ika06n60t data sheets

14
 IKA06N60T ^ TrenchStop series Power Semiconductors 1 Rev. 2 Oct-04 Low Loss DuoPack : IGBT in Trench and Fieldstop  technology with soft, fast recovery anti-parallel EmCon HE diode  Very low V CE(sat) 1.5 V (typ.) Maximum Junction Temperature 175 °C Short circuit withstand time – 5µs Designed for : - Variable Speed Drive for washing machines, air conditioners and induction cooking - Uninterrupted Power Supply Trench and Fieldstop technology for 600 V applications offers : - very tight parameter distribution - high ruggedness, temperature stable behavior - very high switching speed - low V CE(sat)  Low EMI Very soft, fast recovery anti-parallel EmC on HE diode Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  Type V CE I C;Tc=100°C  V CE(sat  ),Tj=25°C T  j,max Marking Code Package Ordering Code IKA06N60T 600V 6A 1.5V 175°C K06T60 TO-220-FP Q67040S4678 Maximum Ratings Parameter Symbol Value Unit Collector-emi tter voltage V C E 600 V DC collector current, limited by T  jmax T C = 25°C T C = 100°C I C  12 6 Pulsed collector current, t p limited by T  jmax  I Cpuls 18 Turn off safe operating area V CE 600V, T  j  175°C -  18 Diode forward current, limited by T  jmax  T C = 25°C T C = 100°C I F  12 6 Diode pulsed current, t p limited by T  jmax  I Fpuls 18  A Gate-emitter voltage V GE  ±20 V Short circuit withstand time 1)  V GE = 15V, V CC 400V, T  j  150°C t S C 5 µs Power dissipation T C = 25°C P t o t 28 W Operating junction temperature T  j -40...+175 Storage temperature T s t g -55...+175 °C 1) Allowed number of short circuits: <1000; time between short circuits: >1s. G C E P-TO-220-3-31 (TO-220 FullPak)

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Page 1: IKA06N60T Data Sheets

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IKA06N60T^

TrenchStop series

Power Semiconductors 1 Rev. 2 Oct-04

Low Loss DuoPack : IGBT in Trench and Fieldstop technologywith soft, fast recovery anti-parallel EmCon HE diode

• Very low VCE(sat) 1.5 V (typ.)

• Maximum Junction Temperature 175 °C

• Short circuit withstand time – 5µs

• Designed for :- Variable Speed Drive for washing machines, air

conditioners and induction cooking- Uninterrupted Power Supply

• Trench and Fieldstop technology for 600 V applications offers :- very tight parameter distribution- high ruggedness, temperature stable behavior - very high switching speed- low VCE(sat)

• Low EMI

• Very soft, fast recovery anti-parallel EmCon HE diode• Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/

Type V CE I C;Tc=100°C V CE(sat ),Tj=25°C T j,max Marking Code Package Ordering Code

IKA06N60T 600V 6A 1.5V 175°C K06T60 TO-220-FP Q67040S4678

Maximum Ratings

Parameter Symbol Value Unit

Collector-emitter voltage V C E 600 V

DC collector current, limited by T jmax

T C = 25°C

T C = 100°C

I C

12

6Pulsed collector current, t p limited by T jmax I C p u l s 18

Turn off safe operating area

V CE ≤ 600V, T j ≤ 175°C

- 18

Diode forward current, limited by T jmax

T C = 25°C

T C = 100°C

I F

12

6

Diode pulsed current, t p limited by T jmax I F p u l s 18

A

Gate-emitter voltage V G E ±20 V

Short circuit withstand time1)

V GE = 15V, V CC ≤ 400V, T j ≤ 150°C

t S C 5 µs

Power dissipation

T C = 25°C

P t o t 28 W

Operating junction temperature T j -40...+175

Storage temperature T s tg -55...+175

°C

1)Allowed number of short circuits: <1000; time between short circuits: >1s.

G

C

E

P-TO-220-3-31(TO-220 FullPak)

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TrenchStop series

Power Semiconductors 2 Rev. 2 Oct-04

Thermal Resistance

Parameter Symbol Conditions Max. Value Unit

Characteristic

IGBT thermal resistance,

junction – case

R t h J C 5.3

Diode thermal resistance,

junction – case

R t h J C D 6.5

Thermal resistance,

junction – ambient

R t h J A 80

K/W

Electrical Characteristic, at T j = 25 °C, unless otherwise specified

ValueParameter Symbol Conditions

min. typ. max.Unit

Static CharacteristicCollector-emitter breakdown voltage V ( B R ) C E S V G E=0V,

I C=0.25mA 600 - -

Collector-emitter saturation voltage V C E ( s a t ) V G E = 15V, I C=6A

T j=25°C

T j=175°C

-

-

1.5

1.8

2.05

Diode forward voltage V F V G E=0V, I F=6A

T j=25°C

T j=175°C

-

-

1.6

1.6

2.05

-

Gate-emitter threshold voltage V G E ( t h ) I C=0.18mA,

V C E=V G E

4.1 4.6 5.7

V

Zero gate voltage collector current I C E S V C E=600V ,V G E=0V

T j=25°C

T j=175°C

-

-

-

-

40

700

µA

Gate-emitter leakage current I G E S V C E=0V,V GE =20V - - 100 nA

Transconductance g f s V C E=20V, I C=6A - 3.6 - S

Integrated gate resistor R G i n t none

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TrenchStop series

Power Semiconductors 3 Rev. 2 Oct-04

Dynamic Characteristic

Input capacitance C i s s - 368 -

Output capacitance C o s s - 28 -

Reverse transfer capacitance C r ss

V C E=25V,

V G E=0V,

f =1MHz - 11 -

pF

Gate charge QG ate V C C=480V, I C=6A

V G E=15V

- 42 - nC

Internal emitter inductance

measured 5mm (0.197 in.) from case

LE P-TO- 220- 3-31 - 7 - nH

Short circuit collector current1)

I C ( S C ) V G E=15V,t S C≤5µsV C C = 400V,

T j = 25°C

- 55 - A

Switching Characteristic, Inductive Load, at T j=25 °C

ValueParameter Symbol Conditions

min. Typ. max.

Unit

IGBT Characteristic

Turn-on delay time t d ( o n ) - 9.4 -

Rise time t r - 5.6 -

Turn-off delay time t d ( o f f ) - 130 -

Fall time t f - 58 -

ns

Turn-on energy E o n - 0.09 -

Turn-off energy E o f f - 0.11 -

Total switching energy E t s

T j=25°C, V C C=400V, I C=6A,V G E=0/15V,

R G=23Ω ,

2 )=60nH,

C σ 2 )

=40pFEnergy losses include“tail” and diodereverse recovery. - 0.2 -

mJ

Anti-Parallel Diode Characteristic

Diode reverse recovery time t r r - 123 - nsDiode reverse recovery charge Q r r - 190 - nC

Diode peak reverse recovery current I r r m - 5.3 - A

Diode peak rate of fall of reverserecovery current during t b

di r r /dt

T j=25°C,V R=400V, I F=6A,

di F /dt =550A/ µs

- 450 - A/µs

1)Allowed number of short circuits: <1000; time between short circuits: >1s.

2)Leakage inductance Lσ and Stray capacity C σ due to dynamic test circuit in Figure E.

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TrenchStop series

Power Semiconductors 4 Rev. 2 Oct-04

Switching Characteristic, Inductive Load, at T j=175 °C

ValueParameter Symbol Conditions

min. typ. max.

Unit

IGBT Characteristic

Turn-on delay time t d ( o n ) - 8.8 -

Rise time t r - 8.2 -

Turn-off delay time t d ( o f f ) - 165 -

Fall time t f - 84 -

ns

Turn-on energy E o n - 0.14 -

Turn-off energy E o f f - 0.18 -

Total switching energy E t s

T j=175°C, V C C=400V, I C=6A,V G E=0/15V,

R G= 23Ω

1 )=60nH,

C σ 1 )

=40pFEnergy losses include“tail” and diodereverse recovery. - 0.335 -

mJ

Anti-Parallel Diode Characteristic

Diode reverse recovery time t r r

- 180 - ns

Diode reverse recovery charge Q r r - 500 - nC

Diode peak reverse recovery current I r r m - 7.6 - A

Diode peak rate of fall of reverserecovery current during t b

di r r /dt

T j=175°C V R=400V, I F=6A,

di F /dt =550A/ µs

- 285 - A/µs

1)

Leakage inductance Lσ and Stray capacity C σ due to dynamic test circuit in Figure E.

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TrenchStop series

Power Semiconductors 5 Rev. 2 Oct-04

I C , C O L L E C T O R C U R R E N T

10Hz 100Hz 1kHz 10kHz 100kHz

0A

5A

10 A

15 A

T C=110°C

T C=80°C

I C , C O L L E C T O R C U R R E N T

1V 10V 100V 1000V

0,1A

1A

10A

DC

10µs

t p=1µs

50µs

5ms

5µs

500µs

f , SWITCHING FREQUENCY V CE, COLLECTOR-EMITTER VOLTAGE

Figure 1. Collector current as a function of switching frequency

(T j ≤ 175°C, D = 0.5, V CE = 400V,

V GE = 0/+15V, R G = 23Ω)

Figure 2. Safe operating area

(D = 0, T C = 25°C,

T j ≤175°C;V GE=15V)

P t o t , P O W E R D I S S I P A T I O N

25°C 50°C 75°C 100°C 125°C 150°C0W

5W

10 W

15 W

20 W

25 W

I C , C O L L E C T O R C U R R E N T

25°C 75°C 125°C0A

2A

4A

6A

8A

T C, CASE TEMPERATURE T C, CASE TEMPERATURE

Figure 3. Power dissipation as a function of case temperature

(T j ≤ 175°C)

Figure 4. Collector current as a function of case temperature

(V GE ≥ 15V, T j ≤ 175°C)

I c

I c

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TrenchStop series

Power Semiconductors 6 Rev. 2 Oct-04

I C , C O L L E C T O R C U R R E N T

0V 1V 2V 3V

0A

3A

6A

9A

12 A

15 A

15 V

7V

9V

11 V

13 V

V GE=20V

I C , C O L L E C T O R C U R R E N T

0V 1V 2V 3V

0A

3A

6A

9A

12 A

15 A

15 V

7V

9V

11 V

13 V

V GE=20V

V CE, COLLECTOR-EMITTER VOLTAGE V CE, COLLECTOR-EMITTER VOLTAGE

Figure 5. Typical output characteristic(T j = 25°C)

Figure 6. Typical output characteristic(T j = 175°C)

I C , C O L L E C T O R C U R R E N T

0V 2V 4V 6V 8V 10V0A

3A

6A

9A

12A

15A

25°C

T J=175°C

V C E ( s a t ) , C O L L E C T O R - E M I T T S A T U R A T I O N V O L T A G E

-50°C 0°C 50°C 100°C0,0V

0,5V

1,0V

1,5V

2,0V

2,5V

3,0V

I C =6A

I C =12A

I C =3A

V GE, GATE-EMITTER VOLTAGE T J, JUNCTION TEMPERATURE

Figure 7. Typical transfer characteristic(VCE=20V)

Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature(V GE = 15V)

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TrenchStop series

Power Semiconductors 7 Rev. 2 Oct-04

t , S W I T C H I N G T I M E S

0A 3A 6A 9A 12A 15A

1n s

10ns

100ns

t r

t d(on)

t f

t d(off)

t , S W I T C H I N G T I M E S

10Ω 30Ω 50Ω 70Ω 90Ω

1ns

10ns

100ns

t f

t r

t d(off)

t d(on)

I C , COLLECTOR CURRENT R G, GATE RESISTOR

Figure 9. Typical switching times as afunction of collector current(inductive load, T J=175°C,V CE = 400V, VGE = 0/15V, R G = 23Ω,Dynamic test circuit in Figure E)

Figure 10. Typical switching times as afunction of gate resistor (inductive load, T J=175°C,V CE = 400V, VGE = 0/15V, I C = 6A,Dynamic test circuit in Figure E)

t , S W I T C H I N G T I M E S

50°C 100°C 150°C1n s

10ns

100ns

t r

t f

t d(on)

t d(off)

V G E ( t h ) , G A T E - E M I T T T R S H O L D V O L T A G E

-50°C 0°C 50°C 100°C 150°C0V

1V

2V

3V

4V

5V

6V

min.

typ.

max.

T J, JUNCTION TEMPERATURE T J, JUNCTION TEMPERATURE

Figure 11. Typical switching times as afunction of junction temperature(inductive load, V CE = 400V,VGE = 0/15V, I C = 6A, R G = 23Ω,Dynamic test circuit in Figure E)

Figure 12. Gate-emitter threshold voltage asa function of junction temperature (I C = 0.18mA)

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TrenchStop series

Power Semiconductors 8 Rev. 2 Oct-04

E , S W I T C H I N G E N E R G Y L O S S E S

0A 2A 4A 6A 8A 10A

0,0 mJ

0,1 mJ

0,2 mJ

0,3 mJ

0,4 mJ

0,5 mJ

0,6 mJ

E ts*

E on

*

*) E on

and E ts

include losses

due to diode recovery

E off

E , S W I T C H I N G E N E R G Y L O S S E S

10Ω 30Ω 55Ω 80Ω

0,0 mJ

0,1 mJ

0,2 mJ

0,3 mJ

0,4 mJ

E ts*

E on

*

*) E on

and E ts

include losses

due to diode recovery

E off

I C , COLLECTOR CURRENT R G, GATE RESISTOR

Figure 13. Typical switching energy lossesas a function of collector current(inductive load, T J=175°C,V CE=400V, VGE=0/15V, R G=23Ω,Dynamic test circuit in Figure E)

Figure 14. Typical switching energy lossesas a function of gate resistor (inductive load, T J=175°C,V CE = 400V, VGE = 0/15V, I C = 6A,Dynamic test circuit in Figure E)

E , S W I T C H I N G E N E R G Y L O S S E S

50°C 100°C 150°C0,0mJ

0,1mJ

0,2mJ

0,3mJ

0,4mJ

E ts*

E on

*

*) E on

and E ts

include losses

due to diode recovery

E off

E , S W I T C H I N G E N E R G Y L O S S E S

200V 300V 400V 500V0,0mJ

0,1mJ

0,2mJ

0,3mJ

0,4mJ

0,5mJ

E ts*

E on

*

*) E on

an d E ts

include losses

due to diode recovery

E off

T J, JUNCTION TEMPERATURE V CE , COLLECTOR-EMITTER VOLTAGE

Figure 15. Typical switching energy lossesas a function of junctiontemperature(inductive load, V CE=400V,VGE = 0/15V, I C = 6A, R G = 23Ω,Dynamic test circuit in Figure E)

Figure 16. Typical switching energy lossesas a function of collector emitter voltage(inductive load, T J = 175°C,VGE = 0/15V, I C = 6A, R G = 23Ω,Dynamic test circuit in Figure E)

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TrenchStop series

Power Semiconductors 9 Rev. 2 Oct-04

V G E , G A T E - E M I T T E R V O L T A G E

0nC 10nC 20nC 30nC 40nC 50nC0V

5V

10V

15V

480V

120V

c , C A P A C I T A N C E

0V 10V 20V

10pF

100pF

1nF

C rss

C oss

C iss

QGE, GATE CHARGE V CE, COLLECTOR-EMITTER VOLTAGE

Figure 17. Typical gate charge(I C=6 A)

Figure 18. Typical capacitance as a functionof collector-emitter voltage(V GE=0V, f = 1 MHz)

I C ( s c ) , s h o r t c i r c u i t C O L L E C T O R C U R R E N

T

12V 14V 16V 18V0A

20A

40A

60A

80A

t S C , S H O R T C I R C U I T W I T H S T A N D T I M E

10V 11V 12V 13V 14V0µ s

2µ s

4µ s

6µ s

8µ s

10µs

12µs

V GE, GATE-EMITTETR VOLTAGE V GE, GATE-EMITETR VOLTAGE

Figure 19. Typical short circuit collector current as a function of gate-emitter voltage

(V CE ≤ 400V, T j ≤ 150°C)

Figure 20. Short circuit withstand time as afunction of gate-emitter voltage(V CE=600V, start at T J=25°C,T Jmax<150°C)

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TrenchStop series

Power Semiconductors 10 Rev. 2 Oct-04

Z t h J C , T R A N S I E N T T H E R M A L R E S I S T

A N C E

10µs 100µs 1ms 10ms 100ms 1s 1

10-1

K/W

100K/W

single pulse

0.01

0.02

0.05

0.1

0.2

D=0.5

Z t h J C , T R A N S I E N T T H E R M A L R E S I S T

A N C E

10µs 100µs 1ms 10ms 100ms 1s 1

10-2

K/W

10-1

K/W

100K/W

single pulse

0.01

0.02

0.05

0.1

0.2

D=0.5

t P, PULSE WIDTH t P, PULSE WIDTH

Figure 21. IGBT transient thermal resistance(D = t p / T )

Figure 22. Diode transient thermalimpedance as a function of pulsewidth(D=t P/T )

t r r ,

R E V E R S E R E C O V E R Y T I M E

200A/µs 400A/µs 600A/µs 800A/µs0ns

50ns

100ns

150ns

200ns

250ns

T J=25°C

T J=175°C

Q r r , R E V E R S E R E C O V E R Y C H A R G E

200A/µs 400A/µs 600A/µs 800A/µs0,0µC

0,1µC

0,2µC

0,3µC

0,4µC

0,5µC

T J=25°C

T J=175°C

di F /dt , DIODE CURRENT SLOPE di F /dt , DIODE CURRENT SLOPE

Figure 23. Typical reverse recovery time asa function of diode current slope(V R = 400V, I F = 6A,Dynamic test circuit in Figure E)

Figure 24. Typical reverse recovery chargeas a function of diode currentslope (V R = 400V, I F = 6A,Dynamic test circuit in Figure E)

R , ( K / W ) τ , ( s )

0.381 1.867*10-2

6

2.57 1.350

0.645 2.208*10-3

1.454 5.474*10-4

0.062 5.306*10-5

0.186 5.926*10-1

C 1=τ 1/R 1

R 1 R 2

C 2=τ 2/R 2

R , ( K / W ) τ , ( s )

0.403 1.773*10

-2

62.57 1.346

0.938 1.956*10-3

2.33 4.878*10-4

0.071 4.016*10-5

175 5.684*10-1

C 1=τ 1 /R 1

R 1 R 2

C 2=τ 2/R 2

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Power Semiconductors 11 Rev. 2 Oct-04

I r r ,

R E V E R S E R E C O V E R Y C U R R E N T

200A/µs 400A/µs 600A/µs 800A/µs0A

2A

4A

6A

8A

T J=25°C

T J=175°C

d i r r / d

t , D I O D E P E A K R A T E O F F A L L

O F R E V E R S E R E C O V E R Y C U R R E N T

200A/µs 400A/µs 600A/µs 800A/µs0A/µs

-100A/µs

-200A/µs

-300A/µs

-400A/µs

-500A/µs

T J=25°C

T J=175°C

di F /dt , DIODE CURRENT SLOPE di F /dt , DIODE CURRENT SLOPE

Figure 25. Typical reverse recovery currentas a function of diode currentslope(V R = 400V, I F = 6A,Dynamic test circuit in Figure E)

Figure 26. Typical diode peak rate of fall of reverse recovery current as afunction of diode current slope(V R = 400V, I F = 6A,Dynamic test circuit in Figure E)

I F , F O R W A R D C U R R E N T

0,0V 0,5V 1,0V 1,5V 2,0V0A

2A

4A

6A

8A

10 A

25°C

T J =175°C V

F , F O R W A R D V O L T A G E

0°C 50°C 100°C 150°C0,0V

0,5V

1,0V

1,5V

2,0V

6A

I F =12A

3A

V F, FORWARD VOLTAGE T J, JUNCTION TEMPERATURE

Figure 27. Typical diode forward current asa function of forward voltage

Figure 28. Typical diode forward voltage as afunction of junction temperature

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Power Semiconductors 12 Rev. 2 Oct-04

P-TO220-3-31

dimensions

symbol [mm] [inch]

min max min max

A 10.37 10.63 0.4084 0.4184

B 15.86 16.12 0.6245 0.6345

C 0.65 0.78 0.0256 0.0306

D 2.95 typ. 0.1160 typ.

E 3.15 3.25 0.124 0.128

F 6.05 6.56 0.2384 0.2584

G 13.47 13.73 0.5304 0.5404

H 3.18 3.43 0.125 0.135

K 0.45 0.63 0.0177 0.0247

L 1.23 1.36 0.0484 0.0534

M 2.54 typ. 0.100 typ.

N 4.57 4.83 0.1800 0.1900

P 2.57 2.83 0.1013 0.1113

T 2.51 2.62 0.0990 0.1030

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Power Semiconductors 13 Rev. 2 Oct-04

Figure A. Definition of switching times

Figure B. Definition of switching losses

I r r m

90% I r r m

10% I r r m

di /dt F

t r r

I F

i,v

t QS

QF

t S

t F

V R

di /dt r r

Q =Q Qr r S F

+

t =t t r r S F

+

Figure C. Definition of diodesswitching characteristics

p(t)1 2 n

T (t) j

τ1

1

τ2

2

n

n

τ

TC

r r

r

r

r r

Figure D. Thermal equivalentcircuit

Figure E. Dynamic test circuit

Leakage inductance Lσ =60nH

and Stray capacity C σ =40pF.

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Power Semiconductors 14 Rev. 2 Oct-04

Published byInfineon Technologies AG, Bereich Kommunikation

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Attention please!

The information herein is given to describe certain components and shall not be considered as warranted characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest InfineonTechnologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in questionplease contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express writtenapproval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protecthuman life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.