p. 5 editor’s foreword p. 6 sizing the market – supply...
TRANSCRIPT
p. 5 Editor’s ForewordSizing the market – risk managment
p. 6 Defi ning Standards High voltage power supply standard
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VITA EDITORIAL DIRECTOR Jerry Gipper [email protected]
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2 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
Page Advertiser
39 Abaco Systems – We never forget those who serve
1 Atrenne Integrated Solutions – 717-SM ATR for harsh environments requiring high level processing and throughput.
3 Behlman Electronics – 3 Phase. 3U. 1 Choice.
24 Dawn VME Products, Inc. – Dawn VITA 62 6U AC/DC Power Supply
19 Elma Electronic – VPX SOSA development platform
9 Milpower Source – VPX power conversion
40 Pentek, Inc. – We didn’t break the mold, we shattered it
6 Vector Electronics & Technology, Inc. – VME, VXS, cCPI chassis, backplanes, and accessories
21 VEROTEC Electronics Packaging – Verotec Integrated Packaging
Advertiser Index
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3 phase. 3U.1 choice. When the mission calls for a 3-phase 3U power supply that can stand up to the most rugged environments, the military chooses VPXtra 704™ from Behlman – the only VPX solution of its kind built to operate seamlessly from MIL-STD-704F power for mission-critical airborne, shipboard, ground and mobile applications.
> 3-phase AC input; high-power DC output
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0000-BehlmanElectronics-JET-Ad-Military-Embedded-Systems-April-May19-2-4-19.indd 1 2/13/19 11:02 AM
Mars Exploration RoverBy Jerry Gipper,
Editorial Director
SpaceVPX-enabling the next generation of satellite constellations
By Jennifer Keenan, Mercury Systems, Inc.
» p. 16
» p. 22
@VitaTechnologySPRING 2019 | VOLUME 37 | NUMBER 1
All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA.© 2019 OpenSystems Media © 2019 VITA Technologies
enviroink.indd 1 10/1/08 10:44:38 AM
On the cover
The VITA Technologies 2019 Resource Guide showcases technologies based on VITA standards, including FMC, OpenVPX, XMC, and related rugged boards, systems, and components. Featured on the cover: Atrenne, A Celestica Compnany. 717-SM ATR for harsh environments requiring high level processing and throughput.
FEATURES
10 Special Features Jerry Gipper Embedded Tech Trends 2019 Wrap-up
Hall of Fame
16 Technology Feature Mars Exploration Rover
By Jerry Gipper, Editorial Director SpaceVPX-enabling the next generation of satellite constellations
By Jennifer Keenan, Mercury Systems, Inc.
DEPARTMENTS
5 Editor’s Foreword Jerry Gipper Sizing the market – risk management
6 Defi ning Standards Phil Keohen, Rantec High voltage power supply standard
8 VITA Standards Update Jerry Gipper VITA Standards activity updates
26 Guest Blogs Milestone in abstracting the hardware:
Realizing the promise of FACEBy Mark Grovak, Curtiss-Wright Defense Solutions
Keep pace with a standardized development processBy Nick Butler, National Instruments
28 VITA Technologies Resource Guide OpenVPX VME VPX VPX/OpenVPX
On the cover
The VITA Technologies 2019 Resource Guide showcases technologies based on VITA standards, including FMC, OpenVPX, XMC, and related rugged boards, systems, and components. Featured on the cover: Atrenne, A Celestica Compnany. 717-SM ATR for harsh environments requiring high level
Embedded Tech Trends 2019 Wrap-upBy Jerry Gipper,
Editorial Director » p. 10
4 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
VPX/OpenVPX
We just wrapped up the latest VITA work- ing group updates and meetings in Las Vegas, right at the beginning of March Madness. Walking the Strip and through the casinos got me to thinking about why people visit Las Vegas. Many are there for the shows and people watching. Many, many others are there for the gambling opportunities. This got me to thinking further about the risks in gam-bling, particularly sports, which then led me to thinking about the risks that we face in the embedded computing industry.
The computing industry is a challenging business with many risks. Quickly evolv- ing technology fills the future with uncertainty. New innovation leap frogs existing products every day putting huge efforts to waste in short time. Promising opportunities fade away as the market is attracted to the next big thing. Reducing risk is foremost on the minds of compa-nies in this industry.
Participating in standards organizations and the development process of new standards is one way that companies use to reduce risk. Open standards, in particular, offer the allure of large eco-systems with many contributors and par-ticipants in both the development of the standards and the resulting technologies and ecosystem. Organizations such as VITA have a long history of developing standards that are widely accepted and long lived in the industry. Companies that develop and use products based on these standards are reasonably com-fortable in a suitable market niche that exists to supporting a product line.
VITA has a liberal policy for accepting what projects are considered for stan-dards development. It requires three or more companies coming together to sponsor the formation of a working group. No business case is required to form a working group. Other members can
choose to join in the efforts either as an ob- server or active participant. VITA does not judge the merits of the efforts but rather lets the market decide what will win.
The availability of market data is a com- mon inquiry. Companies from both the supply and demand sides like to have an idea of market size, key players, trends, and other items of interest. Getting this market data is very challenging in mar-kets the size of those addressed by most VITA technologies. The small size and specialized markets mean that there are usually very low numbers of participants in the ecosystem. Compounding the problem is the inability for many com-panies, particularly public ones, from sharing data that can be used in making business decisions.
Comparing our market data dilemma to the sports gambling industry where big data is extensively used makes me wonder how we can function at all. Sports now captures every piece of data imagin-able with new data becoming available every season with the use of technology. It seems ironic that the very technology that we are developing is used to enable other industries to generate and analyze so much data, yet we are flying blind.
VITA struggles with assisting in the gath- ering and analysis of useful market data. Companies resist sharing too much product shipment data and design wins. The small size of the industry makes it
unattractive to most market research firms, the cost to gather and analyze data is far greater than the potential for report sales.
A gambling strategy is to cover all your bets, but that can be very expensive if it means developing several overlapping products, developing with complicated technologies, or participating in a variety of markets. Most companies don’t have the resources to make even a fraction of this possible, instead needing to put teams on the next big opportunity, fur-ther increasing risk by chasing tails.
In my role as executive director of VITA, I am especially interested in ideas that help us to collect market data that can be used to help guide business and product strategies. Simply collecting shipment data is not possible for a variety of rea-sons; public company restrictions, lack of time to provide data, small sample size, and so on. Unfortunately, most of the forecasting is based on observations and speculation based on casual conversa-tions with industry participants.
In a brief discussion with John Reardon, at RTC Media, during Embedded Tech Trends, we talked about the lack of inter-est from the investment community in companies in the critical embedded computing industry. Investors tend to stay away even though most of the com-panies in the industry have stellar perfor-mance records. Part of the reason they stay away is the very lack of data I have mentioned. Without solid data on the markets served, it is hard for them to take on the investment risks.
I am forever optimistic that this data problem can be solved. Unfortunately, even in this time of technology and high speed, social media conversations, nothing beats a real conversation face-to-face with other humans!
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 5
Editor’s Foreword By Jerry Gipper, Editorial Director
Sizing the market – risk management
@VitaTechnology [email protected]
COMPARING OUR MARKET
DATA DILEMMA TO THE SPORTS
GAMBLING INDUSTRY WHERE
BIG DATA IS EXTENSIVELY USED
MAKES ME WONDER HOW
WE CAN FUNCTION AT ALL.
Defining Standards By Phil Keohen, Rantec
The popular VPX for high performance computing is a multi-faceted, multilayered family of standards covering everything from modules to chassis to systems to architectures. The range of applications targeted by this technology require many dot standards to cover all cases. A recently fast-tracked standards effort illustrates type of work underway at VITA to make the VPX technology more robust.
Power supplies can be plug-in modules to VPX systems. This requires connector technology for both the power supply mod-ules and the reciprocating backplanes. Sealed connectors are typically required for high voltage applications in harsh envi-ronments. The recently accredited ANSI/VITA 86-2019 High Voltage Input Sealed Connector Power Supply standard defines an environmentally sealed connector pair, which is compatible with the backplane footprint as defined in the ANSI/VITA 62.0 Modular Power Supply Standard for 3U power supplies oper-ating in harsh environments operating off a high voltage input.
The modules defined in ANSI/VITA 86 rely heavily on the VITA 62 standard and are further adapted for applications where VPX power supplies are used in harsh airborne environ-ments. Power supply vendors are expected to comply with VITA 47 environmental considerations to ensure survivability in the harsh environment of many of the deployments they will encounter. This makes the VITA 86 efforts ever more important in addressing these challenging environmental conditions when using VPX technology in military applications.
VITA 86 defines both the mechanical and electrical require-ments for commercial-off-the-shelf (COTS) modules intended for creating modular power supplies. The primary focus is to support VPX and OpenVPX standards when designing systems meeting ANSI/VITA 47 environmental conditions with COTS modules that are compatible with the VPX specifications.
As part of the work to create VITA 86, a new connector system was defined, optimized for the harsh environmental needs of VITA 47. This connector mechanically fits within the envelope defined in VITA 62 and VITA 48.2 for 3U Plug-In modules. It also supports the electrical requirements as defined in those stan-dards. This facilitates the production of backplanes and allows system designers to define where and how many power supply modules are to be used within any given system without re design- ing the backplane.
The Rantec Power Systems, Inc. Ruggedized Sealed Power Connector (RC-V86) family of high-power military intercon-nect systems is designed for the harshest environments in a 3U form factor needing higher input voltages up to 500VDC,
while withstanding the effects of harsh airborne environments including altitude, corrosion, shock, and vibration. The RC-V86 (Figure 1) is a reliable interconnect solution with low contact resistance and capable of withstanding a high number of mating cycles. This connector was selected as the reference connector for the VITA 86 standard.
Environments: › Operating Temperature: -55 °C to +85 °C per MIL-STD810G,
Method 501.5/502.2, II › Storage Temperature: -65 C to +125 °C per MIL-STD-810G,
Method 501.5/502.2, I › Temperature Shock: -65 °C to +125 °C per MIL-STD-810G,
Method 503.5, I-C › Operational Altitude: -1,500ft to 70,000ft per
MIL-STD -810G, Method 500.5, II › Mating Durability: 500 mating cycles › Shock: Sustain up to 300G 3ms half-sine shocks per
MIL-STD-810G, Method 509.5 › Vibration: 43.92 GRMS 15-2,000HZ random vibration per
MIL-STD-810G, Method 514.6, I › Salt fog for 500 hours per MIL-STD-810G, Method 514.6,
Procedure I › Fluid contamination per MIL-STD-810G, Method 504.1, › Humidity per MIL-STD-810G, Method 507.5, II, and relative
humidity of 100 percent
The initial effort focused on 3U VPX modules, but future updates to the standard are under consideration for 6U VPX power supply modules. VPX considers and supports a wide range of environ-mental and performance characteristics. VITA 86 helps in pro-viding the necessary standards to meet those characteristics.
For additional information please visit, www.rantec.com or con-tact Phil Keohen at [email protected] or (805) 596-6015.
FIGURE 1 The Rantec RC-V86
6 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
High voltage power supply standard
VITA Standards activity updates
VITA Standards Update By Jerry Gipper
The March VITA working groups meeting was held in Las Vegas. This update is based on the results of that meeting. Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (http://www.vita.com) for details on upcoming face-to-face meetings.
ANSI accreditationAccredited as an American National Standards Institute (ANSI) developer and a submitter of Industry Trade Agreements to the IEC, VITA provides its members with the ability to develop and promote open technology standards. The working groups meet face-to-face every two months to address embedded bus and board industry standards issues.
The following standards have recently been ANSI and VITA ratified via public ballot. › ANSI/VITA 46.0-2019 VPX Baseline Standard › ANSI/VITA 57.1-2019 FPGA Mezzanine Card (FMC)
Standard › ANSI/VITA 86-2019 High Voltage Input Sealed Connector
Power Supply Standard These standards are available for download by VITA members and are posted at the VITA Store for purchase by non-members.
VSO study and working group activitiesStandards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, and a working group requires sponsorship of at least three VITA members.
Several working groups have current projects underway; the following roundup summarizes those projects:
VITA 40: Service and Status Indicator StandardObjective: This standard defines the colors, behaviors, place-ment, and labeling of service indicator lamps for boards, field replaceable units, and enclosures.
Status: This standard was withdrawn several years ago. VITA has been requested to revive the standard. The original docu-ment has been updated to the current format for VITA stan-dards. Minor updates have been made to correct errors in the original document. The solicitation for balloters on VITA 40 has been submitted for the ANSI balloting stage.
VITA 46.30: VPX: Higher Data RateObjective: The VITA 46.30 standard defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The higher data rate connectors compliant to VITA 46.30 are intermateable with legacy VITA 46.0 connectors and follow the same form factor.
Status: The working group has a draft document in the ballot - ing stage. They are starting the VITA 46.31 standard that will define connector featuring a short solder tail intended to be soldered into a blind via.
ANSI/VITA 47: Environments, Design and Construction, Safety, and Quality for Plug-in UnitsObjective: Supplying vendors’ certification of commercial-off-the-shelf (COTS) plug-in units to this standard will facilitate the cost-effective integration of these items into larger systems.
Status: ANSI/VITA 47-2007 has been opened for revision to improve interoperability, create less reliance on individual sup-plier ruggedization guidelines, and make sure environments are concurrent with recent VPX updates. The working group has placed the document in the ANSI ballot stage. The various dot standards are in final working group review.
Several dots standards have been started to support the original VITA 47.0 standard.
› VITA 47.1: Defines the requirements common across the family of standards.
› VITA 47.2: Defines the unique requirements related to products meant to align with the applications defined in IPC J-STD-001, Class 2.
› VITA 47.3: Defines the unique requirements related to products meant to align with the applications defined in IPC J-STD-001, Class 3.
VITA 51.4: Reliability Component DeratingObjective: The goal of this study group is to develop a new component derating standard.
Status: The study group has been meeting to discuss the scope and outline potential sources of data for this activity.
VITA 57.x: FMC, FPGA Mezzanine CardObjective: This standard describes FMC I/O modules and introduces an electro-mechanical standard that creates a low overhead bridge. This is between the front panel I/O, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module.
Status: A new study group has been formed, VITA 57.5 Physical Tools to Aid in FMC+ Development, to define a set of develop-ment tools. Interested parties are invited to join this study group.
8 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
VITA 62.x: Modular Power Supply StandardObjective: The VITA 62.0 standard describes requirements for building a power supply module that can be used to power a VPX chassis. The modules fi t within the standard envelope defi ned for VPX modules in the VITA 48.0 standards.
Status: The original standard is being revised to be in line with additions made to the VPX standards. Additional working groups are on dot standards. VITA 62.1 is focused on a three-phase high voltage power supply for 3U and VITA 62.2 is developing a 270-volt connector standard. Both working groups have draft documents in review.
ANSI/VITA 65: OpenVPX Architectural Framework for VPXObjective: The OpenVPX architectural framework standard is a living document that is regularly updated with new profi le information and corrections.
Status: New profi les based on work with SOSA are being devel-oped. The working group is nearing completion of review for additions, deletions, and changes to the next release.
VITA 66.5: VPX: Optical Interconnect, Spring-Loaded Contact on BackplaneObjective: This document describes an open standard for con-fi guration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fi xed contacts on the Plug In Module and fl oating displacement on the backplane.
Status: The working group is developing the draft document.
VITA 68.2: VPX: Compliance ChannelObjective: This standard defi nes a VPX compliance channel including common backplane performance criteria required to support multiple fabric types across a range of defi ned baud rates. This allows backplane developers to design a backplane that supports required Bit Error Rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane.
Status: The working group is updating the draft of this standard.
VITA 78.1: SpaceVPX Lite SystemsObjective: This document leverages the work done on ANSI/VITA 78 to create a standard with an emphasis on 3U module implementations. The most signifi cant change from SpaceVPX is to shift the distribution of utility signals from the SpaceUM to the System Controller to allow a radial distribution of supply power to up to eight payload modules.
Status: The working group has developed a draft document of the standard that is currently under review.
Copies of all standards reaching ANSI recognition are available from the VITA online store (www.vita.com/Purchase). For a more complete list of VITA standards and their status, go to www.vita.com/Standards.
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 9
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Embedded Tech Trends 2019 Wrap-upBy Jerry Gipper, Editorial Director
The theme for 2019 was “The Future is Now!” The presenters
were encouraged to talk about how the technology that has been in development the past years now has reached deploy-ment status, bringing us into the future.
Embedded Tech Trends is a small, but extremely effective forum where sup-pliers of components, boards, and system level solutions can meet exclu-sively with members of relevant industry media to discuss technologies, trends, and products.
The following is short synopsis of the presentations:
Optical Interconnect Design Challenges in SpaceBy Guillaume Blanchette, Space Industry Manager, Refl ex Photonics Inc.High throughput communication satel-lites are being deployed at a high rate
In January, Embedded Tech Trends 2019 was held San Diego, California at the Andaz. Located in the heart of the famous Gas Lamp district, the attendees had ready access to great dining and local SoCal activities like the San Diego zoo and the USS Midway.
SPECIAL FEATURE
Embedded Tech Trends In-Depth
and the opportunities for optical interconnect in space are fl ourishing. Designing for space applications presents additional challenges compare to designing for earth environment. Blanchette discussed many of the challenges in dealing with optical technology in space. (Video 1.)
Re-imagining Product Lifecycles: The Future of ObsolescenceBy Ethan Plotkin, CEO, GDCA, Inc.Obsolescence is at the tail end of the product lifecycle, the portion that no one wants to deal with but is critical to mission readiness. Plotkin knows the issues well. In his talk, he presents new ways to re-imaging solutions to dealing with the entire product lifecycle to better position for part obsolescence.
Preparing for the Next Wave of High-speed Fabrics in Embedded ComputingBy Burrell Best, Signal Integrity Applications Architect, Samtec, Inc.In an ever-increasing connected world, the embedded systems of tomorrow will need to process huge amounts of data. A new generation of low latency, high-speed fabrics will also be required as the future capabilities of the compute devices and memory
VIDEO 1 – For Reflex Photonics’ presentation: Optical Interconnect Design Challenges in Space
https://buff.ly/2OKtfpn
10 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
technologies that are enabling these systems increases. The speeds at which these new fabrics must operate will pose real challenges for interconnect manufactures and system designers. Best expanded on the fabrics emerging today and identified the challenges interconnect manufactures will have to overcome in order to usher in this new era of embedded computing.
AI in Military & Industrial ApplicationsBy Emil Kheyfets, Aitech Defense Systems, Inc.Embedded computing systems are smarter with each generation. Kheyfets explains the difference between artificial intelligence, machine learning, and deep learning. He goes further into the computing technologies that make these levels of intelligence possible in military and aerospace applications.
The Convergence of Cybersecurity and Anti-TamperBy David Sheets, Curtiss-Wright Defense SolutionsCybersecurity is topmost on many system architects, but balancing security, anti-tamper protection, and reliability is difficult at best. Sheets walks us through strate-gies and tactics that can help defend against cyberattacks in this never-ending war.
Inside-the-box Optical Links: High-speed Interconnect SolutionsBy Laurence Pujol, Product Manager of optical interconnect solutions, RadiallVPX chassis have to deal with more and more applications requiring massive data transfer with low latency. This trend boosts the use of inside-the-box high speed optical links. Pujol went into an overview of optical interconnect solutions compliant with harsh environments including transceivers, disconnects, and fiber management.
Back to the FutureBy Nigel Forrester, Technical Product Marketing, Concurrent Technologies, PlcSecurity is a major challenge with today’s technology. Forrester presented several ways to keep up with the latest security requirements while still enabling you to use your legacy operating systems and applications.
Securing the Supply Chain: The New ImperativeBy Chris Cummins, COO, Abaco SystemsThe recent revelation by Bloomberg of possible cybersecurity infiltration of the embedded computing market by poten-tially unfriendly powers has focused attention on the need for total security of the supply chain – especially where boards are destined for deployment in mission critical environments. There are numerous steps that embedded com-puting manufacturers can – and should – take to eliminate any potential sources of failure or jeopardized missions caused by malicious insertion of compromised components. Beyond this, there are hardware technologies available that can minimize the possibility of a cyber-attack. Cummins outlined the areas of risk and describes strategies to minimize or, ideally, eliminate those risks.
Trends in Packaging and Infrastructure for DoD Modular SystemsBy Ken Grob, Elma Electronic Inc.The Department of Defense (DoD) has em- braced open, modular systems. Grob dis-cusses key trends in computer packaging
SPECIAL FEATURE
EMBEDDED TECH TRENDS IS
A SMALL, BUT EXTREMELY
EFFECTIVE FORUM WHERE
SUPPLIERS OF COMPONENTS,
BOARDS, AND SYSTEM
LEVEL SOLUTIONS CAN MEET
EXCLUSIVELY WITH MEMBERS
OF RELEVANT INDUSTRY MEDIA
TO DISCUSS TECHNOLOGIES,
TRENDS, AND PRODUCTS.
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 11
and system infrastructure that is infl u-encing the direction of technology and standards key to the industry. (Video 2.)
Making AI FlyBy Devon Yeblonski, Principal Product Manager, Sensor Processing, Mercury Systems, Inc.Artifi cial intelligence (AI) is proving to be as disruptive as tank, radar and subma-rines technologies when they were intro-duced into the defense domain. Nations are competitively seeking battlefi eld dominance with their AI-augmented military systems as new technologies are enabling AI processing to move from the data center to the remote, contested tactical edge. Yeblonski introduced the technologies that are making this transi-tion possible. (Video 3.)
VPX and Defense Open Systems Architectures By Mark Littlefi eld, Vertical Product Manager, Defense Kontron AmericaVPX is an attractive platform for Open Systems Architectures (OSA) – and that’s why efforts like SOSA [Sensor Open Systems Architecture] are focused on it. However, it’s also quite challenging because of its scalability and its wide range of product/board types and the needs of different target applications. Littlefi eld examined the challenges that we’re facing in developing a truly useful, general, and sustainable OSA with VPX, how we’re overcoming them, and what impacts it’s having on our market.
Achieving Safety-Critical Determinism with Multicore ProcessorsBy Richard Jaenicke, Green Hills SoftwareSafety-critical applications have been slow to adopt multicore processors, which have long been used in general embedded processing to achieve higher throughput and improved size, weight, and power (SWaP). Contention among cores for shared resources such as last-level cache, memory, and I/O make it diffi cult to achieve the tight determinism required for flight control and other high-assurance applications. Jaenicke
SPECIAL FEATURE Embedded Tech Trends In-Depth
reviewed the requirements and challenges of multicore interference and then discusses an approach to enable strict deterministic behavior while utilizing the full parallel execu-tion capability of multicore processors.
Securing Tactical Systems TODAYBy Rob Persons, Sr. Sales Architect, Artesyn Embedded TechnologiesData encryption in naval tactical systems is critical for maintaining data security. As programs use more commercially available products in these systems, the security requirements do not go away but as Persons discusses, it can be managed with today’s commercial processors.
PICMG: What’s Past is PrologueBy Jessica Isquith, President, PICMGPICMG is celebrating its 25th anniversary. Isquith updates us on the adoption of PICMG standards and what initiatives are underway for new standards, particularly in the area of the industrial internet of things (IIoT) and next generation performance.
The Emergence of Optics in Levels of Electronic PackagingBy Mark Benton, Engineering Manager, Rugged Fiber Optics, TE ConnectivityOptics plays a signifi cant role in next generation rugged embedded computing, with the drive toward higher speeds and smaller form factors. Benton explores the levels of electronic packaging – from the chips to the external cabling – showing how copper interconnect solutions are evolving and where optics technology breaks through.
New Solutions for Rugged Optical CommunicationBy Patrick Mechin, CEO, TechwayAll is moving to high-speed serial into Embedded systems. This trend is originated by the insatiable need for huge data from application. It is fueled by modern sensors and is fully supported by FPGA [fi eld programmable gate array] technology. Mechin presents how we leverage VITA standards to address this need with rugged optical communication.
High-Sped Serial Backplane Architectures: VPX, CPCI-Serial, xTCA – A ComparisonBy Hendrik Thiel, HEITEC AGThiel provides an overview of the currently leading high-speed serial backplane archi-tectures for demanding embedded applications, including VPX, CompactPCI Serial, and xTCA. In addition to a comparison of their technical features, he covers the accep-tance in various market segments and the availability of off-the-shelf boards and sys-tems. Based on that, a relative positioning of the architectures is revealed.
Switch to 25/100GbsBy Franck Lefèvre, Sales Director, Interface ConceptIntegration challenges of rapid interfaces like PCI Gen4 and 25 Giga Ethernet in designs (like boards, backplanes, systems), requires new skills and resources for
VIDEO 2 – Elma’s presentation:Trends in Packaging and Infrastructure for DoD Modular Systems
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VIDEO 3 – Mercury Systems’ presentation: Making AI Fly
https://buff.ly/2CYq60J
12 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
suppliers that were not required with VME and first gen VPX devices. Lefèvre tells us more about the challenges facing our industry.
Intelligent Interconnects with Integrated ElectronicsBy Ritch Selfridge, Director of Engineering, Amphenol AerospaceInterconnects are key to ensuring secure distribution of power and signals while facilitating platform manufacturing and maintenance. Integrating electronic sensors and processing elements enables intelligent interconnect structures that have the potential to reduce weight via intelligent interconnect management and reduce down-time with interconnect structure health monitoring. Selfridge dares us to dream about interconnects will become intelligent autonomous data and power delivery systems.
Tackling Tomorrow’s Enclosure Thermal and Ruggedization Challenges TodayBy Justin Moll, VP of U.S. Market Development, Pixus Technologies Inc.From commercial to weatherproof to full MIL-spec systems, the thermal and density requirements of open standard enclosure systems continue to bring new challenges. Particularly with OpenVPX, solving thermal issues in both commercial and MIL-grade systems demands creative design solutions. Moll provides examples of transforming a commercial enclosure to a rugged MIL chassis with powerful cooling.
A Modern Yet Traditional Approach to Embedded Systems By Dave Caserza, Embedded Computing Architect, Elma Electronic, Inc.Embedded computing applications require a very wide range of performance. Caserza explains how many applications don’t need the processing performance, especially at high cost. CompactPCI Serial is an ideal modern technology for simpler needs.
VPX Power – VITA 62: Past, Present, and FutureBy Jerry Hovdestad, Orbit Power Group, Behlman ElectronicsHovdestad leads us in a brief history of plug-in power, starting with pre-VPX, pre-VME power, and continues on to show early VPX offerings. Hovdestad discussed original capabilities and the relation to VITA 62 and how capabilities have evolved over the years. The need to generate VITA 62.1, VITA 62.2 and VITA 86 is explained in addi-tion to the current increased power demands and the associated cooling challenges.
Open Technologies, Open Markets: The Value of Standards ParticipationBy Dylan Lang, Standards Manager, Samtec, Inc.Today’s embedded systems continue to provide flexible design opportunities while driving many bleeding edge technologies. As a result, the need for embedded sys-tems and standards is greater than ever before. Open-market organizations like VITA facilitate the development of embedded standards. In the efforts to drive standards from idea to reality, active participation is key both for individual companies and the embedded industry. Lang elaborates on the challenges facing standard development and the benefits of overcoming them.
Jump Starting RFSoC Technology for Radar and Mil-Aero ApplicationsBy Rodger Hosking, Vice President and Cofounder, Pentek, Inc.Systems-on-a-chip (SoC) integrate key functionality into a single semiconductor package. The Xilinx RFSoC integrates RF data converters and FPGA functionality into an SoC specifically targeted at RF applications. Hosking walks us through the market opportunities, design challenges, and module designs opened up by this SoC.
Best Practices for Protecting the Supply ChainBy Steve Edwards, Curtiss-Wright Defense SolutionsCounterfeit parts are a threat to all stated Edwards in his opening remarks. He con-tinued in his presentation to discuss best practices for supply chain management and
how to protect your system throughout the entire development and product lifecycle.
Aviation Safety and Security – Can they Coexist?By Scott Engle, Director of Business Development and Capture, Mercury Systems, Inc.We all want to be safe and secure. For safety-critical system to be truly safe, they must also include security, the two are not mutually exclusive. Engle elabo-rates on how safety and security can peacefully co-exist in today’s complex computer systems.
OpenVPX AdvancementsBy Greg Rocco, MIT Lincoln LaboratoryOpenVPX is a living standard quickly adapting to the needs of the market. Greg Rocco is the father of OpenVPX. He reviewed the latest enhancements and changes to OpenVPX.
Successful Application of Open Architecture DevelopmentBy Michael Hackert, NAVAIROpen standards architectures are being widely embraced in many key programs. A lot of work has occurred in the past few years to make the standards and resulting products suitable for DoD applications. Hackert reviewed that work and hints at several acquisition success stories.
All of these presentations, with video, are posted at www.EmbeddedTechTrends.com. It is highly recommended that you view the videos to get the maximum information.
IN THE EFFORTS TO
DRIVE STANDARDS FROM
IDEA TO REALITY, ACTIVE
PARTICIPATION IS KEY
BOTH FOR INDIVIDUAL
COMPANIES AND THE
EMBEDDED INDUSTRY.
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 13
Hall of FameBy Jerry Gipper, Editorial Director
Lollie Wheeler“Hello – VITA, this is Lollie,” is what you heard when you called VITA. Lollie Wheeler was the voice answering the VITA phone for most of 30 years. Lollie was employee number three at VITA. She was good friends with Betty, who was in search of some assistance with the rapidly growing organization. Lollie immediately jumped in helping with whatever needed to be done.
The fi rst edition of the VITA VMEbus Compatible Products Directory was published in 1985. 174 companies and more than 2,700 products were listed in that fi rst edi-tion. Lollie was the go-to person for this new VITA product directory. This directory was printed four times per year; with all the new products and companies joining the VMEbus boom, there was plenty of work to be done with each edition. Collecting inputs and vetting each of them was a tireless task carried out by Lollie with each edi-tion. Eventually the printed directory went paperless on the emerging internet where VITA was an early pioneer. When the directory went on-line the quarterly printed
Since the announcement of VMEbus in 1981 there have been a great number of people and ideas that have had an impact on the development and advancement of open standards used in critical embedded computing systems. The intention of the VITA Technologies Hall of Fame is to honor and preserve the remembrance of those people and technologies that have had the greatest influence on the VITA open standards industry. Many others are to come – innovators and influencers, who have made a significant impact on developing, designing, creating the technology, and ferrying the technical specifications into open standards. These are the people who have overcome the technical and procedural problems, the products that set new expectations. It is our pleasure to honor these primary contributors to this industry.
SPECIAL FEATURE
Hall of Fame 2019
LOLLIE WHEELER
www.vita.com/VITA-Technologies-Hall-of-Fame
publishing became obsolete. However there still remained much to be done as each entry had to be approved, updates made to the database, and members reminded to keep their content fresh.
The staff grew, leadership changed, and Lollie emerged as the behind the scenes manager of VITA. Members knew her as the go-to person for questions about memberships and dues, product direc-tory inputs and changes, assistance in ob-taining copies of specifi cations, and any other miscellaneous requests that came her way. Lollie followed each request to its satisfactory conclusion, never leaving items unresolved.
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Lollie managed the accounting, re -sponded to requests for VITA standards, and scheduled countless VITA Standards Organization (VSO) meetings. Lollie kept a very low profi le but she has had her fi nger on the pulse of the organiza-tion throughout the years. Behind the scenes she ensured that the member dues were collected, which could be a full-time job in itself. She made sure that standards were delivered anywhere in the world. And that the VSO meetings ran smoothly. Coordinating the logis-tics for six VSO meetings each year in hotels all over the country was a chal-lenge with all the conditions that hotels put on achieving your numbers for the meetings, let alone ensuring that all the attendees are satisfi ed.
Ray Alderman, Chairman of the Board at VITA and Executive Director of VITA between 1998 and 2013, frequently refers to John Rynearson as the “Brains” of VITA, himself as the “Muscle,” and Lollie as the “Heart.” Anyone that has ever had the opportunity to engage with Lollie will certainly agree with that analogy.
IP ModulesAs VMEbus became the industrial bus of choice in the 1980s, the standard IC [inte-grated circuit] moved from a 20-pin MSI DIP to a VLSI [very-large-scale integration] high pin count surface mount device. Although the functionality of standard boards increased dramatically, the average selling price remained at about $2,500. This high per-slot cost prompted manufacturers to continue to place as much functionality on each board as possible, to keep the total slot and total system costs as low as possible. This trend increased the basic functionality granularity (the smallest purchasable func-tion) 10 to 50-fold. It was no longer practical to purchase separately a small number of serial lines or a small amount of memory. Many manufacturers attempted to remedy this problem by offering proprietary “daughter modules” for their processor boards. At least 20 different such proprietary offerings were on the market by the end of the 1980s.
At this time, GreenSpring Computers, under the technical direction of Kim Rubin, created a module with the specifi c design and intent that it become an open, widely accepted standard. GreenSpring Computers introduced the module and its specifi ca-tion as an open standard at BUSCON in 1988.
When the modules were introduced, GreenSpring incorporated features that were found in only a few, if any, other modules:
› Up to four modules fi t on one VME or PC-AT board, for high modularity › Bus and processor independent; supported both Motorola and Intel byte
ordering › Simple, synchronous interface made Modules and Carriers easy to design › Rugged mechanical mounting, for ease of use and high reliability › Defi ned ID space for confi guration management
The concept caught on, and by 1994 over 80 companies were designing and offer -ing products to this standard, on at least seven standard buses. GreenSpring called their modules “IndustryPacks,” but each manufacturer was free to use whatever trade name they wished. The term “IP Modules” is commonly used, a term that is now in the public domain.
In 1991, the Motorola Computer Group incorporated the IP Module specifi cation into its 68040 based MVME162, implementing four IP Module positions in a single VME slot. This helped propel the acceptance of the specifi cation.
At the start of 1994 a formal standards committee, VITA 4, was put together under the VITA Standards Organization, which had received accreditation as a standards organization under ANSI. Most of the committee’s work was done via internet, a new concept at the time, which proved effective. The purpose of the committee was to validate and clarify the existing specifi cation. In particular, timing details for 32 MHz and DMA operation were clarifi ed. Also, the specifi cation was reformatted, with num-bering added for easier reference and formality. The ANSI/VITA 4-1995 (S2011) IP Modules standard is still available. (Figure 1.)
IP-MP-SERIAL DS Industry Pack. Photo Courtesy of
Abaco Systems
FIGURE 1
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 15
Mars Exploration Rover By Jerry Gipper, Editorial Director
This mission has held a special place in my heart for many
years. I remember learning about it at the turn of the millennium, going so far as to register myself and my family on the NASA website as mission participants. I received certificate number 3505972 on November 15, 2002, with the promise that a compact disc with our names would be included on the Mars Exploration Rover 2003 mission. (Figure 1.)
In late June of 2003, my family and I were vacationing in Iowa to visit friends and relatives. We had plans to continue to Orlando, Florida for the second part of our vacation. The Spirit rover had already launched on June 10th with the
I was saddened in February with the news from NASA that the Opportunity Rover mission on Mars was formally concluded. What was originally supposed to be a 90-day, 1,000-meter, exploratory excursion had turned into a nearly 15-year, 28.4-mile odyssey across the surface of Mars, far beyond the expectations of anyone.
TECHNOLOGY FEATURE
VMEbus
Mars Exploration Rover – 2003
Mission Participation
Certificate
FIGURE 1
A self-portrait of NASA’s Curiosity Mars rover shows the robot at a drilled sample site called “Duluth” on the lower slopes of Mount Sharp. Photo courtesy of NASA.
16 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
Space Center facility tour ending at the Apollo/Saturn V Center where we had burgers under the Apollo/Saturn V dis-play. We spent the afternoon touring more of the facility and the Space Shuttle positioned the entrance to KSC. On our way out, we spotted a sign displaying upcoming launches. It turned out that late in the day, NASA had rescheduled the Opportunity launch for that evening. I understood that the launch would be between 10:00 pm and 11:15 pm.
We decided to go to Cocoa Beach for dinner instead of heading back to our hotel in Orlando. We enjoyed a late dinner, shopped at Ron Jon’s Surf Shop, and then headed to the beach to watch the launch. From our vantage point, we had a clear view of the launch pad. There were bright lights and vapor clouds around the launch structure. The night was getting late and the kids were get-ting tired. As the clocked ticked past 11:00 pm, I feared the launch had been scrubbed. Just as we turned to go to the car, a bright flash of light appeared at the launch site. We could see the Delta II Heavy rocket slowly lift from the pad. Several seconds later we could hear and feel the launch. We watched in awe as the rocket headed downrange. Just after separation of the first stage, the rocket disappeared into the clouds over the Atlantic. We headed back to the hotel full of amazement from the thrill of view- ing our first space launch. After a long journey to Mars, the probes landed in January 2004 at widely separated equa-torial locations on Mars.
The Mars Exploration Rovers mission with Spirit and Opportunity was quite incred-ible, especially considering that it was originally planned to only function up to 90 days. There are many factors that led to such a long and successful mission, pri- marily the work of the engineering teams to keep the electronics running with all of their manipulation from earth. But as exec-utive director of VITA and a career VMEbus fan, I like to think that the VMEbus elec-tronics at the heart of the avionics system had a key role to play. (Figure 2.)
TECHNOLOGY FEATURE
Opportunity to follow on July 1. Weather and technical issues plagued the initial launch plans, causing delays. We headed to Orlando on July 5. We did the obligatory visit to Disney World on the 6th. I wanted to visit the Kennedy Space Center on the 7th. The kids were not as excited as they thought it would be too boring. They relented with the promise that we would visit Universal Studies the following day. We did the Kennedy
FIGURE 2A self portrait of the Opportunity Rover. Opportunity used its panoramic camera to take the images combined into this mosaic view of the rover. Photo courtesy of NASA.
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 17
VMEbus BrainsThe avionics or ‘brains’ of each rover were in the Rover Electronics Module (REM) (Figure 3) inside the rover body. These electronics controlled the rover movement and instrument deployment. The REM was housed in the Warm Electronics Box (WEB), with all the instrumentation and communications electronics, to protect from the wild temperature extremes on Mars.
Digging deeper you find that the REM was a ruggedized VMEbus chassis. The specific slot count is difficult to pin down but from photos it appears to be six to eight slots in size.
The computer in both Spirit and Opportunity was a 32-bit RAD6000 microprocessor, a radiation-hardened version of the PowerPC chip used in some models of the Macintosh computers at the time, operating at a speed of 20 million instructions per second. The RAD6000 was a direct transfer of the IBM RISC System/6000 single chip CPU to the Lockheed Martin radiation hardened process. Lockheed Martin developed a VMEbus single board computer that utilized the RAD6000 and its related memory components used in the Spirit and Opportunity rovers. Variations of the VME single board computer (SBC) were also used in the Mars Pathfinder and Surveyor rover mis-sions prior to the Spirit and Opportunity rovers. This was the rover mission standard SBC for several years.
Onboard memory included 128 MB of DRAM with error detection and correction, augmented by 256 MB of flash memory and 3 MB of EEPROM, which allowed the system to retain data even without power. The memory was designed to tolerate the extreme radiation environment from space and to safeguard against power-off cycles so the programs and data would remain and not accidentally erase when the rover hibernated during the long cold Martian nights.
The remaining slots in the VME chassis were used to interface with and control the onboard cameras, batteries, tools, and experiments. The expansion slot design of VMEbus made it ideal for adding the electronics necessary to complete the mission.
TECHNOLOGY FEATURE VMEbus
The cards in the VME chassis could acquire images from cameras, drive 44 motors of various types, and process data from three spectrometers. The multiprocessor architecture allowed communication, image acquisition, and operation of payload elements to pro-ceed simultaneously.
VxWorks was the real-time operating system running on the RAD6000. The Mars Exploration Rovers’ software pack-ages were developed using Tornado 1.0.1 for Mars Exploration Rover (a special release) and debugger with updates spanning VxWorks releases from 5.1 through 5.5. The main computer per-formed regular rover health maintenance. Its software made sure that all systems were functioning properly and that it could continue to communicate with its Earth-bound controllers. The main soft-ware control loop essentially kept the rovers “alive” by constantly checking the rovers to ensure that they were both able to communicate throughout the surface mission and that they remained thermally stable (not too hot or too cold) at all times. It did so by periodically checking temperatures, particularly in the rover body, and responding to potential over-heating conditions, recording power generation and power storage data throughout the Mars sol (a Martian day), and scheduling and preparing for com-munication sessions.
Both rovers operated with few glitches during their mission. Memory manage- ment issues confounded Earth based engineers during the early days of Spirit’s mission, but they were corrected enabling the mission to continue. Radia-tion hits occasionally messed up memory cells, but the error correction built into the memory architecture corrected these faults. Several software upgrades during the mission added more capability and improved the rover intelligence to make them more functional.
Thermal managementThe rover’s batteries, electronics, and computer, stayed safe inside the WEB, packed inside the rover body, and like a warm coat, the WEB walls helped FIGURE 3 Mars Exploriation Rover instruments diagram. Photo courtesy of NASA
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keep heat in when the night tempera-tures on Mars could drop to -96° Celsius (-140° Fahrenheit). The rovers were able to release excess heat through radiators.
Several methods were used to keep the rovers at the right temperature:
› Preventing heat escape through a sputtered gold paint fi lm.
› Preventing heat escape through insulation called “aerogel.” A unique material that is both extremely powerful and lightweight, aerogel is 99.8 percent air and has earned the name “solid smoke.”
› Keeping the rover warm through heaters, eight radioisotope heater units (RHU) which each continuously generated 1 W of thermal energy from the decay of radioisotopes, along with electrical heaters that operated only when necessary.
› Making sure the rovers were not too hot or cold through thermostats and heat switches.
› Making sure the rovers didn’t get too hot through the heat rejection system.
Power system challengesThe main source of power for each rover came from a multichannel solar array that looked almost like “wings.” Power was an extremely rare resource, so power man-agement and consumption were foremost on the minds of the designers and mission controllers. The power system was de-signed so that on each day of the surface mission, solar illumination of the rover array was suffi cient to allow the rover to wake up, conduct routine data sampling establishing system status, communicate for at least one hour at X-band, commu-nicate at least twice at UHF, shut down, and survive the nighttime portion of the cycle to wake up the next day.
When fully illuminated with sunlight, the rover solar arrays generated about 140 watts of power for up to four hours per sol. The rovers needed about 100 watts (equivalent to a standard light bulb in a home) to drive. Driving and conducting
experiments at the same time was diffi cult if not impossible due to the limited power budget. The rovers would rest and work in alternating cycles to gather power for spe-cifi c planned tasks. Close coordination between charging, driving, communications, and processing were required.
The power system for the Mars Exploration Rover included two rechargeable batteries that provided energy for the rover when the sun was not shining, especially at night. One of the boards in the VMEbus backplane was dedicated to battery control. This board collected power-related measurements every fi ve to 10 minutes and sent the data back to Earth each day. Over time, the batteries degraded and were not able to recharge to full power capacity making power management even more critical. It was anticipated that dust on the solar panels would greatly affect the capability of the solar
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www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 19
arrays to generate power, projected to reduce production to about 50 watts of power. Fortunately, dust was not as big of a problem until years later, becoming fatal to Opportunity during the global dust storm that caused loss of power generation capability and eventually communication links to earth. (Figure 4.)
Final resting placeEven though we bid farewell to the intrepid Opportunity rover in February at the conclusion of its 15-year mission, it still had one last gift to give.
Last May, Opportunity took a look around Perseverance Valley on the inner slope of Endurance Crater’s western rim. The valley is about the length of two football fi elds and it’s full of descending shallow troughs.
Ironically, Perseverance Valley became Opportunity’s fi nal resting place when a planet-encircling dust storm took over Mars in June, blocking the sun from
TECHNOLOGY FEATURE VMEbus
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Take the Steps to Secure Your Software Supply Chain – What are You Waiting For?By BlackBerry Jarvis
With the constant news around cyber-attacks, it can be very daunting for CISOs, CSOs, CIOs, and engineering VPs to put in place plans to address cybersecurity threats for all their products across the software supply chain. Automobiles are a very pertinent example of the challenges posed by cybersecurity threats to complex software systems, especially with the onset of ubiquitous connectivity and the move towards autonomous vehicles, intelligent transportation systems, and transportation as a service.
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reaching the rover’s solar panels. Engineers lost contact on June 10 and persistently sent more than a thousand signals and commands to the rover over eight months until they realized the mission was over on February 13.
FIGURE 4 Spirit and Opportunity. Infographic comparing the two rovers. Photo courtesy of NASA.
20 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
“This final panorama embodies what made our Opportunity rover such a remarkable mission of exploration and discovery,” says Opportunity project manager John Callas of NASA’s Jet Propulsion Laboratory. (Figure 5).”To the right of center, you can see the rim of Endeavour Crater rising in the distance. Just to the left of that, rover tracks begin their descent from over the horizon and weave their way down to geologic features that our scientists wanted to examine up close. And to the far right
and left are the bottom of Perseverance Valley and the floor of Endeavour crater, pristine and unexplored, waiting for visits from future explorers.”
Then, the storm hit. Those parts of the panorama are black and white because the rover couldn’t complete the task using its filters.
By-the-way, on the drive from the airport to our house at the end of our vacation, I asked the kids “What was your favorite
part of the two-week vacation?” Both of them immediately exclaimed “The day at the Space Center and the rocket launch.” It still makes my heart happy!
References1. Mars Exploration Rover mission,
American Geophysics Union, 2003 2. Mars Exploration Rover Spirit End of
Mission Report December 2015
FIGURE 5 This 360-degree panorama is composed of 354 images taken by the Opportunity rover’s Panoramic Camera (Pancam). Photo courtesy of NASA.
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 21
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SpaceVPX-enabling the next generation of satellite constellationsBy Jennifer Keenan, Mercury Systems, Inc.
H istorically, our military forces utilized geosynchronous
equatorial orbit (GEO) satellites for their reconnaissance and communications networks. These satellites orbit at an altitude of approximately 22,300 miles above the Earth’s surface and therefore have a large field of view. They orbit over the equator at the same rate as the Earth’s rotational period, appearing to be stationary in the sky.
Three GEO satellites placed 120 degrees apart longitudinally can provide full Earth coverage with the exception of a small section around each of the north and south poles. GEO satellites, also favored for meteorology, TV and radio broadcast,
Almost 5,000 artificial satellites orbit our planet with just over 1,900 of them operational. These satellites provide us with communication networks, Global Navigation Satellite System (GNSS) coverage, technological research, as well as scientific and Earth observation data.
TECHNOLOGY FEATURE
SpaceVPX
have typically been custom-designed units taking more than ten years to develop and averaging more than $500 million to build with at least an equal amount spent on launch and operation. With the speed of advancements by adversaries and new emerging technologies, these 15- to 20-year lifespan custom satellites limit the United States’ ability to easily and routinely add new capabilities or technology to their satel-lite program. Due to these challenges, NASA and other government agencies deter-mined they needed a new approach to maintain space and military superiority.
Space: The Final Frontier, but let’s not go that farCommercial companies with massive amounts of funding like SpaceX, OneWeb, and Planet led the way of the small satellite movement with the primary goals of providing global imagery and the infrastructure to deliver internet coverage to all areas of the globe. They provide these services to not only the U.S. government but also to public and private companies. These smaller low Earth orbit (LEO) satellites occupy much lower altitudes of just 1,200 miles above the Earth or less. While there are some sat-ellite constellations in medium Earth orbit (MEO) (the area between GEO and LEO) such as the GNSS GPS, BeiDou, GLONASS and Galileo constellations, the majority of existing and new constellations will continue to be in LEO. (Figure 1.)
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These satellites in LEO can more effectively be replaced if system failure occurs or if destroyed by collision with other satellites or space debris. The U.S. government can routinely take advantage of leading-edge technologies to acquire, process, store, and disseminate larger amounts of real-time data improving and augmenting current capabilities and satellite networks such as the U.S. global positioning system (GPS). To achieve lower development costs and shorten development schedules, designers of these satellites are taking advantage of what other military and communications systems designers have been doing for over 30 years, designing with open standards.
VITA launches into spaceThe SpaceVPX VITA 78 specification is the first open standard developed specifically for space applications and builds off the success of the OpenVPX platform that has been widely adopted for military embedded systems due to its high-performance computing capabilities, interoperability and scalability. SpaceVPX strengthens the OpenVPX specification with additional key features for spacecraft and other high- reliability applications such as airborne weapons and mission-critical ground com-puting systems exposed to ionizing radiation. These include fault tolerance by mitigating vulnerabilities of a single point failure, dual redundant power and manage-ment distribution and diagnostic support. The standard intends to maintain compat-ibility with OpenVPX components and connector pinouts.
SpaceVPX using the RapidIO interconnect protocol for high-performance computing will deliver improvements over other architectures used for space systems using older interfaces with slower data rates like CompactPCI (cPCI) or lacking processor to pro-cessor interconnect like PCI Express (PCIe) by enabling multiprocessor fabrics, low latency, and low power. An ideal interconnect for SWaP-optimized [size, weight, and power] systems, RapidIO enables more functionality through connectivity of many dif-ferent types of processors, from general purpose to digital to FPGAs [field program-mable gate arrays], in one system that previously could only be accomplished with multiple, big box application-specific systems. Now complete systems to acquire, process, store and disseminate data can be developed in a small 3U SpaceVPX chassis using standard 100mm x 160mm 3U SpaceVPX single board computers (SBC). System architects can take advantage of the latest innovations from commercial technology leaders by simply upgrading SBCs that integrate the newest high-performance pro-cessors and high-density storage from an ecosystem of suppliers without a system redesign. Conversely, systems developed using custom architectures require a sub-stantial redesign effort to implement next generation interconnect and process- ing technologies.
TECHNOLOGY FEATURE
MERCURY SYSTEMS, INC. www.mrcy.com
It only makes sense that to stay ahead of our adversaries, the U.S. government would realize the value of these smaller, more agile LEO satellite constellations to provide more reconnaissance data at a fraction of the cost and time of their geostationary counterparts. Additionally, in LEO, satellites travel at different longi-tudes providing full Earth coverage with substantially better signal strength – 1,300x that of geostationary satellites – so data arrives faster with lower latency.
The Defense Advanced Research Pro- grams Agency (DARPA) launched the Blackjack program in early 2018 to create a constellation of LEO satellites that will provide similar functionality to geo- stationary satellites at a cost of about $6 million instead of more than $1 billion. These satellites will be “good enough” and use commercial-off-the-shelf (COTS) components with reduced screening, acceptance testing, and life expectancy compared to their GEO counterparts that encounter higher levels of radiation.
FIGURE 1 Altitude classifications for geocentric orbits.
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 23
Storage is always an issue – Until nowLogically, new high-capacity data storage solutions are necessary to support the growing data acquisition and processing demands of the LEO constellation expan-sion. Dedicated data recording systems previously developed are unsuitable for these SWaP-constrained, lower cost satellites. As a result, a high-density, modular SpaceVPX solid-state-drive (SSD) was developed to satisfy this need.
Taking its expertise in secure SSD devices (Figure 2), sensor-processing solutions, and the OpenVPX standards for terrestrial military applications, Mercury Systems began development of a family of SpaceVPX products including the fi rst space-grade storage drive in a 3U SpaceVPX form factor.
TECHNOLOGY FEATURE SpaceVPX
Similar to a traditional military-grade SSD, this drive uses high endurance, large geometry Single Level Cell (SLC) NAND fl ash, and integrates an internally devel-oped NAND controller containing error correction (ECC) algorithms.
Providing fault tolerance and data in-tegrity, the advanced ECC algorithms counter radiation-induced NAND fl ash errors by correcting byte errors and fail-ing devices while automatically replacing worn NAND blocks. All other compo-nents in the drive are radiation tolerant by design to 100 Krad. With 100 percent au-thority over the NAND controller, these devices are customizable in feature and form factor to meet mission specifi c require-ments. Designed to meet the SpaceVPX specifications, these devices provide high-speed data rates (>9000 Gb/s) not seen in competing storage products using older standards or custom solutions through the Serial RapidIO (SRIO) inter-face. With interoperability, scalability and cost at the heart of open standards, these devices operate with the ecosystem of SpaceVPX products, providing a path to routine system upgrades not available with custom storage devices.
To learn more about the VITA 78 SpaceVPX specifi cation, visit www.vita.com/Tutorials.
Jennifer Keenan is the Senior Product Marketing Manager for the Microelectronics Secure Solutions group in Phoenix, Arizona. Jennifer has a bachelor’s degree in Marketing from Florida State University. To learn more about Mercury’s SpaceVPX-compliant products and other devices for space applications, visitwww.mrcy.com/space-qualifi ed-microelectronics/ or contact us at space.qualifi [email protected].
(510) 657-4444dawnvme.com
Fill Your TankFill Your TankFill Your Tank
You need it right. You want Dawn.
RUGGED, RELIABLE AND READY, the Dawn VITA 62 compliant 6U AC/DC PSC-6265 operates continuously at 580 watts in diverse environments. Standard model is conduction to wedge lock cooled. Operating range -40°C to +85°C, nonoperating range -55°C to +105°C.
Dawn’s HLD-6262 Holdup Module works in conjunction with our PSC-6265 to overcome ‘gaps’ or ‘glitches’ in the normal input power source up to 50 msec, as specified by MIL-STD 704F.
ENCLOSURES BACKPLANES CARD CAGES ACCESSORIES POWER SUPPLIES VPX PRODUCTS RUSH™ MONITORS
Dawn VITA 62 6U AC/DC Power Supply
RUN UP TO THREE SUPPLIES IN PARALLEL.
FIGURE 2 Mercury’s TRRUST-Stor VPX RT Radiation-Tolerant SSD
24 | VITA Technologies Resource Guide Spring 2019 www.vita-technologies.com
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Milestone in abstracting the hardware: Realizing the promise of FACE
The Future Airborne Capability Environment (FACE) Consort - ium, part of The Open Group, was formed to establish a stan-dard common operating environment to support portable capability-based applications across Department of Defense (DoD) avionics systems. Key to the common operating envi-ronment envisioned by FACE is the definition of an interface for operating systems and board support packages (BSP) that enables the hardware portion of a system to be abstracted, greatly increasing the portability and reusability of software applications. With the wide adoption of FACE, system integra-tors can reap tremendous benefits in interoperability and cost.
The FACE Consortium is a government/industry partnership that manages technical standards and business strategies for acquisition of affordable software systems; it exists to pro-mote innovation and rapid integration of portable capabilities across global defense programs. To be verified in accordance with the FACE Technical Standard and FACE Conformance Policy, software needs to be approved by an approved FACE Verification Authority. FACE conformance does not cover hard-ware, although hardware solutions can be designed to comply with FACE-approved software applications. U.S. Army Aviation, with thousands of helicopters to maintain and deploy, has been a leading advocate of the new standards, as has NAVAIR.
The last few years have seen a number of vendors demon-strating FACE-approved software running on a wide range of open architecture hardware designed to be compliant with the FACE standards. To demonstrate the true promise of FACE, though, requires the same FACE-approved application simul-taneously operating in systems that are running different processor architectures (i.e., Intel, Power, ARM, etc.). Such a demonstration would establish the true abstraction of the under- lying hardware that the effort seeks.
Each year, the U.S. Army hosts the FACE Technical Interchange Meeting (TIM), enabling FACE Consortium members to demon-strate FACE-certified software products and products aligned to the FACE Technical Standard. The Army FACE TIM 2018 (held on September 18 in Huntsville, Alabama) allowed vendors to showcase their FACE efforts for the warfighter. While the FACE target audience is the Army community, other customer communities are also invited, and previous events have seen hundreds of Army, Navy, and Air Force attendees.
At the 2018 FACE TIM, Curtiss-Wright, Green Hills Software (GHS), and Harris Corp. publicly demonstrated what is believed to be the first working example of a FACE-conformant software application running simultaneously on two completely different 3U OpenVPX single-board computers, each of which was based on different processor infrastructures (Intel and power architec-ture). The demo featured Harris’s FACE-approved FliteScene Digital Moving Map software running on top of GHS’s certified
FACE-conformant INTEGRITY-178 tuMP real-time multicore operating system. The commercial off-the-shelf (COTS) module hardware solutions showcased in the demonstration included Curtiss-Wright’s NXP Power Architecture QorIQ Quadcore AltiVec-enabled T2080 processor-based VPX3-152, a DO-254 safety-certifiable 3U OpenVPX single-board computer (SBC), and the VPX3-1258, a 4th-generation Intel Core i7 (Haswell) processor- based 3U OpenVPX SBC.
The demonstration of the two completely different hardware instantiations highlighted how the use of a FACE-conformant software infrastructure enables operators of different aircraft types to run common capabilities on hardware that is SWaP-C [size, weight, power, and cost]-optimized for each individual platform. Today, as 3U VPX becomes the industry standard (replacing the ubiquitous 6U VME form factor), leading COTS vendors offer a wide range of 3U OpenVPX processors based on Intel, PowerPC, and ARM architectures, some available as DO-254 safety-certifiable solutions, that can be embedded in a rugged chassis for applications in fighters, cargo aircraft, and helicopters. As the FACE-conformant OS supports all of these processor types, it enables designers to choose their optimal mix of processors and OS when integrating a FACE-conformant SWaP-C-optimized system.
For some applications, the 3U LRU approach may prove too heavy, hot, or costly to meet unique platform requirements; for example, on small unmanned aerial vehicles or in environments where space and power on a larger platform is very limited. For those cases, non-backplane-based small-form-factor (SFF) LRUs can reduce SWaP-C. When the SFF subsystem can also host a FACE-conformant OS, the system integrator gains the added flexibility to run the exact same applications on both the SFF and larger 3U VPX systems and still meet restrictive SWaP-C limitations.
The promise of FACE: To deliver greater flexibility to system designers while simplifying logistics, boosting interoperability, and eliminating costly proprietary solutions. With the dem-onstration of the same FACE-compliant OS and application software running on heterogeneous hardware platforms, the promise becomes a reality.
Mark Grovak is Director, Avionics Business Development, at Curtiss-Wright Defense Solutions.
By Mark Grovak, Curtiss-Wright Defense Solutions BLOG
THE PROMISE OF FACE: TO DELIVER
GREATER FLEXIBILITYTO SYSTEM DESIGNERS WHILE
SIMPLIFYING LOGISTICS, BOOSTING INTEROPERABILITY,
AND ELIMINATING COSTLY PROPRIETARY SOLUTIONS.
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Keep pace with a standardized development process
Standardization has been an objective in test organizations for decades. In 1961, D.B. Dobson and L.L. Wolff of Radio Corporation of America (RCA) published a paper, “Standardi- zation of Electronic Test Equipment.” The paper presented the principles, criteria, and techniques used in the investigation and prototyping of multipurpose missile system test equipment.
The goal of most early technology standardization efforts was to limit the variety of equipment used in test solutions across the organization. The key objective RCA achieved was the design and deployment of a modular hardware set. Modular hardware leads to higher equipment reuse, more integrated test solutions, fewer obsolete components, and an easier pro-cess for technology replacement.
The RCA paper described the process of identifying shared inputs and outputs across multiple functional components and missile programs to define the requirements of its modular hardware system. It was this process of identifying and sepa-rating common elements that can be addressed together that became the basis of abstraction. Larger instrumentation stan-dardization efforts and a move toward commercial off-the-shelf (COTS) technology have led to modular hardware standards like VXI, PXI, PXIe, and AXIe that are used in test organizations across many industries. Standard modular hardware platforms abstract redundant elements like power supplies, cooling, and user interfaces to single points within the system.
Software as the backbone of standardizationSecurity requirements and fast-paced changes are compelling modern test organizations to go far beyond just hardware stan-dardization; they’re now also focusing on software layers and the practices used to develop them. Test engineering teams must begin the process of adopting and standardizing on itera-tive software development to keep pace with product develop-ment teams and maintain project schedules in an industry that is quickly modernizing.
In the report Design and Acquisition of Software for Defense Systems, the Defense Science Board (DSB) states, “many of the capabilities provided by our weapons systems are derived from the software of the system, not the hardware. This shift from hardware-enabled capabilities to software-enabled capabilities is increasing quickly.”
The best test software engineering teams are building abstracted test software that delivers even more benefits than abstracted hardware provides. An abstracted software plat-form comprises layers that perform specific functions, which enables teams to repair and upgrade each module individu-ally while isolating other layers by maintaining the same inputs and outputs. “With dozens of legacy business lines, software standardization has to address the history of each group,” said
Mark Keith, chief engineer at Honeywell Aerospace. “The purpose [of abstraction] is to minimize or eliminate the need for software modifications when that obsolete hardware is replaced.”
Modern software development for testThe test organization must also implement practices that drive faster and more flexible delivery to manufacturing and the cus-tomer. To deliver all the demanded features, modern software engineering teams are moving to continuous iterative software development practices like Agile.
As stated in the DSB report, “The main benefit of iterative development is the ability to catch errors quickly and continu-ously, integrate new code with ease, and obtain user feedback throughout the development of the application.” Iterative soft-ware development is now an industry-standard practice, and the report says that it “will help the [Department of Defense (DoD)] to operate in today’s dynamic security environment, where threats are changing faster than Waterfall development can handle.”
Standardizing on iterative developmentIterative software development requires a well-orchestrated team that works cooperatively and – much like the abstraction of hardware platforms and software architectures – includes shared and repeated concepts and tasks.
Teams that collaborate on code bases must agree and stan-dardize on tools for source code control, unit test frameworks, code analysis, work management, and deployment. A growing additional concern is cybersecurity. The DSB states: “Checking a software system’s code base daily keeps manageable the number of changes required to comply with a large base of cyber rules.”
In the report Contracting Strategy for F-22 Modernization, the Inspector General of the DoD states, “According to a Program Office official, the DoD is at risk of losing its technological edge against U.S. adversaries and it needs to find innovative ways to bring capabilities to the warfighters faster.” Iterative develop-ment is a proven method for accelerating technology develop-ment across multiple industries, not only defense and aerospace.
While test engineering teams have been focusing on hardware standardization and tiered software architectures, research and development organizations have moved toward itera-tive product development. All aspects of standardization are important and valuable to test organizations, but standardiza-tion must be refined to work with the engineering practices under development today. Test organizations that adopt Agile software development practices are poised to capitalize on this approaching opportunity.
Nicholas Butler is head of Aerospace and Defense Marketing at National Instruments.
By Nick Butler, National Instruments BLOG
www.vita-technologies.com VITA Technologies Resource Guide Spring 2019 | 27
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Inteface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Pixus Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Amphenol Military & Aerospace . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Vector Electronics & Technology, Inc. . . . . . . . . . . . . . . . . . . VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Atrenne, A Celestica Company . . . . . . . . . . . . . . . . . . . . . . VPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Atrenne, A Celestica Company . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Company Category Page
2019 RESOURCE GUIDE INDEX
In 2018, Annapolis was the first company to bring 100Gb bandwidth to OpenVPX. The Wild100 EcoSystem is 2.5X faster than existing technology, and enables PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. This break-through capability is made possible by 25Gbps+ FPGA trans-ceivers and high-density MULTIGIG RT3 interconnects.The Wild100 EcoSystem is a growing, interoperable portfolio of rugged high-performance OpenVPX COTS boards and sys-tems that are used for the most challenging data acquisition, digital signal processing, and data storage applications. It isVITA 65 compliant and SOSA-aligned, designed and built in USA, and ideally-suited for rugged embedded defense and commercial applications.
Wild100™ EcoSystem Brings 100GbE to OpenVPX
OpenVPX
www.annapmicro.com
Annapolis Micro Systems, Inc.www.annapmicro.com/product-category/openvpxsystems/
[email protected] 410-841-2514
FEATURES
ĄĄ Higher ADC/DAC bandwidths (10+ GSps)ĄĄ Superior ADC/DAC density (1,000s of coherent synchronized channels
per system)ĄĄ 100Gb backplane, switches, and FPGA processing boardsĄĄ Storage capacity up to 128 TB per 6U slotĄĄ Blind mate optical and/or RF connections (VITA 66/67), for systems
that are easier to field and maintainĄĄ Optional hot swappabilityĄĄ Includes Open Project Builder™ – VHDL or GUI-basedĄĄ Aligned with SOSA™ technical standard
MADE IN
U. S. A.
Wild100 Systems are built for extreme environments, with Air, Conduction, AFT, and/or LFT cooling.
In 2018, Annapolis was the first company to bring 100Gb bandwidth to OpenVPX. The Wild100 EcoSystem is 2.5X faster than existing technology, and enables PCIe Gen-4, 100 Gbps
EcoSystem Brings 100GbE to OpenVPX
FEATURES
Higher ADC/DAC bandwidths (10+ GSps)
Wild100 Systemsare built for extremeenvironments, withAir, Conduction, AFT,and/or LFT cooling.
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The Wild100™ 16-Slot 19" Top-Loading Chassis (WC6C40) is the first 6U OpenVPX COTS Chassis and Backplane with 100GbE capability. Its superior bandwidth and speed addresses the most challenging real-time beamforming, phased array radar surveillance, EW, SIGINT, and high-resolution processing.
High PerformanceThe Chassis and Backplane design is 2.5X faster than existing technology, and enables PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. Superior speed and band-width is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects.
RuggedWC6C40 is built from the ground up to perform at the highest levels in harsh environments. It is designed and tested for high reliability, utilizing high-performance air cooling for thermal control.
MaintainableIn addition to performance and reliability, WC6C40 is readily maintainable. Board management is simplified with optional VITA 66/67 backplane connectivity and hot swappability.
Proven Wild100 EcoSystemWC6C40 is part of the Wild100 EcoSystem. The 100Gb Eco-System is an integrated and agile VITA 65-compliant system architecture for high-end data digitization, signal processing, and storage.
Designed & Manufactured in USAAll Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.
FEATURES
ĄĄ General Features • 16 6U OpenVPX Slots • – 10 Payload • – 1 Switch • – 1 Clock • – 4 VITA 62 Power Supply delivering up to 3840W • Top-Loading OpenVPX Card Cage • Integrated JTAG access/control from chassis manager to each slot • P3 & P6 in payload/clock slots can be configured for VITA 66/67 use • Optional hot swappability
ĄĄ High-Speed OpenVPX Backplane • 25 Gbps Line Rates on Data and Expansion Planes • 40/100GBase-KR4 Ethernet • 10GBase-KX4 XAUI • SDR, DDR and QDR 4x Infiniband • 2.5-10 Gbps AnnapMicro Protocol
(Low FPGA utilization protocol for FPGA-FPGA connections) • 8x PCIe Gen 1, 2 or 3 • 1000Base-x on Control Plane
ĄĄ Mechanical and Environmental • High-Performance Air Cooling • Operating Temperature: 0 to +55°C • Storage Temperature: -20 to +70°C • VITA 46.11-Compliant Chassis Management
6U Chassis & Backplane Deliver 100Gb Bandwidth
OpenVPX
www.annapmicro.com
Annapolis Micro Systems, Inc.www.annapmicro.com/products/16-slot-beamformer-chassis-2/
[email protected] 410-841-2514
MADE IN
U. S. A.
WC6C40 is the first6U Chassis andBackplane with100GbE capability
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MADE IN
U. S. A.
FEATURES
ĄĄ ADC • Channels: 4 • Max Sample Rate: 4.0 GSps • Resolution: 12 bit • Other configurations available
ĄĄ DAC • Channels: 4 • Max Sample Rate: 6.4 GSps • Resolution: 14 bit • Other configurations available
ĄĄ I/O Connectors (optional 50Ω SSMC or VITA 67) • Four analog outputs • Four analog inputs • One clock input • One trigger input
ĄĄ Mechanical and Environmental • Integrated heat sink and EMI/crosstalk shields • Air- or conduction-cooled
ĄĄ Clock Synchronization • Software-selectable external clock input or onboard
PLL clock • All ADCs and DACs across
multiple mezzanine cards easily synchronized
The WILD FMC+ GM60 ADC & DAC is the industry’s first COTS Mezzanine to feature the Xilinx® Zynq® UltraScale+™ RF System-on-Chip (RFSoC) technology (ZU25DR, ZU27DR, or ZU28DR).
This breakthrough RFSoC combines FPGA processing and A/D and D/A Converters in a single chip, giving the GM60 card remarkable density and performance.
For maximum performance, pair one GM60 with an Annapolis WILDSTAR 3U OpenVPX or PCIe Baseboard, or pair two GM60 with a 6U OpenVPX Baseboard. Annapolis WILDSTAR Baseboards utilize up to three high-performance FPGAs, in addition to the GM60 Mezzanine’s RFSoC.
Also designed for standalone use, the GM60 is ideal for appli-cations limited by Size, Weight, Power, and Cost (SWaP-C). This WILD FMC+ card operates within a tight envelope; it is slimmer than a 3U OpenVPX board, with about 45% less depth.
WILD FMC+ GM60 ADC & DAC with RFSoC
OpenVPX
www.annapmicro.com
Annapolis Micro Systems, Inc.www.annapmicro.com/products/wild-fmc-gm60-adc-dac/
[email protected] 410-841-2514
GM60 shown mounted to 3U Baseboard with blindmate RF out the backplane (VITA 67.3)
The standaloneGM60 is ideal forSWaP-C applications
The standaloneGM60 is ideal forSWaP-C applications
ADC & DAC is the industry’s first UltraScale+™ RF
System-on-Chip (RFSoC) technology (ZU25DR, ZU27DR, or
WILD FMC+ GM60 ADC & DAC with RFSoC
GM60 shown mounted to
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The 6XB2 (6U) and 3XBM (3U) WILDSTAR Boards are the first OpenVPX COTS FPGA Baseboards with capability for 100GbE over copper on the VPX backplane. Both boards are VITA 65-compliant and align with the SOSA™ technical standard.High PerformanceThese high-performance boards combine the latest Xilinx Kintex UltraScale or Virtex UltraScale+ FPGAs with a powerful Zynq UltraScale+ MPSoC. They are 2.5X faster than existing tech-nology, and enable PCIe Gen-4, 100 Gbps Ethernet, and Infini-Band high-speed bandwidths. Superior speed and bandwidth is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects.RuggedAnnapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environ-ments. They are designed and tested for reliability, utilizing high-performance air, conduction, or air-flow-through cooling for thermal control.Proven Wild100 EcoSystemWILDSTAR boards are part of the Wild100 EcoSystem. The 100Gb EcoSystem is an integrated and agile VITA 65-compliant system architecture for high-end data digitization, signal pro-cessing, and storage.Designed & Manufactured in USAAll Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.
FEATURES
ĄĄ General Features • Up to two Xilinx® Kintex® UltraScale™ or Virtex® UltraScale+™ FPGAs • – Gen3/Gen4 PCIe, 150G Interlaken and 100Gb Ethernet • Hard Cores • – FPGAs programmable from attached flash, JTAG or • Annapolis-provided software API • Xilinx Zynq® UltraScale+ MPSoC Motherboard Controller • A Full Board Support Package using Open Project Builder™ for fast
and easy Application Development • – BSP options include 40/100GbE IP and both VxWorks 7 • and Linux support • Multiple levels of hardware and software security
ĄĄ OpenVPX Backplane I/O • 12 (3U) or 38 (6U) HSS I/O lanes to VPX backplane for 72 (3U)
or 182 (6U) GB/s of full duplex bandwidth • 16 (3U) or 32 (6U) LVDS lines to VPX backplane • RT3 connectors deliver 25Gb/s, for a total of 100Gb per Fat Pipe • Backplane Protocol Agnostic connections support 10/40/100Gb
Ethernet, IB capable, AnnapMicro, Aurora protocol and user- designed protocols
• Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK, to enable ADC/DAC synchronization
ĄĄ Front Panel I/O • WILD FMC+ (WFMC+™) next generation I/O site(s) • – Accepts standard FMC and FMC+ cards (complies to • FMC+ specification) • – Supports stacking (2 I/O cards per site) • – Up to 32 HSS and 100 LVDS pairs connections to FPGA
ĄĄ Mechanical and Environmental • Air, conduction, or air-flow-through cooled: -55°C to +85°C
Operating • Available in extended temperature grades • Optional blind mate optical and/or RF (VITA 66/67) • Hot swappable • RTM available for additional I/O • Developed in alignment with the SOSA™ Technical Standard
WILDSTAR™ FPGA Boards with 100Gb Capability
OpenVPX
www.annapmicro.com
Annapolis Micro Systems, Inc.www.annapmicro.com/product-category/fpga-boards-2/
[email protected] 410-841-2514
MADE IN
U. S. A.
FEATURES
General Features
WILDSTAR 6XB26U Board features25Gb/s RT3 connectors
OpenVPX
WILDSTAR 3XBM3U Board, shownwith optional VITA67.3 blindmate RF
VITA Technologiess Resource Guide
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The Pixus 2000W RiCool Chassis Platform holds up to 16 slots along with 16 RTMs (rear transition modules) of 3U or 6U OpenVPX boards. The power-ful RiCool blowers reside directly above the card cage provide up to 392 CFM across the slots. The front-to-rear approach cools 125W/slot with higher power requirements optional.
2000W OpenVPX 16-slot RiCool Chassis Platforms
OpenVPX
www.pixustechnologies.com
Pixus Technologieswww.pixustechnologies.com
[email protected] 916-297-0020 @pixustech
Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components
FEATURES
ĄĄ 16-slot OpenVPX with full RTM capabilityĄĄ Power up to 2000W and beyondĄĄ 125W/slot cooling, higher options availableĄĄ 9U overall chassis height (for 6U boards)ĄĄ 6U overall chassis height (for 3U boards)ĄĄ Taller chassis options for increased cooling
FEATURES
ĄĄ Intel® Xeon® D-15xx processorĄĄ DDR4 with ECC (up to 32 GB)ĄĄ Xilinx® Kintex®-7 FPGAĄĄ 4*PCIe x4 portsĄĄ VITA 46.0 standard compliantĄĄ XMC slotĄĄ Air-cooled and conduction-cooled versions
Based on Intel®’s Xeon® D-15xx processor (Broadwell-DE SoC), this IC-INT-VPX3e is a 3U OpenVPX Single Board Computer delivering high performance for military and industrial applications. It is the key building block of the next High Performance Embedded Computing systems (HPEC), and can be combined with one of Interface Concept 10 Gbs Ethernet switches and front end processing FPGA boards (software/firmware libraries), to constitute a system as a whole. Main features include two banks of DDR4 with ECC (up to 32 GB), 4 x PCIe x4 ports, 2*10G Base-KR, 1*1000Base-T Ethernet ports, 1*RS232 console port. The IC-INT-VPX3e is equipped with an on-board Xilinx® Kintex®-7 FPGA, interfaced with the SoC (PCIe x4) to add core functions (IC provides various IPs and integrate specified customer services). This SBC provides USB ports, SATA ports, and GPIOs, taking advantage of the Intel SoC media capabilities. It features one SATA SSD for storage (up to 16 GB). An optional XMC slot is available to support legacy or custom-design mezzanines. The IC-INT-VPX3e is VITA 46.0 standard compliant. It is available air-cooled and conduction-cooled versions.
IC-INT-VPX3e-3U OpenVPX Intel® Xeon® D processing board
OpenVPX
www.interfaceconcept.com
Interface Conceptwww.interfaceconcept.com
[email protected] 510-656-3400 www.linkedin.com/company/interface-concept
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FEATURES and benefits
VITA 46:ĄĄ Qualified to VITA 46 for Open VPX applicationsĄĄ Fully intermountable and intermateable to existing VITA 46
connectorsĄĄ Meets and exceeds VITA 47 performance requirementsĄĄ Supports Ethernet, Fiber Channel, InfiniBand, and other
protocolsĄĄ Modular COTS lightweight connector systemĄĄ Can be combined with high power modules, RF modules
(VITA 67) and Optical modules (VITA 66)
VITA 67:ĄĄ High performance RF addition to the VPX platformĄĄ High density form factorĄĄ Excellent RF performance to 40 GHz & beyondĄĄ Half-width (4 port) and full-width (8 port) formatsĄĄ COST parts readily available through distributionĄĄ Can be combined with high power modules, Ruggedized
modules (VITA 46) and Optical modules (VITA 66)
Looking for a one place for all of your VPX/VITA needs? Amphenol Military and Aerospace now has you covered!
SV Microwave offers a complete line of COTS VITA 67 coaxial/ RF motherboard, daughtercard, contacts and 6" and 12" cable assemblies through distribution. SV cables VITA 67 contacts with male 2.92mm (SMK) connectors to Ø.047 and Ø.086 coaxial cable types. SV’s unique connector retention mechanism makes installing and removing the cable assemblies easier than the competition! Additionally, SV’s floating SMPM coaxial contacts ensure excellent RF performance in any mating condition. These parts are also designed for side-by-side implementation with VITA 46 hardware and are cabled to Ø.047 and Ø.086 coaxial cable types.
Amphenol Aerospace’s R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 10 Gbps, meeting and exceeding VITA 46 stan-dards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with custom-ized wafer-loading patterns.
VITA 46 & 67
Amphenol MAOwww.amphenolmao.com/Products
[email protected] 561-840-1800 @AmphenolMAO
OpenVPX
www.amphenolmao.com/Products
Amphenol Military & Aerospace Operationsis perfectly aligned to provide the latest technologies, cost-effective
manufacturing and supply chain management, and local support to solve any military and
aerospace interconnect need.
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FEATURES
ĄĄ Made in the USA
ĄĄ Most rack accessories ship from stock
ĄĄ Modified ‘standards’ and customization are our specialty
ĄĄ Card sizes from 3U x 160mm to 9U x 400mm
ĄĄ System monitoring option (CMM)
ĄĄ AC or DC power input
ĄĄ Power options up to 1,200 watts
VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.
Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.
Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.
Series 790 is MIL-STD-461D/E compliant and certified, economi-cal, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.
All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.
For more detailed product information,please visit www.vectorelect.com
or call 1-800-423-5659and discuss your applicationwith a Vector representative.
cPCI, PXI, VME, Custom Packaging Solutions
Vector Electronics & Technology, Inc.www.vectorelect.com
[email protected] 800-423-5659
VME
www.vectorelect.com
Made in the USASince 1947
A FINE TECHNOLOGY GROUP
VISIT OUR NEWWEBSITE!
WWW.VECTORELECT.COM
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FEATURES
ĄĄ 2*Kintex® UltraScale™ KU115ĄĄ QorIQ® LS1046A processorĄĄ 4 GB DDR4 ECCĄĄ 256 MBytes of NOR FlashĄĄ Gen2/3 PCIe switchĄĄ Giga Ethernet L2 switchĄĄ 2*FMC+ sites
Based on two Xilinx UltraScale™ FPGAs, the IC-FEP-VPX6e is a Front-End Processing (FEP) board ideal for applications requiring DSP intensive pro-cessing power. Each FPGA is coupled with two DDR4 SDRAM memory banks (supporting up to 2400 MT/s transfers), two optional DDRII SRAM memory banks and SPI Mirror flash memories for local bit streams storage and for user parameters. The board is controlled by a QorIQ® LS1046A processor integrating quad 64-bit Arm® Cortex A72 cores with high-performance Data Path Acceleration Architecture (DPAA). The Gen2/3 PCIe PCI Express advanced switch allows versatile coupling between the processor, the FPGAs and the P1 VPX connector fabric links (Non-transparent configura-tion is possible). Thanks to Interface Concept Multiware software package and its simplified API, the IC-FEP-VPX6e can be easily integrated in hetero-geneous multi-domains PCIe architectures. Both FMC+ sites are VITA 57.4 standard compliant. The IC-FEP-VPX6e is is available in air-cooled and conduction-cooled grades (VITA 46.0 standard compliant).
IC-FEP-VPX6e – 6U VPX UltraScale™ FPGA board (2*FMC+ sites)
VPX
www.interfaceconcept.com
Interface Conceptwww.interfaceconcept.com
[email protected] 510-656-3400 www.linkedin.com/company/interface-concept
FEATURES
ĄĄ Configuration: Up to 7 slots of 3U VPX or CompactPCI modulesĄĄ Cooling: Air assisted, conduction cooledĄĄ Operating Temperature: Min. -54 °C to Max. + 55 °C ĄĄ Altitude (1000 ft): 50ĄĄ Module Cooling: ConductionĄĄ Mounting: Base or slide panelĄĄ Construction: Dip brazed aluminum
Proven ATR enclosure design for rugged and high level processing applications.
The 717-SM Series ATR is the latest proven design in Atrenne’s extensive enclosure design portfolio. Designed to perform in the harshest environments, it can be deployed in a range of land, sea and air applications. Typical applications involve SIGNIT, ISR and EW where high level processing and throughput is required. The ATR is highly customizable for customer-specific application and require-ments. Configurable for up to 7 slots of 3U VPX or CompactPCI modules, this ATR enclosure also comes with an additional 3U Vita 62 compliant power supply slot. The 717-SM Series continues to provide the industry with a baseline of proven and qualified designs where performance and reliability are at the highest levels as demanded by the most discerning customer.
717-SM Series ATR
VPX
www.atrenne.com/products/717-sm-series-atr
Atrenne, A Celestica Companywww.atrenne.com
[email protected] 800-926-8722 @AtrenneOfficial www.linkedin.com/company/atrenne-integrated-solutions/
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ĄĄ Off-the-shelf backplanes can be quickly customized to mission requirementsĄĄ Optimize the communication topology between slots within a system’s
backplaneĄĄ Customize inter-slot communications to meet unique system
requirementsĄĄ Improve signal integrity between system cards beyond requirements of
PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standardsĄĄ Directly connect PCI Express or SerialRapid I/O to multiple cards or
cards and switchesĄĄ Link SATA from a CPU card to a Solid State Drive (SSD) carrierĄĄ Enable XMC cards to talk to other XMC cards or other I/O like
PCI Express linksĄĄ Facilitate rear backplane I/O connections and low profile connector
interface systems when normal transition modules do not fit the system application envelope
Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topolo-gies. Newly patented FMM micro-overlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements.Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advan-tage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase.Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes.
Fabric Mapping Modules
VPX/OpenVPX
www.dawnvme.com
Dawn VME Productswww.dawnvme.com
[email protected] 800-258-DAWN (3296) • 510-657-4444
FEATURES
ĄĄ True 6 Channel supply provides full OpenVPX supportĄĄ Wedge lock conduction cooled moduleĄĄ Up to 800 Watts power output with 1 inch pitch form factorĄĄ Onboard embedded RuSH™ technology actively monitors
voltage, current, temperature and provides protective controlĄĄ Factory programmable power sequencing of all voltage railsĄĄ Shutdown control for each power railĄĄ Over Voltage, Over Current and Over Temp protection
800 Watt 3U OpenVPX Conduction Cooled Power SupplyThe PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions.Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40°C to +85°C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units.The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade.Dawn’s embedded RuSH™ Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system perfor-mance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails.
PSC-6238
VPX/OpenVPX
www.dawnvme.com
Dawn VME Productswww.dawnvme.com
[email protected] 800-258-DAWN (3296) • 510-657-4444
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FEATURES
ĄĄ Benefits: • ATR, Rackmount, Small Form Factor, and Lab
Development Chassis/Backplanes • VPX /OpenVPX, VXS, VME64x, VME, CompactPCI and
other embedded form factors • 25+ VPX backplanes including pass-through back-
planes ready for cabling to a desired topology • From legacy wire-wrap backplanes to advanced
10 Gbaud signaling • Backplanes with central switched, distributed, daisy
chain and many other topologies
ĄĄ Technical Specs: • Supported standards include: ARINC 404A,
MIL-STD-1275, MIL-STD-167, MIL-STD-461, MIL-STD-704, MIL-STD-810, MIL- STD-91403, RTCA/DO-160, …
• 110/120 VAC, 28/48 VDC Power Supplies • Hybrid cooling methodologies • Red/Black Tempest Compartments • Lightening protection (bulk cable injection or pin
injection)
ĄĄ Supported Architectures: • VPX, VME, CompactPCI and embedded form factors
ĄĄ Application Areas: • Rugged enclosures/backplanes for mil-aero and
industrial applications including: C4ISR, EW, Avionics, Image Processing/Surveillance, Mobile Systems, Secure Communications, Rugged Servers, Sonar & Detection systems, Computing, Communications, Medical
Imagine being able to deploy your electronics design in the harshest military, aerospace and industrial environments in the world. Atrenne Integrated Solutions specializes in providing rugged, deployed chassis enclosures, backplanes, and related accessories and services. If you’ve heard of Mupac, Carlo Gavazzi, SIE Computing, Hybricon, Xtech, CBT or AbelConn, then you already know Atrenne. Since acquiring these businesses, we have the industry’s most extensive intellectual property library of chassis designs accumulated throughout our 40+ year history. If your application has challenging shock, vibration, size, temperature/cooling, altitude, humidity, safety, EMI/EMC, 10 Gbaud signaling or other requirements, chances are we already have a platform design that we can use as a starting point. Working with Atrenne lowers your lifecycle cost, reduces technical risk, shortens your schedule, converts fixed costs to variable and allows your team to focus precious resources on your unique value-add.Our design library includes:• 1/4, 1/2, 3/4, 1, 1.5+ ATR enclosures• 1U to 14U high Rackmount enclosures• Small form factor enclosures• Baseplate, forced-air, heat-exchanger, and liquid-cooled
chassis supporting 3U/6U air and conduction-cooled modules
• Backplanes with 10 Gbaud signaling in a range of topologies and much more…
Atrenne can also serve as your one-stop-shop partner for value-add, build-to-print manufacturing of board CCA’s. We can design/build or manufacture
fabricated metal components, custom I/O and cabling/wire harnesses. Additional services include
connector obsolescence management, full assembly/integration and testing.
COTS Rugged Chassis and Backplanes
Atrenne, A Celestica Companywww.atrenne.com
[email protected] 800.926.8722 @AtrenneOfficial www.linkedin.com/company/atrenne-integrated-solutions
VPX/OpenVPX
www.atrenne.com
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FEATURES
ĄĄ SLC or MLC SATA Solid State DiskĄĄ VITA 48/REDI Conduction CooledĄĄ Operational Altitude to 80,000 FeetĄĄ Operational Temperature from -40 °C to +85 °CĄĄ Solid State Disks (SSDs) up to 8TB (SLC) or
16TB (MLC)ĄĄ Optional AES 256/FIPS 140-2 Encryption
This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage.Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media.The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity.Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.
VP1-250-SSDX
VPX/OpenVPX
www.phenxint.com
Phoenix Internationalwww.phenxint.com [email protected] 714.283.4800
Made in the USa
FEATURES
ĄĄ SLC or MLC SATA Solid State DiskĄĄ VITA 48/REDI Conduction CooledĄĄ Operational Altitude to 80,000 FeetĄĄ Operational Temperature from -40 °C to +85 °CĄĄ Solid State Disks (SSDs) up to 8TB (SLC) or
16TB (MLC)ĄĄ Optional AES 256/FIPS 140-2 Encryption
This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage.Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media.The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity.Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.
VP1-250-SSDX
VPX/OpenVPX
www.phenxint.com
Phoenix Internationalwww.phenxint.com [email protected] 714.283.4800
Made in the USa
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©2019 Abaco Systems.
abaco.com @AbacoSys WE INNOVATE. WE DELIVER. YOU SUCCEED.
WE INNOVATE. WE DELIVER. YOU SUCCEED.
WE INNOVATE. WE DELIVER. YOU SUCCEED.WE INNOVATE. WE DELIVER. YOU SUCCEED.
WE INNOVATE. WE DELIVER. YOU SUCCEED.
Inside the helmet, someone is relying on us We develop advanced technologies and, working with our partners, help give our warfighters the competitive advantage that will keep them safe. We know that fathers, mothers, husbands, wives, sons and daughters depend on us.
Yes: for us, it’s personal... abaco.com/we-serve
WE NEVER FORGET THOSE WHO SERVE
Avionics2019_8x10.875.indd 1 19/02/2019 09:18
RFSoC Unparalleled Performance Unbelievably Fast Integration
We didn’t break the mold. We shattered it.
Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: [email protected] • www.pentek.comWorldwide Distribution & Support, Copyright © 2018 Pentek, Inc. Pentek, Quartz and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.
Unleash the Power of the RFSoC. Download the FREE White Paper!https:/www.pentek.com/go/mesrfsoc
The combination of Pentek’s new Quartz™ architecture, and the processing power packed into the new Zynq® UltraScale+™ RFSoC FPGA, smashes the boundaries of high-performance embedded computing.
Pre-loaded with a host of IP modules, this OpenVPX board is ready for out-of-the-box integration into high-performance systems. Optical streaming interfaces, a unique modular design and the Navigator™ development platform means fast, high-speed deployment.
• Powerful Zynq Ultrascale+ FPGA with built-in wideband A/Ds, D/As & ARM processors
• Dual Optical 100 GigE interfaces for extreme system connectivity
• Robust Factory-installed IP for DRFM,radar range gate engine, waveform and chirp generation, real-time data acquisition and more
• QuartzXM™ eXpress Module speeds migration to other form factors
• Board Resources include PCIe Gen.3 x8 and 18 GB DDR4 SDRAM
• Navigator Design Suite BSP and FPGA design kit for seamless integration with Xilinx Vivado®
All this plus FREE lifetime applications support!
Model 5950 Eight-Channel A/D& D/A RFSoC in 3U VPX ConductionCooled
QuartzAd_MES.indd 1 7/12/2018 11:25:35 AM