materials declaration form representative * giovanni giacopello representative title representative...
TRANSCRIPT
IPC 1752
Form Type * Distribute
Sectionals * Material Info Subsectionals * Manufacturing Info
Company Name * STMicroelectronics Response Date *
Contact Name * Refer to " Supplier Comment" section Contact Title
Contact Phone * Refer to " Supplier Comment" section Contact Email *
Authorized Representative * Giovanni Giacopello Representative Title
Representative Phone * Refer to " Supplier Comment" section Representative Email *
Supplier Comment
Uncertainty Statement
Supplier Acceptance * true Legal Declaration *
Legal Statement
Refer to " Supplier Comment" section
Refer to " Supplier Comment" section
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available'
basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness,
truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any
kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Materials Declaration Form
A-D
Supplier Information
2014-01-29
Version 2
* : Required Field
AMS & IPD Materials Declaration Champion
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and
belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the
compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this
form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not
independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications
regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If
the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of
that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of
the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form.
Refer to " Supplier Comment" section
Legal Statement
Online Technical Support - STMicroelectronics : http://www.st.com/web/en/support/online_tech_support.html
Standard
Mfr Item Number Mfr Item Name Version Mfr Site Date
A0UQ*WIFI004 A MICROTEL 2014-01-29
Amount UoM Unit type ST ECOPACK Grade
1267.52 mg Each ECOPACK® 1
J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles
3 245 3 after 168 hrs of floor life, may be done a baking at 70°C for 48 hrs
bulk Solder Termination Terminal Plating Terminal Base Alloy Comment
NAC Nickel/Gold (Ni/Au)
Package Designator Size Nbr of instances Shape
xx xx xx NAC
Comment
Manufacturing information
Product
QueryList : ROHS directive 2011/65/EU _ July 2011
Response
true
false
false
false
false
false
Exemption Id.
Response
true
CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product
Query
Product(s) is obsolete, no information is available
Product(s) does not meet EU RoHS requirements and is not under exemptions
Product(s) meets EU RoHS requirements by application of the selected exemption(s)
Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
Description
The product does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH
Query
QueryList :REACH-20th June 2013
Product(s) is unknown, no information is available
Product(s) meets EU RoHS requirement without any exemptions
Mfr Item Name 1267.518 21085360 998650
Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in
homogeneous
material (ppm)
Concentration in
product (ppm)
CW110001UKTM 12.213 mg supplier die Silicon (Si) 7440-21-3 11.492 mg 699154 9085
CW110001UKTM supplier metallization Aluminium (Al) 7429-90-5 0.03 mg 5473 24
CW110001UKTM supplier metallization Copper (Cu) 7440-50-8 0.184 mg 33571 145
CW110001UKTM supplier metallization Tantalum (Ta) 7440-25-7 0.031 mg 5656 25
CW110001UKTM supplier metallization Titanium (Ti) 7440-32-6 0.009 mg 1642 7
CW110001UKTM supplier metallization Tungsten (W) 7440-33-7 0.001 mg 182 1
CW110001UKTM supplier metallization Nickel (Ni) 7440-02-0 0.001 mg 61 1
CW110001UKTM supplier passivation Silicon Nitride (SiN) 68034-42-4 0.042 mg 2555 33
CW110001UKTM supplier passivation Silicon Oxide(SiO2) 7631-86-9 0.142 mg 8639 112
CW110001UKTM supplier passivation Polyamide Proprietary 0.089 mg 5415 70
CW110001UKTM supplier passivation Gamma-butyrolactone 96-48-0 0.154 mg 9369 122
CW110001UKTM supplier passivation Propylene Glycol Monomethyl Ether Acetate 108-65-6 0.016 mg 973 13
CW110001UKTM supplier passivation Organosilan Compound(s) Proprietary 0.008 mg 487 6
CW110001UKTM supplier passivation fluorinated compound 7782-41-4 0.014 mg 852 11
CW110001UKTM 0.704 mg supplier UBM Copper (Cu) 7440-50-8 0.449 mg 27316 355
CW110001UKTM supplier UBM Titanium (Ti) 7440-32-6 0.006 mg 365 5
CW110001UKTM supplier UBM Nickel (Ni) 7440-02-0 0.249 mg 15149 197
CW110001UKTM 3.52 mg supplier bump Tin (Sn) 7440-31-5 3.365 mg 204721 2660
CW110001UKTM supplier bump Silver (Ag) 7440-22-4 0.134 mg 8152 106
CW110001UKTM supplier bump Copper (Cu) 7440-50-8 0.021 mg 1278 17
STLQ50C25R 0.27 mg supplier Silicon Die Silicone (Si) 7440-21-3 0.27 mg 49252 213
STLQ50C25R 1.668 mg supplier Alloy Copper 7440-50-8 1.607 mg 293141 1270
STLQ50C25R supplier Alloy Iron 7439-89-6 0.038 mg 6932 30
STLQ50C25R supplier Alloy Zinc 7440-66-6 0.002 mg 365 2
STLQ50C25R supplier Alloy Nickel 7440-02-0 0.019 mg 3466 15
STLQ50C25R supplier Alloy Palladium 7440-05-3 0.002 mg 365 2
STLQ50C25R 0.061 mg supplier Glue Silver 7440-22-4 0.049 mg 8938 39
STLQ50C25R supplier Glue Carbocyclic Acrylates proprietary 0.006 mg 1094 5
STLQ50C25R supplier Glue Bismaleimide resin proprietary 0.002 mg 365 2
STLQ50C25R supplier Glue 2-preponoic acid, 2-methyl 68586-19-6 0.002 mg 365 2
STLQ50C25R supplier Glue Additive proprietary 0.002 mg 365 2
STLQ50C25R 0.02 mg supplier Bonding Wire Au 7440-57-5 0.02 mg 3648 16
STLQ50C25R 3.463 mg supplier Molding Compound Epoxy Resin-1 (0.5-6%) Proprietary 0.104 mg 18971 82
STLQ50C25R supplier Molding Compound Epoxy Resin-2 (1-5%) Proprietary 0.104 mg 18971 82
STLQ50C25R supplier Molding Compound Phenol resin (3-6%) Proprietary 0.155 mg 28274 123
STLQ50C25R supplier Molding Compound Silica (82-94%) 60676-86-0 3.024 mg 551623 2391
STLQ50C25R supplier Molding Compound Carbon Black (0.2%) 1333-86-4 0.007 mg 1277 6
STLQ50C25R supplier Molding Compound Others (max2%) Proprietary 0.069 mg 12587 55
STM32F103REY6 31.803 mg supplier Die Silicon 7440-21-3 31.803 mg 652235 25141
STM32F103REY6 9.878 mg supplier Coating Chem (HD4100) Polyamide resin 63428-83-1 8.198 mg 168130 6481
STM32F103REY6 supplier Coating Chem (HD4100) acrylate ester Proprietary 0.988 mg 20263 781
STM32F103REY6 supplier Coating Chem (HD4100) Tetraethylene glycol dimethacrylate 109-17-1 0.494 mg 10131 391
STM32F103REY6 supplier Coating Chem (HD4100) 4,4' - Oxybisdiphthalic anhydride 1823-59-2 0.198 mg 4061 157
STM32F103REY6 0.008 mg supplier Ti End Target Titanium 7440-32-6 0.008 mg 164 6
STM32F103REY6 0.062 mg supplier NiV End Target Ni 7440-02-0 0.057 mg 1169 45
STM32F103REY6 supplier NiV End Target Vanadium 7440-62-2 0.005 mg 103 4
STM32F103REY6 0.132 mg supplier Cu End Target Copper 7440-50-8 0.132 mg 2707 104
STM32F103REY6 0.075 mg supplier AlCu End Target Aluminum 7429-90-5 0.002 mg 41 2
STM32F103REY6 Supplier AlCu End Target Copper 7440-50-8 0.073 mg 1497 58
STM32F103REY6 6.802 mg Supplier Solder Balls (SAC405) Tin 7440-31-5 6.496 mg 133224 5135
STM32F103REY6 Supplier Solder Balls (SAC405) Silver 7440-22-4 0.272 mg 5578 215
STM32F103REY6 Supplier Solder Balls (SAC405) Copper 7440-50-8 0.034 mg 697 27
STLQ50C18R 0.276 mg Supplier Silicon die Silicon (Si) 7440-21-3 0.27 mg 49261 213
STLQ50C18R Supplier Passivation Gamma-butyrolactone 96-48-0 0.002 mg 365 2
STLQ50C18R Supplier Passivation Polyhydroxyamide 55295-98-2 0.001 mg 182 1
STLQ50C18R Supplier Back side metallization Nickel (Ni) 7440-02-0 0.002 mg 365 2
STLQ50C18R Supplier Back side metallization Gold (Au) 7440-57-5 0.001 mg 182 1
STLQ50C18R 2.683 mg Supplier Alloy Copper 7440-50-8 2.585 mg 471629 2043
STLQ50C18R Supplier Alloy Iron 7439-89-6 0.061 mg 11129 48
A0UQ*WIFI004Material Composition Declaration
STLQ50C18R Supplier Alloy Iron Phosphide(FeP) 26508-33-8 0.001 mg 182 1
STLQ50C18R Supplier Alloy Zinc 7440-66-0 0.003 mg 547 2
STLQ50C18R Supplier Coating Nickel 7440-02-0 0.03 mg 5473 24
STLQ50C18R Supplier Coating Palladium 7440-05-3 0.003 mg 547 2
STLQ50C18R 0.052 mg Supplier Glue Silver 7440-22-4 0.041 mg 7480 32
STLQ50C18R Supplier Glue Carbocyclic Acrylates proprietary 0.005 mg 912 4
STLQ50C18R Supplier Glue Bismaleimide resin proprietary 0.002 mg 365 2
STLQ50C18R Supplier Glue 2-preponoic acid, 2-methyl 68586-19-6 0.002 mg 365 2
STLQ50C18R Supplier Glue Additive proprietary 0.002 mg 365 2
STLQ50C18R 0.051 mg Supplier Bonding wire Gold (Au) 7440-57-5 0.051 mg 9305 40
STLQ50C18R 2.421 mg Supplier Molding compound MP8000C Epoxy resin-1 Proprietary 0.073 mg 13319 58
STLQ50C18R Supplier Molding compound MP8000C Epoxy resin-2 Proprietary 0.073 mg 13319 58
STLQ50C18R Supplier Molding compound MP8000C Phenol resin Proprietary 0.11 mg 20069 87
STLQ50C18R Supplier Molding compound MP8000C Silica 60676-86-0 2.16 mg 394089 1708
STLQ50C18R Supplier Molding compound MP8000C Carbon Black 1333-86-4 0.005 mg 912 4
Capacitor 1 14.623 mg Supplier Ceramic Zirconium oxide 1314-23-4 4.725 mg 323121 3735
Capacitor 1 Supplier Ceramic Calcium oxide 1305-78-8 3.78 mg 258497 2988
Capacitor 1 Supplier Ceramic Misc Proprietary 0.945 mg 64624 747
Capacitor 1 Supplier metallisation Nickel 7440-02-0 2.696 mg 184367 2131
Capacitor 1 Supplier metallisation Copper 7440-50-8 1.663 mg 113725 1315
Capacitor 1 Supplier Glass Silicon dioxide 7631-86-9 0.146 mg 9984 115
Capacitor 1 Supplier Glass diboron trioxide; boric oxide 1303-86-2 0.037 mg 2530 29
Capacitor 1 supplier metallisation Nickel 7440-02-0 0.174 mg 11899 138
Capacitor 1 supplier metallisation Tin 7440-31-5 0.457 mg 31252 361
Capacitor 2 7.037 mg supplier Ceramic Zirconium oxide 1314-23-4 1.834 mg 260622 1450
Capacitor 2 supplier Ceramic Calcium oxide 1305-78-8 1.834 mg 260622 1450
Capacitor 2 supplier Ceramic Silica 7631-86-9 0.448 mg 63663 354
Capacitor 2 supplier Ceramic Misc Proprietary 0.448 mg 63663 354
Capacitor 2 supplier metallisation Copper 7440-50-8 1.727 mg 245417 1365
Capacitor 2 supplier Glass Silicon dioxide 7631-86-9 0.128 mg 18190 101
Capacitor 2 supplier Glass diboron trioxide; boric oxide 1303-86-2 0.043 mg 6111 34
Capacitor 2 supplier metallisation Nickel 7440-02-0 0.149 mg 21174 118
Capacitor 2 supplier metallisation Tin 7440-31-5 0.426 mg 60537 337
Resistors 1.186 supplier Substrate Al2O3 1344-28-1 0.91 mg 767285 719
Resistors supplier Substrate SiO2 7631-86-9 0.021 mg 17707 17
Resistors supplier Substrate MgO 1309-48-4 0.021 mg 17707 17
Resistors supplier Inner electrode (C1) Ag 7440-22-4 0.021 mg 17707 17
Resistors supplier Inner electrode (C2) Ag 7440-22-4 0.028 mg 23609 22
Resistors supplier Resistive layer RuO2 12036-10-1 0.007 mg 5902 6
Resistors supplier Termination (barrier) Ni 7440-02-0 0.1 mg 84317 79
Resistors supplier Termination (barrier) Sn 7440-31-5 0.05 mg 42159 40
Resistors supplier Primary glass Glass Frit 65997-18-4 0.007 mg 5902 6
Resistors supplier Overcoat II Epoxy resin 25068-38-6 0.021 mg 17707 17
Antenna 18.72 mg supplier glass Glass Cloth 65997-17-3 11.232 mg 589081 6899
Antenna supplier Termination Copper (Cu) 7440-50-8 2.808 mg 147270 1725
Antenna supplier resin Epoxy 26265-8-7 4.68 mg 245450 2875
Antenna 0.16 mg supplier ink Epoxy Acrylate Oligomer proprietary 0.048 mg 2517 29
Antenna supplier ink Epoxy Resin proprietary 0.016 mg 839 10
Antenna supplier ink Acrylate Resin proprietary 0.008 mg 420 5
Antenna supplier ink Pigment 147-14-8 0.002 mg 105 1
Antenna supplier ink Inoganic Fillers 7727-43-7 0.046 mg 2413 28
Antenna supplier ink Ether glycol Solvent 112-15-2 0.024 mg 1259 15
Antenna supplier ink Solvent Naphta 8030-30-6 0.016 mg 839 10
Antenna 0.187 mg supplier Tin New Jersey(#9099) proprietary 0.029 mg 1521 18
Antenna supplier Tin Water 7732-18-5 0.132 mg 6923 81
Band Pass filter (LFB182G45SG9B740) 4.062 mg supplier Ceramic Zirconium oxide 1313-97-9 2.945 mg 725012 2328
Band Pass filter (LFB182G45SG9B740) supplier Copper alloy Copper 7440-50-8 1.117 mg 274988 883
Chip Inductor (LQP03TN3N9C02D) 0.178 mg supplier Silver/Silver alloy Silver 7440-22-4 0.04 mg 224719 32
Chip Inductor (LQP03TN3N9C02D) supplier Glass Silicon dioxide 7631-86-9 0.064 mg 359551 51
Chip Inductor (LQP03TN3N9C02D) supplier Glass diboron trioxide 1303-86-2 0.012 mg 67416 9
Chip Inductor (LQP03TN3N9C02D) supplier Glass Aluminium Oxide 1344-28-1 0.045 mg 252809 36
Chip Inductor (LQP03TN3N9C02D) supplier metallization Nickel 7440-02-0 0.008 mg 44944 6
Chip Inductor (LQP03TN3N9C02D) supplier metallization Tin 7440-31-5 0.009 mg 50562 7
Chip Inductor (LL1005-FH1N0S) 0.826 mg supplier Ceramic SiO2 7631-86-9 0.398 mg 481840 315
Chip Inductor (LL1005-FH1N0S) supplier Ceramic MgO 1309-48-4 0.1 mg 121065 79
Chip Inductor (LL1005-FH1N0S) supplier Ceramic Al2O3 1344-28-1 0.021 mg 25424 17
Chip Inductor (LL1005-FH1N0S) supplier Ceramic B2O3 1303-86-2 0.081 mg 98063 64
Chip Inductor (LL1005-FH1N0S) supplier Ceramic (Fe,Mn)(Fe,Mn)2O4 68186-94-7 0.007 mg 8475 6
Chip Inductor (LL1005-FH1N0S) supplier Conductor Ag 7440-22-4 0.051 mg 61743 40
Chip Inductor (LL1005-FH1N0S) supplier Terminal Ag 7440-22-4 0.105 mg 127119 83
Chip Inductor (LL1005-FH1N0S) supplier Terminal Ni 7440-02-0 0.026 mg 31477 21
Chip Inductor (LL1005-FH1N0S) supplier Terminal Sn 7440-31-5 0.037 mg 44794 29
Chip Power Inducor (BRC1608T1R0M) 4.376 mg supplier Ferrite Nickel oxide 1313-99-1 0.324 mg 74040 256
Chip Power Inducor (BRC1608T1R0M) supplier Ferrite Copper oxide 1317-38-0 0.108 mg 24680 85
Chip Power Inducor (BRC1608T1R0M) supplier Ferrite Diiron trioxide 1309-37-1 1.621 mg 370430 1281
Chip Power Inducor (BRC1608T1R0M) supplier Ferrite Zinc oxide 1314-13-2 0.385 mg 87980 304
Chip Power Inducor (BRC1608T1R0M) supplier Electrode Silver 7440-22-4 0.009 mg 2057 7
Chip Power Inducor (BRC1608T1R0M) supplier Electrode Glass Frit Proprietary 0.001 mg 229 1
Chip Power Inducor (BRC1608T1R0M) supplier Electrode2 Silver 7440-22-4 0.018 mg 4113 14
Chip Power Inducor (BRC1608T1R0M) supplier Electrode3 Phenolic Resin 9003-35-4 0.001 mg 229 1
Chip Power Inducor (BRC1608T1R0M) supplier Electrode4 Bisphenol F-type epoxy resin 9003-36-5 0.001 mg 229 1
Chip Power Inducor (BRC1608T1R0M) supplier Electrode metallization Nickel oxide 7440-02-0 0.001 mg 229 1
Chip Power Inducor (BRC1608T1R0M) supplier Electrode metallization Tin 7440-31-5 0.004 mg 914 3
Chip Power Inducor (BRC1608T1R0M) supplier Windingwire Copper 7440-50-8 0.807 mg 184415 638
Chip Power Inducor (BRC1608T1R0M) supplier Insulation coating Polyuretane Foams 9009-54-5 0.025 mg 5713 20
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Bismuth oxide 1304-76-3 0.007 mg 1600 6
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Nickel oxide 1313-99-1 0.085 mg 19424 67
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Copper oxide 1317-38-0 0.017 mg 3885 13
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Bisphenol A Epichlorohydrin Resin 25068-38-6 0.065 mg 14854 51
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Diiron trioxide 1309-37-1 0.569 mg 130027 450
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Zinc oxide 1314-13-2 0.191 mg 43647 151
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Phenolic Resin 9003-35-4 0.046 mg 10512 36
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Epoxi resin Amine adduct 134091-76-2 0.044 mg 10055 35
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Epoxy resin Proprietary 0.035 mg 7998 28
Chip Power Inducor (BRC1608T1R0M) supplier Exterior part with ferrite Catalyst Proprietary 0.012 mg 2742 9
I.C. RF switch (SKY13330-397LF) 9.348 mg supplier EPOXY 2-PREPONOIC ACID 2-METHYL 68586-19-6 0.004 mg 428 3
I.C. RF switch (SKY13330-397LF) supplier EPOXY ADDITIVE Trade Secrete 0.004 mg 428 3
I.C. RF switch (SKY13330-397LF) supplier EPOXY BISMALEIMIDE RESIN Trade Secrete 0.004 mg 428 3
I.C. RF switch (SKY13330-397LF) supplier EPOXY CARBOCYCLIC ACRYLATES Trade Secrete 0.012 mg 1284 9
I.C. RF switch (SKY13330-397LF) supplier EPOXY DICUMLYL PEROXIDE 80-43-3 0.001 mg 107 1
I.C. RF switch (SKY13330-397LF) supplier EPOXY SILVER 7440-22-4 0.098 mg 10484 77
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME COPPER 7440-50-8 2.19 mg 234275 1731
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME IRON 7439-89-6 0.002 mg 214 2
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME MAGNESIUM 7439-95-4 0.003 mg 321 2
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME MANGANESE 7439-96-5 0.001 mg 107 1
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME NICKLE-MATERIAL BASE Trade Secrete 0.08 mg 8558 63
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME SILICON 7440-21-3 0.016 mg 1712 13
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME ZINC 7440-66-6 0.011 mg 1177 9
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME PLATING NICKLE-PLATING PROCESS 7440-02-0 0.026 mg 2781 21
I.C. RF switch (SKY13330-397LF) supplier LEADFRAME PLATING PALLADIUM 7440-05-3 0.002 mg 214 2
I.C. RF switch (SKY13330-397LF) supplier MOLD COMPOUND CARBON BLACK 1333-86-4 0.02 mg 2139 16
I.C. RF switch (SKY13330-397LF) supplier MOLD COMPOUND EPOXY RESIN Trade Secrete 0.2 mg 21395 158
I.C. RF switch (SKY13330-397LF) supplier MOLD COMPOUND PHENOL RESIN Trade Secrete 0.2 mg 21395 158
I.C. RF switch (SKY13330-397LF) supplier MOLD COMPOUND SILICA FUSED 60676-86-0 6.251 mg 668699 4942
I.C. RF switch (SKY13330-397LF) supplier SILICON CHIP SILICON 7440-21-3 0.132 mg 14121 104
I.C. RF switch (SKY13330-397LF) supplier WIRE GOLD 7440-57-5 0.091 mg 9735 72
Shield 253.865 mg supplier Shiled Cu 7440-50-8 64.177 mg 252800 50733
Shield supplier Shiled Sn 7440-31-5 0.004 mg 16 3
Shield supplier Shiled P 12517-41-8 0.005 mg 20 4
Shield supplier Shiled Zn 7440-66-6 172.328 mg 678817 136228
Shield supplier Shiled Ni 7440-02-0 17.171 mg 67638 13574
Shield supplier Shiled Pb 7439-92-1 0.007 mg 28 6
Shield supplier Shiled Fe 7439-89-6 0.173 mg 681 137
IC Low Voltage Comparator (NCX2200GM) 2.079 mg supplier Wire Gold (Au) 7440-57-5 0.02 mg 9620 16
IC Low Voltage Comparator (NCX2200GM) supplier Die Silicon (Si) 7440-21-3 0.102 mg 49062 81
IC Low Voltage Comparator (NCX2200GM) supplier Mould Compound Phenolic resin Proprietary 0.02 mg 9620 16
IC Low Voltage Comparator (NCX2200GM) supplier Mould Compound Metal hydroxide Proprietary 0.02 mg 9620 16
IC Low Voltage Comparator (NCX2200GM) supplier Mould Compound Tetramethylbiphenyl diglycidyl ether 85954-11-6 0.061 mg 29341 48
IC Low Voltage Comparator (NCX2200GM) supplier Mould Compound Phenol Formaldehyde resin 9003-35-4 0.02 mg 9620 16
IC Low Voltage Comparator (NCX2200GM) supplier Mould Compound Silica -amorphous 7631-86-9 0.162 mg 77922 128
IC Low Voltage Comparator (NCX2200GM) supplier Mould Compound Silica fused 60676-86-0 0.528 mg 253968 417
IC Low Voltage Comparator (NCX2200GM) supplier Lead Frame Silicon (Si) 7440-21-3 0.01 mg 4810 8
IC Low Voltage Comparator (NCX2200GM) supplier Lead Frame Copper (Cu) 7440-50-8 1.036 mg 498316 819
IC Low Voltage Comparator (NCX2200GM) supplier Lead Frame Nickel 7440-02-0 0.02 mg 9620 16
IC Low Voltage Comparator (NCX2200GM) supplier Lead Frame Nickel 7440-02-0 0.03 mg 14430 24
IC Low Voltage Comparator (NCX2200GM) supplier Post-plating Tin (Sn) 7440-31-5 0.03 mg 14430 24
IC Low Voltage Comparator (NCX2200GM) supplier Component Aluminium Oxide (Al2O3) 1344-28-1 0.01 mg 4810 8
IC Low Voltage Comparator (NCX2200GM) supplier Component Resin system Proprietary 0.01 mg 4810 8
I.C. Serial Flash (MX25L8006EZUI-12G) 34.475 mg supplier Mold Compound Phenol Resin 205830-20-2 0.517 mg 14996 409
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Mold Compound Biphenyl epoxy resin 85954-11-6 0.388 mg 11255 307
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Mold Compound epoxy resin Proprietary 0.388 mg 11255 307
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Mold Compound carbon black 1333-86-4 0.025 mg 725 20
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Mold Compound silica vitreous 60676-86-0 11.613 mg 336853 9180
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Leadframe Copper (Cu) 7440-50-8 18.189 mg 527600 14379
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Leadframe Iron (Fe) 7439-89-6 0.467 mg 13546 369
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Leadframe Zinc (Zn) 7440-66-6 0.018 mg 522 14
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Leadframe Phosphorus (P) 7723-14-0 0.028 mg 812 22
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Silicon Silicon 7440-21-3 1.949 mg 56534 1541
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Silver 7440-22-4 0.163 mg 4728 129
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Acrylic resin Trade Secret 0.018 mg 522 14
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Polybutadiene derivative Trade Secret 0.009 mg 261 7
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Butadiene copolymer Trade Secret 0.004 mg 116 3
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Epoxy resin Trade Secret 0.005 mg 145 4
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Acrylate Trade Secret 0.012 mg 348 9
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Peroxide Trade Secret 0.002 mg 58 2
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Die Attach Additive Trade Secret 0.004 mg 116 3
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Wire Au 7440-57-5 0.083 mg 2408 66
I.C. Serial Flash (MX25L8006EZUI-12G) supplier Sn plating Sn 7440-31-5 0.593 mg 17201 469
I.C. Quad bus buffer (SN74LVC125ARGYR) 30.098 mg supplier Bond Wire Copper 7440-50-8 0.083 mg 2758 66
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Die Attach Silica 7631-86-9 0.003 mg 100 2
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Die Attach Silver 7440-22-4 0.114 mg 3788 90
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Die Attach Epoxy Proprietary 0.048 mg 1595 38
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Copper 7440-50-8 11.807 mg 392285 9334
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Tin 7440-31-5 0.029 mg 964 23
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Zinc 7440-66-6 0.028 mg 930 22
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Chromium 7440-66-6 0.03 mg 997 24
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Plating Nickel 7440-02-0 0.204 mg 6778 161
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Plating Gold 7440-57-5 0.002 mg 66 2
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Lead Frame Plating Palladium 7440-05-3 0.009 mg 299 7
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Mold Compound Fused Silica 60676-86-0 15.569 mg 517277 12308
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Mold Compound Carbon Black 1333-86-4 0.086 mg 2857 68
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Mold Compound Epoxy Proprietary 1.548 mg 51432 1224
I.C. Quad bus buffer (SN74LVC125ARGYR) supplier Semiconductor Device Silicon 7440-21-3 0.538 mg 17875 425
XTAL (NX2016SA-38) 6.064 mg supplier Cover Silicon 7440-21-3 0.001 mg 174 1
XTAL (NX2016SA-38) supplier Cover Manganese 7439-96-5 0.005 mg 870 4
XTAL (NX2016SA-38) supplier Cover Nickel 7440-02-0 0.322 mg 56039 255
XTAL (NX2016SA-38) supplier Cover Cobalt 7440-48-4 0.188 mg 32718 149
XTAL (NX2016SA-38) supplier Cover Iron 7439-89-6 0.59 mg 102680 466
XTAL (NX2016SA-38) supplier Cover Nickel 7440-02-0 0.174 mg 30282 138
XTAL (NX2016SA-38) supplier Base Aluminum Oxide 1344-28-1 2.268 mg 394709 1793
XTAL (NX2016SA-38) supplier Base Manganese Oxide 1317-34-6 0.083 mg 14445 66
XTAL (NX2016SA-38) supplier Base Silicon Dioxide 7631-86-9 0.079 mg 13749 62
XTAL (NX2016SA-38) supplier Base Molybdenum Oxide 1313-27-5 0.012 mg 2088 9
XTAL (NX2016SA-38) supplier Base Magnesium oxide 1309-48-4 0.007 mg 1218 6
XTAL (NX2016SA-38) supplier Base Molybdenum 7439-98-7 0.59 mg 102680 466
XTAL (NX2016SA-38) supplier Base Iron 7439-89-6 0.415 mg 72224 328
XTAL (NX2016SA-38) supplier Base Nickel 7440-02-0 0.11 mg 19144 87
XTAL (NX2016SA-38) supplier Base Cobalt 7440-48-4 0.131 mg 22798 104
XTAL (NX2016SA-38) supplier Base Silver 7440-22-4 0.324 mg 56387 256
XTAL (NX2016SA-38) supplier Base Copper 7440-50-8 0.057 mg 9920 45
XTAL (NX2016SA-38) supplier Base Nickel (Plating) 7440-02-0 0.223 mg 38810 176
XTAL (NX2016SA-38) supplier Base Cobalt (Plating) 7440-48-4 0.027 mg 4699 21
XTAL (NX2016SA-38) supplier Base Gold (Plating) 7440-57-5 0.038 mg 6613 30
XTAL (NX2016SA-38) supplier Electro Conductive Adhesive Silver 7440-22-4 0.077 mg 13401 61
XTAL (NX2016SA-38) supplier Electro Conductive Adhesive Silicon 7440-21-3 0.025 mg 4351 20
XTAL (NX2016SA-38) supplier Crystal Blank Silicon Dioxide 14808-60-7 0.287 mg 49948 227
XTAL (NX2016SA-38) supplier Evaporation Gold 7440-57-5 0.03 mg 5221 24
XTAL (NX2016SA-38) supplier Evaporation Chromium 7440-47-3 0.001 mg 174 1
XTAL (NX3215SA-32) 13.055 mg supplier Cover Silicon 7440-21-3 0.004 mg 306 3
XTAL (NX3215SA-32) supplier Cover Manganese 7439-96-5 0.009 mg 689 7
XTAL (NX3215SA-32) supplier Cover Nickel 7440-02-0 0.552 mg 42283 436
XTAL (NX3215SA-32) supplier Cover Cobalt 7440-48-4 0.324 mg 24818 256
XTAL (NX3215SA-32) supplier Cover Iron 7439-89-6 1.014 mg 77671 802
XTAL (NX3215SA-32) supplier Cover Nickel 7440-02-0 0.137 mg 10494 108
XTAL (NX3215SA-32) supplier Base Aluminum Oxide 1344-28-1 5.981 mg 458139 4728
XTAL (NX3215SA-32) supplier Base Silicon Dioxide 7631-86-9 0.294 mg 22520 232
XTAL (NX3215SA-32) supplier Base Chromium Oxide 1308-38-9 0.041 mg 3141 32
XTAL (NX3215SA-32) supplier Base Molybdenum 7439-98-7 0.284 mg 21754 225
XTAL (NX3215SA-32) supplier Base Calcium Oxide 7439-98-7 0.041 mg 3141 32
XTAL (NX3215SA-32) supplier Base Magnesium oxide 1309-48-4 0.041 mg 3141 32
XTAL (NX3215SA-32) supplier Base Iron 7439-89-6 0.894 mg 68480 707
XTAL (NX3215SA-32) supplier Base Nickel 7440-02-0 0.477 mg 36538 377
XTAL (NX3215SA-32) supplier Base Cobalt 7440-48-4 0.274 mg 20988 217
XTAL (NX3215SA-32) supplier Base Silver 7440-22-4 0.355 mg 27193 281
XTAL (NX3215SA-32) supplier Base Copper 7440-50-8 0.061 mg 4673 48
XTAL (NX3215SA-32) supplier Base Nickel (Plating) 7440-02-0 0.193 mg 14784 153
XTAL (NX3215SA-32) supplier Base Cobalt (Plating) 7440-48-4 0.061 mg 4673 48
XTAL (NX3215SA-32) supplier Base Gold (Plating) 7440-57-5 0.071 mg 5439 56
XTAL (NX3215SA-32) supplier Base Tungsten 7440-33-7 1.523 mg 116660 1204
XTAL (NX3215SA-32) supplier Electro Conductive Adhesive Silver 7440-22-4 0.237 mg 18154 187
XTAL (NX3215SA-32) supplier Electro Conductive Adhesive Silica 7631-86-9 0.029 mg 2221 23
XTAL (NX3215SA-32) supplier Crystal Blank Silicon Dioxide 14808-60-7 0.126 mg 9651 100
XTAL (NX3215SA-32) supplier Evaporation Gold 7440-57-5 0.031 mg 2375 25
XTAL (NX3215SA-32) supplier Evaporation Chromium 7440-47-3 0.001 mg 77 1
Solder Paste 28.856 supplier Paste Tin (Sn) 7440-31-5 27.413 mg 949993 21670
Solder Paste supplier Paste Sb (Antimony) 7440-36-0 1.443 mg 50007 1141
PCB 762.187 mg supplier Copper (metallic) copper 7440-50-8 159.934 mg 209836 126430
PCB supplier Laminate Epoxy resin Proprietary 243.709 mg 319750 192655
PCB supplier Laminate Glass fiber 65997-17-3 252.026 mg 330662 199230
PCB supplier Painted resin Baruim sulfate 7727-43-7 31.834 mg 41767 25165
PCB supplier Painted resin Acrylic resin Proprietary 74.27 mg 97443 58711
PCB supplier Painted resin Silica, Crystalline 14808-60-7 0.039 mg 51 31
PCB supplier Painted resin Talc 14807-96-6 0.035 mg 46 28
PCB supplier Painted resin Acrylic resin Proprietary 0.152 mg 199 120
PCB supplier Nickel and Nickel alloys nickel 7440-02-0 0.112 mg 147 89
PCB supplier Gold Gold 7440-57-5 0.076 mg 100 60