shb express continues strong open source vs. open spec...

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Standards Update Changes at PICMG for 2017

ALSO: ATCA & HPM at 15 SHB Express continues strong Open source vs. open spec CompactPCI Serial in spacexTCA for Physics

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NEW IDEASSHAPING THE FUTURE

Register at XPONENTIAL.org

AUVSI XPONENTIAL 2017 will equip you with insights spanning the next generation of unmanned systems maintaining technological advantage over our adversaries and aiding in the safety of our troops.

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GROUP EDITORIAL DIRECTOR John McHale [email protected]

PRESIDENT OF PICMG Jessica Isquith [email protected]

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www.picmg-systems.com PICMG Systems & Technology Resource Guide Spring 2017 | 3

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Pixus Technologies 31

MicroTCA IOxOS Technologies 28 IOxOS Technologies 31

RESOURCE GUIDE INDEX

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SPRING 2017 | VOLUME 21 NUMBER 1

® 2017 OpenSystems Media® CompactPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC,

GEN4, and their logos are registered trademarks of PICMG.TM xTCA is a trademark of PICMG.© 2017 PICMG Systems & TechnologyAll registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners. Member since 1998

On the cover

The PICMG Systems & Technology 2017 Resource Guide highlights a number of popular PICMG standards. The Resource Guide also spotlights some of the industry’s top products, in the categories of AdvancedTCA, CompactPCI, enclosures, COM Express, CompactPCI Serial, and MicroTCA.

Standards Update | Jessica Isquith

5 2017 marks significant changes for PICMG

Technology Focus 6 PICMG standards adoption growing in Asia, Europe with

COM Express leading the way By John McHale, Editorial Director

Application Feature 8 ATCA and its hardware platform management at 15 years:

How can I use them now? By Mark Overgaard, Pentair Electronics Protection

12 SHB Express still going strong – PICMG 1.3 application examples

By Jim Renehan, Trenton Technology

16 PICMG: A CTO’s perspective By Doug Sandy, Artesyn Embedded Technologies

20 CompactPCI Serial reaches out into space By Manfred Schmitz, MEN Mikro Elektronik

22 Recent developments based on PICMG xTCA for Physics standard

By Ray Larsen, Kay Rehlich, and Andrew Young

PICMG Consortium 24 PCI Industrial Computer Manufacturers’ Group (PICMG)

Consortium Info

Resource Guide

26 AdvancedTCA COM Express CompactPCI CompactPCI Serial Enclosures MicroTCA

4 | Spring 2017 PICMG Systems & Technology Resource Guide www.picmg-systems.com

PICMG standards adoption growing in Asia, Europe with

COM Express leading the way By John McHale, Editorial Director

Technology Focus 6

CompactPCI Serial reaches out into space By Manfred Schmitz, MEN Mikro Elektronik

Recent developments based on PICMG xTCA for Physics standard

By Ray Larsen, Kay Rehlich, and Andrew Young

Application Feature

Application Feature

20

22

Standards-based technology platforms for open innovation


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Standards Update

By Jessica Isquith, President of PICMG [email protected]

2017 marks significant changes for PICMG

Last year ended with the loss of Joe Pavlat, who successfully led this organization for over 20 years. He worked with mem-bers to establish PICMG as a global leader in open standards for embedded computing. We are grateful for his service and will continue to build and improve the organization he helped found.

The new year marks significant changes for PICMG. As our new president, I am excited to work with our new VP of marketing, Justin Moll, as well as returning officers Doug Sandy and Michael Munroe, as well as all our 150 member companies and organizations.

For 2017, our key initiatives include modernizing and updating how we distribute our specifications, creating user groups for standards and families, starting a university outreach program, and encouraging collaboration with complementary standards organizations.

PICMG is an international standards organization with members from 15-plus countries, and we continue to experience greater adoption of standards across Europe, the Americas, and Asia. As such, we want to work with all members to facilitate partici-pation in committees and better meet regional technical and promotions expectations.

Active standards work will lead to substantial enhancements of COM Express (0.3 release in Spring), MicroTCA (40G), Space CompactPCI Serial and AdvancedTCA (software design guides). PICMG-based product shipments are positioned for a strong year due to the continued growth of COM Express and adop-tion of CompactPCI Serial in conjunction with steady adoption of other standards.

We have always been a leading open standards organization, addressing the needs for many markets, including industrial, commercial, medical, military and aerospace, and research. This issue of PICMG Systems and Technology contains five member-contributed articles, which combine to show the depth and breadth of our impact across a diverse set of markets and applications.

Ray Larsen, Andrew Young, and Kay Rehlich, leaders within the physics community, provide an overview of the xTCA specifica-tions, as well as examples of current and future implementa-tions. Already, PICMG has ratified three major hardware speci-fications and two software guidelines for xTCA for Physics, with three additional software guidelines are expected to be com-plete in 2017. Due to the strength of the xTCA specifications and robust collaboration among researchers, AdvancedTCA

and MicroTCA standards have been selected and adopted by the physics community worldwide.

CompactPCI Serial for Space was created to meet the growing requirements of the commercial space industry. Space CompactPCI Serial extends CompactPCI serial in two key ways: First is the definition of a dual star architecture for increased availability, while the second is an open management bus allowing the integration of different communication protocols common to space applications. The MEN Micro article pro-vides an excellent introduction to this important standard and the industry’s involvement.

Jim Renehan of Trenton Systems provides an overview of SHB Express, one of the first PICMG standards, which continues to be a vital part of the embedded computing landscape. He discusses three different use cases: International Space Station – Microgravity Sciences Glovebox (MSG), a fruit-packing applica-tion, and a multisegment system for battlefield intelligence.

Hardware Platform Management (HPM) has been a critical com-ponent of AdvancedTCA since the adoption of AdvancedTCA 2002. Mark Overgaard of Pentair, who has led the HPM efforts, presents the evolution of HPM beyond AdvancedTCA to MicroTCA and VPX while illustrating several potential new applications. Advanced performance, robustness, high avail-ability and management benefits of ATCA and its HPM frame-work make a fine fit for certain defense communications, semiconductor wafer-fabrication machines, cable TV back-end systems, and security subsystems, in addition to high-energy physics applications.

The fifth article, which puts the role and culture of PICMG in perspective, is by Doug Sandy, who has been an active member of PICMG since its founding and CTO since 2009. He explores how PICMG is positioned to continue providing open specifi-cations to the industry in the areas that will benefit most: the Internet of things, industrial automation, aerospace, medical, transportation, physics, and communications

Over a third of PICMG’s members will be exhibiting at Embedded World in March, and the officers will there to sup-port and meet with any members who would like to discuss any aspect of PICMG.

If you are interested in any of the initiatives and activities mentioned, please contact me at [email protected] or all of the officers at [email protected]. Participation and member-driven innovation is the key to our future success.






including medical, energy, gaming, and retail automation.

“Beyond industrial, the market opportun- ities (available sockets and carriers) for COMs in powering more mobile and/or distributed IoT/sensing device classes has grown considerably during this time,” he continues.

In the PICMG world “COM Express is still netting healthy market growth in industrial applications year-over-year, [growing] in terms of use and evolution of the form factor,” Mandell says. “COM Express Mini features a similar size and tech features to [competing industry stan-dards] Qseven and SMARC (small), and the lineage of other COM Express technology types has accelerated adoption of the Type 10 form factor. In industrial, I expect COM Express and variants will continue to lead the market for industrial modules through the next several years and likely beyond.

PICMG, founded more than 20 years ago, has seen its standards adopted in five continents and markets such as transportation, industrial, transportation, military, aerospace, medical, physics/research, energy, communications, and more.

Today PICMG’s COM Express standard is the hottest in terms of global adoption, while the organization and industry evolves CompactPCI into CompactPCI Serial for high-performance embedded computing applications. The non-profit’s xTCA specifi-cations also continue to perform well in communications applications and are growing in use among military applications.

COM ExpressCOM Express continues to be the shining star, with a lot of growth potential in Europe and Asia, says Justin Moll, VP of marketing for PICMG and VP of U.S. Development for Pixus Technologies.

Moreover, analysts at VDC Research in Natick say that computer-on-module (COM) solutions are really catching on in industrial applications as an alternative to larger form factors such as xTCA.

“COMs in general are seeing growing demand within industrial applications at the expense of alternative standard board form factors like xTCA and CompactPCI, driven primarily by cost and growing demand for hardware scalability using a common platform,” says Dan Mandell, Senior Analyst in the IoT and Embedded Technology Practice at VDC Research. “Though industrial automation is the leading application for COMs, we have seen greater growth through the last three years in other verticals

Leaders of PICMG say that their standards continue to grow in adoption across the globe, with COM Express making huge inroads in Asia and Internet of Things (IoT) markets while CompactPCI Serial grows in acceptance in Europe.

PICMG standards adoption growing in Asia, Europe with COM Express leading the wayBy John McHale, Group Editorial Director

Technology Focus



to lacking supplier support and competitive board architectures gaining a lot of trac-tion in aerospace/rail such as VPX (and VME, which is not growing but continues to push steady volumes year-over-year),” says Mandell.

“The biggest supporters for CompactPCI Serial include MEN Mikro, EKF Elektronik, and FASTWEL,” he adds. “MEN Mikro established a new working group within PICMG in November 2015 for extending CompactPCI Serial into space applications [Space CompactPCI Serial] – alongside industry leaders such as Airbus, Thales Alenia Space, and STI Spacetech.”

VDC analysts see space as bright spot for the new standard. “Given the successes of CompactPCI technology in prior space system projects such as the “Curiosity” rover and some satellite control systems on the ISS [International Space Station], we expect CompactPCI Serial will see moderate adoption in future space applications. The base spec already has the mechanical and conduction cooling technologies needed for space deployments in place. Like any market with safety- or mission- critical design elements, space end users are reluctant to dramatic technological change.

“Space CompactPCI Serial is the new alternative to VPX in space applications and is at the moment on its way to the PICMG ballot,” Plannerer says. “The two main changes in the extension of the CompactPCI Serial specification are the definition of a dual star architecture for increased availability, and allowing the integration of different com-munication protocols common in space applications for both – the dual-star and the full-mesh network (which was formerly restricted to Ethernet only).”

“Others have dabbled with the technology, like Kontron and Pixus, but never really picked it up,” Mandell notes. “Kontron launched a few products in 2013 as part of its “High-Speed CompactPCI Initiative” but not much has happened in the years since for them.”

xTCAxTCA standards – MicroTCA and Advanced TCA – are performing steadily in terms of adoption in various markets, such as the U.S. military, in applications such as the U.S. Navy’s P-8A Poseidon aircraft.

The U.S. military has increased ATCA adoption due to the purchase of the IBM blade center by a Chinese company, says Jessica Isquith, President of PICMG. U.S. suppliers cannot deploy Chinese hardware, and as the blade center and ATCA share a physical form factor, the PICMG standard has gained attention as a potential replacement from U.S. manufacturers, she adds.

ATCA is also performing strongly in physics applications, Moll says, as this industry sees the success of ATCA’s implementation with SLAC. MicroTCA also continues to find adoption thanks to its size, weight, and power (SWaP) advantages combined with its performance, he adds.

Looking forward The PICMG membership is discussing developing specifications to cover fiber, secu-rity, smaller form factors, ruggedization, and more, Isquith says. Additionally, the Rugged Com Express standard is expected to be ratified by VITA later this year, after Com Express .3 is ratified next month, she adds.

“It should be noted that PICMG is more membership-driven than other standards organizations,” she continues. “If three executive PICMG members develop a state-ment of work involving industries and/or organizations, it becomes the basis of a new specification. We don’t have leadership-driven mandates – three members at minimum can create a statement and that leads to the standard.”

“The champions for COM Express in industrial markets would be Kontron, Advantech, and congatec,” he adds.

Com Express and IoTVDC Research analysts also say the adoption rate of COM Express in indus-trial IoT gateways or other connected industrial applications is trending up- ward. Why is it (or standardized boards in general) succeeding or failing to find market share there?

“Hardware modularity using modules is a key differentiator for some IoT gateway suppliers. However, the modularity sought for IoT gateways is, in most cases, for scalability in connectivity for supporting different cellular modems/networks (across geographies). These modules often feature proprietary or smaller ‘modem-like’ FFs like mPCIe,” Mandell says.

Compact PCI Serial“I believe there is real potential for CompactPCI Serial in U.S. military and aerospace systems where VPX cur-rently drives the market from a price/ performance standpoint,” Moll says.

“CompactPCI Serial is the choice for completely new systems with high demand on fast data transfer and com-puting power, while customers still maintain their CompactPCI systems as long as possible, if there is no need for faster connections, says Michael Plannerer, Director of Global Research & Development for MEN Mikro Elektronik. “Luckily there is no need for a hard decision, as they can maintain their CompactPCI systems and just integrate fast CompactPCI Serial peripherals by using CompactPCI PlusIO CPU boards (which are 100 percent backwards- compatible with parallel CompactPCI). The markets and applications are totally the same. [At] MEN we just make them more robust, so they can be also used in harsh environments as well.”

Some see the growth of CompactPCI Serial moving a bit more slowly. “We have not seen any real market growth for CompactPCI Serial since its debut in 2011 beyond its starting markets, primarily due



What is ATCA’s Hardware Platform Management (HPM) layer? Here’s a look at the ATCA HPM architecture, which includes the following key elements and roles:

› a Shelf Manager (optionally redundant) in each shelf or chassis [Author’s note: In ATCA and telecom generally, the term “shelf” is used where other industries would use the word “chassis.” This article uses those terms interchangeably.] that monitors and supervises the operations of that shelf and represents it to upper layers of management.

› a logical System Manager, a conceptual function in the ATCA framework which manages the functions of one or more (perhaps dozens, hundreds, or more) shelves in an organization.

› local management controllers (MCs) integrated into each HPM-enabled field-replaceable unit (FRU) in a shelf, each representing a FRU to the next higher layer. For instance, IPMCs, which are just one type of MC, represent ATCA boards or other top-level FRUs in a shelf to the Shelf Manager, while MMCs (module MCs) represent AMC modules to the IPMC of the carrier ATCA board on which they are installed.

› a dual-redundant Intelligent Platform Management Bus (IPMB-0, I2C-based) that connects the Shelf Manager to the IPMCs of the FRUs in the shelf.

› a dual-redundant Ethernet communication fabric that supports basic communication among the boards and the outside world, often used for control and management, including System Manager communication with the Shelf Manager.

The ATCA [advanced telecommunications computing architecture] standard was adopted at the end of 2002; since that time, billions of dollars of ATCA-based products have shipped worldwide. The bulk of those products have gone into demanding high-end telecom applications worldwide, but there are numerous other applications that can benefit from the proven architectural strengths of ATCA.

ATCA and its hardware platform management at 15 years: How can I use them now?By Mark Overgaard

Figure 1 shows that the System Manager can include applications based on the Hardware Platform Interface (HPI), a complementary management API specifica-tion that was developed by the Service Availability Forum consortium. HPI is often used in ATCA systems as the interface between System Manager applications and the ATCA shelves they supervise. A Shelf Manager can include a built-in HPI server interface to support such configurations.

Key specifications that govern ATCA and related frameworks are also listed in Figure 1. The PICMG 3.x group defines the overall framework, including its HPM aspects, and the AMC.x group covers the hot-swappable AMC module framework, including its HPM layer. In MicroTCA, AMC modules are plugged directly into a shelf or chassis; the MTCA.x specifi-cations cover that framework, the HPM aspects of which are based on ATCA.

Application Feature



The HPM.x group of specifications defines specific HPM facilities, including firmware upgrades and LAN-attached IPMCs. The latter facility allows IPMCs to link to the standard ATCA Ethernet base interface to complement IPMB-0 with a much higher performance communication link for management purposes (typically on a shared basis with other uses).

One non-PICMG framework that has heavily leveraged ATCA HPM is ANSI/VITA 46.11, the system-management architecture for the VPX-pluggable module framework used widely in critical embedded systems. While adopting the overall architecture and many detailed aspects of ATCA HPM, VITA 46.11 adapts the architecture in key ways to the specific needs of the VPX community. For instance, neither VPX nor VITA 46.11 supports hot-swapping modules in a live system. VITA 46.11 is being actively adopted in the growing VPX ecosystem.

For more background on ATCA HPM and related topics see the sidebar for a list of recent articles in this magazine and its sister publication, VITA Technologies.

How can you use ATCA HPM now? Option 1: Adopt ATCA as-is on your new project. The advanced performance, robust-ness, high availability, and management benefits of ATCA and its HPM framework are a fine fit for many current applications, such as defense communications. For instance, an ATCA-based platform has been adopted as the basis for ship-based and comple-mentary land-based IT infrastructure for the U.S. Navy and is in production rollout and already operational on dozens of the eventual hundreds of naval vessels. Billions of dollars in contracts have already been issued for this program.

IPMB-L IPMB-L

ShelfManager(Active)

ATCA/AMC Specification Elements

ShMC

OptionalIntegralHPI

ShelfManager(Backup)

ShMC

OptionalIntegralHPI

OptionalHPI Client(s)

Power EntryModule[1...N]

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Fan Tray[1...N]

IPMC

IPMC

Shelf Manager

Shelf Management Controller (ShMC)

IPM Controllers—Several Variants

AMC Module

Other Field Replaceable Unit (FRU)

AdvancedTCA Board and Optional Rear Transition Module (RTM)

HPI Client(s) and IntegralHPI Server

Key ATCA-related Specifications

PICMG 3.0 ATCA basePICMG 3.1 Ethernet fabricPICMG 3.7 ATCA base extensionsPICMG 3.8 RTM extensions for physicsIRTM.0 Intelligent RTM

AMC.0 AMC baseAMC.1/2 PCI Express, Ethernet fabrics

MTCA.01 MicroTCA baseMTCA.1/2/31 Rugged MicroTCA variantsMTCA.4/4.11 MTCA extensions for physics

HPM.1 Firmware upgradeHPM.2 LAN-attached IPMCsHPM.3 DHCP-assigned parameters

HPI2 Hardware Platform InterfaceHPI-to-xTCA2 Mapping to ATCA, MicroTCA

1 IPv6 support not yet addressed2 Service Availability Forum (SAF) speci�cation

ATCA Board ATCA Board

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CarrierIPMC

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IPv6 OK

Figure 1 | ATCA HPM architecture and key governing specifications.›www.picmg-systems.com PICMG Systems & Technology Resource Guide Spring 2017 | 9

THE PICMG 3.X GROUP DEFINES THE OVERALL FRAMEWORK,

INCLUDING ITS HPM ASPECTS, AND THE AMC.X GROUP

COVERS THE HOT-SWAPPABLE AMC MODULE FRAMEWORK,

INCLUDING ITS HPM LAYER. IN MICROTCA, AMC MODULES ARE

PLUGGED DIRECTLY INTO A SHELF OR CHASSIS; THE MTCA.X

SPECIFICATIONS COVER THAT FRAMEWORK, THE HPM ASPECTS

OF WHICH ARE BASED ON ATCA.


http://www.ekf.com


http://www.ekf.com

Control of advanced semiconductor wafer- fabrication machines, cable TV back-end systems, and security subsystems for corporate communications networks are additional areas where ATCA’s capa-bilities fit key market needs.

Another recently active domain for ATCA is in high-energy physics applications. In this domain, which includes massive (measured in kilometers) instruments for high-energy physics experiments, the built-in high availability features of ATCA (and MicroTCA as well) are critical to mission success. PICMG 3.8 stan-dardizes key ATCA extensions for this domain, while MTCA.4 and MTCA.4.1 do the same for MicroTCA.

There is a broad ecosystem of ATCA chassis, boards (also known as blades), and other components for new projects to choose from.

Option 2: Adapt and extend ATCA to meet your special needs. One example of this option is the Juniper (previously BTI Systems) 7800 Series cloud-scale open net-working platform (covered in PICMG Winter 2013-2014 issue.) In this architecture, as well, backward compatibility with ATCA boards is maintained, but special slots add critical functionality to support the very high bandwidth communication features of this platform.

Figure 2 shows a reference design for an IPMC based on an advanced ASPEED Technologies server-management processor. It can be used on compliant ATCA FRUs, but also in extended architectures like either of the two described above. It is available with schematics, firmware source code, and documentation for use in any of the ATCA adoption/adaptation options described in this article. (See also PICMG April 2016 issue for more information.)

Option 3: Leverage ATCA’s mature HPM facilities, but define other platform aspects on a custom basis. It is possible to fully adopt the management architecture as shown in Figure 1 (and defined in the ATCA specifications), but apply it to a physical platform archi-tecture that is not ATCA. For instance, the custom architecture may allow more boards in a single chassis than ATCA does or it may support alternate communication fabric topologies. Another option: the boards may be physically larger or smaller than ATCA boards. Leveraging the mature ATCA management architecture while adopting many otherwise-proprietary system aspects may be highly cost- effective for some companies. Adaptable Schroff Pigeon Point management components are available for all elements of the ATCA HPM architecture for companies choosing this option.

Mark Overgaard is Architect, System Management, for Pentair Electronics Protection. Mark was the founder and formerly the CTO of Pigeon Point Systems, which was acquired by Pentair in July 2015 and integrated into Pentair’s Electronics Protection platform under the Schroff brand. For more information readers may contact the company at [email protected].

Pentair Electronics Protection http://schroff.pentair.com/en/schroff-na/hardware-platform-management

Recent HPM-related articles

› April 2016 PICMG Systems & Technology, “Adding advanced server-management features to ATCA IPMCs”

› November 2015 PICMG Systems & Technology, “Adding IoT friendliness to AdvancedTCA and related specifications”

› September 2015 VITA Technologies, “Maturing VITA 46.11 to address VPX-specific needs”

› September 2014 VITA Technologies, “Validating the interoperability of VITA 46.11-based system management elements”

› February 2014 VITA Technologies, “System management on VPX: leveraging VITA 46.11 for VPX plug-in modules”

› Winter 2013-2014 PICMG Technologies, “Upcoming ATCA Base Extensions benefits current and future systems – including for cloud”

› Summer 2012 PICMG Technologies, “COTS management building blocks for AdvancedTCA: Proven over the first decade”

› Summer 2012 PICMG Technologies, “How one TEM leverages ATCA hardware platform management”

SystemInterfaces

(mutuallyexclusive)

UART-2

Ethernet MAC 2DDR MemoryController

SPI MemoryController

Ethernet MAC 1

SystemUART

LPC/eSPI

NC-SI

SOLUART

PCIe

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USB

PECI

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NetworkController

UART-3

LPC Controller(KCS/BT)

Video Controller(AST2500-only)

USB 1.1 HID Controller

ADC ControllerI2C-5...7

AMC Site 1,2

USB 2.0 VirtualHub Controller

System SPIFlash Controller

eSPI Controller

I2C-3

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VoltageSupervisor &

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Master-Only I2CSD Card

connectorSDI,

Linux console BDM

JTAGSDIO-2

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-48 V voltageand current AMC site

monitoring

Control andmonitoring

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Figure 2 | Schroff Pigeon Point reference design for an ATCA IPMC.›

Application Feature


http://schroff.pentair.com/en/schroff-na/hardware-platform-management



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What is SHB Express?SHB Express or PICMG 1.3 is an industry standard for edge card processor boards; i.e., single-board computers or system host boards and system backplanes. The edge card processor board and backplane combination supports faster system MTTR [mean time to recovery] times, enhanced hardware platform stability, and expanded support for industry-standard plug-in cards. The last point is probably the most important because the system backplane in a PICMG 1.3-driven rackmount computer uses standard option card interface connectors that enable the most diverse usage of industry-standard, commercial off-the-shelf (COTS) plug-in cards.

The PICMG 1.3 standard defines the routing of 20 PCIe base links from the system host board’s edge connectors to a PICMG 1.3 backplane. With a mezzanine card design approach it is possible to expand the number of SHB-to-backplane PCIe links to 37 links depending on the number of SHB processors, chipset type, mezzanine card design and backplane type. Let’s take a look at a couple of system usage cases for SHB Express.

SHB Express usage case 1 – International Space Station – Microgravity Sciences Glovebox (MSG) The International Space Station (ISS) is packed full of engineering systems neces-sary to fulfill the station’s science objectives. One such system is the Microgravity Sciences Glovebox (MSG) Video Upgrade Equipment (VUE) from Teledyne Brown Engineering that utilizes embedded multicore Intel processor technology incor-porated into a PICMG 1.3 single-board computer (SBC) architecture. Key MSG

PICMG got its start back in 1994 with the development of the first edge card computing industry standard: PICMG 1.0. Since then edge card computing has evolved to incorporate the latest PCI Express interface methodology and implementation standards in the SHB Express or PICMG 1.3 industry standard.

SHB Express still going strong – PICMG 1.3 application examplesBy Jim Renehan

VUE building blocks include a multislot PCI Express backplane, four Terabytes of RAID data storage boards, three tera-bytes of hard drive data storage, two types of video capture boards for both Gigabit Ethernet (GigE) Vision 2.0 and High Definition Serial Digital Interface (HD-SDI) video data, a serial communi-cations board offering selectable RS232, RS422, or RS485 ports, and a data acqui-sition board to both monitor the health of the system as well as control video cameras and monitors. The VUE records experiments, documenting the opera-tions for the earthbound science teams to analyze once the data has been trans-mitted to the ground.

The VUE was a significant digital upgrade to the previous MSG NTSC analog video system that eliminated the need for digital tapes to record the science and the inherent problems with transporting the physical media both up

Application Feature


The International Space Station uses embedded multicore Intel processor technology incorporated into a PICMG 1.3 single-board computer (SBC) architecture for video capture. Photo courtesy NASA.


to and down from the ISS. The VUE also did away with tape media issues related to physical storage space and the crew time needed to change out the media during sci-ence operations. Tape media storage space, and the crew time needed to manipulate the data tapes were critically limited on ISS. The VUE system converted the MSG’s video system to digital data, thereby doing away with the physical media. The VUE’s digital data enables transmission to the ground via telemetry networks. This provided faster data accessibility to the ground science teams for starting their analysis within days of any MSG experiment. This compares to the multi-month wait time typical with the previous analog tape system.

A layout drawing of the overall MSG VUE is illustrated in Figure 1 with the control system or MSG Video Drawer located in the lower-left corner of the drawing.

The system control and data storage architecture of the MSG VUE video drawer consists of:

› 1 – PICMG 1.3 single-board computer

› 1 – PICMG 1.3 PCI Express backplane

› 2 – 4TB SSD plug-in data storage boards configured in a RAID [redundant array of independent disks] array

› 3 – 1TB HDDs for data storage backup

› Video capture boards for GbE Vision 2 and HD-SDI video data

› 1 – RS232/RS422/RS485 serial communications board

› 1 – data acquisition board for system monitoring

Figure 2 illustrates the SHB Express SBC and backplane used in the VUE.

SHB Express usage case 2 – fruit sorting In fruit-packing applications, the need to provide an accurate and reliable method of sorting fruit based on optimum color, size, shape, and blemish-free surface clarity parameters is a constant need. When done right it can be a major competitive advantage for growers and packing house operators. There are various automatic vision solutions available that do a great job inspecting for presence and absence of items. Unfortunately, in fruit sorting the vision

Figure 1 | MSG VUE layout.›

Figure 2 | MCG VUE single-board computer and backplane.›www.picmg-systems.com PICMG Systems & Technology Resource Guide Spring 2017 | 13

WITH A MEZZANINE CARD

DESIGN APPROACH IT

IS POSSIBLE TO EXPAND

THE NUMBER OF SHB-TO-

BACKPLANE PCIE LINKS

TO 37 LINKS DEPENDING

ON THE NUMBER OF SHB

PROCESSORS, CHIPSET TYPE,

MEZZANINE CARD DESIGN

AND BACKPLANE TYPE.


system needs to be able to make visual inspections based on analog or “degree of goodness” data. So what’s the answer to this dilemma?

For a major fruit grower co-op in California, the answer has been an SHB Express system host board like the one in Figure 2 communicating to a series of DSP cards plugged into the backplane and connected to cameras. The system shown in Figure 3 has an SHB running custom inspection software developed by the co-op and is able to perform all inspections at a rate of 40 ms per piece of fruit.

The next-generation fruit-inspection system will use new inspection software, a later version PICMG 1.3 system host board featuring the latest Intel Xeon pro-cessor, a PCI Express Gen3 backplane, and a series of high-speed Ethernet cameras. Preliminary speed tests show a 90 percent reduction in inspection time compared to the previous system. This faster inspection time equates to being

able process eight or nine pieces of fruit per second, with up to eight lanes of fruit running at a time. Upcoming mechanical changes to the sorting system will deliver a further speed improvement of 12-14 fruit per second all without bruising or damaging the fruit during inspection.

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Figure 3 | Fruit-inspection system.›

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SHB Express usage case 3 – Multisegment system for battlefield intelligence In airborne surveillance applications, reductions in the computer systems’ size, weight, and power (SWaP) – without sacrificing the data gathering and processing abilities of the aircraft’s intel-ligence personnel – are critical elements in determining mission success.

The SHB Express system illustrated in Figure 4 shows how up to four PICMG 1.3 system host boards can be supported by a PICMG 1.3, 4-segment backplane. The underlying technologies at work in the airborne computing systems deployed on this aircraft are dual- processor SBCs

and passive backplanes utilizing multicore Intel processors and Intel Virtualization Technology, Intel AVX Extensions, and Intel HyperThreading. These technologies, com-bined with classified O/S and application software, make it possible to run hundreds of applications simultaneously within each SHB Express system onboard the aircraft. The bottom line is that the SHB Express systems onboard provide the troops with the latest and most up-to-date battlefield information possible.

Next-generation edge card computing system host boards and backplanesAs embedded processor technology continues to evolve, and as the speed of technology innovation continues to accelerate, so must the publication speed of industry standards. A new edge card computing standard called HDEC (high den-sity embedded computing) has been developed and introduced by Trenton that replaces the single-density card-edge fingers and PCI Express sockets on the PICMG 1.3 processor boards and backplanes with double-density PCI Express connection points. This configuration enables HDEC processor boards to support up to 88 lanes of PCIe 3.0 from the board’s card fingers directly to the system back-plane. The HDEC architecture supports the latest long-life Intel server processors in a dual-processor/SBC form factor while delivering faster system throughput with lower data latencies.

Jim Renehan is director of marketing and business development for Trenton Technology. Jim has held various marketing and application engineering positions in the embedded computing, industrial automation, and automatic identification industries. Jim holds a BS in Industrial Technology from Iowa State University of Science and Technology in Ames, Iowa.

Trenton Technology • www.trentonsystems.com

Figure 4 | Multisegment PICMG 1.3 system.›


http://www.trentonsystems.com


http://www.picmg.org

I still remember my first PICMG meeting. I was only a couple years out of graduate school when my then-supervisor invited me to participate in a manufacturers’ group that would be defining a new type of industrial computer form factor. My company at the time, Pro-log, had been the inventor of the venerable STD bus; at the time, we were looking for a replacement technology that offered both interoperability with other vendors and dramatically higher performance. Although I didn’t know quite what to expect, I told my boss to count me in.

In my mind’s eye, I envisioned a room full of stodgy old engineers debating eso-teric design nuances ad nauseam. What I found, however, left me happily surprised. Representatives from about ten companies faced off around rectangular tables in order to solve the real problems associated with developing a new industrial computer speci-fication. This was a no-nonsense group, and they knew how to get the job done. By leveraging the collective expertise of each of the member companies, we were able to create the most successful industrial computing specification of the time – CompactPCI.

It was this no-nonsense approach, design expertise, and straightforward governance that led to PICMG’s success in the industry. CompactPCI grew to incorporate a suite of new features not envisioned by the original authors. Later, PICMG tackled the unique requirements of telecommunications platforms with the introduction of AdvancedTCA, AdvancedMC, and MicroTCA. Others joined the community with a commercial off-the-shelf (COTS) military focus and introduced ruggedized platforms to the PICMG portfolio. Most recently, platforms have been introduced to address transportation,

In the current environment of “open source everything,” is there still a role for PICMG and open specifications? Doug Sandy, vice president of technology and CTO for PICMG, explores the past and future of PICMG within the emerging industry landscape.

PICMG: A CTO’s perspectiveBy Doug Sandy

computer-on-module (COM), and high-energy physics needs.

As you can imagine, a lot has changed since PICMG first opened its doors in 1994. Technologically speaking, the industry has moved from chips running at tens of megahertz to processors that clock in at over one gigahertz. Com- munications speeds are now in the hun-dreds of gigabits per second, and server storage is typically in the terabytes. With all this advancement, perhaps the big-gest change has been the rise of open source initiatives. Open hardware and software projects such as Open Compute and Linux have changed the playing field for consumer and vendor alike. This age of “open” everything prompts the question: “Are specifications relevant anymore?” Perhaps this query is best answered by understanding what open source is and what it is not.

Application Feature



What open source isA variety of computing-related hardware open source projects have sprung up in the past few years. In these organiza-tions, community members collaborate to create product definitions within the scope of the project in order to serve the community and industry at large. The Open Source Hardware Association defines open source as “hardware whose design is made publicly available so that anyone can study, modify, distribute, make, and sell the design or hardware based on that design.” Requirements vary by organization, however, typical design elements of a submission include Gerber files, mechanical drawings, sche-matics, bills of materials, firmware and factory test code. These requirements are shown in Figure 1.

The open source hardware model works well when developers either don’t expect to reclaim their engineering expenses (e.g., hobbyists) or expect to reclaim their engineering investment in ways other than product differentiation. For these developers, open source is a vehicle to sell other values such as integrated circuits, product maintenance, installa-tion, or manufacturing services. Making an open source submission is a method to accelerate their revenue from these sources. Alternately, large users of the technology may choose to provide their own designs to the open source commu-nity. This tactic may be used to leverage some of the design capabilities within the community and quickly commoditize the product. Of course, this method can’t be employed for products that provide real competitive advantage. Both of these strategies are a significant departure from the specifications-based approach.

Product Definition(Open Source Submission)

SchematicMechanical Drawings

GerberFiles

Bill of Materials

Firmware and Test Source Code

Figure 1 | Typical elements of an open source hardware project.›


THIS AGE OF “OPEN”

EVERYTHING PROMPTS

THE QUESTION:

“ARE SPECIFICATIONS

RELEVANT ANYMORE?”


http://www.elma.com

The primary beneficiary of open source hardware development to date has been the hyperscale cloud computing market, where a small number of very large users seek to deploy vast quantities of very specific commodity products.

What open source is notOpen specifications, unlike open source, focus more on common interfaces than on defining finished product. Individual vendors may develop whatever they wish and remain compliant to the speci-fication so long as the interfaces comply (Figure 2). Product interoperability between multiple vendors is a key goal of this approach. As such, open specifica-tions favor multiple vendors that offer differentiation based on product fea-tures. Industries that require a broad ecosystem of varied components will benefit most from open specifications. Industrial automation is one such industry, as it requires many different types of I/O and processor types to serve its needs.

Military, aerospace, transportation, and the Internet of things (IoT) also pose chal-lenges for the open-source hardware model, though for different reasons. In these markets, security and safety are key criteria. Having secure designs openly available for review and modification plays into the hands of the very elements they must be secured from. Malicious entities can use the published information to identify vulner-abilities and plan attacks. Would-be attackers can even work within the open source community in order to introduce vulnerabilities directly within the project deliver-ables. Open specifications avoid these issues because the security and safety critical elements remain isolated and under the control of each individual vendor.

ew17_177_799x123_825_Embedded_Computing_Design_2ew17P.indd 1 04.10.16 15:26

Open Specification(requirements

document)

High-levelBehaviors

Form Factor & Mechanical Interfaces

Connector &Electrical Interfaces

Thermal& CoolingInterfaces

Protocols & APIs

Figure 2 | Typical elements of an open specification.›

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http://www.embedded-world.de

What does the future hold?Open source initiatives and open specifications organizations both serve the industry by promoting product ecosystems. Open source favors commoditization of specific prod-ucts and ecosystems of integrators and contract manufacturers. Open specifications, on the other hand, promote broad ecosystems of highly differentiated and interoperable products delivered by equipment vendors. This difference is summarized in Table 1. Both models serve a purpose and neither model is likely to disappear any time soon.

Recognizing its role in the industry, PICMG is well positioned to continue providing open specifications to the industry in the areas that will benefit most, namely: IoT, industrial automation, aerospace, medical, transportation, physics and communica-tions. Current activities are focused on physics, aerospace extensions to CompactPCI Serial platform, higher speed versions of MicroTCA, and improvements to the pop-ular COM Express specification. PICMG has always been vendor-led and is always open to new projects.

Although the rectangular conference tables are gone (we now face off in conference calls), the no-nonsense, “get it done” attitude of PICMG is alive and well. With thousands

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of collective years of industry experience, domain-specific skills, non-onerous poli-cies and procedures, and a focus on cus-tomer success through interoperability, PICMG is a strong choice for your next open specification project. I look forward to working with you soon.

Doug Sandy has been the vice president of technology for PICMG since 2009. In addition to facilitating the

technical work of the organization, Doug leads strategic-technology programs and identifies emerging trends in hyperscale cloud computing for the Embedded Power business of Artesyn Embedded Technologies. Sandy is a widely published author, accomplished conference speaker, and leader in the area of standardization processes. Doug can be reached at [email protected].

www.picmg.org • www.artesyn.com

Table 1 | Open source versus open specifications.›

Open source project Open specifications

Primary output Product definitions Interface definitions

Primary focus Specific product instances Multivendor interoperability

Ecosystem beneficiaries Integrators, contract manufacturers Equipment vendors



http://www.picmg.org

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The commercialization of aerospace, like this OneWeb project, increases the pres-sure on established companies to develop competitive products for this market. One possible option is to count on existing international standards in order to save time and cost during both de vel opment and during the project life cycle.

Taking such a standard and adapting it to the requirements for space was also the solution a group of global players in space like Airbus, Thales Alenia, and others went for: They decided to go with a rather new and powerful but already industry-proven standard: CompactPCI Serial. Using a proven standard like this also helps diminish the obsolescence problem of avionics hardware while sig-nificantly reducing complexity and costs for hardware and software.

In this vein, the new technical PICMG sub-committee “Space CompactPCI Serial” is now extending the current CompactPCI Serial specification by a substandard

Recently, the U.S.-based Internet service provider OneWeb ordered 900 satellites to provide additional global broadband. Knowing that this volume is more than half of the total 1,400 satellites already in orbit, and knowing that the cost for sending one into space is about $100 million, the industry needs to start thinking about new technologies that could help manage the mass of satellites that must be produced every year.

CompactPCI Serial reaches out into spaceBy Manfred Schmitz

covering the specific requirements for space applications. Players in this working group include – in addition to Airbus and the initiating companies STI Spacetech, SYSGO and TTTech – Amphenol FCI, EKF, Elma Electronic, ERNI, Fastwel, Harting, HEITEC, Intel, Keysight, Pentair, and Positronic, with MEN Micro acting in a consultative role, having already been strongly involved in the development of the CompactPCI PlusIO and CompactPCI Serial standard.

Availability and open interfaces for space applicationsVPX was – with the exception of completely customized solutions – for a long time the only standard for embedded systems in space, but CompactPCI also has a long history in space applications. Famous examples of CompactPCI use include the Curiosity Mars rover in satellite control and its implementation for scientific tasks in the International Space Station. Even the CompactPCI Serial base specification has the mechanical and conduction cooling technologies needed for space already defined and in place.

In addition, compared to VPX, the flexible CompactPCI Serial standard offers an easier-to-use and cost-optimized development.

A typical application for Space CompactPCI Serial could be, for example, the imple-mentation of the platform and the payload controller onboard a satellite.

Space CompactPCI Serial is the most logical choice for a highly sophisticated market, while both reusing and evolving proven industrial technologies and finding significant cost reductions. At the same time, some unused features have been removed from CompactPCI Serial to make the standard more streamlined, while other properties have been added to optimize the standard for use cases.

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The two main changes in the extension of the CompactPCI Serial specification are the definition of a dual star architecture for increased availability, and the addition of an open management bus that allows the integration of different communication protocols common in space applications.

The CompactPCI Serial basic specification defines a single star architecture while Space CompactPCI Serial now symmetrically doubles the usage of these inter-connects, so if one CPU fails, the functionality of the complete system will not be affected. Having this increase in availability was essential for use in space, especially since it’s a little difficult to simply exchange a CPU card while a satellite is in orbit.

In addition to the system slot (A) on the left side of the system, a second system slot (B) on the right side of the system uses the same routing method. All seven peripheral slots are connected to both system slots, and both system slots are con-nected to each other. Altogether, these links build a fully meshed interconnectivity network. The full-mesh network is not restricted to any particular protocol and may be used for physical interconnection standards like Ethernet, SpaceWire, TTEthernet, and EtherSpace. (Figure 1.)

Parallel to the full-mesh network, both system slots can be connected to any of the peripheral boards by means of eight specific differential links. These links could be also used for any protocol, depending on the application and the individual boards. This dual star architecture is intended to be used in high-availability solutions.

The result is a parallel and flexible usage of the full mesh Ethernet network via the backplane, as well as the dual-star architecture via PCI Express or any other protocol.

The specification defines a utility connector, which can be controlled and configured via an open management bus. It takes over the hot-plug functionality, as it was used for CompactPCI Serial, and allows single cards within a system to be switched on and off. Hot-plug functionality is indeed not necessary for satellites in orbit, but can actually be extremely useful during integration while on ground and for test systems, which can be still realized via PCI Express and with common CompactPCI Serial cards.

As Space CompactPCI Serial is intended to be used in a conduction-cooled envi-ronment, the mechanical design is fully compatible with CompactPCI Serial, but the board-to-board pitch is 5HP [horizontal pitch = 25.4 mm] instead of 4HP [20.3 mm] to allow a conduction-cooling frame for each board. At the moment, members of the working group are already working on specific standard backplanes for Space CompactPCI Serial.

The high-speed backplane interconnects and the connectors are intended to sup-port data rates of 12.5 Gbit/s per differ-ential pair. The accelerated bandwidth of the full mesh is 400 Gbit/s. Additionally, the dual star interconnect simultaneously supports a 1 Tbit/s through-put rate.

Infrastructure signals allow for comfort-able and flexible system management. In addition to an I²C bus, CAN bus is also supported. The power supply is 12 volts; an optional 5-V standby voltage could be used to support suspend modes or sleep modes. Power rails can be either be a single plane, or every board could be supplied and controlled individu-ally. The power supply and the system management are not part of the Space CompactPCI Serial specification.

The harsh environments in space, and especially the vacuum conditions, demand much from the connectors. The material must not outgas, as some outgassed materials can leave deposits on the satellites’ sensitive lenses. An outgassing test had already confirmed the qualification of the connectors used for Space CompactPCI Serial. Other mechanical or environmental measures, like SEU-resistance, are not defined in the standard specification, as these mea-sures depend on the customer’s require-ments and the boards’ place within the application and end system.

The working group – which finished the specification recently – plans to bring it into the PICMG ballot during the second quarter of 2017.

Space CompactPCI Serial allows the use of established industrial technology in space, which allows the cost-effective use of the latest technology for space applications. The open standard guar-antees the interoperability of different boards from different suppliers, and helps designers reuse solutions from mission to mission.

Manfred Schmitz is the CEO of MEN Mikro Elektronik in Nurnberg, Germany.

www.men.de

Figure 1 | Space CompactPCI Serial defines a second system slot, forming a dual star architecture for PCI-Express.›


http://www.men.de


The largest of the accelerators, now known as the International Linear Collider (ILC), is a 20-mile long machine (costing over $10 billion) that is still under con-sideration by several governments, most prominently the Japanese, who are proposing to host the proposed multi-national machine which has been under development for more than a decade.

Smaller new machines using similar technology are also very active. The main one is the new DESY (Deutsches Electronen Synchroton) lab in Hamburg’s new X-Ray Free Electron Laser (XFEL), about a tenth the length of the ILC. This machine is adapted to photon physics research using pulsed electron beams to produce very short X-ray beam pulses to open up new fields of materials research. This machine is now built and beginning the commis-sioning stage, as discussed below by Kay Rehlich; Kay headed the control system development based on a new variant of MicroTCA called MTCA.4, plus a more recent version called MTCA.4.1,

The xTCA for Physics PICMG standards work began in 2009 after several years of investigation into the suitability of ATCA as a controls platform for several new accelerators then under consideration.

Recent developments based on PICMG xTCA for Physics standardsBy Ray Larsen, Kay Rehlich, and Andrew Young

which includes an auxiliary backplane to manage the very high precision of fadio fre-quency (RF) controls demanded by these machines. Two other machines (described below by Andrew Young of the SLAC National Accelerator Laboratory) benefitting from these new standards are the Pohang Light Source in South Korea, and the European Spallation Neutron source in Lund, Sweden.

MTCA implementation at the DESY XFEL (Kay Rehlich)The European XFEL is a 3.4 km (2.1 mile)-long X-ray free electron laser (XFEL) currently in the commissioning phase. The 1.7 km (1.05 mile)-long accelerator can raise elec-trons to 17.5 GeV energy. It is followed by undulator sections to generate extremely short X-ray flashes with wavelengths in the rage of 0.05 to 4.7 nanometers so that even atomic details become discernible. [Note: An undulator is a long section of alternating polarity magnets that “wiggle” the electron beam, causing it to radiate straight ahead X-ray pulses which are the beam of interest for research; the electrons are then stripped off by a bending magnet into a beam dump.]

This 1.2 billion Euro ($1.28 billion) facility was constructed and financed by 11 European countries with a major contribution from DESY in Hamburg. MTCA is used for all of the important superconducting cavity accelerator sections to establish highly precise phase and amplitude of the beam from cavity-to-cavity for the full length of the machine.

The electron accelerator can produce up to 27,000 electron beam bunches per second. These bunches are distributed to three undulators to deliver beam to three experimental areas operating simultaneously by switching magnets. A MicroTCA-based timing system and machine-protection system provides a flexible, safe, and independent operation of the three beam lines. All fast subsystems to read out and control the RF, the beam, and the interlocks are implemented in MicroTCA.4 standard.

Application Feature


The DESY accelerator in Hamburg (shown: the accelerator with the yellow superconducting acceleration modules and the gray racks containing the MicroTCA electronics) uses more than 200 MicroTCA.4 shelves to control the accelerators and experiments. Photo courtesy XFEL.


In almost 800 superconducting accelerating cavities, the amplitudes and phases are measured and controlled with a stability of 0.02 ps. The MTCA.4 standard provides the required high analog performance and fast communication channels to imple-ment this cutting-edge technology; it also supports the full remote management of this entire distributed installation. More than 200 MicroTCA.4 shelfs are installed and operational to control the accelerators and experiments.

MTCA at the Pohang Accelerator Laboratory (PAL) XFEL (Andrew Young)The Pohang Accelerator Laboratory (PAL) in Pohang, South Korea, has developed a 0.1 nm SASE-based FEL, PAL-XFEL, for a high power XFEL. The $400 million XFEL has successively installed a linac, undulator, and beam line and was completed at the end of 2016. The FEL commissioned the hard and short pulse X-ray coherent photon sources with an MTCA.4 peam position monitor (BPM) and timing distribution system. The BPM system consists of 23 MTCA.4 shelves that provide positioning and intensity of the beam for over 200 BPMs. The system consists of stripline BPMs for the linear accelerator, which has a resolution of 2µm at 180pC (picocoloumbs). A second BPM system was a cavity BPM system used in the undulator section which has a resolution of 250nm at 180pC.

The MTCA.4 standard provides the required high analog performance and fast com-munication to implement this cutting-edge technology. The BPM system supports beam synchronous data management though the EPICs control system which enabled the system to be fully commissioned in a very short time period.

MTCA at the European Spallation Source (Andrew Young)The European Spallation Source (ESS) is a 5MW spallation source under construction in Lund, Sweden, with a 2Gev proton beam that will deliver 2.86ms proton pulses at a rate of 14 Hz to a rotating tungsten target. This machine is a 1.8 billion Euro ($1.92 billion) project with an in-kind contribution of 40 percent. The machine will provide advance-ments in medical, energy, smart materials, and neutron science.

The ESS accelerator will use MTCA.4/4.1 for the BPM and Low Level RF (LLRF) sys-tems. There will be over 150 shelves that will use a new high speed digitizer with a Xilinx Kintex UltraScale device (designed by Struck in Germany). The new rear transi-tion module for both BPMs and LLRF was designed by SLAC/DESY and licensed to Struck to operate over a wideband of frequencies ranging from 352 MHz to 1.3 GHz. The ESS accelerator will begin commissioning in 2018.

Status of xTCA for Physics standards development (Ray Larsen)The xTCA for Physics collaboration of laboratories and industry under PICMG has now processed three major hardware specifications and two software guidelines,

with three further software guidelines still under development, two of which are nearing completion. These are sum-marized in Table 1 above.

The major contribution to the user community is the addition of pow-erful rear-transition module options to MTCA.0. Another is in MTCA.4.1, with the addition of an auxiliary backplane with very high RF bandwidth to accom-modate many new classes of rear transi-tion modules for both analog and digital high-performance systems.

Community developmentsIn addition to the above, DESY has spear-headed a collaboration of the labora-tory, government, and industry to help drive many of the new lab applications into the marketplace. DESY also hosted the 5th Annual MTCA Workshop for laboratories and industry in December 2016, attended by approximately 150 researchers and industry participants along with exhibitors. Due to this col-laboration and steady commitment, it appears that MTCA utilization among research users in Europe, Japan, Korea, and the U.S. is growing.

Ray Larsen is Systems Project Manager, Instrumentation & Controls, at Stanford University’s SLAC National Accelerator Laboratory in Menlo Park, California. Kay Rehlich headed the control system development for DESY in Hamburg, Germany. Andrew Young is an engineer at Stanford University’s SLAC National Accelerator Laboratory in Menlo Park, California.

Table 1 | xTCA for Physics standards development.›

Type PICMG # Title Date

HW 3.8R1.0 AdvancedTCA Rear Transition Module Zone 3A Sept. 5, 2011

HW MTCA.4 R1.0 MicroTCA Enhancements for rear I/O and timing Aug. 22, 2011

HW MTCA.4.1 MTCA.4.1 Enhancements for MTCA.4 Sept. 16, 2016

SWGL MTCA.4 Standard Hardware API Design Guide (SHAPI) Dec. 2016

SWGL MTCA.4 PCI Express Hot Plug Design Guide Dec. 2016

SWGL MTCA.4 Standard Device Model Design Guide (SDM) Q2 2017

SWGL MTCA.4 Standard Process Model Design Guide (SPM) Q2 2017

SWGL MTCA.4 EPICS Interface Use Case for SDM, SPM Q3 2017



PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance telecommunications, military, indus-trial, and general-purpose embedded computing applications.

Founded in 1994, the group has more than 250 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single-board computer design, very-high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high-availability software, and comprehensive system management.

Key standards families developed by PICMG include CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, and HPM (Hardware Platform Management). In its more than two decades of operation, PICMG has published over 50 specifications developed by participants from hundreds of com-panies. Work on standards across a wide range of markets, applications, and tech-nologies continues as the boundaries of datacom, telecom, military and aerospace, industrial, man/machine interface applications, and deeply embedded computing continue to blur.

Equipment built to PICMG standards is used worldwide, with any company allowed to build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules).

A rigorous intellectual property (IP) policy ensures early discovery of any member-owned IP; moreover, all members must agree to “reasonable and non-discrimina-tory” (RAND) licensing of any IP written into a standard. To date, no PICMG standard requires any license or royalty to build or operate.

PICMG adheres to a formal, multistep development process. Development work can be periodically be reviewed by all member companies, although work inside of a tech-nical subcommittee is confidential to the members of that committee until that work

is ready for broader review by other members. Until a specification or stan-dards-related document is ratified by the entire membership, it is confidential to PICMG. After ratification, all documents are available to the general public.

Why use PICMG standards?PICMG standards – because the orga-nization has such a large number of contributing companies – reflect the extremely wide and deep technical capabilities of its members. By using well-understood and proven open stan-dards, vendors can bring products to market quickly. Customers gain from the price and performance competition that results from many vendors operating in an open marketplace.

Thousands of PICMG standards- compliant products – ranging from components and subsystems to complete application-ready systems – are commercially avail-able, representing more than $5 billion per year in global revenue.

To Learn MoreTo learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email [email protected].

PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info


Thousands of PICMG-compliant products, ranging from components and subsystems to complete application-ready systems, are commercially available, representing more than $5 billion yearly in global revenue.

https://www.picmg.org/membership/



JOINING PICMG

Why join PICMG?By joining an organization like PICMG, anyone can play an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They come to know experts in a wide range of engineering disciplines. The groups that develop these open standards do so because they are interested in getting some-thing done in a finite amount of time; whenever possible, bureaucracy and politics are kept to a minimum. Members of these development groups have a common goal: To create standards that are widely used and that each company involved can make money from. Companies can specialize in their areas of expertise without needing to be good at everything. In addition to technical collaboration, business collaborations often evolve in a symbiotic way.

Companies that participate in standards development also have a very important advantage: They are already up to speed when the standard is released and can thus be first to market with compliant and leading-edge products.

In its 20-plus years of operation, PICMG has published almost 50 open industry speci-fications that encompass nine basic standards families developed by participants from hundreds of companies.

To Learn MoreTo learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email [email protected].

THE VALUE OF OPEN STANDARDS

What makes PICMG a leading standards organization?PICMG has more than 250 member com-panies, all of which combine to bring an extremely wide and deep talent base to the table. Unlike some other consortia, PICMG is not controlled by one or a few companies: It is governed by the Executive Members that work together to ratify processes and procedures, elect officers, and approve budgets. PICMG maintains a “one company-one vote” policy, which means that no single com-pany can dominate the standards-devel-opment process.

Over the last several decades, open standards have become increasingly important for a wide range of embedded and specialized computer applications, both big and small. While the definition of “open standard” can vary, for the embedded computer world it usually means a succinct definition of every-thing a vendor needs to know to build equipment and write software that will work with compatible products offered by other vendors.

In an organization like PICMG, all players, whether large or small, can take an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They also can meet experts in a wide range of engineering disciplines.

PICMG also has an outstanding intel-lectual property (IP) policy that ensures that members must submit IP declara-tions throughout the standards-devel-opment process, where they can be accepted for use or rejected. To date, no PICMG standard or specification has required any user licenses or royalties. Moreover, anyone can build equipment in accordance with or use PICMG stan-dards whether they are members or not. PICMG is truly an open organization. Dues are low: In fact, the cost of a yearly Executive membership has not changed in 20 years.

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info


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FEATURES

ĄĄ Choose from the latest generation Intel CPUsĄĄ CANbus for intra-vehicular systems communicationĄĄ Dual band Wi-Fi for maximum tranceive rangesĄĄ Dual miniPCIe site and one XMC/PMC site ĄĄ Configurable to over 64GB SSD storageĄĄ Passive conduction cooled and fanless thermal designĄĄ Uses standard Type 6 ComE modules

ĄĄ Modular construction allows economical reconfigurationĄĄ Adapt to mission evolution with leading edge compute modulesĄĄ I/O recipe changes are efficient and cost effective

Part of our ComSys platform of configurable systems, the ComSys-5001 is a high performance mission compute platform ideal for vehicular applications in demanding defense, industry and homeland security environments. Along with the latest Intel processing power and graphics support, the system is a Cisco certified routing engine complete with the full suite of mobile routing protocols essential for network attached equipment on the move. In addition, the ComSys-5001 pro-vides dual band Wifi connections for maximum performance in wireless networks. CANbus enables intra-vehicular communi-cation between essential electronic assets on board. Packaged in a small, sealed and light weight chassis, the ComSys-5001 is ready to perform. Work with our team to identify the system elements your program needs.

Rugged Vehicular Systems

COM Express

picmg.mil-embedded.com/p374029

Elma Electronicwww.elma.com [email protected] 216-760-9909

For a more complete view of our line of embedded computing products and capabilities visit our website at www.elma.com

Benefits

FEATURES

ĄĄ 100G backplaneĄĄ Supporting maximum 19 100GbE ports in QSFP28

form factorĄĄ 100GbE port is compatible with 40GbE or quad

10GbE (breakout)ĄĄ 3.2Tb/s aggregate switching bandwidthĄĄ Supporting Layer 2 switchingĄĄ Supporting Layer 3 routingĄĄ Supporting OpenFlow 1.3

EmbedWay SF4800 is a 100G ATCA switch board. It provides 10 100GE ports on the front panel and 9 100GE ports via the rear I/O card, with total 3.2Tb/s aggre-gate switching bandwidth. The backplane is compliant with 40/100G Ethernet standard (40GBASE-KR4/ 100GBASE-KR). SF4800 supports L2 switching and L3 routing, as well as OpenFlow 1.3 features.

Targeting for diverse applications such as IMS, RNC, broadband, switching/routing and network security, SF4800 is designed and manufactured with high quality and reliability, as a powerful platform for network core infrastructure.

SF4800 Switch Board

AdvancedTCA


EmbedWay Technologieswww.embedway.com/emen/?s=/product-show-id-31-cid-3-yn-1.html [email protected]

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http://www.elma.com


http://www.elma.com

http://www.embedway.com/emen/?s=/product-show-id-31-cid-3-yn-1.html



http://picmg.mil-embedded.com/p374029


FEATURES

ĄĄ <<Feature 1>>ĄĄ <<Feature 2>>ĄĄ <<Feature 3>>ĄĄ <<Feature 4>>ĄĄ <<Feature 5>>ĄĄ <<Feature 6>>ĄĄ <<Feature 7>>ĄĄ <<Feature 8>>ĄĄ <<Feature 9>>ĄĄ <<Feature 10>>

<<Description>>

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Company name<<website_url>>

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FEATURES

ĄĄ COM Express Type 7 Basic module

ĄĄ Intel® Xeon™ and Intel® Pentium™ processor family (codename Broadwell)

ĄĄ 2x 10 Gigabit Ethernet interfaces,

ĄĄ Headless server performance currently with up to 16 server cores

ĄĄ 48 gigabytes of DDR4 ECC RAM

ĄĄ Industrial-grade temperature variants available

ĄĄ Operating system support for all popular Linux distributions and Microsoft Windows variants, including Microsoft Windows 10 IoT

ĄĄ An extensive range of accessories, such as standardized cooling solutions and the new COM Express Type 7 carrier board for evaluation, simplifies the design-in and will become available parallel to the launch of the new modules.

Introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM.Target applications for the new Server-on-Modules are industrial auto-mation, storage and networking appliances as well as modular server designs and base stations for telecom carriers, service providers‘ server farms as well as cloud, edge and fog servers for IoT and Industry 4.0 applications. The COM Express footprint is tiny and allows more cores per rack. This extremely compact and robust server technology allows 10 GbE connections to be carried into the field, which is essential for hosting IoT applications.The application-ready, modular core of the long-term available con-gatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged – even in case of a switch in the processor architecture. Without module technology, upgrading proprietary SBC designs and ATCA platforms used for carrier infrastructures is significantly more expensive.

The feature set in detailThe new conga-B7XD COM Express Type 7 Server-on-Modules come in a headless design and are available with ten different server processors: From the 16 Core Intel® Xeon® processor D1577 to the Intel® Pentium® processor D1519 for the industrial temperature range (-40 °C to +85 °C). In terms of memory, they offer up to 48 gigabytes of fast 2400DDR4 memory with or without error correction code (ECC) depending on customers’ requirements.An outstanding characteristic of the new congatec Server-on-Modules is the high level of network performance due to 2x 10 Gigabit Ethernet ports. It also supports the NC-SI Network Controller Sideband Interface for connecting a Baseboard Management Controller (BMC) allowing out-of-band remote manageability. Powerful system extensions includ-ing Flash memory can be connected via up to 24 PCI Express Gen 3.0 Lanes and 8x PCIe Gen 2.0 Lanes. 2x SATA 6G ports are available for conventional storage media. Further I/O interfaces, including 4x USB 3.0, 4x USB 2.0, LPC, SPI, I2C Bus and 2x UART, are featured.

conga-B7XD COM Express Type 7 Server-on-Module

congatec www.congatec.us

[email protected] 858-457-2600 www.linkedin.com/company/congatec-ag twitter.com/congatecAG

COM Express

picmg.opensystemsmedia.com/p374036

PICMG System

s & Technology Resource Guide


http://www.congatec.us


http://www.linkedin.com/company/congatec-ag


http://www.twitter.com/congatecAG


FEATURES

ĄĄ MTCA.4 mid-size double-width AMC form factorĄĄ NXP QorIQ T2081 CPU @ 1.8 GHz with AltiVecĄĄ Xilinx Kintex UltraScale Central FPGA (KU040 or KU060)ĄĄ Powered by TOSCA III FPGA Design Kit for straight-forward

FMC integration and customizationĄĄ Single HPC VITA 57.1 compliant FMC slotĄĄ 10 channels ADC 16-bit @ 250 Msps & 4 channels DAC 16-bitĄĄ MTCA.4.1 class A1-compliant RTM for analog signals

The IFC_1420 High-performance Digitizer is a mid-size (4HP) double-width MTCA.4-compliant AMC unit featuring one HPC VITA57.1-compliant FMC slot and implementing a fast ADC/DAC function (4-channel 16-bit DAC function and 10-channel 16-bit ADC function @ 250 Msps). The FMC slot and the ADC/DAC function are controlled by a Xilinx Kintex UltraScale FPGA device, connected on one side to the AMC interface with PCIe x4 Gen2 links (ports 4 to 7), point-to-point links (ports 12 to 15) and multi-point links (ports 17 to 20), and on the other side to a NXP QorIQ T-series T2081 processor with a PCIe x4 Gen3 link. The processor itself is connected by one 1000 BASE-KX gigabit Ethernet link to the AMC interface (port 0), and one 1000 BASE-KX gigabit Ethernet link to the ADF rear transition module interface. The combination of a powerful processor with a powerful FPGA device on the same board, and a rich interconnectivity with the environment has been proved by experience to be a great technological choice.The on-board Xilinx Kintex UltraScale FPGA is powered by IOxOS Technologies' FPGA Design Kit (TOSCA series), that enables the straight-forward integration of the FMC module, the ADC/DAC function and the implementation of custom applications within a high-performance Network on Chip (NoC) based architecture.An extensive EPICS ecosystem of open source tools, libraries and applications is growing around these MTCA.4 and FMC COTS, with the collaboration of the Paul Scherrer Institut (PSI) in Switzerland, aiming to support the physics community in the development of efficient distributed real-time platforms for precision instrumentation and state of the art accelerator control systems.

IFC_1420 High-Performance Digitizer AMC (10 x ADC 16-bit)

MicroTCA


IOxOS Technologieswww.ioxos.ch/images/pdf/02_press_release/MTCA4_Product_Line.pdf

[email protected] +41 22 364 76 92

Pentair’s Schroff brand offers a complete solution based on a standard COM Express Type 6 carrier including COM module, storage, cooling and power supply in an Interscale C case. Interscale C provides a flexible small case where the height, width and depth can be adapted for customer-specific solutions. The COM module heat spreader is adapted directly to a corresponding heat sink through a cutout in the case top cover providing efficient heat dissipation. The cutout in the case is sealed tightly using EMC textile gaskets. A power management plug-in board is placed in one corner of the COM carrier as the power supply for the COM module. The Schroff COM Carrier provides common computer interfaces and features slots for various expansion boards. Expansion boards are inserted parallel to the carrier and include additional features such as MiniPCI Express interfaces for off the shelf mPCIe cards like graphics cards, hard drives or wireless modules. Other expansion boards include a postcode module for debugging and a prototype module for inte-grating user defined functions using the GPIOs or other signals of the COM module or fieldbus modules for connecting to various industry fieldbuses. With the modular COM carrier you can test application functionality in the labora-tory or deploy your product based on the Schroff standard carrier for small pro-duction batches. Customers can receive a completely integrated solution from a single source and can focus on their own value add such as software.

Modular COM-Carrier for COM-Express Type 6-Module

COM Express


Pentair Technical Solutions GmbH schroff.pentair.com

[email protected] +49 (0) 7082 794 0 www.linkedin.com/company/pentair-schroff-europe twitter.com/Schroff_NA

KEY FEATURES

ĄĄ Modular design allows additional modules to be added via expansion boardsĄĄ Complete solution combines a COM module and storage in one Interscale C

case with cooling and a power supplyĄĄ System solution can be integrated, tested, verified and certified

Carrier board interfacesĄĄ Gbit Ethernet, USB 2.0 and 3.0, 5.1 HD Audio, DVI-D and DisplayPortsĄĄ VGA and UART ports, two SIM retainers and a microSD retainerĄĄ Optional cable adapters for RS-232 interfaces, LPT and PS/2 ĄĄ LVDS interface to connect a touchscreen, three S-ATA interfaces, two Mini

PCIe interfacesĄĄ Fan, power and status signal connectors

Possible expansion boardsĄĄ Postcode & prototype module for debugging and user defined I/OĄĄ USB/PCIe expansion board for additional PCIe and Mini PCIe slotsĄĄ Fieldbus module slotĄĄ PMC/XMC slot (e.g. FPGA-XMC)

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http://www.ioxos.ch/images/pdf/02_press_release/MTCA4_Product_Line.pdf



http://www.linkedin.com/company/pentair-schroff-europe


http://www.twitter.com/schroff_NA

http://www.schroff.pentair.com



FEATURES

ĄĄ <<Feature 1>>ĄĄ <<Feature 2>>ĄĄ <<Feature 3>>ĄĄ <<Feature 4>>ĄĄ <<Feature 5>>ĄĄ <<Feature 6>>

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FEATURES

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FEATURES

ĄĄ Made in the USA

ĄĄ Most rack accessories ship from stock

ĄĄ Modified ‘standards’ and customization are our specialty

ĄĄ Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ System monitoring option (CMM)

ĄĄ AC or DC power input

ĄĄ Power options up to 1,200 watts

VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economi-cal, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

For more detailed product information,

please visit www.vectorelect.com

or call

1-800-423-5659 and discuss your application

with a Vector representative.

cPCI, PXI, VME, Custom Packaging Solutions

Vector Electronics & Technology, Inc.www.vectorelect.com

[email protected] 800-423-5659

CompactPCI


Made in the USASince 1947

A FINE TECHNOLOGY GROUP

VISIT OUR NEWWEBSITE!

WWW.VECTORELECT.COM

PICMG System



http://www.vectorelect.com






FEATURES

ĄĄ InterProtect® – the ingenious and unique construction with sealing concept allows protection up to class IP 66 strictly complying to all 19" system dimensions.ĄĄ InterProtect® is well suited for tough environments such as tropical regions

where humidity up to 100% or in deserts with sandstorms.ĄĄ For use in railways, defense, and naval applications as well as all other

applications requiring special protection of electronics. ĄĄ Robust shock and vibration resistance in accordance railway and military

standards up to 20g/200 ms. ĄĄ Heat generation can be dissipated through integrated heat sinks in the top and

bottom modules.ĄĄ Standard subrack has an overall depth of 295.4 mm and is designed for

PCB depths 160, 220 and 240 mm and typical 19 inch width (84 HP). Special widths can be produced easily.ĄĄ Subrack is hermetically sealed with a special conductive silicone sealing.

Therefore, an optimal EMV/ESD-protection is provided.

Intermas develops electronic enclosure systems:Cabinets, housings, subracks, and an extensive range of accesso ries for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

Intermas has an extensive product range of more than 10,000 sepa rate components and more than 30 years’ experience.

Go towww.Intermas-US.com

for our new catalog.

Subrack InterProtect®

Enclosures


Intermas US, LLCwww.Intermas-US.com

[email protected] 1-800-811-0236

FEATURES

ĄĄ 1x HD-SDI input up to 1080p60ĄĄ Real-time HD H.264 encode at 1080p60ĄĄ Stereo audio capture from HD-SDIĄĄ KLV Metadata capture from HD-SDIĄĄ HD-SDI monitor outputĄĄ Optional onboard redundant storage (up to 16GBytes)ĄĄ Extended Temperature -40°C to +85°C

The HDCorder-SDI is an intelligent H.264 Streaming solution that accepts a HD-SDI input at up to 1080p60 and encodes and streams it to the host system. The CompactPCI-Serial board solution is ideal for demanding applications in Military, Communications, Transportation, Mining and Energy industries.In addition to capturing video and stereo audio data the HDCorder-SDI supports extraction of KLV (MSB 0605.3 compliant) embedded data contained within the HD-SDI signal. The video, audio and metadata are synchronized and streamed with the compressed video direct to the host system. An SDI monitor output is provided.The HDCorder-SDI also features optional on-board redundant storage to compliment the host system storage and improve data integrity. The on-board storage automatically acts as a rolling buffer, storing the most recent recorded data. This storage redundancy ensures no mission data is lost even when starved of host CPU attention in heavily loaded system configurations.The HDCorder-SDI is a standard 3U CompactPCI Serial module and supported for Linux and Windows.

HDCorder-SDI – HD-SDI H.264 Video Encoder

CompactPCI Serial


Advanced Micro Peripheralswww.amp-usa.com/compactpci/serial/hdcorder-sdi.php

[email protected] 212-951-7205 @adv_micro_Perip www.linkedin.com/company/advanced-micro-peripherals

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http://www.Intermas-US.com

http://www.Intermas-US.com


http://www.amp-usa.com/compactpci/serial/hdcorder-sdi.php


http://www.linkedin.com/company/advanced-micro-peripherals


http://www.twitter.com/adv_micro_perip



FEATURES

ĄĄ MTCA.4 mid-size double-width AMC form factorĄĄ NXP QorIQ T2081 CPU @ 1.8 GHz with AltiVecĄĄ Xilinx Kintex UltraScale Central FPGA (KU040 or KU060)ĄĄ Powered by TOSCA III FPGA Design Kit for straight-forward

FMC integration and customizationĄĄ Dual HPC VITA 57.1 compliant FMC slotsĄĄ MTCA.4.1 class D1.4-compliant RTM interfaceĄĄ Total integration within EPICS ecosystem

IOxOS Technologies unveils the IFC_1410, an intelligent FMC carrier in AMC form factor that is the cornerstone of its new comprehensive MTCA.4 ecosystem.The IFC_1410 integrates the latest generation of NXP PowerPC QorIQ processors. The T2081 provides quad dual threat core capability running at up to 1.8 GHz with medium power operation (~14[W] Typ. @ 1.4 GHz), and is complemented by large DDR3L System Memory (up to 4 GBytes), non volatile memory NOR, NAND and multiple I/O capabilities such as dual 1000-BASE-KX Ethernet.The on-board Xilinx Kintex UltraScale FPGA is powered by IOxOS Technologies' FPGA Design Kit (TOSCA series), that enables the straight-forward integration of the FMC modules and the implementation of custom applications within a high-performance Network on Chip (NoC) based architecture.An extensive EPICS ecosystem of open source tools, libraries and applications is growing around these MTCA.4 and FMC COTS, with the collaboration of the Paul Scherrer Institut (PSI) in Switzerland, aiming to support the physics community in the development of efficient distributed real-time platforms for precision instrumentation and state of the art accelerator control systems.

IFC_1410 Intelligent FMC Carrier AMC

MicroTCA


IOxOS Technologieswww.ioxos.ch/images/pdf/01_datasheet/IFC_1410_DS_A3.pdf

[email protected] +41 22 364 76 92

The Pixus/Rittal team have developed many of the first and most commercially successful AdvancedTCA and CompactPCI systems in the industry. With a modular design approach, Pixus offers a wealth of enclosure configuration options for the most challenging design requirements. The company also provides a wide range of MicroTCA enclosure solutions, specializing in customized platforms.

Enclosure Platforms for AdvancedTCA, MicroTCA & CompactPCI

Enclosures


Pixus Technologieswww.pixustechnologies.com

[email protected] 519-885-5775 @pixustech

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

FEATURES

ĄĄ Superior cooling solutions with unique RiCool reverse impeller blower optionsĄĄ Ruggedized and customized versions availableĄĄ Backplane experts with 40G standard products and

100G in designĄĄ Hard-to-find enclosure/subrack componentsĄĄ Creative design solutions for volumes large and small

PICMG System



http://www.ioxos.ch/images/pdf/01_datasheet/IFC_1410_DS_A3.pdf


http://www.pixustechnologies.com



http://www.twitter.com/pixustech



shb express continues strong open source vs. open spec...

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