product reliability qualification report
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PEX8605_3andUSB3380_2_2380_AB_Rel_Qual_Report_Rev2PLX Technology
870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
1
September 14, 2012
Prepared and Reviewed By: Thomas Huang Quality and Reliability Engineer
Approved By: Brete Bigley Director, Quality Assurance and Reliability
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification for the PEX8605/3 Switch and USB3380/2, USB2380 Bridge devices, revision AB silicon, in a 90nm fab process technology. An aQFN (Advanced Quad Flat No-Lead Package) and QFN (Quad Flat No-Lead Package) package assembly technology are utilized for the Switch and Bridge families respectively. This document summarizes the qualification plan and the results to date of the product as per below. 2. Scope: The PEX8605/3 and USB3380/2, USB2380 devices are fabricated in a 90nm process technology from Renesas and assembled in 10x10 QFN/aQFN package type at ASE Kaohsiung, Taiwan (ASEK). The PEX8605 (Switch) and USB3380 (Bridge) will be used as the prime reliability qualification vehicles for the following devices: PEX8605 and PEX8603 switches; USB3382, USB3381, and USB3380 bridges. Renesas’s 90nm technology node generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-line monitors, and an excellent reliability history. The PEX8605 and USB3380 will be used to separately qualify their respective switch and bridge families. The 10x10 mm 136L aQFN and 10x10 mm 88L QFN package is already qualified previously via a full package qualification of the PEX8605-AB50NI G and OXU3102-AANC G device (reports attached herein). 3. Background information:
Wafer Fabrication Information (Renesas)
Process Type CMOS LOGIC (CUP) General Purpose Process Name 90nm Number of Metal Layers 6
Lead Frame Information
Lead Frame material Cu (C7025) Assembly Process Information (ASEK)
Package Name USB 3380, USB 2380 QFN (Quad Flat No-Lead Package)
Package Size 10x10 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% matte Sn MSL – Moisture Sensitivity Level 3 Package Name PEX 8605, PEX 8603, USB 3382
aQFN (Advance Quad Flat No-Lead Package) Package Size 10x10 Lead Count 136L Lead Frame Pitch 0.5mm Wire Bond Material Cu Plating Composition 100% matte Sn MSL – Moisture Sensitivity Level 3
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification results for PEX8605-AB50NI G and the USB3380- AB50NI G devices.
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max, Sample Size: 120
Device Lot # Date Cod
0 Pass
PEX8605 8314D-ES 1219 120 500 hrs Cum
0 Pass
PEX8605 8314D-ES 1219 120 1000 hrs Cum
0 Pass
USB3380 8314A-ES 1218 120 0 Pass
Conditional and Full Reliability Qualification only require 168hrs HTOL. 1000 hrs HTOL is for information only. Based on the Arrhenius equation with Ta = 125 C, Tuse = 55 C, CL = 60 % and Ea =0.7 V, the expected failure rate in FIT (Failures in Time) is 25 FIT.
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Device Lot # Date Cod
2000V
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 5 0 Pass
b. Charge Device Model JESD22-C101D, 500V, Sample Size: 5
Device Lot # Date Cod
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 5 0 Pass
c. Machine Model JESD22-A115A, 200V, Sample Size: 5
Device Lot # Date Cod
200V
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 5 0 Pass
4.3 Latch Up, JESD 78A, +/- 100mA, Sample Size: 6
Device Lot # Date Cod
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 6 0 Pass
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5. Package Qualification Results
ASEK ‘s QFN package technology was qualified previously by PLX. The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and the attachment below is the package qualification results.
PLX_310x_Full_Reliab ility_Qualification_Repo ASEK ‘s aQFN package technology was also qualified previously by PLX. The PEX8605-AB50NI G is assembled in ASEK’s 10x10 aQFN 136L package technology and the attachment below is the package qualification results.
PEX8605_3andUSB3 380_2_2380_Full_Rel
6.0 CONCLUSION This reliability qualification plan applies to the PEX8605/3 and USB3380/2, USB2380 family of products in revision AB silicon, all of which are manufactured with the same process technology (90nm), package type (aQFN/QFN), and materials. The PEX8605/USB3380 devices have been utilized as the qualification vehicles for the family of products which includes: PEX8605-AB50NI G, PEX8603-AB50NI G, USB3382-AB50NI G, USB3381-AB50NI G, and USB3380-AB50NI G. Base on the reliability data completed to date, PLX grants full qualification approval for the subject products.
7.0 REVISION HISTORY
Revision Date Orginator Comments Rev. 0 1/5/12 Thomas Huang Product Reliability Qualification Plan. Rev. 1 7/23/12 Thomas Huang Full Product Reliability Qualification Done. Rev. 2 9/14/12 Thomas Huang Update HTOL 1000hrs Result (Information Only).
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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Family Qualification: PEX8605-AA50NI G PEX8603-AA50NI G USB3382-AA50NI G USB3380-AA50NI G USB2380-AA50NI G
November 18, 2011
Prepared and Reviewed By: Thomas Huang Quality and Reliability Engineer
Approved By: Brete Bigley Director, Quality Assurance and Reliability
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification for the PEX8605/3 Switch and USB3380/2, USB2380 Bridge devices, revision AA silicon, in a 90nm fab process technology. An aQFN (Advanced Quad Flat No-Lead Package) and QFN (Quad Flat No-Lead Package) package assembly technology are utilized for the Switch and Bridge families respectively. This document summarizes the qualification plan and the results to date of the product as per below. 2. Scope: The PEX8605/3 and USB3380/2, USB2380 devices are fabricated in a 90nm process technology from Renesas and assembled in 10x10 QFN/aQFN package type at ASE Kaohsiung, Taiwan (ASEK). The PEX8605 (Switch) and USB3380 (Bridge) will be used as the prime reliability qualification vehicles for the following devices: PEX8605 and PEX8603 switches; USB3382, USB3381, and USB3380 bridges. Renesas’s 90nm technology node generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-line monitors, and an excellent reliability history. The PEX8605 and USB3380 will be used to separately qualify their respective switch and bridge families. PEX8605 is assembled with a 10x10 mm 136L aQFN at ASEK and will be used to qualify the aQFN package technology. The 10x10 mm 88L QFN package is already qualified previously via a full package qualification of the OXU3102-AANC G device (report attached herein). 3. Background information: Wafer Fabrication Information (NEC)
Process Type CMOS LOGIC (CUP) General Purpose Process Name 90nm Number of Metal Layers 6
Lead Frame Information Assembly Process Information (ASEK)
Package Name USB 3380, USB 2380 QFN (Quad Flat No-Lead Package)
Package Size 10x10 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% matte Sn MSL – Moisture Sensitivity Level 3 Package Name PEX 8605, PEX 8603, USB 3382
aQFN (Advance Quad Flat No-Lead Package) Package Size 10x10 Lead Count 136L Lead Frame Pitch 0.5mm Wire Bond Material Cu Plating Composition 100% Ni/Pd/Au MSL – Moisture Sensitivity Level 3
Lead Frame material Cu (C7025)
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification results for PEX8605-AA50NI G and the USB3380- AA50NI G devices.
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max, Sample Size: 120 Note: *= Conditional qualification/release ** = Full qualification/release
Device Lot# / Date Code SS Time point Results Notes
PEX8605 lot# 8687H-E; DC 1132 40
168 hr Cum*
Conditional Qualification, Completion Date: 10/4/2011
PEX8605 lot# 8696A-ES; DC 1133 40 0/40 PEX8605 lot# 8722A-ES; DC 1136 40 0/40 USB3380 lot# 8687I-ES; DC 1133 40 0/40 USB3380 lot# 8696B-ES; DC 1135 40 0/40
USB3380 lot# 8722B-ES; DC 1136 40 0/40
PEX8605 lot# 8687H-E; DC 1132 40
500 hr Cum
PEX8605 lot# 8687H-E; DC 1132 40
1000 hr Cum**
PEX8605 lot# 8696A-ES; DC 1133 40 0/40
PEX8605 lot# 8722A-ES; DC 1136 40 0/40
USB3380 lot# 8687I-ES; DC 1133 40 0/40
USB3380 lot# 8696B-ES; DC 1135 40 0/40
USB3380 lot# 8722B-ES; DC 1136 40 0/40
Based on the Arrhenius equation with Ta = 125 C, Tuse = 55 C, CL = 60 % and Ea =0.7 V, the failure rate in FIT (Failures in Time) after full qualification is 98 FIT.
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Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 5 0/5 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 5 0/5
b. Charge Device Model JESD22-C101D, 500V, Sample Size: 5
Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 5 0/5 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 5 0/5
c. Machine Model JESD22-A115A, 200V, Sample Size: 5
Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 5 0/5 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 5 0/5
4.3 Latch Up, JESD 78A, +/- 100mA, Sample Size: 6
Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 6 0/6 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 6 0/6
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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5. Package Qualification Results ASEK ‘s QFN package technology was qualified previously by PLX. The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and the attachment below is the package qualification results.
PLX_310x_Full_Reliab ility_Qualification_Repo
The PEX8605 G is assembled in ASEK’s 10x10 aQFN 136L package technology and below is the package qualification plan and results. Note: *= Conditional qualification/release ** = Full qualification/release
5.1 Pre-Condition Level 2A (JESD22-A113-F), 192 hrs 30C/60%RH, Peak 260 C, Sample Size: 180
Lot# / Date Code SS Results Notes
lot# 8687H-E; DC 1132 180 0/180 Conditional / Full Qualification, Completion Date: 10/4/2011
lot# 8696A-ES; DC 1133 180 0/180 lot# 8722A-ES; DC 1136 180 0/180
5.2 Biased HAST (JESD22-A110C), 121C/100% RH, 96 hrs, Vdd Nominal, Sample Size: 45
Lot# / Date Code SS Time Point Results Notes lot# 8687H-E; DC 1132 45
96 hrs Cum** 0/45 Conditional / Full
Qualification, Completion Date: 10/20/2011
lot# 8696A-ES; DC 1133 45 0/45 lot# 8722A-ES; DC 1136 45 0/45
5.3 Temperature Cycle Test ( JESD22-A104C, Condition C), -65 C to 150 C for 1000 Cycles,
Sample Size: 45
Lot# / Date Code SS Cycles Results Notes lot# 8687H-E; DC 1132 45
250 cycles Cum* 0/45 Conditional Qualification,
Completion Date: 10/20/2011
lot# 8696A-ES; DC 1133 45 0/44*** lot# 8722A-ES; DC 1136 45 0/45 lot# 8687H-E; DC 1132 45
500 cycles Cum* 0/45
lot# 8696A-ES; DC 1133 44 0/44 lot# 8722A-ES; DC 1136 45 0/45 lot# 8687H-E; DC 1132 45
1000 cycles Cum**
0/45 Full Qualification, Completion Date: 11/18/2011
lot# 8696A-ES; DC 1133 44 0/44 lot# 8722A-ES; DC 1136 45 0/45
*** 1 unit sustained mechanical damage by the handler during ATE testing.
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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September 21, 2010
Prepared and Reviewed By: Norbe Mendoza Staff, Quality and Reliability Engineer
Approved By: Brete Bigley
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification of the OX3102 device in .13um G fab process technology with QFN (Quad Flat No-Lead Package) assembly. This document summarizes the qualification plan and the results of the product as per below.
2. Scope: The OX3102, fabricated in .13um G process technology and assembled in 10x10 QFN package will be used as the prime reliability qualification vehicle for the following devices: OX3101 and OX3100. TSMC .13um G technology generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-process monitors, and an excellent reliability history.
3. Background information: Wafer Fabrication Information (TSMC)
Process Type CMOS LOGIC (CUP) General Purpose Process Name .13um Number of Metal Layers 6
Lead Frame Information
Assembly Process Information (ASEK) Package Name QFN, Quad Flat No-Lead Package Package Size 10x10x.9mm3 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% Sn MSL – Moisture Sensitiv ity Level 3
Lead Frame material C7025
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification test plan and results for OX3102, .13 um FSG, 1P/6M device. Note: *= Conditional qualification/release
** = Full qualification/release *** = TSMC Data
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max
Sample Size: 120
G92029.1*** G92030.1*** G92030.1*** Lot P6C555.00E/DC 1025
100
100
100
120
100
100
100
120
100
100
100
120
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Sample Size: 6
Lot P6C555.00E/DC 1025 6
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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5 Package Qualification Results The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and below is the package qualification plan and results. Note: *= Conditional qualification/release ** = Full qualification/release
5.1 Pre-Condition Level 2A (JESD22-A113-F), 192 hrs 30C/60%RH, Peak 260 C Sample Size: 180
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
*
5.2 uHAST per JESD22-A110C, 121C/100% RH, 96 hrs (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.3 Temperature Cycle Test (JESD22-A104C, Condition B), - 55C to 125C 1000 cycles
(after precon from 1 above) Sample Size: 45
Lot #/ID SS Cycles Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.4 High Temperature Storage Life (JESD22-A103-C), 150C for 1000 hours (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
Completion Date: 9/21/2010
5.5 Pressure Cooker Test (JESD-A102-C), 100%RH/ 121C, 168 Hrs. Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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B. Post, Pre-Condition
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5.7 Package Dimension Measurements
6.0 CONCLUSION This reliability qualification report applies to the OX3102 family of products, all of which are manufactured with the same process technology (.13um G), package type (QFN), and materials. The OX3102 device has been utilized as the qualification vehicle for the family of products which includes: OX3102, OX3101, and OX3100.
7.0 REVISION HISTORY Revision Date Orginator Comments Rev. 0 2/12/10 Norbe Mendoza Product Reliability Qualification Plan Rev. 1.0 8/11/10 Norbe Mendoza Conditional Qualification Release Rev. 2.0 9/21/10 Norbe Mendoza Full Qualification Release
thuang
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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5.4 High Temperature Storage Life (JESD22-A103-C), 150C for 1000 Hrs., Sample Size: 45
Lot# / Date Code SS Time Point Results Notes
lot# 8687H-E; DC 1132 45 1000 hrs Cum**
0/45 Full Qualification, Completion Date: 11/18/2011
lot# 8696A-ES; DC 1133 45 0/45 lot# 8722A-ES; DC 1136 45 0/45
5.5 Pressure Cooker Test (JESD-A102-C), 100%RH/ 121C, 168 Hrs., Sample Size: 45
Lot# / Date Code SS Time Point Results Notes lot# 8687H-E; DC 1132 45
168 hrs Cum** 0/45 Conditional / Full
Qualification, Completion Date: 10/20/2011
lot# 8696A-ES; DC 1133 45 0/45 lot# 8722A-ES; DC 1136 45 0/45
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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6.0 CONCLUSION This reliability qualification plan applies to the PEX8605/3 and USB3380/2, USB2380 family of products in revision AA silicon, all of which are manufactured with the same process technology (90nm), package type (aQFN/QFN), and materials. The PEX8605/USB3380 devices have been utilized as the qualification vehicles for the family of products which includes: PEX8605-AA50NI G, PEX8603-AA50NI G, USB3382- AA50NI G, USB3381-AA50NI G, and USB3380-AA50NI G. Based on the reliability data completed to date, PLX grants full qualification approval for the subject products.
7.0 REVISION HISTORY
Revision Date Orginator Comments Rev. 0 02/24/11 Norbe Mendoza Product Reliability Qualification Plan Rev. 1 10/19/11 Thomas Huang Conditional Reliability Qualification Report Rev. 2 11/18/11 Thomas Huang Full Reliability Qualification Report
thuang
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
1
September 21, 2010
Prepared and Reviewed By: Norbe Mendoza Staff, Quality and Reliability Engineer
Approved By: Brete Bigley
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification of the OX3102 device in .13um G fab process technology with QFN (Quad Flat No-Lead Package) assembly. This document summarizes the qualification plan and the results of the product as per below.
2. Scope: The OX3102, fabricated in .13um G process technology and assembled in 10x10 QFN package will be used as the prime reliability qualification vehicle for the following devices: OX3101 and OX3100. TSMC .13um G technology generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-process monitors, and an excellent reliability history.
3. Background information: Wafer Fabrication Information (TSMC)
Process Type CMOS LOGIC (CUP) General Purpose Process Name .13um Number of Metal Layers 6
Lead Frame Information
Assembly Process Information (ASEK) Package Name QFN, Quad Flat No-Lead Package Package Size 10x10x.9mm3 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% Sn MSL – Moisture Sensitiv ity Level 3
Lead Frame material C7025
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification test plan and results for OX3102, .13 um FSG, 1P/6M device. Note: *= Conditional qualification/release
** = Full qualification/release *** = TSMC Data
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max
Sample Size: 120
G92029.1*** G92030.1*** G92030.1*** Lot P6C555.00E/DC 1025
100
100
100
120
100
100
100
120
100
100
100
120
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
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Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Sample Size: 6
Lot P6C555.00E/DC 1025 6
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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5 Package Qualification Results The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and below is the package qualification plan and results. Note: *= Conditional qualification/release ** = Full qualification/release
5.1 Pre-Condition Level 2A (JESD22-A113-F), 192 hrs 30C/60%RH, Peak 260 C Sample Size: 180
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
*
5.2 uHAST per JESD22-A110C, 121C/100% RH, 96 hrs (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.3 Temperature Cycle Test (JESD22-A104C, Condition B), - 55C to 125C 1000 cycles
(after precon from 1 above) Sample Size: 45
Lot #/ID SS Cycles Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.4 High Temperature Storage Life (JESD22-A103-C), 150C for 1000 hours (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
Completion Date: 9/21/2010
5.5 Pressure Cooker Test (JESD-A102-C), 100%RH/ 121C, 168 Hrs. Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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B. Post, Pre-Condition
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5.7 Package Dimension Measurements
6.0 CONCLUSION This reliability qualification report applies to the OX3102 family of products, all of which are manufactured with the same process technology (.13um G), package type (QFN), and materials. The OX3102 device has been utilized as the qualification vehicle for the family of products which includes: OX3102, OX3101, and OX3100.
7.0 REVISION HISTORY Revision Date Orginator Comments Rev. 0 2/12/10 Norbe Mendoza Product Reliability Qualification Plan Rev. 1.0 8/11/10 Norbe Mendoza Conditional Qualification Release Rev. 2.0 9/21/10 Norbe Mendoza Full Qualification Release
thuang
1
September 14, 2012
Prepared and Reviewed By: Thomas Huang Quality and Reliability Engineer
Approved By: Brete Bigley Director, Quality Assurance and Reliability
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification for the PEX8605/3 Switch and USB3380/2, USB2380 Bridge devices, revision AB silicon, in a 90nm fab process technology. An aQFN (Advanced Quad Flat No-Lead Package) and QFN (Quad Flat No-Lead Package) package assembly technology are utilized for the Switch and Bridge families respectively. This document summarizes the qualification plan and the results to date of the product as per below. 2. Scope: The PEX8605/3 and USB3380/2, USB2380 devices are fabricated in a 90nm process technology from Renesas and assembled in 10x10 QFN/aQFN package type at ASE Kaohsiung, Taiwan (ASEK). The PEX8605 (Switch) and USB3380 (Bridge) will be used as the prime reliability qualification vehicles for the following devices: PEX8605 and PEX8603 switches; USB3382, USB3381, and USB3380 bridges. Renesas’s 90nm technology node generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-line monitors, and an excellent reliability history. The PEX8605 and USB3380 will be used to separately qualify their respective switch and bridge families. The 10x10 mm 136L aQFN and 10x10 mm 88L QFN package is already qualified previously via a full package qualification of the PEX8605-AB50NI G and OXU3102-AANC G device (reports attached herein). 3. Background information:
Wafer Fabrication Information (Renesas)
Process Type CMOS LOGIC (CUP) General Purpose Process Name 90nm Number of Metal Layers 6
Lead Frame Information
Lead Frame material Cu (C7025) Assembly Process Information (ASEK)
Package Name USB 3380, USB 2380 QFN (Quad Flat No-Lead Package)
Package Size 10x10 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% matte Sn MSL – Moisture Sensitivity Level 3 Package Name PEX 8605, PEX 8603, USB 3382
aQFN (Advance Quad Flat No-Lead Package) Package Size 10x10 Lead Count 136L Lead Frame Pitch 0.5mm Wire Bond Material Cu Plating Composition 100% matte Sn MSL – Moisture Sensitivity Level 3
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification results for PEX8605-AB50NI G and the USB3380- AB50NI G devices.
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max, Sample Size: 120
Device Lot # Date Cod
0 Pass
PEX8605 8314D-ES 1219 120 500 hrs Cum
0 Pass
PEX8605 8314D-ES 1219 120 1000 hrs Cum
0 Pass
USB3380 8314A-ES 1218 120 0 Pass
Conditional and Full Reliability Qualification only require 168hrs HTOL. 1000 hrs HTOL is for information only. Based on the Arrhenius equation with Ta = 125 C, Tuse = 55 C, CL = 60 % and Ea =0.7 V, the expected failure rate in FIT (Failures in Time) is 25 FIT.
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Device Lot # Date Cod
2000V
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 5 0 Pass
b. Charge Device Model JESD22-C101D, 500V, Sample Size: 5
Device Lot # Date Cod
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 5 0 Pass
c. Machine Model JESD22-A115A, 200V, Sample Size: 5
Device Lot # Date Cod
200V
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 5 0 Pass
4.3 Latch Up, JESD 78A, +/- 100mA, Sample Size: 6
Device Lot # Date Cod
0 Pass Conditional / Full Qualification Completion Date: 7/23/12 USB3380 8314A-ES 1218 6 0 Pass
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5. Package Qualification Results
ASEK ‘s QFN package technology was qualified previously by PLX. The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and the attachment below is the package qualification results.
PLX_310x_Full_Reliab ility_Qualification_Repo ASEK ‘s aQFN package technology was also qualified previously by PLX. The PEX8605-AB50NI G is assembled in ASEK’s 10x10 aQFN 136L package technology and the attachment below is the package qualification results.
PEX8605_3andUSB3 380_2_2380_Full_Rel
6.0 CONCLUSION This reliability qualification plan applies to the PEX8605/3 and USB3380/2, USB2380 family of products in revision AB silicon, all of which are manufactured with the same process technology (90nm), package type (aQFN/QFN), and materials. The PEX8605/USB3380 devices have been utilized as the qualification vehicles for the family of products which includes: PEX8605-AB50NI G, PEX8603-AB50NI G, USB3382-AB50NI G, USB3381-AB50NI G, and USB3380-AB50NI G. Base on the reliability data completed to date, PLX grants full qualification approval for the subject products.
7.0 REVISION HISTORY
Revision Date Orginator Comments Rev. 0 1/5/12 Thomas Huang Product Reliability Qualification Plan. Rev. 1 7/23/12 Thomas Huang Full Product Reliability Qualification Done. Rev. 2 9/14/12 Thomas Huang Update HTOL 1000hrs Result (Information Only).
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Family Qualification: PEX8605-AA50NI G PEX8603-AA50NI G USB3382-AA50NI G USB3380-AA50NI G USB2380-AA50NI G
November 18, 2011
Prepared and Reviewed By: Thomas Huang Quality and Reliability Engineer
Approved By: Brete Bigley Director, Quality Assurance and Reliability
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification for the PEX8605/3 Switch and USB3380/2, USB2380 Bridge devices, revision AA silicon, in a 90nm fab process technology. An aQFN (Advanced Quad Flat No-Lead Package) and QFN (Quad Flat No-Lead Package) package assembly technology are utilized for the Switch and Bridge families respectively. This document summarizes the qualification plan and the results to date of the product as per below. 2. Scope: The PEX8605/3 and USB3380/2, USB2380 devices are fabricated in a 90nm process technology from Renesas and assembled in 10x10 QFN/aQFN package type at ASE Kaohsiung, Taiwan (ASEK). The PEX8605 (Switch) and USB3380 (Bridge) will be used as the prime reliability qualification vehicles for the following devices: PEX8605 and PEX8603 switches; USB3382, USB3381, and USB3380 bridges. Renesas’s 90nm technology node generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-line monitors, and an excellent reliability history. The PEX8605 and USB3380 will be used to separately qualify their respective switch and bridge families. PEX8605 is assembled with a 10x10 mm 136L aQFN at ASEK and will be used to qualify the aQFN package technology. The 10x10 mm 88L QFN package is already qualified previously via a full package qualification of the OXU3102-AANC G device (report attached herein). 3. Background information: Wafer Fabrication Information (NEC)
Process Type CMOS LOGIC (CUP) General Purpose Process Name 90nm Number of Metal Layers 6
Lead Frame Information Assembly Process Information (ASEK)
Package Name USB 3380, USB 2380 QFN (Quad Flat No-Lead Package)
Package Size 10x10 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% matte Sn MSL – Moisture Sensitivity Level 3 Package Name PEX 8605, PEX 8603, USB 3382
aQFN (Advance Quad Flat No-Lead Package) Package Size 10x10 Lead Count 136L Lead Frame Pitch 0.5mm Wire Bond Material Cu Plating Composition 100% Ni/Pd/Au MSL – Moisture Sensitivity Level 3
Lead Frame material Cu (C7025)
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification results for PEX8605-AA50NI G and the USB3380- AA50NI G devices.
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max, Sample Size: 120 Note: *= Conditional qualification/release ** = Full qualification/release
Device Lot# / Date Code SS Time point Results Notes
PEX8605 lot# 8687H-E; DC 1132 40
168 hr Cum*
Conditional Qualification, Completion Date: 10/4/2011
PEX8605 lot# 8696A-ES; DC 1133 40 0/40 PEX8605 lot# 8722A-ES; DC 1136 40 0/40 USB3380 lot# 8687I-ES; DC 1133 40 0/40 USB3380 lot# 8696B-ES; DC 1135 40 0/40
USB3380 lot# 8722B-ES; DC 1136 40 0/40
PEX8605 lot# 8687H-E; DC 1132 40
500 hr Cum
PEX8605 lot# 8687H-E; DC 1132 40
1000 hr Cum**
PEX8605 lot# 8696A-ES; DC 1133 40 0/40
PEX8605 lot# 8722A-ES; DC 1136 40 0/40
USB3380 lot# 8687I-ES; DC 1133 40 0/40
USB3380 lot# 8696B-ES; DC 1135 40 0/40
USB3380 lot# 8722B-ES; DC 1136 40 0/40
Based on the Arrhenius equation with Ta = 125 C, Tuse = 55 C, CL = 60 % and Ea =0.7 V, the failure rate in FIT (Failures in Time) after full qualification is 98 FIT.
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Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 5 0/5 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 5 0/5
b. Charge Device Model JESD22-C101D, 500V, Sample Size: 5
Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 5 0/5 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 5 0/5
c. Machine Model JESD22-A115A, 200V, Sample Size: 5
Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 5 0/5 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 5 0/5
4.3 Latch Up, JESD 78A, +/- 100mA, Sample Size: 6
Device Lot# / Date Code SS Results Notes
PEX8605 lot# 8687H-E; DC 1132 6 0/6 Conditional / Full Qualification Completion Date: 10/5/11 USB3380 lot# 8687I-ES; DC 1133 6 0/6
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5. Package Qualification Results ASEK ‘s QFN package technology was qualified previously by PLX. The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and the attachment below is the package qualification results.
PLX_310x_Full_Reliab ility_Qualification_Repo
The PEX8605 G is assembled in ASEK’s 10x10 aQFN 136L package technology and below is the package qualification plan and results. Note: *= Conditional qualification/release ** = Full qualification/release
5.1 Pre-Condition Level 2A (JESD22-A113-F), 192 hrs 30C/60%RH, Peak 260 C, Sample Size: 180
Lot# / Date Code SS Results Notes
lot# 8687H-E; DC 1132 180 0/180 Conditional / Full Qualification, Completion Date: 10/4/2011
lot# 8696A-ES; DC 1133 180 0/180 lot# 8722A-ES; DC 1136 180 0/180
5.2 Biased HAST (JESD22-A110C), 121C/100% RH, 96 hrs, Vdd Nominal, Sample Size: 45
Lot# / Date Code SS Time Point Results Notes lot# 8687H-E; DC 1132 45
96 hrs Cum** 0/45 Conditional / Full
Qualification, Completion Date: 10/20/2011
lot# 8696A-ES; DC 1133 45 0/45 lot# 8722A-ES; DC 1136 45 0/45
5.3 Temperature Cycle Test ( JESD22-A104C, Condition C), -65 C to 150 C for 1000 Cycles,
Sample Size: 45
Lot# / Date Code SS Cycles Results Notes lot# 8687H-E; DC 1132 45
250 cycles Cum* 0/45 Conditional Qualification,
Completion Date: 10/20/2011
lot# 8696A-ES; DC 1133 45 0/44*** lot# 8722A-ES; DC 1136 45 0/45 lot# 8687H-E; DC 1132 45
500 cycles Cum* 0/45
lot# 8696A-ES; DC 1133 44 0/44 lot# 8722A-ES; DC 1136 45 0/45 lot# 8687H-E; DC 1132 45
1000 cycles Cum**
0/45 Full Qualification, Completion Date: 11/18/2011
lot# 8696A-ES; DC 1133 44 0/44 lot# 8722A-ES; DC 1136 45 0/45
*** 1 unit sustained mechanical damage by the handler during ATE testing.
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
1
September 21, 2010
Prepared and Reviewed By: Norbe Mendoza Staff, Quality and Reliability Engineer
Approved By: Brete Bigley
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification of the OX3102 device in .13um G fab process technology with QFN (Quad Flat No-Lead Package) assembly. This document summarizes the qualification plan and the results of the product as per below.
2. Scope: The OX3102, fabricated in .13um G process technology and assembled in 10x10 QFN package will be used as the prime reliability qualification vehicle for the following devices: OX3101 and OX3100. TSMC .13um G technology generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-process monitors, and an excellent reliability history.
3. Background information: Wafer Fabrication Information (TSMC)
Process Type CMOS LOGIC (CUP) General Purpose Process Name .13um Number of Metal Layers 6
Lead Frame Information
Assembly Process Information (ASEK) Package Name QFN, Quad Flat No-Lead Package Package Size 10x10x.9mm3 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% Sn MSL – Moisture Sensitiv ity Level 3
Lead Frame material C7025
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification test plan and results for OX3102, .13 um FSG, 1P/6M device. Note: *= Conditional qualification/release
** = Full qualification/release *** = TSMC Data
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max
Sample Size: 120
G92029.1*** G92030.1*** G92030.1*** Lot P6C555.00E/DC 1025
100
100
100
120
100
100
100
120
100
100
100
120
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
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Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Sample Size: 6
Lot P6C555.00E/DC 1025 6
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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5 Package Qualification Results The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and below is the package qualification plan and results. Note: *= Conditional qualification/release ** = Full qualification/release
5.1 Pre-Condition Level 2A (JESD22-A113-F), 192 hrs 30C/60%RH, Peak 260 C Sample Size: 180
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
*
5.2 uHAST per JESD22-A110C, 121C/100% RH, 96 hrs (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.3 Temperature Cycle Test (JESD22-A104C, Condition B), - 55C to 125C 1000 cycles
(after precon from 1 above) Sample Size: 45
Lot #/ID SS Cycles Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.4 High Temperature Storage Life (JESD22-A103-C), 150C for 1000 hours (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
Completion Date: 9/21/2010
5.5 Pressure Cooker Test (JESD-A102-C), 100%RH/ 121C, 168 Hrs. Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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B. Post, Pre-Condition
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5.7 Package Dimension Measurements
6.0 CONCLUSION This reliability qualification report applies to the OX3102 family of products, all of which are manufactured with the same process technology (.13um G), package type (QFN), and materials. The OX3102 device has been utilized as the qualification vehicle for the family of products which includes: OX3102, OX3101, and OX3100.
7.0 REVISION HISTORY Revision Date Orginator Comments Rev. 0 2/12/10 Norbe Mendoza Product Reliability Qualification Plan Rev. 1.0 8/11/10 Norbe Mendoza Conditional Qualification Release Rev. 2.0 9/21/10 Norbe Mendoza Full Qualification Release
thuang
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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5.4 High Temperature Storage Life (JESD22-A103-C), 150C for 1000 Hrs., Sample Size: 45
Lot# / Date Code SS Time Point Results Notes
lot# 8687H-E; DC 1132 45 1000 hrs Cum**
0/45 Full Qualification, Completion Date: 11/18/2011
lot# 8696A-ES; DC 1133 45 0/45 lot# 8722A-ES; DC 1136 45 0/45
5.5 Pressure Cooker Test (JESD-A102-C), 100%RH/ 121C, 168 Hrs., Sample Size: 45
Lot# / Date Code SS Time Point Results Notes lot# 8687H-E; DC 1132 45
168 hrs Cum** 0/45 Conditional / Full
Qualification, Completion Date: 10/20/2011
lot# 8696A-ES; DC 1133 45 0/45 lot# 8722A-ES; DC 1136 45 0/45
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
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6.0 CONCLUSION This reliability qualification plan applies to the PEX8605/3 and USB3380/2, USB2380 family of products in revision AA silicon, all of which are manufactured with the same process technology (90nm), package type (aQFN/QFN), and materials. The PEX8605/USB3380 devices have been utilized as the qualification vehicles for the family of products which includes: PEX8605-AA50NI G, PEX8603-AA50NI G, USB3382- AA50NI G, USB3381-AA50NI G, and USB3380-AA50NI G. Based on the reliability data completed to date, PLX grants full qualification approval for the subject products.
7.0 REVISION HISTORY
Revision Date Orginator Comments Rev. 0 02/24/11 Norbe Mendoza Product Reliability Qualification Plan Rev. 1 10/19/11 Thomas Huang Conditional Reliability Qualification Report Rev. 2 11/18/11 Thomas Huang Full Reliability Qualification Report
thuang
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
1
September 21, 2010
Prepared and Reviewed By: Norbe Mendoza Staff, Quality and Reliability Engineer
Approved By: Brete Bigley
PLX Technology 870 W. Maude Ave. Sunnyvale, CA 94085 www.plxtech.com
2
1. Purpose: Perform a product family reliability qualification of the OX3102 device in .13um G fab process technology with QFN (Quad Flat No-Lead Package) assembly. This document summarizes the qualification plan and the results of the product as per below.
2. Scope: The OX3102, fabricated in .13um G process technology and assembled in 10x10 QFN package will be used as the prime reliability qualification vehicle for the following devices: OX3101 and OX3100. TSMC .13um G technology generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in-process monitors, and an excellent reliability history.
3. Background information: Wafer Fabrication Information (TSMC)
Process Type CMOS LOGIC (CUP) General Purpose Process Name .13um Number of Metal Layers 6
Lead Frame Information
Assembly Process Information (ASEK) Package Name QFN, Quad Flat No-Lead Package Package Size 10x10x.9mm3 Lead Count 88L Lead Frame Pitch 0.4mm Wire Bond Material Cu Plating Composition 100% Sn MSL – Moisture Sensitiv ity Level 3
Lead Frame material C7025
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4. Die Qualification Results QUALIFICATION PLAN and RESULTS: The following is the product qualification test plan and results for OX3102, .13 um FSG, 1P/6M device. Note: *= Conditional qualification/release
** = Full qualification/release *** = TSMC Data
4.1 High Temperature Operating Life Test (JESD22- 108-B), Condition: Ta= 125°C, Voltage: Vdd max
Sample Size: 120
G92029.1*** G92030.1*** G92030.1*** Lot P6C555.00E/DC 1025
100
100
100
120
100
100
100
120
100
100
100
120
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
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Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Lot# / Date Code SS Results Notes
Lot P6C555.00E/DC 1025 5 0/5
Conditional/Full Qualification,
Sample Size: 6
Lot P6C555.00E/DC 1025 6
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5 Package Qualification Results The OXU3102-AANC G is assembled in ASEK’s 10x10 QFN 88L package technology and below is the package qualification plan and results. Note: *= Conditional qualification/release ** = Full qualification/release
5.1 Pre-Condition Level 2A (JESD22-A113-F), 192 hrs 30C/60%RH, Peak 260 C Sample Size: 180
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
*
5.2 uHAST per JESD22-A110C, 121C/100% RH, 96 hrs (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.3 Temperature Cycle Test (JESD22-A104C, Condition B), - 55C to 125C 1000 cycles
(after precon from 1 above) Sample Size: 45
Lot #/ID SS Cycles Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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5.4 High Temperature Storage Life (JESD22-A103-C), 150C for 1000 hours (after precon from 1 above) Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
Completion Date: 9/21/2010
5.5 Pressure Cooker Test (JESD-A102-C), 100%RH/ 121C, 168 Hrs. Sample Size: 45
Lot #/ID SS Results Notes
Lot P6C555.00E/DC 1025
Lot P6C555.00F/DC 1026
Lot P6C555.00G/DC 1027
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B. Post, Pre-Condition
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5.7 Package Dimension Measurements
6.0 CONCLUSION This reliability qualification report applies to the OX3102 family of products, all of which are manufactured with the same process technology (.13um G), package type (QFN), and materials. The OX3102 device has been utilized as the qualification vehicle for the family of products which includes: OX3102, OX3101, and OX3100.
7.0 REVISION HISTORY Revision Date Orginator Comments Rev. 0 2/12/10 Norbe Mendoza Product Reliability Qualification Plan Rev. 1.0 8/11/10 Norbe Mendoza Conditional Qualification Release Rev. 2.0 9/21/10 Norbe Mendoza Full Qualification Release
thuang