phase2 pixel sensor: meeting on
DESCRIPTION
Phase2 Pixel Sensor: Meeting on. D. Bortoletto, Purdue University & University of Oxford. Phase 2 Pixel Sensor Working group meeting. Bump bonding for hybrid pixels remain a dominant cost for hybrid detector. The cost for a single detector unit have been over € 200 - 300 - PowerPoint PPT PresentationTRANSCRIPT
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CMS Tracker Meeting 1
Phase2 Pixel Sensor: Meeting on
D. Bortoletto, Purdue University & University of Oxford
D. Bortoletto, May 20, 2014
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CMS Tracker Meeting 2
Bump bonding for hybrid pixels remain a dominant cost for hybrid detector. The cost for a single detector unit have been over € 200 - 300
• Readout chip (ROC) : sensor chip (SC) : bump bonding (cost ratio) = 1:2:7!
• BB technology used in CERN pixel detectors is not commonly available in small volumes. Flip chip assembly part has caused the rise in total costs during last two years (pie diagrams).
D. Bortoletto, May 20, 2014
Phase 2 Pixel Sensor Working group meeting
27%
32%
40%
Cost structure 2008 - bump bonding of single detector (estimate)
ROC bumping & dicing SC bumping & dicing Flip chip bonding
23%
27%
50%
Cost structure 2010 - bump bonding of single detector (estimate)
ROC bumping & dicing SC bumping & dicing Flip chip bonding
M. Campbel
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CMS Tracker Meeting 3
In this meeting we would like to discuss with companies the challenges for Phase 2
The environment of HL-LHC:o Operations in 140 collisions per bunch crossing at 5x1034 cm-2 s-1
and 40 MHz o Maintain occupancy at ≈ % level
– Higher granularity / smaller pixel require smaller thinner pixels
D. Bortoletto, May 20, 2014
Phase 2 Pixel Sensor Working group meeting
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CMS Tracker Meeting 4
try
D. Bortoletto, May 20, 2014
Pixel geometries
PIXEL SIZES under Consideration
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CMS Tracker Meeting 5
What is the minimal bump bonding pitch and bump bonding pad size that can be achieved with your technology?
How large can the die be or bb density to achieve a good yield (similar to the one that was achieved by the current pixel sensors) ?
What is the minimum thickness of the ROC and sensor wafers that you can handle?
Are they any interesting development in BB that we should be aware of?
Any other issue that we should consider?D. Bortoletto, May 20, 2014
The questions