network and communications processors, sg1007

Quarter 2, 2009SG1007Q22009 Rev 0

Network/Embedded Processors

SG1007–2SG1007Q22009

SE

IN

Seltage Core (V) Voltage IO/tol (V) Status

MP 1.5 ±10% 3.3 ±10% VM is RoHS compliant package.

MSta

Additional Information

MP tegrated MPU for mobile computing. 256-pin ZT is the preferred ackage. 823E has 16 K I-cache and 8 K D-cache. VR is RoHS compliant ackage.emoved from active portfolio.

MP

MP

No

MSta


XP Low-cost, integrated MPU with tailored Communication Processing Module (CPM) including Universal Serial Bus (USB). VR is RoHS compliant package.XP

XP

XP

No

MSta


MP w-cost, integrated MPU with tailored CPM including Fast Ethernet.

is RoHS compliant package.

MP werQUICC® family with embedded 8xx core—with 4 KB I-cache and D-cache, and MMUs integrated with CPM of earlier generation 68360 ICC. 860P and 860DP have 16K I-cache and 8K D-cache.

is RoHS compliant package.

MP

MP

MP

MP

MP

MP

No

CURITY AND INTEGRATED COMMUNICATIONS PROCESSORS

TEGRATED COMMUNICATIONS PROCESSORS

curity ProcessorsProduct Description Packaging Speed (MHz) Rev Vo

C184VF Security co-processor designed to interface with 32-bit PCI and 8xx system bus. Ideal for use with Freescale Semiconductor MPC824x and 8xx devices.

252-ball MAPBGA (VF), (VM) 75 B

PC823 Integrated Microprocessors for Portable Systems (1001)

ndard Temperature: 0°C TA to 95°C TJ (Junction Temperature)

Product Description Packaging Speed (MHz) Rev Temp Note

(-40°C TA to 95°C TJ)SOQ MPQ POQ

C823 Portable System MPU

256-ball PBGA (ZT), (VR) 66, 75, 81 B2T CZT66 0 60 300 InppR

C823 256-ball PBGA (VR) 66, 75, 81 B2T CVF66 0 60 300

C823E 256-ball PBGA (ZT), (VR) 66, 75 B2T CZT66 0 60 300

te: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

PC850 Integrated Communications Processorsndard Temperature: 0°C TA to 95°C TJ (Junction Temperature)



C850 Low-Cost Integrated Communications MPU

256-ball PBGA (ZT), (VR) 50, 66, 80 BU CZT50 0 60 300

C850DE 256-ball PBGA (ZT), (VR) 50, 66, 80 BU CZT50 0 60 300

C850SR 256-ball PBGA (ZT), (VR) 50, 66, 80 BU CZT50 0 60 300

C850DSL 256-ball PBGA (ZT), (VR) 50 BU CZT50 0 60 300

te: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

PC860 Integrated Communications ProcessorsNote

ndard Temperature: 0°C TA to 95°C TJ (Junction Temperature)



C855T PowerQUICC® 357-ball PGBA (ZQ), (VR) 50, 66, 80 D4 CZQ50, 66 0 44 220 Lo

VR

C860DE 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 Po4KQU

VR

C860DP 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220

C860DT 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220

C860EN 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220

C860P 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220

C860SR 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220

C860T 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220

te: Extended temperature products with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

SG1007–3SG1007Q22009

INTEGRMPC862Standard Tem

Product Additional Information

MPC857DS T for DSL applications.ompliant package.

MPC857T 62 PowerQUICC® family including simultaneous operation of rnet (MII) and Parallel ATM (Utopia), Utopia II Multi-Phy, Utopia L2/VBR.ompliant package.

family is now MPC qualified and is being converted to QZ e. Refer to PCN # 11230.re now available.

MPC862P

MPC862T

Note: Exten

MPC866Standard Tem


MPC852T y. package.

MPC853T y.

MPC859DS on available now. package.

MPC859T C® with tailored CPM including Fast Ethernet.nd 8K D-cache.d 4K D-cache. package.

MPC859P

MPC866P amily extension in 0.18 µm offering lower power and higher

K D-cache.d 4K D-cache. package.

MPC866T

Note: Exten

MPC885Standard Tem


MPC870 family extension in 0.18 µm with embedded 8xx core–withe, integrated security, two Fast Ethernet (10/100) controllers,

5 support Ethernet only. VR is RoHS compliant package.5 support Ethernet and ATM. VR is RoHS compliant package.

MPC875

MPC880

MPC885

Note: Exten

ATED COMMUNICATIONS PROCESSORS (continued) Integrated Communications ProcessorsNote

perature: 0°C TA to 95°C TJ (Junction Temperature)

Description Packaging Speed (MHz) Rev Temp Note


L PowerQUICC® 357-ball PBGA (ZP), (ZQ), (VR) 50, 66 B n/a 0 44 220 Low-cost 857VR is RoHS c

357-ball PBGA (ZP), (ZQ), (VR) 50, 66, 80, 100 B CZQ50, 66, 80 0 44 220 Rev B of the 8the Fast EtheSlave, and AAVR is RoHS c862 product (thick) packagZQ samples a

357-ball PBGA (ZP), (ZQ), (VR) 50, 66, 80, 100 B CZQ50, 66, 80 0 44 220

357-ball PBGA (ZP), (ZQ), (VR) 50, 66, 80, 100 B CZQ50, 66, 80 0 44 220

ded temperature products with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

Integrated Communications ProcessorsNote




PowerQUICC® 256-ball PBGA (ZT), (VR) 50, 66, 80, 100 A CVR66, CZT100, 50, 66 0 60 300 Low-cost Ethernet onlVR is RoHS compliant

256-ball PBGA (ZT), (VR) 50, 66, 80, 100 A CVR66, CZT100, 50, 66 0 60 300 Low-cost Ethernet onlHDLC support.

L 357-ball PBGA (ZP), (VR) 50, 66 A CZP 50, 66, 100 0 44 220 Samples and productiVR is RoHS compliant

357-ball PBGA (ZP), (VR) 100, 133 A CZP100 0 44 220 Low-cost PowerQUIC859P = 16K I-cache a859T = 4K I-cache anVR is RoHS compliant

357-ball PBGA (ZP), (VR) 100, 133 A CZP100 0 44 220

357-ball PBGA (ZP), (VR) 100,133 A CZP100 0 44 220 PowerQUICC® 862 fperformance.866P = 16K I-cache, 8886T = 4K I-cache anVR is RoHS compliant

357-ball PBGA (ZP), (VR) 100,133 A CZP100 0 44 220


Integrated Communications ProcessorsNote




PowerQUICC® 256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZT66, 133 0 60 300 PowerQUICC® I 866 8K I-cache, 8K D-cachand USB.MPC870 and MPC87MPC880 and MPC88

256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZT66, 133 0 60 300

256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZP66, 133 0 44 220

256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZP66, 133 0 44 220


SG1007–4SG1007Q22009

INM ives and Features

f Channels) #T1/E1 USB Integrated SecuritySCC

MP 2 n/a Y n/a

MP 2 n/a Y n/a

MP 1 n/a Y n/a

MP 2 n/a Y n/a

MP 2 2 Y n/a

MP 2 n/a Y n/a

MP 2 n/a n/a n/a

MP 2 n/a n/a n/a

MP 1 1 n/a n/a

MP 1 1 n/a n/a

MP 1 n/a n/a n/a

MP 1 1 n/a n/a

MP 1 1 n/a n/a

MP 1 n/a n/a n/a

MP 2 n/a n/a n/a

MP 2 2 n/a n/a

MP 2 2 n/a n/a

MP 4 n/a n/a n/a

MP 4 2 n/a n/a

MP 4 2 n/a n/a

MP 4 2 n/a n/a

MP 4 2 n/a n/a

MP 4 2 n/a n/a

MP 4 2 n/a n/a

MP 4 2 n/a n/a

MP 0 n/a Y N

MP 1 1 Y Y

MP 2 2 Y N

MP 3 2 Y Y

TEGRATED COMMUNICATIONS PROCESSORS (continued)PC823/MPC850/MPC855T/MPC857T/MPC859T/MPC860/MPC862/MPC866/MPC885 Processor Derivat

Product I-Cache(KB)

D-Cache (KB) 10T 10/100 ATM ESAR ATM (No o

HDLC

C823 2 1 Up to 2 n/a n/a n/a Up to 64

C823E 16 8 Up to 2 n/a n/a n/a Up to 64

C850 2 1 1 n/a n/a n/a n/a

C850DE 2 1 Up to 2 n/a n/a n/a n/a

C850SR 2 1 Up to 2 n/a Y n/a Up to 64

C850DSL 2 1 1 n/a Y n/a n/a

C852T 4 4 Up to 2 1 n/a n/a n/a

C853T 4 4 Up to 2 1 n/a n/a Up to 32

C855T 4 4 1 1 Y n/a Up to 32

C857T 4 4 1 1 Y Y Up to 32

C857DSL 4 4 1 1 Y Y n/a

C859P 16 8 1 1 Y Y Up to 32

C859T 4 4 1 1 Y Y Up to 32

C859DSL 4 4 1 1 Y Y n/a

C860DE 4 4 Up to 2 n/a n/a n/a n/a

C860DP 16 8 Up to 2 1 Y n/a Up to 64

C860DT 4 4 Up to 2 1 Y n/a Up to 64

C860EN 4 4 Up to 4 n/a n/a n/a n/a

C860P 16 8 Up to 4 1 Y n/a Up to 64

C860SR 4 4 Up to 4 n/a Y n/a Up to 64

C860T 4 4 Up to 4 1 Y n/a Up to 64

C862P 16 8 Up to 4 1 Y Y Up to 64

C862T 4 4 Up to 4 1 Y Y Up to 64

C866P 16 8 Up to 4 1 Y Y Up to 64

C866T 4 4 Up to 4 1 Y Y Up to 64

C870 8 8 0 2 N N n/a

C875 8 8 1 2 N N Up to 32

C880 8 8 Up to 2 2 Y Y Up to 64

C885 8 8 Up to 3 2 Y Y Up to 64

SG1007–5SG1007Q22009

INTEGRPowerQ


MPC8241MPC8241

Functionality of the MPC8245 in lower cost package. Extended Temperature 0°C to 105°C TJ. VR is RoHS compliant packages.

MPC8245MPC8245MPC8245AMPC8245MPC8245

32-bit superscalar processor core with integrated peripheral logic. Supports up to 133 MHz 64-bit memory interface and up to 66 MHz 32-bit PCI interface, MPC8245 has the on-chip DUART and is pin-compatible with the MPC8240. VV is RoHS compliant packages.

MPC8247 Ethernet only device.

MPC8248 Ethernet only device. Integrated security.

XPC8255 Low-cost derivative of 8260.XPC8260 Supports fast ethernet HDLC channels and OC-3 ATM up to

200 MHz CPU, 166 MHz CPM, 66 MHz Bus.

MPC8250A Ethernet only derivative.

MPC8255A Low-cost ATM and Ethernet derivative.

MPC8260A Standard device. Supports fast Ethernet HDLC channels and OC-3 ATM up to 200 MHz CPU, 166 MHz CPM,66 MHz Bus.

MPC8264A Supports TC-layer and IMA microcode in addition to standard device features.

MPC8265A Supports PCI in addition to standard device features.

MPC8266A Superset, supporting TC/IMA and PCI.MPC8270 PCN Announcing Rev A published in Q2.

MPC8271 Supports Ethernet and ATM.

MPC8272 Supports Ethernet and ATMIntegrated encryption.

MPC8275 Low-cost ATM device.MPC8280

CPU/CPM/B , P = 300, Q = 333, R = 366, S = 375, T = 400, U = 450, V = 500, anNote: Extend

ATED COMMUNICATIONS PROCESSORS (continued)UICC® II FamilyNote

Description CPU/CPM/Bus Speed(MHz)

Rev Packaging Std Temp Note

(0°C to 105°C)Ext Temp Note

(-40°C to 105°C)Samples SOQ MPQ POQ

PowerPC ISA 166/200/266166/200

D=1.4D=1.4

357-ball TBGA (ZQ), (VR)357-ball TBGA (ZQ), (VR)

— — — 22

4444

220220

PowerPC ISA 266/300266/300/333/350

400/466266/300333/350

D=1.4D=1.4D=1.4D=1.4D=1.4

352-ball TBGA (ZU), (VV)352-ball TBGA (ZU), (VV)352-ball TBGA (ZU), (VV)352-ball TBGA (ZU), (VV)352-ball TBGA (ZU), (VV)

— — — 11111

2424242424

144144T144T144144

PowerQUICC® II (HiP7) 266/200/66 (MIB) 300/200/100 (PIE) 400/200/100 (TIE) 400/266/133 (TMF)

A 516-ball PBGA (ZQ/VR) MPC8247ZQxxxA MPC8247CZQxxxA KMPC 2 40 200

PowerQUICC® II (HiP7) 266/200/66 (MIB) 300/200/100 (PIE) 400/200/100 (TIE) 400/266/133 (TMF)


PowerQUICC® II (HiP3) 200/133/66 (IFB) C2 480-ball TBGA (ZU/VV) XPC8255ZUIFBC XPC8255CZUIFBC KMPC 2 21 105PowerQUICC® II (HiP3) 166/133/66 (HFB)

200/133/66 (IFB)200/166/66 (IHB)

C2 480-ball TBGA (ZU/VV) XPC8260ZUxxxC XPC8260CZUxxxC KMPC 2 21 105

PowerQUICC® II (HiP4) 266/166/66 (MHB)300/200/66 (PIB)200/166/66 (IHB)

C 516-ball PBGA (ZQ/VR)480-ball (ZU/VV)

MPC8250AVRIHBCMPC8250AZUxxxC

MPC8250ACZQIHBCMPC8250ACZUxxxC

KMPC 2 40 200

PowerQUICC® II (HiP4) 266/166/66 (MHB)300/300/66 (PIB)

B 480-ball TBGA (ZU/VV) MPC8255AZUxxxB MPC8255ACZUxxxB KMPC 2 21 105

PowerQUICC® II (HiP4) 300/200/66 (PIB)300/208/83 (PJD)266/166/66 (MHB)266/200/66 (MIB)


PowerQUICC® II (HiP4) 300/200/66 (PIB)266/166/66 (MHB)266/200/66 (MIB)300/208/83 (PJD)


PowerQUICC® II (HiP4) 300/200/66 (PIB)266/166/66 (MHB)266/200/66 (MIB)300/208/83 (PJD)

C 480-ball TBGA (ZU/VV) MPC8265AZUxxxC MPC8265AZUxxxC KMPC 2 21 105

PowerQUICC® II (HiP4) 300/208/83 (PJD) C 480-ball TBGA (ZU/VV) MPC8266AZUxxxC MPC8266AZUxxxC KMPC 2 21 105PowerQUICC® II (HiP7) 333/250/83 (QLD)

450/300/100 (UPE)266/200/66 (MIB)

A 516-ball PBGA (ZQ/VR)480-ball TBGA (ZU/VV)

MPC8270xxMIBA MPC8270CxxMIBA KMPC 2 21/40 105/200

PowerQUICC® II (HiP7) 266/200/66 (MIB)300/200/100 (PIE)400/200/100 (TIE)400/266/133 (TMF)


PowerQUICC® II (HiP7) 266/200/66 (MIB)300/200/100 (PIE)400/200/100 (TIE)400/266/133 (TMF)


PowerQUICC® II (HiP7) 266/200/66 (MIB) A 516-ball PBGA (ZQ/VR) MPC8275ZQMIBA MPC8275CxxMIBA KMPC 2 40 200PowerQUICC® II (HiP7) 333/250/83 (QLD)

450/300/100 (UPE)A 480-ball TBGA (ZU/VV) MPC8280xxxxxA MPC8280CxxUPEA KMPC 2 21 105

US speed for PowerQUICC® II (HIP 3/4) A = 50, B = 66, C = 75, D = 83, E = 100, F = 133, G = 150, H = 166, I = 200, J = 208, K = 233, L = 250, M = 266, N = 291d W = 533.ed temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

SG1007–6SG1007Q22009

INM ICC® II Derivatives and Features

#T1/E1 #T3/E3 USB PCI TC/IMA

MP 2 0 Y Y NMP 2 0 Y Y NMPMP

44

11

n/an/a

YN

NN

MP 8 2 n/a N NMP 8 2 n/a N YMP 8 2 n/a Y NMP 8 2 n/a Y YMP 4 1 Y Y NMP 2 0 Y Y NMP 2 0 Y Y NMP 4 1 Y Y NMP 8 2 Y Y Y

MP cal

usQUICC Engine

Standard Temp.

Extended Temp.

Packaging Samples

MP es n/a MPC8313 MPC8313C 620-ball TE-PBGA

MPC

MP es n/a MPC8313E MPC8313EC 620-ball TE-PBGA

MPC

MP Local

BusQUICC Engine

Standard Temp.

Extended Temp.

Packaging Samples

MP Yes n/a PPC8314, PPC8314E

PPC8314C, PPC8314EC

620-ball TE-PBGA

MPC

MP Yes n/a PPC8315, PPC8315E

PPC8315C, PPC8315EC

620-ball TE-PBGA

MPC

M

J)Samples Additional Information

MP KMPC n/a

MP KMPC n/a

MP KMPC n/a

MP KMPC n/a

Mrity Local Bus QUICC Engine

MP o Yes Yes (Ethernet, HDLC)

MP s Yes Yes (Ethernet, HDLC)

MP o Yes Yes (Ethernet, HDLC, ATM)

MP s Yes Yes (Ethernet, HDLC, ATM)

TEGRATED COMMUNICATIONS PROCESSORS (continued) PC8250/MPC8255/MPC8260/MPC8264/MPC8265/MPC8266/MPC8270/MPC8275/MPC8280 PowerQU

Product I-Cache(KB)

D-Cache(KB)

10T 10/100 Utopia ATM Support (No of Channels) FCC MCCHDLC SCC

C8247 16 16 3 2 0 64 3 2 0C8248 16 16 3 2 0 64 3 2 0C8250C8255

1616

1616

Up to 4Up to 4

Up to 3Up to 2

02-CH (155 Mbps ea)

Up to 128Up to 128

44

32

11

C8260 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2C8264 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2C8265 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2C8266 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2C8270 16 16 Up to 4 Up to 3 0 Up to 128 4 3 1C8271 16 16 3 2 1 64 3 2 0C8272 16 16 3 2 1 64 3 2 0C8275 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 128 4 3 1C8280 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2

PC8313 PowerQUICC® II Pro Processor Familyroduct Description CPU

(MHz)DDR/DDR2

(MHz)I-Cache D-Cache Memory Controller 10/100/1000

EthernetUSB PCI Security Lo

B

C8313 PowerQUICC® II Pro 266, 333, 400

333 16K 16K 1 × 16/32-bit DDR 2 (SGMII) 1 x Hi-Speed (PHY)

1 × 32-bit No Y

C8313E PowerQUICC® II Pro 266, 333, 400

333 16K 16K 1 × 16/32-bit DDR 2 (SGMII) 1 x Hi-Speed (PHY)

1 × 32-bit Yes Y

PC8314/15 PowerQUICC® II Pro Processor Derivatives and Featuresroduct Description CPU

(MHz)DDR/DDR2

(MHz)I-Cache D-Cache Memory Controller 10/100/1000

EthernetSystem Interfaces Security


266 16 K 16 K 1 x 32/64 bit DDR1/2 up to 266 MHz

2 PCI-Express® - 2 x 1 Lane (for PPC8314, PPC8314E),

USB 2.0 w/ Phy, PCI

Yes


266 16 K 16 K 1 x 32/64 bit DDR1/2 up to 266 MHz

2 PCI-Express® - 2 x 1 Lane (for PPC8315, PPC8315E),

SATA x 2 (PPC8315, PPC8315E) USB 2.0 w/ Phy, PCI

Yes

PC8323 PowerQUICC® II Pro FamilyProduct Description CPU

(MHz)DDR

(MHz)QUICC Engine

(MHz)Packaging Std Temp

(0°C TA to 105°C TJ)Ext Temp

(-40°C TA to 105°C T

C8321 PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8321 MPC8321C

C8321E PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8321E MPC8321EC

C8323 PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8323 MPC8323C

C8323E PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8323E MPC8323EC

PC8323 PowerQUICC® II Pro Derivatives and FeaturesProduct I-Cache D-Cache Memory Controller 10/100 Ethernet USB PCI Secu

C8321 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit N

C8321E 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit Ye

C8323 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit N

C8323E 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit Ye

SG1007–7SG1007Q22009

INTEGRMPC834

Produc amples Additional Information

MPC8343 KMPC MPC samples available.MPC8343E MPC MPC samples available. Integrated security.MPC8347 MPC MPC samples available.

MPC8347E MPC MPC samples available. Integrated security.

MPC8349 KMPC MPC samples available.MPC8349E MPC MPC samples available. Integrated security.Note: Exten

MPC834Prod Local Bus Communications Engine

MPC8343 Yes n/aMPC8343E Yes n/aMPC8347 Yes n/aMPC8347E Yes n/aMPC8349 Yes n/aMPC8349E Yes n/a

MPC836Product

)Samples Additional Information

MPC8358 KMPC *MPC8358E KMPC *MPC8358/E KMPC *MPC8360 KMPC *MPC8360E KMPC *1. Extended* Rev. 2.0 no

MPC836Prod Local Bus QUICC Engine

MPC8358 Yes YesMPC8358E Yes YesMPC8360 Yes Yes

MPC8360E Yes Yes

MPC837P Security Local Bus QUICC Engine

MPC8377E , PCI Yes Yes n/aMPC8378E Yes Yes n/aMPC8379E Yes Yes n/a

ATED COMMUNICATIONS PROCESSORS (continued)9 PowerQUICC® II Pro FamilyNote

t Description CPU(MHz)

DDR/DDR2(MHz)

Packaging Std Temp Note

(0°C to 105°C)Ext Temp Note

(-40°C to 105°C)S

PowerQUICC® II Pro 266, 400 266 620-ball PBGA (ZQ/VR) MPC8343 MPC8343CPowerQUICC® II Pro 266, 400 266 620-ball PBGA (ZQ/VR) MPC8343E MPC8343EC KPowerQUICC® II Pro 266, 400, 533, 667 266, 333 620-ball PBGA (ZQ/VR)

672-ball TBGA (ZU/VV)MPC8347 MPC8347C K

PowerQUICC® II Pro 266, 400, 533, 667 266, 333 620-ball PBGA (ZQ/VR)672-ball TBGA (ZU/VV)

MPC8347E MPC8347EC K

PowerQUICC® II Pro 400, 533, 667 266, 333 672-ball TBGA (ZU/VV) MPC8349 MPC8349CPowerQUICC® II Pro 400, 533, 667 266, 333 672-ball TBGA (ZU/VV) MPC8349E MPC8349EC K

ded temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

9 PowerQUICC® II Pro Derivatives and Featuresuct I-Cache D-Cache Memory Controller 10/100/1000 Ethernet USB PCI Security

32K 32K 32-bit DDR/DDR2 2 1 × Hi-Speed 1 × 32-bit, 33/66 MHz No32K 32K 32-bit DDR/DDR2 2 1 × Hi-Speed 1 × 32-bit, 33/66 MHz Yes32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 1 × 32-bit, 33/66 MHz No32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 1 × 32-bit, 33/66 MHz Yes32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 2 × 32-bit or 1 × 64-bit No32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 2 × 32-bit or 1 × 64-bit Yes

0 PowerQUICC® II Pro FamilyDescription CPU

(MHz)DDR

(MHz)QUICC Engine

(MHz)Packaging Std Temp1

(0°C TA to 105°C TJ)Ext Temp*

(-40°C TA to 105°C TJ

PowerQUICC® II Pro 266, 400 266 300, 400 740-ball TBGA (ZU/VV) MPC8358 MPC8358CPowerQUICC® II Pro 266, 400 266 300, 400 740-ball TBGA (ZU/VV) MPC8358E MPC8358ECPowerQUICC® II Pro 266, 400 266 266 668-ball PBGA (ZQ/VR) MPC8358E MPC8358ECPowerQUICC® II Pro 400, 533, 667 266, 333 400, 500 740-ball TBGA (ZU/VV) MPC8360 MPC8360CPowerQUICC® II Pro 400, 533, 667 266, 333 400, 500 740-ball TBGA (ZU/VV) MPC8360E MPC8360EC

temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.t recommended for new designs. Production available for Rev. 2.0. Samples and production now available for Rev. 2.1.

0 PowerQUICC® II Pro Derivatives and Featuresuct I-Cache D-Cache Memory Controller 10/100/1000 Ethernet USB PCI Security

32K 32K 1 × 32/64-bit DDR 2 Yes 1 × 32-bit, 33/66 MHz No32K 32K 1 × 32/64-bit DDR 2 Yes 1 × 32-bit, 33/66 MHz Yes32K 32K 1 × 32/64-bit or

2 × 32-bit DDR2 Yes 1 × 32-bit, 33/66 MHz No

32K 32K 1 × 32/64-bit or2 × 32-bit DDR

2 Yes 1 × 32-bit, 33/66 MHz Yes

x PowerQUICC® II Pro Processor Derivatives and Featuresroduct I-Cache D-Cache Memory Controller 10/100/1000 Ethernet System Interfaces

32 K 32 K 1 x 32/64 bit DDR1/2 up to 400 MHz 2 2-x1 PCI-Express®, x2 SATA, USB 2.032 K 32 K 1 x 32/64 bit DDR1/2 up to 400 MHz 2 (SGMII) 2-x1 PCI-Express®, USB 2.0, PCI32 K 32 K 1 x 32/64 bit DDR1/2 up to 400 MHz 2 x4 SATA, USB 2.0, PCI

SG1007–8SG1007Q22009

INP

Local Bus CPM Additional Information

M Yes No Advanced power management, IEEE® 1588 v2

M Yes No www.freescale.com

M Yes Ethernet Only

www.freescale.com



M Yes No DPFP, www.freescale.com

M Yes No XOR, www.freescale.com

M Yes No DPFP, XOR, www.freescale.com

M Yes Yes www.freescale.com

M Yes Yes www.freescale.com

M Yes QUICC Engine

QUICC Engine has 8 UCCs supporting Ethernet, ATM, and HDLC; one MCC supporting 256 HDLC channels; 8 TDMs; interworking support.

M Yes QUICC Engine

QUICC Engine has 8 UCCs supporting Ethernet, ATM, and HDLC; one MCC supporting 256 HDLC channels;8 TDMs; interworking support. Table Lookup Unit included.

M Yes QUICC Engine

QUICC Engine has 8 UCCs supporting Ethernet, ATM, and HDLC; two MCCs supporting HDLC channels; 16 TDMs and interworking support. Contact factory for samples

M 32 b to 150 MHz

No Pattern Matching Engine and Table Lookup Unit included.

M 32 b to 33 MHz, boot from NAND

(NOR, ROM)

n/a LCD controller from SXGA (1280 x 1024) to QVGA (320 x 240) up to 72 Hz. AltiVec™ power mgmt.

M 32 b to 133 MHz

n/a AltiVec™, power mgmt, protocol support: Enet, VLAN, IPv4, IPv6, TCP, UDP, pin compatible with MPC8641D

M 32 b to 133 MHz

n/a Dual core, dual AltiVec™, power mgmt, protocol support: Enet, VLAN, IPv4, IPv6, TCP, UDP, pin compatible with MPC8641

M 32 b to 133 MHz

n/a AltiVec™, power mgmt, protocol support: Enet, VLAN, IPv4, IPv6, TCP, UDP, pin compatible with MPC864x Family

M 32 b to 133 MHz

n/a AltiVec™, power mgmt, protocol support: Enet, VLAN, IPv4, IPv6, TCP, UDP, pin compatible with MPC864x Family

A

TEGRATED COMMUNICATIONS PROCESSORS (continued)owerQUICC® III FamilyProduct Description CPU

Frequency(MHz)

Communications Frequency

(MHz)

I/D Cache

L2Cache

Memory Controller 10/100/1000 Ethernet

System Interfaces Security

PC8536E PowerQUICC® III 600 to 1.5 GHz

n/a 32 K 512 KB DDR2/3 - 333 MHz to 667 MHz

2 PCI, PCI Express®, DMA, SATA, USB, SD/MMC

Yes

PC8540 PowerQUICC® III 667, 833, 1000

n/a 32 K 256 K DDR1-333 MHz 2 PCI, PCI-Express®, pRIO,I2C, DUART

No

PC8541E PowerQUICC® III 533, 667, 833, 1000

n/a 32 K 256 K DDR1-333 MHz 2 2x, PCI, I2C, DUART Yes

PC8543E PowerQUICC® III 800, 1000 n/a 32 K 256 K DDR1-400 MHz, DDR2-400 MHz

2-eTSEC PCI, sRIO/PCI-Express®,I2C, DUART

Yes

PC8544 PowerQUICC® III 1000 333 32 K 256 K DDR1/2-544 MHz 2 PCI, Triple PCI-Express®,I2C, DUART

Yes

PC8545E PowerQUICC® III 800, 1000, 1200

n/a 32 K 512 K DDR1-400 MHz, DDR2-400 MHz

2-eTSEC PCI, PCI-Express®, I2C, DUART

Yes

PC8547E PowerQUICC® III 1000, 1200,1333


4-eTSEC PCI, PCI-X, PCI-Express®, I2C, DUART

Yes

PC8548E PowerQUICC® III 1000, 1200,1333, 1500


4-eTSEC PCI, PCI-X, PC-Express®, sRIO, I2C, DUART

Yes

PC8555E PowerQUICC® III 533, 667, 833, 1000

333 32 K 256 K DDR1-333 MHz 2 2x PCI, I2C, DUART Yes

PC8560 PowerQUICC® III 667, 833, 1000

333 32 K 256 K DDR1-333 MHz 2 I2C, DUART No

PC8567E PowerQUICC® III 800, 1000, 1200

400 32 K 512 K DDR1-400 MHz,DDR2-533 MHz

3-QUICC Engine™

PCI, PCI-Express®, sRIO,I2C, DUART

Yes

PC8568E PowerQUICC® III 1000,1333 400, 533 32 K 512 K DDR1-400 MHz, DDR2-533 MHz

2-eTSEC, 3-QUICC Engine™

PCI, PCI-Express®, sRIO,I2C, DUART

Yes

PC8569E PowerQUICC® III 800, 1200,1333

400, 533, 667 32 K 512 K Single 64b or Dual 32b DDR2/DDR3 with up to

800 MHz data rate

Up to 4 GbE, Up to 8 10/100

(All QUICC Engine)

PCI-Express®, sRIO, I2C, DUART

Yes

PC8572E Dual CorePowerQUICC® III

1067, 1200, 1333, 1500

n/a 32 K 1 MB with ECC

Dual 64b DDR2/DDR3 with ECC, up to

800 MHz data rate

4-eTSEC with SGMII + one

10/100

Triple PCI-Express®, sRIO, I2C, DUART

Yes

PC8610 Integrated Host Processor

667, 800, 1000, 1066,

1333

n/a 32 K/32 K

256 KB with ECC

Single 64b DDR1/DDR2 with ECC,

400 to 533 MHz data rate

Connectthrough PCI or PCI-Express®

x8 and x4 PCI-Express®, PCI, LCD Controller, 2-I2S Audio, SPI, 2-DUART, 2 I2C, 2-IrDA,

32-GPIO, 2-DMA

n/a1


1000, 1250, 1333, 1500

n/a 32 K/32 K

1 MB with ECC

Dual 64b DDR1/DDR2 with ECC, 400 to 600

MHz data rate

4-eTSEC Dual x8 PCI-Express®, x4 sRIO, DUART, dual I2C

n/a

PC8641D Dual Core Integrated Host

Processor

1000, 1250, 1333, 1500

n/a 32 K/32 K

1 MB per core with

ECC

Dual 64b DDR1/DDR2 with ECC, 400 to 600

MHz data rate


n/a


1000, 1250 n/a 32 K/32 K

1 MB with ECC

Dual 64b DDR1/DDR2 with ECC, 500 MHz

data rate


n/a

PC8640D Dual Core Integrated Host

Processor

1000, 1250 n/a 32 K/32 K

1 MB per core with

ECC

Dual 64b DDR1/DDR2 with ECC, 500 MHz

data rate


n/a

change bar appears in the left margin to mark the location of new or revised information.

SG1007–9SG1007Q22009

INTEGR68K Inte

Prod Additional Information

MC68302 0 core with three high-performance multiprotocol serial nels also on-chip DMA, RAM, timers, I/O, chip select, and state interrupt controller.

G are RoHS compliant packages.MC68302V

MC68EN30 8302, plus separate IEEC 802.2 Ethernet MAC channel and RAM controller.

s RoHS compliant package.

MC68LC30 c EC000 Core Processor with two high-performance protocol serial channels; also on-chip DMA, RAM, timers,hip selects, and wait state interrupt controller.

RoHS compliant package.

MC68360 32 + core with System Intergration Module (SIM) and four performance SCCs support numerous protocols. Two s support Ethernet on "EN" version.

R are RoHS compliant packages.MC68360V

MC68EN36

MC68EN36

MC68MH36 chip integrated microprocessor and peripheral combination four SCCs, two serial management controllers (SMCs), and erial peripheral interface (SPI).

R are RoHS compliant packages.MC68MH36

Note: Exten

NetworkStatus Targeted Applications

MCC5E0RX ommended for new designs. • Broadband Access• Wireless Infrastructure• Multiservice Platforms• Media Gateways• High-Function Routing• Metro Ethernet

ATED COMMUNICATIONS PROCESSORS (continued)grated Communication ProcessorsNote

uct Description Packaging Speed(MHz)

Rev Temp Note

(-40°C to 85°C)SOQ MPQ POQ BRICK

IntergratedMultiprotocol

Processor (IMP)

132-pin (FC), (EH) 16, 20, 25 C CFC16, 20 0 36 144 180 6800chanwait

EH, A

144-pin (PV), (AG) 16, 20, 25, 33 C n/a 0 60 300 300

132-pin (RC) 16, 20, 25 C CRC16, 20 0 14 70 n/a

144-pin (PV), (AG) 16 @ 3.3 V C CPV16V 0 60 300 300

2 IntergratedMultiprotocol

Processor with Ethernet Controller

144-pin (PV), (AG) 20, 25 BT CPV20 0 60 300 300 Full 6full D

AG i

2 Low-CostIntergrated

MultiprotocolProcessor

100-pin (PU), (AF) 16, 20, 25 @ 5 V CT CPU16, 20 0 84 420 420 StatimultiI/O, c

AF is

16, 20 @ 3.3 V CT CPU16V

QUICC QuadIntegrated

Communications Controller

240-pin (EM), (AI) 25, 33 @ 5.0 V L CEM25 0 24 120 n/a CPUhigh-SCC

AI, V

357-pin (ZP), (VR) L CZP25 0 44 220 n/a

241-pin (RC) L CRC25 0 10 50 n/a

240-pin (EM), (AI) 25 @ 3.3 V L 0 24 120 n/a

357-pin (ZP), (VR) L 0 44 220 n/a

0 240-pin (EM), (AI) 25, 33 @ 5.0 V L CEM25 0 24 120 n/a

357-pin (ZP), (VR) L CZP25 0 44 220 n/a

241-pin (RC) L CRC25 0 10 50 n/a

0V 240-pin (EM), (AI) 25 @ 3.3 V L 0 24 120 n/a

357-pin (ZP), (VR) L 0 44 220 n/a

0 240-pin (EM), (AI) 25, 33 @ 5.0 V L CEM25 0 24 120 n/a One-with one s

AI, V

357-pin (ZP), (VR) L CZP25 0 44 220 n/a

241-pin (RC) L CRC25 0 10 50 n/a

0V 240-pin (EM), (AI) 25 @ 3.3 V L 0 24 120 n/a

357-pin (ZP), (VR) L 0 44 220 n/a

ded temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

ProcessorsProduct Description Packaging Speed

(MHz)Rev Throughput Power

(Typ)

266WBOB 266 MHz C-5e Network Processor 840-ball CBGA (HiTCE) 266 B0 5 Gbps 9.2 W Not rec

SG1007–10SG1007Q22009

PRC-

M

M

M

M

XXDIE REVISIONEVEL OF DIE

SEQUENTIAL ALPHA

SEQUENTIALNUMERIC

A0, B0.

XPACKAGE REVISION

REVISION LEVEL OF PACKAGE

SEQUENTIAL ALPHACHARACTERS

66FREQUENCY

50/66/80/100/133 MHzPPCKXPXPCMPC

HICK)HICK)D)D)

D4DIE MASK REVISION

823 B2T850 BT/BU852T A853T A855T D4857T B857DSL B859P A859T A859DSL A860 D4862 B866 A870 O875 O880 O885 O

BEQUENCY

B 66D 83F 133H 166J 208L 250N 291Q 333S 375U 450W 533

B3DIE MASK REVISION

BC

ENCY

DDDR FREQUENCY

D 266

AREVISION

CONTACT LOCAL FREESCALE SALES OFFICE

CQUICC ENGINE

FREQUENCYC 200 MHZ

KMPMPCPPC

NCY

EDDR/DDR2 FREQUENCY

D 266F 333G 400

BDIE MASK REVISION

B = 3.1NONE = 1.1

ODUCT NUMBERINGPort Network Processor Family Product Numbering Scheme

PC8xx Processor Product Numbering Scheme

PC82xx PowerQUICC®™ II Processor Product Numbering Scheme

PC8323 PowerQUICC® II PRO Family Product Numbering Scheme

PC8349E/MPC837xE PowerQUICC® II PRO Family Product Numbering Scheme

XTEST CONDITIONS

L JUNCTION TEMPERATURE QUALIFIED: 0°C TO 100°C

T TJ -40°C TO 100°CW TJ-40°C TO 125°C

(QUALIFICATION TESTCONDITION INDICATORS)

REVISION L

MAJOR DIEREVISION

MINOR DIEREVISION

EXAMPLE:

XXXXPRODUCT FAMILY

C501 C-5 NP DIE REVISION D0 (XC AND MC)

C5E0 C-5eQ500 Q-5M500 M-5C3E0 C-3E

XXPRODUCT CODE

PC ENGINEERING SAMPLESMC PRODUCTION QUALIFICATION

XXPACKAGE INDICATOR

RX CERAMIC FLIPCHIP BGAZU TAPE BGAZP EBGA

XXXSPEED BIN

166 166 MHz200 200 MHz266 266 MHz

AND SO ON...

ENPART/MODULE MODIFIER

DE DUAL CHANNEL (W/ENET)DP DUAL CHANNEL (10/100, MULTI-HDLC, ATM)DT DUAL CHANNEL (10/100, MULTI-HDLC, ATM)EN FOUR CHANNEL (W/ENET)P FOUR CHANNEL (10/100, MULTI-HDLC, ATM)SR FOUR CHANNEL (W/ENET, MULTI-HDLC, ATM)T FOUR CHANNEL (10/100, MULTI-HDLC, ATM)

860800 SERIES DEVICE

823850852T853T855T857T

857DSL859DSL

859P859T860862866870875880885

MPCPRODUCT CODE

PROTOTYPE SAMPLEC SAMPLE PACK (2–10)

ENGINEERING PRODUCTIONQUALIFIED

CTEMP RANGE

BLANK 0°C TA TO 95°C TJC -40°C TA TO 95°C TJ

ZPPACKAGE

|256-BALL ZT (LEAD)357-BALL ZP (LEAD)256-BALL ZQ (LEAD-T357-BALL ZQ (LEAD-T256-BALL VR (NO LEA357-BALL VR (NO LEA

ZUPACKAGE

480-BALL ZU (LEAD)480-BALL VV (NO LEAD)516-BALL VR (NO LEAD)516-BALL ZQ (LEAD)

IFCPU/CPM FR

A 50C 75E 100G 150I 200K 233M 266P 300R 366T 400V 500

CTEMP RANGE JUNCTION

BLANK 0°C TA TO 105°C TJC -40°C TA TO 105°C TJ

82608XXX SERIES DEVICE

8250 ETHERNET ONLY8255 LOW-COST (W/ATM)8260 BASE8264 IMA ENABLED8265 PCI OPTION8266 PCI + IMA8270 ETHERNET ONLY8275 LOW-COST (W/ATM)8280 FULL FEATURE (IMA AND TC)

MPCPRODUCT CODE

PPC PROTOTYPE SAMPLEKXPC SAMPLE PACK (2–10)XPC ENGINEERING PRODUCTIONMPC QUALIFIED

APROCESS

BLANK HIP3A HIP4(8280, 8270, 8275)BLANK HIP7

EENCRYPTION ACCELERATION

BLANK NOT INCLUDEDE INCLUDED

VRPACKAGE

ZQ 516-BALL PBGA (LEAD)VR 516-BALL PBGA (NO LEAD)

CTEMP RANGE (JUNCTION)

BLANK 0°C TO 105°C C -40°C TO 105°C

83238323 FAMILY DEVICE NUMBER

(8323, 8321)

MPCPRODUCT CODE

MPC QUALIFIED

AFe300 CORE FREQU

AD 266AF 333



ZUPACKAGE

ZU TBGA (LEAD)VV TBGA (RoHS)ZQ PBGA (LEAD)VR PBGA (RoHS)


BLANK 0°C TO 105°C C -40°C TO 105°C

83498349 FAMILY DEVICE NUMBER

(8349, 8347, 8343)837x FAMILY DEVICE NUMBER

(8377, 8378, 8379)

MPCPRODUCT CODE

C SAMPLE PACK (2-10) FULL QUAL

PROTOTYPE SAMPLE

HCPU FREQUE

AD 266AG 400AJ 533AL 667

SG1007–11SG1007Q22009

PRODUMPC836

MPC85X

MPC85X

MPC85X

MPC856

Note: Extend

MPRODU

KMPC SAMPMPC FULL

FQUICC ENGINE

FREQUENCYD 266E 300G 400H 500

EREQUENCYD 266F 333

ADIE REVISION

X DIE MASK REVISION

PROKMPC MPC F

JR SPEED

266 300

333 400500533600667800

BDIE REVISION

X DIE MASK REVISION

PROKMPC MPC F

JR SPEED

266 300

333 400500533600667800

BDIE REVISION

X DIE MASK REVISION

FQUICC ENGINE

FREQUENCYG 400J 533

PKMPMPC

LDDR SPEEDJ 266 K 300 L 333

BREVISION

A 1.0B 2.0C 3.0

LQUICC ENGINE FREQUENCY

G 400 MHZJ 533 MHZL 667 MHZ

PRODKMPMPC

ADIE REVISION

A change b

CT NUMBERING (continued)0 PowerQUICC® II Pro Product Numbering Scheme

X PowerQUICC® III Processor Product Numbering SchemeNote (Standard)

X PowerQUICC® III Processor Product Numbering SchemeNote (QUICC Engine Enabled)

X PowerQUICC® III Processor Product Numbering SchemeNote (8540/8560 under 1 GHz)

9E Preliminary Product Numbering Scheme

ed temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.



ZUPACKAGE

ZQ PBGA (MPC8358 ONLY)VR PB FREE PBGA (MPC8358 ONLY)ZU TBGAVV PB FREE TBGA

CTEMP RANGE

BLANK 0°C TA TO 105°C TJ (TBGA)C -40°C TA TO 105°C TJ (TBGA)BLANK 0°C TA TO 105°C TJ (PBGA)C -40°C TA TO 105°C TJ (PBGA)

83608360 FAMILY DEVICE

NUMBER(8360, 8358)

PCCT CODELE PACK (2-10)

QUAL

HCPU FREQUENCY

AD 266AG 400AJ 533AL 667

DDR F

854885XX DEVICES8540, 8555, 8541,8548, 8547, 8545,8543, 8544, 8572, 8536

PXPACKAGE

PX PLASTIC LEADVT PLASTIC PB-FREE HX HICTE LEADVU HICTE PB-FREE

AUFREQUENCYAJ 533 MHZAL 667 MHZAN 800 MHZAP 833 MHZAQ 1 GHZAR 1.067 GHZAT 1.2 GHZAU 1.33 GHZAV 1.5 GHZ

CTEMP RANGE (JUNCTION)BLANK 0° TO 105°CC -40° TO 105°C

MPCDUCT CODE

SAMPLE PACK (2-10)ULL QUAL

DDDEFG HJ KL N

ESECURITY

BLANK = NOT PRESENTE = PRESENT

856885XX DEVICES8560, 8567, 8568

PXPACKAGE

PX PLASTIC LEADVT PLASTIC PB-FREE HX HICTE LEADVU HICTE PB-FREE

AUFREQUENCYAJ 533 MHZAL 667 MHZAN 800 MHZAP 833 MHZAQ 1 GHZAR 1.067 GHZAT 1.2 GHZAU 1.33 GHZAV 1.5 GHZ

CTEMP RANGE (JUNCTION)BLANK 0° TO 105°CC -40° TO 105°C

MPCDUCT CODE

SAMPLE PACK (2-10)ULL QUAL

DDDEFG HJ KL N

ESECURITY

BLANK = NOT PRESENTE = PRESENT

PX PACKAGE

PX STANDARD PACKAGEVT LEAD FREE

833FREQUENCY

667, 833 MHZ 667, 833 MHZ


BLANK 0° TO 105°CC -40° TO 105°C

854085XX DEVICES

85608540

MPCRODUCT CODEC SAMPLE PACK (2-10) FULL QUAL

ESECURITY


VT PACKAGE

VT 783 29 X 29 MM FC-PBGA

AUe500 FREQUENCY

AN 800 MHZAQ 1000 MHZAU 1333 MHZ


BLANK 0°C TA TO 105°C TJ C -40°C TA TO 105°C TJ

85698569 FAMILY DEVICE

NUMBER8569

MPCUCT CODE

C SAMPLE PACK (2-10) FULL QUAL

NDDR SPEEDK 600 MHZL 667 MHZN 800 MHZ

ESECURITY


ar appears in the left margin to mark the location of new or revised information.

SG1007–12SG1007Q22009

PRUU

UU

UU

P2

QoP2

terfaces Security Local Bus Additional Information

P2 wo Serial RapidIO, C, SPI, 2 x I2C, RT

Yes Enhanced 16b version

www.freescale.com

P2 wo Serial RapidIO, C, SPI, 2 x I2C, RT

Yes Enhanced 16b version

www.freescale.com

ZREVISION

B SILICON REVISION 1.1

AMEMORY DATA RATE

G 400 MHZ DDR2J 533 MHZ DDR2

ENCY MHZ MHZ MHZ

M

AMEMORY DATA RATE

H 500 MHZN 533 MHZ (0.95 CORE

VOLTAGE/1.05 PLATFORM)

ZREVISION

C SILICON REVISION 2.1

ENCY MHZ MHZ MHZ MHZ

M

AMEMORY DATA RATE

G 400 MHZH 500 MHZJ 533 MHZK 600 MHZN 500 MHZ (LOW

ZREVISION

B SILICON REVISION BC SILICON REVISION C

ENCYHZ

MHZ MHZ

ZDDR SPEED

Z NOT SPECIFIED

AREVISION

A 1.0

ODUCT NUMBERING (continued)8610WXXYYYYZ

8640DWXXYYYYAZ

8641DWXXYYYYAZ

Family, QorIQ™ Communication Processors Product Numbering Scheme

rIQ™ COMMUNICATIONS PLATFORMS Family

Product Description Number of Cores CPU Frequency(MHz)

I/D Cache L2 Cache Memory Controller 10/100/1000 Ethernet

System In

020 Dual Core P2 2 800, 1000, 1200

32 K 512 K with ECC

64b DDR2/3 with ECC 3-eTSEC with up to two SGMII

Three PCI Express, tUSB 2.0, SD/MM

DUA

010 Single Core P2 1 800, 1000, 1200

32 K 512 K with ECC

64b DDR2/3 with ECC 3-eTSEC with up to two SGMII

Three PCI Express, tUSB 2.0, SD/MM

DUA

YYYYCPU FREQUENCY

800 800 MHZ CORE WITH 400 MHZ DDR11066 1066 MHZ CORE WITH 533 MHZ DDR21333 1333 MHZ CORE WITH 533 MHZ DDR2

XXPACKAGE

VT LEAD FREE SPHERE PBGAPX LEADED SPHERE PBGA

8610DEVICE NUMBER

8610

UPRODUCT CODE

MC QUALIFIED PRODUCTION

WOPERATING TEMPERATURE

BLANK 0° TO 105°CT -40° TO 105°C

YYYYCPU FREQU1000 10001067 10671250 1250

XXPACKAGE

HX LEADED SPHERE HCTEVU LEAD FREE SPHERE HCTE

8640DEVICE NUMBER

8640

UUPRODUCT CODE

C QUALIFIED PRODUCTION

DNUMBER OF CORES

BLANK SINGLE CORED DUAL CORE


BLANK 0° TO 105°CT -40° TO 105°C

YYYYCPU FREQU1000 10001250 12501333 13331500 1500

XXPACKAGE

HX LEADED SPHERE HCTEVU LEAD FREE SPHERE HCTE

8641DEVICE NUMBER

8641

UUPRODUCT CODE

C QUALIFIED PRODUCTION

DNUMBER OF CORES

BLANK SINGLE CORED DUAL CORE


BLANK 0° TO 105°CT -40° TO 105°C

2PACKAGE

2 TEPBGA2 PB FREE

EENCRYPTION

E SEC PRESENTN NOT PRESENT

PQUAL STATUS

P PROTOTYPEN QUAL’D TO INDUSTRIAL TIER

P2020DEVICE NAME

P2020 DUAL CORESP2010 SINGLE CORE

KCPU FREQU

H 800 MK 1000M 1200

STEMP RANGE

S STD TEMPX EXT TEMP

SG1007–13SG1007Q22009

HOST PHost Pr

Product Additional Information Architecture

603MPC603R

MPC603R

MPC603R

MPC603RT

Not recommended for new designs. PowerPC ISA

745MPC745B

MPC745B


745MPC745C

MPC745C


755MPC755B

MPC755B

MPC755BT

MPC755B


755MPC755C

MPC755C

MPC755CT

MPC755C


74MPC7410

MPC7410

MPC7410

MPC7410

MPC7410T

MPC7410

MPC7410

MPC7410T

MPC7410T

Features similar to the MPC7400 with 32-/64-bit L2 bus support and direct-mapped SRAM capability. High bandwidth 133 MHz 64-bit MPX/60x bus interface.

Extended temperature range(MPC7410T only): -40°C to 105°C.

Not recommended for new designs.




PowerPC ISA

ROCESSORS ocessorsNote

Packaging Speed(MHz)

AppsMode

Rev Process CoreVoltage

VoltageIO/tol

(V)

SOQ MPQ POQ

R255-ball CBGA (RX)

255-ball CBGA (VG)

255-ball PBGA (ZT)

255-ball CBGA (RX)

200, 266, 300

200, 300

200

200, 266

L

L

L

L

C=2.1

C=2.1

C=2.1

C=2.1

Hip3

Hip3

Hip3

Hip3

2.5 ±5%

2.5 ±5%

2.5 ±5%

2.5 ±5%

3.3, 5

3.3, 5

3.3, 5

3.3, 5

1

1

1

1

60

60

60

1

60

60

300

60

B255-ball PBGA (PX)

255-ball PBGA (VT)

300

300

L

L

E=2.8

E=2.8

Hip4

Hip4

2.0 ±0.1 V

2.0 ±0.1 V

3.3

3.3

1

1

1

1

60

60

C255-ball PBGA (PX)

255-ball PBGA (VT)

350

350

L

L

E=2.8

E=2.8

Hip4

Hip4

2.0 ±0.1 V

2.0 ±0.1 V

3.3

3.3

1

1

44

44

220

220

B360-ball PBGA (PX)

360-ball CBGA (RX)

360-ball CBGA (RX)

360-ball PBGA (VT)

300

300

300

300

L

L

L

L

E=2.8

E=2.8

E=2.8

E=2.8

Hip4

Hip4

Hip4

Hip4

2.0 ±0.1 V

2.0 ±0.1 V

2.0 ±0.1 V

2.0 ±0.1 V

3.3

3.3

3.3

3.3

1

1

0

1

44

1

44

44

220

44

220

220

C360-ball CBGA (RX)

360-ball PBGA (PX)

360-ball CBGA (RX)

360-ball PBGA (VT)

350, 400

350, 400

350, 400

350, 400

L

L

L

L

E=2.8

E=2.8

E=2.8

E=2.8

Hip4

Hip4

Hip4

Hip4

2.0 ±0.1 V

2.0 ±0.1 V

2.0 ±0.1 V

2.0 ±0.1 V

3.3

3.3

3.3

3.3

1

1

1

1

44

44

1

44

220

220

44

220

10360-ball HiCTE (HX)

360-ball HiCTE (VU)

360-ball HiCTE (VU)

360-pad HiCTE (VS)

360-ball HiCTE (HX)

360-ball CBGA (RX)

360-ball CBGA (RX)

360-ball CBGA (RX)

360-ball CBGA (RX)

450, 500

400, 450

450, 500

450, 500

500

400, 450

400, 450, 500

400, 450, 500

400, 450

L

N

L

L

L

N

L

L

N

E=1.4

E=1.4

E=1.4

E=1.4

E=1.4

E=1.4

E=1.4

E=1.4

E=1.4

Hip6

Hip6

Hip6

Hip6

Hip6

Hip6

Hip6

Hip6

Hip6

1.8 ±0.1 V

1.8 ±0.1 V

1.8 ±0.1 V

1.8 ±0.1 V

1.8 ±0.1 V

1.5 ±0.05 V, 1.8 ±0.1 V

1.8 ±0.1 V

1.8 ±0.1 V

1.5 ±0.05 V, 1.8 ±0.1 V

2.5, 3.3

2.5, 3.3

2.5, 3.3

2.5, 3.3

2.5, 3.3

2.5, 3.3

2.5, 3.3

2.5, 3.3

2.5, 3.3

1

1

1

1

1

1

1

1

1

44

44

44

44

44

44

44

44

44

220

220

220

220

220

220

220

220

220

SG1007–14SG1007Q22009

MP

MP

MP

MP

MP

MP

MP

220

220

220

220

220

220

220Extended temperature range(MC7447AT only): -40°C to 105°C.

PowerPC ISA

MP

MP

MP

MP

MP

MP

220

220

220

220

220

220

PowerPC ISA

MP 220 Extended temperature range: -40°C to 105°C.

MP

MP

MP

MP

MP

36

36

36

36

180




PowerPC ISA

No

HOHo

Q POQ Additional Information Architecture

7447AC7447A

C7447A

C7447A

C7447A

C7447A

C7447A

C7447AT

360-ball HiCTE (HX)

360-ball HiCTE (HX)

360-ball HiCTE (VU)

360-ball HiCTE (VU)

360-pad HiCTE (VS)

360-pad HiCTE (VS)

360-ball HiCTE (HX)

600, 733, 867, 1000, 1167

1000, 1267, 1333, 1420

600, 733, 867, 1000, 1167

1000, 1267, 1333, 1420

600, 733, 867, 1000, 1167

1000, 1267, 1333, 1420

1000, 1167

N

L

N

L

N

L

N

B=1.1

B=1.1

B=1.1

B=1.1

B=1.1

B=1.1

B=1.1

Hip7

Hip7

Hip7

Hip7

Hip7

Hip7

Hip7

1.1 V ± 50 mv

1.3 V ± 50 mv

1.1 V ± 50 mv

1.3 V ± 50 mv

1.1 V ± 50 mv

1.3 V ± 50 mv

1.1 ± 0.05 V

2.5

2.5

2.5

2.5

2.5

2.5

2.5

1

1

1

1

1

1

1

44

44

44

44

44

44

44

7448C7448

C7448

C7448

C7448

C7448

C7448

360-ball HiCTE (HX)

360-ball HiCTE (VU)

360-pad HiCTE (VS)

360-ball HiCTE (HX)

360-ball HiCTE (VU)

360-pad HiCTE (VS)

600, 667, 867, 1000, 1250, 1267, 1400

600, 667, 867, 1000, 1250, 1267, 1400

600, 667, 867, 1000, 1250, 1267, 1400

1000, 1420, 1600, 1700

1000, 1420, 1600, 1700

1000, 1420, 1600, 1700

N

N

N

L

L

L

D=2.2

D=2.2

D=2.2

D=2.2

D=2.2

D=2.2

Hip8 90 nm SOI

Hip8 90 nm SOI

Hip8 90 nm SOI

Hip8 90 nm SOI

Hip8 90 nm SOI

Hip8 90 nm SOI

1.0 to 1.1 ± 0.05 V

1.0 to 1.1 ± 0.05 V

1.0 to 1.1 ± 0.05 V

1.2 to 1.3 ± 0.05 V

1.2 to 1.3 ± 0.05 V

1.2 to 1.3 ± 0.05 V

1.5, 1.8, 2.5

1.5, 1.8, 2.5

1.5, 1.8, 2.5

1.5, 1.8, 2.5

1.5, 1.8, 2.5

1.5, 1.8, 2.5

TBD

TBD

TBD

TBD

TBD

TBD

44

44

44

44

44

44

C7448T 360-ball HiCTE (HX) 1000, 1267, 1400 N D=2.2 Hip8 90 nm SOI 1.0 to 1.1 ± 0.05 V 1.5, 1.8, 2.5 TBD 44

7457C7457

C7457

C7457

C7457

C7457T

484-ball CBGA (VG)

484-ball CBGA (VG)

484-ball CBGA (RX)

484-ball CBGA (RX)

484-ball CBGA (RX)

867, 1000

867, 1000, 1267

867, 1000

867, 1000, 1267

1000

N

L

N

L

N

C=1.2

C=1.2

C=1.2

C=1.2

C=1.2

Hip7

Hip7

Hip7

Hip7

Hip7

1.1 ± 0.05 V

1.3 ± 0.05 V

1.1 ± 0.05 V

1.3 ± 0.05 V

1.1 V ± 0.05 V

1.8, 2.5

1.8, 2.5

1.8, 2.5

1.8, 2.5

1.8, 2.5

1

1

1

1

0

36

36

36

36

36

te: VU, VS, VT, VG are RoHS compliant packages.

ST PROCESSORS (continued)st ProcessorsNote (continued)

Product Packaging Speed(MHz)

AppsMode

Rev Process CoreVoltage

VoltageIO/tol

(V)

SOQ MP

SG1007–15SG1007Q22009

MCF5XProduct Packaging Rev Additional Information

MCF51JM6 80 LQFP64 QFP64 LQFP44 LQFP

n/a CAN

MCF51JM1 80 LQFP64 QFP64 LQFP44 LQFP

n/a CAN

MCF5208 160-pin QFP196-ball

MAPBGA

n/a 32x32 EMAC, QSPI, I2C,Production Q4 2005.

MCF5234 256-ball MAPBGA

n/a 16-CH eTPU.


n/a 16-CH eTPU, Crypto Enabled.

MCF5270

MCF5270

160-pin QFP

196-ball MAPBGA

n/a

n/a

32x32 EMAC, QSPI, I2C.

32x32 EMAC, QSPI, I2C.

MCF5271

MCF5271

160-pin QFP

196-ball MAPBGA

n/a

n/a

Hardware Encryption, 32x32 EMAC, QSPI, I2C.

Hardware Encryption, 32x32 EMAC, QSPI, I2C.


n/a MAC, HW divide, BDM, 4 TDM GCI/IDL ports, software HDCL module, QSPI, 3 PWMs, 5 V tolerant I/O.


n/a 32 x 32 EMAC, QSPI, I2C.

MCF5274L 196-ball MAPBGA



n/a Hardware Encryption, 32 x 32 EMAC, QSPI, I2C.

MCF5275L 196-ball MAPBGA



n/a Enhanced CAN 2.0B controller. Flashless version of MCF5282.


n/a Enhanced CAN 2.0B controller, 256 KB Flash. This product incorporates SuperFlash® technology licensed From SST.

XX PRODUCT FAMILYCore Dhrys 2.1

MIPS @ max MHz

Processor Cache (KB)

ProcessorSRAM(KB)

SerialInterface,

UART

Timers/CS/

GPIO

DMA DRAMController

FEC/USB/PCI OperatingVoltage

(V)

OperatingFrequency

(MHz)

Temp

4 V1 46 n/a 16 2SCI, 2IIC, 2SPI

8/0/up to 66 n/a n/a USB 2.0 FS OTG

2.7~5.5 50 -40°C to +105°C

28 V1 46 n/a 8 2SCI, 2IIC, 2SPI

8/0/up to 66 n/a n/a USB 2.0 FS OTG

2.7~5.5 50 -40°C to +105°C

V2 159 8 Config. I/O 16 3 UARTs 8/8/up to 50 16 DDR/SDR One 10/100 1.5, 2.5, 3.3 166 -40°C to +85°C

V2 142 8 Config. 64 3 UARTs 24/8/up to 142 4-CH SDRAM 1x 10/100,1x CAN

1.5, 3.3 100, 150 -40°C to +85°C

V2 142 8 Config. 64 3 UARTs 24/8/up to 142 4-CH SDRAM 1x 10/100, 2x CAN

1.5, 3.3 100, 150 -40°C to +85°C

V2

V2

96

96

8 Config. I/D

8 Config. I/D

64

64

3 UARTs

3 UARTs

8/8/up to 39

8/8/up to 61

4-CH

4-CH

SDRAM

SDRAM

One 10/100

One 10/100

1.5, 3.3

1.5, 3.3

100

100

0°C to 70°C

0°C to 70°C

V2

V2

96

96

8 Config. I/D

8 Config. I/D

64

64

3 UARTs

3 UARTs

8/8/up to 39

8/8/up to 61

4-CH

4-CH

SDRAM

SDRAM

One 10/100

One 10/100

1.5, 3.3

1.5, 3.3

100

100

-40°C to +85°C

0°C to 70°C

V2 63 1 I 4 10/100 FEC,

2 UARTs, USB, QSPI

4/8/up to 32 2-CH SDRAM MAC/MAC +PHY

3.3 66 -40°C to +85°C

V2 159 16 Config. I/D 64 3 8/8/up to 69 4-CH DDR Two 10/100, USB 2.0

Full-Sp Device

1.5, 2.5, 3.3 166 0°C to 70°C

V2 159 16 Config. I/D 64 3 8/8/up to 61 4-CH DDR One 10/100, USB 2.0

Full-Sp Device

1.5, 2.5, 3.3 166 0°C to 70°C

V2 159 16 Config. I/D 64 3 8/8/up to 69 4-CH DDR Two 10/100, USB 2.0

Full-Sp Device

1.5, 2.5, 3.3 166 -40°C to 85°C

V2 159 16 Config. I/D 64 3 8/8/up to 61 4-CH DDR One 10/100, USB 2.0

Full-Sp Device

1.5, 2.5, 3.3 166 -40°C to 85°C

V2 63 2 I 64 3 UARTsI2C, QSPI, FlexCAN

4 Timers, +4 DMA Timers,

7 Chip Sel., Up to 150 I/O's

4-CH SDRAM MAC (FEC)/n/a 3.3, 5 66, 80 -40°C to 85°C

V2 54 2 I 64 3 UARTsI2C, QSPI, FlexCAN


7 Chip Sel., Up to 150 I/Os

4-CH SDRAM MAC (FEC)/n/a 3.3, 5 66, 80 -40°C to 85°C

SG1007–16SG1007Q22009

MC to 85°C 256-ball MAPBGA

n/a Enhanced CAN 2.0B controller, 512 KB Flash. This product incorporates SuperFlash® technology licensed From SST.






n/a Hardware Encryption, 32 x 32 EMAC, QSPI, I2C, One CAN.

MC to 85°C 160 QFP n/a 32 x 32 EMAC, QSPI, I2C.



MC to 85°C 160 QFP n/a Hardware Encryption, 32 x 32 EMAC, QSPI, I2C.



MC to 70°C 388-ballTEPBGA

n/a DSPI, I2C, MMU, FPUContact an authorized sales representative for product status and additional information.


n/a DSPI, I2C, MMU, FPU, Hardware Encrypted. Contact an authorized sales representative for product status and additional information.







Mmp Packaging Rev Additional Information

F5282 V2 54 2 I 64 3 UARTsI2C, QSPI, FlexCAN


7 Chip Sel., Up to 150 I/Os

4-CH SDRAM MAC (FEC)/n/a 3.3, 5 66, 80 -40°C

F5327 V3 200 16K Unified Cache

32 3 8/6/up to 94 16-CH DDR One USB 2.0 Full-Sp Host One USB 2.0 Full-Sp Device

1.5, 3.3 240 -40°C


32 3 8/6/up to 94 16-CH DDR One 10/100One USB 2.0 Full-Sp Host One USB 2.0 Full-Sp Device

1.5, 3.3 240 -40°C



1.5, 3.3 240 -40°C


32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 180 -40°C

F5372L V3 200 16K Unified Cache


1.5, 3.3 240 -40°C


32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 180 -40°C

F5373L V3 200 16K Unified Cache


1.5, 3.3 240 -40°C

F5470 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, PCI

1.5, 2.5, 3.3 200 0°C

F5471 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, PCI

1.5, 2.5, 3.3 200 0°C

F5472 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One 10/100, USB 2.0D, PCI

1.5, 2.5, 3.3 200 0°C

F5473 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One10,100, USB 2.0D, PCI

1.5, 2.5, 3.3 200 0°C

F5474 V4e 410 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, USB 2.0D, PCI

1.5, 2.5, 3.3 266 0°C

CF5XXX PRODUCT FAMILY (continued)Product Core Dhrys 2.1

MIPS @ max MHz


ProcessorSRAM(KB)

SerialInterface,

UART

Timers/CS/

GPIO

DMA DRAMController


(V)

OperatingFrequency

(MHz)

Te

SG1007–17SG1007Q22009

MCF5475 388-ballTEPBGA



n/a Two CAN, DSPI, I2C, MMU, FPUContact an authorized sales representative for product status and additional information.


n/a Two CAN, DSPI, I2C, MMU, FPU, Hardware Encrypted. Contact an authorized sales representative for product status and additional information.









NETWOProduc I/O Voltage Packaging

MC926032 3.3 or 2.5 256-ball MAPBGA

MC926043 3.3 or 2.5 196-ball MAPBGA

Notes:1. Verifica2. MC9263. MC926

MCF5XProduct Packaging Rev Additional Information

V4e 410 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, USB 2.0D, PCI

1.5, 2.5, 3.3 266 0°C to 70°C

V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, PCI

1.5, 2.5, 3.3 166 -40°C to 85°C

V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, PCI

1.5, 2.5, 3.3 166 -40°C to 85°C

V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One 10/100, USB 2.0D, PCI

1.5, 2.5, 3.3 166 -40°C to 85°C

V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One 10/100, USB 2.0D, PCI

1.5, 2.5, 3.3 166 -40°C to 85°C


1.5, 2.5, 3.3 200 -40°C to 85°C


1.5, 2.5, 3.3 200 -40°C to 85°C

RK TRANSCEIVERS — GIGABIT SERDES TRANSCEIVERSNote

t Description Max Data Rate Power Dissipation (Typ)

Quad Gigabit Ethernet Transceiver (1000 Base-X) 1.25 Gbaud 1000 mW

Dual Gigabit Ethernet Transceiver (1000 Base-X) 1.25 Gbaud 600 mW

tion boards are available to facilitate the use and evaluation of the Quad Gigabit Transceivers03DVB Evaluation Board for MC92603.04DVB Evaluation Board for MC92604.

XX PRODUCT FAMILY (continued)Core Dhrys 2.1

MIPS @ max MHz


ProcessorSRAM(KB)

SerialInterface,

UART

Timers/CS/

GPIO

DMA DRAMController


(V)

OperatingFrequency

(MHz)

Temp

SG1007–18SG1007Q22009

SO68

Interface HostPlatforms

LanguageSupport

CompilerOutput

Formats

CW ISA Windows2000/XP

C/C++, EC++, andPowerPC

ISA,Assembly

ELF/DWARF 1.0,Freescale

SemiconductorS-Record

CW p and Ethernet Tap Linux n/a n/a

CW p and Ethernet Tap Linux n/a n/a

CW Linux n/a n/a

CW Linux n/a n/a

CW 00, P&E Microcomputer acraigor System BDM

Windows 2000/XP

C/C++, Assembly

DWARF1, DWARF2,

STABS

CW Windows 2000/XP

C/C++, Assembly

DWARF1, DWARF2,

STABS

CW n/a n/a n/a

CW n/a n/a n/a

CW n/a n/a n/a

Fo eescale Semiconductor distributor.

FTWARE AND DEVELOPMENT TOOLSK, ColdFire®, MPC5xx and PowerPC ISA — CodeWarrior™

Product Description TargetSupport

RTOSSupport

BoardSupport

Host-Target

S-PPC-CMWFL-CX CodeWarrior™ forPowerPC ISA

PowerPC ISA QNX Neutrino; RTXC from Lineo; Embedix SDK from

Lineo, Precise MQX, ATI Nucleus

n/a PowerPC

S-PPC-LLPLT-CX CodeWarrior™ Development Studio for PowerPC ISA, Linux

Platform Development

PowerPC ISA Linux PowerQUICC® I, II, III and Embedded Host

CodeWarrior™ USB Ta

S-PPC-LLAPP-CX CodeWarrior™ Development Studio for PowerPC ISA, Linux

Application Development

PowerPC ISA Linux PowerQUICC® I, II, III and Embedded Host

CodeWarrior™ USB Ta

S-MCF-LLPLT-CX CodeWarrior™ Development Studio for ColdFire® ISA, Linux

Platform Development

M5282, M5272 Linux M5282 n/a

S-MCF-LLAPP-CX CodeWarrior™ Development Studio for ColdFire® ISA, Linux

Application Development

M5282, M5272 Linux M5282 n/a

S-MPC-5XX-CX CodeWarrior™ Development Studio for MPC5xx,

Node-locked

MPC555, MPC56x Quadros RTXC, Embedix SDK, MQX

Embedded, ATI Nucleus,

OSEKturbo

MPC555PBSLK, MPC564EVB, MPC565EVB

PowerTAP, Abatron BDI 20CABLEPPC (BDM only), M

S-MPC-5500B-CX CodeWarrior™ Development Studio for MPC55xx, Build only

tools, Node-locked license

MPC55xx n/a n/a n/a

S-MCF-PROED-CX CodeWarrior™ for ColdFire®, Professional Edition

n/a n/a n/a n/a

S-MCF-STDED-CX CodeWarrior™ for ColdFire®, Standard Edition

n/a n/a n/a n/a

S-68K CodeWarrior™ for 68K,Full Product

n/a n/a n/a n/a

r information on all available CodeWarrior™ editions, visit www.freescale.com/codewarrior or contact your local Freescale Semiconductor Sales Office or authorized Fr

SG1007–19SG1007Q22009

SOFTWHardwaNetcomm

Pr escriptionQUICCstartMPC8XX

MPC83XXMPC85XX

MPC8641

ApplicatioM683XX MC68EN302RC25

MC8610 MPC8XX FADS)

MPC7448 m

MPC82XX

d for ADS

MPC83XX

ily (Rev 2.X Silicon)

ARE AND DEVELOPMENT TOOLSre Tools unication Hardware Tools oduct Family Device Supported Part Number D Evaluation Systems

MPC885 CWH-PPC-885XN-VX MPC855 Quickstart Evaluation System

MPC8343 CWH-PPC-8343N-VE MPC8343 Quickstart Evaluation SystemMPC8540 CWH-PPC-8540N-VE MPC8540 Quickstart Evaluation System

MPC8555 CWH-PPC-8555N-VE MPC8555 Quickstart Evaluation System

MPC8641D PCEVALHPC-8641DE ATX form factor evaluation board for 8641D

n Development SystemsMC68EN302 M68302FADS-ENA Ethernet Adaptor Card, M68302FADS comes with

MC8610 PPCEVALHPCD-8610E ATX Evaluation Platform for MC8610MPC823 MPC823FADS MPC823 Family Application Development System (

MPC850 MPC850SRFADS MPC850 Family Development System

MPC860 MPC866ADS MPC860/62/66 Development System with Wiretap

MPC862 MPC866ADS MPC860/62/66 Development System with Wiretap

MPC7448 MCEVALHPC2-7448E Hardware and Software Complete Evaluation Syste

MPC866 MPC866ADS MPC860/62/66 Development System with WiretapMPC852T MPC852TADS MPC852T Development System with Wiretap

MPC853T TBD TBD

MPC885 Family MPC885ADS MPC885 Family Development System with Wiretap

8260/70/80 – 480-pin TBGA PQ2FADS-ZU PQ2 Family Application Development System

8260/70/80 – 516-pin PBGA PQ2FADS-VR PQ2 Family Application Development System

8272 Family MPC8272ADS 8272 Family Application Development SystemAll PQ2 MPC8260ADS-TCOM MPC8260 T1/T3 Communication Companion Boar

MPC8313E Family MPC8313E-RDB MPC8313E Reference Design Board

MPC8323E Family MPC8323xE-MDS-PB Pb-free Processor Board

MPC8349E Family MPC8349EA-MDS PowerQUICC® II Pro Development System

MPC8349EA-MDS-PB Pb-free Processor Board (DDR-II only)

PQ-MDS-PIBE Platform Board I/O for PowerQUICC® II Pro Family

PQ-MDS-PMCPCI PMC Cards for PowerQUICC® II Pro FamilyPQ-MDS-USB USB Cards for PowerQUICC® II Pro Family

MPC8360E Family MPC8360EA-MDS-PB MDS Pb-Free Processor Board for MPC8360E Fam

PQ-MDS-T1E TI/E1 Card for MPC8360E Family

PQ-MDS-QOC3 QUAD OC-3 ATM Card for MPC8360E Family

MPC8377E MPC8377E-MDS-PB MPC8377E Modular Development System

MPC8378E MPC8378E-MDS-PB MPC8378E Modular Development SystemMPC8379E MPC8379E-MDS-PB MPC8379E Modular Development System

SG1007–20SG1007Q22009

DescriptionMP m

ystem

nt System

m

ystem

IntMP r IBM PC

C860 Development Systems

MP

MiMP

MP

SaMP

MIMP

ial

MPMP

ReMP ay Reference Design

SOHaNe

Product Family Device Supported Part NumberC85XX 8540 MPC8540ADS-BGA PQ3 8540 Application Development Syste

8548 MPC8548CDS PQ3 MPC8548E Modular Development S

8555 MPC8555CDS PQ3 MPC8555E Configurable Developme

8560 MPC8560ADS-BGA PQ3 8560 Application Development Syste

8568 MPC8568E-MDS-PB PQ3 MPC8568E Modular Development S8572 PPCEVAL-DS-8572B PQ3 8572 Development System

erface KitsC8XX MPC8xx, MC683xx MPC860ADI-PC Application Development Interface (ADI) fo

MPC885 MPC885-FLASH Flash Chip for MPC885ADSMPC850SR, MPC860SR MPC860SR-PHY ATM PHY Board for the MPC850 and MP

C82XX All PQ2 MPC8260ADI-COP ADI to COP Converter

All PQ2 MPC8260ADS-FLASH Flash Chip for 8260ADS

All PQ2 MPCRCOP-3V COP Interface

crocode PackagesC8XX MPC860, MPC855T MPC860SWSS7-DOS Signaling System 7 Microcode

C82XX All with PQ2/PQ3 CPM MPC8260SW-FDS Fast Data Switching (FDS)

All with PQ2/PQ3 CPM MPC8260SW-MSP Multiservice Platform (MSP)

All with PQ2/PQ3 CPM MPC8260SW-ESS7 Enhanced SS7 (ESS7)

All with PQ2/PQ3 CPM MPC8260SW-EAAL2 Enhanced AAL2 (EAAL2)

ndpoint BoardsC824X MPC8240 PPCEVAL-SP3-8240 Sandpoint with 8240 PMC

MPC8241 PPCEVAL-SP3-8241 Sandpoint with 8241 PMC

MPC8245 PPCEVAL-SP3-8245 Sandpoint with 8245 PMC

MPC8245 PPCDEV-SP3-8245 Sandpoint Dev with PMC

TXE BoardsC8349E Family MPC8349E MPC8349-MITXE MPC8349 Mini-ITX System Board

MPC8349-MITX-GP MPC8349 Mini-ITX System Board Industr

C8377E Family MPC8377E MPC8377E-RDB MPC837E Mini-ITX System BoardC8379E Family MPC8379E MPC8379E-RDB MPC8379E Mini-ITX System Board

ference Design BoardsC8323E Family MPC8323E MPC8323E-RDB MPC8323E Integrated Multiservice Gatew

FTWARE AND DEVELOPMENT TOOLSrdware Tools (continued)tcommunication Hardware Tools (continued)

SG1007–21SG1007Q22009

SOFTWThird Pa

Third ds and tems

Support Chips

Drivers / Protocol Stacks

Application Framework

Software Components

Abatron

Agilent Tech

ALT Softwar •

Altium

Apogee Sof

Artis Micros •

Ashley Laure •

Blunk Micro •

Cadence

CoWare

CMX System

CodeSource

Corelis

Crescent Ba

Curtiss-Wrig •

Data Conne •

Effnet •

Embedded P •

Emerson •

EmuTec

Enea Embed

Eureka Tech •

Everbee Net •

Express Log

Falconstor •

Flextronics • •

Freescale • • • • •

FSMLabs

GDA Techno •

Genesi •

Green Hills •

IneoQuest T

International

Intoto

IP Infusion •

Isystem

JMI Software •

Jungo •

Kadak

Kapersky La •

ARE AND DEVELOPMENT TOOLS (continued)rty Tools and Solutions

Party Vendor Families Supported Operating Systems

Compilers and Code Generation

Tools

Software Debuggers

Coverification Tools and Simulation

Models

Emulators and Diagnostic Tools

Logic Analyzers

BoarSysPowerQUICC® Host Proc DSP

• • • •

nologies • • • •

e •

• • •

tware • •

ystems • •

nt •

systems • •

•

s • • • •

ry • • •

• • • •

y Software • •

ht •

ction •

•

lanet •

•

• • •

ded Technologies • • • •

nology • •

works •

ic • • •

•

•

• • • • • •

• • •

logies • •

• •

Software • • • • • •

echnologies • •

Test Technologies • •

•

•

• • •

• •

• •

• • •

bs •

SG1007–22SG1007Q22009

NOTES

SG1007–23SG1007Q22009

NOTES

How to Reach Us:

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SG1007Q22009Rev 04/2009

network and communications processors, sg1007

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