C) frames and the correspondingfuses are shown in: ...... (see Fig. 3.4.2)
Switch off SN DCCs in the SMSC(C) frames
Screw out all SN main fuses
5 Power Supply Check (SN (31 LTG))
Screw in the first/next SN-fuse
Switch on the corresponding DCC in the SN module frame to check the fuseassignment to the MUT
Is the LED of the DCC lit? Y h...6N h...7
6 Decision Block
Have all SN-fuses already been screwed in? Y h...ENDN h...5
7 Identify Faulty Modules
Unplug all related modules individually under power (except DCC), but leavethem in position.
After each module is unplugged the voltage should be checked again. (Thegreen LED of the DCC is lit)
Could the fault be cleared by removing a certain module? Y h...8N h...9
PROC:SN – 24 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
8 Replace Faulty Module
Replace faulty module, plug in all modules
– Repeat testing after replacing faulty module h...5
9 Faulty DCC
Switch off the DCC of the faulty module frame
Screw out the fuse which is allocated to this DCC
Replace DCC by spare module, screw in fuse, switch on DCC
Is the LED of the DCC lit? Y h...11N h...10
10 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...5
11 Plug in Modules
Plug in all modules
– Repeat testing after replacing the DCC h...5
12 Create Basic State (SN (63 LTG))
Switch off DCCs in the SN module frames
Screw out all SN main fuses
A30808-X3063-A403-2-7630 PROC:SN – 25
CommissioningSystem
ITMN - OFFLINE
13 Power Supply Check (SN (63 LTG))
Caution: The assignment of the fuses to the relevant module frame is imple-mented for two different cable routings and for two different racks:
Fuse assignment in R:SN(B)/LTGG for cable routing from above ...... (see Fig. 3.4.3)
Fuse assignment in R:SN(B)/LTGG for cable routing from below ...... (see Fig. 3.4.4)
Fuse assignment in R:SN(B)/LTGM for cable routing from above ...... (see Fig. 3.4.5)
Fuse assignment in R:SN(B)/LTGM for cable routing from below ...... (see Fig. 3.4.6)
Fuse assignment in R:SN(B)/MB/LTGM for cable routing from above ...... (see Fig. 3.4.7)
Fuse assignment in R:SN(B)/MB/LTGM for cable routing from below ...... (see Fig. 3.4.8)
Screw in the first/next SN-fuse
Switch on the corresponding DCC in the SN module frame to check the fuseassignment to the MUT
Is the LED of the DCC lit? Y h...14N h...15
14 Decision Block
Have all SN-fuses already been screwed in? Y h...ENDN h...15
15 Identify Faulty Modules
Unplug all modules individually under power (except DCCMS), but leave them inposition.
After each module is unplugged the voltage should be checked again. (Thegreen LED of the DCC is lit)
Could the fault be cleared by removing a certain module? Y h...16N h...17
16 Replace Faulty Module
Replace faulty module, plug in all modules
– Repeat testing after replacing faulty module h...13
PROC:SN – 26 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
17 Faulty DCC
Switch off the DCC of the faulty module frame
Screw out the fuse which is allocated to this DCC
Replace DCC by spare module, screw in fuse, switch on DCC
Is the LED of the DCC lit? Y h...19N h...18
18 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...13
19 Plug in Modules
Plug in all modules
– Repeat testing after replacing the DCC h...13
20 Create Basic State (TSG frames)
Switch off DCCs in the TSG module frames
Screw out all TSG main fuses
A30808-X3063-A403-2-7630 PROC:SN – 27
CommissioningSystem
ITMN - OFFLINE
21 Power Supply Check (TSG-Frames for SN(126..504LTG))
Caution: The assignment of the fuses to the relevant module frame is imple-mented for two different cable routings and for two different racks:
Fuse assignment in R:SN(B)/LTGG for cable routing from above ...... (see Fig. 3.4.9)
Fuse assignment in R:SN(B)/LTGG for cable routing from below ...... (see Fig. 3.4.10)
Fuse assignment in R:SN(B)/LTGM for cable routing from above ...... (see Fig. 3.4.11)
Fuse assignment in R:SN(B)/LTGM for cable routing from below ...... (see Fig. 3.4.12)
Fuse assignment in R:SN(B)/MB/LTGM for cable routing from above ...... (see Fig. 3.4.13)
Fuse assignment in R:SN(B)/MB/LTGM for cable routing from below ...... (see Fig. 3.4.14)
Screw in the first/next TSG-fuse
Switch on the corresponding DCC in the TSG module frame to check the fuseassignment to the MUT
Is the LED of the DCC lit? Y h...22N h...23
22 Decision Block
Have all TSG-fuses already been screwed in? Y h...29N h...21
23 Identify Faulty Modules (TSG-Frames)
Unplug all modules individually under power (except DCCMS), but leave them inposition.
After each module is unplugged the voltage should be checked again. (Thegreen LED of the DCC is lit)
Could the fault be cleared by removing a certain module? Y h...24N h...25
24 Replace Faulty Module (TSG-Frames)
Replace faulty module, plug in all modules
– Repeat testing after replacing faulty module h...21
PROC:SN – 28 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
25 Faulty DCC (TSG-Frames)
Switch off the DCC of the faulty module frame
Screw out the fuse which is allocated to this DCC
Replace DCC by spare module, screw in fuse, switch on DCC
Is the LED of the DCC lit? Y h...27N h...26
26 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...21
27 Plug in Modules (TSG-Frames)
Plug in all modules
– Repeat testing after replacing the DCC h...21
28 Create Basic State (SSG-Frames)
Switch off DCCs in the SSG module frames
Screw out all SSG main fuses
A30808-X3063-A403-2-7630 PROC:SN – 29
CommissioningSystem
ITMN - OFFLINE
29 Power Supply Check (SSG-Frames)
• In SN (126LTG) switching networks only the left half of the SSG moduleframe is equipped. This is fed by only one DCC
• In SN (252 LTG..504 LTG) switching networks both halves of the SSG moduleframe are equipped and each one is fed by a separate DCC
Caution: The assignment of the fuses to the relevant module frame is imple-mented for two different cable routings and for two different racks:
Fuse assignment in R:SN(B)/LTGG for cable routing from above ...... (see Fig. 3.4.17)
Fuse assignment in R:SN(B)/LTGG for cable routing from below ...... (see Fig. 3.4.18)
Fuse assignment in R:SN(B)/LTGM for cable routing from above ...... (see Fig. 3.4.19)
Fuse assignment in R:SN(B)/LTGM for cable routing from below ...... (see Fig. 3.4.20)
Fuse assignment in R:SN(B)/MB/LTGM for cable routing from above ...... (see Fig. 3.4.21)
Fuse assignment in R:SN(B)/MB/LTGM for cable routing from below ...... (see Fig. 3.4.22)
Screw in the first/next SSG-fuse
Switch on the corresponding DCC in the SSG module frame to check the fuseassignment to the MUT
Is the LED of the DCC lit? Y h...30N h...31
30 Decision Block
Have all SSG-fuses already been screwed in? Y h...ENDN h...29
31 Identify Faulty Modules (SSG-Frames)
Unplug all modules individually under power (except DCCMS), but leave them inposition.
After each module is unplugged the voltage should be checked again. (Thegreen LED of the DCC is lit)
Could the fault be cleared by removing a certain module? Y h...32N h...33
PROC:SN – 30 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
32 Replace Faulty Module (SSG-Frames)
Replace faulty module, plug in all modules
– Repeat testing after replacing faulty module h...29
33 Faulty DCC (SSG-Frames)
Switch off the DCC of the faulty module frame
Screw out the fuse which is assigned to this DCC
Replace DCC by spare module, screw in fuse, switch on DCC
Is the LED of the DCC lit? Y h...35N h...34
34 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...29
35 Plug in Modules (SSG-Frames)
Plug in all modules
– Repeat testing after replacing the DCC h...29
END
A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 1
CommissioningSystem
ITMN - OFFLINE
3.5 Off-line Installation of Common Channel SignalingNetwork Control
CCNC:CCS7
3.5.1 Documents
The following documents are required as references
– Maintenance Manual MMN:CCS7
– AKUHW Lists
3.5.2 LED Displays (Processor Modules)
To show the operating state and the statuses in the start-up procedure, the LEDs in thefaceplate of the processor modules are activated as follows:
Status in the start-up procedure LEDs
H1 H2 H3 H4
Start-up/M:P(M)U:SIMP test x 1 1 1
End of start-up 0 1 0 0
Test mode / Watchdog inactive 1 x x x
Tab. 3.5.1 LEDs on M:PU:SIMP (M:PMU:SIMP)
Status in the start-up procedure LED
H1
Start-up/M:MH:SIMP test 1
End of start-up 0
Tab. 3.5.2 LEDs on M:MH:SIMP
Status in the start-up procedure LEDs
H1 H2 H3
Start-up/M:SIPA test x 0 1
End of start-up 0 1 0
Test mode / Watchdog inactive 1 x x
Tab. 3.5.3 LEDs on M:SIPA
PROC:CCNC_CCS7 – 2 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.5.3 LED Displays (SILT Modules)
3.5.4 Fuse Assignment
The fuse assignment for F:SILTD(A) dependents on the rack where the frame is built in
Status in the start-up procedure LEDs
H1 H2 H3 H4
Start-up/M:P(M)U:CPI test x 1 1 1
End of start-up 0 1 0 0
Test mode / Watchdog inactive 1 x x x
Tab. 3.5.4 LEDs on M:PU:CPI (M:PMU:CPI)
Status in the start-up procedure LEDs
H1 H2 H3 H4
Start-up and MU test x 0 1 0
Test of peripheral units x 0 1 1
Initialization of HW/RL x 1 1 1
End of start-up 0 1 0 0
Test mode / Watchdog inactive 1 x x x
Tab. 3.5.5 LEDs on M:SILTC
Status in the start-up procedure LEDs
H1 H2 H3 H4 H5 H6 H7
Start-up and RAM test x 1 1 1 1 1 1
Stack, watchdog test x 1 1 1 0 1 1
EPROM test x 1 1 1 0 0 1
Notebook, RAM test x 1 1 1 0 0 0
TIMER, DMA test x 1 0 1 0 0 0
PORT HDLC x 1 0 0 0 0 0
End of start-up 0 1 0 0 0 0 0
Test mode / Watchdog inactive 1 x x x x x x
Tab. 3.5.6 LEDs on M:SILTD
A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 3
CommissioningSystem
ITMN - OFFLINE
3.5.4.1 Fuse Assignment in R:CCNP/SILTDThe fuse assignment in R:CCNP/SILTD is realized for 2 different versions of the rack:
– shielded or unshielded version
– partially shielded version
3.5.4.2 Fuse Assignment in R:SILTD
MUT SILT Groupleft
SILT Groupright
02 FU 1 FU 11
04 FU 3 FU 13
06 FU 7 FU 17
Tab. 3.5.7 Fuse assignment R:CCNP/SILTD(shielded or unshielded version)
MUT SILT Groupleft
SILT Groupright
02 FU 1 FU 11
04 FU 2 FU 12
06 FU 3 FU 13
Tab. 3.5.8 Fuse assignment R:CCNP/SILTD(partially shielded version)
MUT SILT Groupleft
SILT Groupright
02 FU 1 FU 11
03 FU 3 FU 13
04 FU 5 FU 15
05 FU 7 FU 17
06 FU 9 FU 19
07 FU 10 FU 20
Tab. 3.5.9 Fuse assignment R:SILTD
PROC:CCNC_CCS7 – 4 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.5.5 Rack SILTD
Fig. 3.5.1 Rack R:SILTD
MOLOC A120
MOLOC A001
A
BMOLOC A001
F:SILTD
F:SILTD
F:SILTD
F:SILTD
F:SILTD
F:SILTD
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
03
13
05
15
07
17
09
19
10
20
FU
MOLOC A001
MOLOC A001
MOLOC A001
MOLOC A001
MOLOC A120
MOLOC A120
MOLOC A120
MOLOC A120
MOLOC A120
A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 5
CommissioningSystem
ITMN - OFFLINE
3.5.6 Rack CCNP/SILTD
Fig. 3.5.2 Rack R:CCNP/SILTD
MOLOC A120
MOLOC A001
A
BMOLOC A001
F:SILTD
F:SILTD
F:SILTD
F:CCNP(B)
F:CCNP(B)
CD
Fuse panel
MUT02
MUT04
MUT06
MUT08
MUT10
MUT01
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
11
03
13
07
17
05
06
15
16
FU
MOLOC A001
MOLOC A001
MOLOC A001
MOLOC A120
MOLOC A120
MOLOC A120
MOLOC A120
PROC:CCNC_CCS7 – 6 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
1 Basic Test (Rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
2 Information Block
All work should be performed for the two CCNPs in MUT 08 and 10 in parallel
3 Create Basic State
Switch off all CCNC-DCCs
Screw out all CCNC-fuses
4 Screw in Fuses (CCNP)
Screw in the following fuses:
• FU 6 for CCNP0 MUT 08
• FU16 for CCNP1 MUT 10
5 Switch on DCCs (CCNP)
Switch on the corresponding DCCs ......(see Fig. 3.5.2)
Is the green LED in the module faceplate on? Y h...7N h...6
6 LED off (CCNP)
DCC or modules suspect
– If DCC is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:DCC
– If a module is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:MOD
7 Check Basic Setting (CCNP)
When the DCCs have been switched on, the CCNP automatically performs self-tests for a few seconds. Modules given in parenthesis refer to a CCNP with a 4MB memory
A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 7
CommissioningSystem
ITMN - OFFLINE
Basic setting for the LED displays on the faceplates of the processor modules is,that only the following LEDs are lit:
• PU:SIMP (PMU:SIMP) : H2
• SIPA : H2
• PU:CPI (PMU:CPI) : H2
Are the LED displays in the basic setting? Y h...16N h...8
8 Fault Analysis
To show the operating state and the statuses in the start-up procedure, theLEDs in the faceplates of the processor modules are activated as shown in: ...... (see 3.5.2)
Carry out fault analysis according to the tables mentioned above
Is LED H1 on one or more of the modules: M:P(M)U:SIMP / M:SIPA /M:P(M)U:CPI lit? Y h...9
N h...10
9 Slide Switches (CCNP)
Move slide switch S2, which is reached through faceplate opening 400 (exceptfor M:SIPA, where S2 is marked on the faceplate), until LED H1 goes out.
10 Troubleshooting for CCNP Modules
Switch off all DCCs
Replace module identified by means of fault analysis
Switch on all DCCs again
Is the LED display in basic setting when self-test is completed? Y h...16N h...11
11 Decision Block: Same Fault Pattern
Same fault pattern as before module replacement? Y h...12N h...13
12 Reinsert Original Module
Switch off all DCCs and reinsert original module
– After reinserting original module h...14
13 Possible Faults
Spare module could be defective or there is another fault in the CCNP
Switch off all DCCs
– After switching off all DCCs h...14
PROC:CCNC_CCS7 – 8 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
14 Decision Block: Other Modules Suspect
Are any other modules suspect? Y h...10N h...15
15 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...5
16 Switch on DCCs (SILTD(A))
Screw fuses for F:SILTD(A) (in R:CCNP/SILTD or in R:SILTD depending onconfiguration) into fuse panel.
......(see 3.5.4)
Switch on DCCs
Is green LED on DCC faceplate lit? Y h...18N h...17
17 LED off
DCC or modules suspect
– If DCC is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:DCC
– If a module is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:MOD
18 Check Basic Setting (SILTC)
When DCCs have been switched on, SILTC and SILTD automatically performself-tests for a few seconds.
Is only LED H2 lit on all M:SILTC? Y h...19N h...20
19 Check Basic Setting (SILTD)
Is only LED H2 lit on all M:SILTD? Y h...35N h...28
20 Interpretation of LED Combinations (SILTC)
For Interpretation of the LED combinations ......(see Tab. 3.5.5)
Is LED H1 lit? Y h...21N h...22
21 Slide Switches (SILTC)
Move slide switch S2 (can be reached through faceplate opening 400) until LEDH1 goes out.
A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 9
CommissioningSystem
ITMN - OFFLINE
22 Check LED H3
Is LED H3 lit? Y h...23N h...18
23 Replace Defective Module (SILTC)
Switch off DCC for suspect M:SILTC by way of toggle switch on DCC modulefaceplate
Replace suspect M:SILTC
24 RESET (SILTC)
Switch on DCC and press RESET
Has a new EPROM been installed, and still LED H3 alone is lit on M:SILTC afterself-test? Y h...25
N h...26
25 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...16
26 Check LED H2
Is only LED H2 lit on M:SILTC after self test? Y h...18N h...27
27 Test EPROM
Test EPROM for faults or install new EPROM
– Repeat testing h...24
28 Interpretation of LED Combinations (SILTD)
For Interpretation of the LED combinations ...... (see Tab. 3.5.6)
29 Replace Defective Module (SILTD)
Switch off DCC for suspect M:SILTD by way of toggle switch on DCC modulefaceplate
Replace suspect M:SILTD
30 RESET (SILTD)
Switch on DCC and press RESET
31 Check LED H2 (SILTD)
Is only LED H2 lit on M:SILTD after self test? Y h...19N h...32
PROC:CCNC_CCS7 – 10 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
32 Decision Block: Components Changed
Have components from the defective M:SILTD been installed on the replace-ment module (e.g. EPROM)? Y h...34
N h...33
33 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...16
34 Test EPROM (SILTD)
Switch off DCC by way of toggle switch on DCC module faceplate
Test EPROM for faults or install new EPROM
– Repeat testing h...30
35 Screw in Fuses (MUXM)
Screw in the following fuses:
• FU 5 for MUXM-0
• FU15 for MUXM-1
36 Switch on DCCs (MUXM)
Switch on DCCs for MUXM
Is green LED in the module faceplates lit? Y h...38N h...37
37 LED off (MUXM)
DCC or modules suspect
– If DCC is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:DCC
– If a module is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:MOD
38 RESET (MUXM)
Press reset switch S1 and start self test
Does LED2 flash when test is finished? Y h...ENDN h...39
39 Replace MUXM
Switch off relevant DCC and replace MUXM
– Repeat testing after replacing MUXM h...36
END
A30808-X3063-A403-2-7630 PROC:LTG – 1
CommissioningSystem
ITMN - OFFLINE
3.6 Off-line Installation of Line Trunk Groups
LTG
3.6.1 Documents
The following documents are required as references:
– Maintenance Manual MMN:LTGx
– AKUHW Lists
PROC:LTG – 2 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2 Fuse Assignments of the different Types of LTG
3.6.2.1 Fuse Assignment of R:LTGA
Fig. 3.6.1 Fuse Assignment of R:LTGA
F:LTGA(A) 0
F:LTGA(B) 0
F:LTGA(A) 1
F:LTGA(B) 1
CD
MUT02
MOLOC C091
MOLOC C001, C013, C025,C 037
MOLOC C079, C085, C103, C115
MUT03
MUT04
MUT05MOLOC C091
MOLOC C001, C013, C025,C 037
MOLOC C079, C085, C103, C115
MUT01
A
B
C
D
A
B
C
D
A
B
C
D
A
B
C
D
Fuse panel
01
02
03
11
12
13
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
A30808-X3063-A403-2-7630 PROC:LTG – 3
CommissioningSystem
ITMN - OFFLINE
3.6.2.2 Fuse Assignment of R:LTGB/LTGB:OSS
Fig. 3.6.2 Fuse Assignment of R:LTGB
F:LTGB(A)
F:LTGB(A)
F:LTGB(A)
F:LTGB(A)
CD
MUT02
MUT03
MUT04
MUT05
MUT01
A
B
C
D
A
B
C
D
A
B
C
D
A
B
C
D
Power supply for all LTU
MOLOC C001, C013
MOLOC C103, C115
Power supply for all LTU
MOLOC C001, C013
MOLOC C103, C115
Power supply for all LTU
MOLOC C001, C013
MOLOC C103, C115
Power supply for all LTU
MOLOC C001, C013
MOLOC C103, C115
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
03
01
02
13
11
12
06
04
05
16
14
15
FU
Fuse panel
PROC:LTG – 4 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.3 Fuse Assignment of R:LTGC
Fig. 3.6.3 Fuse Assignment of R:LTGC
A
B
MOLOC A001, A015
MOLOC A001, A015
MOLOC A001, A015
MOLOC A001, A015
MOLOC A001, A015
MOLOC A001, A015
F:LTGC(A)
F:LTGC(A)
F:LTGC(A)
F:LTGC(A)
F:LTGC(A)
F:LTGC(A)
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
03
FU
11
12
13
Fuse panel
A30808-X3063-A403-2-7630 PROC:LTG – 5
CommissioningSystem
ITMN - OFFLINE
3.6.2.4 Fuse Assignment of R:LTGC/CR
Fig. 3.6.4 Fuse Assignment of R:LTGC/CR
A
B
MOLOC A001, A115
MOLOC A001
MOLOC A001, A115
MOLOC A001, A115
MOLOC A001
MOLOC A001, A115
F:LTGC(A)
F:LTGC(A)
F:LTGC(A)
F:LTGC(A)
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
F:CR(A) F:CR(A)
F:CR(A) F:CR(A)
*
*
*
*
*):Each half-frame F:CR(A) is assigned to the LTGC above / below and electrically connected with it
MOLOC A115
MOLOC A115
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
03
FU
11
13
Fuse panel
PROC:LTG – 6 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.5 Fuse Assignment of R:LTGD
Fig. 3.6.5 Fuse Assignment of R:LTGD
A
B
MOLOC A001
MOLOC A115
MOLOC A001, A115
MOLOC A001
MOLOC A001, A115
MOLOC A001
F:CRES(A) 0
F:LTGD(A) 0
F:CRES(A) 1
F:CRES(A) 2
F:LTGD(A) 1
F:CRES(A) 3
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
MOLOC A115
MOLOC A001
MOLOC A115
MOLOC A115
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
03
05
06
11
12
13
15
16
FU
Fuse panel
A30808-X3063-A403-2-7630 PROC:LTG – 7
CommissioningSystem
ITMN - OFFLINE
3.6.2.6 Fuse Assignment of R:LTGF
Fig. 3.6.6 Fuse Assignment of R:LTGF
A
B
MOLOC A117
MOLOC A117
MOLOC A117
MOLOC A117
MOLOC A117
MOLOC A117
F:LTGF(A)
F:LTGF(A)
F:LTGF(A)
F:LTGF(A)
F:LTGF(A)
F:LTGF(A)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
01
02
03
FU
04
05
06
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
PROC:LTG – 8 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.7 Fuse Assignment of R:LTGG
Fig. 3.6.7 Fuse Assignment of R:LTGG
A
BMOLOC A001 (left LTG)
MOLOC A123 (right LTG)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
11
12
03
04
13
14
05
06
15
16
FU
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
A30808-X3063-A403-2-7630 PROC:LTG – 9
CommissioningSystem
ITMN - OFFLINE
3.6.2.8 Fuse Assignment of R:LTGG:OSS
Fig. 3.6.8 Fuse Assignment of R:LTGG:OSS
F:LTGG(A)
F:LTGG(A)
CD
Fuse panel
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
MOLOC
A001
A008, A013, A018, A023, A028
A123
A066, A071, A076, A081, A086
01
03
02
04
F:LTGG(A)
A123
A066, A071, A076, A081, A086
06
08
A123
A066, A071, A076, A081, A086
10
12
A001
A008, A013, A018, A023, A028
05
07
A001
A008, A013, A018, A023, A028
09
11
F:LTGG(A)
F:LTGG(A)
A123
A066, A071, A076, A081, A086
14
16
A123
A066, A071, A076, A081, A086
18
20
A001
A008, A013, A018, A023, A028
13
15
A001
A008, A013, A018, A023, A028
17
19
MUT01
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
FU FU
MOLOC
PROC:LTG – 10 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.9 Fuse Assignment of R:SNB/LTGG (Cable routing from above)
Fig. 3.6.9 Fuse Assignment of R:SNB/LTGG(Cable routing from above)
A
B
MOLOC A123 (right LTG)
F:SSG(B) or F:TSG(B)
F:SSG(B) or F:TSG(B)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
11
12
03
04
13
14
05
06
15
16
FU
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
A30808-X3063-A403-2-7630 PROC:LTG – 11
CommissioningSystem
ITMN - OFFLINE
3.6.2.10 Fuse Assignment of R:SNB/LTGG (Cable routing from below)
Fig. 3.6.10 Fuse Assignment of R:SNB/LTGG(Cable routing from below)
A
BMOLOC A001 (left LTG)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:LTGG(A)
F:SSG(B) or F:TSG(B)
F:SSG(B) or F:TSG(B)
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
05
06
15
16
03
04
13
14
01
02
11
12
FU
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
PROC:LTG – 12 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.11 Fuse Assignment of R:LTGH
Fig. 3.6.11 Fuse Assignment of R:LTGH
A
BMOLOC A001 (left LTG)
MOLOC A123 (right LTG)
F:LTGG(A) 0
F:LTGG(A) 1
F:LTGG(A) 2
F:LTGG(A) 3
F:LTGH(A) 4
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
A
B
A
B
A
B
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
02
11
12
03
04
13
14
15
16
FU
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A001 (left LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
MOLOC A123 (right LTG)
A30808-X3063-A403-2-7630 PROC:LTG – 13
CommissioningSystem
ITMN - OFFLINE
3.6.2.12 Fuse Assignment of R:LTGM
Fig. 3.6.12 Fuse Assignment of R:LTGM
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
02
03
05
19
20
21
22
23
06
07
04
08
09
01
10
24
26
27
28
11
12
13
14
15
25
29
30
31CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
32
33
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
PROC:LTG – 14 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.13 Fuse Assignment of R:SNB/LTGM
Fig. 3.6.13 Fuse Assignment of R:SNB/LTGM(Cable routing from above)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
02
32
08
09
10
11
12
22
23
24
33
25
26
01
03
04
06
07
27
28
29
30
31
05
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
F:SSG(B) or F:TSG(B)A
B
F:SSG(B) or F:TSG(B)A
B
A30808-X3063-A403-2-7630 PROC:LTG – 15
CommissioningSystem
ITMN - OFFLINE
Fig. 3.6.14 Fuse Assignment of R:SNB/LTGM(Cable routing from below)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
04
05
07
27
28
29
30
31
08
09
06
10
11
03
12
22
24
25
26
01
02
32
33
23
CD
Fuse panel
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
C
D F:LTGM(A)
LTG LTG LTG LTG LTG
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
MOLOC C151 / LTGM 1
MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4
MOLOC C101 / LTGM 0
F:SSG(B) or F:TSG(B)C
D
F:SSG(B) or F:TSG(B)C
D
PROC:LTG – 16 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.6.2.14 Fuse Assignment for R:SNB/MB/LTGM
Fig. 3.6.15 Fuse Assignment for R:SN/MB/LTGM(Cable routing from above)
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
DF:TSG(B) or F:SSG(B)
Fuse panel
C
D
FU
F:TSG(B) or F:SSG(B)
03
F:MB/CCG(B)
F:MB/CCG(B)
04
05
06
07
27
28
29
30
31
C
D F:LTGM(A)
0 1 2 3 4
C
D F:LTGM(A)
0 1 2 3 4
MOLOC C101/LTGM 0
MOLOC C255/LTGM 3
MOLOC C203/LTGM 2
MOLOC C151/LTGM 1
MOLOC C305/LTGM 4
MOLOC C101/LTGM 0
MOLOC C151/LTGM 1
MOLOC C203/LTGM 2
MOLOC C255/LTGM 3
MOLOC C305/LTGM 4
A30808-X3063-A403-2-7630 PROC:LTG – 17
CommissioningSystem
ITMN - OFFLINE
Fig. 3.6.16 Fuse Assignment for R:SN/MB/LTGM(Cable routing from below)
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
CD
MUT02
MUT03
MUT04
MUT05
MUT06
MUT07
MUT01
A
B
A
B
C
D
C
D
C
D
Fuse panel
FU
F:LTGM(A)
03
F:MB/CCG(B)
F:TSG(B) or F:SSG(B)
F:TSG(B) or F:SSG(B)
F:MB/CCG(B)
04
05
06
07
27
28
29
30
31
0 1 2 3 4
C
D F:LTGM(A)
0 1 2 3 4
MOLOC C101/LTGM 0
MOLOC C255/LTGM 3
MOLOC C203/LTGM 2
MOLOC C151/LTGM 1
MOLOC C305/LTGM 4
MOLOC C101/LTGM 0
MOLOC C151/LTGM 1
MOLOC C203/LTGM 2
MOLOC C255/LTGM 3
MOLOC C305/LTGM 4
PROC:LTG – 18 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
1 Check of System Voltage per Rack Row
Ensure that the main fuses are unscrewed before starting the check.
Measure system voltage for each rack row at the last frame
Note: the operational voltage is dependent upon the charging status of thebatteries.Tolerance range: -60 V (-54 V...-71 V)Tolerance range: -48 V (-45.6 V...-57 V)
Is system voltage -60V (-48V) present? Y h...3N h...2
2 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...1
3 Basic Test (Rack)
Check rack layout and issues against exchange-specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
4 Visual Check
Check of all cable ends at the distributing frame
Are the cables already on-hook at the distributing frame and/or the ports? Y h...6N h...5
5 Visual Check
Make sure that there are no short circuits between the single conductors.
If this is not possible (e.g. lack of materials) or when in doubt, disconnect thecables which lead to the central/main distribution frame at the wire-wrappingfield of the F:LTG
6 Set DIPFIX Switch
For setting the DIPFIX switch and solder strap ......MMN:LTGx -TAB
Set the DIPFIX switch and the solder strap for all M:DIUs and M:RGEs.
Comply with country-specific settings.
A30808-X3063-A403-2-7630 PROC:LTG – 19
CommissioningSystem
ITMN - OFFLINE
7 Preparation
Put the switches on all LTG-current converters down
8 Information about Fuse Assignments
For screwing in fuses and switching on the relevant DCCs refer to the fuseassignments shown in the following figures:
Fuse Assignment of R:LTGA: ...... (see Fig. 3.6.1)
Fuse Assignment of R:LTGB/LTGB:OSS: ...... (see Fig. 3.6.2)
Fuse Assignment of R:LTGC: ...... (see Fig. 3.6.3)
Fuse Assignment of R:LTGC/CR: ...... (see Fig. 3.6.4)
Fuse Assignment of R:LTGD: ...... (see Fig. 3.6.5)
Fuse Assignment of R:LTGF: ...... (see Fig. 3.6.6)
Fuse Assignment of R:LTGG: ...... (see Fig. 3.6.7)
Fuse Assignment of R:LTGG/OSS: ...... (see Fig. 3.6.8)
Fuse Assignment of R:SNB/LTGG (cable routing from above): ...... (see Fig. 3.6.9)
Fuse Assignment of R:SNB/LTGG (cable routing from below): ...... (see Fig. 3.6.10)
Fuse Assignment of R:LTGH: ...... (see Fig. 3.6.11)
Fuse Assignment of R:LTGM: ...... (see Fig. 3.6.12)
Fuse Assignment of R:SNB/LTGM (cable routing from above): ...... (see Fig. 3.6.13)
Fuse Assignment of R:SNB/LTGM (cable routing from below): ...... (see Fig. 3.6.14)
Fuse Assignment of R:SN/MB/LTGM (cable routing from above): ...... (see Fig. 3.6.15)
Fuse Assignment of R:SN/MB/LTGM (cable routing from below): ...... (see Fig. 3.6.16)
PROC:LTG – 20 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
9 Switch on Power Supply
Screw in only one fuse at a time and switch on the relevant current converter(In LTGM the module in the corresponding MOLOC).
Screw in the first/next fuse for the LTG which is to be switched on.
Caution: use only 10 A fuses
Switch on the according current converter(s)(In LTGM the module in the corresponding MOLOC:M:DIU120A or M:DIU:LDIM)
System reaction: green LED of current converter(s) lights up
10 Check LED
Is the green LED of the current converter(s) lit?(In LTGM the green LED of the corresponding module: M:DIU120A orM:DIU:LDIM) Y h...14
N h...11
11 Find Faulty Module
Possible causes of fault: Module short circuit, faulty current converter or mainfuse
Pull all corresponding modules individually under power (except DCC orM:DIU120A/M:DIU:LDIM), but leave them in position.
After each module is pulled the voltage should be checked again.
Could the fault be cleared by removing a certain module? Y h...13N h...12
12 Special Fault Clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...9
13 Replace Faulty Module
replace faulty module
plug in all modules h...10
14 Decision: Next Current Converter
are all current converters (or M:DIU120A/M:DIU:LDIM) for this LTG alreadyswitched on? Y h...15
N h...9
A30808-X3063-A403-2-7630 PROC:LTG – 21
CommissioningSystem
ITMN - OFFLINE
15 Decision: Next LTG
Are all LTGs already switched on? Y h...ENDN h...8
END
PROC:LTG – 22 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
A30808-X3063-A403-2-7630 PROC:DAS300 – 1
CommissioningSystem
ITMN - OFFLINE
3.7 Test Procedure for DAS 300
DAS 300 TEST
The DAS 300 is an OEM device which is not tested by Siemens. To make claims on thevendor’s warranty, if necessary, the device must be checked with the integrated testfunctions during installation testing.
Operation of the DAS 300:
• The menu options referred to in the procedure appear in the LCD display above thefunction keys F1 to F4.
• Menu options are selected by pressing the relevant function key.
3.7.1 Digital Announcement System DAS 300
Fig. 3.7.1 Digital announcement system DAS 300
F1 F2 F3 F4
0# *
87 9
54 6
21 3
LoudspeakerTape recorderinput
Cursor keysNumerical keypad
Headphonejack
Microphonejack
Function keys
LCD display, 2 lines of 40 characters Key switch
DAS 300
PROC:DAS300 – 2 A30808-X3063-A403-2-7630
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3.7.2 Digital Announcement System DAS 300 (Rear View)
Fig. 3.7.2 Digital announcement system DAS 300 (rear view)
CPU module
Power supply
120 Ω PCM connec-tions
PCMCPU
PCM module
SVA STV 48DC+5/+12/-12
+-
Power∆V1∆V2
LD1
LD2
RSTERRRST
ABT
A30808-X3063-A403-2-7630 PROC:DAS300 – 3
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1 Decision Block
Is the DAS 300 already in service? Y h...2N h...7
2 Identify the DIU Number
Refer to the exchange configuration documents to obtain the numbers of theLTG and DIU to which the DAS is connected.
3 Interrogate State of DIU
b STAT DIU:LTG=tsg-ltg,DIU=diu;
The command is repeated with the addition: EXEC'D
A list of the operating states of the interrogated units is output.
4 Decision Block
What is the operating state of the DIU?
– ACT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . h...5– MBL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . h...7– other. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . h...6
5 Configure the DIU to CBL
b CONF DIU :LTG=tsg-ltg,DIU=diu,OST=CBL;
The command is repeated with the addition: EXEC'D
Continue with the next block after 5 minutes at most. But if the CBL acknowl-edgement arrives within the 5 minutes, continue with the next block immedi-ately.
6 Configure the DIU to MBL
b CONF DIU :LTG=tsg-ltg,DIU=diu,OST=MBL;
The command is repeated with the addition: EXEC'D h...8
7 Switch on the DAS
When it is switched on, the DAS 300 should first go to the start menu. This canbe recognized by the texts OPT, MON and STA above the function keys.
– Switch on the DAS 300 using the key switch on the front.
– Wait for the start menu to appear (OPT above F1, MON above F2 and STAabove F3 in the LCD).
8 Select the Test Menu
– Press the key below menu option STA to select the status interrogationmenu.
– Press the key below menu option TEST to select the test menu.
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9 Enter Password
– Enter the test password (default ex-factory code ’1357902468’).
– Confirm with the # key.
10 Select System Test
Press the key below menu option SYS to select the system test menu.
11 Evaluation of Test Results
If the test was completed without error, the tested unit appears in the displaywith the addition O.K..
12 Perform CPU Test
Press the key below menu option CPU to start the CPU test.
Is the tested unit OK? Y h...13N h...26
13 Perform CRC Test
Press the key below menu option CRC to check the fixed texts.
Is the tested unit OK? Y h...14N h...26
14 Perform RAM Test
Press the key below menu option RAM to start the RAM test.
Is the tested unit OK? Y h...15N h...26
15 Select PCM Test
– Press the * key to return to the test start menu.
– Press the key below menu option PCM to select the PCM test menu.
16 Perform SYN Test
Press the key below menu option SYN to test the synchronization of the PCMinterface.
Is the tested unit OK? Y h...17N h...26
17 Perform TSx Test
Press the key below menu option TSx to test PCM time slots.
Is the tested unit OK? Y h...18N h...26
A30808-X3063-A403-2-7630 PROC:DAS300 – 5
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18 Perform SIG Test
Press the key below menu option SIG to test the signaling in PCM time slot 16.
Is the tested unit OK? Y h...19N h...26
19 Select Interface Test
– Press the * key to return to the test start menu.
– Press the key below menu option IF to select the interface test menu.
20 Perform RS1 Test
Press the key below menu option RS1 to test processor interface 1.
21 Decision Block
The processor interfaces can only be tested in the DAS 300 FLASH version.If the unit under test is a DAS 300 with EPROM, it does not have any processorinterfaces. The displayed result states that the interface test is ’not available’.
Is the unit under test a DAS 300 with EPROM? (test not possible?) Y h...25N h...22
22 Decision Block
Is the tested unit OK? Y h...23N h...26
23 Perform RS2 Test
Press the key below menu option RS2 to test processor interface 2.
Is the tested unit OK? Y h...24N h...26
24 Identify DIU Number
Refer to the exchange configuration documents to obtain the numbers of theLTG and DIU to which the DAS is connected.
25 Configure DIU to ACT
b CONF DIU :LTG=tsg-ltg,DIU=diu,OST=ACT;
The command is repeated with the addition EXEC'D
End of DAS 300 test
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26 Replace DAS 300
The DAS 300 is faulty. Replace the DAS 300 and send back the faulty device inits original packing materials.
End of DAS 300 test
END
A30808-X3063-A403-2-7630 PROC:DSU – 1
CommissioningSystem
ITMN - OFFLINE
3.8 Off-line Installation of Data Service Unit
DSU
3.8.1 Documents
The following Documents are required as references
– Maintenance Manual MMN:DSU
– AKUHW Lists
3.8.2 General
The DSU is based on the concept of the DLU. It provides interworking functions (IWF)for data exchange with different external telecommunication networks.The IWF is implemented in the interworking equipment (IWE). The IWE consists of oneIWE module and one IWES module which replace two SLM modules of the DLU.
The DSU is called DLU in the following procedure because the term DLU continues tobe used in fault reports and diagnostic results.
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3.8.3 Rack Layout
3.8.3.1 Rack Layout R:DSU (A-B-B-Modem) / (Fuse Assignment R:DSU)
Fig. 3.8.1 R:DSU, Configuration A-B-B-Modem
Shelf 0
Shelf 2
Shelf 4
CD
Fuse panel
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01 MOLOC A001, A058, A119
FU
MUT02
MUT03
MUT05
MUT06
MUT01
MOLOC A010-052, A089-11305
11 MOLOC C001, C058,C119
MOLOC C010-052, C089-11315
02 MOLOC A00, A119
MOLOC A010-052, A071-11306
12 MOLOC C001, C119
MOLOC C010-052, C071-11316
03 MOLOC A001, A119
MOLOC A010-052, A071-11307
13 MOLOC C001, C119
MOLOC C010-052, C071-11317
04
14
Shelf 1
Shelf 3
Shelf 5
F:DLU(A)
F:DLU(B)
F:DLU(B)
to PSU
to PSU
Modem
Modem
A30808-X3063-A403-2-7630 PROC:DSU – 3
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3.8.4 Equipment List
F:DLU(A), F:DLU(B) and F:DLU(C)
Basic frame F:DLU(A) Shelf 0, 1 Ext. frame F:DLU(B) Shelf 2...7
Mountinglocation
Module type Mountinglocation
Module type
Standard Variant Standard Variant
A001 M:DCCx A001 M:DCCx
A010 M:IWEx A010 M:IWEx
A016 M:IWESx 1) A016 M:IWESx 1)
A022 M:IWEx A022 M:IWEx
A028 M:IWESx 1) A028 M:IWESx 1)
A034 M:IWEx A034 M:IWEx
A040 M:IWESx 1) A040 M:IWESx 1)
A046 M:IWEx A046 M:IWEx
A052 M:IWESx 1) A052 M:IWESx 1)
A058 empty A058 M:BDE
A065 M:BDB A065 M:BDE
A071 M:BDCG A071 M:IWEx
A077 M:DLUC A077 M:IWESx 1)
A083 M:DIUD M:LDID A083 M:IWEx
A089 empty A089 M:IWESx 1)
A095 M:IWEx A095 M:IWEx
A101 M:IWESx 1) A101 M:IWESx 1)
A107 M:IWEx A107 M:IWEx
A113 M:IWESx 1) M:ALEX 2) A113 M:IWESx 1)
A119 M:DCCx A119 M:DCCx
C001 M:DCCx C001 M:DCCx
C010 M:IWEx C010 M:IWEx
C016 M:IWESx 1) C016 M:IWESx 1)
C022 M:IWEx C022 M:IWEx
C028 M:IWESx 1) C028 M:IWESx 1)
C034 M:IWEx C034 M:IWEx
C040 M:IWESx 1) C040 M:IWESx 1)
C046 M:IWEx C046 M:IWEx
C052 M:IWESx 1) C052 M:IWESx 1)
C058 empty C058 M:BDE
C065 M:BDB C065 M:BDE
C071 M:BDCG C071 M:IWEx
Tab. 3.8.1 Equipment list
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The equipment complement of F:DLU(C) is the same as for F:DLU(B), but it onlyoccupies mounting location row A.
3.8.5 Mounting Location List
F:DLU(A), F:DLU(B) and F:DLU(C)
C077 M:DLUC C077 M:IWESx 1)
C083 M:DIUD M:LDID C083 M:IWEx
C089 empty C089 M:IWESx 1)
C095 M:IWEx C095 M:IWEx
C101 M:IWESx 1) C101 M:IWESx 1)
C107 empty C107 M:IWEx
C113 empty C113 M:IWESx 1)
C119 M:DCCx C119 M:DCCx
Moduletype
Address Mountinglocation
Basic frameShelf 0, 1
Ext. frame 0Shelf 2, 3
Ext. frame 1Shelf 4, 5
Ext. frame 2Shelf 6, 7
M:ALEX 0 - 15 A113
M:BDB 0 - A065
1 - C065
M:BDCG 0 - 8 A071
1 - 8 C071
M:BDE 2 - 4 - 6 - A058
2 - 4 - 6 - A065
3 - 5 - 7 - C058
3 - 5 - 7 - C065
M:DCCx 0 - 0 2 - 0 4 - 0 6 - 0 A001
0 - 1 2 - 1 4 - 1 6 - 1 A119
1 - 0 3 - 0 5 - 0 7 - 0 C001
1 - 1 3 - 1 5 - 1 7 - 1 C119
M:DIUD 0 - 10 A083
1 - 10 C083
M:LDID 0 - 10 A083
1 - 10 C083
Tab. 3.8.2 Mounting location list
Basic frame F:DLU(A) Shelf 0, 1 Ext. frame F:DLU(B) Shelf 2...7
Mountinglocation
Module type Mountinglocation
Module type
Standard Variant Standard Variant
Tab. 3.8.1 Equipment list
A30808-X3063-A403-2-7630 PROC:DSU – 5
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The mounting location list for the expansion frame F:DLU(C) is the same as forF:DLU(B), but only mounting location row A.
M:DLUC 0 - 9 A077
1 - 9 C077
M:IWEx 0 - 0 2 - 0 4 - 0 6 - 0 A010
M:IWEx 1 - 0 3 - 0 5 - 0 7 - 0 C010
M:IWESx 0 - 1 2 - 1 4 - 1 6 - 1 A016
M:IWESx 1 - 1 3 - 1 5 - 1 7 - 1 C016
M:IWEx 0 - 2 2 - 2 4 - 2 6 - 2 A022
M:IWEx 1 - 2 3 - 2 5 - 2 7 - 2 C022
M:IWESx 0 - 3 2 - 3 4 - 3 6 - 3 A028
M:IWESx 1 - 3 3 - 3 5 - 3 7 - 3 C028
M:IWEx 0 - 4 2 - 4 4 - 4 6 - 4 A034
M:IWEx 1 - 4 3 - 4 5 - 4 7 - 4 C034
M:IWESx 0 - 5 2 - 5 4 - 5 6 - 5 A040
M:IWESx 1 - 5 3 - 5 5 - 5 7 - 5 C040
M:IWEx 0 - 6 2 - 6 4 - 6 6 - 6 A046
M:IWEx 1 - 6 3 - 6 5 - 6 7 - 6 C046
M:IWESx 0 - 7 2 - 7 4 - 7 6 - 7 A052
M:IWESx 1 - 7 3 - 7 5 - 7 7 - 7 C052
M:IWEx 2 - 8 4 - 8 6 - 8 A071
M:IWEx 3 - 8 5 - 8 7 - 8 C071
M:IWESx 2 - 9 4 - 9 6 - 9 A077
M:IWESx 3 - 9 5 - 9 7 - 9 C077
M:IWEx 2 - 10 4 - 10 6 - 10 A083
M:IWEx 3 - 10 5 - 10 7 - 10 C083
M:IWESx 2 - 11 4 - 11 6 - 11 A089
M:IWESx 3 - 11 5 - 11 7 - 11 C089
M:IWEx 0 - 12 2 - 12 4 - 12 6 - 12 A095
M:IWEx 1 - 12 3 - 12 5 - 12 7 - 12 C095
M:IWESx 0 - 13 2 - 13 4 - 13 6 - 13 A101
M:IWESx 1 - 13 3 - 13 5 - 13 7 - 13 C101
M:IWEx 0 - 14 2 - 14 4 - 14 6 - 14 A107
M:IWEx 3 - 14 5 - 14 7 - 14 C107
M:IWESx 0 - 15 2 - 15 4 - 15 6 - 15 A113
M:IWESx 3 - 15 5 - 15 7 - 15 C113
Moduletype
Address Mountinglocation
Basic frameShelf 0, 1
Ext. frame 0Shelf 2, 3
Ext. frame 1Shelf 4, 5
Ext. frame 2Shelf 6, 7
Tab. 3.8.2 Mounting location list
PROC:DSU – 6 A30808-X3063-A403-2-7630
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3.8.6 Connection of DLU to two LTG
Fig. 3.8.2 Connection of DLU to two LTG
DIUDLU0
PDC0
DLU
PDC1
DIUDLU1
PDC0
PDC1
DIUDLU0
PDC0
DLU
PDC1
DIUDLU1
PDC0
PDC1
LTUU21 S
ILCLTU
U21
LTUU20
LTUU20
LTUU21 S
ILCLTU
U21
LTUU20
LTUU20
LTGx
LTGy
A30808-X3063-A403-2-7630 PROC:DSU – 7
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The diagram above shows the connection of the DLU to two LTGs. One DLU system isconnected to the LTGx and the other to the LTGy. The dotted lines represent the linkswithout CCS.
3.8.7 Wiring between DIU:DLU and LTU
Fig. 3.8.3 Wiring between DIU:DLU and LTU
F2in.....F1ou49
50F2ou F1in.....F2ou F2in
49
50
F2ou.....F1in51
52F2in F1ou.....F2in F2ou
51
52
F2in.....F1ou49
50F2ou F1in.....F2ou F2in
49
50
F2ou.....F1in51
52F2in F1ou.....F2in F2ou
51
52
PDC0
PDC1
Pin No.
Pin No.
Pin No.
Pin No.
LTU/U21
LTU/U20
DIU:DLU LE LE DIU30A
PROC:DSU – 8 A30808-X3063-A403-2-7630
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3.8.8 Connection path from DLU to LTE
Fig. 3.8.4 Connection path from DLU to LTE
DIUDLU0
PDC0
DLU
PDC1
F2in F1ouLTE
F2ou F1in
F2in F1ouLTE
F2ou F1in
PCM 30 with CCS
PCM 30 without CCS
To/from LTGx
To/from LTGx
DIUDLU1
PDC0
PDC1
F2in F1ouLTE
F2ou F1in
F2in F1ouLTE
F2ou F1in
PCM 30 with CCS
PCM 30 without CCS
To/from LTGy
To/from LTGy
A30808-X3063-A403-2-7630 PROC:DSU – 9
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3.8.9 Connection path from LTG to LTE
Fig. 3.8.5 Connection path from LTG to LTE
F1inLTE
F2ouF1ou
LTE
PCM 30 with CCS
PCM 30 without CCS
To/from DLU
To/from DLU
F2in
F1in F2ouF1ou F2in
LTUU21
SILC
LTGx
F1inLTE
F2ouF1ou
LTE
PCM 30 with CCS
PCM 30 without CCS
To/from DLU
To/from DLU
F2in
F1in F2ouF1ou F2in
LTUU21
SILC
LTGy
LTUU20
LTUU20
PROC:DSU – 10 A30808-X3063-A403-2-7630
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1 Check of system voltage per rack row
Ensure that the main fuses are unscrewed before starting the check
Measure the system voltage for each rack row at the last frame
The operational voltage is dependent upon the charging status of the batteries:
Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6V ... -57V)
Is system voltage -60V (-48V) present? Y h...3N h...2
2 Special fault clearance
Carry out special fault clearance
– After finishing special fault clearance h...1
3 Basic test (rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
4 Check switch settings
Check modules for correct positioning of straps and switch settings ......MMN:DSU,TAB, MOD
5 Information block
6 Switch on exchange voltage (R:DSU)
The assignment of fuses to the individual modules is given in ......(see 3.8.3)
Switch off all DCCxx and RGMG of the first/ next R:DSU
Unscrew all fuses in this R:DSU h...7
!CAUTION:Areas on the wrap fields with pins for ringing or system voltage (e.g. SLM modules or DCCs) may beequipped with protection caps. The protection caps protect the operating personnel from touching the pinswith ringing or system voltage and must not be removed.
A30808-X3063-A403-2-7630 PROC:DSU – 11
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7 Information about DCCxx
If a DCCDB (A001, A119) is installed instead of the DCCCR, there is no needfor the DCCCV or DCCDD (A010). The DCCDB provides all the voltages thatwere otherwise provided by the DCCCR and DCCCV/DCCDD. If a DCCDC(A001) is used, there is also no need for the voltage of 93 V.
8 Screw in fuses
The assignment of fuses to the individual modules is given in ...... (see 3.8.3)
Screw in the fuse assigned to the DCCs in the first / next shelf
9 Switch on left-hand DCCxx
Switch on the left-hand DCCxx (MOLOC A001/C001)
Is the green LED on the faceplate of the DCCxx lit? Y h...12N h...10
10 Replace defective DCCxx
Switch off defective DCCxx
Unscrew relevant fuse
Switch off spare module
Replace defective DCCxx by spare module
Screw in relevant fuse
Switch on DCCxx
Is the green LED on the faceplate of the DCCxx lit? Y h...12N h...11
11 Special fault clearance
Note:If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective
Carry out special fault clearance
– Repeat testing after successful fault clearance h...9
12 Switch on right-hand DCCxx
Switch on the right-hand DCCxx (MOLOC A119/C119)
Is the green LED on the faceplate of the DCCxx lit? Y h...15N h...13
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13 Replace defective DCCxx
Switch off defective DCCxx
Unscrew relevant fuse
Switch off spare module
Replace defective DCCxx by spare module
Screw in relevant fuse
Switch on DCCxx
Is the green LED on the faceplate of the DCCxx lit? Y h...15N h...14
14 Special fault clearance
Note:If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective
Carry out special fault clearance
– Repeat testing after successful fault clearance h...12
15 Decision: DCCDV/DCCDD
Is there a DCCDV or DCCDD in the shelf? Y h...16N h...19
16 Switch on DCCDV/DCCDD
Switch on DCCDV/DCCDD (MOLOC A010/ C010)
Is the green LED on the faceplate of the DCCDV/DCCDD lit? Y h...19N h...17
17 Replace defective DCCDV/DCCDD
Switch off defective DCCDV/DCCDD
Unscrew relevant fuse
Switch off spare module
Replace defective DCCDV/DCCDD by spare module
Screw in relevant fuse
Switch on DCCDV/DCCDD
Is the green LED on the faceplate of the DCCDV/DCCDD lit? Y h...19N h...18
A30808-X3063-A403-2-7630 PROC:DSU – 13
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18 Special fault clearance
Note:If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective
Carry out special fault clearance
– Repeat testing after successful fault clearance h...16
19 Next shelf?
Are all DCCs in all shelves switched on? Y h...20N h...8
20 Information about connection path test
The connection of the DLU to LTG is shown in:(LTGs used are LTGB, LTGG, LTGM) ...... (see Fig. 3.8.2)
When the DLU and LTG are connected, care must be taken to ensure 1:1wiring. This means that F2out of DIU:DLU0 goes via pins 49 and 50, just as F2inof LTU:U21. ...... (see Fig. 3.8.3)
21 Information about connection path from DLU to LTE
Because the DLU and the start of the PCM link may be located apart, specialprecautions must be taken to ensure that the cabling between DIU:DLU andLTE (line terminating equipment / loading equipment) is correct. If it is, the corre-sponding PCM link simply needs to be connected to the LTE. If then no connec-tion can be established between DLU and LTG, the PCM link is interrupted.
The connection of DLU to LTE is shown in ...... (see Fig. 3.8.4)
22 Establish connection DIU:DLU to LTE
The connection first has to be established for DIU:DLU0 and than for DIU:DLU1
23 Establish test loop for PDC0
Link up the outgoing cable with CCS (PDC0) from the DIU:DLU0 (DIU:DLU1) tothe LTE which is to be connected with the LTE of LTGx (LTGy).
Red LED F2 on LTE goes out
Link F1out to F1in at the output of the LTE
Did the red LEDs MA0 and SA0 on the DIU:DLU0 (DIU:DLU1) go out? Y h...25N h...24
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24 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU:DLU0 (DIU:DLU1)module.
25 Connect PDC0 to the link
Open the loop and connect the PDC0 to the link
26 Establish test loop for PDC1
Link up the outgoing cable without CCS (PDC1) from the DIU:DLU0 (DIU:DLU1)to the LTE which is to be connected with the LTE of LTGx (LTGy).
Red LED F2 on the LTE goes out
Link F1out to F1in at the output of the LTE
Did the red LEDs MA1 and SA1 on the DIU:DLU0 (DIU:DLU1) go out? Y h...29N h...27
27 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU:DLU0 (DIU:DLU1) module.
28 Connect PDC1 to the link
Open the loop and connect the PDC1 to the link
29 Decision: next DLU system
Note that DLU system 1 is connected to another LTG as shown in ......(see Fig. 3.8.2)
Has DLU system 1 already been checked? Y h...30N h...23
30 Information about connection LTG to LTE
The connection first has to be established for LTGx (to DLU system 0) and thanfor LTGy (to DLU system 1).
The connection of LTG to LTE is shown in ......(see Fig. 3.8.5)
A30808-X3063-A403-2-7630 PROC:DSU – 15
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31 Establish test loop for cable with CCS
Link the outgoing cable with CCS from the LTU:U21 of LTGx (LTGy) to the LTEwhich is to be connected to the LTE of DLU system 0 (DLU system 1), if notalready done.
Red LED F2 on LTE goes out
Link F1out at the output of the LTE to F1in
Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...33N h...32
32 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU module in question.
33 Connect LTU:U21 to the link
Open the loop and connect the LTU:U21 to the link
34 Establish test loop for cable without CCS
Link the outgoing cable without CCS from the LTU:U20 of LTGx (LTGy) to theLTE which is to be connected to the LTE of DLU system 0 (DLU system 1), if notalready done.
Red LED F2 goes out
Link F1out to F1in at the output of the LTE
Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...36N h...35
35 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU module in question.
36 Connect LTU:U20 to the link
Open the loop and connect the LTU:U20 to the link
37 Decision: test DLU-system 1
Has the connection of LTGy to DLU system 1 already been checked? Y h...38N h...31
38 Decision: F:Modem
Are there F:Modem installed in the current R:DSU? Y h...PROC:MODEM
N h...39
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39 Decision: next R:DSU
Have all R:DSU of the NE already been switched on? Y h...40N h...6
40 Decision: R:Modem
– Repeat the following procedure until all R:Modem of the NE are put intoservice h...PROC:
MODEM
– If no R:Modem is installed in the NE or all R:Modem have already been putinto service, continue: h...END
END
A30808-X3063-A403-2-7630 PROC:MODEM – 1
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3.9 Off-line Installation of modems for 3.1 kHzaudio bearer services
MODEM
3.9.1 Rack Layouts
3.9.1.1 Rack Layout R:DSU (A-B-B-Modem) / (Fuse Assignment forModems)
PROC:MODEM – 2 A30808-X3063-A403-2-7630
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Fig. 3.9.1 R:DSU, Configuration A-B-B-Modem
Shelf 0
Shelf 2
Shelf 4
CD
Fuse panel
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
01
FU
MUT02
MUT03
MUT05
MUT06
MUT01
05
11
15
12
16
03
07
13
17
04
14
Shelf 1
Shelf 3
Shelf 5
F:DLU(A)
F:DLU(B)
F:DLU(B)
to PSU
to PSU
Modem
Modem
02
06
A30808-X3063-A403-2-7630 PROC:MODEM – 3
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3.9.1.2 Rack Layout R:Modem / (Fuse Assignment for Modems)
Fig. 3.9.2 R:Modem
Fuse panel
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
FU
03 to PSU
01 to PSU
to PSU02
Modem
06 to PSU
04 to PSU
to PSU05
Modem
Modem
Modem
Modem
Modem
not equipped
not equipped
PROC:MODEM – 4 A30808-X3063-A403-2-7630
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3.9.2 Modem Frame Layouts
Two different types of modems for 3.1 kHz audio bearer services can be used in theDSU:
– GPT modem
– NEUHAUS modem
According to the type of modem it is possible to place 12 (NEUHAUS) or 14 (GPT)modems into one frame F:Modem.All modems in a frame are supplied by one power supply unit (PSU). It is not possibleto mix both types of modems in one frame, because they are fed by different types ofPSUs.The modem frames F:Modem can be located in the Mounting Units 06 and 07 of theR:DSU and/or in a separate rack R:Modem.
3.9.2.1 Frame F:Modem (GPT)
Fig. 3.9.3 Frame F:Modem (GPT)
Modem frame (Type GPT)
PSU
1413121110987654321
A30808-X3063-A403-2-7630 PROC:MODEM – 5
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3.9.2.2 Frame F:Modem (NEUHAUS)
Fig. 3.9.4 Frame F:Modem (NEUHAUS)
1 Prepare modem frames
Unscrew the fuses of all modem frames F:Modem of the current rack, if notalready done
The fuse assignment for the modem frames is shown in: ......3.9.1
2 Switch on PSU
Unplug all modems in the first/next F:Modem but leave in position
Plug in the PSU of this F:Modem
Screw in the fuse for this F:Modem
Check if PSU is working:
• On PSU for GPT: Green LED “Mains in” and red LED “PWR Monitor” mustlight up
• On PSU for NEUHAUS: All 3 Green LEDs must light up
Is the PSU working? Y h...5N h...3
Modem frame (Type NEUHAUS)
PSU
121110987654321
PROC:MODEM – 6 A30808-X3063-A403-2-7630
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3 Replace PSU
Unscrew the corresponding fuse
Replace the PSU by spare module of the same PSU type
Screw in the corresponding fuse
Check if PSU is working:
• On PSU for GPT: Green LED “Mains in” and red LED “PWR Monitor” mustlight up
• On PSU for NEUHAUS: All 3 Green LEDs must light up
Is the PSU working? Y h...5N h...4
4 Special fault clearance
Carry out special fault clearance
– Repeat testing after successful fault clearance h...2
5 Plug in modems
Plug in the first/next modem of the frame where the PSU has been switched on
Is the modem working? (Red LED for Power must light up) Y h...8N h...6
6 Replace modem
Replace the modem by spare module of the same modem type
Is the modem working? (Red LED for Power must light up) Y h...8N h...7
7 Special fault clearance
Carry out special fault clearance
– Repeat testing after successful fault clearance h...5
8 Decision: next modem
Have all modems of the frame already been plugged in Y h...9N h...5
9 Decision: next F:Modem
Have all modem frames of the current rack already been put into service? Y h...10N h...2
10 Return blockReturn to calling procedure
END
A30808-X3063-A403-2-7630 PROC:DLUB – 1
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ITMN - OFFLINE
3.10 Off-line Installation of Digital Line Unit(Frames D / E / F)
DLUB
3.10.1 Documents
The following Documents are required as references
– Maintenance Manual MMN:DLUB
– AKUHW Lists
PROC:DLUB – 2 A30808-X3063-A403-2-7630
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3.10.2 Fuse Assignments
3.10.2.1 Fuse Assignment R:DLUB (D-E-D-E)
Fig. 3.10.1 Sicherungszuordnung R:DLUB (D-E-D-E)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
Shelf 0
Fuse panel
MUT02
MUT03
MUT01
01
MGB
04
03
A001-057 02A068-121
05
06
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(D)
Shelf 2
12
11
10
13
14
C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)
Shelf 0MUT05
21
20
A001-057 19A068-121
22
23
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(D)
07
18
A001,A015-033
08 A008,A039-057
09A116,A068-086
A123,A092-110
Shelf 2
27
30
31
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E) A116,A068-086
A123,A092-110
29
28 C001,C015-033
C008,C039-057
A001,A015-033
25 A008,A039-057
24 26
CD
MUT06
FU
BD2
BD2
BD3
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
RGB
RGB
RGB
RGB
MGB
BD3
* 057 Only if MGB is inserted.Note: If only one DCC is used per halfshelf, the DCC Pos shf-1 and shf-3 are omitted as well as the accordingfuses.
A30808-X3063-A403-2-7630 PROC:DLUB – 3
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3.10.2.2 Fuse Assignment R:DLUB (D-E-D-D)
Fig. 3.10.2 Sicherungszuordnung R:DLUB (D-E-D-D)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
Shelf 0
Fuse panel
MUT02
MUT03
MUT01
01
04
03
A001-057 02A068-121
05
06
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(D)
Shelf 2
12
11
10
13
14
C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)
Shelf 0MUT05
21
20
A001-057 19A068-121
22
23
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(D)
07
18
A001,A015-033
08 A008,A039-057
09A116,A068-086
A123,A092-110
CD
Shelf 2MUT06
29
28
A001-057 26A068-121
30
31
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(D)
24
FU
BD2
BD3
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
RGB
RGB
RGB
RGB
RGB
RGB
MGB
MGB
MGB
* 057 Only if MGB is inserted.Note: If only one DCC is used per halfshelf, the DCC Pos shf-1 and shf-3 are omitted as well as the according
PROC:DLUB – 4 A30808-X3063-A403-2-7630
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3.10.2.3 Fuse Assignment Rack R:DLUB (D-E-D-F)
Fig. 3.10.3 Sicherungszuordnung R:DLUB (D-E-D-F)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
Shelf 0
Fuse panel
MUT02
MUT03
MUT01
01
MGB
04
03
A001-057 02A068-121
05
06
C001,C015-033
C008,C039-057*
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(D)
Shelf 2
12
11
10
13
14
C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)
Shelf 0MUT05
21
20
A001-057 19A068-121
22
23
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(D)
07
18
A001,A015-033
08 A008,A039-057
09A116,A068-086
A123,A092-110
Shelf 2
27
A116,A074-92
A123,A098-110
A001,A015-033
25 A008,A039-057
24 26
CD
FU
F:DLU(F)
BD2
BD3
BD2
BD3
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
RGB
RGB
RGB
RGB
MGB
* 057 Only if MGB is inserted.Note: If only one DCC is used per halfshelf, the DCC Pos shf-1 and shf-3 are omitted as well as the according
A30808-X3063-A403-2-7630 PROC:DLUB – 5
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3.10.3 Equipment of the different frames
Detailed information about the equipment of the different frames are listed in the equip-ment list and the mounting location list of the MMN:DLUB, APP.
3.10.4 Shelter DLU 400/700
The shelter can contain the following equipment:
• Remote Shelter DLU 400 (Fig. 3.10.4)Basic frame D for DLUB (F:DLU(D)) with a max. of 384 subscribers or basic frameG for DLUD (F:DLU(G)) with a max. of 448 subscribers
• Remote Shelter DLU 700 (Fig. 3.10.5)Basic frame F:DLU(D)) or F:DLU(G)) and also extension frame F for DLUB(F:DLU(F)) with a max. of 240 subscribers
• Transmission equipment for the shelter (optional)The following transmission equipment is provided in the shelter for connection to thenetwork node or for the connection of additional shelters (ring or star configuration):
– Transmission technology in the synchronous digital hierarchy (SDH)SDH: synchronous multiplexers (SMA1/4) or, alternatively,synchronous dual terminal multiplexers (STM1D)
– Transmission technology in the plesiochronous digital hierarchy (PDH)PDH technology in the shelter:Optical/HDSL terminal multiplexer for 2 Mbit/s (OMX2/HMX)Optical terminal multiplexer for 34 Mbit/s (OMX16)
(PDH technology can also be integrated in the DLU hardware)
PROC:DLUB – 6 A30808-X3063-A403-2-7630
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• MDF/ DDF distribution frame
• Air conditioning (fan and heater)
• Power supply unit, including standby battery
• Cable TV
• Modem for OFDC (optional)
3.10.4.1 Overview Shelter 400/700
Fig. 3.10.4 Configuration of ’Remote Shelter DLU 400’
MDF200 DA internal
MDF200 DA internal
MDF200 DA external
MDF200 DA external
MDF200 DA external
Mains access (MAP)orlightning overvoltageprotection (LOP)
SMA 1/4 or SMT1D(SDH)
1600
mm
1800 mm500 mm
Front viewSide view (left)
Fan
Basic frame D(F:DLU(D)) or G
(F:DLU(G))
Connector panel
Fan
OMX2/HMX or OMX16(PDH)
Connector panel
AC/DC converter (48 V/30 A)
Cable TV
SIEMENS
Heater 1600 W
DDF24 PCM30
DDF24 PCM30
DC distribution
AC distribution
Battery
(Connection foremergency power supply)
OFDC modem
A30808-X3063-A403-2-7630 PROC:DLUB – 7
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Fig. 3.10.5 Configuration of ’Remote Shelter DLU 700’
3.10.4.2 Fuse Assignment PPD (Primary power distribution)
Sicherungen gesicherte Einheit
F1 25 A AC Power supply(Fehlerstromschutzschalter)
F2 16 A Rectifier 1
F3 16 A Rectifier 2 (optional)
F4 10 A Heater
F5 10 A Cabel TV (optional)
Tab. 3.10.1 Assignment of primary fuses
Mains access (MAP)orlightning overvoltageprotection (LOP)
Heater 1600 W
AC/DCconverter(48 V/30 A)
MDF200 DA external
Basic frame D(F:DLU(D)) or G
(F:DLU(G))
Extension frame F(F:DLU(F))
SMA 1/4 or SMT1D(SDH)
1800
mm
1800 mm500 mm
Front viewSide view (left)
Fan
Connecting panel
Fan
OMX2/HMX or OMX16(PDH)
Connecting panel
DC distribution
AC distribution
Cable TV
SIEMENS
MDF200 DA external
MDF200 DA external
MDF200 DA internal
MDF200 DA internal
MDF200 DA internal
MDF200 DA external
DDF24 PCM30
DDF24 PCM30
DDF24 PCM30
104 DAinternal
(Connection for emer-gency power supply)
Battery
OFDC modem
MDF200 DA external
PROC:DLUB – 8 A30808-X3063-A403-2-7630
ITMN - OFFLINE CommissioningSystem
3.10.4.3 Fuse Assignment SPD (Secondary power distribution)
Caution:The fuse cover must not be removed by the maintenance. personnel. If maintenancework on the fuses is necessary, this can only be carried out by trained specialists. Beforethe fuse cover is removed the 220 V AC line voltage must be switched off.
F6 10 A Socket (for OFDC-Modem)
Fuses Unit
F1 10 A DLU Shelf 0 (System side 1)
F2 10 A DLU Shelf 1 (System side 1)
F3 10 A DLU Shelf 1 (System side 0)
F4 10 A DLU Shelf 0 (System side 0)
F5 10 A Transmission equipment (SDH)orRadio equipment SRA L1/SRA L2
F6 10 A not used
F7 10 A Transmission equipment (PDH)orRadio equipment SRA L1/SRA L2
F8 10 A Shelter DLU 400: not usedbzw.Shelter DLU 700: Shelf 2 (System side 1)
F9 10 A Fan 2
F10 10 A Fan 1
F11 10 A Monitoring and heater control
F12 10 A Shelter DLU 400: not usedbzw.Shelter DLU 700: Shelf 2 (System side 0)
F13 50 A Battery
Tab. 3.10.2 Assignment of secondary fuses
Sicherungen gesicherte Einheit
Tab. 3.10.1 Assignment of primary fuses
A30808-X3063-A403-2-7630 PROC:DLUB – 9
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3.10.5 Remote DLU
3.10.5.1 Connection of a remote DLU to two LTG
Fig. 3.10.6 Connection of DLUB to two LTG
The diagram above shows the connection of the DLUB to two LTGs. One DLUB systemis connected to the LTGx and the other to the LTGy. The dotted lines represent the linkswithout CCS.
PDC0
PDC1
LTUU21
LTUU21
PDC0
PDC0
PDC0
PDC1
PDC1
PDC1
DLU
DLU
LTUU20
LTUU20
LTUU21
LTUU21
LTUU20
LTUU20
LTGx
LTGy
SILC
SILC
DIUDLU0
DIUDLU1
DIUDLU0
DIUDLU1
A2 051
B2 051
A2 074
B2 074
Plug position
A2 051
B2 051
A2 074
B2 074
PROC:DLUB – 10 A30808-X3063-A403-2-7630
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3.10.5.2 Wiring between DIU:DLU and LTU
Fig. 3.10.7 Wiring between DIU:DLU and LTU (DIU120A)
(*): The pin numbers refer to the first of four PDC connectors of the DIU120A. An over-view of all pin numbers is shown in the following table:
PDC(0) PDC(1) PDC(2) PDC(3)
Sym Koax Sym Koax Sym Koax Sym Koax
E132 E132 E142 E142 E152 E152 E212 E212
E134 C134 E144 C144 E154 C154 E214 C214
E136 E136 E146 E146 E156 E156 E216 E216
E138 C136 E148 C146 E158 C156 E218 C216
Tab. 3.10.3 Pin numbers for PCM30 connectors of DIU120A
F1in...F2outF2in...F1out
F2in
F2out49
50
51
52
F2out...F1in F1out...F2in
F1in...F2outF2in...F1out
F2in
F2out
F2out...F1in F1out...F2in
F2out
F2in
F2out
F2in
PDC0
Pin No. (Plug pin)
PDC1
LTU/U21
LTU/U20
DIU:DLU
LE LE
DIU120A
Sym. Koax.
49
29
51
31
49
50
51
52
49
29
51
31
E132
E134
E136
E138
Pin No.(*)
Sym. Koax.
E132
C134
E136
C136
E132
E134
E136
E138
E132
C134
E136
C136
A30808-X3063-A403-2-7630 PROC:DLUB – 11
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Fig. 3.10.8 Numbering method on F:LTGM
row C(mounting area 1)
SU1
SU4
SU5
SU2
SU3
SU1
SU4
SU2
SU3
row D(mounting area 2)
ABCDE
1
9
5
Pin E 2 1 2 2
0 (no pins available)
PDC1
PDC2
Pin E 2 1 4
Pin E 2 1 6
Pin E 2 1 8
Pins for PDC3 (sym.)
101
F:LTGM(A) Rearview
151203255305
PDC0
DIU120A MOLOCS:
PROC:DLUB – 12 A30808-X3063-A403-2-7630
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Fig. 3.10.9 Wiring between DIU:DLU and LTU (DIU30D)
3.10.5.3 Connection path from DLUB to LTE
Fig. 3.10.10 Connection path from DLUB to LTE
F1in...F2outF2in...F1out
F2in
F2out49
50
51
52
F2out...F1in F1out...F2in
F1in...F2outF2in...F1out
F2in
F2out
F2out...F1in F1out...F2in
F2out
F2in
F2out
F2in
PDC0
Pin No. (Plug pin)
PDC1
LTU/U21
LTU/U20
DIU:DLU
LE LE
DIU30D
Sym. Koax.
49
29
51
31
49
50
51
52
49
29
51
31
49
50
51
52
Pin No. (Plug pin)
Sym. Koax.
49
29
51
31
49
50
51
52
49
29
51
31
PDC0
PDC0
PDC1
PDC1
DLU
PCM 30 with CCS
PCM 30 without CCS
F2in
F2out F1in
F1outLTE
F2in
F2out F1in
F1outLTE
PCM 30 with CCS
PCM 30 without CCS
F2in
F2out F1in
F1outLTE
F2in
F2out F1in
F1outLTE
to/from LTGx
to/from LTGx
to/from LTGy
to/from LTGy
DIUDLU0
DIUDLU1
A30808-X3063-A403-2-7630 PROC:DLUB – 13
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3.10.5.4 Connection path from LTG to LTE
Fig. 3.10.11 Connection path from LTG to LTE
1 Check of system voltage per rack row
Ensure that the main fuses are unscrewed before starting the check
Measure the system voltage for each rack row at the last frame
The operational voltage is dependent upon the charging status of the batteries:
Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6V ... -57V)
Is system voltage -60V (-48V) present? Y h...3N h...2
2 Special fault clearance
Carry out special fault clearance
– After finishing special fault clearance h...1
LTUU21PCM 30 with CCS
PCM 30 without CCS
F2out
F2inF1out
F1inLTE
F2in
F2outF1in
F1outLTE
to/from DLU
to/from DLU
LTUU20
SILC
LTGx
LTUU21PCM 30 with CCS
PCM 30 without CCS
F2out
F2inF1out
F1inLTE
F2in
F2outF1in
F1outLTE
to/from DLU
to/from DLU
LTUU20
SILC
LTGy
PROC:DLUB – 14 A30808-X3063-A403-2-7630
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3 Basic test (rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
Check and if necessary correct positioning of straps and switch settings on themodules
......MMN:DLUB -TAB MOD:DLU
4 Create basic state
The assignment of fuses to the individual modules is given in ......(see 3.10.2)
Switch off all DCCxx (RGB, MGB, if present)
Unscrew all fuses in the R:DLU h...5
5 Information about DCCxx
If SLM_8 or SLMD modules are used, each halfshelf is supplied by one DCC_8(DCCDD, DCCDC, DCCCR) instead of 2 DCCDF.These DCC_8 are inserted in the mounting locations of DCC x-0 and DCC x-2.DCC x-1 and DCC x-3 are omitted and also the corresponding fuses.
The following steps have to be carried out for each shelf of the DLUB.
6 Information block: Thermal switch
In every DLUB rack, a thermal switch is built into the bottom panel of the rack.The contact is fixed at the allowable room temperature. If this temperature isexceeded, then, via this thermal switch all DCCs in the rack receive groundpotential via the individual control input.In this way the DCCs are switched off.Exception: The DCCs in basic shelf0 are not switched off. In this way messagesare still possible.If the temperature goes down, the DCCs are switched back on.
!CAUTION:Areas on the wrap fields with pins for ringing or system voltage (e.g. SLM modules or DCCs) may beequipped with protection caps. The protection caps protect the operating personnel from touching the pinswith ringing or system voltage and must not be removed.
A30808-X3063-A403-2-7630 PROC:DLUB – 15
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7 Screw in fuses
The assignment of fuses to the individual modules is given in ...... (see 3.10.2)
Screw in the fuse for the first/next DCCxx which is to be switched on
Switch on the corresponding DCCxx
Is the green LED on the faceplate of the DCCxx lit? Y h...10N h...8
8 Replace DCCxx
Switch off DCCxx
Unscrew corresponding fuse
Switch off spare module
Replace DCCxx by spare module
Screw in corresponding fuse
Switch on DCCxx
Is the green LED on the faceplate of the DCCxx lit? Y h...10N h...9
9 Special fault clearance
If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...7
10 Decision: next DCCxx
Are all DCCs in the shelf switched on? Y h...11N h...7
11 Decision: next shelf
Are all DCCs in each shelf of the rack switched on? Y h...12N h...7
12 Decision: RGB
Is at least one module M:RGB present in the rack? Y h...13N h...18
13 Switch on RGB
Fuse allocation to DCCxx and RGB-modules (if present) in F:DLU(D)
PROC:DLUB – 16 A30808-X3063-A403-2-7630
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Switch on the first / next RGB (in F:DLU(D))
Is the green LED on the faceplate of the RGB module lit? Y h...16N h...14
14 Replace defective RGB
Switch off defective RGB
Switch off spare module
Replace defective RGB by spare module(Replacing the RGB module under power is possible)
Switch on RGB
Is the green LED on the faceplate of the RGB module lit? Y h...16N h...15
15 Special fault clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...13
16 Measure ringing voltage
The ringing voltage can be measured with a multimeter between the test jackson the front panel of the RGB module. ......MMN:DLUB -
TAB:MOD
Measure the ringing voltage between the test jacks.
Is the ringing voltage correct? Y h...17N h...14
17 Decision: next RGB
Have all RGB modules in the rack already been switched on? Y h...18N h...13
18 Decision: MGB
Is at least one module M:MGB present in the rack? Y h...19N h...23
MUT FUSE DCCxx RGB Remark
02 01 0-0 0
02 0-2 1
05 18 0-0 0
19 0-2 1
06 24 2-0 0 Only in Version D, E, D, D
26 2-2 1
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19 Switch on MGB
The MGB modules in F:DLU(D) are (if present) redundantly supplied via thefuses of DCCxx 1-0 and 1-1
Fuse allocation to DCCxx and MGB-modules (if present) in F:DLU(D)
Switch on MGB in the first / next F:DLU(D)
Is the green LED on the faceplate of the MGB module lit? Y h...22N h...20
20 Replace defective MGB
Switch off defective MGB
Switch off spare module
Replace defective MGB by spare module(Replacing the MGB module under power is possible)
Switch on MGB
Is the green LED on the faceplate of the MGB module lit? Y h...22N h...21
21 Special fault clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...19
22 Decision: next MGB
Have all MGB modules in the rack already been switched on? Y h...23N h...19
MUT FUSE DCCxx Remark
02 03 1-0 Parallel for one MGB module
04 1-1
05 20 1-0 Parallel for one MGB module
21 1-1
06 28 3-0 Parallel for one MGB module(Only possible in Version D, E, D,
D)29 3-1
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23 Information about TESMOD2E
Before on-line testing of the DLUB, all the test routines that can be called by theCP with MML commands can also be called by means of the TESMOD2E (TEStMOdule for DLU 2 Extended) and the results displayed. In this way TESMOD2Ecan be used in off-line mode to obtain a statement on the operability of theDLUB to be put into service before the DLUB is connected to the parentexchange via the PCM lines.
Answer the following question with yes only if a TESMOD2E is available and on-line testing is not possible in the foreseeable future.
Do you want to test the DLUB with the TESMOD2E ? Y i....PROC:TESMOD2E
N h...24– After finishing DLUB testing with TESMOD2E continue h...24
24 Information about connection path test
The connection of the DLUB to LTG is shown in:(LTGs used are LTGB, LTGF, LTGG, LTGM) ......(see Fig. 3.10.
6)
According to the LTG the DIU30D or DIU120A is used as LTU. The wiringbetween DIU:DLU and the corresponding LTU is shown in the following figures:
Wiring to DIU120A ......(see Fig. 3.10.7)
Wiring to DIU30D ......(see Fig. 3.10.9)
25 Information about connection path from DLUB to LTE
Because the DLUB and the start of the PCM link may be located apart, specialprecautions must be taken to ensure that the cabling between DIU:DLU and LTE(line terminating equipment / loading equipment) is correct. If it is, the corre-sponding PCM link simply needs to be connected to the LTE. If then no connec-tion can be established between DLUB and LTGB, the PCM link is interrupted.
The connection of DLUB to LTE is shown in ......(see Fig. 3.10.10)
26 Establish connection DIU:DLU to LTE
The connection first has to be established for DIU:DLU0 and than for DIU:DLU1
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27 Create test loop for PDC0
Link up the outgoing cable with CCS (PDC0) from the DIU:DLU0 (DIU:DLU1) tothe LTE which is to be connected with the LTE of LTGx (LTGy).
Red LED F2 on LTE goes out
Link F1out to F1in at the output of the LTE
Did the red LEDs MA0 and SA0 on the DIU:DLU0 (DIU:DLU1) go out? Y h...29N h...28
28 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU:DLU0 (DIU:DLU1) module.
29 Connect PDC0 to the link
Open the loop and connect the PDC0 to the link
30 Create test loop for PDC1
Link up the outgoing cable without CCS (PDC1) from the DIU:DLU0 (DIU:DLU1)to the LTE which is to be connected with the LTE of LTGx (LTGy).
Red LED F2 on the LTE goes out
Link F1out to F1in at the output of the LTE
Did the red LEDs MA1 and SA1 on the DIU:DLU0 (DIU:DLU1) go out? Y h...32N h...31
31 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU:DLU0 (DIU:DLU1) module.
32 Connect PDC1 to the link
Open the loop and connect the PDC1 to the link
33 Decision: next DLUB system
Note that DLUB system 1 is connected to another LTG as shown in ...... (see Fig. 3.10.6)
Has DLUB system1 already been checked? Y h...34N h...27
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34 Establish connection LTG to LTE
The connection first has to be established for LTGx (to DLUB system 0) andthan for LTGy (to DLUB system 1).
The connection of LTG to LTE is shown in ......(see Fig. 3.10.11)
35 Create test loop for cable with CCS
Link the outgoing cable with CCS from the LTU:U21 of LTGx (LTGy) to the LTEwhich is to be connected to the LTE of DLUB system 0 (DLUB system 1), if notalready done.
Red LED F2 on LTE goes out
Link F1out at the output of the LTE to F1in
Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...37N h...36
36 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU module in question.
37 Connect LTU:U21 to the link
Open the loop and connect the LTU:U21 to the link
38 Create test loop for cable without CCS
Link the outgoing cable without CCS from the LTU:U20 of LTGx (LTGy) to theLTE which is to be connected to the LTE of DLUB system 0 (DLUB system 1), ifnot already done.
Red LED F2 goes out
Link F1out to F1in at the output of the LTE
Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...40N h...39
39 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU module in question.
40 Connect LTU:U20 to the link
Open the loop and connect the LTU:U20 to the link
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41 Decision: test connection to DLUB system 1
Has the connection of LTGy to DLUB system 1 already been checked? Y h...ENDN h...35
END
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3.11 Testing DLUB with the TESMOD2E
TESMOD2E
3.11.1 Overview of TESMOD2E parts
The test module can be divided into two parts: the control/ memory board and the controlpanel. TESMOD2E can have an input and display panel connected and/or a printer.TESMOD2E is plugged into the mounting location of the DLUC module and the DLUCmodule is plugged into TESMOD2E.
Fig. 3.11.1 TESMOD2E -Overview
HEX display
X
X
LED
off/on
LIST key
= TESMOD /DLUC
= SME/TESMOD
= A
= LIMITER
= PRINTER
= RUN IN
= SINGLE/CONTI.
= STOP
RESET key
Control panel
PT 80 connector
Connector for inputand display panel
PlugDLUC
Control/memory board
Module frameconnector
PIOP8255
Memory bankswitchover
Controllogic
27C201EPROM
27C201EPROM
27256EPR
27256EPR
62256-RAM
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3.11.2 Control and memory unit
The control logic for TESMOD2E is used to access the memory and peripheral compo-nents and to switch over the memory areas between the DLUC module and TESMOD2EThe organization of the memory areas on both modules is shown in the following figure.
Fig. 3.11.2 Memory organization for DLUC and TESMOD2E
The memory area is switched over with the comparator chip and a register. The DLUCmemory area is always enabled if the address wanted is larger than the value stored inthe register. The TESMOD2E memory is disabled during this access procedure. On theDLUC module the memory chips are accessed or disabled by the enabling and disablingof the CS chip.
The DLUC memory area is enabled by:
– switch position on TESMOD2E
– access to the RAM area of the DLUC module
– switchover by program
0000H 0000H
6000H
FFFFH
C000H
E000H
FFFFH
E P R O M
R A M
DLUC TESMOD2E
27C256 /62256
27C256 /62256
62256
8000H 0
1
3132
63
27C201
27C201
.
.
.
Country
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The memory unit of TESMOD2E is realized by a program memory with a capacity of 48Kbyte, a data memory with a capacity of 16 Kbyte and 2 country specific EPROMs witha total capacity of 512 Kbyte. The total memory area of both country specific EPROMsis divided into 64 memory banks with a capacity of 8 Kbyte each.Each memory bank contains the country specific loading data of one country. Switch-over between the memory banks is realized by a decoder with address latch. The corre-sponding memory bank is selected by the 'PORT command OUT adr.'.
The addresses of the TESMOD2E memory area are located on the same level as theEPROM area of the M:DLUC (see Fig. 3.11.2)
The module PIOP 8255 is used as an interface to switches, LEDs, Hex-displays and theprinter.
3.11.3 Control panel
The control panel contains switches, keys and displays.
3.11.3.1 Switch functions
Switch Position Meaning
STOP OFF/ON ON A test run can be stopped by putting the switch to the ON position. Theprogram stops when the job buffer has been processed.
OFF The test is resumed by changing the switch to the OFF position.
SINGLE/CONT SINGLE When the switch is in the SINGLE position, the selected program isexecuted once. All the tests executed are shown in the test log.
CONT The selected program executes 65535 times. The test log will containonly those tests in which faults occurred.
RUN IN OFF/ON ON Run-in mode: The program executes 65535 times. A printer must beconnected. If faults have occurred, a summary of the fault messages isprinted out after every program execution. If the same fault occurs onthree consecutive occasions, the message "Same fault from test run X toY" is only printed out from time to time. This happens until another faultoccurs.
OFF The run-in mode is switched off.
PRINTER OFF/ON OFF The printer is switched off.
ON The printer is switched on. A printer must be connected, otherwise theprogram does not execute.
Caution! Do not connect a print multiplexer
LIMITER OFF/ON ON Only 10 consecutive fault messages are printed out.Fault output does not start again until a new program step has begun.
OFF Fault output is only interrupted when the fault field is full (approx. 500messages).
Tab. 3.11.1 Switch functions
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3.11.3.2 Key functions
3.11.3.3 Displays
A OFF/ON OFF Normal initialization procedure:In this position, the RAM area and the DMA/DLC chips undergo a pretestin the first run. In a subsequent run these chips are not pretested. If theconfiguration data have been entered, the load routine is executed. Afterthe DLU load routine, the TESMOD2E is ready for test command input.
ON In this position no more activities are carried out after initialization of theTESMOD2E .
SME/TESMOD SME With the switch in this position, control is taken over by the ETA85controller.
TESMOD
TESMOD with original processor on DLUC module.It is controlled by the input and display panel.
EPROMDLUC/TESMOD
DLUC When power has been switched on or the reset key pressed, the DLUoperating program is started. The TESMOD2E functions are not avail-able in this setting.
Key Function
LIST Printer switch "OFF":The test log is displayed in the form of a code on the HEX display in single-step mode.Advance step-by-step by repeatedly pressing the LIST key. When each code number isoutput the red LED indicates whether the value displayed refers to a text message or a faultmessage.
Red LED on: Fault messageRed LED off: Text message
Printer switch "ON":The test log is printed out.
RESET The RESET key resets the processor and restarts the program depending on the EPROMDLUC/TESMOD.
Tab. 3.11.2 Key functions
Display Meaning
Hexadecimal display This identifies the test routines and the coded test results.
Tab. 3.11.3 Displays
Switch Position Meaning
Tab. 3.11.1 Switch functions
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3.11.4 Input and display panel
Fig. 3.11.3 Input and display panel
Red LED Each time a code number is output, the red LED indicates whether the valuedisplayed refers to a text message or a fault message.
red LED on - fault messagered LED off - text message
Green LED The green LED indicates that a test is currently running.
Display Meaning
Tab. 3.11.3 Displays
0 1 2 3
D I S P L A Y
7654
8
C D
9 A B
E F I L
S G
B T
D E
SWITCHES
KEY
HEX - INPUT FUNCTION KEYS
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As shown in the figure above, the input and display panel contains:
• a 16-character alphanumeric display
• a hexadecimal key pad
• a function key pad
• two switches
• a RESET key
3.11.4.1 16-character displayThe 16-character alphanumeric display shows the test messages, addresses and data.
3.11.4.2 RESET keyPress the RESET key to reset the DLUC, initialize, and then to load the DLU.
3.11.4.3 Switch functions
3.11.4.4 Hexadecimal key padThe hexadecimal key pad is used to enter the module flag byte, to select test routinesand to enter addresses and data.
3.11.4.5 Function key pad
The function key pad comprises eight keys. When one of these function keys is pressed,the function is selected on the basis of the key value that has been read in, a corre-sponding status byte is set and the necessary memory cells reserved. The two key padsare then interrogated for input. If one of the hexadecimal keys is now pressed, this valueis stored and displayed. When a new function key is pressed, the status byte is resetand the memory cells reserved again. If the E key is pressed, the function called isexecuted. When the function has terminated, the status byte is cleared and the keys areinterrogated again for input. The function keys are explained below:
• E keyThe E key (Enter) starts routines or initiates actions which have been called by theother function keys.
Switch Position Meaning
TEST PORT/ALL PORT With the switch in this position, one module can be tested on its own.
ALL With the switch in this position, all the modules of a module type aretested.
RAM TESMOD /DLUC TESMOD Press the G key to modify or display files, or to start programs fromthe TESMOD2E memory area.
DLUC Press the G key to modify or display files, or to start programs fromthe DLUC memory area.
Tab. 3.11.4 Switch functions
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• B keyBefore starting the test routines, the configuration data of the DLU (each insertedmodule is represented by an identification byte) have to be input. By pressing the Bkey all modules, except the controller modules (DLUC,DIUD,BDCG) and the TUmodules (FMTU, LCMM) will be preset with the identification byte of a normalsubscriber line module.The preset id bytes are only written into the memory if pressing the B key is followedby pressing the E key. Thus it can be avoided that identification bytes, which havebeen input manually, are unintentionally overwritten by pressing the B key.
• T keyPress the T key (Test) and state the test block number to call all test routines. Thetest routines are started by pressing the E key. After the test the result is output andthe keys are interrogated for new input.
• D keyPress the D key to display the DLUC or TESMOD2E data. The position of the RAMTESMOD2E /DLUC switch determines the memory area from which the data aretaken. After pressing the D key, enter the required address. The contents of theaddress are displayed when the E key has been pressed. The I key can be used todisplay neighboring memory cells.
• I keyPress the I key to increment the address by one. This key can also be used for thedecrement function when the configuration data are being entered, if the TESTPORT/ALL switch is in the PORT position when the I key is pressed.
• S key Press the S key (Substitute) to change the contents of memory cells. The displayshows the address of the memory location to be changed, the contents of thememory location and the data to be entered. Press the E key to transfer the dataentered on the keypad into the memory cell.
• G keyPress the G key (Go) to start a program from any address.
• L keyPress the L key (List) to print out the last test log.
3.11.5 Test options with TESMOD2E
To call the individual test routines, press the T key and then specify the test by statingthe test code number. The following table gives an overview of the individual testroutines.
Test code no. Test object
0 Entire DLU system
1 DLUC
2 GCG
3 All BD/DCC if switch PORT/ALL is at ALL
3 One BD/DCC if switch PORT/ALL is at PORT
Tab. 3.11.5 Test codes and test routines
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Tests of the entire DLU system are carried out in the following sequence:
– DLUC test
– GCG test
– BD test
– DIU:DLU test
– TU test
– SLMAC test
– EMSP test
The tests listed above check the following:
• DLUC test
– Checksum per EPROM with reference value
– Checksum of all EPROMs
– Writability of the RAM cells
– Writability of the RAM cells with different bit patterns
– Availability of memory addresses
• GCG test
– Switchover of clock systems
– Loop test for checking the correct DLU clock distribution
4 DIU:DLU
5 All SLMACs if switch PORT/ALL is at ALL
5 One SLMAC if switch PORT/ALL is at PORT
6 SASC
7 All TU modules
8 FMTU
9 LCMM
A LVMM (not possible in DLUB)
B EMSP
C All SLMD if switch PORT/ALL is at ALL
C One SLMD if switch PORT/ALL is at PORT
D ALEX
E MTA
F MTAM
10 LTAM
11 TBAM
12 SLCI Version 6.2 or later
20 DIAGNOSIS for Version 6.2
30 QUICKCHECK for SLMA / SLMD
40 MDF test for Version 5.1
Test code no. Test object
Tab. 3.11.5 Test codes and test routines
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– Analysis of acknowledgments issued by the GCG
• BD test
– Disconnection of an SLMA group of four
– DCC and RGB flag tests are already implemented in the diagnosis
• DIU:DLU test
– TSX status bit
– All PCM channels
– PCM link up to the LTGB interface
– Signaling path to the LTGB
• TU test
– PCM link up to the COSLAC/SICOFI
– meter pulse
– Ringing current indicator
– Leak current, short-to-ground and voltage failure indicator
– LN-, LR, C-, D-, EN-, EH- and UN-indicators
– Reference values on LCMM for resistance, voltage and capacitance
• SLMA test
– Signaling path DLUP <---> SLMCP
– Interface between SLMCP and COSLAC/SICOFI
– Line-dependent COSLAC data (if COSLAC is used)
– Loopback setting of COSLAC/SICOFI in analog area
– B seizure:Testing feeding voltagePort seizure as B subscriberRinging trough connectionRing trippingTesting feeding voltage (low impedance)Testing feeding voltage (high impedance)clear back
– A subscriber:Port seizure as A subscriberDigit inputTesting speech path (frequency and level)Testing meter pulseReversal(Loop open)clear forwardoverload testTesting the test relays
• EMSP testThe EMSP test checks the line-dependent COSLAC data.
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3.11.6 Tables relevant for the procedure
3.11.6.1 Basic switch settings
3.11.6.2 Mounting locations for SLMD short circuit connectors
Switch Switch position
EPROM DLUC/TESMOD TESMOD
STEUERUNG SME/TESMOD TESMOD
A OFF/ON OFF
LIMITER OFF/ON ON
PRINTER OFF/ON ON OFF (only if there is no printer)
RUN IN OFF/ON OFF
TEST SINGLE/CONT SINGLE
STOP OFF/ON OFF
Tab. 3.11.6 Basic switch settings on control panel
Switch Switch position
TEST PORT/ALL PORT
RAM TESMOD/DLUC TESMOD
Tab. 3.11.7 Basic switch settings on the input and displaypanel
Frame left halfshelf right halfshelf
F:DLU(D) C2 15/27/39/51 C2 68/80/92/104
F:DLU(E) A2 15/27/39/51 A2 68/80/92/104
C2 15/27/39/51 C2 68/80/92/104
F:DLU(F) A2 15/27/39/51 A2 80/92/104
Tab. 3.11.8 Mounting locations for module typesQ965, Q1101, Q838
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3.11.6.3 Mounting locations for SLMX short circuit connectors
3.11.6.4 ID-Bytes for Configuration Data
Frame left halfshelf right halfshelf
F:DLU(D)
C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110
F:DLU(E) A2 15/21/27/33/39/45/51/57 A2 68/74/80/86/92/98/104/110
C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110
F:DLU(F) A2 15/21/27/33/39/45/51/57 A2 74/80/86/92/98/104/110
Tab. 3.11.9 Mounting locations for module typesQ1103, Q1192
Frame left halfshelf right halfshelf
F:DLU(D)
C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110
F:DLU(E) A2 15/21/27/33/39/45/51/57 A2 68/74/80/86/92/98/104/110
C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110
F:DLU(F) A2 15/21/27/33/39/45/51/57 A2 74/80/86/92/98/104/110
Tab. 3.11.10 Mounting locations for module type Q1338
Shelf ID-Bytes for DCCs in lefthalfshelf
ID-Bytes for DCCs in righthalfshelf
0 00 / 01 02 / 03
1 04 / 05 06 / 07
2 08 / 09 0A / 0B
3 0C / 0D 0E / 0F
Tab. 3.11.11 DCC ID-Bytes
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Flag byte Module
0 not present
1 DCC
2 RGB
Tab. 3.11.12 Flag-Bytes
ID-Byte Module
00 not present
01 SLMA:COS
02 SLMA:CM16
03
04 SLMA:CCBR
05 SLMA:CRMP
06 SLMD:C
07 LMEM
08 LVMM
09 FTEM
0A ALEX
0B EMSP Q828 or Q1094-X1/X2
0C GCG
0D DLUC
0E DIU:DLU
0F SLMA:C12R
10 SLMA:CMC
11 SLMA:SAB
12 SLMA:TPL / SLMA:TAB
13 SLMA:DID
14 SLMA:CAB
15 SLMA:CMRL
18 SLMA:GAB
19 SLMA:GLAB
1A MTAM
1B LTBAM-TBA EBP 1F
1C LTBAM-LTA EBP 1E
1D
1E SLMA:DIOD
1F
20 SLMA:FPB
Tab. 3.11.13 Module ID-Bytes
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21 SLMA:CSR
22 SLMD:A
23 SLMA:BEL
24 SLMA:12R
25 SLMD:B
27 SLMA:FPC
28 FMTU
29 LCMM
2A
2B
2C EMSP Q1094-X4
2D SASC
2F SLCIM
30
31
32 SLMA:FPS
33 IWEA
34
35 IWEB
36 SLMA CSP (Brasil)
37 ALMA (Brasil)
38 OLMA (Brasil)
39 OLMAC (Brasil)
3A SLMA FPD
3C SLMA:FPC8 (Austria)
41 SLMX
49 DIUDRA (SDE)
4A DIUDRB (SDE)
4B SUR
50 SLMA:FPE
51 SLMA:FPF
52 MGB
ID-Byte Module
Tab. 3.11.13 Module ID-Bytes
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1 Switch settings on the TESMOD2E
Put all switches on the control panel to the basic position according to: ......(see Tab.3.11.6)
Put switches on the input and display panel to the basic position according to: ......(see Tab.3.11.7)
2 Connect the TESMOD2E
Switch off current converter DCCxx in the left halfshelf of shelf 0 and switch offRGB0 (if present)
The LEDs on the module faceplates of DCCxx and RGB in the left halfshelf ofshelf 0 go out
Pull control module DLUC0 in the left halfshelf of shelf 0
Plug TESMOD2E into the mounting location of DLUC0
Plug module DLUC0 onto the TESMOD2E module
Connect control and display panel to TESMOD2E
Switch on printer and connect to control and display panel
3 Plug in ADL
Plug ADL test module onto the rear of mounting location A2/B2 051 and C2/D2074
Set switches on the ADL test module to the following positions:
• S1 = ON
• S2 = OFF
• S3 = OFF
• S4:
– S4 = OFF : No CRC4 mode (switch S5 on M:DIUDC at OFF) for WM
– S4 = ON : CRC4 mode (if S5 on M:DIUDC is ON) for DBP
As of Version 6.2, only the ADL is used as a DIU termination
4 Prepare SLMD-Test
Connect the network terminator (NT) for ISDN subscribers on the back of theSLMD modules.
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For module frames with code number S30804-B2709-X- * (F:DLU(D)) to thefollowing points:
• A-wire of NT to pin B2 039 37
• B-wire of NT to pin B2 039 38
The SLMD short-circuit connector S30189-H4906-A110 can be used for SLMDmodule types Q965, Q1101 and Q838. One SLMD short-circuit connector isrequired per SLMD. The SLMD short circuit connector is like the SLMD moduleplugged into a mounting location with integer value.
The following mounting locations for SLMD short-circuit connectors arepossible:
...... (see Tab.3.11.8)
The SLMD short-circuit connector S30189-H4906-A110 must be used for SLMDmodule types Q1103 and Q1192. One SLMD short-circuit connector is requiredper SLMD.
The following mounting locations for SLMD short-circuit connectors arepossible:
...... (see Tab.3.11.9)
5 Prepare SLMX-Test
The SLMX short-circuit connector S30257-Z7103-A20 can be used for SLMXmodule type Q1338. One SLMX short-circuit connector is required per SLMX.The SLMX short circuit connector must be plugged into the rear side of theSLMX mounting location.
The following mounting locations for SLMX short-circuit connectors arepossible:
...... (see Tab.3.11.10)
6 Information about Country settings
If the STOP-Switch is in position OFF before switching on the power, the lastselected country memory bank is active.If another country is to be activated, the STOP Switch has to be set to positionON before power is switched on. Then the program runs in an endless loop afterswitching on the power and the user can select the relevant country memorybank. After selecting the correct country memory bank the STOP Switch is to beset to position OFF again and the automatic initializing starts.
7 Decision: select memory bank with country specific loading data
Is already the correct memory bank with the country specific loading dataselected? Y h...9
N h...8
PROC:TESMOD2E – 16 A30808-X3063-A403-2-7630
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8 Select memory bank with country specific loading data
Set STOP-Switch to position ON
Switch on current converter DCCxx in the left halfshelf and RGB0 (if present)
The program runs in an endless loop.
Select the correct memory bank with the HEX-keys or by pressing the I-key(increment) or L-key (decrement)
Set STOP-Switch to position OFF h...10
9 Switch on DCCxx
Switch on current converter DCCxx in the left halfshelf and RGB0 (if present)
The LEDs on the faceplates of modules DCCxx and RGB in the left halfshelf ofshelf 0 light up.
10 Initializing TESMOD2E
TESMOD2E is automatically initialized. A RAM test and a DLC/DMA test arethen carried out on the DLUC. If no faults are found during the test, the DLUC issubsequently initialized.At the end of the TESMOD initialization the display shows:' BASIC - TEST ' ' **NO FAULTS DETECTED** ' ' END OF TEST 'and the configuration data can be entered.
Does the display panel show '**NO FAULT DETECTED**'? Y h...12N h...11
11 Replace defective TESMOD2E
The TESMOD2E is probably defective and must be replaced
Switch off current converter DCCxx and RGB0 (if present) in the left halfshelf ofshelf 0
Remove input and display panel from TESMOD2E
Remove DLUC0 module from TESMOD2E
Replace TESMOD2E in DLUC0 mounting location
Plug DLUC0 onto TESMOD2E
Connect input and display panel to TESMOD2E
– After replacing defective TESMOD2E continue h...9
12 Decision: automatic input of configuration data
The rack capacity stage has to be input before starting the DLU test. For thisreason it is necessary to generate the configuration data. Every module which ispresent in the DLU is entered in the configuration data.
Caution: Only the modules entered in the configuration data will be tested
A30808-X3063-A403-2-7630 PROC:TESMOD2E – 17
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Depending on the switch A OFF/ON the configuration data are input automati-cally or manually:
• A=OFF : Configuration data are input automatically
• A=ON : Configuration data have to be input manually
Is the configuration data input automatically? Y h...13N h...15
13 Automatic input of configuration data
A printer should be connected for automatic input of configuration data so that aprintout of the data can be made. Whenever automatic configuration data isexecuted, the display "GET EQUIPMENT DATA" appears on the control panel oron the printout. Each time an automatic input of configuration data has takenplace, the printout of the data should be compared with the actual rack configu-ration. If a module is installed at a mounting location, the printout of the configu-ration data must show the hardware ID of the module in question. If it shows 00,however, instead of the right hardware ID, the module in question is defective.The BD modules do not appear in the configuration data printout.The RGB, MGB and DCC modules are recognized automatically.
The DCCs are assigned to the following HEX-numbers: ...... (see Tab.3.11.11)
In the case of automatic configuration data input, only the DIUD in the shelf inwhich the TESMOD2E is plugged in is entered in the configuration data; theDIUD in the other DLUC system is not entered, however.
DLUB READY is printed out after successful input of the configuration data
DLUB READY
Compare the configuration data printout with the rack layout
Are all the modules contained in the configuration data? Y h...16N h...14
14 Replace modules
Switch off DCC
Modules marked 00 must be replaced
Switch on DCC
– After replacing modules continue h...13
PROC:TESMOD2E – 18 A30808-X3063-A403-2-7630
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15 Manual input of configuration data
The TESMOD2E needs the configuration data for the DLU load routine. Theconfiguration data contain the module data and the capacity stage.
Press the B key on the input panel
"DLU DATA" appears on the alphanumeric display
Press the E key on the input panel
The alphanumeric display shows the number of the first DCC and the corre-sponding flag byte.
The flag byte must be entered on the keypad according to: ......(see Tab.3.11.12)
The TESMOD2E begins with the left-hand DCC in shelf 0. After entering thecode number, press the I key and the TESMOD2E is ready for entry of the nextcode number. The DCCxx are numbered from 00 through 0F. Simply enter thatthe DCCxx is present or not. The bus distributors are automatically enteredwhen the DCCxx are entered. If both DCCxx in a shelf are entered as notpresent, the entire shelf is taken as not present. Positions 10 and 11 arereserved for the RGB.
Caution!When the TEST PORT/ALL switch is changed to the ALL position, the I key nolonger has the increment function, but the decrement function. This means thatif an input error is made, the entire configuration data do not have to be reen-tered.
Enter the configuration data for all DCCxx and RGB according to the followingtable:
......(see Tab.3.11.12)
Press the E key when all 18 flag bytes have been entered.
The bytes are stored in the EPROM EMULATOR.
The TESMOD2E is now ready for entry of the remaining module types.
Enter the configuration data for the remaining modules according to: ......(see Tab.3.11.13)
Press the E key when all flag bytes have been entered.
All flag bytes are stored in the EPROM EMULATOR.
When the configuration data have been entered, the DLU is loaded with system,device, module and port data. The operation and maintenance program of theDLU is then started up until all the modules present have been created and acti-vated.
When the load routine has terminated, TESMOD2E is ready for tests to beexecuted and indicates this on the display with DLUB READY.
A30808-X3063-A403-2-7630 PROC:TESMOD2E – 19
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16 Test entire DLU with TESMOD2E
Press the T key
The display shows a 0
The code number 0 executes all the possible tests on the DLU in sequence. ...... (see 3.11.5)
Start the tests by pressing E
When these tests have terminated, the green LED on the control panel goes outand the number of errors is shown on the display panel.
17 Evaluate message
Branch to the following blocks according to the message which is displayed
– The message NO ERRORS DETECTED is displayed h...28– The message XX ERRORS DETECTED is displayed (XX indicates the
number of errors that have occurred) h...18
18 L key
If a module needs to be replaced, it must be marked as faulty once it has beenremoved.
Press the L key
The display outputs the first error that occurred, stating the fault location(module identification).
19 Identify the errors that have occurred (1)
Does the error displayed relate to an SLMAC module? Y h...20N h...23
20 Identify the errors that have occurred (2)
Is LOOP TEST ERROR displayed? Y h...21N h...23
21 Identify the errors that have occurred (3)
– If LOOP TEST ERROR is output for one port only h...23– If LOOP TEST ERROR is output for the entire SLMAC h...22
22 Pull SLMAC module
Pull the identified SLMAC module and then reinsert it h...26
23 Decision: fault clearance
Is it probable that the displayed error can be cleared? Y h...24N h...25
PROC:TESMOD2E – 20 A30808-X3063-A403-2-7630
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24 Clear error
Clear displayed error h...26
25 Replace module
Replace the module indicated in the display h...26
26 Display next error
Display the next error by pressing I
Is another error displayed? Y h...19N h...27
27 RESET
Press RESET key h...16
28 DLU system 1 already tested?
Has DLU system 1 already been tested? Y h...30N h...29
A30808-X3063-A403-2-7630 PROC:TESMOD2E – 21
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29 Test DLU system 1
Switch off current converter DCCxx in the left halfshelf of shelf 0 and switch offRGB0 (if present)
The LEDs on the module faceplates of DCCxx and RGB in the left halfshelf ofshelf 0 go out
Pull control module DLUC0 in the left halfshelf of shelf 0
Unplug TESMOD2E
Plug in DLUC0 again
Switch on current converter DCCxx in the left halfshelf and RGB0 (if present)
The LEDs on the module faceplates of DCCxx and RGB in the left halfshelf ofshelf 0 are lit
Switch off current converter DCCxx in the right halfshelf of shelf 0 and switch offRGB1 (if present)
The LEDs on the module faceplates of DCCxx and RGB in the right halfshelf ofshelf 0 go out
Pull control module DLUC1 in the right halfshelf of shelf 0
Plug TESMOD2E into the DLUC1 mounting location
Plug the DLUC1 onto the TESMOD2E
Switch on printer and connect to the control and display panel
Switch on current converter DCCxx in the right halfshelf of shelf 0 and RGB1 (ifpresent)
The LEDs on the module faceplates of the DCCxx and RGB in the right halfshelfof shelf 1 light up.
TESMOD2E is automatically initialized when power is switched on. A RAM testand a DLC/DMA test are then carried out on the DLUC. If no faults are foundduring the tests, the DLUC is subsequently initialized. The configuration data donot have to be reentered for DLU system 1 as they are still stored in the EPROMemulator. After initialization the DLU is loaded with system, device, module andport data. Subsequently, the operation and maintenance software of the DLU isstarted until all the modules present have been created and activated.When the load routine has terminated, the TESMOD2E is ready for tests to beexecuted and indicates this by displaying DLUB READY.
h...12
30 End of DLU-Test with TESMOD2E
End of DLU-Test with TESMOD2E
Return to calling procedure
END
PROC:TESMOD2E – 22 A30808-X3063-A403-2-7630
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A30808-X3063-A403-2-7630 PROC:DLUD – 1
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3.12 Off-line Installation of Digital Line Unit(Frames G / E / F)
DLUD
3.12.1 Documents
The following Documents are required as references
– Maintenance Manual MMN:DLUD
– AKUHW Lists
PROC:DLUD – 2 A30808-X3063-A403-2-7630
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3.12.2 Fuse Assignments
3.12.2.1 Fuse Assignment R:DLUD (G-E-G-E)
Fig. 3.12.1 Fuse Assignment R:DLUD (G-E-G-E)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
Shelf 0
Sicherungsschiene
MUT02
MUT03
MUT01
01
RGB
MGB
04
03
A001-057 02A066-125
05
06
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(G)
Shelf 2
12
11
10
13
14
C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)
21
20
19
22
23
07
18
A001,A015-033
08 A008,A039-057
09A116,A068-086
A123,A092-110
27
30
31
24 26
CD
FU
BD2
BD3
Shelf 0 MUT05
MUT06
A001-057 A066-125
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(G)
Shelf 2
29
28 C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)A001,A015-033
25 A008,A039-057
A116,A068-086
A123,A092-110
BD2
BD3
* 057 nur wenn MGB gesteckt ist.Hinweis: Wird nur ein DCC pro Halbshelf verwendet, entfallen die DCC Pos shf-1 und shf-3 und somit auchdie zugehörigen Sicherungen.
MGB
RGB
RGB
RGB
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
A30808-X3063-A403-2-7630 PROC:DLUD – 3
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3.12.2.2 Fuse Assignment R:DLUD (G-E-G-G)
Fig. 3.12.2 Fuse Assignment R:DLUD (G-E-G-G)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
MUT01
01
04
03
02
05
06
12
11
10
13
14
Shelf 0MUT05
21
20
A001-057 19A066-125
22
23
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(G)
07
18
08
09
CD
Shelf 2MUT06
29
28
A001-057 26A066-125
30
31
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(G)
24
FU
Sicherungsschiene
Shelf 0 MUT02
MUT03
A001-057 A066-125
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(G)
Shelf 2
C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)A001,A015-033
A008,A039-057
A116,A068-086
A123,A092-110
BD2
BD3
* 057 nur wenn MGB gesteckt ist.Hinweis: Wird nur ein DCC pro Halbshelf verwendet, entfallen die DCC Pos shf-1 und shf-3 und somit auch die
MGB
MGB
MGB
RGB
RGB
RGB
RGB
RGB
RGB
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
PROC:DLUD – 4 A30808-X3063-A403-2-7630
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3.12.2.3 Fuse Assignment R:DLUD (G-E-G-F)
Fig. 3.12.3 Fuse Assignment R:DLUD (G-E-G-F)
FU
09 1907 170501 11 1503 13 FUFU
10 2008 180602 12 1604 14 FUFU
292721 2523 31 33
30282622 3224
Sicherungsschiene MUT01
01
04
03
02
05
06
12
11
10
13
14
Shelf 0MUT05
21
20
A001-057 19A066-125
22
23
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(G)
07
18
08
09
Shelf 2
27
A116,A074-92
A123,A098-110
A001,A015-033
25 A008,A039-057
24 26
CD
FU
F:DLU(F)
Shelf 0 MUT02
MUT03
A001-057 A066-125
C001,C015-033,057*
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 1
F:DLU(G)
Shelf 2
C001,C015-033
C008,C039-057
C116,C068-086
C123,C092-110
Shelf 3
F:DLU(E)A001,A015-033
A008,A039-057
A116,A068-086
A123,A092-110
BD2
BD3
BD2
BD3
* 057 nur wenn MGB gesteckt ist.Hinweis: Wird nur ein DCC pro Halbshelf verwendet, entfallen die DCC Pos shf-1 und shf-3 und somit auch die
MGB
MGB
RGB
RGB
RGB
RGB
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
DCC
A30808-X3063-A403-2-7630 PROC:DLUD – 5
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3.12.3 Equipment of the different Frames
Detailed information about the equipment of the different frames are listed in the equip-ment list and the mounting location list of the MMN:DLUD, APP.
3.12.4 Shelter DLU 400/700
The shelter can contain the following equipment:
• Remote Shelter DLU 400 (Fig. 3.12.4)Basic frame D for DLUB (F:DLU(D)) with a max. of 384 subscribers or basic frameG for DLUD (F:DLU(G)) with a max. of 448 subscribers
• Remote Shelter DLU 700 (Fig. 3.12.5)Basic frame F:DLU(D)) or F:DLU(G)) and also extension frame F for DLUB(F:DLU(F)) with a max. of 240 subscribers
• Transmission equipment for the shelter (optional)The following transmission equipment is provided in the shelter for connection to thenetwork node or for the connection of additional shelters (ring or star configuration):
– Transmission technology in the synchronous digital hierarchy (SDH)SDH: synchronous multiplexers (SMA1/4) or, alternatively,synchronous dual terminal multiplexers (STM1D)
– Transmission technology in the plesiochronous digital hierarchy (PDH)PDH technology in the shelter:Optical/HDSL terminal multiplexer for 2 Mbit/s (OMX2/HMX)Optical terminal multiplexer for 34 Mbit/s (OMX16)
(PDH technology can also be integrated in the DLU hardware)
PROC:DLUD – 6 A30808-X3063-A403-2-7630
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• MDF/ DDF distribution frame
• Air conditioning (fan and heater)
• Power supply unit, including standby battery
• Cable TV
• Modem for OFDC (optional)
3.12.4.1 Overview Shelter 400/700
Fig. 3.12.4 Configuration of ’Remote Shelter DLU 400’
MDF200 DA internal
MDF200 DA internal
MDF200 DA external
MDF200 DA external
MDF200 DA external
Mains access (MAP)orlightning overvoltageprotection (LOP)
SMA 1/4 or SMT1D(SDH)
1600
mm
1800 mm500 mm
Front viewSide view (left)
Fan
Basic frame D(F:DLU(D)) or G
(F:DLU(G))
Connector panel
Fan
OMX2/HMX or OMX16(PDH)
Connector panel
AC/DC converter (48 V/30 A)
Cable TV
SIEMENS
Heater 1600 W
DDF24 PCM30
DDF24 PCM30
DC distribution
AC distribution
Battery
(Connection foremergency power supply)
OFDC modem
A30808-X3063-A403-2-7630 PROC:DLUD – 7
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Fig. 3.12.5 Configuration of ’Remote Shelter DLU 700’
3.12.4.2 Fuse Assignment PPD (Primary power distribution)
Sicherungen gesicherte Einheit
F1 25 A AC Power supply(Fehlerstromschutzschalter)
F2 16 A Rectifier 1
F3 16 A Rectifier 2 (optional)
F4 10 A Heater
F5 10 A Cabel TV (optional)
Tab. 3.12.1 Assignment of primary fuses
Mains access (MAP)orlightning overvoltageprotection (LOP)
Heater 1600 W
AC/DCconverter(48 V/30 A)
MDF200 DA external
Basic frame D(F:DLU(D)) or G
(F:DLU(G))
Extension frame F(F:DLU(F))
SMA 1/4 or SMT1D(SDH)
1800
mm
1800 mm500 mm
Front viewSide view (left)
Fan
Connecting panel
Fan
OMX2/HMX or OMX16(PDH)
Connecting panel
DC distribution
AC distribution
Cable TV
SIEMENS
MDF200 DA external
MDF200 DA external
MDF200 DA internal
MDF200 DA internal
MDF200 DA internal
MDF200 DA external
DDF24 PCM30
DDF24 PCM30
DDF24 PCM30
104 DAinternal
(Connection for emer-gency power supply)
Battery
OFDC modem
MDF200 DA external
PROC:DLUD – 8 A30808-X3063-A403-2-7630
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3.12.4.3 Fuse Assignment SPD (Secondary power distribution)
Caution:The fuse cover must not be removed by the maintenance. personnel. If maintenancework on the fuses is necessary, this can only be carried out by trained specialists. Beforethe fuse cover is removed the 220 V AC line voltage must be switched off.
F6 10 A Socket (for OFDC-Modem)
Fuses Unit
F1 10 A DLU Shelf 0 (System side 1)
F2 10 A DLU Shelf 1 (System side 1)
F3 10 A DLU Shelf 1 (System side 0)
F4 10 A DLU Shelf 0 (System side 0)
F5 10 A Transmission equipment (SDH)orRadio equipment SRA L1/SRA L2
F6 10 A not used
F7 10 A Transmission equipment (PDH)orRadio equipment SRA L1/SRA L2
F8 10 A Shelter DLU 400: not usedbzw.Shelter DLU 700: Shelf 2 (System side 1)
F9 10 A Fan 2
F10 10 A Fan 1
F11 10 A Monitoring and heater control
F12 10 A Shelter DLU 400: not usedbzw.Shelter DLU 700: Shelf 2 (System side 0)
F13 50 A Battery
Tab. 3.12.2 Assignment of secondary fuses
Sicherungen gesicherte Einheit
Tab. 3.12.1 Assignment of primary fuses
A30808-X3063-A403-2-7630 PROC:DLUD – 9
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3.12.5 Remote DLU
3.12.5.1 Connection of a remote DLUD to two LTG
Fig. 3.12.6 Connection of remote DLUD to two LTG
The diagram above shows the connection of the remote DLUD to two LTGs. One DLUDsystem is connected to the LTGx and the other to the LTGy. The dotted lines representthe links without CCS.
PDC0
PDC1
LTUU21
LTUU21
PDC0
PDC0
PDC0
PDC1
PDC1
PDC1
DLU
DLU
LTUU20
LTUU20
LTUU21
LTUU21
LTUU20
LTUU20
LTGx
LTGy
SILC
SILC
DLUS0
DLUS1
DLUS0
DLUS1
Plug position
B2 057
B2 066
B2 057
B2 066
PROC:DLUD – 10 A30808-X3063-A403-2-7630
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3.12.5.2 Wiring between DLUS and LTU
Fig. 3.12.7 Wiring between DLUS and LTU (DIU120A)
(*): The pin numbers refer to the first of four PDC connectors of the DIU120A. An over-view of all pin numbers is shown in the following table:
PDC(0) PDC(1) PDC(2) PDC(3)
Sym Koax Sym Koax Sym Koax Sym Koax
E132 E132 E142 E142 E152 E152 E212 E212
E134 C134 E144 C144 E154 C154 E214 C214
E136 E136 E146 E146 E156 E156 E216 E216
E138 C136 E148 C146 E158 C156 E218 C216
Tab. 3.12.3 Pin numbers for PCM30 connectors of DIU120A
F1in...F2outF2in...F1out
F2in
F2out53
54
55
56
F2out...F1in F1out...F2in
F1in...F2outF2in...F1out
F2in
F2out
F2out...F1in F1out...F2in
F2out
F2in
F2out
F2in
PDC0
PDC1
LTU/U21
LTU/U20
DLUS
LE LE
DIU120A
Sym. Koax.
53
57
55
58
43
44
45
46
43
47
45
48
E132
E134
E136
E138
Pin No.(*)
Sym. Koax.
E132
C134
E136
C136
E132
E134
E136
E138
E132
C134
E136
C136
Pin No. (Plug Pin)
A30808-X3063-A403-2-7630 PROC:DLUD – 11
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Fig. 3.12.8 Numbering method on F:LTGM
row C(mounting area 1)
SU1
SU4
SU5
SU2
SU3
SU1
SU4
SU2
SU3
row D(mounting area 2)
ABCDE
1
9
5
Pin E 2 1 2 2
0 (no pins available)
PDC1
PDC2
Pin E 2 1 4
Pin E 2 1 6
Pin E 2 1 8
Pins for PDC3 (sym.)
101
F:LTGM(A) Rearview
151203255305
PDC0
DIU120A MOLOCS:
PROC:DLUD – 12 A30808-X3063-A403-2-7630
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Fig. 3.12.9 Wiring between DLUS and LTU (DIU30D)
3.12.5.3 Connection path from DLUD to LTE
Fig. 3.12.10 Connection path from DLUD to LTE
F1in...F2outF2in...F1out
F2in
F2out53
54
55
56
F2out...F1in F1out...F2in
F1in...F2outF2in...F1out
F2in
F2out
F2out...F1in F1out...F2in
F2out
F2in
F2out
F2in
PDC0
Pin No. (Plug Pin)
PDC1
LTU/U21
LTU/U20
DLUS
LE LE
DIU30D
Sym. Koax.
53
57
55
58
43
44
45
46
43
47
45
48
49
50
51
52
Pin No. (Plug pin)
Sym. Koax.
49
29
51
31
49
50
51
52
49
29
51
31
PDC0
PDC0
PDC1
PDC1
DLU
DLUS0
DLUS1
PCM 30 with CCS
PCM 30 without CCS
F2in
F2out F1in
F1outLTE
F2in
F2out F1in
F1outLTE
PCM 30 with CCS
PCM 30 without CCS
F2in
F2out F1in
F1outLTE
F2in
F2out F1in
F1outLTE
To/from LTGx
To/from LTGx
To/from LTGy
To/from LTGy
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3.12.5.4 Connection path from LTG to LTE
Fig. 3.12.11 Connection path from LTG to LTE
1 Check of system voltage per rack row
Ensure that the main fuses are unscrewed before starting the check
Measure the system voltage for each rack row at the last frame
The operational voltage is dependent upon the charging status of the batteries:
Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6V ... -57V)
Is system voltage -60V (-48V) present? Y h...3N h...2
2 Special fault clearance
Carry out special fault clearance
– After finishing special fault clearance h...1
LTUU21PCM 30 with CCS
PCM 30 without CCS
F2out
F2inF1out
F1inLTE
F2in
F2outF1in
F1outLTE
To/from DLU
To/from DLU
LTUU20
SILC
LTGx
LTUU21PCM 30 with CCS
PCM 30 without CCS
F2out
F2inF1out
F1inLTE
F2in
F2outF1in
F1outLTE
To/from DLU
To/from DLU
LTUU20
SILC
LTGy
PROC:DLUD – 14 A30808-X3063-A403-2-7630
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3 Basic test (rack)
Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.
Check that all modules and cables are firmly in place.
Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.
Check and if necessary correct positioning of straps and switch settings on themodules
......MMN:DLUD -TAB MOD:DLU
4 Create basic state
The assignment of fuses to the individual modules is given in ......(see 3.12.2)
Switch off all DCCxx (RGB, MGB, if present)
Unscrew all fuses in the R:DLUD h...5
5 Information about DCCxx
If SLM_8 or SLMD modules are used, each halfshelf is supplied by one DCC_8(DCCDD, DCCDC, DCCCR) instead of 2 DCCDF.These DCC_8 are inserted in the mounting locations of DCC x-0 and DCC x-2.DCC x-1 and DCC x-3 are omitted and also the corresponding fuses.
The following steps have to be carried out for each shelf of the DLUD.
6 Information block: Thermal switch
In every DLUD rack, a thermal switch is built into the bottom panel of the rack.The contact is fixed at the allowable room temperature. If this temperature isexceeded, then, via this thermal switch all DCCs in the rack receive groundpotential via the individual control input.In this way the DCCs are switched off.Exception: The DCCs in basic shelf0 are not switched off. In this way messagesare still possible.If the temperature goes down, the DCCs are switched back on.
!CAUTION:Areas on the wrap fields with pins for ringing or system voltage (e.g. SLM modules or DCCs) may beequipped with protection caps. The protection caps protect the operating personnel from touching the pinswith ringing or system voltage and must not be removed.
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7 Screw in fuses
The assignment of fuses to the individual modules is given in ...... (see 3.12.2)
Screw in the fuse for the first/next DCCxx which is to be switched on
Switch on the corresponding DCCxx
Is the green LED on the faceplate of the DCCxx lit? Y h...10N h...8
8 Replace DCCxx
Switch off DCCxx
Unscrew corresponding fuse
Switch off spare module
Replace DCCxx by spare module
Screw in corresponding fuse
Switch on DCCxx
Is the green LED on the faceplate of the DCCxx lit? Y h...10N h...9
9 Special fault clearance
If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...7
10 Decision: next DCCxx
Are all DCCs in the shelf switched on? Y h...11N h...7
11 Decision: next shelf
Are all DCCs in each shelf of the rack switched on? Y h...12N h...7
12 Decision: RGB
Is at least one module M:RGB present in the rack? Y h...13N h...18
13 Switch on RGB
Fuse allocation to DCCxx and RGB-modules (if present) in F:DLU(G)
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Switch on the first / next RGB (in F:DLU(G))
Is the green LED on the faceplate of the RGB module lit? Y h...16N h...14
14 Replace defective RGB
Switch off defective RGB
Switch off spare module
Replace defective RGB by spare module(Replacing the RGB module under power is possible)
Switch on RGB
Is the green LED on the faceplate of the RGB module lit? Y h...16N h...15
15 Special fault clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...13
16 Measure ringing voltage
The ringing voltage can be measured with a multimeter between the test jackson the front panel of the RGB module. ......MMN:DLUD -
TAB:MOD
Measure the ringing voltage between the test jacks.
Is the ringing voltage correct? Y h...17N h...14
17 Decision: next RGB
Have all RGB modules in the rack already been switched on? Y h...18N h...13
MUT FUSE DCCxx RGB Remark
02 01 0-0 0
02 0-2 1
03 07 2-0 0 Only in Version G,G,G,G
09 2-2 1
05 18 0-0 0
19 0-2 1
06 24 2-0 0 Only in Version G,E,G,G orG,G,G,G
26 2-2 1
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18 Decision: MGB
Is at least one module M:MGB present in the rack? Y h...19N h...23
19 Switch on MGB
The MGB modules in F:DLU(D) are (if present) redundantly supplied via thefuses of DCCxx 1-0 and 1-1
Fuse allocation to DCCxx and MGB-modules (if present) in F:DLU(D)
Switch on MGB in the first / next F:DLU(G)
Is the green LED on the faceplate of the MGB module lit? Y h...22N h...20
20 Replace defective MGB
Switch off defective MGB
Switch off spare module
Replace defective MGB by spare module(Replacing the MGB module under power is possible)
Switch on MGB
Is the green LED on the faceplate of the MGB module lit? Y h...22N h...21
21 Special fault clearance
Carry out special fault clearance
– Repeat testing after finishing special fault clearance h...19
22 Decision: next MGB
Have all MGB modules in the rack already been switched on? Y h...23N h...19
MUT FUSE DCCxx Remark
02 03 1-0 Parallel for one MGB module
04 1-1
03 11 3-0 Parallel for one MGB module(Only possible in Version G,G,G,G)
12 3-1
05 20 1-0 Parallel for one MGB module
21 1-1
06 28 3-0 Parallel for one MGB module(Only possible in Version G,E,G,G
or G,G,G,G)29 3-1
PROC:DLUD – 18 A30808-X3063-A403-2-7630
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23 Information about connection path test
The connection of the DLUD to LTG is shown in:(LTGs used are LTGB, LTGF, LTGG, LTGM) ......(see Fig. 3.12.
6)
According to the LTG the DIU30D or DIU120A is used as LTU. The wiringbetween DIU:DLU and the corresponding LTU is shown in the following figures:
Wiring to DIU120A ......(see Fig. 3.12.7)
Wiring to DIU30D ......(see Fig. 3.12.9)
24 Information about connection path from DLUD to LTE
Because the DLUD and the start of the PCM link may be located apart, specialprecautions must be taken to ensure that the cabling between DLUS and LTE(line terminating equipment / loading equipment) is correct. If it is, the corre-sponding PCM link simply needs to be connected to the LTE. If then no connec-tion can be established between DLUD and LTGB, the PCM link is interrupted.
The connection of DLUD to LTE is shown in ......(see Fig. 3.12.10)
25 Establish connection DLUS to LTE
The connection first has to be established for DLUS0 and than for DLUS1
26 Create test loop for PDC0
Link up the outgoing cable with CCS (PDC0) from the DLUS0 (DLUS1) to theLTE which is to be connected with the LTE of LTGx (LTGy).
Red LED F2 on LTE goes out
Link F1out to F1in at the output of the LTE
Did the red LED for PDC0 alarm on DLUS0 (DLUS1) go out? Y h...28N h...27
27 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DLUS0 (DLUS1) module.
28 Connect PDC0 to the link
Open the loop and connect the PDC0 to the link
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29 Create test loop for PDC1
Link up the outgoing cable without CCS (PDC1) from the DLUS0 (DLUS1) to theLTE which is to be connected with the LTE of LTGx (LTGy).
Red LED F2 on the LTE goes out
Link F1out to F1in at the output of the LTE
Did the red LED for PDC0 alarm on DLUS0 (DLUS1) go out? Y h...31N h...30
30 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DLUS0 (DLUS1) module.
31 Connect PDC1 to the link
Open the loop and connect the PDC1 to the link
32 Decision: next DLUD system
Note that DLUD system 1 is connected to another LTG as shown in ...... (see Fig. 3.12.6)
Has DLUD system1 already been checked? Y h...33N h...26
33 Establish connection LTG to LTE
The connection first has to be established for LTGx (to DLUD system 0) andthan for LTGy (to DLUD system 1).
The connection of LTG to LTE is shown in ...... (see Fig. 3.12.11)
34 Create test loop for cable with CCS
Link the outgoing cable with CCS from the LTU:U21 of LTGx (LTGy) to the LTEwhich is to be connected to the LTE of DLUD system 0 (DLUD system 1), if notalready done.
Red LED F2 on LTE goes out
Link F1out at the output of the LTE to F1in
Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...36N h...35
35 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU module in question.
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36 Connect LTU:U21 to the link
Open the loop and connect the LTU:U21 to the link
37 Create test loop for cable without CCS
Link the outgoing cable without CCS from the LTU:U20 of LTGx (LTGy) to theLTE which is to be connected to the LTE of DLUD system 0 (DLUD system 1), ifnot already done.
Red LED F2 goes out
Link F1out to F1in at the output of the LTE
Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...39N h...38
38 Fault clearance
First check the cable for continuity.
If no faults can be found here, replace the DIU module in question.
39 Connect LTU:U20 to the link
Open the loop and connect the LTU:U20 to the link
40 Decision: test connection to DLUD system 1
Has the connection of LTGy to DLUD system 1 already been checked? Y h...ENDN h...34
END
A30808-X3063-A403-2-7630 PROC:CP113D – 1
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3.13 Off-line Installation of CP113D
CP113D
3.13.1 Documents
The following Documents are required as references
– AKUHW Lists (Equipment Lists)
– Maintenance Manual MMN:CP113D
– Maintenance Manual MMN:PC - BASIS, Ordering no.: A30808-X3069-Y260- * -7620
– MMN:SW
– NM:CP113D
– NM:CP Devices
– Manuals required:MTDMDDPC
PROC:CP113D – 2 A30808-X3063-A403-2-7630
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3.13.2 Abbreviations
3.13.3 Test Equipment and Resources
– APS (contained on both disks)
– Multimeter (DMM)
– Scratch tapes with write ring
3.13.4 General Information about Testing CP113D
The coordination processor CP113D undergoes a system test before leaving the manu-facturing plant. The individual racks are tested to check that the voltage converters, thelogic components and the internal cabling function correctly.
a) The cables of the CP rack row are supplied as a supplementary package to the coor-dination processor and are given a system test in the rack (except when cables aresupplied later).
Abb. Meaning
B:CMY bus to common memory
B:IOC bus system for input/output control
BAP base processor
CAP call processor
CI common interface
CMY common memory
F: frame
IOC input/output control
IOP input/output processor
LMY local memory
MDD magnetic disk device
MI memory interface
MOLOC mounting location
MTD magnetic tape device
MUT mounting unit
MYB memory bank
MYC memory control
PI processor interface
PU processor unit
R: rack
A30808-X3063-A403-2-7630 PROC:CP113D – 3
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b) Once accepted by the test department, all modules are protected from unauthorizedaccess (by means of a loop secured round each individual module frame).
c) The magnetic tape device, the disk drives and the personal computers are system-tested and separately packed for delivery. The disk storage units had the test-APScopied onto them in the test department.
d) The coordination processor is checked in the system test department with a testAPS. This APS is located on both magnetic disks.
e) The CP113D installation test can begin once installation is completed. The APS onthe disks is used for system testing.
f) The CP113D is tested in the following steps:
Off-line test:
– Visual check of devices and cabling
– Preset all devices (if not already done at the factory)
– Start up the PC on-line following manufacturer's instructions (if not already doneat the factory)
– Start the fans
– Switch on power to all equipment
– Off-line diagnostics of CMY, IOC, IOP, (BAP/CAP only if faulty)
On-line test:
– Start up hardware
– Load application program system (test APS) and start operating system (APSpresent on both system disks)
– Configure the necessary operating states in the CP area
– Check the logic components and devices:common memory (CMY),base processor (BAP),input/output control (IOC)input/output processor (IOP)bus to common memory (B:CMY)magnetic tape device (MTD) andmagnetic disk device (MDD)using the appropriate test and diagnostic software
– Introduce hardware modifications if necessary
– Incorporate the current operating APS and repeat the on-line tests
g) Error messages output by the test programs are handled on the basis of the MMN.
h) Implementation of modifications according to instructions (notices are sent by themodification service). The modification guidelines must be observed. If the installa-tion tester does not carry out the modifications himself, he should at least know
PROC:CP113D – 4 A30808-X3063-A403-2-7630
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which ones are made.Any faults that occur when the modifications have been incor-porated must be eliminated with the operating APS and the MMN.
i) After each hardware modification to a device, the modification service must beinformed of the new device issue.
j) A fault report must be written on each hardware fault (for repairs and statistics).
k) Always disconnect power before unplugging modules and plugging them in again.
l) If modules with DIP switches are replaced by spares, find the correct new settingsin the MMN:CP113D - TAB.
A30808-X3063-A403-2-7630 PROC:CP113D – 5
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3.13.5 Overview of the Hardware belonging to the CP Complex
Fig. 3.13.1 Overview: Hardware belonging to the CP-Complex
CAP-5
PU0
PU1
CI
PI
LMY
PI
PU0
PU1
CI
PI
LMY
PI
PU0
PU1
CI
PI
LMY
PI
PU0
PU1
CI
PI
LMY
PI
MI
MI
PU0
PU1
CI
PI
LMY
PI
B:IOC
IOP
IOP
PU0
PU1
CI
PI
LMY
PI
B:IOC
IOP
IOP
MYB0
MYB MYB MYB1 2 3
MYC
MYB0
MYB MYB MYB1 2 3
MYC
MI
MI
CAP-0 BAP-0 BAP-1 IOC-0
IOC-1
IOC-2
IOC-3
MINIMUM Configuration
MAXIMUM Configuration
CMY-0 CMY-1
B:CMY-0
B:CMY-1
PROC:CP113D – 6 A30808-X3063-A403-2-7630
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3.13.6 Overview of Interfaces B:CMY
Fig. 3.13.2 Overview of Interfaces B:CMY
CPCIACPCIB
CPCIACPCIB
CPCIACPCIB
CPCIACPCIB
CPCIACPCIB
CPCIACPCIB
CPCIACPCIB
CPCIACPCIB
BAP-0 IOC-0 BAP-1 IOC-1 IOC-2 IOC-3 CAP-0 CAP-5
PIDATPIADR
PIDATPIADR
PIDATPIADR
PIDATPIADR
PIDATPIADR
PIDATPIADR
PIDATPIADR
PIDATPIADR
MIAD MIAD MIAD MIAD
CMYA CMYA CMYA CMYA
Control C(MYC)
Control D
Control C(MYC)
Control D
CMYD CMYD CMYD CMYD
Interface modules to the CMY
B:CMY-0 B:CMY-1
CMY-0 CMY-1
CMY
B:CMY
Only for CP113D with R:CP113B.Connection with PIDAT and PIADR as for other Processors.
Interface modules to B:CMY
Interface modules to the processors
.....
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3.13.7 Module Connectors and Numbering
Fig. 3.13.3 Module Connectors and numbering
112
113
114
116
118
120
115
117
119
1
2
3
4
5
6
7
8
129
240
1
2
3
4
5
6
7
248
AB
CD
E Backplane labelling
Rear view and numbering of a module connector in CP113D
PROC:CP113D – 8 A30808-X3063-A403-2-7630
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3.13.8 Coding Switch on Module MUH:1088
Fig. 3.13.4 Coding switch on module MUH:1088
VariantS30810-Q1088-
Capacity stage inMBYTE
Switch Settings
S1 S2 S3 S4
X200 8 ON OFF OFF ON
X400 16 ON ON OFF ON
X500 16 OFF OFF ON OFF
X600 32 ON OFF ON OFF
X800 64 ON ON ON OFF
Coding switch settings
Tab. 3.13.1 Coding switch settings
1 2 3 4
ON
MUH:1088
Coding switch
A30808-X3063-A403-2-7630 PROC:CP113D – 9
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3.13.9 Rack Overview
3.13.9.1 Rack for CP113A - Variant A
Fig. 3.13.5 Rack R:CP113A - Variant A
MUT09
MUT10
MUT05
Fuse panel, AD:RAL
MUT03
MUT04
MUT12
MUT01
CMY 0
Fans
F:CMY 0
F:CMY 1
F:P/IOC 1
CMY 1
Fanbox
BAP 1 IOC 1
FU 01 03 05 07 09 11 13 15 17 19
02 04 06 08 10 12 14 16 18 20FU
FU Frame Unit
19 --- AD:RAL,HW-Tracer
20 --- AD:RAL,HW-Tracer
02 F:CMY 0 CMY 0
12 F:CMY 1 CMY 1
07 -- Fans(AIC 1)
04 F:MI 0 BCMY 0
14 F:MI 1 BCMY 1
05 F:P/IOC 0 BAP 0
06 F:P/IOC 0 IOC 0
15 F:P/IOC 1 BAP 1
16 F:P/IOC 1 IOC 1
17 -- Fanbox(AIC 0)
F:P/IOC 0 BAP 0 IOC 0
MUT06
MUT07F:MI 1 BCMY 1
F:MI 0 BCMY 0
PROC:CP113D – 10 A30808-X3063-A403-2-7630
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3.13.9.2 Rack for CP113B - Variant A
Fig. 3.13.6 Rack R:CP113B - Variant A
MUT09
MUT10
MUT05
MUT03
MUT04
MUT12
MUT01
Fans
F:P/IOC 2
F:P/IOC 3
F:P/IOC 5
Fanbox
CAP 4 CAP 5
FU 01 03 05 07 09 11 13 15 17 19
02 04 06 08 10 12 14 16 18 20FU
FU Frame Unit
01 F:P/IOC 2 CAP 0
02 F:P/IOC 2 IOC 2
11 F:P/IOC 3 CAP 1
12 F:P/IOC 3 IOC 3
07 --- Fans (AIC 17)
03 F:PI 0 BCMY 0
13 F:PI 1 BCMY 1
05 F:P/IOC 4 CAP 2
06 F:P/IOC 4 CAP 3
15 F:P/IOC 5 CAP 4
16 F:P/IOC 5 CAP 5
17 -- Fanbox(AIC 16)
F:P/IOC 4 CAP 2 CAP 3
MUT06
MUT07F:PI 1 BCMY 1
F:PI 0 BCMY 0
CAP 1 IOC 3
CAP 0 IOC 2
A30808-X3063-A403-2-7630 PROC:CP113D – 11
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3.13.9.3 Rack for DEVD - Variant A
Fig. 3.13.7 Rack R:DEVD - Variant A
MUT06
MUT05
Fuse panel, AD:RAL
MUT03
MUT04
MUT08
MUT12
MUT01
Luftableitblech
IOPG 0
Fans
F:IOP 0
F:IOP 1
F:DEV(E)orF:DEV(F)
IOPG 1
Fanbox
MTD 0
MOD0
FU 01 03 05 07 09 11 13 15 17 19
02 04 06 08 10 12 14 16 18 20FU
FU Frame Unit
01 F:IOP 0 IOPG 0
02 F:IOP 0 IOPG 0
05 F:IOP 0 M:LAUB
06 F:IOP 0 M:LAUB
11 F:IOP 1 IOPG 1
12 F:IOP 1 IOPG 1
15 F:IOP 1 M:LAUB
16 F:IOP 1 M:LAUB
14 --- Fans(AIC 9)
03 --- MTD 0
07 F:DEV(E) orF:DEV(F)
MDD 0,MOD 0
17 F:DEV(E) orF:DEV(F)
MDD 1,MOD 1
08 -- Fanbox(AIC 8)
MDD0
MOD1
MDD1
PROC:CP113D – 12 A30808-X3063-A403-2-7630
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3.13.10 Fuse Assignment
3.13.10.1 Fuse Assignment of R:CP113A (Variant A)
3.13.10.2 Fuse Assignment of R:CP113B (Variant A)
MUT Frame FU Unit MOLOC Module
01 AD:RAL 19 External devices,e.g. tracer
20 External devices
03 F:CMY 0 02 CMY 0 C101,C327
DCCx,DCCx
04 F:CMY 1 12 CMY 1 C101,C327
DCCx,DCCx
05 FAN 07 Fans
06 F:MI 0 04 BCMY 0 C101,C327
DCCx,DCCx
07 F:MI 1 14 BCMY1 C101,C327
DCCx,DCCx
09 F:P/IOC 0 05 BAP 0 C101 DCCx
06 IOC 0 C327 DCCx
10 F:P/IOC 1 15 BAP 1 C101 DCCx
16 IOC 1 C327 DCCx
12 FANBOX 17
Tab. 3.13.2 Fuse Assignment of R:CP113A (Variant A)
MUT Frame FU Unit MOLOC Module
01 AD:RAL
03 F:P/IOC 2 01 CAP 0 C101 DCCx
02 IOC 2 C327 DCCx
04 F:P/IOC 3 11 CAP 1 C101 DCCx
12 IOC 3 C327 DCCx
05 FAN 07 Fans
06 F:PI 0 03 BCMY 0 C101,C327
DCCx,DCCx
07 F:PI 1 13 BCMY 1 C101,C327
DCCx,DCCx
09 F:P/IOC 4 05 CAP 2 C101 DCCx
06 CAP 3 C327 DCCx
10 F:P/IOC 5 15 CAP 4 C101 DCCx
16 CAP 5 C327 DCCx
12 FANBOX 17 Fans
Tab. 3.13.3 Fuse Assignment of R:CP113B (Variant A)
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3.13.10.3 Fuse Assignment of R:DEVD (Variant A)
3.13.10.4 Fuse Assignment to Fans
MUT Frame FU Unit MOLOC Module Remark
01 AD:RAL -- --
03 F:IOP 0 01 IOPG 0 C101,C331 DCCMS
02 IOPG 0 C313 DCCMR
05 M:LAUB LAUB:BLAUB:E
06 M:LAUB LAUB:DLAUB:S
04 F:IOP 1 11 IOPG 1 C101,C331 DCCMS
12 IOPG 1 C313 DCCMR
15 M:LAUB LAUB:BLAUB:E
16 M:LAUB LAUB:DLAUB:S
05 FAN 14 Fans
06 MTD 03 MTD 0
08 F:DEF(F) 07 MDD 0 A056 DCCDA F:DEV(E) orF:DEV(F) can beused alternativelyMOD 0 A049 DCCDA
17 MDD 1 A121 DCCDA
MOD 1 A115 DCCDA
08 F:DEV(E) 07 MDD 0 A001 DCCDA
17 MDD 1 A115 DCCDA
12 FANBOX 08 Fan
Tab. 3.13.4 Fuse Assignment of R:DEVD (Variant A)
Rack Fuse Fans in MUT Remark
R:CP113A FU 07 05 --
FU 17 12 FANBOX
FU19 -- External devices, e.g. tracer
FU 20 -- External devices
R:DEVD FU 14 05 --
FU 08 12 FANBOX
R:CP113B(Extension Rack)
FU 07 05 --
FU 17 12 FANBOX
Tab. 3.13.5 Fuse Assignment to Fans
PROC:CP113D – 14 A30808-X3063-A403-2-7630
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3.13.11 Overview OEM-Devices / IOPs / frames
3.13.12 Sequence for Switching on the Frames
OEM-Device IOP-type required Frame required
MTD:STC 2922 IOP:MTD
MTD:STC 2925 IOP:UNI
MTD:HP 88781 IOP:UNI
MDD M2263SA(780 MByte)
IOP:MDD F:DEV(E)
MDD HP C2490A(2,1 GByte)
IOP:MDDorIOP:UNI
F:DEV(E)orF:DEV(F)
MDD XP34550S(4,5 GByte)
IOP:UNI F:DEV(F)orF:DEV(E)
MOD Sony SMO-F531(1,3 GB)
IOP:UNI F:DEV(F)
MOD Sony SMO-F541(2,6 GB)
IOP:UNI F:DEV(F)
Tab. 3.13.6 Overview: OEM-Devices / IOPs / frames
Rack Frame MUT FU Unit Remark
R:CP113A F:MI 0 06 04 BCMY 0
F:MI 1 07 14 BCMY 1
F:CMY 0 03 02 CMY 0
F:CMY 1 04 12 CMY 1
F:P/IOC 0 09 05 BAP 0
06 IOC 0
F:P/IOC 1 10 15 BAP 1
16 IOC 1
R:DEVD F:IOP 0 03 01 IOPG 0
02 IOPG 0
05 M:LAUB
06 M:LAUB
F:IOP 1 04 11 IOPG 1
12 IOPG 1
15 M:LAUB
16 M:LAUB
Tab. 3.13.7 Sequence for Switching on the Frames
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3.13.13 Displays on Module Faceplates
3.13.13.1 Displays after successful Hardware Start-up
R:CP113B F:PI 0 06 03 BCMY 0 Extension rack
F:PI 1 07 13 BCMY1
F:P/IOC 2 03 01 CAP 0
02 IOC 2
F:P/IOC 3 04 11 CAP 1
12 IOC 3
F:P/IOC 4 09 05 CAP 2
06 CAP 3
F:P/IOC 5 10 15 CAP 4
16 CAP 5
Unit Module Display LED Remarks
4 3 2 1
B:CMY-0 BCTI none see procedure
PIDAT * *(05A131) / (05A145) in BAP-SPR the inhibit-bit remains setuntil startup is concluded
PIDAT *
PIDAT none (05A163) for IOC-0
PIDAT none (05A175) for IOC-1
B:CMY-1 BCTI none
PIDAT * *(06A131) / (06A145) in BAP-SPR the inhibit bit remains setuntil startup is concluded
PIDAT *
PIDAT none (06A163) for IOC-0
PIDAT none (06A175) for IOC-1
CMY-0 CMY 2C any none The displays on both CMY2Cs in a CMY must be identical,otherwise error. Switching power off then at the CMYconcerned may remedy the situationCMY-1 CMY 2C any none
BAP-0 CPCL xxxx Sequence on the 7-segment displays is shown in the proce-dure
*A925 After manual start-up with BAP-0
Tab. 3.13.8 Displays after successful Hardware Startup
Rack Frame MUT FU Unit Remark
Tab. 3.13.7 Sequence for Switching on the Frames
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1 Check the Basic State (Preparation) of R:CP113 and R:DEVD
Check the basic state of R:CP113A, R:DEVD and if present R:CP113B (exten-sion rack).
Ensure that the main fuses are unscrewed before starting the check
Measure the system voltage for each rack row at the last frame
The operational voltage is dependent upon the charging status of the batteries:
Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6 V... -57V)
Is system voltage -60V (-48V) present? Y h...3N h...2
2 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...1
3 Switch off DCCs
Switch off all DCCs
Check: System test log (if included)
BAP-1 CPCL xxxx Sequence on the 7-segment displays is shown in the proce-dure
*A925 After manual start-up with BAP-1
IOC-0 CPCL A 3 8 5 A1A5 is also possible
IOC-1 CPCL A 3 8 5 A1A5 is also possible
IOP IOP:TA ******CF none *Time display (not time-of-day) for several minutes
IOP:MBIBREQ
IOP:SCDV
none
IF:MDD * *H1 or H2 or none
IK:DTD none
Unit Module Display LED Remarks
4 3 2 1
Tab. 3.13.8 Displays after successful Hardware Startup
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4 Check Mechanical Layout
Check racks and module frames (R:CP113A, R:DEVD and R:CP113B ifpresent) to see if any parts are touching, or if there is any foreign material ortransport damage.
Check that all modules and cables are firmly in place
If any transport damage or damaged seals have been detected, the rack layout(R:CP113A and R:DEVD or R:CP113B) has to be checked against the equip-ment list.
Check the layout of the module frames and the standard cabling plan
Break module seal
Check connections between wire wrap field and chassis ground bus.
Check cabling against cable laying list A30808-A....-X...- * -33
5 Check Memory Settings
Check that the memory settings on all MUH:1088 modules are correct.
Unplug module MUH:1088 from all mounting locations.
The module contains a coding switch for adapting memory addressing to thepossible equipment variants.
Check switch settings of the coding switch on the MUH:1088 modules andcorrect if necessary
Coding switch and the correct switch settings are given in ...... (see 3.13.8)
6 Check the Jumpering in F:MI0
Check the following wire wrap connections:
• From MOLOC 277 PIN E 212 to MOLOC 277 PIN C 212
• From MOLOC 285 PIN E 212 to MOLOC 285 PIN C 212
7 Test Fans
Screw in the fuses for the fans consecutively and turn fan switches on
The assignment of fuses to the fans is given in ...... (see Tab.3.13.5)
Are all fans working? Y h...9N h...8
8 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...7
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9 Switching on the MTD
Branch to one of the following procedures for switching on the MTD according tothe MTD used:
– Switching on the MTD: STC 2922 of Storage Tek(Connected to IOP:MTD) i....PROC:
MTD_STC2922
– Switching on the MTD: STC 2925 of Storage Tek(Connected to IOP:UNI / SCSI-Interface) i....PROC:
MTD:STC2925
– Switching on the MTD: HP 88781 A of Hewlett Packard(Connected to IOP:UNI / SCSI Interface) i....PROC:
MTD:HP88781A
– After the MTD is successfully put into service, continue: h...10
10 Check Cabling of Disk Storage Unit (MDD)
The following different types of MDD can be used for the CP113D:
• Quantum Atlas Disk storage Unit XP34550S (4,5GByte)
• HP Disk storage Unit HP C2490A (2,1Gbyte)
• Fujitsu Disk storage Unit M2263SA (780 Mbyte)
Check that interface cables to the IOP:MDD / IOP:UNI are connected accordingto the following instructions:
– If Quantum Atlas disk storage unit XP34550S (4,5Gbyte) is used(Connected to IOP:UNI / SCSI-Interface) i....NM:CP -
Devices, MDDXP34550S(4,5 Gbyte)
– If HP disk storage unit MDD HP C2490A (2,1Gbyte) is used(Connected to IOP:MDD or IOP:UNI) i....NM:CP -
Devices, MDDHP C2490A(2,1 Gbyte)
– If Fujitsu disk storage unit MDD M2263SA (780 Mbyte) is used(Connected to IOP:MDD) i....NM:CP -
Devices,MDD M2263SA(780 Mbyte)
No transport safety catches (bolts etc.) have to be removed in this disk genera-tion.
Have one or both disk memories (MDD) been replaced or supplied after theoriginal installation? Y h...11
N h...12
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11 Check Switch Settings of Disk Storage Unit (MDD)
Check that switch settings are set according to the following instructions:
– If Quantum Atlas disk storage unit XP34550S (4,5Gbyte) is used i ...NM:CP -Devices, MDDXP34550S(4,5 Gbyte)
– If HP disk storage unit MDD HP C2490A (2,1Gbyte) is used i ...NM:CP -Devices, MDDHP C2490A(2,1 Gbyte)
– If Fujitsu disk storage unit MDD M2263SA (780 Mbyte) is used i ...NM:CP -Devices,MDD M2263SA(780 Mbyte)
12 Check Cabling of MODs (Only in F:DEV(F))
Check the following cable connections of the MODs:
• Correct attachment of the power supply plug to the MOD
• Correct attachment of the power supply plug to the MOD-fan
• Correct attachment of the SCSI bus cabling
For MOD Sony SMO-F531 (1,3 GB): check these cable connections accordingto the instructions in
......NM:CP -Devices,MOD SonySMO-F531
For MOD Sony SMO-F541 (2,6 GB): check these cable connections accordingto the instructions in
......NM:CP -Devices,MOD SonySMO-F541
13 Check Settings of the MODs (Only in F:DEV(F))
Check the following settings of the operation mode plug of the MODs:
• Check the setting to the correct SCSI address (SCSI-ID 2)
• Check the correct jumper setting in the operation mode plug for deactivatingthe internal terminating resistor (Depending on the SCSI devices connected)
For MOD Sony SMO-F531 (1,3 GB): check these settings according to theinstructions in
......NM:CP -Devices,MOD SonySMO-F531
For MOD Sony SMO-F541 (2,6 GB): check these settings according to theinstructions in
......NM:CP -Devices,MOD SonySMO-F541
14 Screw in Fuse
Screw in fuse for MDD-0 (and MOD-0 in F:DEV(F))(One fuse supplies the DCCs of both devices)
...... (see Tab.3.13.4)
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15 Switch on MDD-0
Switch on DCC for MDD-0 ......(see Tab.3.13.4)
LED of the DCC lights up
LED of the MDD lights up for approx. 30 s
16 Switch on MOD-0 (Only in F:DEV(F))
Switch on DCC for MOD-0 ......(see Tab.3.13.4)
LED of the DCC lights up
MOD fan starts up
MOD-LED lights up shortly
17 Screw in Fuse
Screw in fuse for MDD-1 (and MOD-1 in F:DEV(F))(One fuse supplies the DCCs of both devices)
......(see Tab.3.13.4)
18 Switch on MDD-1
Switch on DCC for MDD-1 ......(see Tab.3.13.4)
LED of the DCC lights up
LED of the MDD lights up for approx. 30 s
19 Switch on MOD-1 (Only in F:DEV(F))
Switch on DCC for MOD-1 ......(see Tab.3.13.4)
LED of the DCC lights up
MOD fan starts up
MOD-LED lights up shortly
20 Installation of PC
Information about the inverter:The 220V outputs of the inverter (220V, 1KVA and 2,5KVA) are floating. If testdevices are supplied by the inverter, electrostatical charging or grounding loopsmay lead to faulty test results or defects.Remedy: Grounding one line of the 220V output, before switching on theinverter (If not already done by the manufacturer).
Switch on the inverter for the PC.
Installation of the PC according to ......MMN:PC -BASIS
– After the PC has been installed and a CP session opened h...21
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21 Prepare Switching on DCCs
Put all inhibit bit switches in module faceplates (on PIDAT, BCTI) in ON position(up). Put the TEST switches on the faceplates of the CPCL modules (in BAP0/1and IOC0/1) up to the ON position.
Make sure that all DCCs of the CP113D are switched off
22 Switch on DCCs
A distinction is drawn between the capacity stages of the CP113Ds. Because ofclock synchronization the module frames are tested in the following sequence : ...... (see Tab.
3.13.7)
Screw in fuse for the first (next) module frame (see preceding table).
Switch on power with the switch on the assigned DCC module faceplates.
Caution: If there are several DCCs in one MI, CMY or IOP module frame, theswitches of all these DCCs must be switched on.
Are the green LEDs on the DCC modules lit? Y h...23N h...24
23 Decision: Next Modules
Are all units listed in the table in operation? Y h...32N h...22
24 Fault Clearance
Switch off the voltage converter(s) immediately and unscrew the assigned fuse
25 Check the Fuse for DCC
Is the corresponding fuse in the fuse panel defective? Y h...26N h...27
26 Replace Fuse
Replace the fuse in the fuse panel h...22
27 Decision Block: DCC
Has the current converter already been replaced? Y h...29N h...28
28 Replace DCC
Replace the DCC with spare DCC
Mark the replaced DCC as defective h...22
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29 Decision Block: Cable
Is a cable the next unit to be cleared of faults? Y i....NM:CP113D, TAB,CP0050
N h...31
30 Decision Block
Could the fault be cleared? Y h...22N h...31
31 Special Fault Clearance
The fault could not be cleared by standard fault clearance measures. A systemspecialist must carry out fault clearance.
– After successful fault clearance h...22
32 Diagnosis 0 CMY
The off-line diagnostics must be carried out on both CMYs one after the other.
Set the inhibit bit switches for the CMY to be tested on the BCTI modules ofboth B:CMYs to the ON position
Press the DIAG key on the CMY to be tested
Diagnostic 0 is started and indicated by LED DIAG0. On completion, if no errorshave been found, 5AAA is displayed.
Is 5AAA displayed? Y h...34N h...33
33 Fault Clearance
– Fault clearance according to i....NM:CP113D,TAB, CP053
– After successful fault clearance h...32
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34 Diagnosis 2 CMY
Press RESET key on the CMY to be tested
The display shows E-01 (- = dark) and the DIAG0 LED goes out.
Press DIAG key on the CMY to be tested
Diagnostic 2 is started and indicated by the LED DIAG2. On completion, if noerrors have been found, 5AAA is displayed.
Diagnostic 2 can be restarted by pressing the DIAG key again. Diagnostic 3 canonly be started if diagnostic 2 ends with an error. Press the RES key again(display then shows E-02) to start diagnostic 0 again.
Is 5AAA displayed? Y h...35N h...36
35 Decision: Next CMY
Switch the inhibit-bit switches for the tested CMY in the BCTI modules of bothB:CMYs to OFF
Have off-line diagnostics been performed on both CMYs? Y h...37N h...32
36 Diagnosis 3 CMY
Press RESET key on the CMY to be tested
The display goes dark and the DIAG2 LED goes out.
Press DIAG key on the CMY to be tested
Diagnostic 3 is started and indicated by the LEDs DIAG0 and DIAG2.
Diagnostic 3 can be restarted by pressing the DIAG key again.
– Analyze track numbers and carry out fault clearance according to i ...NM:CP113D,TAB, CP053
– After successful fault clearance h...35
37 Off-line Diagnostics IOC
Perform off-line diagnostics in both IOCs, and for further IOCs in the extensionframe R:CP113B, if present.The TEST switch (down = OFF) on the CPCL module is used to switch off thesupervisory circuit (comparator).The TEST switch should only be put in the OFF position during fault clearancefor test purposes.
The BOOT or RES key triggers a RESET in the IOC.
Diagnostics are started by pressing the RES and BOOT keys simultaneously.
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The display is changed with the DIAG switch.
• Switch ON (up): The part of the diagnostic register belonging to the leadingprocessor half within the IOC is displayed.
• Switch OFF (down): The part of the diagnostic register belonging to thesecondary processor half within the IOC is displayed.
The contents of the diagnostic registers are the same if PU-0 and PU-1 in anIOC come to the same result during an audit.
Press RES key
Press RES and BOOT keys simultaneously
Off-line diagnostics are started. If executed without error, x55x appears in thedisplay. (x has no significance for the analysis).
Is x55x displayed? Y h...39N h...38
38 Fault Clearance
Analyze the track numbers
Carry out fault clearance according to i....NM:CP113D,TAB, CP052
– After finishing fault clearance h...39
39 Decision: Next IOC
Have off-line diagnostics already been performed on all IOCs? Y h...40N h...37
40 Off-line Diagnostics IOP
These off-line diagnostics must be run on all IK:DTD and IOP:SCDV modules.
When the off-line diagnostics are started on module IK:DTD, the MDD must beswitched on for the IOP:MDD and the MTD for the IOP:MTD. A tape must alsobe mounted in the MTD, and the device must be switched on-line.
The PC must be ready for operation (a printer may not benecessary)
Start the off-line diagnostics with the DIAG key on the faceplate of modulesIK:DTD and IOP:SCDV.
Track numbers of the RESET test are indicated by way of LEDs.The LEDs go dark for 1 second on completion of the RESET test.The IOP type is displayed for 1.5 secs.:
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The track numbers of the test/diagnostic programs are then displayed.Following error-free execution, the LEDs on the IOP:MDD, IOP:MTD and theIOP:SCDX go dark again.The LEDs of the IOP:SCDV, however, light up.
Performing SCDV diagnostics is only possible if the firmware of moduleIOP:SCDV is not issue G5.
Start off-line diagnostics by pressing the DIAG key on the faceplate of moduleIOP:SCDV.
Track numbers of the RESET test are indicated by way of LEDs.The LEDs go dark for 1 second on completion of the RESET test.The IOP type is displayed for 1.5 secs.:
LED display goes dark for 1 secondThe track numbers of the test/diagnostic programs are then displayed.Following error-free execution, the LEDs on the IOP:SCDV, light up.
The printer and the screen of the PC output the following:CP113 off-line diagnosticsPlease enter the following characters:ASDFGHJKL
Enter the string 'ASDFGHJKL' on the PC and confirm with <ENTER>
CP113 off-line diagnostics passedLEDs on the SCDV module go out
Off-line diagnostics terminated without error? Y h...42N h...41
41 Fault Clearance
Analyze the LED display
Carry out fault clearance according to i ...NM:CP113D,TAB, CP054
– After finishing fault clearance h...42
LED display IOP type
D3 D2 D1 D0
1 0 1 0 IOP:MTD
1 0 0 1 IOP:MDD
- 0 1 1 IOP:SCDX
LED display IOP type
D3 D2 D1 D0
- 0 1 1 IOP:SCDV
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42 Off-line Diagnostics IOP:TA
Press DISPLAY key in module faceplate of IOP:TA.
The following can be checked by pressing the DISPLAY key in the faceplate ofmodule IOP:TA:
• Press key down = (off-line) the displays are checked.
• Key up = (on-line) the time is displayed.
Press the DIAG key in the faceplate of module IOP:TA.
Diagnostics are started. On completion without error, the display goes darkagain for a short time.
Off-line diagnostics terminated without error? Y h...44N h...43
43 Fault Clearance
Analyze the LED display
Carry out fault clearance according to i....NM:CP113D,TAB, CP054
– After finishing fault clearance h...44
44 Decision: IOPAUC
The IOPAUC is only used in CP113 of AC (authentication center)
Is there at least one IOPAUC in use Y h...45N h...47
45 Off-line diagnostics of IOPAUC
Press the RESET key on the front panel of the IOPAUC module
The progress of the test is indicated via the LEDs of the IOPAUC
– For evaluating the LED displays of the IOPAUC see i....NM:CP113D, TAB,CP0054
Has the diagnostics ended without faults? Y h...47N h...46
46 Fault clearance
Carry out fault clearance according to i....NM:CP113D, TAB,CP0054
– After successful fault clearance h...47
47 Prepare BAP Hardware Start-up
Flick all inhibit-bit switches to OFF
Switch off the DCCs connected to BAP-0 and BAP-1, if not already done
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48 Information about BAP Hardware Start-up
When the DCCs have been switched on, the initialization and test programs inthe individual processors are run (hardware start-up). Track numbers aredisplayed which give information on the type of error if one occurs.The BAP to which power is first applied becomes the MASTER, as long as thisBAP is error-free.
For start-up with the APS, it is necessary for the following units to be connectedto a B:CMY (displayed by reset inhibit bits (SPB LED = off)):
• one BAP (SPB LED on module PIDAT A131 or A145)
• one IOC (SPB LED on module PIDAT A163 or A175)
• one CMY (SPB LED on module BCTI)
Ensure that the following IOPs can be reached via the IOC connected to theB:CMY, and that they have the status shown in the table:
• one IOP:MDD
• one IOP:SCDV (for connection of the PC)
The BAP that becomes MASTER formats both CMYs first. Display on master:A885' for approx. 5sec.
It then initializes BCMY0/1, and IOC0/1Display: 'A8A5',...,'A8C5',...,'AB05'
When 'AB05' is displayed, the test APS is already being loaded from one of thedisks (MDD0 or MDD1). This can be seen by the rhythmic flashing of one of theLEDs. (module IF:MDD H1-reading from MDD).
Displays on the other module faceplates after initialization, if no errors are foundin the processors during hardware start-up are given in:
...... (see Tab.3.13.8)
49 Switch on BAP0 and BAP1
Screw in the fuses for the DCCs of BAP-0 and BAP-1
Switch on DCCs in BAP0 and BAP1
Are the green LEDs on both DCC modules lit? Y h...58N h...50
50 Fault Clearance
Switch off the DCC on which the LED is not lit immediately and unscrew therelevant fuse. After a successful test start-up, remove the fault from the defec-tive unit with the test APS (provided a BAP can load the APS).
– If only one BAP is defective, continue h...58– If both BAPs are defective, the errors must be removed immediately h...51
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51 Check the Fuse for DCC
Is the corresponding fuse in the fuse panel defective? Y h...52N h...53
52 Replace Fuse
Replace the fuse in the fuse panel h...49
53 Decision Block: DCC
Has the current converter already been replaced? Y h...55N h...54
54 Replace DCC
Replace the DCC with spare DCC
Mark the replaced DCC as defective h...49
55 Decision Block: Cable
Is a cable the next unit to be cleared of faults? Y i....NM:CP113D, TAB,CP0050
N h...57
56 Decision Block
Could the fault be cleared? Y h...49N h...57
57 Special Fault Clearance
The fault could not be cleared by standard fault clearance measures. A systemspecialist must carry out fault clearance.
– After successful fault clearance h...49
58 Decision: Start-up with Test APS Possible
Has the system been configured to allow start-up with the test APS? Y h...87N h...59
59 Decision: BAP-0/-1 already Reset
Has the firmware been reinitiated in processor BAP-0/1 by means of the BOOTkey on the faceplate of module CPCL? Y h...60
N h...61
60 Analyze Inhibit-bit LEDs
Analyze the inhibit-bit LEDs and eliminate errors using i....MMN:CP113D- FC
– When errors have been successfully eliminated h...47
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61 Decision: SPB0 and SPB1 Lit
Are the red SPB, SPB0 and SPB1 LEDs lit on the faceplates of modules BCTIand PIDAT (F:MI 0, F:MI 1)? Y h...63
N h...62
62 Check DCCs
Check that all DCCs have power “ON”
63 Decision: Inhibit-bit Switches
Is the corresponding inhibit-bit switch SPB still ON? Y h...64N h...65
64 Inhibit-bit Switch
Flick corresponding inhibit-bit switch (SPB, SPB0 or SPB1) to OFF h...47
65 Decision: Other BAP MASTER
The inhibit-bit has been set by the firmware
– If no start-up with the other BAP as MASTER has been attempted the start-up has to be repeated with switching on the DCCs of BAP-0 and BAP-1 in adifferent order h...47
– If a start-up with the other BAP as MASTER has already run through amanual start-up must be attempted h...66
66 Manual Start-up Part 1
BAP-0 becomes master if the inhibit-bit switch in BCMY-0 and BCMY-1 onmodule PIDAT (mounting location 145) is put ON (up).BAP-1 becomes master if the inhibit-bit switch in BCMY-0 and BCMY-1 onmodule PIDAT (mounting location 131) is put ON (up).BAP-0 becomes master with the procedure described below. If you want BAP-1to be master, set the inhibit-bit switch accordingly and press the BOOT key onmodule CPCL in BAP-1.
Flick the inhibit-bit switch to ON (up) in BCMY-0 and BCMY-1 on module PIDAT(mounting location 145).
Related LEDs on the modules light up
Press BOOT key on faceplate of module CPCL in BAP-0.
When the DCCs have been switched on, the initialization and test programs(hardware start-up) run in the individual processors. Track numbers aredisplayed which give information on the type of fault if a fault occurs. The BAP-0becomes MASTER.
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For start-up with the APS, it is necessary for the following units to be connectedto a B:CMY (displayed by reset inhibit bits (SPB LED = off)):
• one BAP (SPB LED on module PIDAT A131 or A145)
• one IOC (SPB LED on module PIDAT A163 or A175)
• one CMY (SPB LED on module BCTI)
Ensure that the following IOPs can be reached via the IOC connected to theB:CMY, and that they have the status shown in the table:
• one IOP:MDD
• one IOP:SCDV (for connection of the PC)
Displays on the module faceplates when the BOOT key has been pressed, if noerrors have been found in the processors during hardware start-up: ......(see Tab.
3.13.8)
Has the system been configured so that start-up with the test APS is possible? Y h...68N h...67
67 Decision: Manual Start-up with second BAP
– Repeat manual start-up with second BAP, if not already done h...66– If the manual start-up has already been attempted with the second BAP, off-
line diagnostics must be executed h...82
68 Manual Start-up Part 2IPL113: MANUAL START - CURRENT CONFIGURATION
UNIT STATUS TEST
********************************************
BAP-0 ost Test result
BAP-1 ost Test result
B:CMY-0 ost Test result
B:CMY-1 ost Test result
CMY-0 ost Test result
CMY-1 ost Test result
IOC-0 ost Test result
IOC-1 ost Test result
IPL113: ENTER PARAMS
TO DIAGNOSE MEMORY : “DIAG;”
TO FORMAT MEMORY : “FORMAT;”
TO CONTINUE : “;ETX”
Is the preceding message output? Y h...73N h...69
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69 Decision: Check IOP:SCDV/Cabling to PC
Have the switch settings on module IOP:SDCV and the cable connection to thePC already been checked? Y h...70
N h...71
70 Decision: Manual Start-up with second BAP
– Repeat manual start-up with second BAP, if not already done h...66– If the manual start-up has already been attempted with the second BAP, off-
line diagnostics must be executed h...82
71 Check Cabling to PC
Check and if necessary replace connecting cable to the PC or change plug posi-tion
72 Check Switches on IOP:SCDV
Check and if necessary adjust the switches on module IOP:SCDV. Themounting location for this IOP can be found in the exchange configuration docu-ments. The location and setting of the switches can be found in: ......MMN:CP113D
- TAB
Switch off power at the switch on the DCC faceplate in the IOP module frame.
To connect the PC to the IOP:SCDV, check and if necessary adjust the settings.
Switch on power again h...47
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73 Manual Start-up Part 3
Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS
TO START APS MANUALLY : “MANUALLY;”
TO START INSTALLAT.RECOV : “INSTALLATION;”
TO START UTILITY(MONITOR) : “UTILITY;”
TO STOP INITIAL START : “STOP;”
TO START APS AUTOMATICALLY: “;ETX”
Enter “MAN;” and press <ENTER>IOC-0 MDD : BZS/AKD AND GENERATION LIST
IOC-1 MDD : BZS/AKD AND GENERATION LIST
The current generation list is output:
xxxxxxxxxxxxxx
99999999 xxxxxxxxxxxxxxxxxxxxx
MANUAL RECOVERY - LOADING VIA IOC : “IOC-0;/IOC-1;”
Enter “IOC-0;” or “IOC-1;” and press <ENTER>LOAD.DEV. - *MDD* -GENERATION TO LOAD :”NAME;” (8 CHAR)
Enter the current APS generation 8 characters (in APS documentation or at theplace marked 9999999 in the generation list printed out previously).
Enter 'Generation-No.' and press <ENTER>
If the APS version is unknown and cannot be found out, enter *. For safetyreasons this must be repeated 3 times after system enquiry.
MANUAL RECOVERY - LTG LOADING : “Y;/N;”
Enter "N;" and press <ENTER>
Flick inhibit-bit switch in BCMY-0 and BCMY-1 on module PIDAT (mountinglocation 145) to OFF (down).
Related LEDs on the modules go out
Manual start-up is initiated.
The track numbers to be run through on the module CPCL in the BAP masterare shown in block: ......(see 87)
To make things clearer, only the headline is given for the system messages.
Wait for the following system message:ALL DOUBLE FILES SYNCHRONIZED
Was the manual start-up with the test APS successful? Y h...89N h...74
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74 Decision: Manual Start-up with other BAP
Has the manual start-up been attempted with another BAP? Y h...76N h...75
75 Boot Key
Press BOOT key of other BAP and repeat manual start-up h...66
76 Decision: Manual Start-up via IOC-1
Branch to one of the following blocks
– Repeat manual start-up via IOC-1, if not already done h...66– If manual start-up via IOC-1 has already been attempted h...77
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77 START/UTILITY
When working with the IMON, ensure that the PC can be reached via the IOCspecified in the Start Utility.
Press BOOT key in BAP-0IPL113: MANUAL START - CURRENT CONFIGURATION
UNIT STATUS TEST
********************************************
BAP-0 ost Test result
BAP-1 ost Test result
B:CMY-0 ost Test result
B:CMY-1 ost Test result
CMY-0 ost Test result
CMY-1 ost Test result
IOC-0 ost Test result
IOC-1 ost Test result
IPL113: ENTER PARAMS
TO DIAGNOSE MEMORY : “DIAG;”
TO FORMAT MEMORY : “FORMAT;”
TO CONTINUE : “;ETX”
– If the preceding message did not appear h...69Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS
TO START APS MANUALLY : “MANUALLY;”
TO START INSTALLAT.RECOV : “INSTALLATION;”
TO START UTILITY(MONITOR) : “UTILITY;”
TO STOP INITIAL START : “STOP;”
TO START APS AUTOMATICALLY: “;ETX”
Enter “UTI;” and press <ENTER>UTILITY - RECOVERY - DEVICE - TYPE TO USE : “MDD;/MTD;”
Enter “MDD;” and press <ENTER>UTILITY - RECOV. - LOAD FROM MDD VIA : “IOC-0;/IOC-1;”
Enter “IOC-0;” or “IOC-1;” and press <ENTER>PLEASE ENTER UTILITY - FILE - NAME
Acknowledge this message with “SY.INSTALL”IMON : V0031 START
IMON : ENTER COMMAND
Was it possible to start IMON? Y h...79N h...78
78 Fault Clearance
Check connection of MDD to IOP:MDD against the cable laying list.
Check switch settings and cable connections in the MDD against the manufac-turer's documentation.
– After successful fault clearance h...47
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79 Display Disk Contents
Display disk contents with the following commands:DISP MDDIR:DEVIN=010E01; (for MDD-0)
DISP MDDIR:DEVIN=030E01; (for MDD-1)
All disk files of MDD-0 (MDD-1) are displayed
Branch to one of the following blocks according to the files displayed
– If all system files are present continue h...80– If not all system files are present the files must be copied again from tape to
disk. System test with test APS must be omitted h...93
80 Decision: BAP Off-line Diagnostics
Have BAP off-line diagnostics been carried out? Y h...81N h...82
81 Branch according to Off-line Diagnostics
– If all off-line diagnostics have been terminated without error, one or moresystem files have probably been destroyed. In this case the test with the testAPS must be omitted h...93
– Otherwise h...21
82 Prepare BAP Off-line Diagnostics (Special Fault Clearance)
Off-line diagnostics must be performed on both BAPs.
Flick the TEST switch on module CPCL to OFF to switch off the supervisorycircuit. It should only be switched OFF for test purposes. Diagnostics cannot beinitiated by MML or key when the supervisory circuit is switched off.
Initiate hardware start-up with the BOOT key on the CPCL module. The BAP inwhich the BOOT key was pressed becomes the master.
Reset the processor with the RES key.
Start diagnostics by pressing the RES and BOOT keys simultaneously.
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Change the display with the DIAD switch.
• When the switch is ON (up), the part of the diagnostic register that belongsto the leading processor half (PU) in the BAP is displayed.
• When the switch is OFF (down) the part of the diagnostic register thatbelongs to the secondary processor half (PU) in the BAP is displayed.
The contents of the diagnostic registers are the same if the PU-0 and PU-1 in aBAP come to the same result in the audit.
Switch off the DCCs connected to BAP0/1
For the off-line diagnostics in the BAPs, disconnect the start-up lines and put thecorresponding PINs in the multilayer to 0 V.
Disconnect the start-up lines shown in the following table:
Insert the following links:
Switch on DCCs connected to BAP0/1
An initialization program runs in both BAPs
Is 'A435' displayed in at least one BAP? Y h...84N h...83
83 Special Fault Clearance
Carry out special fault clearance according to i....NM:CP113D,TAB, CP052
– After finishing special fault clearance h...47
Rack Frame MUT MOLOC
R:CP113A P/IOC0 09 D179P3
D179P4
P/IOC1 10 D179P3
D179P4
Rack MUT from to
MOLOC PIN MOLOC PIN
R:CP113A 09 179 A248 179 C248
10
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84 Start BAP Off-line Diagnostics
Start diagnostics in the BAP with the correct display ('A435') by pressing theRES and BOOT keys simultaneously.
Off-line diagnostics are started. On termination without error, xAAx is displayed.(x has no significance for the analysis).
Is xAAx displayed? Y h...86N h...85
85 Fault Clearance
Analyze the track numbers and clear faults using i ...NM:CP113D,TAB, CP052
– After successful fault clearance h...47
86 Check Internal Cabling
The BAP(s) is/are OK. The fault is in the cabling between BAP-0/1 and BCMY-0/1, or in the cabling between BCMY-0/1 and CMY-0/1 or in the CMY-0/1.
Check the internal cabling of the R:CP113A against the cable laying list
– If any faults have been found in the internal cabling, remove faults andcontinue h...47
– If no faults have been found in the internal cabling, evaluate and clear faultsaccording to i ...NM:CP113D,
TAB, CP052
– After successful fault clearance h...47
87 Software Start-up with test APS
Software start-up is initiated as soon as the display of the CPCL module of theBAP master changes from 'Axx5' to 'Bxx4'. (xx - different track points of start-up)
The following track points run trough:
– ‘Bx34‘
– ‘Bx54‘
– ‘Bx74‘
– ‘Bx94‘
or: ‘Dxx2‘ or ‘Exx1‘ (changes every 4 s)(xx-arbitrary, with:
– 'Dxx2' the call processing load is shown in Erl.
– 'Exx1' the entire processor load in percent)
Have the track points shown above been run trough? Y h...88N h...66
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88 System Messages
To make things clearer, only a headline is given for system messages.
If startup with test APS was successful the following message is output:ALL DOUBLE FILES SYNCHRONIZED
Wait for system message
Branch to the following blocks according to the system reaction:
– ALL DOUBLE FILES SYNCHRONIZED is displayed h...89– Any other message is displayed h...66– No message is displayed h...71
89 Enter USER-ID and Password
USER-ID and password will be interrogated.For the first OMT “EWSD0” and for further OMTs “EWSD1”, “EWSD2”,“EWSD3” has to be entered as USER-ID.The password is “SYSTEM-1”.(All inputs in capital letters)
Enter USER-ID and password
90 Enter Date and Time
Enter date and time:
b ENTR TIME:DATE=yy-mm-dd,TIME=hh-mm-ss,WD=xx;
Secure time:
b CORR TIME:MODE=SECURE;
91 Check Fan Alarms
Switch off the individual fans in each fan module by the switches on themodules. After about 5 secs. this is logged on the printer.
System message fan alarm
Switch on fans again (do not wait for longer than 5 mins.)
Was it possible to generate this message from each fan module? Y h...93N h...92
92 Check Alarm Lines
Check alarm lines from the fan modules to the IOP:TA against cabling list and ifnecessary perform special fault clearance IOP:TA according to the MMN.
– After finishing fault clearance h...91
!Caution:Do not leave the fans switched off for longer than 5 mins. as racks warm up rapidly, endangering compo-nents.
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93 Install Hardware APS
The term Hardware APS indicates that the APS contains only the data of thehardware which is present in the exchange and no routing-, zoning-, orsubscriber-data.
The following is necessary before installing the hardware APS:
• error-free configuration of CP113D with the test APS
• APS documentation
Observe the notes in the APS documentation supplied.
Note:The APS installation is to be carried out according to procedure SW140 (if deliv-ered on Tape) or according to procedure SW141 (If delivered on MOD).
Install the APS, using one of the following procedures (According to the mediumon which the APS is delivered).
– For APS delivered on tape h...NM:SW,PROC:SW140
– For APS delivered on MOD h...NM:SW,PROC:SW141
END
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A30808-X3063-A403-2-7630 PROC:MTD_STC2922 – 1
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3.14 Switching on MTD STC 2922 of Storage Tek
MTD_STC2922
3.14.1 Introduction
• The scope of delivery of the magnetic tape device STC 2922 of Storage Tek containsa user manual.
• MTD-fault clearance should only be carried out by especially trained personnel.
1 Basic test Magnetic Tape Device STC 2922
Check that interface cables to the IOP:MTD are connected according to ......NM:CP -Devices,MTD:STC 2922
Open the door of MTD
Turn POWER switch to OFF
Unscrew the cover of MTD module frame (using special tool Torx 15) andremove foam rubber in front of the modules.
Unplug the IFP module of the MTD
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The switch settings must be checked or set according to ......NM:CP -Devices,MTD:STC 2922
Reconnect the IFP module
Replace the foam rubber in front of the modules and screw on the cover of theMTD module frame
Open the cover of the tape path
Before testing the MTD, cleaning must be carried out according to the instruc-tions given in
......MMN:CP113,MAINT:MTDSTC 2922
The cleaning should be recorded in a copy of the maintenance list which accom-panies the MMN. The list should be attached to the door of the rack.
If the cover does not close tightly due to a physical defect, the magnetic tape willnot be automatically threaded. In this case spare catches must be obtained andexchanged. ......MMN:CP113,
MAINT:MTDSTC 2922
Close the cover of the tape path
Switch on the main supply switch at the rear of the MTD, if not already done
The location of the main supply switch is given in: ......NM:CP -Devices,MTD:STC 2922
!Observe the EGB regulations
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2 Switch on Magnetic Tape Device
A short self-test is carried out after switching on the power. Operating or hard-ware faults are shown on the MTD display. An explanation of the fault numbersis to be found on the inside of the MTD door, or in Section "INTF FCD" (FaultCode Dictionary 2921&2922 with Industry standard Interface) of the manual thatis supplied.
The tape leader must be cleanly cut, i.e. not have a plastic threading end (cut offwith a special tool) as this prevents the tape from being guided when it isthreaded in. If automatic tape threading is not possible, e.g. at altitudes over1.800m, it must be threaded by hand. Manual threading is started by pressingthe LOAD-REW key twice. The magnetic spool must be turned so that the tapeis inserted into the suction opening. If SHUT DOOR is displayed on the MTD,ensure that the MTD door is properly closed.
Screw in fuse 3 for MTD (in R:DEVD)
Close MTD door
Put POWER switch to ON position
If the self-test completes without finding a fault, - - - - is displayed.
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3 Diagnose Magnetic Tape Device
The following inputs relate to the MTD keyboard
Press the <ENTER ADDR> key, enter '1 F F A' and then press <ENTER>(Request the firmware version)
D1 is shown in the MTD display
Press <ENTER>
'16' or '17' appears on the MTD display
MTDs with FW < D1 16 may not be used.
Open the MTD door
Insert a fault-free empty tape with a write enable ring, but do not load (ScratchTape)
Press <ENTER DIAG> enter '1 0' and then press <ENTER>
The last input starts the complete MTD device diagnostics. The magnetic tape isautomatically loaded after internal checks are carried out. Read/write tests withboth recording densities are then made. After a positive run the diagnostics endwith - - - - on the display. If there is a fault, a fault number is displayed. Detailsabout the cause of the fault together with fault numbers are listed in the STCManual, Section "INTF FCD" (Fault Code Dictionary 2921&2922 with Industrystandard Interface) . Fault clearance is explained in the section for Mainte-nance, Removal/Replacement, Diagnostics in the STC Manual.
Is - - - - displayed after the diagnostics? Y h...5N h...4
4 Fault clearance
Carry out fault clearance as described in STC Manual, sections Maintenance,Removal/Replacement, Diagnostics
– After successful fault clearance h...5
5 Check Tape
Open MTD door
The following test overwrites any files that may exist!
Press the door contact (below left) with a pen or any other suitable tool and holdit down
Press <ENTER DIAG>, enter 'D' and then press <ENTER>
The tape is written to with higher recording density 6250 BPI and read in theREAD AFTER WRITE MODE. MTD Display: @D
'@D' appears in the MTD display
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The following 2 system responses are possible:
• If the magnetic tape is fault-free, it is wound back when the end-of-tape mark(EOT) is recognized.
• If the magnetic tape is faulty it is stopped after 5 faults. MTD display: ODC(In this case the tape cannot be used)
Is the tape fault-free? Y h...6N h...7
6 Unload fault-free tape
Unload tape and remove it
Remove pen (or tool) from the door contact.
Close the MTD doorReturn to calling procedure
7 Unload faulty tape
Rewind tape
Unload tape and remove it
Tape must not be used anymore
Remove pen (or tool) from the door contact.
Close the MTD doorReturn to calling procedure
END
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A30808-X3063-A403-2-7630 PROC:CP113C/CR – 1
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3.15 Off-line Installation of CP113C/CR
CP113C/CR
3.15.1 Documents
The following Documents are required as references
– AKUHW Lists (Equipment Lists)
– Maintenance Manual MMN:CP113C/CR
– Maintenance Manual MMN:PC - BASIS, Ordering no.: A30808-X3069-Y260- * -7620
– MMN:SW
– NM:CP113C/CR
– NM:CP-Devices
– Manuals required:MTDMDDPC
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3.15.2 Abbreviations
3.15.3 Test Equipment and Resources
– APS (contained on both disks)
– Multimeter (DMM)
– Scratch tapes with write ring
3.15.4 General Information about Testing CP113C/CR
The coordination processor CP113C/CR undergoes a system test before leaving themanufacturing plant. The individual racks are tested to check that the voltageconverters, the logic components and the internal cabling function correctly.
a) The cables of the CP rack row are supplied as a supplementary package to the coor-dination processor and are given a system test in the rack (except when cables aresupplied later).
Abb. Meaning
B:CMY bus to common memory
B:IOC bus system for input/output control
BAP base processor
CAP call processor
CI common interface
CMY common memory
F: frame
IOC input/output control
IOP input/output processor
LMY local memory
MDD magnetic disk device
MI memory interface
MOLOC mounting location
MTD magnetic tape device
MUT mounting unit
MYB memory bank
MYC memory control
PI processor interface
PU processor unit
R: rack
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b) Once accepted by the test department, all modules are protected from unauthorizedaccess (by means of a loop secured round each individual module frame).
c) The magnetic tape device, the disk drives and the personal computers are system-tested and separately packed for delivery. The disk storage units had the test-APScopied onto them in the test department.
d) The coordination processor is checked in the system test department with a testAPS. This APS is located on both magnetic disks.
e) The CP113C/CR installation test can begin once installation is completed. The APSon the disks is used for system testing.
f) The CP113C/CR is tested in the following steps:
Off-line test:
– Visual check of devices and cabling
– Preset all devices (if not already done at the factory)
– Start up the PC on-line following manufacturer's instructions (if not already doneby the manufacturer)
– Start the fans
– Switch on power to all equipment
– Off-line diagnostics of CMY, IOC, IOP, (BAP/CAP only if faulty)
On-line test:
– Start up hardware
– Load application program system (test APS) and start operating system (APSpresent on both system disks)
– Configure the necessary operating states in the CP area
– Check the logic components and devices:common memory (CMY),base processor (BAP),input/output control (IOC)input/output processor (IOP)bus to common memory (B:CMY)magnetic tape device (MTD) andmagnetic disk device (MDD)using the appropriate test and diagnostic software
– Introduce hardware modifications if necessary
– Incorporate the current operating APS and repeat the on-line tests
g) Error messages output by the test programs are handled on the basis of the MMN.
h) Implementation of modifications according to instructions (notices are sent by themodification service). The modification guidelines must be observed. If the installa-tion tester does not carry out the modifications himself, he should at least know
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which ones are made. Any faults that occur when the modifications have been incor-porated must be eliminated with the operating APS and the MMN.
i) After each hardware modification to a device, the modification service must beinformed of the new device issue.
j) A fault report must be written on each hardware fault (for repairs and statistics).
k) Always disconnect power before unplugging modules and plugging them in again.
l) If modules with DIP switches are replaced by spares, find the correct new settingsin the MMN:CP113C/CR - TAB.
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3.15.5 Overview of the Hardware Belonging to the CP Complex
Fig. 3.15.1 Overview: Hardware belonging to the CP-Complex
CAP-0
LMY
PU0
PU1
CI
PI
PI
BCMY-0
BCMY-1
CAP-5
LMY
PU0
PU1
CI
PI
PI
BAP-0
LMY
PU0
PU1
CI
PI
PI
BAP-1
LMY
PU0
PU1
CI
PI
PI
B:IOC
LMY
PI
PI
PU0
PU1
CI
B:IOC
LMY
PI
PI
PU0
PU1
CI
IOP
IOP
IOP
IOP
MYC
MYB0
MYB1
MYB2
MYB3
CMY-1
MI
MI
MYC
MYB0
MYB1
MYB2
MYB3
CMY-0
MI
MI
Minimum Configuration
Maximum Configuration
IOC-1IOC-0
IOC-3IOC-2
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3.15.6 Overview of Interfaces B:CMY
Fig. 3.15.2 Overview of Interfaces B:CMY
M:PIA 0
Stg 0
Stg 1
M:PIA 1
Stg 0
Stg 1
M:PIA 2
Stg 0
Stg 1
M:PIA 3
Stg 0
Stg 1
BAP-0
IOC-0
BAP-1
IOC-1
CAP-0
CAP-1
IOC-2
IOC-3
CAP-2
CAP-3
CAP-4
CAP-5
Reserve
Stg 0
Stg 1
M:MTI
M:BCM
Stg 1
Stg 0
Control bus (doubled)
Address/ Data bus (ECC secured)
Capacity dependent partof the BCMY
Processors B:CMYInterface to theprocessors
Interface to theCMY
CMY0
CMY1
HW tracer
MP:CP113C
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3.15.7 Overview IOPs (DE5/2)
Fig. 3.15.3 Overview IOPs (DE5/2)
-1
B:IOC
LMY
PU-0
PU-1
IOP:SCDP-0
IOP:MB 0
IOP:UNI-0
IOP:MB 34
IOP:MB 32
IOP:MB42
IOP:MB 40
IOP:TA
IOP:SCDP-1
IOP:MB 1
IOP:UNI-1
IOP:MB 35
IOP:MB 33
IOP:MB43
IOP:MB 41
IOP:TA
CCG(A)-0
CCNP-0
-1
1-1MB-0-1
1-0MB-0-0
SYPC
DC/AC-Conv. DCIRC
OMT-1
X.21
MTDMODMDD
DC/AC-Conv. DCIRC
OMT-0
X.21
MTD MOD MDD
GPS-Receiver
Fan Alarms
GPS-Receiver
Fan Alarms
IOC-0 IOC-1
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3.15.8 Overview IOPs (DE5/4)
3.15.8.1 IOPs (DE5/4) Part 1
Fig. 3.15.4 Overview IOPs (DE5/4) Part 1
B:IOC
LMY
PU-0
PU-1
IOP:SCDP-0
IOP:UNI-0
IOP:MB 34
IOP:MB 32
IOP:MB42
IOP:MB 40
IOP:TA
IOP:SCDP-1
IOP:UNI-1
IOP:MB 35
IOP:MB 33
IOP:MB43
IOP:MB 41
IOP:TA
CCG(A)-0-1
1-1MB-0-1
1-0MB-0-0
SYPC
DC/AC-Conv. DCIRC
OMT-1
X.21
MTDMODMDD
DC/AC-Conv. DCIRC
OMT-0
X.21
MTD MOD MDD
GPS-Receiver
Fan Alarms
GPS-Receiver
Fan Alarms
IOC-0 IOC-1
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3.15.8.2 IOPs (DE5/4) Part 2
Fig. 3.15.5 Overview IOPs (DE5/4) Part 2
-1
B:IOC
LMY
PU-0
PU-1
IOP:MB 0
Optional
IOP:MB 38
IOP:MB 36
IOP:MB 1
Optional
IOP:MB 39
IOP:MB 37
CCNP-0
1-3MB-0-3
1-2MB-0-2
IOC-2 IOC-3
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3.15.9 Inverter
3.15.9.1 Cabling of the 230V Inverter DCIRC
Fig. 3.15.6 Cabling of the 230V inverter DCIRC
DCIRC500 VA
WR-0
inside
inside
To fuse panel(20A fuse)
Terminal strip
E
When installing the DCIRC into therack, this connector is to be used forgrounding the DCIRC
121110
9
87
456
32
1
151413
Connectors 3, 6, 9, 12, 15 areinternally grounded
230V/AC
Grounding!
Feedtrough elements
230V/AC to F:Modem
NL
230V/ACTo OEM-Devices
-UE2
+UE1
UA2
UA1
DCIRC500 VA
WR-1
inside
inside-UE2
+UE1
UA2
UA1
9874 5 6321 11 ...
Terminal strip
L1
L2
Load compensation
230V/AC from WR-1
32
1
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3.15.9.2 230V AC-Connectors on Inverter DCIRC
Fig. 3.15.7 230V AC-Connectors on Inverter DCIRC
DCIRC 500 VA
DCIRC 500 VA
20 A 20 A
Modem
Modem
OMT-0
OMT-1
Load comp. Load comp.
Feedtrough elements
0
1
- UE
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3.15.10 Fan Alarm Cabling on CP113C/CR
Fig. 3.15.8 Fan Alarm Cabling in CP113C/CR
0 1 2 3 4 5 6 7
AD:RAL
Cable:AD:RAL - IOPTA
Alarm-Inputs
Switches for activating theAlarm inputs
SU 1 SU 2
FAN (AIC-2)
FAN (AIC-1)
FANBOX (AIC-0)-UE
+UE (GND)
Alarm-Switch
To fuse panelIOPTA-0
IOPTA-1
Grounding bar
RACK
Wires
(03 C329P4)
(07 C329P4)
Plug position:
04
08
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3.15.11 SCSI Bus Cabling CP113C/CR
3.15.11.1 SCSI Bus with 1 MTD
Fig. 3.15.9 SCSI bus cabling for MDD, MOD and MTD(CP113C/CR)
MDD1 MOD1 MDD0
MTD0MTD1
IOP:UNI0
IOP:UNI1
Rear view of the rack
R:CP113C/CR R:DEV(B)
MDD0 MTD0
IOP:UNI1
IOP:UNI0
MTD0
MDD1 MOD1
SCSI-Bus(Cable Z55...) SCSI-Bus
(Cable Z56...)
SCSI-Bus(Cable Z55...)
SCSI-Bus(Cable Z56...)
Terminatingresistor (active)
Terminatingresistor(active)
MTD-0 can beplugged asMTD-1 ontothe other bus
PROC:CP113C/CR – 14 A30808-X3063-A403-2-7630
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3.15.11.2 SCSI-Bus with 2 MTDs
Fig. 3.15.10 SCSI bus cabling of 2 MTDs (CP113C/CR)
MDD1 MDD0
IOP:UNI0
IOP:UNI1
Rear view of the rack
R:CP113C/CR R:DEV(B)
MDD0 MTD0
IOP:UNI1
IOP:UNI0
MTD0
MDD1
SCSI-Bus(Cable Z55...) SCSI-Bus
(Cable Z56...)
SCSI-Bus(Cable Z55...)
Terminatingresistor (active)
Terminatingresistor(active)
MTD1
Terminatingresistor(active)
MOD0 (Option)
MTD1
SCSI-Bus(Cable Z56...)
Terminating resistor(active)
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3.15.11.3 SCSI Bus with MDD and MOD
Fig. 3.15.11 SCSI bus cabling with MDD and MOD(CP113C/CR)
MDD1 MOD1 MDD0
IOP:UNI0
IOP:UNI1
Rear view of the rack
R:CP113C/CR R:DEV(B)
MDD0
IOP:UNI1
IOP:UNI0
MDD1 MOD1
SCSI-Bus(Cable Z55...)
SCSI-Bus(Cable Z55...)
MOD0
MOD0
Terminalresistor(active)
Terminalresistor(active)
PROC:CP113C/CR – 16 A30808-X3063-A403-2-7630
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3.15.12 F:DEVF Overview
Fig. 3.15.12 F:DEVF front view
Fig. 3.15.13 F:DEV(F) rear view with cabling to:MDD, MOD and MTD (CP113C/CR)
FANFAN
MDD1MDD0
MOD0 MOD1
001 015 029 049 056 067 081 095 115 122
DCCDA DCCDA
support plate
fromIOP:UNI0
DCCDA
fromIOP:UNI1
DCCDA
MDD0 MOD0MDD1 MOD1
to MTD-1 to MTD-0
ribbon cable ribbon cable
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3.15.13 Maintenance Panel MP:CP113C
An outline functional description and short introduction to the MP follows below.Complete operating instructions for the MP are contained in NM:CP113C/CR.
3.15.13.1 Performance FeaturesThe maintenance panel unit is remote from the PC and can be connected via a cablesimultaneously with a maximum of three different units of the CP.
These units are:
• Processor (BAP, CAP, IOC)
• Common memory (CMY0, CMY1)
• Bus to the Common memory (BCMY0, BCMY1)
• Input/output processor of the peripheral devices (IOP:UNI)
The MP is connected to these units, via the module front-facing connector, which aresituated on the following modules for the above-named units:
The maintenance panel is for the display or input of data and commands relating to theCP units to which it is connected. The MP power supply is realized via the currentconverter module DCCMC.Several of these DCCMCs are located in each CP module frame.
Unit Module with front connector forMP
Processor M:PEX
CMY M:CMYC
BCMY M:BCM
IOP:UNI M:IOP:UNI
Tab. 3.15.1 Modules with front connector for MP:CP113C
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3.15.13.2 Overview of MP:CP113C
Fig. 3.15.14 Overview of MP:CP113C
3.15.13.3 Operation of the MPThere are 5 keys and one LCD display for operating the MP. The "SELECT UNIT" keyis on the left of the LCD display. The other four are directly beneath the LCD display.They have various uses which can be read off in the last line of the LCD display. TheLCD display has 4 lines with 20 characters each and basically provides three differenttypes of display:normal display, extended display and fault display. This short description only refers tothe normal display:
Fig. 3.15.15 Normal display of MP:CP113C
SELECT UNIT
Menu keys
LCD-display,consists of 4 LCD rows
RESET-key
Potentiometer forLCD-brightness
Unit 3Unit 1 Unit 2Powerconnection
Cable to:
Unit 1: Data 1 Comm.1Unit 2: Comm.2Unit 3: Comm.3disp | req | cmd | send
Unit identification (four characters)
Data field (eight characters)
Command field (six characters)
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3.15.13.4 Key Functions of MP
A list of all menu key functions as well as all possible commands is in the MP OperatingInstructions in NM:CP113C/CR.
3.15.13.5 New Start of the MPA new start is made by pressing the "RESET" key or by unplugging the MP transformerand plugging it in again.
Notes for use:
• The MP:CP113C can be unplugged or plugged in again without interrupting thecomputer.
• After pulling MP:CP113C the processes which were started by the MP in allconnected CP units are reset.
• The CP unit to be controlled must be in MBL status.
• The serial interface of the MP:CP113C functions with TTL level and is thereforecompatible to a standard V.28 interface.
Key Key function Meaning
SELECT UNIT Selects the unit for which a command is to be enteredThe selected unit is shown inverted in the display
MENU KEYS Their function isshown in the lastline of the display
disp switches between normal and extended display
esc ends the current input or output and reactivates the latest validmenu key assignment
cmd selects the next command from the currently valid command list(dependent on the selected unit) and shows the selected unit inthe command field
beg jumps to the first command of the current command list
send carries out the displayed command
Tab. 3.15.2 Key functions of MP
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3.15.14 Rack Equipment
3.15.14.1 Rack (R) for CP113 COMPACT
Fig. 3.15.16 Rack R:CP113C
F:PIOP 0
MUT09
MUT10
MUT04
Fuse panel, AD:RAL
MUT02
MUT03
MUT01
IOPG 2
Fans
F:PIOP 2
F:DEV (F)
IOPG 0
FU 01 03 05 07 09 11 13 15 17 19
02 04 06 08 10 12 14 16 18 20FU
FU Frame Units
01 F:DEV (F) MOD 0,MDD 0
02 F:PIOP 2 CAP 4
03 F:PIOP 0 CAP 2
04 F:PIOP 2 IOC 2
05 F:PIOP 0 IOC 0
06 F:PIOP 2 M:LAUB
07 F:PIOP 0 M:LAUB
08 F:PIOP 2 IOPG 2
09 F:PIOP 0 IOPG 0
12 --- Fans(MUT04)
13 F:PBC 0 BAP 0
14 F:PBC 0 CAP 0
15 F:PBC 0 BCMY 0
16 F:PBC 0 M:BCM 0
17 F:PBC 0 CMY 0
18 F:PBC 1 BAP 1
19 F:PBC 1 CAP 1
20 F:PBC 1 BCMY 1
21 F:PBC 1 M:BCM 1
22 F:PBC 1 CMY 1
23 F:PIOP 1 CAP 3
24 F:PIOP 3 CAP 5
25 F:PIOP 1 IOC 1
26 F:PIOP 3 IOC 3
27 F:PIOP 1 M:LAUB
28 F:PIOP 3 M:LAUB
29 F:PIOP 1 IOPG 1
30 F:PIOP 3 IOPG 3
31 --- Fanbox
32 --- Fans, optional(MUT08)
33 F:DEV (F) MOD 1,MDD 1
F:PIOP 3CAP5
IOPG 3
MUT05
MUT07F:PIOP 1
F:PBC 0 CMY 0
MUT08Fans
21 23 25 27 29 31
22 24 26 28 30
MUT11Fanbox
IOC3
CAP3
IOPG 1
IOC1
BAP0
CAP0
CAP2
IOC0
CAP4
IOC2
BCMY 0
MUT06F:PBC 1 CMY 1
BAP1
CAP1
BCMY 1
33
32
MOD0
MDD0
MOD1
MDD1
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3.15.14.2 Rack (R) for CP113 COMPACT RURAL
Fig. 3.15.17 Rack R:CP113 CE
F:SMSC 1
MUT07
MUT10
MUT08
Fuse panel, AD:RAL
MUT02
MUT04
MUT01
SMSC 0
Fans
F:SMSC 0
F:DEV (F)
SMSC 1
FU 01 03 05 07 09 11 13 15 17 19
02 04 06 08 10 12 14 16 18 20FU
FU Frame Units
01 F:DEV (F) MDD 0,MOD 0
02 F:SMSC 0 SMSC 0
04 F:SMSC 0 SMSC 0
05 F:PIOP 0 IOC 0
06 F:SMSC 0 SMSC 0
07 F:PIOP 0 M:LAUB
08 F:SMSC 0 SMSC 0
09 F:PIOP 0 IOPG 0
10 F:SMSC 0 SMSC 0
12 --- Fans(MUT08)
14 F:PBC 0 BAP 0
15 F:PBC 0 BCMY 0
16 F:PBC 0 M:BCM 0
17 F:PBC 0 CMY 0
19 F:PBC 1 BAP 1
20 F:PBC 1 BCMY 1
21 F:PBC 1 M:BCM 1
22 F:PBC 1 CMY 1
23 F:SMSC 1 SMSC 1
25 F:SMSC 1 SMSC 1
26 F:PIOP 1 IOC 0
27 F:SMSC 1 SMSC 1
28 F:PIOP 1 M:LAUB
29 F:SMSC 1 SMSC 1
30 F:PIOP 1 IOPG 1
31 --- Fanbox
32 --- Fans(MUT09)
33 F:DEV (F) MDD 1,MOD 1
F:PIOP 1 IOPG 1
MUT05F:PBC 0 CMY 0
MUT09Fans
21 23 25 27 29 31
22 24 26 28 30
MUT11Fanbox
IOC1
BAP0
BCMY 0
MUT06F:PBC 1 CMY 1
BAP1
BCMY 1
33
32
MUT03F:PIOP 0 IOPG 0
IOC0
MOD0
MDD0
MOD1
MDD1
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3.15.15 Fuse Assignment
3.15.15.1 Fuse Assignment for R:CP113C
MUT Frame FU Plugposition
of supplyplug
Suppliedmodule
Mounting location ofthe supplied module
Allocated unit
01 AD:RAL 12 external devices, e.g.Tracer
31 external devices
02 F:PIOP(A) 02 C101 DCCMC C101 CAP 4
04 C127 DCCMC C127 IOC 2
06 C249 M:LAUB C153, C177, C199, C221 LAU
08 C337 DCCMC C337 IOPG 2
03 F:PIOP(A) 03 C101 DCCMC C101 CAP 2
05 C127 DCCMC C127 IOC 0
07 C249 M:LAUB C153, C177, C199, C221 LAU
09 C337 DCCMC C337 IOPG 0
04 FAN 12 F2 (-UE) FAN
05 F:PBC(A) 13 C101 DCCMC C101 BAP 0
14 C125 DCCMC C125 CAP 0
15 C151 DCCMC C151 BCMY 0
16 C159 M:BCM C167 M:BCM0
17 C339 DCCMC C339 CMY 0
06 F:PBC(A) 18 C101 DCCMC C101 BAP 1
19 C125 DCCMC C125 CAP 1
20 C151 DCCMC C151 BCMY 1
21 C159 M:BCM C167 M:BCM1
22 C339 DCCMC C339 CMY 1
07 F:PIOP(A) 23 C101 DCCMC C101 CAP 3
25 C127 DCCMC C127 IOC 1
27 C249 M:LAUB C153, C177, C199, C221 LAU
29 C337 DCCMC C337 IOPG 1
08 FAN 32 F2 (-UE) FAN
09 F:PIOP(A) 24 C101 DCCMC C101 CAP 5
26 C127 DCCMC C127 IOC 3
28 C249 M:LAUB C153, C177, C199, C221 LAU
30 C337 DCCMC C337 IOPG 3
Note: every fuse is 10 A
Tab. 3.15.3 Fuse Assignment R:CP113C
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3.15.15.2 Fuse Assignment for R:DEVB
3.15.15.3 Fuse Assignment to Fans
3.15.15.4 Fuse Assignment for R:CE (CP113 Compact Rural)
10 F:DEV(F) 01 DCCDA A056 MDD 0
DCCDA A049 MOD 0
33 DCCDA A122 MDD 1
DCCDA A115 MOD 1
11 FANBOX 31 X22 (-UE) FANBOX
MUT Equipment FU Ampere
04 MTD 05 10
07 MTD 02 10
10 DCIRC0 19 20
11 DCIRC1 20 20
Tab. 3.15.4 Fuse Assignment R:DEVB
Rack Fuse Fan in MUT Remarks
CP113C 12 04 Fan and external devices, e.g. HW tracer
32 08 Fan (if available)
31 11 Fan and external devices
Tab. 3.15.5 Fuse Assignment to fans
MUT Frame FU Plugposition
of supplyplug
Suppliedmodule
Mounting location ofthe supplied module
Allocated unit
01 AD:RAL 12 external devices
31 external devices
Note: every fuse is 10 A
Tab. 3.15.6 Fuse Assignment for R:CE (CP113 Compact Rural)
MUT Frame FU Plugposition
of supplyplug
Suppliedmodule
Mounting location ofthe supplied module
Allocated unit
Note: every fuse is 10 A
Tab. 3.15.3 Fuse Assignment R:CP113C
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02 F:SMSC(C) 02 DCCCR C101 SYP
04 DCCCR C153 CCG-0
06 SYPD-0/1
08 DCCDE C259 MB-0
10 C343 DCCMC C343 SN-0
11 ext. hooter/ ext.Alarms
03 F:PIOP(A) 03 C101 DCCMC C101
05 C127 C127 IOC-0
07 C249 C153, C177, C199, C221 LAU
09 C337 C337 IOPG-0
04 F:SMSC(C) 23 DCCCR C101 CDEX
25 DCCCR C153 CCG-1
27 DCCDE C259 MB-1
29 C343 DCCMC C343 SN-1
05 F:PBC(A) 13 C101 DCCMC C101 BAP 0
14 C125 DCCMC C125 CAP 0
15 C151 DCCMC C151 BCMY 0
16 C159 M:BCM C167 M:BCM0
17 C339 DCCMC C339 CMY 0
06 F:PBC(A) 18 C101 DCCMC C101 BAP 1
19 C125 DCCMC C125 CAP 1
20 C151 DCCMC C151 BCMY 1
21 C159 M:BCM C167 M:BCM1
22 C339 DCCMC C339 CMY 1
07 F:PIOP(A) 24 C101 DCCMC C101
26 C127 DCCMC C127 IOC 1
28 C249 M:LAUB C153, C177, C199, C221 LAU
30 C337 DCCMC C337 IOPG 1
08 FAN 12 F2 (-UE) FAN
09 FAN 32 F2 (-UE) FAN
10 F:DEV(F) 01 DCCDA A056 MDD 0
DCCDA A049 MOD 0
33 DCCDA A122 MDD 1
DCCDA A115 MOD 1
11 FANBOX 31 X22 (-UE) FANBOX
MUT Frame FU Plugposition
of supplyplug
Suppliedmodule
Mounting location ofthe supplied module
Allocated unit
Note: every fuse is 10 A
Tab. 3.15.6 Fuse Assignment for R:CE (CP113 Compact Rural)
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3.15.16 Memory Organization
Two different types of modules M:CMYM can be used in the CMY:
3.15.17 Sequence for Switching on the Modules in R:CP113C
3.15.17.1 Sequence for Switching on the Modules in R:CP113C
Serial Number Memory capacity of a CMYMmodule in Mbyte
..Q1256-X100 64
..Q1256-X200 128
Tab. 3.15.7 Memory organization
Fuse MUT Supplied module Mounting location ofthe supplied module
Allocated unit Frame Remark Remark
16 05 M:BCM C167 *) PBC0 Minimumconfiguration21 06 M:BCM C167 *) PBC1
15 05 DCCMC C151 BCMY0 PBC0
20 06 DCCMC C151 BCMY1 PBC1
17 05 DCCMC C339 CMY0 PBC0
22 06 DCCMC C339 CMY1 PBC1
05 03 DCCMC C127 IOC0 PIOP Parallel
09 03 DCCMC C337 IOPG0 PIOP
25 07 DCCMC C127 IOC1 PIOP Parallel
29 07 DCCMC C337 IOPG1 PIOP
07 03 M:LAUB C153, C177, C199, C221 LAU PIOP
27 07 M:LAUB C153, C177, C199, C221 LAU PIOP
*) Note: The fuses for M:BCM supply the DCCs on board. These DCCs supply the clock generator on the module directly,so that the clock generator is still able to work, even if the DCC of the corresponding BCMY is switched off or defective.
The LEDs of the modules M:BCM remain dark when these fuses are screwed in
Tab. 3.15.8 Sequence for switching on the modules R:CP113C
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3.15.17.2 Sequence for Switching on the Modules in R:CE
14 05 DCCMC C125 CAP0 PBC0 Extension
19 06 DCCMC C125 CAP1 PBC1
03 03 DCCMC C101 CAP2 PIOP
23 07 DCCMC C101 CAP3 PIOP
04 02 DCCMC C127 IOC2 PIOP Parallel
08 02 DCCMC C337 IOPG2 PIOP
26 09 DCCMC C127 IOC3 PIOP Parallel
30 09 DCCMC C337 IOPG3 PIOP
06 02 M:LAUB C153, C177, C199, C221 LAU PIOP
28 09 M:LAUB C153, C177, C199, C221 LAU PIOP
02 02 DCCMC C101 CAP4 PIOP
24 09 DCCMC C101 CAP5 PIOP
Fuse MUT Supplied module Mounting location ofthe supplied module
Allocated unit Frame Remark
16 05 M:BCM C167 *) PBC0
21 06 M:BCM C167 *) PBC1
15 05 DCCMC C151 BCMY0 PBC0
20 06 DCCMC C151 BCMY1 PBC1
17 05 DCCMC C339 CMY0 PBC0
22 06 DCCMC C339 CMY1 PBC1
05 03 DCCMC C127 IOC0 PIOP Parallel
09 03 DCCMC C337 IOPG0 PIOP
26 07 DCCMC C127 IOC1 PIOP Parallel
30 07 DCCMC C337 IOPG1 PIOP
07 03 M:LAUB C153, C177, C199, C221 LAU PIOP
28 07 M:LAUB C153, C177, C199, C221 LAU PIOP
*) Note: The fuses for M:BCM supply the DCCs on board. These DCCs supply the clock generator on the module directly,so that the clock generator is still able to work, even if the DCC of the corresponding BCMY is switched off or defective.
The LEDs of the modules M:BCM remain dark when these fuses are screwed in
Tab. 3.15.9 Sequence for switching on the modules R:CE
Fuse MUT Supplied module Mounting location ofthe supplied module
Allocated unit Frame Remark Remark
*) Note: The fuses for M:BCM supply the DCCs on board. These DCCs supply the clock generator on the module directly,so that the clock generator is still able to work, even if the DCC of the corresponding BCMY is switched off or defective.
The LEDs of the modules M:BCM remain dark when these fuses are screwed in
Tab. 3.15.8 Sequence for switching on the modules R:CP113C
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3.15.18 Displays on Module Faceplates
3.15.18.1 Displays after Successful Hardware Start-up
Unit Module Display LED Remarks
B:CMY-0 BCM MST green
CG0 green if selected/red if not
CG1 green if selected/red if not.one LED must be green, the other is automatically red
ILBS green if the ILB is resetred if the ILB is set
PIA MST green
PIA MST green
PIA MST green
PIA MST green
MTI MST green
B:CMY-1 BCM MST green
CG0 green if selected/red if not
CG1 green if selected/red if notone LED must be green, the other is automatically red
ILBS green if the ILB is reset red if ILB is set
PIA MST green
PIA MST green
PIA MST green
PIA MST green
MTI MST green
CMY-0 CMYC MST green
ILB0 green if the ILB is reset to B:CMY0red if the ILB is set to B:CMY0
ILB1 green if the ILB is reset to B:CMY1red if the ILB is set to B:CMY1
CMYM0 MST green
CMYM1 MST green
CMYM2 MST green
CMYM3 MST green
Tab. 3.15.10 Displays after successful Hardware Startup
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3.15.19 Commands for Creating CAPs
List of CAPs and corresponding PBI-numbers
• CR CAP:CAP=0,PBI=4;
• CR CAP:CAP=1,PBI=6;
• CR CAP:CAP=2,PBI=8;
• CR CAP:CAP=3,PBI=9;
• CR CAP:CAP=4,PBI=10;
• CR CAP:CAP=5,PBI=11;
CMY-1 CMYC MST green
ILB0 green if the ILB is reset to B:CMY0red if the ILB is set to B:CMY0
ILB1 green if the ILB is reset to B:CMY1red if the ILB is set to B:CMY1
CMYM0 MST green
CMYM1 MST green
CMYM2 MST green
CMYM3 MST green
BAP-0 PEX Display at the MPThe sequence of the BAP master is described in the proce-dure
(DY A925 if manually booted with BAP-0)
BAP-1 PEX Display at the MPThe sequence of the BAP master is described in the proce-dure
(DY A925 if manually booted with BAP-1)
IOC-0 PEX DY A385 Display at the MP (A1A5 is also possible)
MST green
ILB0 green if the ILB is reset to the B:CMY0red if the ILB is set to B:CMY0
ILB1 green if the ILB is reset to B:CMY1red if ILB is set to B:CMY1
IOC-1 PEX DY A385 Display at the MP (A1A5 is also possible)
MST green
ILB0 green if the ILB is reset to the B:CMY0red if the ILB is set to B:CMY0
ILB1 green if the ILB is reset to the B:CMY1red if the ILB is set to B:CMY1
IOP IOP:TA ******* * Time is displayed for approx. 5 mins. if the display keyis pressed
IOP:MB IBREQ green for a few minutes
IOP:UNI MST green
Unit Module Display LED Remarks
Tab. 3.15.10 Displays after successful Hardware Startup
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1 Check the Basic State (Preparation) of Racks R:CP113C / R:DEVB / R:CE
Check the basic state of the racks R:CP113C / R:DEVB / R:CE
Ensure that the main fuses are unscrewed before starting the check
Measure the system voltage for each rack row at the last frame
The operational voltage is dependent upon the charging status of the batteries:
Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6V ... -57V)
Is system voltage -60V (-48V) present? Y h...3N h...2
2 Special Fault Clearance
Carry out special fault clearance
– After finishing special fault clearance h...1
3 Switch off DCCs
Switch off all DCCs
4 Check Mechanical Layout
Check racks and module frames (R:CP113C / R:DEVB / R:CE) to see if anyparts are touching, or if there is any foreign material or transport damage.
Check that all modules and cables are firmly in place
If any transport damage or damaged seals have been detected, the rack layout(R:CP113C and R:DEVB) / R:CE has to be checked against the equipment list.
Check the layout of the module frames and the standard cabling plan
Break module seal
Check connections between wire wrap field and chassis ground bus.
Check cabling against cable laying list A30808-A....-X...- * -33
5 Automatic Memory Setting
No manual memory setting is necessary for CP113C/CR.An address decoder is loaded when the voltage is switched on via the CMY-FW.This enables memory modules of the most differing level of component place-ment and DRAM layout to be mixed in a CMY.
The memory is distributed on one till four modules (M:CMYM0 - M:CMYM3).Two different types of modules can be used:
...... (see Tab.3.15.7)
The CMY has no set BCMY connection number in the hardware. This is allo-cated with the RESET incode from BCMY during the system run-up, and storesthem in the RAM of the MC and in ASIC MFC.
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6 Check Cabling of Fan Alarm Lines
Check cabling between AD:RAL and both IOP:TA ......(see Fig. 3.15.8)
Check switches for activating the alarm inputs in AD:RAL ......(see Fig. 3.15.8)
7 Test fans
Insert the following fuses (depending on the rack to be switched on) one afterthe other and switch on the fans:
Are the corresponding LEDs lit? Y h...9N h...8
8 Special fault clearance
Carry out special fault clearance
– After finishing special fault clearance h...7
9 Basic State DCCs
Make sure that all DCCs of the CP113C/CR are switched off
10 Switch on DCCs
To prevent module damage and because of clock synchronization the moduleframes are switched on in a special sequence:
Sequence for switching on the modules in R:CP113C ......(see Tab.3.15.8)
Sequence for switching on the modules in R:CE ......(see Tab.3.15.9)
Screw in the first (next) fuse (see table mentioned above).
Rack Fuse Fan in MUT Remarks
R:CP113C FU 12 04 Fan and external devices e.g. HW Tracer
FU 32 08 Fan (if available)
FU 31 11 Fan and external devices
Rack Fuse Fan in MUT Remarks
R:CE FU 12 08 Fan and external devices e.g. HW Tracer
FU 32 09 Fan (if available)
FU 31 11 Fan and external devices
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The following system responses are possible, according to the fuse screwed in:
• Fuse for M:BCM:The DCCs on board of the corresponding module M:BCM are supplied withsystem voltage but the LEDs on the module faceplate remain dark.
• Fuse for DCCMC:No system reaction until the corresponding DCC is switched on
• Fuse for M:LAUB:LEDs on the corresponding module M:LAUB light up
Switch on power with the switch on the assigned DCC module faceplates.(Except for M:LAUB and M:BCM which are directly connected to the fuse)
The following system responses are possible, according to the module switchedon:
• DCCMC:
– Green LED on the module faceplate of the DCCMC lights up
– The green LEDs of the DCCs for IOPG and IOC only light up if bothDCCMCs have been switched on
• DCCMC for BCMY0:
– Green LED on the module faceplate of the DCCMC lights up
– LED on M:BCM in F:PBC0 lights green immediately
• DCCMC for BCMY1:
– Green LED on the module faceplate of the DCCMC lights up
– LED on M:BCM in F:PBC1 lights yellow for approx. 5 sec. and then green
Does the LED of the module switched on light as shown in the preceding list? Y h...11N h...12
11 Decision: Next Module
Are all units listed in the table in operation? Y h...22N h...10
12 Fault Clearance
Switch off the voltage converter immediately and unscrew the assigned fuse
13 Check the Fuse for DCC
Is the corresponding fuse in the fuse panel defective? Y h...14N h...15
14 Replace Fuse
Replace the fuse in the fuse panel h...10
15 Decision Block: DCC
Has the current converter already been replaced? Y h...17N h...16
PROC:CP113C/CR – 32 A30808-X3063-A403-2-7630
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16 Replace DCC
Replace the DCC with spare DCC
Mark the replaced DCC as defective h...10
17 Decision Block: Module
Have all corresponding modules already been replaced? Y h...19N h...18
18 Replace the Corresponding Modules
Replace modules of the affected unit successively by spare modules.
If the green LED of the DCC is still not lit after replacing a module, the sparemodule has to be replaced with the original module again.
After each module replacement h...10
19 Decision Block: Cable
Is a cable the next unit to be cleared of faults? Y i....NM:CP113C/CR,TAB, CP0050
N h...21
20 Decision Block
Could the fault be cleared? Y h...10N h...21
21 Special Fault Clearance
The fault could not be cleared by standard fault clearance measures. A systemspecialist must carry out fault clearance.
– After successful fault clearance h...10
22 Information Block: SCSI Bus
The cabling of the complete SCSI bus is shown in ......(see 3.15.11)
23 Switch on Magnetic Tape Device
Branch to one of the following MTD procedures according to the MTD used:
– Switching on MTD: STC 2925 of Storage Tek i....PROC:MTD:STC2925
– Switching on MTD: HP 88781 A of Hewlett Packard i....PROC:MTD:HP88781A
– After successful MTD start-up, continue: h...24
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24 Check Cabling of Disk Storage Unit (MDD)
The following cabling of the MDDs has to be checked:
• Correct connection of the power supply plug to the MDD
• Correct connection of the SCSI-bus cabling to MDD
For MDD HP C2490A (2,1 GByte), check cabling according to: ......NM:CP -Devices,MDDHPC2490A(2,1 GByte)
For MDD Quantum Atlas XP34550S (4,5 GByte), check cabling according to: ......NM:CP -Devices, MDDXP34550S(4,5 GByte)
25 Check Switch Settings of Disk Storage Unit (MDD)
For MDD HP C2490A (2,1 GByte): check that switch settings are set accordingto:
......NM:CP -Devices, MDDHP C2490A(2,1 GByte)
For MDD Quantum Atlas XP34550S (4,5 GByte): check that switch settings areset according to:
......NM:CP -Devices, MDDXP34550S(4,5 GByte)
26 Check Cabling of MODs
Check the following cable connections of the MODs:
• Correct attachment of the power supply plug to the MOD
• Correct attachment of the power supply plug to the MOD-fan
• Correct attachment of the SCSI bus cabling
For MOD Sony SMO-F531 (1,3 GB) check cabling according to ......NM:CP -Devices,MOD SonySMO-F531
For MOD Sony SMO-F541 (2,6GB) check cabling according to ......NM:CP -Devices,MOD SonySMO-F541
PROC:CP113C/CR – 34 A30808-X3063-A403-2-7630
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27 Check Settings of the MODs
Check the following settings of the operation mode plug of the MODs:
• Check the setting to the correct SCSI address (SCSI-ID 2)
• Check the correct jumper setting in the operation mode plug for deactivatingthe internal terminating resistor (Depending on the SCSI devices connected)
For MOD Sony SMO-F531 (1,3 GB) check settings according to ......NM:CP -Devices,MOD SonySMO-F531
For MOD Sony SMO-F541 (2,6GB) check settings according to ......NM:CP -Devices,MOD SonySMO-F541
28 Screw in Fuse
Screw in fuse for MDD-0 and MOD-0(One fuse supplies the DCCs of both devices)
......(see 3.15.15)
29 Switch on MDD-0
Switch on DCC for MDD-0 ......(see 3.15.15)
LED of the DCC lights up
LED of the MDD lights up
30 Switch on MOD-0
Switch on DCC for MOD-0 ......(see 3.15.15)
LED of the DCC lights up
MOD fan starts up
MOD-LED lights up shortly
31 Screw in Fuse
Screw in fuse for MDD-1 and MOD-1(One fuse supplies the DCCs of both devices)
......(see 3.15.15)
32 Switch on MDD-1
Switch on DCC for MDD-1 ......(see 3.15.15)
LED of the DCC lights up
LED of the MDD lights up
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33 Switch on MOD-1
Switch on DCC for MOD-1 ...... (see 3.15.15)
LED of the DCC lights up
MOD fan starts up
MOD-LED lights up shortly
34 Installation of PC
Information about the inverter:The 230V outputs of the inverter (230V, 500 VA) are floating.Before switching on the inverter one line of the 230V output has to be grounded.Normally the grounding is already done by the manufacturer but has to bechecked again now.
Check / establish the correct grounding of the inverter ...... (see Fig. 3.15.6)
Switch on the inverter for the PC.(To this inverter no further PCs can be connected)
...... (see Fig. 3.15.7)
Installation of the PC according to ......MMN:PC -BASIS
– After the PC has been installed and a CP session opened h...35
35 Connecting the Maintenance Panel
The Maintenance Panel (MP) can be connected in any order with up to threeunits and the voltage supply of any unit of the CP113C/CR. An interference ofactive units by a non-initialized MP is excluded.
Connect the Maintenance Panel to the voltage supply on the front panel plug ofany DCCMC voltage converter of the CP113C/CR.
After connecting the operating voltage to the MP, self-tests are first carried outby the FW.After a successful test the following text is displayed on the MP:
**************************
* *
* MP:CP113C, FW xxxx *
* Selftest OK !! *
* -------------------- *
* Hit any key to start *
* *
**************************
FW xxxx identifies the current firmware version
Has the self-test been terminated successfully? Y h...37N h...36
PROC:CP113C/CR – 36 A30808-X3063-A403-2-7630
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36 Fault Clearance
Carry out fault clearance according to the instructions of the MP, given in ......NM:CP113C/CR,TAB
– After finishing fault clearance h...35
37 Diagnosis 0 CMY
The off-line diagnostics must be carried out on both CMYs one after the other.
Connect the maintenance panel via the front panel plug to the module M:BCMof both BCMYs and to the M:CMYC module of the CMY to be tested.
The interface lock bits of the CMY to be tested must be set to both BCMYs asfollows.
Select BCMY0 with the "SELECT UNIT" key.
Enter the command "SILBM0" ("SILBM1") with the menu keys for setting theinterface lock bits to the CMY0 (CMY1).
Select BCMY1 with the "SELECT UNIT" key.
Enter the command "SILBM0" ("SILBM1") with the menu keys for setting theinterface lock bits to the CMY0 (CMY1).
The interface lock bits of the CMY0 (CMY1) are set to both BCMYs.
Select CMY with "SELECT UNIT" and enter the command "RESET" for theCMY with the menu key.
The module is reset (otherwise the diagnostic command is ineffective).
Enter the command "DIAG0" for the CMY with the menu keys.
Diagnostics 0 is started (complete CMY diagnostics). The LED MST on moduleM:CMYC flashes green. (Diagnostics ends after approx. 10 seconds, even if theLED continues to flash).
The diagnostics result can be found in the fourth entry of the trace RAM.
Enter the command "TRINF" for the CMY with menu keys.**************************
* *
* CMYx < list > TRINF *
* Show trace RAM *
* FAILNR 4: 5AAA5AAA * <- positive pattern after the diagnostics
* disp ---- ++++ end *
* *
**************************
Is "5AAA5AAA" displayed for FAILNR? Y h...39N h...38
A30808-X3063-A403-2-7630 PROC:CP113C/CR – 37
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38 Fault Clearance
Carry out fault clearance according to i ...NM:CP113C/CR,TAB:CP053
– After successful fault clearance h...37
39 Diagnosis 2 CMY
Enter the "RESET" command for the CMY with the menu keys
The module is reset (otherwise the diagnostics command is ineffective)
Enter the "DIAG2" command for the CMY with menu keys (diagnostics of theCMY memory medium)
Diagnostics 2 is started (diagnostics of the CMY memory medium). The LEDMST flashes green on module M:CMYC. (The diagnostics ends after approx. 10secs., even if the LED continues to flash).
The diagnostics result can be found in the fourth entry of the trace RAM.
Enter the command "TRINF" for the CMY with menu keys.**************************
* *
* CMYx < list > TRINF *
* Show trace RAM *
* FAILNR 4: 5AAA5AAA * <- positive pattern after the diagnostics
* disp ---- ++++ end *
* *
**************************
The diagnostics 2 can be restarted by repeatedly entering the DIAG2 command.Diagnostics 3 can only be started if the diagnostics 2 has ended with faults.
Is "5AAA5AAA" displayed for FAILNR? Y h...41N h...40
PROC:CP113C/CR – 38 A30808-X3063-A403-2-7630
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40 Diagnosis 3 CMY
Enter the "RESET" command for the CMY with the menu keys
The module is reset (otherwise the diagnostics command is ineffective)
Enter the "DIAG3" command for the CMY with menu keys
Diagnostics 3 is started (localizing the defect RAM chip). The LED MST flashesgreen on the M:CMYC module. (The diagnostics ends after approx. 10 secs.,even if the LED continues to flash).
The diagnostics result can be found in the fourth entry of the trace RAM.
Enter the command "TRINF" for the CMY with menu keys.**************************
* *
* CMYx < list > TRINF *
* Show trace RAM *
* FAILNR 4: * <- Result after the diagnostics
* disp ---- ++++ end *
* *
**************************
Make an evaluation of the track numbers and carry out fault clearanceaccording to
i....NM:CP113C/CR -TAB:CP0053
– After successful fault clearance h...41
41 Reset Interface Lock Bits
Enter the "RESET" command for CMY with the menu keys
Select BCMY0 with the "SELECT UNIT" key.
Enter the command "RILBM0" ("RILBM1") with the menu keys for resetting theinterface lock bits to the CMY0 (CMY1).
Select BCMY1 with the "SELECT UNIT" key.
Enter the command "RILBM0" ("RILBM1") with the menu keys for resetting theinterface lock bits to the CMY0 (CMY1).
The interface lock bits of the CMY0 (CMY1) are reset again.
Has the off-line diagnostics been carried out at both CMYs? Y h...43N h...42
42 Decision Block: other CMY
– Repeat CMY-diagnosis for other CMY (Carry out the details in parentheses) h...37
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43 Off-line Diagnostics IOC
Off-line diagnostics must be carried out for IOC0 and IOC1 as well as otherIOCs in case expansion module frames are available.
The command "NOTEST" switches off the supervisory circuit (comparator in theM:PEX module). The command "NOTEST" can therefore only be used for testpurposes when fault clearing.
The command "RESET" releases an impulse in the RESET line.
The "DIAGP" command releases an impulse in the RESET and the BOOT linewhich starts the processor diagnostics.
Connect the maintenance panel via the front panel plug of the M:PEX module(plug position 700) with the IOC to be tested.
Select the IOC to be tested with the "SELECT UNIT" key.
Enter the command "RESET" for the IOC with the menu keys.
Enter the command "DIAGP" with the menu keys.
The off-line diagnostics is started. The LED MST on module M:PEX flashesgreen.
" DY 3AAC" appears in the display of the maintenance panelwhen the diagnostics has run fault-free.
Has “ DY 3AAC” been displayed? Y h...45N h...44
44 Fault Clearance
Make an evaluation of the track numbers and carry out fault clearanceaccording to
i ...NM:CP113C/CR,TAB:CP0052
– After successful fault clearance h...45
45 Decision: Next IOC
Has the off-line diagnostics been carried out for all IOCs? Y h...46N h...43
PROC:CP113C/CR – 40 A30808-X3063-A403-2-7630
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46 Off-line Diagnostics IOP:UNI
This off-line diagnostics must be carried out for all M:IOP:UNI modules.
The interfaces to the devices are not tested by the test program, but only theIOP:UNI. This test includes all test/diagnostics programs which do not accessB:IOC.
The interfaces are only tested by the device tests so that in case there is a faultonly the device and not the IOP:UNI is taken out of service.
After the off-line diagnostics are carried out the IOP must be reset with RESET.
Connect the maintenance panel via the front panel plug with the M:IOP:UNI ofthe IOP:UNI to be tested.
Select the IOP:UNI to be tested with the "SELECT UNIT" key.
Enter the command "RESET" with the menu keys.
IOP:UNI is reset
Switch to extended display on the MP by pressing the "disp" key.
Enter the command "DIAG" with the menu keys.
A short diagnostics procedure is started in the IOP:UNI
"NO FAULT FOUND" appears in the MP display.
If a fault has been found, the LED MST of the IOP:UNI lights red and a faultmessage appears in full text in the MP display.
Has the off-line diagnostics been ended without faults? Y h...48N h...47
47 Fault Clearance
Evaluate the fault messages of the MP and clear faults accordingly.
– After successful fault clearance h...48
48 Reset IOP:UNI
Enter the "RESET" command for the IOP:UNI with the menu keys at the MP.
The IOP:UNI is reset.
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49 Off-line Diagnostics IOP:TA
The IOP:TA must be inactive before starting off-line diagnostics.This means that a value other than "AC" must be displayed in the status displayof the M:IOP:TA module.
Press the diagnostics key on the front panel of the M:IOP:TA moduleuntil decimal points appear in the "Status" display.
Diagnostics is started (approx. 7 sec.)"OF" appears in the "Status" display.The progress of the diagnostics is shown in the display "Minutes" (00 - 9D)
"PU" or "IA" appears in the "Status" display after successful diagnostics (withoutCCG the "CF" message appears). The "Hours" display must not indicate "FF".
Has the diagnostics ended without faults? Y h...51N h...50
50 Fault Clearance
Evaluate the display and carry out fault clearance according to i ...NM:CP113C/CR,TAB, CP0054
– After successful fault clearance h...51
51 Decision: IOPAUC
The IOPAUC is only used in CP113C of AC (authentication center)
Is there at least one IOPAUC in use Y h...52N h...54
52 Off-line diagnostics of IOPAUC
Press the RESET key on the front panel of the IOPAUC module
The progress of the test is indicated via the LEDs of the IOPAUC
– For evaluating the LED displays of the IOPAUC see i ...NM:CP113C/CR,TAB, CP0054
Has the diagnostics ended without faults? Y h...54N h...53
53 Fault clearance
Carry out fault clearance according to i ...NM:CP113C/CR,TAB, CP0054
– After successful fault clearance h...54
PROC:CP113C/CR – 42 A30808-X3063-A403-2-7630
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54 Prepare BAP Hardware Start-up
Switch off the DCCs connected to BAP-0 and BAP-1, if not already done
55 Information about BAP Hardware Start-up
The fuses for the voltage converters BAP0 and BAP1 must both be screwed inbefore switching on the voltage converter.
After switching on the voltage converter there is a sequence of initializing andtest programs (HW start-up) in the individual processors).The BAP where the power is switched on first becomes MASTER, but only oncondition that this BAP is fault-free. The MP should be connected to the BAPmaster and the corresponding IOC before switching on the voltage converter,because track numbers are used for displaying the boot status and are shownon the MP display if the MP is connected.
For start-up with the APS, the following units have to be connected to a B:CMY(is displayed by reset interface lock bits (LED ILB = green is displayed).
• one BAP (ILB LED on module PEX)
• one IOC (ILB LED on module PEX)
• one CMY (ILB LED on module CMYC)
Ensure that one IOP:UNI (for the connection from MDD and PC) can bereached via the IOC connected to the B:CMY, and that it has the status shownin:
......(see Tab.3.15.10)
The BAP, which becomes MASTER, first formats both CMYs.Display at the MP: " DY A885" for BAP master.
Then it initializes IOC0/1Display at the MP: " DY A8A5",...," DY A8B5",...," DY A8C5" for BAP master'
When “ DY AB05” (“ DY AD05”) is displayed, the test APS is already beingloaded from one of the disks (MDD-0 or MDD-1).
Displays on the other module panels, or on the MP display after initialization (incase no fault is found in the processors during the HW start-up):
......(see Tab.3.15.10)
56 Switch on BAP0 and BAP1
Screw in the fuses for the DCCs of BAP-0 and BAP-1
Switch on DCCs for BAP0 and BAP1
Are the green LEDs on both DCC modules lit? Y h...67N h...57
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57 Fault Clearance
Switch off the DCC on which the LED is not lit immediately and unscrew therelevant fuse. After a successful test start-up, remove the fault from the defec-tive unit with the test APS (provided a BAP can load the APS).
– If only one BAP is defective, continue h...67– If both BAPs are defective, the errors must be removed immediately h...58
58 Check the Fuse for DCC
Is the corresponding fuse in the fuse panel defective? Y h...59N h...60
59 Replace Fuse
Replace the fuse in the fuse panel h...56
60 Decision Block: DCC
Has the current converter already been replaced? Y h...62N h...61
61 Replace DCC
Replace the DCC with spare DCC
Mark the replaced DCC as defective h...56
62 Decision Block: PEX
Has the corresponding PEX already been replaced? Y h...64N h...63
63 Replace PEX
Replace the corresponding PEX with spare module.
Mark the replaced module as defective h...56
64 Decision Block: Cable
Is a cable the next unit to be cleared of faults? Y i ...NM:CP113C/CR,TAB, CP0050
N h...66
65 Decision Block
Could the fault be cleared? Y h...56N h...66
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66 Special Fault Clearance
The fault could not be cleared by standard fault clearance measures. A systemspecialist must carry out fault clearance.
– After successful fault clearance h...56
67 Decision: Start-up With test APS Possible
Has the system been configured to allow start-up with the test APS? Y h...92N h...68
68 Decision: Other BAP MASTER
– If no start-up with the other BAP as MASTER has been attempted the start-up has to be repeated with switching on the DCCs of BAP-0 and BAP-1 in adifferent order h...54
– If a start-up with the other BAP as MASTER has already run through amanual start-up must be attempted h...69
69 Manual Start-up Part 1
It is best to carry out the manual recovery in the following way:
• The access to the bus is taken from one of both BAPs. This can be bestachieved by switching off the processor.
• Afterwards the BOOT key on the front panel of the M:BCM module allocatedto the other BAP must be pressed.
• Only after successful installation is the BAP to be switched on again andconfigured.
Switch off BAP-1 (BAP-0).
Activate the BOOT key on the front panel of the M:BCM module in the F:PBC0for BAP-0 (F:PBC1 for BAP-1).
After switching on the voltage converter the initialization and test programs runin the individual processor (HW recovery).Track points which are shown on the MP display are used to display the bootstatus. The MP also must be connected to the BAP master and the corre-sponding IOC before switching on the voltage converter.The BAP-0 (BAP-1) becomes MASTER.
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For start-up with the APS, the following units have to be connected to a B:CMY(is displayed by reset interface lock bits (LED ILB = green is displayed).
• one BAP (ILB LED on module PEX)
• one IOC (ILB LED on module PEX)
• one CMY (ILB LED on module CMYC)
Ensure that one IOP:UNI (for the connection from MDD and PC) can bereached via the IOC connected to the B:CMY, and that it has the status shownin:
...... (see Tab.3.15.10)
Displays on the other module panels, or on the MP display after initialization (incase no fault is found in the processors during the HW start-up): ...... (see Tab.
3.15.10)
Has the system been configured so that start-up with the test APS is possible? Y h...71N h...70
70 Decision: Manual Start-up with second BAP
– Repeat manual start-up with second BAP, if not already done h...69– If the manual start-up has already been attempted with the second BAP, off-
line diagnostics must be executed h...87
71 Manual Start-up Part 2IPL113: MANUAL START - CURRENT CONFIGURATION
UNIT STATUS TEST
********************************************
BAP-0 ost Test result
BAP-1 ost Test result
B:CMY-0 ost Test result
B:CMY-1 ost Test result
CMY-0 ost Test result
CMY-1 ost Test result
IOC-0 ost Test result
IOC-1 ost Test result
IPL113: ENTER PARAMS
TO DIAGNOSE MEMORY : “DIAG;”
TO FORMAT MEMORY : “FORMAT;”
TO CONTINUE : “;ETX”
Is the preceding message output? Y h...77N h...72
72 Decision: Check IOP:UNI / Cabling to PC
Have the device settings on module IOP:UNI and the cable connections to thePC already been checked? Y h...73
N h...74
PROC:CP113C/CR – 46 A30808-X3063-A403-2-7630
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73 Decision: Manual Start-up with Second BAP
– Repeat manual start-up with second BAP, if not already done h...69– If the manual start-up has already been attempted with the second BAP, off-
line diagnostics must be executed h...87
74 Check Cabling to PC
Check and if necessary replace connecting cable to the PC or change plug posi-tion
75 Check Device Data in the IOP:UNI
Connect the MP to the front panel of the M:IOP:UNI module.
Call up the IOP:UNI with the "SELECT UNIT" key.
Enter the "SHOWCF" command with the menu keys.
The device data of the IOP:UNI are displayed.
Are the device data correctly set? Y h...54N h...76
76 Modify Device Data in the IOP:UNI
Transmit the "CONFIG" command with the menu keys.
Modify or regenerate the device settings with the "mod" or "crea" keys.
After modifying the device settings, the modifications must be retrieved bypressing the "ok" key.(The configuration can be interrupted without any modification by pressing the"end" key)
– After modifying the device settings h...54
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77 Manual Start-up Part 3
Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS
TO START APS MANUALLY : “MANUALLY;”
TO START INSTALLAT.RECOV : “INSTALLATION;”
TO START UTILITY(MONITOR) : “UTILITY;”
TO STOP INITIAL START : “STOP;”
TO START APS AUTOMATICALLY: “;ETX”
Enter “MAN;” and press <ENTER>IOC-0 MDD : BZS/AKD AND GENERATION LIST
IOC-1 MDD : BZS/AKD AND GENERATION LIST
The current generation list is output:
xxxxxxxxxxxxxx
99999999 xxxxxxxxxxxxxxxxxxxxx
MANUAL RECOVERY - LOADING VIA IOC : “IOC-0;/IOC-1;”
Enter “IOC-0;” or “IOC-1;” and press <ENTER>LOAD.DEV. - *MDD* -GENERATION TO LOAD :”NAME;” (8 CHAR)
Enter the current APS generation 8 characters (in APS documentation or at theplace marked 9999999 in the generation list printed out previously).
Enter 'Generation-No.' and press <ENTER>
If the APS version is unknown and cannot be found out, enter *. For safetyreasons this must be repeated 3 times after system enquiry.
MANUAL RECOVERY - LTG LOADING : “Y;/N;”
Enter "N;" and press <ENTER>
Manual start-up is initiated.
The track numbers to be run through which are shown in the MP display for theBAP master are shown in block: ...... (see 55)
To make things clearer, only the headline is given for the system messages.
Wait for the following system message:ALL DOUBLE FILES SYNCHRONIZED
Was the manual start-up with the test APS successful? Y h...78N h...79
78 Second BAP
Switch on the second BAP again h...94
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79 Decision: Manual Start-up with other BAP
Has the manual start-up been attempted with another BAP? Y h...81N h...80
80 Boot Key
Repeat the entire sequence with the other BAP (Details in Parentheses) h...69
81 Decision: Manual Start-up via IOC-1
Branch to one of the following blocks
– Repeat manual start-up via IOC-1, if not already done h...69– If manual start-up via IOC-1 has already been attempted h...82
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82 START / UTILITY
When working with the IMON, ensure that the PC can be reached via the IOCspecified in the Start Utility.
Switch off BAP-1 (BAP-0)
Press the BOOT key on the front panel of the M:BCM module in the F:PBC0 forBAP-0 (F:PBC1 for BAP-1).IPL113: MANUAL START - CURRENT CONFIGURATION
UNIT STATUS TEST
********************************************
BAP-0 ost Test result
BAP-1 ost Test result
B:CMY-0 ost Test result
B:CMY-1 ost Test result
CMY-0 ost Test result
CMY-1 ost Test result
IOC-0 ost Test result
IOC-1 ost Test result
IPL113: ENTER PARAMS
TO DIAGNOSE MEMORY : “DIAG;”
TO FORMAT MEMORY : “FORMAT;”
TO CONTINUE : “;ETX”
– If the preceding message did not appear h...72Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS
TO START APS MANUALLY : “MANUALLY;”
TO START INSTALLAT.RECOV : “INSTALLATION;”
TO START UTILITY(MONITOR) : “UTILITY;”
TO STOP INITIAL START : “STOP;”
TO START APS AUTOMATICALLY: “;ETX”
Enter “UTI;” and press <ENTER>UTILITY - RECOVERY - DEVICE - TYPE TO USE : “MDD;/MTD;/MOD;”
Enter “MDD;” and press <ENTER>UTILITY - RECOV. - LOAD FROM MDD VIA : “IOC-0;/IOC-1;”
Enter “IOC-0;” or “IOC-1;” and press <ENTER>PLEASE ENTER UTILITY - FILE - NAME
Acknowledge this message with “SY.INSTALL”IMON : V0031 START
IMON : ENTER COMMAND
Was it possible to start IMON? Y h...84N h...83
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83 Fault Clearance
Check connection of MDD to IOP:UNI according to ......NM:CP -Devices, MDDHP C2490A(2,1 Gbyte)
Check switch settings and cable connections in the MDD against the manufac-turer's documentation.
– After successful fault clearance h...54
84 Display Disk Contents
Display disk contents with the following commands:DISP MDDIR:DEVIN=010C01; (for MDD-0)
DISP MDDIR:DEVIN=030C01; (for MDD-1)
All disk files of MDD-0 (MDD-1) are displayed
Branch to one of the following blocks according to the files displayed
– If all system files are present continue h...85– If not all system files are present the files must be copied again from tape to
disk. System test with test APS must be omitted h...98
85 Decision: BAP Off-line Diagnostics
Have BAP off-line diagnostics been carried out? Y h...86N h...87
86 Branch according to Off-line Diagnostics
– If all off-line diagnostics have been terminated without error, one or moresystem files have probably been destroyed. In this case the test with the testAPS must be omitted h...98
– Otherwise h...9
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87 Prepare BAP Off-line Diagnostics (Special Fault Clearance)
The off-line diagnostics must be carried out in both BAPs.
After connecting the MP at the front panel plug of the M:PEX module the off-linediagnostics can be started with the command "DIAGP".The test is made parallel, i.e. the test programs are processed synchronously inboth halves of the processor. The comparator between both halves whichcauses a resetting of the processor in the case of disparity, is generally locked.It is only released for special test stages. The comparison between theprocessor halves runs via the software.
The processor is reset with the "RESET" command. (Impulse on the RESETline)
The diagnostics is started with the "DIAGP" command. (Impulse on the RESETand the BOOT line)
The register contents, not only the leading but also the current processorhalves, are displayed on the MP display.
The content of the diagnostics register is the same when PU-0 and PU-1 reachthe same result for an audit within a BAP.
Switch off the DCCs connected to BAP0/1
Connect the maintenance panel with BAP0 and BAP1 via the front panel plug ofthe M:PEX module.
Switch on DCCs connected to BAP0/1
An initialization program runs in both BAPs
Does the display on the MP show " DY A435" for at least one BAP? Y h...89N h...88
88 Special Fault Clearance
Carry out special fault clearance according to i ...NM:CP113C/CR -TAB, CP0052
– After finishing special fault clearance h...54
89 Start BAP Off-line Diagnostics
Select the BAP with the "SELECT UNIT" key for which "DY A435" wasdisplayed.
Transmit the "DIAGP" command with the menu keys for this BAP.
The off-line diagnostics are started. After the diagnostics have run fault-free "DY 3AAC" is displayed.
Is “ DY 3AAC” displayed? Y h...91N h...90
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90 Fault Clearance
Analyze the track numbers and clear faults using i....NM:CP113C/CR -TAB, CP052
– After successful fault clearance h...54
91 Check Internal Cabling
The BAP(s) is/are OK. The fault is in the cabling between BAP-0/1 and BCMY-0/1, or in the cabling between BCMY-0/1 and CMY-0/1 or in the CMY-0/1.
Check the internal cabling of the R:CP113C / R:CE against the cable laying list
– If any faults have been found in the internal cabling, remove faults andcontinue h...54
– If no faults have been found in the internal cabling, evaluate and clear faultsaccording to i....NM:
CP113C/CR-TAB, CP052
– After successful fault clearance h...54
92 Software Start-up with Test APS
The SW recovery begins as soon as the display on the MP for the BAP masterjumps from " DY Axx5" to " DY Bxx4". (xx - different track points of the recovery)
The following track points (among others) run trough:
– ‘DY Bx34‘
– ‘DY Bx54‘
– ‘DY Bx74‘
– ‘DY Bx94‘
or: ‘DY Dxx2‘ or ‘DY Exx1‘ (changes every 4 s)(xx-arbitrary, with:
– 'Dxx2' the call processing load is shown in Erl.
– 'Exx1' the entire processor load in percent)
Have the track points shown above been run trough? Y h...93N h...69
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93 System Messages
To make things clearer, only a headline is given for system messages.
If start-up with test APS was successful the following message is output:ALL DOUBLE FILES SYNCHRONIZED
Wait for system message
Branch to the following blocks according to the system reaction:
– ALL DOUBLE FILES SYNCHRONIZED is displayed h...94– Any other message is displayed h...69– No message is displayed h...74
94 Enter USER-ID and Password
USER-ID and password will be interrogated.For the first OMT “EWSD0” and for further OMTs “EWSD1”, “EWSD2”,“EWSD3” has to be entered as USER-ID.The password is “SYSTEM-1”.(All inputs in capital letters)
Enter USER-ID and password
95 Enter Date and Time
Enter date and time:
b ENTR TIME:DATE=yy-mm-dd,TIME=hh-mm-ss,WD=xx;
Secure time:
b CORR TIME:MODE=SECURE;
96 Check Fan Alarms
Switch off the individual fans in each fan module by the switches on themodules. After about 5 secs. a system message must be output.
System message fan alarm
Switch on fans again (do not wait for longer than 5 mins.)
Was it possible to generate this message from each fan module? Y h...98N h...97
!Caution:Do not leave the fans switched off for longer than 5 mins. as racks warm up rapidly, endangering compo-nents.
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97 Fault Clearance: IOP:TA
Prerequisites:Cabling between fans and AD:RAL / between AD:RAL and IOP:TA has beencontrolled according to: ......(see Fig. 3.15.
8)
Perform fault clearance of IOP:TA according to the MMN.
– After finishing fault clearance h...96
98 Install Hardware APS
The following is necessary before installing the hardware APS:
• error-free configuration of CP113C/CR with the test APS
• APS documentation
Observe the notes in the APS documentation supplied.
Note:The APS installation is to be carried out according to procedure SW140 (if deliv-ered on Tape) or according to procedure SW141 (If delivered on MOD).
Install the APS, using one of the following procedures (According to the mediumon which the APS is delivered).
– For APS delivered on tape h...NM:SW,PROC:SW140
– For APS delivered on MOD h...NM:SW,PROC:SW141
END
A30808-X3063-A403-2-7630 PROC:MTD_STC2925 – 1
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3.16 Switching on MTD STC 2925 of Storage Tek
MTD:STC2925
3.16.1 Introduction
• The scope of delivery of the magnetic tape device STC 2925 of Storage Tek containsa user manual: “2925 SCSI Maintenance Manual”
• MTD-fault clearance should only be carried out by especially trained personnel.
1 Check cabling to IOP:UNI
Check that interface cables to the IOP:UNI are connected according to ......NM:CP-MTD:STC 2925
2 Check switch settings
Open the door of MTD
Turn POWER switch at the front of the MTD to OFF
Unscrew the cover of MTD module frame (using special tool Torx 15) andremove foam rubber in front of the modules.
Unplug the IF card of the MTD
The switch settings must be checked or set according to ......NM:CP-MTD:STC 2925
Reconnect the IF card
Unplug the CS card of the MTD
The switch settings must be checked or set according to ......NM:CP-MTD:STC 2925
Reconnect the CS card
Replace the foam rubber in front of the modules and screw on the cover of theMTD module frame
!Observe the EGB regulations
!Observe the EGB regulations
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3 Switching on main supply switch/ cleaning tape path
Open the cover of the tape path
Before testing the MTD, cleaning must be carried out according to the instruc-tions given in
......MMN:CP113C/CR-MAINTMTD STC 2925
The cleaning should be recorded in a copy of the maintenance list which accom-panies the MMN. The list should be attached to the door of the rack.
If the cover does not close tightly due to a physical defect, the magnetic tape willnot be automatically threaded. In this case spare catches must be obtained andexchanged. ......MMN:
CP113C/CR-MAINTMTD STC 2925
Close the cover of the tape path
Switch on main supply switch at the rear of the MTD, if not already done
The location of the main supply switch is given in: ......NM:CP-MTD:STC 2925
4 Switch on magnetic tape device
A short self-test is carried out after switching on the power. Operating or hard-ware faults are shown on the MTD display. An explanation of the fault numbersis to be found on the inside of the MTD door, or in Section "2925 SCSI FCD”(Fault Code Dictionary 2925 with SCSI Interface) of the manual that is supplied.
The tape leader must be cleanly cut, i.e. not have a plastic threading end (cut offwith a special tool) as this prevents the tape from being guided when it isthreaded in. If automatic tape threading is not possible, e.g. at altitudes over1.800m, it must be threaded by hand. Manual threading is started by pressingthe LOAD-REW key twice. The magnetic spool must be turned so that the tapeis inserted into the suction opening. If SHUT DOOR is displayed on the MTD,ensure that the MTD door is properly closed.
Screw in fuse for MTD (in R:DEVB)
Close MTD door
Put POWER switch to ON position
If the self-test completes without finding a fault, - - - - is displayed.
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5 Diagnose magnetic tape device
The following inputs relate to the MTD keyboard
Open the MTD door
Insert a fault-free empty tape with a write enable ring, but do not load (ScratchTape)
Press <ENTER DIAG> enter '1 0' and then press <ENTER>
The last input starts the complete MTD device diagnostics. The magnetic tape isautomatically loaded after internal checks are carried out. Read/write tests withboth recording densities are then made. After a positive run the diagnostics endwith - - - - on the display. If there is a fault, a fault number is displayed. Detailsabout the cause of the fault together with fault numbers are listed in the STCManual, Section "2925 SCSI FCD” (Fault Code Dictionary 2925 with SCSI Inter-face) . Fault clearance is explained in the section for Maintenance,Removal/Replacement, Diagnostics in the STC Manual.
Is - - - - displayed after the diagnostics? Y h...7N h...6
6 Fault clearance
Carry out fault clearance as described in STC Manual, sections Maintenance,Removal/Replacement, Diagnostics
– After successful fault clearance h...7
7 Check Tape
Open MTD door
The following test overwrites any files that may exist!
Press the door contact (below left) with a pen or any other suitable tool and holdit down
Press <ENTER DIAG>, enter '47' and then press <ENTER>
The tape is written to with higher recording density 6250 BPI and read in theREAD AFTER WRITE MODE.
The following 2 system responses are possible:
• If the magnetic tape is fault-free, it is wound back when the end-of-tape mark(EOT) is recognized.
• If the magnetic tape is faulty, “47B” or “47C” is shown in the MTD-Display(In this case the tape cannot be used)
Is the tape fault-free? Y h...8N h...9
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8 Unload fault-free tape
Unload tape and remove it
Remove pen (or tool) from the door contact.
Close the MTD doorReturn to calling procedure
9 Unload faulty tape
Rewind tape
Unload tape and remove it
Tape must not be used anymore
Remove pen (or tool) from the door contact.
Close the MTD doorReturn to calling procedure
END
A30808-X3063-A403-2-7630 PROC:MTD_HP – 1
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3.17 Switching on the MTD HP 88781A of Hewlett Packard
MTD:HP 88781A
3.17.1 Introduction
• The scope of delivery of the magnetic tape device HP88781A contains a usermanual: “Tape Drive User´s Guide”.
• MTD-fault clearance should only be carried out by especially trained personnel.
• For fault clearance of the magnetic tape device a service manual, Part No.: 88781-90030 can be obtained from HP.
• The magnetic tape device has only two jumpers on the SCSI-interface module whichhave to be set. All other settings can be input at the control panel.
The configuration data of the magnetic tape device can be saved on a magnetic tapeor can be read in from a save tape.The device settings are stored in a non volatile memory. This memory is supplied bya 3V battery on the buffer module.(Lifetime of the battery approx. 10 years - type: BR 2335)
• The magnetic tape is to be threaded manually
• The door has to be closed after threading the magnetic tape
• The tape is automatically wound to the beginning-of-tape mark and the MTDswitches to the ONLINE state
• During ONLINE state the door is always locked
• The door can be unlocked by pressing the RESET key (ONLINE-display is switchedoff)
All inputs in the following procedure relate to the MTD keyboard
1 Check cabling to IOP:UNI
Check wether interface cables to the IOP:UNI are connected according to ......NM:CP-MTD:HP
2 Switch off power supply
Switch off power supply switch at the front of the MTD
Switch off power supply switch at the rear of the MTD
The location of the power supply switches is given in: ......NM:CP-MTD:HP
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3 Check/set jumper settings on SCSI-interface module
Unscrew the six screws (Torx 25) of the Interface module at the rear of the MTDand take it out (Jumpers are located on the Interface module)
......NM:CP-MTD:HP
Use grounding strap (According to ESD regulations)
Check or set the settings of the two jumpers according to: ......NM:CP-MTD:HP
Mount the Interface module at the rear of the MTD again
4 Switch on power supply/clean tape path
Plug in Hubbel-plug (Power supply) at the rear of the MTD ......NM:CP-MTD:HP
Plug in Interface-cable (The fasten plug (grounding) is not plugged in for thisMTD)
......NM:CP-MTD:HP
Screw in MTD fuse
Switch on power supply switch at the rear of the MTD ......NM:CP-MTD:HP
Open MTD door
Switch on power supply switch at the front of the MTD
Clean tape path, instructions are given in: ......MMN:CP113-MAINTMTD HP
The cleaning should be recorded in a copy of the maintenance list which accom-panies the MMN. The list should be attached to the door of the rack.
5 Check Device-Address
(The Device-Address (SCSI-ID) has to be set to 4)
b Press RESET keyDisplay: READY
b Press OPTION keyDisplay: TEST *
b Press NEXT key until ID * is displayed
b Press ENTER keyDisplay: ID 4
ID 4 indicates, that ID is set to 4
Has ID 4 been displayed? Y h...7N h...6
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6 Set Device-Address
b Press NEXT or PREV key until 4 is displayed
b Press ENTER keyDisplay: SET 4
b Press OPTION keyDisplay: READY
7 Information block: Configuration data
The device settings are stored in a non volatile memory. This memory issupplied by a 3V battery on the buffer module.(Lifetime of the battery approx. 10 years - type: BR 2335)
The configuration data of the MTD are already adapted to the system fordelivery of the complete EWSD-exchange.In case a magnetic tape device has to be replaced, the configuration data canbe saved to a save tape beforehand.This save tape must for safety reasons be set up directly at the time of thesystem initial switch on.
8 Load magnetic tape to save the configuration data
Load a small magnetic tape to save the configuration data and close the door.
Tape will be positioned to the beginning-of-tape mark (BOT), MTD switches toONLINE
Has the tape already been configured to save the configuration data? Y h...10N h...9
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9 Prepare save tape for configuration data (Test 150)
b Press RESET key
b Press OPTION key
b Press NEXT key until TEST * is displayed
b Press ENTER keyDisplay: TEST 0 (number 0 is blinking)
b Press NEXT or PREV key until 150 is displayed
b Press ENTER keyDisplay: ONCE *
b Press ENTER keyDisplay: A 6250 (Number 6250 is blinking indicating the recording
density)
b Press ENTER keyDisplay: RUN 150 (After termination PASS 150)
Magnetic tape has been written to with recording density of 6250 BPI andrewound
b Press OPTION keyDisplay: BOT
10 Saving configuration data (Test 128)
b Press OPTION key
b Press NEXT key until TEST * is displayedDisplay: TEST *
b Press ENTER keyDisplay: TEST 0 (Number 0 is blinking)
b Press NEXT or PREV key until 128 is displayed
b Press ENTER keyDisplay: ONCE *
b Press ENTER keyDisplay: RUN 128 (After termination PASS 128)
Magnetic tape has been written to
b Press OPTION keyDisplay: IDLE
b Press REW/UNLD key (Tape is rewound)Display: BOT
b Press REW/UNLD key (Tape is completely rewound)Display: UNLOAD, READY
Unload tape, label and store it
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11 Off-line-Diagnosis of magnetic tape device (Test 1)
Open MTD-door
Insert a fault-free empty tape with write enable ring (Scratch Tape)
A small magnetic tape is sufficient for the diagnosis, because the time for thediagnosis increases with the tape length.
Close MTD door. (Tape is loaded, door is locked, MTD switches to ONLINE)
b Press RESET key (Display ONLINE switched off)
b Press OPTION key and select the Function TEST * with the NEXT key (if TEST* is not displayed automatically)Display: TEST *
b Press ENTER keyDisplay: TEST 0 (Number 0 is blinking)
b Select Number 1 with NEXT key (Test 1)
b Press ENTER keyDisplay: ONCE *
b Press ENTER keyDisplay: RUN xyz (Test-Numbers)
The following system reactions are possible:
– Display: PASS 1 h...12– Display: FAIL 1 h...13
12 Off-line-Diagnosis was successful
b Press OPTION keyDisplay: BOT
b Press REW/UNLD key (Tape is completely rewound)
Unload test tape h...14
13 Off-line-Diagnosis was faulty
b Press ENTER key. Alternately the error number and the test number aredisplayed. e.g.:Display: ERR 78 und TEST 165
(The fault number and the test number must be written down)Fault clearance on site should only be carried out by trained O&M personnel.(faults can also be caused by a defective magnetic tape)
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For hints for fault clearance refer to:
• NM:CP113C-MTD:HP
• HP Service Handbook, chapter 8
b Press OPTION keyDisplay: IDLE
b Press REW/UNLD key (Tape is rewound)Display: BOT
b Press REW/UNLD key (Tape is completely rewound)
Unload test tape
14 Test magnetic tape (Test 2)
The quality of magnetic tapes can be tested with the magnetic tape device.(Off-line diagnosis, test 2)
The following test overwrites any files that may exist!
The test takes about 23 minutes for a magnetic tape of 730 m (big reel)
Load magnetic tape which is to be tested (With write enable ring)
Close door - Tape is loaded
b Press RESET key (Display ONLINE is switched off)
b Press OPTION key and select the Function TEST * by pressing the NEXT key (IfTEST * is not automatically displayed)Display: TEST *
b Press ENTER keyDisplay: TEST 0 (Number 0 is blinking)
b Select Number 2 by pressing NEXT key (Test 2)
b Press ENTER keyDisplay: ONCE *
b Press ENTER keyDisplay: RUN xyz (Test-Numbers)
The magnetic tape is tested with recording modes GCR (Group Code Recording6250 CPI) and PE (Phase Encoded 1600 CPI).
The following 2 system reactions are possible:
– PASS 2 (Magnetic tape is error-free) h...15– FAIL 2 (Magnetic tape is faulty) h...16
15 Unload fault-free tape
Unload tape and remove it
Close the MTD doorReturn to calling procedure
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16 Unload faulty tape
Rewind tape
Unload tape and remove it
Tape should not be used anymore
Close the MTD doorReturn to calling procedure
END
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4 Tables
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5 Appendix (APP)
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