president’s corner pg. 4 celebrating 25 years of...

PICMG_Tech

Presidentrsquos Corner PG 4 Celebrating 25 years of PICMG

MicroTCA Workshop Report PG 5

Technology Focus PG 8 COM Express in medical imaging

SPRING 2019

VOLUME 23 NUMBER 1

Member since 1998

On the cover

The PICMG Systems amp Technology 2019 Resource Guide covers the use of MTCA4 in high-energy physics COM Express in medical imaging the 25th anniversary of the PICMG consortium and more

The Resource Guide also highlights some of the industryrsquos top products in the categories of COM Express CompactPCI cPCI Serial Space and Industrial Automation

picmg-systemscom PICMG_Tech

reg 2019 OpenSystems Mediareg CompactPCI PICMG PICMG ATCA AdvancedTCA MicroTCA AdvancedMC

GEN4 and their logos are registered trademarks of PICMGTM xTCA is a trademark of PICMGcopy 2019 PICMG Systems amp TechnologyAll registered brands and trademarks in AdvancedTCA amp CompactPCI Systems are property of their respective owners

Published by

Presidentrsquos Corner | Jessica Isquith

4 Celebrating 25 years of PICMG

6 PICMG Consortium Members at Embedded World

MicroTCA Workshop Report | Justin Moll

5 MicroTCA workshop at DESY ndash 2018

Technology Focus 8 Leveraging COM Express for medical equipment design By Patrick Lee Arbor Technology

12 Next-generation backplane production technology By Gary Routledge Amphenol

Application Feature 16 High-energy physics Controllers for X-ray laser accelerators By Heiko Koerte and Vollrath Dirksen NAT

PICMG Consortium 20 PCI Industrial Computer Manufacturersrsquo Group (PICMG)

Consortium Info

2019 Resource Guide

24 COM Express CompactPCI cPCI Serial Space Industrial Automation

2 | Spring 2019 | PICMG Systems amp Technology Resource Guide wwwpicmgmil-embeddedcom

Leveraging COM Express for medical equipment design

By Patrick Lee Arbor Technology

Next-generation backplane production technology

By Gary Routledge Amphenol

High-energy physics Controllers for X-ray laser accelerators

By Heiko Koerte and Vollrath Dirksen NAT

Technology Focus

Technology Focus

Application Feature

8

12

16

Standards-based technology platforms for open innovation

IMAGE

WWWOPENSYSMEDIACOM

ADVERTISER PAGE

COM Express Acromag Inc 24

Seco 24 Avnet Integrated 25 congatec 26 Eurotech 27

CompactPCI Vector Electronics amp Technology Inc 28

CompactPCIcPCI Serial Space Acromag Inc 29 Atrenne A Celestica Company 29

Industrial Automation NAT GmbH 30

RESOURCE GUIDE INDEX

EVENTS

GROUP EDITORIAL DIRECTOR John McHale johnmchaleopensysmediacom

PRESIDENT OF PICMG Jessica Isquith jesspicmgorg

ASSISTANT MANAGING EDITOR Lisa Daigle lisadaigleopensysmediacom

TECHNOLOGY EDITOR Mariana Iriarte marianairiarteopensysmediacom

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VITA EDITORIAL DIRECTOR Jerry Gipper jerrygipperopensysmediacom

SALESMARKETING

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BUSINESS DEVELOPMENT EUROPE Rory Dear rorydearopensysmediacom +44 (0)7921337498

PRESIDENT Patrick Hopper patrickhopperopensysmediacom

EXECUTIVE VICE PRESIDENT John McHale johnmchaleopensysmediacom

EXECUTIVE VICE PRESIDENT Rich Nass richnassopensysmediacom

CHIEF FINANCIAL OFFICER Rosemary Kristoff rosemarykristoffopensysmediacom

EMBEDDED COMPUTING BRAND DIRECTOR Rich Nass richnassopensysmediacom

ECD EDITOR-IN-CHIEF Brandon Lewis brandonlewisopensysmediacom

TECHNOLOGY EDITOR Curt Schwaderer curtschwadereropensysmediacom

ASSOCIATE TECHNOLOGY EDITOR Laura Dolan lauradolanopensysmediacom

SENIOR EDITOR Sally Cole sallycoleopensysmediacom

CREATIVE PROJECTS Chris Rassiccia chrisrassicciaopensysmediacom

PROJECT MANAGER Kristine Jennings kristinejenningsopensysmediacom

FINANCIAL ASSISTANT Emily Verhoeks emilyverhoeksopensysmediacom

SUBSCRIPTION MANAGER subscriptionsopensysmediacom

CORPORATE OFFICE 1505 N Hayden Rd 105 bull Scottsdale AZ 85257 bull Tel (480) 967-5581

REPRINTS WRIGHTrsquoS MEDIA REPRINT COORDINATOR Wyndell Hamilton whamiltonwrightsmediacom (281) 419-5725

wwwpicmgmil-embeddedcom Spring 2019 | PICMG Systems amp Technology Resource Guide | 3

PAGE ADVERTISER

19 EKF-ELECTRONIK GmbH ndash Unleash the power

11 Elma Electronic ndash Proven COTS building blocks

7 Embedded World ndash Exhibition and Conference itrsquos a smarter world

10 PICMG ndash Join the PICMG IIoT specification effort

32 Vector Electronics amp Technology Inc ndash VME VXS cPCI chassis backplanes and accessories

15 VEROTEC Electronics Packaging ndash Continuing 50 years of excellence in functional and elegant electronic packaging

ADVERTISER INDEX

ESC Boston May 15-16 2019

Boston MA httpsesc-bostoncom

IoT World May 13-16 2019 Santa Clara CA

tmtknect365comiot-world


Presidentrsquos Corner

By Jessica Isquith President of PICMG jesspicmgorg

COM-HPC specification is expected to support two different module sizes one for high-performance computing the other for embedded computing Initial plans include the incorporation of a new high-speed connector able to support existing and future interfaces such as PCI Express Gen 45 and 100 Gb Ethernet The specification will target medium- to high-performance server-class proces-sors Eighteen PICMG member com-panies have joined the group which is sponsored by Congatec ADLINK and Kontron

In the summer of 2018 VITA and PICMG agreed to transfer Rugged COM Express to the PICMG organization in order to complete the specification PICMG and VITA have a rich history of successful col-laboration to meet industry needs This specification will define a ruggedized version of PICMG COM0 for harsh and mission-critical environments The goal of the specification is to describe a 100 percent mechanical-compatible housing around a COM Express module The team is finalizing a solid aluminum-frame design that protects the elec-tronics against environmental influences such as moisture dust vibration or EMC radiation and operates in the extended temperature range of -40 degC to +85 degC This effort is sponsored by MEN Micro nVENT and Elma

Doug Sandy continues to lead our IIoT initiatives related to the sensor domain which ndash until now ndash has suffered from a lack of standardization We are moving forward with an aggressive program to advance IIoT Our approach encourages a firewalled secure network architecture that supports a variety of synchroniza-tion methods and a uniform data model that scales down to the sensor domain through binary encoding Using well-established practices the specifications

Celebrating 25 years of PICMG

Happy 25th AnniversaryWelcome PICMG is celebrating its 25th year with great momentum and many active committees Since our founding nine families of specifications and tens of thousands of successful collaborations have led to billions of dollars in products and solutions across a wide array of markets We are poised to continue our efforts in solving embedded computing requirements through new and expanded open specifications

New leadership teamThe new year brings two new entrants to the PICMG management team ndash Valerie Andrew and Dylan Lang ndash who join CTO Doug Sandy VP of marketing Justin Moll and me as officers Valerie ndash in her role as PICMG secretary ndash brings to the team her years of leadership experience in the embedded computing industry She currently has a senior marketing role at Elma and is an active participant in SOSA [Sensor Open Systems Architecture consortium] and VITA Our new treasurer Dylan joins us from SAMTEC where his primary focus is open standards He is also the secretary of the COM-HPC technical subcommittee and leads efforts at several embedded computing consortia These two new officers bring fresh ideas expertise and a shared commit-ment to open standards and the importance of collaboration

Embedded World in our sightsEmbedded World is the largest annual event dedicated to the embedded computing industry Last yearrsquos event attracted more than 30000 visitors and over 1000 exhibi-tors the 2019 numbers are expected to top last yearrsquos PICMG as an international standards organization finds this event to be one of the strongest forums for our mem-bers to meet This yearrsquos embedded world will facilitate many face-to-face meetings with members potential members and other consortia Attendees are encouraged to visit PICMG at booth 3A-528 where we will showcase products from seventeen of our members In addition 40 PICMG members will have dedicated booths to show off their offerings

Contributed articlesThis issue contains four member-contributed articles that address several key markets that use PICMG-based products including medical systems high-energy physics and production automation

NAT provides an excellent overview as to why MTCA4 is the ideal standard for X-ray laser accelerator control systems (page 16) Arborrsquos article on page 8 discusses the key factors medical equipment designers need to consider when solving application requirements and how the agility and reliability of COM Express systems address these concerns Amphenol provides a review of next-generation backplane produc-tion technology (page 12) while Justin Moll shares an overview (page 5) of the latest MicroTCA Workshop

Key technical initiatives for 2019In 2018 PICMG launched an important new project COM-HPC This new COM specification led by Christian Eder of Congatec is under development in a parallel track with existing COM Express efforts The subcommittee will be developing a next-generation COM standard and the accompanying Carrier Design Guide The

The 7th MicroTCA Workshop for Industry and Research was held at DESY [Deutsches Elektronen-Synchrotron] in Hamburg Germany on December 5 and 6 2018 The workshop was attended by 190 participants from more than 20 research facilities and more than 30 companies from all over the world

Before the workshop several pre-workshops included tutorials on different topics for newcomers as well as specialists in MicroTCA which were very well received by the participants

The main workshop consisted of 43 talks Many companies showcased their new prod-ucts while research facilities presented their experimental results The presentations left the impression that MicroTCA applications in many organizations have finished the testing stage and have moved on to real implementation

This year four interesting keynotes were presented Saeed Karamooz CEO of Vadatech informed attendees about the growing MicroTCA market while Timo Korhonen chief engineer at ESS [European Spallation Source] reported on the

will provide plug-and-play interoperability at the sensor domain to the ldquolast footrdquo of the IIoT network In March 2018 we formed an alliance with DMTF in order to extend the Redfish management API to industrial applications Specification work on both the postage-stamp form factor and the IIoT data model efforts will commence by Q2 of 2019

In addition to these efforts ongoing enhancements to MicroTCA and Compact PCI Serial are also expected in 2019

current status of MTCA4 installations at his facility Physicist Adrian Mancuso who leads scientists at the European XFEL introduced the audience to serial crystallography at the EuXFEL and showed the initial results of the first year of operation The last keynote was given by Christian Ganninger global product manager of nVent-Schroff who ad- dressed upcoming developments in the MicroTCA standard including the capa-bility of 40 G and 100 G Ethernet PCIe Gen 4 and 5 and the support of signifi-cant increased power

The workshop also encompassed an industrial exhibition Several MTCA manufacturers and developers presented their products and invited the participants of the workshop to participate in lively discussions

Coffee breaks lunch and the workshop dinner on the ship MS Hanseatic offered lots of networking opportunities

Please save the date for next year The 8th MicroTCA Workshop for Industry and Research will take place December 4 and 5 2019 in Hamburg

All presentations from the 2018 workshop can be downloaded from httpsmtcawsdesydecontributions

Looking aheadI am confident that increased participa-tion will lead to innovations which will meet our industryrsquos evolving needs Whether you are currently a member or planning to become one I encourage you to contact us at infopicmgorg and let us know how we can work together


MicroTCA Workshop Report

By Justin Moll Vice President of Marketing at PICMG With Susanne Schuster DESY justinpicmgorg

MicroTCA workshop at DESY ndash 2018


PICMG Consortium Members at Embedded WorldFebruary 26 ndash 28 | Nuremberg Germany

wwwembedded-worldde

Company BoothHall

AAEON Technology Inc 11-350

Acromag Inc 33-354

ADLINK Technology Inc 11-540

Advantech Co LTD 22-138

Analog Devices Inc 4A4A-641

Arbor Technology Corp 22-450

Avalue Technology Inc 33-549

AXIOMTEK CO LTD 11-456

Concurrent Technologies PLC 11-519

congatec AG 11-358

Connect Tech Inc 11-430

Data Modul AG 11-234

DFI Inc 11-521

Ecrin Systems 22-449

EKF Elektronik GmbH 11-660

Elma Electronic Inc 11-655

ENGICAM srl 33-219

ept GmbH 33-510

esd electronics gmbh 22-640

Eurotech SpA 33-529

FASTWEL Group Co Ltd 11-512

Company BoothHall

Fraunhofer FOKUS 44-470

Hartmann Electronic GmbH 22-440

HEITEC AG 11-340

IBASE Technology Inc 22-440

Intel Corporation 11-338

Kontron 11-478

MEN Mikro Elektronik GmbH 11-406

Mitsubishi Electric TOKKI Systems Corporation

11-181

National Instruments 44-108

nVent Schroff GmbH 33-311

OpenSystems Media 3A3A-528

Polyrack Electronic-Aufbausysteme GmbH

33-349

Portwell Inc 22-340

Qualcomm Incorporated 4A4A-330

Samtec 4A4A-240

SECO SpA 11-330

TQ-Systems GmbH 11-578

VersaLogic Corp 33-257

Yamaichi Electronics 33-301

Nuumlrnberg Germany

February 26 ndash 28 2019

Media partners

Keep up to date

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As needs vary drastically from application to application medical equipment designers can benefit from the scalable architecture and flexibility of Computer-on-Module (COM) Express systems With COM Express (COMe) equipment designers can directly deploy the COM onto their IO boards as ready-made components Since medical applications also deal with human life the equipment deployed also requires the highest safety and reliability standards

There are a number of key factors medical-equipment designers need to consider when developing solutions for a wide variety of application requirements ndash how do the agility and reliability of COM Express systems address these concerns

Considerations for designing medical equipmentAlthough patients may only see the scanners doctors use to capture diagnostic data transforming detailed X-rays and images scanned from these complex imaging systems into actionable information to diagnose and treat patient illnesses requires substantial processing power Of course not all medical applications require the same level of computing performance In fact some equipment ndash such as endoscopes com-puter-assisted surgical equipment and other devices ndash are designed to be operated by a skilled physician and require portability over computing prowess What factors

Modern-day medical applications have a wide spectrum of needs from the demanding computing requirements of optical imaging technologies ndash such as magnetic resonance imaging (MRI) optical coherence tomography (OCT) X-ray computed tomography (CT) computed axial tomography (CAT) scans and 3D ultrasounds ndash to the compact form factor and low power consumption necessary for mobile diagnostic equipment

Leveraging COM Express for medical equipment designBy Patrick Lee

should medical-equipment designers consider when developing solutions for such a wide range of applications

All-in-one design versus ready-made embedded systemsIn the past medical equipment designers would use custom-built all-in-one moth-erboards Designers would choose a microprocessor or microcontroller chip design the supporting circuitry around the chip and add any specialized inputs and outputs (IO) required by the par-ticular application An all-in-one design gave designers a great deal of control over exactly what features were included in the final design Every part of the circuit in a fully customized design is there for a reason specific to the end

Technology Focus


components to an IO board to support additional functionality COMe provides addi-tional design flexibility

Form factors and performance requirements for a range of applicationsEquipment designers also need to take form factor into consideration when designing for medical applications Advancements in optical-imaging technologies have helped doctors to diagnose innumerable conditions and save countless lives However these technologies also have demanding ndash and growing ndash computing requirements For complex imaging applications such as these COM Express Basic amp Compact modules offer highly scalable computing and graphics performance that enable equipment designers to create application-ready widely usable product families (Figure 1)

If the application requires mobility over processing power the small size and low energy consumption of COM Express Mini modules provide the perfect fit for next-generation ultra-compact portable medical devices These devices require con-siderably less processing power than large-scale MRI machines or other medical imaging technologies

Consequently medical equipment designers also need to match computing per-formance to the target medical application needs Although entry-level CPUs are sufficient and help reduce power consumption for portable equipment complex imaging technologies generally require high-end CPUs with greater processing power For example producing high-quality images from MRI OT CT and CAT scans for doctors to properly identify anomalies in their patients requires higher computing performance or even a discrete GPU to process massive amounts of data at high

application However fully customized designs can take substantial time to get from the drawing board to the market

COMe solutions in contrast provide a more modular alternative to tradi-tional all-in-one motherboards When choosing a COMe solution to integrate with their own IO boards equipment designers can increase the speed of product design and improve time-to-market efficiency Since COMe systems can easily integrate with 80 percent of IO boards equipment designers are free to focus on the IO board design without having to worry about the x86 architecture of the chip By selecting ready-made COMe and deploying it on a customized IO board for a particular customer medical equipment designers can focus on their core competency in designing the IO board to fit the needs of target applications By enabling equipment designers to add different

Figure 1 | Optical-imaging technologies ndash which have helped doctors to diagnose innumerable conditions and save countless lives ndash have demanding computing requirements (Image courtesy Arbor Technologies)

rsaquo

Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe

High Level Medical Imaging

SATA

USB

Mid to Entry Level Medical Imaging

HDMI

LVDS

VGA

DVI

DPeDP

PCHData AcquisitionModules

GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP


Figure 2 | Systems suggested for high-level medical imaging (left) and mid- to entry-level medical imaging (right)rsaquo


Critical medical concernsSince doctors rely on the devices and applications developed by medical equipment designers to diagnose and treat life-threatening illnesses medical applications understandably have a unique demand for the highest product safety and reliability standards that comply with strict regulations In par-ticular ISO-13485 dictates the global quality standards for designing and manufacturing medical devices and should be an expectation for any med-ical equipment designer to meet

Besides compliance with medical regula-tory requirements equipment designers must also deliver uncompromised system reliability expertise and product longevity of typically seven years After all pieces of medical equipment are both instrumental tools that cannot be easily replaced as well as substantial financial investments for hospitals and clinics Moreover the long amount of time required to obtain approval for devices that operate in critical environ-ments especially those involving human lives from the US Food and Drug Administration and regulatory bodies in other jurisdictions necessitates above-average device reliability

Designing for medical applicationsEngineers designing equipment for use in medical applications must meet unique demands and needs of the med-ical sector One of these is the ISO-13485 standard which requires that products meet the requisite quality standards for medical devices used in critical environ-ments involving human life

Also important Equipment that is ISO-14971 certified to effectively ensure the safety of medical devices during the entire product lifecycle In fact the nine-part ISO-14971 standard is even more rigorous than the ISO-13485 stan-dard covering risk analysis evaluation control management and compre- hen sive procedures for reviewing and monitoring during production and post-production Arborrsquos medical-grade COMe modules offer longevity well beyond the industry standard providing 10- or even 15-year life cycle support for selected modules

speeds Whatrsquos more doctors may even use a number of different medical diagnostic software and hardware that require additional processing capacity across heteroge-neous platforms

To address these concerns medical designers may select COM Express systems that support Open Computing Language (OpenCL) or Open Graphics Library (OpenGL) platforms to provide performance enhancements for medical applications As the names suggest OpenCL and OpenGL are royalty-free standards that allow designers to develop parallel processing software that is compatible with CPUs GPUs digital signal processing (DSP) units and field-programmable gate arrays (FPGAs) from many different manufacturers Alternatively designers may also choose to use a discrete GPU such as Nvidiarsquos CUDA platform to achieve accelerated image processing (Figure 2)

Join the PICMG IIoT Specification EffortPlug amp Play Interoperability at the Sensor Domain

wwwpicmgorg

Be a part of the PICMG IIoT open specification effort to bring true plug-and-play interoperability to the ldquolast footrdquo of the network With our low-fee model companies large and small can work with thought innovators on the leading edge of technology

Join PICMG today

20190109-PICMG-Island-Ad-04indd 1 1919 1110 PM

Technology Focus


Complete computing requirementsArborrsquos COM Express modules support Intel 2nd 3rd 4th 5th 6th and 7th-gen-eration core processors as well as AMDrsquos G-series amp R-series platforms (Table 1)

Selectable form factorsArbor modules are available in several form factors for agile deployment (Table 2)

Designing for peak medical efficiency safetyMedical equipment designers have a lot on their plate when it comes to devel-oping lifesaving solutions for doctors and healthcare providers COM Express modules offer an efficient and highly effective solution that addresses the key factors equipment designers need to consider when developing equipment for medical applications Ready-made COM Express modules enable faster time to market while still offering suffi-cient flexibility for designers to customize IO board designs for a broad spectrum of highly specialized applications from optical imaging to portable diagnos-tics Embedded COM systems are also available in multiple form factors and support a wide range of computing per-formance requirements COM Express solutions must meet the rigorous regulatory requirements for medical devices thereby ensuring uncompromised product reliability and safety From highly por-table medical equipment to advanced MRI OT CT and CAT scan machines COMe modules are agile enough for any IO board used in cutting-edge medical applications

Patrick Lee is Embedded Computer Division Director for Arbor Technology

Arbor Technology wwwarbor-technologycom


MEDICAL APPLICATIONS

UNDERSTANDABLY HAVE

A UNIQUE DEMAND FOR THE

HIGHEST PRODUCT SAFETY

AND RELIABILITY STANDARDS

THAT COMPLY WITH STRICT

REGULATIONS

Table 1 | Platforms and their expected performance optimizationrsaquo

Platform Intel 2nd thru 7th generation core processors

AMD G-Series AMD R-Series

Performance Entry- to high-level computing Optimized for power efficiency

Optimized for performance

Table 2 | Module form factors and sizes for deploymentrsaquo

Form Factor Mini Type Compact Type Basic Type

Size 84 by 55 mm 95 by 95 mm 125 by 95 mm

Available modules EmNANO series EmETXe series EmETXe series

Elmarsquos small form factor line combines the latest CPUswith the application IO you need COTS building blocks

enable reliable systems that perform in the toughestenvironments and offer high levels configurability

elmacomElma Electronic Inc

Proven COTS Building Blocks

With you at every stage

simulation capabilities automated production and assembly test and production-level signal-integrity testing

Signal integrity Not the end of the roadWe all understand that connectors and PCB materials need upgrading along with engineering knowledge and expertise to design at high speeds PCB fabrication is also a challenge due to backdrills aspect ratios copper roughness tolerances and impedance control

Signal integrity is an essential discipline required to define the parameters of the channel for performance at high speed as such a huge amount of time and effort is spent on signal integrity quite understandably But whatrsquos next when the new gen-eration of PICMG products are in production Our 30 years of experience in back-plane design and assembly tells us that the production of high-speed backplanes is as important as signal integrity to ensure that all the engineering work is not undone during the production phase of the backplane

Higher data rates require smaller compliant pins and via holes New connectors include compliant pins as short as 110 mm pressed into a 037 mm plated hole This size shrink puts the emphasis on ensuring these pins are assembled correctly and do not compromise the signal (Figure 1)

The assembly technology of yesterday will struggle to process the new generation of compliant pins because of the use of manual-press machines and limited test

A new generation of high-speed proto-cols are here with the next generations already on the horizon The exciting world of high speed has arrived before we know it todayrsquos technology will be superseded

The next generation of PCIe Ethernet and Infiniband to name a few will add more complexities to the signal channel We are seeing data rates increase expo-nentially The ldquoevolution of backplanesrdquo has begun

What is changing as backplanes evolve and what are the challenges seen during this evolution There are obvious upgrades required for the hardware and we must also gain new understanding of the high-speed channel but we must also consider the production and test environment which consists of con-nector technology engineering knowl-edge PCB materials and fabrication

Next-generation data rates are placing higher demands on backplane design assembly and test New production techniques are required to deal with these evolving data-rate realities

Next-generation backplane production technologyBy Gary Routledge

Technology Focus


technologies Designers need to have 100 percent confidence that all com-pliant pins are correctly positioned in the via hole This is the challenge for the new production environment

The importance of production and testThe final stage of ensuring that the backplane will function and perform as designed is the production and test phase Days weeks and months of engi-neering signal-integrity simulations PCB design and post simulation are spent tuning the PCB design for optimal performance Even so months of engi-neering work can be quickly undone if the connector pin is not inserted into the PCB hole correctly

With hundreds of pins in a connector pin field how can we detect one bent pin if we cannot physically see it A pin that is not inserted correctly can cause a system failure which needs to be detected and fixed before the backplane leaves the production environment (Figure 2)

Bent pins and the signalThe smallest variance in design and pro-duction can have the biggest impact on performance at high data rates A production-induced fault or bent pin will have clear effects on the signal including but not limited to impedance drop insertion loss return loss and mode conversion (Figure 3)

The effects of a bent pin are not only limited to the immediate effect on the signal What happens over time if the bent pin is undetected PICMG-compliant systems are often deployed in the harshest of environments In these high-stakes environments there is the risk that a bad pin can over time cause damage to the connector and PCB due to shock and vibration This situation can cause wear on the protective surface of the PCB and potentially short to another copper feature or the pin could break away from the connector and become a floating object that could cause a short between two other compliant pins

Enabling the evolution of technologyEngineers connector vendors and PCB vendors have all stepped up and pro-vided a path to higher data rates The last link in the chain to ensuring that systems make the successful evolution into the next generation of products is the production environment The

investment and infrastructure must be in place to facilitate the production

What equipment and processes do we need to be able to successfully assemble next generation backplanes How do we process the backplane to ensure the integrity of the new generation of compliant pin Unless you have visited a dedicated backplane production facility that is capable of producing backplanes up to 56G PAM4 then you might be surprised by the technologies involved These include light-assisted connector placement prepress-compliant pin engagement automatic connector press machines automatic pin scan optical inspection automatic 100 percent X-ray inspection and signal-integrity testing automatic electrical test hi-pot power testing and quality assurance by onsite signal-integrity specialists (Figure 4)

Figure 1 | Higher data rates require smaller compliant pins and via holesrsaquo


Figure 2 | X-ray image of bent compliant pinsrsaquo

through the production environment This process often starts at the early stages of a project when signal-integrity simulation is complete and PCB layout begins

rsaquo Design for Manufacture rsaquo Design for Assembly rsaquo Design for Test rsaquo FAE product support rsaquo Detailed and concise PCB manufacturing instructions rsaquo PCB fabricator control ndash correct drill size and plating the correct drilling

processes predrill and multipeck drilling hole TP and backdrill stub control

As an example to avoid plating knee within the plated hole for the compliant pin it is recommended that the drill process should always be from the press-fit side of the PCB to ensure clean entry of the compliant pin into the plated hole Clear instructions must be given to the PCB fabricator to control the integrity of the plated hole They do not know what the hole is used for or the data rate of the PCB

The use of automated press machines enables designers to program the machine to recognize anomalies during the press process Each connector has a set profile and an expected force to correctly press the connector If the recorded force during assembly differs from the profile then the assembly is flagged and inspected for any potential bent pins

Consider production from the very startIn addition to the equipment there is also the expertise and knowledge required to introduce a product into and

Figure 3 | Small variances such as bent pins will have large effects on performance at high data ratesrsaquo

Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D


Regular audits and spot checks should be performed with PCB vendors to ensure quality is maintained and will not adversely affect the signal

There is a huge amount of expertise and knowledge required to process high-speed backplanes We see identical comparisons to our experiences during the years of

E L E C T R O N I C S PA C K A G I N G

Continuing 50 years of excellence in functional and elegant electronic packaging

Verotec Integrated Packaging bull Ph 6038219921 bull salesverotecus bull wwwverotecus

Instrument Cases bull Card Cages bull Integrated Systems bull 19rdquo Fan TraysBackplanes and Extenders bull Rack Cases bull Pluggable PSU

Modi cation ServicesStandard modi ed and custom products and systems to meet speci c requirementsTecServ+

19rdquoDIPLOMAT AND VEROTEC CASESStylish desktop cases for 19rdquo systems

PLUGGABLE PSU20 - 240W General Purpose200 - 600W PICMG 211

CARD CAGES AND COMPONENTSDIN41494 and IEC60297 general purposeIEEE11011011 for cPCI VPX VME64x PXI etcMIL-STD-167 IEEE11011011 for rugged applications

19rdquo RACK CASESStandardVeroshield EMC screened and IP sealedEurocard mounting

THERMAL SOLUTIONSIntelligent ltered and standard19rdquo 1U fan trays

INTEGRATED SYSTEMSHorizontal and vertical board mounting19rdquo Rack Mount and Desktop SystemsTecSYS lsquoReady to Runrsquo Development Systems

BACKPLANES AND EXTENDERSVME VME64x VXI OpenVPX cPCI and PXICustom Design Capability

evolution in the ITdatacom markets where data rates also increased exponen-tially All the engineering and production expertise equipment and infrastructure invested to facilitate the ITdatacom evo-lution are now required to successfully produce PICMG-compliant backplanes and products

Production and test are often the for-gotten links in the chain to ensure signal integrity Any chain is only as strong as the weakest link Letrsquos not forget the importance of production ndash a vital link in the evolution of technology

Gary Routledge is Engineering Manager EMEA amp APAC for Amphenol Backplane and Systems Integration

Amphenol wwwamphenol-bsicom

Figure 4 | 100 percent production-level signal-integrity testing on every signal can identify missing or incorrect backdrills in the PCB that are otherwise invisible Such testing will identify and eliminate PCB fabrication faults that otherwise go undetected

rsaquo


The chosen technology also had to act as the platform for the new X-Ray Free-Electron Laser (XFEL) accelerator (wwwxfeleu) DESY is the main share-holder in the European XFEL which will generate ultrashort X-ray flashes ndash 27000 times per second ndash with a brilliance that is a billion times higher than that of the best conventional X-ray radiation sources The facility the only one of its kind in the world opens completely new research opportunities for scientists and industrial users As the main shareholder DESY plays a major part in the construction and operation of the facility

DESY (Deutsches Elektronen-Synchrotron) ndash one of the worldrsquos leading particle-accelerator centers conducting top-level international research into the fundamental relationships of matter ndash was tasked with finding a successor technology for its control and data-acquisition systems which were based on VME and proprietary hardware some of which was more than 30 years old The main requirements better signal quality higher bandwidth and support for several decades of operation allowing for a phased migration in current installations

High-energy physics Controllers for X-ray laser acceleratorsBy Heiko Koerte and Vollrath Dirksen

From the beginning NAT worked with DESYrsquos engineering team and the ecosystem of MicroTCA companies to enhance the MTCA0 standard for the physics communityrsquos additional requirement The MTCA4 standard allows users to build solutions ndash scaling from small to large high-performance systems ndash ranging from single-unit installations to large installations of more than 200 crates with a timing synchronization in the pico-second range

Engineers conducted rigorous benchmarking of various technologies ndash such as AdvancedTCA VXI VPX and MicroTCA MicroTCA4 technology with up to 20 sys-tems per project was successfully tested in existing installations and a newer FLASH-II accelerator The experiences and results exceeded DESYrsquos expectations thereby paving the way for the installation at the European XFEL Assembly of this facility was completed at the end of 2016 Starting in the summer of 2017 scientists from around the world were able to use two out of the six initial planned scientific instruments for the intermediate term The accelerator is now operating at a temperature of -271 degC

Application Feature


Among the requirements

rsaquo Open standard rsaquo 19-inch-rack suitable rsaquo Modular and scalable rsaquo Very small individual systems very large system installations rsaquo Multiple sources for all components rsaquo A viable merchant market ndash ecosystem of industrial partners rsaquo Acceptance of the technology outside of the physics market rsaquo Availability and long-term support of operating systems rsaquo Bus bandwidth should be improved by a factor of 10 rsaquo An evolution path to increase the bandwidth further in the future rsaquo Use the latest high-speed interconnect technology rsaquo Improvement of signal quality in the system to increase the resolution of the

ADCDAC conversion rsaquo Higher-precision timing system to fulfill the high-precision synchronization

demands of a picosecond range rsaquo Availability of different footprints rsaquo Better remote control and monitoring as the installations are in tunnels with no

direct local access during operation rsaquo Trigger and interlock bus integrated in the backplane rsaquo Integrated high-precision (picosecond range) clock distribution rsaquo Better cabling management rear cabling via rear transition modules rsaquo Reduction in plugging and unplugging cables (a major source of system failures) rsaquo Faster and more reliable board replacement rsaquo Some cables are sensitive to motion such as RF cables rsaquo Hot-plug support rsaquo Redundant power and cooling rsaquo Support for redundancy of all components but without adding costs if not

implemented

Finding a solutionBetween 2009 and 2011 DESY and NAT worked with the MicroTCA ecosystem through the PICMG standards organization to extend the trigger and clock signals in the Zone 1 connector of the MTCA standard In 2011 the MTCA4 standard an evolu-tion of the MTCA0 standard was ratified by PICMG to address the requirements of the physics community The MTCA4 standard adds rear transition module support and special trigger and low-latency clock distribution buses to the MTCA standard and increases the number of power modules slots from two to four

During this time the embedded computing ecosystem developed ATCA boards AMC modules and RTMs and built systems based on ATCA and MTCA for meticulous benchmarking Comparing the signal quality flexibility system price and the avail-ability of commercial off-the-shelf (COTS) products many physics researchers made the MTCA4 platform their selected platform technology It was chosen for accelera-tors and experiments inside DESY as well as other Helmholtz institutes in Germany and worldwide in nearly all new low-level RF applications

Following are several examples of where the MTCA4 platform was tested intensively and successfully

Example 1 FLASH ndash FLASH is a free-electron laser at DESY which was commissioned in 2004 and has been used for research with shortwave ultraviolet and soft X-ray radiation since 2005 The facility is 260 meters long and generates soft X-ray radia-tion down to a wavelength of four nanometers (billionths of a meter) Until 2009 FLASH was the only free-electron laser in the world to produce radiation in the soft X-ray region

and generates extremely bright and short X-ray flashes with laser-like prop-erties in a self-amplifying process

Why build itThe technology DESY has used for high-speed high-performance control of the beams in its accelerators including PETRA and FLASH were no longer state-of-the-art and suitable for the next generation of accelerators In the year 2005 several task forces for different experimental projects had to define the requirements and find a new technology as a successor for the VMEbus and as a replacement for some of DESYrsquos proprietary hardware

In the years after 2005 there were two major trends in embedded systems One was to integrate high-speed serial inter-faces with existing parallel bus architec-tures offering backwards compatibility and forming new standards such as VXS CPSB and CPCI-Serial Another trend was to cut ties with existing archi-tectures and ignore backwards compati-bility Instead some companies adopted the latest high-speed serial interfaces (VPX technology is an example) while some standards organizations combined the latest switching interfaces with addi-tional features such as standardized management hardware and software The standards emerging from these efforts are AdvancedTCA (ATCA) and MicroTCA (MTCA)

These trends made it very difficult to select the right technology as no single standard could fulfill all the requirements of high-energy physics users Moreover in the early days it was unclear which new standard would be accepted in which market and have the longevity that research scientists needed

Standards challengeThe new technology needed to have the same advantages as the VMEbus including robustness modularity scal-ability suitability for 19-inch rack mounting and long life cycle support it also had to overcome the limitations of using a technology that is more than 30 years old In addition the functionality of DESYrsquos own proprietary hardware had to be considered


FLASH I uses MTCA0 platforms as a replacement for some of its VMEbus sys-tems to compare both technologies FLASH I was subsequently extended with FLASH II which uses mainly MTCA4 systems with the new timing capabilities Major parts of the FLASH installation are based now on MTCA4 platforms and run without disruption proving the reliability and signal quality and paving the way to next big installation XFEL

Example 2 European XFEL ndash FLASH is a small version of the European XFEL which is already producing laser flashes for science The facilities differ mainly in the wavelengths of the light flashes generated The new European XFEL light source was commissioned and built exclusively using MTCA4 technology (Figure 1)

MTCA4 systems are used as coupler-interlock master and slave low-level RF master and slave diagnostics experi-ment readout vacuum and magnets

The tunnel with a length of 34 kilometers is equipped with more than 200 MTCA4 systems most of which are 9U high 19 inches wide and contain 12 slots (similar to NATIVE-R9) some are 2U high with 6 slots The MicroTCA controller hubs (MCHs) are a combination of NAT-MCH-PHYS and NAT-MCH-PHYS80 models with their respec-tive rear transition module (RTM) NAT-MCH-RTM providing remote and local system control and management GbE and PCI Express non-blocking switches and low-latency clock distribution

Each system contains one or two redundant 1000-watt power supplies with the potential to upgrade to four of NATrsquos new NAT-PM-AC1000 units to provide double the power an Intel processor AMC module with two local SSDs with an upgrade path to the NAT-MCH-COMex-i7 potentially releasing an AMC slot The system also con-tains an NAMC-psTimer with picosecond timing accuracy a machine-protection AMC (DAMC-02) a data intercommunication AMC (DAMC-TCK7 with the NAMC-TCK7 as second source) and data-acquisition ADC and DACs Ethernet switches digital IO and other modules from the MicroTCA ecosystem

XFEL and beyondBesides being used for research in its own right FLASH also serves as a pilot facility for the European XFEL Its operation provides major insights that benefit the European XFEL which will generate even shorter wavelengths down to one-tenth of a nano-meter At the same time scientists can use the FLASH facility to continue development for the planned International Linear Collider (ILC) for particle physics (Table 1)

MTCA4 is the ideal standard for a project of the size of XFEL but also for smaller installations Reusing the same components even in small systems with only two

European XFEL FLASH

Abbreviation for

Start of commissioning

Length of the accelerator

Length of the facility

Number of accelerator modules

Maximum electron energy

Maximum wavelength of the laser light

Number of undulators (magnet structures for light generation)

Number of experiment stations

Location

Operator

European X-rayFree-Electron Laser

2016

17 kilometres

34 kilometres

100

175 billion electron volts(175 GeV)

005 nanometre(of the order of an atom)

3 upgradeable to 5

6 upgradeable to 10

Hamburg and Schenefelt

European XFEL GmbH

Free-Electron Laserin Hamburg

2004

015 kilometres x11

03 kilometres x11

7 x14

1 billion electron volts 175(1 GeV)

41 nanometre x182(of the order of an atom)

1

5 x2

Hamburg

DESY

Table 1 | Comparison of European XFEL and FLASH facilitiesrsaquo

Application Feature


boards can be implemented cost-effectively reducing maintenance costs by having a single technology for multiple applications

DESY is drawing up plans for PETRA IV upgrading PETRA III to become an extremely narrowly focused high-resolution 3D X-ray microscope offering outstanding research prospects for cutting-edge nanoscience and materials science When completed it will allow scientists to examine the physical and chemical processes taking place inside materials on all scales ndash from millimeters through to atomic dimensions

The PETRA III X-ray source already produces highly focused brilliant X-ray beams which are extremely good at penetrating matter A key parameter for this is the so-called emittance a measure of the cross-section and concentration of a particle beam inside an accelerator The smaller the emittance the better The planned modifications associated with PETRA IV will drastically reduce the emittance even further by up to two orders of magnitude MicroTCA4 will be part of that success

Heiko Koerte ndash who has been with NAT for nearly 26 years ndash is responsible for NATrsquos worldwide sales and marketing activities Prior to being appointed VP and Director Sales amp Marketing in 2000 he led software development at NAT for over eight years Heiko is still involved in the definition of all strategic hardware and software products at NAT He holds a diploma degree in physics from Bonn University (Bonn Germany) Reach Heiko at heikokoertenateuropecom

Vollrath Dirksen is Strategic Business Development Manager for NAT He was part of the MTCA4 and MTCA41 standardization work group for PICMG and runs frequent MTCA trainings at NAT DESY MicroTCA Technology Lab and customer sites Before joining NAT in 2007 Vollrath worked as Key Account Manager and Senior Channel Manager at Motorola Embedded Communications Computing and Blue Wave Systems in the telecom industrial defense and medical markets He holds a diploma degree in Telecommunication and Electrical Engineering from Jade University of Applied Sciences (Wilhelmshaven Germany) Readers may email him at vollrathnateuropecom

NAT wwwnateuropecom

Figure 1 | View into the 21-kilometer long accelerator tunnel of European XFEL with the yellow superconducting accelerator modules hanging from the ceiling (photo DESYD Noumllle)rsaquo


PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance telecommunications military indus-trial and general-purpose embedded computing applications

Founded in 1994 the group has more than 250 member companies that specialize in a wide range of technical disciplines including mechanical and thermal design single-board computer design very-high-speed signaling design and analysis networking expertise backplane and packaging design power management high-availability software and comprehensive system management

Key standards families developed by PICMG include CompactPCI AdvancedTCA MicroTCA AdvancedMC CompactPCI Serial COM Express SHB Express and HPM (Hardware Platform Management) In its more than two decades of operation PICMG has published over 50 specifications developed by participants from hundreds of com-panies Work on standards across a wide range of markets applications and tech-nologies continues as the boundaries of datacom telecom military and aerospace industrial manmachine interface applications and deeply embedded computing continue to blur

Equipment built to PICMG standards is used worldwide with any company allowed to build or use equipment without restriction (although certain technologies used for some military applications may be subject to US export restrictions governed by ITAR rules)

A rigorous intellectual property (IP) policy ensures early discovery of any member-owned IP moreover all members must agree to ldquoreasonable and non-discrimina-toryrdquo (RAND) licensing of any IP written into a standard To date no PICMG standard requires any license or royalty to build or operate

PICMG adheres to a formal multistep development process Development work can be periodically be reviewed by all member companies although work inside of a tech-nical subcommittee is confidential to the members of that committee until that work

is ready for broader review by other members Until a specification or stan-dards-related document is ratified by the entire membership it is confidential to PICMG After ratification all documents are available to the general public

Why use PICMG standardsPICMG standards ndash because the orga-nization has such a large number of contributing companies ndash reflect the extremely wide and deep technical capabilities of its members By using well-understood and proven open stan-dards vendors can bring products to market quickly Customers gain from the price and performance competition that results from many vendors operating in an open marketplace

Thousands of PICMG standards- compliant products ndash ranging from components and subsystems to complete application-ready systems ndash are commercially avail-able representing more than $5 billion per year in global revenue

To Learn MoreTo learn more about the PICMG organization and membership please visit wwwpicmgorgmembership or email infopicmgorg

PCI Industrial Computer Manufacturersrsquo Group (PICMG) Consortium Info


Thousands of PICMG-compliant products ranging from components and subsystems to complete application-ready systems are commercially available representing more than $5 billion yearly in global revenue

There are nine distinct ldquofamiliesrdquo of PICMG standards Many have subsidiary specifications that are designed to add additional capability

Please visit wwwpicmgorgopenstandards to learn more about each one

rsaquo Advanced TCA This high-performance modular standard also called ATCA was developed for critical central-office

telecommunications applications and is also used for a wide range of commercial and military applications It offers

a complete management infrastructure so that high-availability systems with ldquosix ninesrdquo reliability can be deployed

rsaquo CompactPCI A modular general-purpose computing system based on 3U and 6U Eurocard mechanical standards it

features hot-swap capability and can be either convection- or conduction-cooled With hundreds of thousands of installations

worldwide this popular architecture is one of the most successful and popular standards in use today

rsaquo COM Express This small-form-factor (SFF) standard is designed for deeply embedded applications where space is

at a premium but high performance is required COM Express boards can be used as standalones or plugged onto an

application-specific baseboard with IO expansion

rsaquo MicroTCA Often called ldquoAdvancedTCArsquos little brotherrdquo MicroTCA is a modular platform for building smaller and less-

expensive systems that AdvancedTCA while retaining the high-availability architecture of AdvancedTCA MicroTCA systems

use AMC modules as their basic computing and IO building blocks

rsaquo Advanced MC This standard defines a family of small hot-swappable and fully managed mezzanine cards that can be

used to tailor IO for large AdvancedTCA systems or used as the basis for building MicroTCA systems They are commonly

called ldquoAMCsrdquo

rsaquo CompactPCI Serial This relatively new standard uses CompactPCIrsquos mechanical structure but updates the system

interconnects to include PCI Express Ethernet SATA and USB It offers 20 to 40 times the backplane bandwidth

of CompactPCI and is ideal for new applications or upgrades to older systems

rsaquo SHB Express This upgrade to the PCI-ISA standard replaces parallel PCI interconnects with serial PCI Express lanes

improving performance and increasing compute power A passive backplane is used and standard desktop PCI Express cards

can be used for IO customization

rsaquo Hardware Platform Management Also known as ldquoHPMrdquo this software standard defines how to build fully

managed high-availability AdvancedTCA or MicroTCA systems It is the first and currently the only open standard for

system management

rsaquo PCI-ISA PICMGrsquos first open standard PCI-ISA is used to build rugged reliable and maintainable computers that are

designed to replace desktop PCs in industrial-control communications or data-acquisition applications The PCI-ISA standard

moves all of the active circuitry normally found on a motherboard to an easily replaceable and upgradable plug-in card

While standard PC cards plug into other slots to customize a system a PCI-ISA system uses a passive backplane consisting

of connectors with no active components

rsaquo New standards and under development The cPCI Serial Space specification a ruggedized version of CompactPCI

Serial that specifically addresses the extreme environment requirements for outer space was ratified in August 2017

In addition PICMG is working with members and advisory board industry leaders to develop the elements for an IIoT

[industrial Internet of Things] specification New standards arise when members identify the need to create a new

embedded computing standard for a particular market or application

OPEN MODULAR COMPUTING STANDARDS



Why join PICMGBy joining an organization like PICMG anyone can play an important role Participants have access to thought leaders in areas they or their company may lack expertise They come to know experts in a wide range of engineering disciplines The groups that develop these open standards do so because they are interested in getting something done in a finite amount of time whenever possible bureaucracy and politics are kept to a minimum Members of these development groups have a common goal To create standards that are widely used and that each company involved can make money from Companies can specialize in their areas of expertise without needing to be good at everything In addition to technical collaboration business collaborations often evolve in a symbiotic way

Companies that participate in standards development also have a very important advantage They are already up to speed when the standard is released and can thus be first to market with compliant and leading-edge products

In its 20-plus years of operation PICMG has published almost 50 open industry specifications that encompass nine basic standards families developed by participants from hundreds of companies The Consortium plans to continue its work across a wide range of technologies Member companies of PICMG have some big plans for the next decade as designers in the data communica-tions telecommunications industrial and militaryaerospace arenas embed technology ever more deeply into specialized and everyday products


What makes PICMG a leading standards organizationPICMG has more than 250 member companies all of which combine to bring an extremely wide and deep talent base to the table Unlike some other consortia PICMG is not controlled by one or a few companies It is governed by the Executive Members that work together to ratify processes and procedures elect officers and approve budgets PICMG maintains a ldquoone company-one voterdquo policy which means that no single company can dominate the standards-development process

Over the last several decades open standards have become increasingly important for a wide range of embedded and specialized computer applications both big and small While the definition of ldquoopen standardrdquo can vary for the embedded computer world it usually means a succinct definition of everything a vendor needs to know to build equipment and write software that will work with compatible products offered by other vendors

In an organization like PICMG all players whether large or small can take an important role Participants have access to thought leaders in areas they or their company may lack expertise They also can meet experts in a wide range of engineering disciplines

PICMG also has an outstanding intellectual property (IP) policy that ensures that members must submit IP declarations throughout the standards-development process where they can be accepted for use or rejected To date no PICMG standard or specification has required any user licenses or royalties Moreover anyone can build equipment in accordance with or use PICMG standards whether they are members or not PICMG is truly an open organization Dues are low In fact the cost of a yearly Executive mem-bership has not changed in 20 years


THE VALUE OF OPEN STANDARDS

JOINING PICMG



LIST OF PICMG EXECUTIVE MEMBERS

ADLINK Technology Inc wwwadlinktechcom

Advantech Co LTD wwwadvantechcom

Airbus Defence amp Space wwwairbusdefenceandspacecom

Amphenol wwwamphenolcom

Artesyn Embedded Technologies wwwartesyncom

BAE Systems wwwbaesystemscom

congatec AG wwwcongateccom

DESY wwwdesyde

Elma Electronic Inc wwwelmacom

Ericsson AB wwwericssoncom

European Spallation Source ERIC wwweuropeanspallationsourcese

Eurotech SpA wwweurotechcom

Extreme Engineering Solutions wwwxes-inccom

Fivetech Technology Inc wwwfivetkcom

Fraunhofer FOKUS wwwfokusfraunhoferde

Fujitsu Limited wwwfujitsucom

General Micro Systems Inc wwwgms4sbccom

HEITEC AG wwwheitecde

Huawei wwwhuaweicomen

IN2P3-CNRS wwwin2p3fr

Institute of High Energy Physics httpenglishihepcascn

Intel Corporation wwwintelcom

Keysight Technologies wwwkeysightcom

Kontron wwwkontroncom

Meinberg Funkuhren GmbH amp Co KG wwwmeinbergde

MEN Mikro Elektronik GmbH wwwmenmicrocom

Mercury Systems Inc wwwmrcycom

MSC Technologies GmbH wwwmsc-technologieseu

NAT GmbH wwwnateuropecom

National Instruments wwwnicom

North Atlantic Industries wwwnaiicom

nVent Schroff schroffnventcom

OpenSystems Media wwwopensysmediacom

PICMG China wwwpicmgorgmemberpicmg-china

Pixus Technologies Inc wwwpixustechnologiescom

Polyrack Electronic-Aufbausysteme GmbH wwwpolyrackcom

Portwell Inc wwwportwellcom

Prodrive BV prodrive-technologiescom

RECAB recabcom

RTD Embedded Technologies Inc wwwrtdcom

Samtec wwwsamteccom

Sanritz Automation Co Ltd wwwsanritzcojp

SECO SpA wwwsecoit

Simonson Technology Services wwwsimonsontechnet

SLAC National Accelerator Laboratory www6slacstanfordedu

Southco Inc wwwsouthcocom

TE Connectivity wwwtecom

Trenton Systems Inc wwwtrentonsystemscom

VadaTech Inc wwwvadatechcom

Vectology Inc wwwvectologyjp

Yamaichi Electronics wwwyamaichicom

ZTE Corporation wwwztecom


Listings are subject to change

FEATURES

ĄĄ AMD Ryzentrade Embedded V1000 processorsĄĄ Up to 4 cores 8 threads with the latest Radeontrade Vega graphics

and IO Controller on a single ChipĄĄ Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC

MemoryĄĄ 4x USB 30 8x USB 20 4x PCI-e x1 Gen 3 PEG x8 Gen3ĄĄ Scalable TDPĄĄ Also available in industrial version (-40degC divide +85degC)

COMe-B75-CT6 is a COM Expresstrade Compact 30 Type 6 Module designed by SECO with nothing less than the AMD Ryzentrade Embed-ded V1000 processors The module mounts up to 4 ldquoZenrdquo x86 CPU cores with the latest Radeontrade graphics and IO controller on a single chip It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory a wide range of expansion ports PCI-Express Serial Ports networking and video interfaces which make it an ideal solution for multiple scenarios from medical imaging to industrial controls up to premium thin client digital signage and communications infrastructure

COM Express with AMD Ryzentrade Embedded V1000 processors

COM Express

wwwsecocomprodseucategorycom-expresstype-vicome-b75-ct6html

SECOwwwsecocom

salessecocom +39 0575 26979 wwwlinkedincomcompanyseco-spa SECO_spa

FEATURES

ĄĄ Mini-ITX format for easy mountingĄĄ COM Express Type 10 processor slot (Supports Intelreg Atomreg

(Apollo Lake) CPU module)ĄĄ Four AcroPack mini PCIe slots for field IOĄĄ Peripherals 2x GbE RJ45 2x USB 30 2x RS232 DisplayPortĄĄ Storage M2 80mm site removable 25 SSD SATA IIĄĄ -40deg C to +85deg C extended temperature range

The ACEX4040 carrier card allows you to quickly combine a COM Express Type 10 CPU module with a mix of IO modules for custom computing applications With its rugged design and compact Mini-ITX form factor this carrier card is easily mounted in a variety of enclosures for rapid development High-density IO connectors and numerous ports simplify interfacing to field devices and peripherals

Select from 25+ AcroPackreg modules to install any combination of analog IO digital IO serial IO MIL-STD 1553 CAN and FPGA processor functions

COMe T10 Carrier Hosts Four AcroPack IO Modules

COM Express

wwwacromagcomACEX4040

Acromag IncwwwacromagcomACEX4040

solutionsacromagcom 877-295-7088 wwwlinkedincomcompanyacromag Acromag

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

24 | Spring 2019 PICMG Systems amp Technology Resource Guide wwwpicmgmil-embeddedcom

The MSC C6B-CFLH delivers scalable CPU and graphics performance ranging from Intelreg Coretrade Processor i3 and i5 up to i7 and Xeon This makes it the ideal workhorse for CPU and graphics intensive tasks in medical industrial scientific surveillance traffic control media processing and gaming applications

bull COM Expressreg Type 6 Basic form-factorbull Most recent 8th Generation Intelreg Coretrade processorbull Four and six processor core optionsbull Up to 32GB DDR4 DRAM with optional ECCbull DisplayPortHDMIDVIbull eDPLVDS interface optionsbull Triple independent display support res up to 4kbull 4x 6Gbs SATAbull 4x USB 3120 and 4x USB 20 interfacesbull Eight PCI Expresstrade x1 lanesbull PEG port 1x16 for connecting IO extensions and

GPUphysics accelerators bull Trusted Platform Module (TPM)

At Avnet we believe in scalability and diversity of products and we share the passion for technology with our customers That is why our engineers created one of the most comprehensive product portfolio of PICMG COM Expressreg modules

If you want to learn more about what is coming up next on our roadmap join us at Embedded World in Nuremberg Germany 26-28 February 2019 Booth 2-238

The MSC C7B-DVDVL product line is a high performance computing platform with on-chip crypto accelerator and multiple 10GbE ports It provides industry leading perfor-mance at low power consumption and is well positioned for edgefog computing switchingrouting network appliances ATE machine learning and medical applications

bull COM Expressreg Type 7 Basic form-factorbull Intel Atomreg C3000 processor seriesbull From two to sixteen processor coresbull Up to 48GB DDR4 DRAM with optional ECCbull Crypto HW acceleration for CPU offloadingbull Up to four 10GbE portsbull 2x 6Gbs SATA optional eMMC SSDbull Up to 3x USB 30 and 4x 20 USBbull DV provides PCIe switching for extended IO

connectivity (up to 22 PCIe lanes)bull DVL comes with direct lane mapping

(up to 14 PCIe gen 3 lanes)bull Trusted Platform Module (TPM)

MSC C6B-CFLH MSC C7B-DV MSC C7B-DVL

Avnet Integratedavnetcomintegrated

infomscavneteu +49 7249 910 0 wwwlinkedincomcompanyavnet twittercomAvnet

COM Express

wwwmsc-technologieseu

bull Intelreg Coretrade H amp U processors seriesbull Intel Atomreg C3000 processor seriesbull Intel Atomreg processor E3900 amp E3800 series

bull From single to sixteen coresbull Basic Compact and Mini form-factor boardsbull Commercial and industrial temperature options

PICMG System

s amp Technology Resource Guide

wwwpicmgmil-embeddedcom PICMG Systems amp Technology Resource Guide Spring 2019 | 25

FEATURES

ĄĄ High scalability from 16 Core Intelreg Xeonreg processor technology with 45 W TDP to low-power quad core Intelreg Atomtrade processors with a TDP as low as 115 W

ĄĄ All Server-on-Modules support the commercial temperature (0degC to 60degC) range Selected SKUS even offer support for the industrial temperature range (-40 degC to +85 degC)

ĄĄ conga-B7AC with Intel Atom technology (code named Denverton) offers 4x 10 Gigabit Ethernet ports conga-B7XD with Intel Xeon technology support 2x 10 GbE

ĄĄ Supporting up to 48 gigabytes of fast and energy efficient 2400DDR4 (ECC or Non ECC)

ĄĄ NC-SI Network Controller Sideband Interface support to connect a Baseboard Management Controller allowing out-of-band remote manageability

ĄĄ Up to 32 PCIe lanes for flexible server extensions such as NVMe flash storage andor GPGPUs

ĄĄ Comprehensive set of standard interfaces with 2x SATA Gen3 (6 Gbs) 6x USB 3020 LPC SPI I2C Bus and 2x legacy UART

ĄĄ OS support for Linux and Microsoft Windows variants

With the launch of the COM Express Type 7 specification the PICMG has defined a highly flexible new module standard characterized by high-speed network connectivity with up to four 10 GbE interfaces as well as an increased number of up to 32 PCIe lanes for customization This is a perfect basis for bringing the embedded server-class Intelreg Xeonreg D SoC as well as the new Intelreg Atomtrade processors (code name Denverton) to the industrial fields

Developers with high-performance demands for industrial automa-tion storage and networking applications modular server and base station designs for telecom carriers as well as cloud edge and fog servers for IoT and Industry 40 applications are best served with modules based on the Intel Xeon D1500 processor family such as the conga-B7XD COM Express Type 7 Server-on-Modules from congatec They are available with ten different server processors soldered on the module for highest robustness ranging from the Intelreg Xeonreg processor D1577 to the Intelreg Pentiumreg processor D1519 for the industrial temperature range (-40degC to +85degC) These modules offer up to 16 cores for 32 threads and a maximum turbo frequency of up to 270 GHz delivered in a low thermal envelope of only 45 Watt thermal design power (TDP) and below

For applications that are power restricted andor do not need the high performance per core that the Intel Xeon D1500 processors provide the new conga-B7AC modules with Intelreg Atomtrade C3000 processors raise the bar for embedded edge computing through 10 GbE band-width support With a power consumption of only 11 to 31 Watt TDP the new low-power multi-core Server-on-Modules feature up to 16 cores Compared to the Intel Xeon modules they do not support hyper threading or turbo boost

Both new congatec COM Express Type 7 Server-on-Modules impress by a full range of server features on a very small form factor including multiple 10 Gigabit Ethernet interfaces 32 PCIe lanes and up to 48 gigabytes of DDR4 ECC RAM The long-term available Server-on-Modules come application-ready offering a standard-ized footprint carrier board interfaces and a cooling concept which significantly simplifies system designs ndash accelerating the launch of new robust server technology Future performance upgrades are remarkably simple and cost-efficient as only the Server-on-Module needs to be exchanged for new processor architecture

Product Link wwwcongateccomusproductscom-express-type7html

Server-on-Modules

congatec wwwcongatecus

sales-uscongateccom 858-457-2600 wwwlinkedincomcompanycongatec congatecAG

COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES

ĄĄ Up to 16 Cores for HPEC and Microserver-ready ApplicationsĄĄ Powerful Intel Xeon D-1500 CPUĄĄ Up to 64GB ECC RAMĄĄ 2x 10Gb EthernetĄĄ Rugged and Fanless DesignĄĄ Full HWSW CustomizationĄĄ Eurotech Professional Services

The CPU-162-23 brings the computational performance and RAM capacity of a server to the field It supports extended temperature range (-40 to +85degC) and ECC memory to operate reliably in industrial and rugged applicationsThe CPU-162-23 can be configured with any member of the XeonPentium D-1500 family ranging from 4 to 16 cores and is available with up to four SO-DIMM sockets for a total of 64GB DDR4 with or without ECCThe CPU-162-23 is a headless module with a Basic form factor (125x95mm) that is fully compliant with the COM Express Type 7 pinout delivering very high speed interfaces like up to x32 PCIe lanes two 10Gbps (10GBASE-KR) and one 101001000Mbps Ethernet port (1000BASE-T) Other interfaces include two SATA 30 ports four USB 30 and four USB 20 portsSupported operating systems include Yocto Linux and CentOS moreover the CPU-162-23 supports Everyware Software Framework (ESF) a commercial enterprise-ready edition of Eclipse Kura the open source JavaOSGi middleware for IoT Edge GatewaysEurotech Professional Services are available for the CPU-162-23 starting from BIOS personalization and include carrier board design system development and production Deep module customization such as feature changes are also available

CPU-162-23 COM Express Basic Type 7 ndash Rugged Intel Xeon D

COM Express

wwweurotechcomenproductsboards-modulescomexpresscpu-162-23

Eurotechwwweurotechcom

saleseurotechcom +39 0433 485 411 wwwlinkedincomcompanyeurotech eurotechfan

FEATURES

ĄĄ Up to 12 Cores for HPEC and Microserver-ready ApplicationsĄĄ Powerful Intel Xeon D-1500 CPUĄĄ Hybrid RAM ArchitectureĄĄ Compact Size with PCIe x16 PortĄĄ Rugged and FanlessĄĄ Full HWSW CustomizationĄĄ Eurotech Professional Services

The CPU-161-18 is a COM Express module that combines a high performance truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs 8GB of memory soldered directly on the PCB and up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot targeting use cases requiring extreme rugged-ness and large memoryConfigurable with any member of the XeonPentium D-1500 family it supports extended temperature CPUs such as the Pentium D-1519 and the Xeon D-1559 closing the gap between traditional embedded applications and serversCompatible with existing Type 6 carrier boards the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 oneSupported operating systems include Yocto Linux and CentOS moreover the CPU-161-18 supports Everyware Software Framework (ESF) Eurotechrsquos IoT Edge FrameworkEurotech Professional Services are available for the CPU-161-18 from BIOS personalization to carrier board design system development and production Deep module customization such as feature changes are also available

CPU-161-18 COM Express Compact Type 6 ndash Rugged Intel Xeon D

COM Express




PICMG System


PICMG System



FEATURES

ĄĄ Made in the USA

ĄĄ Most rack accessories ship from stock

ĄĄ Modified lsquostandardsrsquo and customization are our specialty

ĄĄ Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ System monitoring option (CMM)

ĄĄ AC or DC power input

ĄĄ Power options up to 1200 watts

VME and VME64x CompactPCI or PXI chassis are avail-able in many configurations from 1U to 12U 2 to 21 slots with many power options up to 1200 watts Dual hot-swap is available in AC or DC versions We have in-house design manufacturing capabilities and in-process controls All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry

Series 2370 chassis offer the lowest profile per slot Cards are inserted horizontally from the front and 80mm rear IO back-plane slot configuration is also available Chassis are available from 1U 2 slots up to 7U 12 slots for VME CompactPCI or PXI All chassis are IEEE 11011011 compliant with hot-swap plug-in AC or DC power options

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards Options include hot-swap plug-in AC or DC power and system voltagetemperature monitor Embedded power supplies are available up to 1200 watts

Series 790 is MIL-STD-461DE compliant and certified economical and lighter weight than most enclosures available today It is available in 3U 4U and 5U models up to 7 horizon-tal slots

All Vector chassis are available for custom modification in the shortest time frame Many factory paint colors are available and can be specified with Federal Standard or RAL numbers

For more detailed product informationplease visit wwwvectorelectcom

or call 1-800-423-5659and discuss your applicationwith a Vector representative

cPCI PXI VME Custom Packaging Solutions

Vector Electronics amp Technology Incwwwvectorelectcom

inquirevectorelectcom 800-423-5659

CompactPCI

wwwvectorelectcom

Made in the USASince 1947

A FINE TECHNOLOGY GROUP

VISIT OUR NEWWEBSITE

WWWVECTORELECTCOM

PICM

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stem

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ogy

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FEATURES

ĄĄ Configuration Up to 7 slots of 3U VPX or CompactPCI modulesĄĄ Cooling Air assisted conduction cooledĄĄ Operating Temperature Min -54 degC to Max + 55 degC ĄĄ Altitude (1000 ft) 50ĄĄ Module Cooling ConductionĄĄ Mounting Base or slide panelĄĄ Construction Dip brazed aluminum

Proven ATR enclosure design for rugged and high level processing applications

The 717-SM Series ATR is the latest proven design in Atrennersquos extensive enclosure design portfolio Designed to perform in the harshest environments it can be deployed in a range of land sea and air applications Typical applications involve SIGNIT ISR and EW where high level processing and throughput is required The ATR is highly customizable for customer-specific application and require-ments Configurable for up to 7 slots of 3U VPX or CompactPCI modules this ATR enclosure also comes with an additional 3U Vita 62 compliant power supply slot The 717-SM Series continues to provide the industry with a baseline of proven and qualified designs where performance and reliability are at the highest levels as demanded by the most discerning customer

717-SM Series ATR

CompactPCIcPCI Serial Space

wwwatrennecomproducts717-series-1-atr

Atrenne A Celestica Companywwwatrennecom

salesatrennecom 800-926-8722 AtrenneOfficial wwwlinkedincomcompanyatrenne-integrated-solutions

FEATURES

ĄĄ Two AcroPack or mini-PCIe module slots support any combination of IO functionsĄĄ PCI Express Version 21 compliant carrierĄĄ Compliant with PICMG CPCI-S0 R20 standardĄĄ PCIe switch allows two devices to share a single 4HP

peripheral board slot in a CPCI-S chassisĄĄ Geographical addressing identifies carrier location on the

backplaneĄĄ Front panel 68-pin VHDCI CHAMP 08mm connectors for

field IO signals

The ACPS3310 is a 3U CompactPCI Serial carrier card for Acromagrsquos AcroPack mezzanine modules Two isolated IO expansion slots interface AcroPack or mini PCIe modules to the PCIe bus All connections to field signals are made through front panel connectors on the carrier board which passes them to the individual AcroPack modulesSelect from 25+ AcroPack modules to install any combination of analog IO digital IO serial IO communication and FPGA processor functions This modular approach allows the user to create a board which is customized to the application thus saving slots and reducing costs

3U CompactPCI Serial Carrier Card for AcroPackreg or mPCIe


wwwacromagcomACPS3310

Acromag IncwwwacromagcomACPS3310


PICMG System


PICMG System



FEATURES

ĄĄ Graphical block level designĄĄ Xilinx- and Intel-Altera FPGAĄĄ GigE-Vision CameraLink USB3-VisionĄĄ Up to 48 GigE-Vision cameras in 2U MTCA crateĄĄ Up to 64 Gbps PCIexpress infrastructure with 128 Gbps optical uplinkĄĄ 40 Gbps Ethernet infrastructure with 100 Gbps optical uplink

NATvision high performance video and image processing technology is based on todayrsquos state of the art Xilinx and Intel Altera FPGA resource boards combining the performance and realtime advantages of FPGA hardware based algorithms with software based image processing running on ARM CPUsNATvision system solution uses the open system standard MTCA for embedded applications This combines flexibility and scala-bility with high speed data rate capabilitiesIn a small 2U 19-inch system up to 48 GigE-Vision cameras can be terminated and synchronised the image data pre-processed and then distributed flexiblyCompared to existing solutions NATvision reduces the number of cables offers higher speed interconnects timing and trigger signals and reduces the development costs of FPGAARM based programmingTo meet time-to-market product price expectations and perfor-mance requirements NATvision offers as development environ-mentbull Graphical block level design with Visual Applets bull ARM CC++ code combined with FPGA high level design (HLS) bull Linux-BSP with AXI interface and VHDL or Verilog coding

Industrial Automation

NAT GmbHhttpswwwnateuropecomsolutionsnatvisionhtml infonateuropecom +49 228 965 864 0

NATvision ndash High performance video and image processing

PICM

G Sy

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s amp

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ogy

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PICM

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OpenSystems Media works with industry leaders to develop and publish content that educates our readers

Check out our white papers at wwwpicmgmil-embeddedcom

white-papers

4 Game-Changing Underlying Technologies for Advanced RadarBy National Instruments

The electromagnetic spectrum is an increasingly contentious warfare domain the evolution of which presents new challenges for scientists and engineers who design intelligence surveillance and reconnaissance (ISR) systems The underlying technologies that enable these sophisticated systems are also evolving to meet these challenges In this white paper learn how four recent innovations ndash gallium nitride for front-end components high-speed data converters for tx and rx evolving FPGA technology for cognitive techniques and high-bandwidth data buses for sensor fusion ndash will have the biggest enabling impact on radar technology over the next several years

Read the white paper httpsbitly2GkZOJZ



Check out our white papershttpwhitepapersopensystemsmediacom

Most popular topicsManaging SWaP COM ExpressMIL-STD-1553Cockpit Display SystemsThermal ManagementShock and Vibration Testing Radar Software Defined Radio

FPGAsCOTSVPX UAVsPICMGCounterfeit partsData Security

SPRING 2019

VOLUME 23 NUMBER 1

Member since 1998

On the cover

The PICMG Systems amp Technology 2019 Resource Guide covers the use of MTCA4 in high-energy physics COM Express in medical imaging the 25th anniversary of the PICMG consortium and more

The Resource Guide also highlights some of the industryrsquos top products in the categories of COM Express CompactPCI cPCI Serial Space and Industrial Automation

picmg-systemscom PICMG_Tech

reg 2019 OpenSystems Mediareg CompactPCI PICMG PICMG ATCA AdvancedTCA MicroTCA AdvancedMC

GEN4 and their logos are registered trademarks of PICMGTM xTCA is a trademark of PICMGcopy 2019 PICMG Systems amp TechnologyAll registered brands and trademarks in AdvancedTCA amp CompactPCI Systems are property of their respective owners

Published by

Presidentrsquos Corner | Jessica Isquith

4 Celebrating 25 years of PICMG

6 PICMG Consortium Members at Embedded World

MicroTCA Workshop Report | Justin Moll

5 MicroTCA workshop at DESY ndash 2018

Technology Focus 8 Leveraging COM Express for medical equipment design By Patrick Lee Arbor Technology

12 Next-generation backplane production technology By Gary Routledge Amphenol

Application Feature 16 High-energy physics Controllers for X-ray laser accelerators By Heiko Koerte and Vollrath Dirksen NAT

PICMG Consortium 20 PCI Industrial Computer Manufacturersrsquo Group (PICMG)

Consortium Info

2019 Resource Guide

24 COM Express CompactPCI cPCI Serial Space Industrial Automation


Leveraging COM Express for medical equipment design

By Patrick Lee Arbor Technology

Next-generation backplane production technology

By Gary Routledge Amphenol

High-energy physics Controllers for X-ray laser accelerators

By Heiko Koerte and Vollrath Dirksen NAT

Technology Focus

Technology Focus

Application Feature

8

12

16

Standards-based technology platforms for open innovation

IMAGE

WWWOPENSYSMEDIACOM

ADVERTISER PAGE







EVENTS













SALESMARKETING



























PAGE ADVERTISER







ADVERTISER INDEX




































wwwembedded-worldde

Company BoothHall


Acromag Inc 33-354








congatec AG 11-358



DFI Inc 11-521




ENGICAM srl 33-219

ept GmbH 33-510


Eurotech SpA 33-529


Company BoothHall



HEITEC AG 11-340



Kontron 11-478



11-181





33-349

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Samtec 4A4A-240

SECO SpA 11-330




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Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe


SATA

USB


HDMI

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VGA

DVI

DPeDP


GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP











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Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


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PICM

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stem

s amp

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ogy

Res

ourc

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ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

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ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

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ogy

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ourc

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ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

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stem

s amp

Tec

hnol

ogy

Res

ourc

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ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

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ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









WWWOPENSYSMEDIACOM

ADVERTISER PAGE







EVENTS













SALESMARKETING



























PAGE ADVERTISER







ADVERTISER INDEX




































wwwembedded-worldde

Company BoothHall


Acromag Inc 33-354








congatec AG 11-358



DFI Inc 11-521




ENGICAM srl 33-219

ept GmbH 33-510


Eurotech SpA 33-529


Company BoothHall



HEITEC AG 11-340



Kontron 11-478



11-181





33-349

Portwell Inc 22-340


Samtec 4A4A-240

SECO SpA 11-330




Nuumlrnberg Germany


Media partners

Keep up to date

embedded-worldde




T +49 9 11 86 06-49 12

F +49 9 11 86 06-49 13




T +49 89 2 55 56-13 49

F +49 89 2 55 56-03 49













Technology Focus









rsaquo

Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe


SATA

USB


HDMI

LVDS

VGA

DVI

DPeDP


GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP











wwwpicmgorg


Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

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ogy

Res

ourc

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ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

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ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers








































wwwembedded-worldde

Company BoothHall


Acromag Inc 33-354








congatec AG 11-358



DFI Inc 11-521




ENGICAM srl 33-219

ept GmbH 33-510


Eurotech SpA 33-529


Company BoothHall



HEITEC AG 11-340



Kontron 11-478



11-181





33-349

Portwell Inc 22-340


Samtec 4A4A-240

SECO SpA 11-330




Nuumlrnberg Germany


Media partners

Keep up to date

embedded-worldde




T +49 9 11 86 06-49 12

F +49 9 11 86 06-49 13




T +49 89 2 55 56-13 49

F +49 89 2 55 56-03 49













Technology Focus









rsaquo

Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe


SATA

USB


HDMI

LVDS

VGA

DVI

DPeDP


GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP











wwwpicmgorg


Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









Nuumlrnberg Germany


Media partners

Keep up to date

embedded-worldde




T +49 9 11 86 06-49 12

F +49 9 11 86 06-49 13




T +49 89 2 55 56-13 49

F +49 89 2 55 56-03 49













Technology Focus









rsaquo

Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe


SATA

USB


HDMI

LVDS

VGA

DVI

DPeDP


GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP











wwwpicmgorg


Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers
















Technology Focus









rsaquo

Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe


SATA

USB


HDMI

LVDS

VGA

DVI

DPeDP


GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP











wwwpicmgorg


Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

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s amp

Tec

hnol

ogy

Res

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COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

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PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

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white-papers
















rsaquo

Discrete GPU

GPU

CPU

COMe Module

MemoryMemory

x8 PCIe

x16 PCIe


SATA

USB


HDMI

LVDS

VGA

DVI

DPeDP


GPU

CPU

COMe Module

Memory

x8 PCIe SATA

USB

HDMI

LVDS

VGA

DVI

DPeDP











wwwpicmgorg


Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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ide

PICM

G Sy

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s amp

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Res

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COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

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FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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ide

PICM

G Sy

stem

s amp

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Res

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white-papers
















wwwpicmgorg


Join PICMG today


Technology Focus









UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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ide



white-papers
















UNDERSTANDABLY HAVE





REGULATIONS

























Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers



















Technology Focus




















Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers



























Technology Focus

Figure 3A Figure 3B

Figure 3C Figure 3D





















rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers




























rsaquo







Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers














Application Feature







implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers














implemented


















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers
















European XFEL FLASH

Abbreviation for









Location

Operator


2016

17 kilometres

34 kilometres

100



3 upgradeable to 5

6 upgradeable to 10


European XFEL GmbH


2004

015 kilometres x11

03 kilometres x11

7 x14



1

5 x2

Hamburg

DESY


Application Feature







NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers














NAT wwwnateuropecom









































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers















































system management
























JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers



















JOINING PICMG











DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

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e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers

















DESY wwwdesyde































RECAB recabcom


Samtec wwwsamteccom


SECO SpA wwwsecoit












FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









FEATURES






COM Express


SECOwwwsecocom


FEATURES






COM Express




PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide














COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers





















COM Express




PICMG System



FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









FEATURES














Server-on-Modules



COM Express

wwwcongatecus

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









FEATURES




COM Express




FEATURES




COM Express




PICMG System


PICMG System



FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









FEATURES


















CompactPCI

wwwvectorelectcom




WWWVECTORELECTCOM

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide


FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









FEATURES




717-SM Series ATR





FEATURES




field IO signals







PICMG System


PICMG System



FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









FEATURES






PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide

PICM

G Sy

stem

s amp

Tec

hnol

ogy

Res

ourc

e Gu

ide



white-papers









president’s corner pg. 4 celebrating 25 years of...

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