ref 200 datasheet

8/12/2019 REF 200 Datasheet

1/19

1988 Burr-Brown Corporation PDS-851D Printed in U.S.A. October, 1993

FEATURES

COMPLETELY FLOATING:No Power Supply or Ground Connections

HIGH ACCURACY: 100A 0.5% LOW TEMPERATURE COEFFICIENT:

25ppm/C WIDE VOLTAGE COMPLIANCE:

2.5V to 40V

ALSO INCLUDES CURRENT MIRROR

APPLICATIONS

SENSOR EXCITATION

BIASING CIRCUITRY

OFFSETTING CURRENT LOOPS

LOW VOLTAGE REFERENCES

CHARGE-PUMP CIRCUITRY

HYBRID MICROCIRCUITS

REF200

DUAL CURRENT SOURCE/CURRENT SINK

DESCRIPTIONThe REF200 combines three circuit building-blocks

on a single monolithic chiptwo 100A currentsources and a current mirror. The sections are

dielectrically isolated, making them completely

independent. Also, since the current sources are two-

terminal devices, they can be used equally well as

current sinks. The performance of each section is

individually measured and laser-trimmed to achieve

high accuracy at low cost.

The sections can be pin-strapped for currents of 50A,100A, 200A, 300A or 400A. External circuitrycan be used to obtain virtually any current. These and

many other circuit techniques are shown in the

Applications section of this Data Sheet.

The REF200 is available in plastic 8-pin mini-DIP

and SOIC packages.

I

High

I

High Substrate

Mirror

In

I

Low

I

Low

Mirror

Out

Mirror

Common

1 2

1 2

8 7 6 5

1 2 3 4

100A 100A

International Airport Industrial Park Mailing Address: PO Box 11400, Tucson, AZ 85734 Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 Tel: (520) 746-1111 Twx: 910-952-1111

Internet: http://www.burr-brown.com/ FAXL ine: (800) 548-6133 (US/Canada Only) Cable: BBRCORP Telex: 066-6491 FAX: (520) 889-1510 Im mediate Product Info: (800) 548-6132

REF200

REF200

SBVS020


2/19

REF200 2

SPECIFICATIONS

At TA= +25C, VS= 15V, unless otherwise noted.

REF200AP, AU

PARAMETER CONDITION MIN TYP MAX UNITS

CURRENT SOURCES

Current Accuracy 0.25 1 %Current Match 0.25 1 %Temperature Drift Specified Temp Range 25 ppm/ COutput Impedance 2.5V to 40V 20 100 M

3.5V to 30V 200 500 MNoise BW = 0.1Hz to 10Hz 1 nAp-p

f = 10kHz 20 pA/ HzVoltage Compliance (1%) TMINto TMAX See Curves

Capacitance 10 pF

CURRENT MIRROR I = 100A UnlessOtherwise Noted

Gain 0.995 1 1.005

Temperature Drift 25 ppm/ CImpedance (output) 2V to 40V 40 100 MNonlinearity I = 0A to 250A 0.05 %Input Voltage 1.4 V

Output Compliance Voltage See Curves

Frequency Response (3dB) Transfer 5 MHz

TEMPERATURE RANGE

Specification 25 +85 COperating 40 +85 CStorage 40 +125 C

ELECTRICAL

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the users own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS

Applied Voltage ..................................................................... 6V to +40V

Reverse Current ........................................................................... 350AVoltage Between Any Two Sections .................................................80VOperating Temperature ................................................... 40C to +85CStorage Temperature .....................................................40C to +125CLead Temperature (soldering, 10s) .............................................. +300C (SOIC 3s)........................................................+260C

I

I

Substrate

Mirror Input

Low

Low

Mirror Common

Mirror Output

1

2

3

4

8

7

6

5

1

2

High

High

1

2

I

I

Top View DIP/SOIC

PACKAGE

DRAWING TEMPERATURE

PRODUCT PACKAGE NUMBER(1) RANGE

REF200AP 8-Pin Plastic DIP 006 25C to +85CREF200AU 8-Pin SOIC 182 25C to +85C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book. (2) Grade designation A

may not be marked. Absence of grade designation indicates A grade.

PACKAGE/ORDERING INFORMATION

ELECTROSTATICDISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradationto complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.


3/19

REF2003

TYPICAL PERFORMANCE CURVESAt TA= +25C, VS= +15V, unless otherwise noted.

100.1

100

99.9

99.8

99.7

99.6

99.5

2550 25 7550 1251000

Temperature (C)

Current(A)

85CDrift specified by

box method

(See text)

CURRENT SOURCE

TYPICAL DRIFT vs TEMPERATURE

600

500

400

300

200

100

0

50 10

Temperature Drift (ppm/C)

Quantity(Units)

Distribution of three

production lots

1284 Current Sources.

2015 25 3530 40 5045 55 6560

2 5

117

30 15 6 0 1 1

501

454

8666

CURRENT SOURCE

TEMPERATURE DRIFT DISTRIBUTION

101

100.8

100.6

100.4

100.2

100

99.8

99.6

99.4

99.2

Current(A)

99

0 5 10 15 20 25 30 35 40

Voltage (V)

CURRENT SOURCE

OUTPUT CURRENT vs VOLTAGECURRENT SOURCE

OUTPUT CURRENT vs VOLTAGE

0

100.5

100.4

100.3

100.2

100.1

100

99.9

99.8

99.7

99.6

99.5

Voltage (V)

1 2 3 4 5

Current(A)

55C

25C

125C

1000

900

800

700

600

500

400

300

200

100

Revers

eCurrent(A)

0

0 2 4 6 8 10 12

Reverse Voltage (V)

CURRENT SOURCE

REVERSE CURRENT vs REVERSE VOLTAGE

Reverse Voltage

Circuit Model

12k 7V

5k

Safe Reverse Current

Safe Reverse VoltageOutputCu

rrent(500pA/div)

CURRENT SOURCE

CURRENT NOISE (0.1Hz to 10Hz)

Time (500ms/div)


4/19

REF200 4

TYPICAL PERFORMANCE CURVES (CONT)At TA= +25C, VS= +15V, unless otherwise noted.

MIRROR TRANSFER NONLINEARITY

0

0.1

0.08

0.06

0.04

0.02

0

0.02

0.04

0.06

0.08

0.01

Current (A)

50 100 150 200 250

Nonlinearity(%o

f250A)

Data from Three

Representative Units(Least-square fit)

5

4

3

2

1

0

1

2

3

4

Error(%)

5

10A 100A 1mA

Mirror Current (A)

MIRROR GAIN ERROR vs CURRENT

V =

1.25VV = 1V

V = 1.5V

O

O

O

InputVoltage(V)

0

1A 10A 100A 1mA 10mA

Current

MIRROR INPUT VOTAGE/OUTPUT

COMPLIANCE VOLTAGE vs CURRENT

4

3

2

1

Input Voltage

Output

Compliance

Voltage


5/19

REF2005

FIGURE 1. Simplified Circuit Diagram.

(Substrate)

Current

Source

(1 of 2)

4k

8X

8,7

5k

1k

1,2

6

3

5 4

1k

12k

Current

Mirror

APPLICATIONS INFORMATIONThe three circuit sections of the REF200 are electrically

isolated from one another using a dielectrically isolated

fabrication process. A substrate connection is provided (pin

6), which is isolated from all circuitry. This pin should be

connected to a defined circuit potential to assure rated DC

performance. The preferred connection is to the most nega-

tive constant potential in your system. In most analogsystems this would be VS. For best AC performance, leave

pin 6 open and leave unused sections unconnected.

Drift performance is specified by the box method, as

illustrated in the Current vs Temperature plot of the typical

performance curves. The upper and lower current extremes

measured over temperature define the top and bottom of the

box. The sides are determined by the specified temperature

range of the device. The drift of the unit is the slope of the

diagonaltypically 25ppm/C from 25C to +85C.

If the current sources are subjected to reverse voltage, a

protection diode may be required. A reverse voltage circuit

model of the REF200 is shown in the Reverse Current vs

Reverse Voltage curve. If reverse voltage is limited to lessthan 6V orreverse current is limited to less than 350A, noprotection circuitry is required. A parallel diode (Figure 2a)

will protect the device by limiting the reverse voltage across

the current source to approximately 0.7V. In some applica-

tions, a series diode may be preferable (Figure 2b) because

it allows no reverse current. This will, however, reduce the

compliance voltage range by one diode drop.

Applications for the REF200 are limitless. Application Bul-

letin AB-165 shows additional REF200 circuits as well as

other related current source techniques. A collection of

circuits is shown to illustrate some techniques. Also, see

AB-165A.

FIGURE 2. Reverse Voltage Protection.

100A

Bidirectional

Current Source

D4 D2

D D31

D2

D1100A

100A

NOTE: All diodes = 1N4148.

Bidirectional

Current Source

(a) (b) (c) (d)


6/19

REF200 6

FIGURE 3. 50A Current Source.

FIGURE 4. 200A, 300A, and 400A Floating Current Sources.

FIGURE 5. 50A Current Sinks.

300A

100A

45

3

In Out

Com

Mirror

100A

Compliance = 4V

(b)

400A

100A

45

3

In Out

Com

Mirror

100A

Compliance = 4V

(c)(a)

200A

100A 100A

(b)

50A

100A

45

3

In Out

Com

Mirror

VS

100k

50A

100A

45

3

In Out

Com

Mirror

(c)

Compliance to

V + 5.1VS

+VS

VS

5.1V

1N4689

27k

0.01F

100A

45

3

In Out

Com

Mirror

(a)

VS

Compliance to

V + 5VS

+VS

100A50A

Compliance to

Ground

VS

+VS

100A

IOUT

100A

50A45

3

In Out

Com

Mirror


7/19

REF2007

100A/200A

45

3

In Out

Com

Mirror

SCompliance to V + 1.5V

+VS

100A100A

SV

FIGURE 6. Improved Low-Voltage Compliance. FIGURE 7. 100A Current Source80V Compliance.

100A

100A

40k

40k 0.01F

0.01F

1N41481N4148

1N41481N4148

(e) Bidirectional 200A

cascoded current source.

100A

100A40k

40k 0.01F

0.01F

(d) Floating 200A cascoded

current source.

100A

Load

VS

+VS

(a) Compliance approximate

to Gnd. HV compliance

limited by FET breakdown.

100A

Load

+VS

(b) Compliance to +V 5V.

High

Low

100A

VS

33k0.01F

S

100A

Loa

d

+VS

(c)

VS

27k

5.1V

1N4689

NOTES: (1) FET cascoded current sources offer improved output impedance and high frequency operation. Circuit in (b)

also provides improved PSRR. (2) For current sinks (Circuits (a) and (b) only), invert circuits and use N channel JFETS.

FIGURE 8. FET Cascode Circuits.

101

100

99

0 10 20 30 40 50 60 70 80

Applied Voltage (V)

Provides 2X Higher Compliance Voltage

SERIES-CONNECTED CURRENT SOURCES

CURRENT vs APPLIED VOLTAGE

Current(A)

100A

100A

High

Low


8/19

REF200 8

FIGURE 9. Op Amp Offset Adjustment Circuits.

To

Other

Amps

Op Amp

V

R

+V

NOTE: (1) For N Op Amps, use Potentiometer Resistance = N 100.

100A

51

51

S

IN

B

OUT

RA

V

VS

Using Standard Potentiometer

V = V (R /R )

Offset Adjustment Range = 5mVOUT IN B A

To

Other

Amps

Op Amp

V

R

+V

100A

S

IN

B

OUT

RA

V

VS

Using Bourns Op Amp Trimpot

V = V (R /R )

Offset Adjustment Range = 5mVOUT IN B A

(1)

100Bourns Trimpot

(1)2k Linear

100A 100A


9/19

REF2009

R

100A

Reference

V

100A

S

R2

0.01F

R

(N R )2

1

I = N 100AOUT

(1)

R

(N R )2

1

I = N 100AOUT

(1)

100A

0.01F

R2

+VS

+V

100A

S

OPA602

0.01F NR

I = (N +1) 100AO

R0.01F NR

I = (N +1) 100AO

R

100A

OPA602

0.01F NR

I = (N +1) 100AO

10pF

(a) (b)

(d)(c)

(e)

VS

OPA602

R NR IOUT

1k 4k 500A1k 9k 1mA

100k 9.9k 10mA

EXAMPLES

FEATURES:

(1) Zero volts shunt compliance.

(2) Adjustable only to values above

reference value.

NOTE:Current source/sink swing to the

Load Return rail is limited only

by the op amp's input common

mode range and output swing

capability. Voltage drop across R

can be tailored for any amplifier to

allow swing to zero volts from rail.

NOTE: (1) Burr BrownOPA602 or OPA128

EXAMPLES

R1

R2

IOUT

100 10M 1nA10k 1M 1A

10k 1k 1mA

Use OPA128

IO= 100A (N + 1). Compliance 3.5V

with 0.1V across R. Max IOlimited by FET.

For IO= 1A, R = 0.1, NR = 1k.

FIGURE 10. Adjustable Current Sources.


10/19

REF200 10

FIGURE 12. Precision Triangle Waveform Generator.

FIGURE 11. RTD Excitation With Three Wire Lead Resistance Compensation.

1N4148N4148

1N4148N4148

BidirectionalCurrent Source1/2REF

OPA6

R

CTriangle Output

Square Output

2Vp-p

2Vp-p

10 k

Frequency = 1/4RC Hz)Frequency = 25/C Hz)C is in F and R = 10k )

7

V = Gain 200A RTDOUT

A B

O

C

I

VS

+VS

RTDCable Shield

200A

Reference

Current

200A

Compensation

Current

REF200

1

ROFFSET

INA110

Instrumentation Amplifier

2 3 4

8 6 5


11/19

REF20011

FIGURE 13. Precision Duty-Cycle Modulator.

15V

100A

0.1F

SiliconixJ109

50k

IOUTFor current source,invert circuitry anduse P-Channel FET.

15V

100A

0.1F

SiliconixJ109

50 k

IOU T For current source,invert circuitry anduse P-Channel FET.50 k0.1F

100A

FIGURE 14. Low Noise Current Sink. FIGURE 15. Low Noise Current Sink with Compliance

Below Ground.

100k

1/4OPA

60k100A + Bridge(See Figure 12)

V = +10V: 100% Duty Cycle = +10V: 100 Duty CycleV = 0V: 50 Duty CycleV = 10V: 0 Duty Cycle

INININ

12Vp-pDuty Cycle Out

C

VIN10V V 10VIN

100A + Bridge(See Figure 12)

1/4OPA

1/4OPA


12/19

REF200 12

FIGURE 17. Rate Limiter.

FIGURE 16. Floating 300A and 400A Cascoded Current Sources.

FIGURE 18. 25mA Floating Current Source.

27k

In OutMirrorCom

20k 0.01F

0.01F100A

100A

High300A

2N5116

2N4340

5 4

3300ALow

(a) Regulation (15V to 30V = 0.00003%/V (10Ga) Regulation (15V to 30V = 0.00003 /V (10G)

In OutMirrorCom

20k 0.01F100A

High400A

2N5116

2N4340

5 4

3400ALow

(a) Regulation (15V to 30V = 0.000025%/V (10Ga) Regulation (15V to 30V = 0.000025 /V (10G)

100A

10 0

10 0

10 0100

40.20k

Low

V

100A

High

25mACompliance4V to 30V

NOTE: Each am plifier 1/4 LM324.Op amp po wer supplies are derivedwithin the circuitry, and this quiescentcurrent is included in the 25mA .

S

+VS

10k

10k

OPA602

C

100AVS

+VS

V = VI

100A

VI

V Rate Limit = 100A/CODiodes: 1N4148or PWS740-3Diode Bridge forreduced V .OS

O


13/19

REF20013

10 5 +5 +10

1 0

5

+5

+10

OPA602

100A

1N4148

1N4148

R

(50k)

V IR

(50k)

+15V

10pFVO

OPA602

1N4148

1N4148

R

(50k)

V IR

(50k)

10pFVO

100A

15V

10 5 +5 +10

1 0

5

+5

+10

For V > 5V: V = 0For V < 5V: V = V 5V Dead to 100A R)OO

II I

For V < 5V: V = 0For V > 5V: V = 5V V Dead to 100A R)OO

II I

O

O

V I

V I

FIGURE 19. Dead-Band Circuit.

OPA602

100A

1N4148

1N4148

R

(50k)

R

(50k)

+15V

10pF

OPA602

1N4148

1N4148

R

(50k)

VI

R

(50k)

10pF100A

15V

10 5 +5 +10

10

5

+5

+10

For V > 5V: V = V 5VFor V < 5V: V = V + 5V (Dead to 100A R)

OO

II I

O

VI

I

OPA602

VO

10k

10k

10k

FIGURE 20. Double Dead-Band Circuit.


14/19

REF200 14

FIGURE 22. Voltage Reference.FIGURE 21. Low-Voltage Reference.

FIGURE 23. Bipolar Limiting Circuit.

FIGURE 24. Limiting Circuit.

100A

1

+V

V = 100V

S

O

100A

10k

+V

V = 1V

S

OOPA602

0.01F

100A

with bridge

(See Figure 2)

OPA121

100F

VOOPA121

VIR

(50k)

1k

V = V (5V < V < 5V)V = 5V (V > 5V)V = 5V (V < 5V)(Bound = 100A R)

OOO

I II

I

10 5 +5 +10

10

5

+5

+10O

VI

+7.5V (R = 75k)+5V (R = 50k)+2.5V (R = 25k)

2.5V (R = 25k)+5V (R = 50k)+7.5V (R = 75k)

R

(50k)

OPA121

100F

VOOPA121

VI

100A

1k

1N4148

V = V (V < 5V)V = 5V (V > 5V)(V = 100A R)

OO

I II

LIMIT

10 5 +5 +10

10

5

+5

+10O

VI

+7.5V (R = 75k)+5V (R = 50k)+2.5V (R = 25k)


15/19

REF20015

V

V

CENTER

O

I

WV , +V = 100A RW

WV W+V

V

5V

The

Window

0

1k

VS

VOCENTERV

VI

100A

100A

0.01F

R(3)

(2)

(1)

0.01F(1)

R(3)

+5V

1/2LM393

1/2LM393

NOTES: (1) Capacitors optional to reduce noise and switching time.(2) Programs center of threshold voltage. (3) Programs window voltage.

+VS

(2)

FIGURE 25. Window Comparator.

FIGURE 26. Instrumentation Amplifier with Compliance to VS.

100A

V = +In (In)O

100A

VS

INA105

+VS

InPMI

MAT03+In

1/2OPA1013

1/2OPA1013


16/19

PACKAGING INFORMATION

Orderable Device Status (1) PackageType

PackageDrawing

Pins PackageQty

Eco Plan (2) Lead/Ball Finish MSL Peak Temp(3)

REF200AP OBSOLETE PDIP P 8 TBD Call TI Call TI

REF200AU ACTIVE SOIC D 8 75 Green (RoHS &no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

REF200AU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &no Sb/Br)


REF200AU/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS &no Sb/Br)


REF200AUE4 ACTIVE SOIC D 8 75 Green (RoHS &no Sb/Br)


REF200AUG4 ACTIVE SOIC D 8 75 Green (RoHS &no Sb/Br)


(1) The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND:Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW:Device has been announced but is not in production. Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontentfor the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 16-Feb-2009

Addendum-Page 1
http://www.ti.com/productcontenthttp://www.ti.com/productcontent


17/19

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1(mm)

W(mm) Q

REF200AU/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 1


18/19

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

REF200AU/2K5 SOIC D 8 2500 346.0 346.0 29.0

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 2


19/19

I M P O R T A N T N O T I C E

T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a k e c o r r e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e a n y p r o d u c t o r s e r v i c e w i t h o u t n o t i c e . C u s t o m e r s s h o u l d o b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y t h a t s u c h i n f o r m a t i o n i s c u r r e n t a n d c o m p l e t e . A l l p r o d u c t s a r e s o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c k n o w l e d g m e n t .

T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c a b l e a t t h e t i m e o f s a l e i n a c c o r d a n c e w i t h T I s s t a n d a r d

w a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t T I d e e m s n e c e s s a r y t o s u p p o r t t h i s w a r r a n t y . E x c e p t w h e r e m a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d u c t i s n o t n e c e s s a r i l y p e r f o r m e d .

T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . C u s t o m e r s a r e r e s p o n s i b l e f o r t h e i r p r o d u c t s a n d a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t o m e r p r o d u c t s a n d a p p l i c a t i o n s , c u s t o m e r s s h o u l d p r o v i d e a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .

T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o r k r i g h t , o r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f o r m a t i o n p u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .

R e p r o d u c t i o n o f T I i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p a n i e d b y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n . I n f o r m a t i o n o f t h i r d p a r t i e s m a y b e s u b j e c t t o a d d i t i o n a l r e s t r i c t i o n s .

R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e v o i d s a l l

e x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n d i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .

T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i f e s u p p o r t ) w h e r e a f a i l u r e o f t h e T I p r o d u c t w o u l d r e a s o n a b l y b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a r t i e s h a v e e x e c u t e d a n a g r e e m e n t s p e c i f i c a l l y g o v e r n i n g s u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t y a n d r e g u l a t o r y r a m i f i c a t i o n s o f t h e i r a p p l i c a t i o n s , a n d a c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r y a n d s a f e t y - r e l a t e d r e q u i r e m e n t s c o n c e r n i n g t h e i r p r o d u c t s a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n g a n y a p p l i c a t i o n s - r e l a t e d i n f o r m a t i o n o r s u p p o r t t h a t m a y b e p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s a g a i n s t a n y d a m a g e s a r i s i n g o u t o f t h e u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e T I p r o d u c t s a r e s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r o d u c t s d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e m e e t m i l i t a r y s p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c t s w h i c h T I h a s n o t d e s i g n a t e d a s m i l i t a r y - g r a d e i s s o l e l y a t t h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e g a l a n d r e g u l a t o r y r e q u i r e m e n t s i n c o n n e c t i o n w i t h s u c h u s e .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e s p e c i f i c T I p r o d u c t s a r e d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t , i f t h e y u s e a n y n o n - d e s i g n a t e d p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t o m e e t s u c h r e q u i r e m e n t s .

F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m e n t s p r o d u c t s a n d a p p l i c a t i o n s o l u t i o n s :

P r o d u c t s A p p l i c a t i o n s A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e D L P P r o d u c t s w w w . d l p . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d D S P d s p . t i . c o m D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r o l C l o c k s a n d T i m e r s w w w . t i . c o m / c l o c k s M e d i c a l w w w . t i . c o m / m e d i c a l I n t e r f a c e i n t e r f a c e . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y L o g i c l o g i c . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w o r k P o w e r M g m t p o w e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m T e l e p h o n y w w w . t i . c o m / t e l e p h o n y R F I D w w w . t i - r f i d . c o m V i d e o & I m a g i n g w w w . t i . c o m / v i d e o R F / I F a n d Z i g B e e S o l u t i o n s w w w . t i . c o m / l p r f W i r e l e s s w w w . t i . c o m / w i r e l e s s

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