lab 0: intro to uf f28335 development board, soldering/wire … · 2011. 1. 11. · university of...

University of Florida EEL 4744 – Spring 2011 Dr. Eric M. Schwartz Electrical & Computer Engineering Dept. Revision 2 Damian Szmulewicz, TA Page 1/4 Lab 0: Intro to UF F28335 Development Board, 11-Jan-11

Soldering/Wire-wrapping, and your TA

Needle-

nose plier

Wire wrap tool tip

Proper wire wrapping

OBJECTIVES In this lab you will meet your TA and give them the required information listed below. Next you will see a short demonstration on soldering & wire-wrapping during this lab to aid you in building your UF F28335 board and adding future hardware to the board. Upon seeing the TA demonstrate these techniques, you will be encouraged (forced) to try to solder boards on your own and also to practice wire-wrapping some connections. You will then solder some new headers to access ports and address lines on your UF F28335 Development Board. Meet your TA. Get to know him. Understand the lab policies. Fill out and submit the Lab Rules and Policies handout. REQUIRED MATERIALS Printout the following document:

o Lab Rules and Policies o Parts List

Read/save the following document: o Pre-laboratory Report Guidelines o CCS Installation Instructions o Electronic Assembly handout

EEL4744 DSP part list Multimeter (from 3701) Chip extractor (from 3701) Wire wrap tool (your tool) Soldering iron (available for use in lab) Wire cutters and needle nose pliers (shown above,

some available for use in lab, but if you own one, bring you own)

DISCUSSION The Electronic Assembly handout discusses how to solder, a technique that makes a good electrical (and mechanical) connection between two locations. Wire wrapping is another technique for making a good electrical and mechanical connection between two locations. The advantage over soldering is that the process can be easily reversed, and with our wire wrap tool, require no additional equipment. An electrical connection between two pins is established by wrapping bare wire around the first pin, running insulation covered wire to a second pin, and wrapping the second pin with the bare wire. There should be 5-7 turns of bare conductor on a wire-wrap pin and about 1 to 1.5 turn of insulated wire on

the pin. To obtain 5-7 turns of bare wire, approximately 1-inch of wire should be stripped of insulation. Multiple wire wrap connections can be made from a single pin (as shown), but daisy chaining should be avoided. Instead, wrap from pins A to B, then from pins C to D, and then from pins B to C. This will allow for easier unwrapping, if necessary.

PRELAB REQUIREMENTS Read all of the documents listed in the above section. Print and bring the completed Lab Rules and Policies, the blank Parts List documents. Answer the prelab questions and bring them to lab for submission. Answers to the prelab questions can be found in the posted lab documents. Go through the CCS Installation Instructions to install the software on your laptop. Obtain a screen shot CCS running on your laptop that also shows your name in big letters on the same screen. To do a screen shot in Windows, press Ctrl-PrtScrn (i.e., select Ctrl and PrtScrn at the same time). Copy this screen shot into PowerPoint, Word, or similar; save this document and print it. Email a good picture (of less than 200 KB) of yourself with your complete name in the body of the email, to class gmail account. No other files need to be emailed for this lab. Note: Prelab requirements MUST be accomplished PRIOR to coming to your lab.

PRELAB QUESTIONS 1. When soldering a wire to a pin, what should the

soldering iron touch and what should the un-melted solder touch?

2. How many turns of bare wire should be on a wire wrap pin? How much wire (in inches) do you need to strip to get these turns on the pins? How many wraps of insulation should be on a wire wrap pin?

3. Where should appropriate lab files be emailed for this course? How late can you arrive for lab and still be admitted? How late can you arrive for lab and still be allowed to take the lab quiz?

4. What is the lab makeup policy if you miss a single lab and can you drop this lab if ... a) you overslept? b) project for other class due? .

5. What minimum lab average is required in order to be eligible to pass the course? How late can you arrive for lab and still be allowed to take the lab quiz?

6. How many 74HC574 dip chips should be in your kit? How many jumpers?

Wire wrap tool



LAB PROCEDURE Parts Kit: Obtain your 4744 lab kit from your TA. These parts will be used in the labs throughout the semester. Verify that your kit has all the parts listed in the Part List by going through the checklist and checking off each part. Immediately notify your TA about any missing parts by submitting your form with the missing parts circled. Submit the form even if you received all of your parts

Lab Rules and Policies and Introductions: Your TA will discuss the lab rules and policies and then give you a general introduction to the laboratory and what will be expected from you for the semester.

Board Constructions: Your TA will demonstrate proper soldering and wire-wrapping techniques so that you will then be able to finish the construction of the board and have the skills to do further soldering and wire wrapping throughout the semester (and throughout your life). 1. You all should have some soldering experience from

EEL 3701. The TA will provide you with a scrap perf-board and two scrap sockets or headers. Practice soldering by adding the two sockets or headers onto a scrap perf-board. When you feel comfortable with the soldering technique, show your TA. After TA approval, you can move on to the next step.

2. Practice your wire-wrap technique by connecting several pins on the two parts. After TA approval, you can move on to the next step.

3. Build your UF F28335 board after carefully studying Figures 1-3. a. Note: Solder one pin ONLY and let your TA

inspect your work before proceeding. b. Mount headers in the DSP GPIO location. Note

that the header should be mounted through the

bottom of the board with the short pins poking through to the top. The long pins and plastic will be on the bottom. Make sure that the plastic is firmly against the PCB. Verify the positioning with Figures 1-3. Solder the pin labeled GP0. Show your TA BEFORE moving on. After TA approval, solder pin GP49 on the same header.

c. Similarly solder two corner pins of the headers labeled Address & Control Bus, Data Bus, ADC and CPLD HEADER. Show your board to your TA for inspection.

d. After TA approval, complete the soldering of the headers that you started.

e. Next mount headers in the CPLD JTAG location. Note that the header should be mounted through the top of the board with the short pins poking through to the bottom. The long pins and plastic will be on the top. Make sure that the plastic is firmly against the PCB. Verify the positioning with Figures 1-3. Solder the one corner pin. After TA approval, solder the opposite corner

f. Similarly solder the opposite corner pins in the CPLD JUMPERS location. The short pins are soldered on the bottom of the board.

g. After TA approval, complete the soldering of the headers that you started. in parts e and f.

h. Inspect your board for poor solder joints, if any, and repair them.

i. Let your TA perform a visual inspection of your work and suggest any more necessary repairs.

Code Composer Software Open Code Composer (CCS) on your laptop. Show it to your TA.

LAPTOP COMPUTERS Students are required to bring and use their own personal laptops to all labs. The only desktop PC in the lab is for TA use only.



Figure 1: Mostly assembled UF F28335 Development Board. Red rounded rectangles enclose downward facing headers (soldered on top, i.e., on side shown). Blue rectangles enclose upward facing headers (soldered on bottom, i.e., on side not shown). The part of the PCB below the red boxes (the expansion area) will be populated throughout the semester. The parts in the red boxes on the

sides do NOT need to be fully populated until needed; I would suggest that you install at least the top two on each side.



Figure 2: Close up of left side of board. . Red rounded rectangles enclose downward facing headers (soldered on top,

i.e., on side shown). Blue rectangles enclose upward facing headers (soldered on bottom, i.e., on side not shown).

Figure 3: Close up of right side of board. . Red rounded rectangles enclose downward facing headers (soldered on top,

i.e., on side shown). Blue rectangles enclose upward facing headers (soldered on bottom, i.e., on side not shown).

lab 0: intro to uf f28335 development board, soldering/wire … · 2011. 1. 11. · university of...

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