hp elitebook 8470p notebook pc_product end-of-life disassembly

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.] HP EliteBook 8470p Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

6

Batteries All types including standard alkaline and lithium coin or button style batteries

2

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

1

Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords 0 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

0

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0

http://standards.corp.hp.com/elclass/AMF87701.htm

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing refractory ceramic fibers

0

Components, parts and materials containing radioactive substances

0

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable)

Description #1 Cross head of screwdriver

Description #2 TORX T8 (2.31mm)

Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first. 3. Use correct screwdriver and torque value before unlock the screw. 4. 5. 6. 7. 8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

http://standards.corp.hp.com/elclass/AMF87701.htm

MANUFACTURING PROCESS INSTRUCTIONSMECHANICAL ASSEMBLY

MODEL : CT12

A. Current station version list

Sub-assembly name: CT12 FA DIS-ASS’Y

Document No.: SOP CT12 FA DIS-ASS’Y

Written by: Stanley Chen Revision: 0.1

Date: 2011/12/13 Page: 1

Station Ver. Station Ver. Station Ver. Station Ver.

1 0.1 9 0.1 17 0.1 25 0.1

2 0.1 10 0.1 18 0.1 26 0.1

3 0.1 11 0.1 19 0.1 27 0.1

4 0.1 12 0.1 20 0.1 28 0.1

5 0.1 13 0.1 21 0.1 29 0.1

6 0.1 14 0.1 22 0.1

7 0.1 15 0.1 23 0.1

审核：制表：

B. Version Modify list

Revision Date Station Content Ver. Design

0.1 2011/12/13 ALL FIRST VERSION 0.1Stanley

Chen

7 0.1 15 0.1 23 0.1

8 0.1 16 0.1 24 0.1

Alicia Chien

Standard Operation Procedure

Document No. : CT12 FA DIS ASS’Y SOP Station :

Name : Ver. : Date :

Step：：：：

Disassemble Battery

1. Slide the battery latch to the left, then remove

the battery. (Fig.1)

1(1/1)

Battery Latch

0.1 2011/12/13

After

Before

Fig.1

1

2

Notes : If finding anything uncommon, notice foreman or assistant at once.

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Tabulator： Issue department：Alicia Chien NPSU-SE

Fig.2




Step：：：：

Disassemble Cover

1. Slide the cover latch to the left, then remove

the cover. (Fig.1)

2(1/1)

0.1 2011/12/13

Cover Latch

Before

After

Fig.1

1

2




Fig.2




Step：：：：

1

3

Disassemble HDD

1. Loosen HDD set screw * 3. (Fig.1)

2. Remove the HDD.

3(1/1)

0.1 2011/12/13

2

Before

After

Fig.1




Electric cross screwdriver (0#) 1HDD assistant fixture 1

Fig.2




Step：：：：

1. Loosen screw (6052A0004501) * 2.

2. Remove the modem.

Disassemble Modem

4(1/1)

0.1 2011/12/13

1

2




Electric cross screwdriver (0#) 1




Step：：：：

Disassemble Bluetooth

1. Pull out the CNTR, then remove the bluetooth

and cable.

5(1/1)

0.1 2011/12/13

Fig.1

Before

After




Fig.2




Step：：：：

Disassemble FAN

1. Loosen FAN set screw * 2, then remove theFAN. (Fig.1)

6(1/1)

0.1 2011/12/13

1

2

Fig.1

Before

After





Fig.2




Step：：：：

Loosen Keyboard set screw

1. Loosen keyboard set screw * 3.

7(1/1)

0.1 2011/12/13

1

2 3




Electric cross screwdriver (#1) 1




Step：：：：

Disassemble Keyboard

8(1/1)

0.1

图一

2011/12/13

1. Pull out the stick point FFC and keyboard

FPC. (Fig.2/Fig.3)

2. Turn the computer over.

Fig.1




Fig.3

Fig.2




Step：：：：

Disassemble Thermal

9(1/1)

0.1 2011/12/13

1. Loosen thermal screws.

2. Remove the thermal.

Intel UMA

1

2

3

4

Intel DIS1 3

5

6

AMD UMA

1

3





2

4

5

24




Step：：：：

Disassemble CPU

1. Disassemble the CPU by slot screwdriver andvacuum pen.

10(1/1)

0.1 2011/12/13

Before

After

Fig.1




Slot screwdriver 1

Vacuum Pen 1

Fig.2




Step：：：：

Loosen BTCB screws

1. Loosen BTCB screw * 4.

11(1/1)

0.1

如图一

2011/12/13

123




Electric cross screwdriver 1

4




Step：：：：

Disassemble ODD

1. Loosen ODD set screw * 1.

2. Remove the ODD.

12(1/1)

0.1 2011/12/13








Step：：：：

Loosen screws and pull out CNTR

1. Loosen the screw (6052B0101901)*2.(Fig.1)

2. Pull out the speaker CNTR. (Fig.2)

13(1/1)

0.1 2011/12/13

1

2

Fig.1

On the side of ODD





Fig.2




Step：：：：

Loosen Hinge screws

1. Loosen Hinge screw (6052B0155201) * 4.

(Fig.1/Fig.2)

14(1/1)

0.1 2011/12/13

1

2

3

4

Fig.1




Electric torx screwdriver (T8) 1

Support fixture 1

3

Fig.2




Step：：：：

Loosen BTCB screws

1. Loosen BTCB screw (6052B0155201) *4.

15(1/1)

0.1 2011/12/13

41





2

3




Step：：：：

Loosen BTCB screws

1. Loosen BTCB screw (6052B0155201) * 4.

16(1/1)

0.1 2011/12/13

4




1

3

2





Step：：：：

Disassemble BTCB

17(1/1)

0.1 2011/12/13

1. Disassemble the BTCB.

2. Must be sure there is a pad on the north

bridge, then attach a release paper to it.

(Fig.2)

3. Put the BTCB in material box.

Fig.1




Fig.2




Step：：：：

Disassemble DDRs

1. Remove all DDRs.

18(1/1)

0.1 2011/12/13







Step：：：：

Disassemble WWAN card

19(1/1)

0.1 2011/12/13

1. Loosen WWAN screw * 2.

2. Remove the WWAN card.

1





2




Step：：：：

Disassemble WLAN card

1. Loosen WLAN screw (6052A0004501) * 2.

2. Remove the WLAN card.

20(1/1)

0.1 2011/12/13

1





2




Step：：：：

Disassemble Hall Sensor/B

1. Disassemble Hall Sensor/B.

2. Disassemble the cable from routing rib.(marked in white circle)

21(1/1)

0.1

圖一

2011/12/13







Step：：：：

Pull out CNTRs

1. Pull out LCM CNTR and camera cable CNTR.

(Fig.1)

2. Pull out the F/P FFC. (Fig.2)

22(1/1)

0.1 2011/12/13

Fig.1




Fig.2




Step：：：：

1. Loosen M/B screw * 3. (Fig.1)

2. Take out the small battery from routing rib.(Fig.2)

Loosen M/B screws

23(1/1)

0.1 2011/12/13

1

2

3

Fig.1





Fig.2




Step：：：：

1. Take out the M/B.

Take out the M/B

24(1/1)

0.1 2011/12/13







Step：：：：

Loosen screws

25(1/1)

0.1 2011/12/13

1. Disassemble the 4 cables from routing rib.(Fig.1)

2. Loosen screw * 2. (Fig.2/Fig.3)

12

Fig.1





1

Fig.2 Fig.3




Step：：：：

1. Have the hinge be vertical by wrench.

2. Disassemble the top case.

Disassemble Top Case

26(1/1)

0.1 2011/12/13

Fig.1




Wrench 1

Fig.2

Fig.3




Step：：：：

Disassemble RJ11

1. Disassemble RJ11 cable.

27(1/1)

0.1 2011/12/13







Step：：：：

Disassemble Speaker

1. Loosen screw (6052A0004501) * 2.(Fig.2)

2. Disassemble the speaker....

28(1/1)

0.1 2011/12/13

Fig.1





DO NOT PRESSDO NOT PRESSDO NOT PRESSDO NOT PRESSFig.2

1

2




Step：：：：

Inspect BTCB

1. Inspect the BTCB.

� Check the latch. (Fig.1)

� Check the bracket. (Fig.2)

� Check the thermal pad. (Fig.3)

29(1/1)

0.1 2011/12/13

NO HOT MELT � NG

Fig.1




Fig.2 Fig.3

hp elitebook 8470p notebook pc_product end-of-life disassembly

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