product end -of-life disassembly instructionsh22235.€¦ · hp elitebook 8770w mobile workstation...

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.] HP EliteBook 8770w Mobile Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

3

Batteries All types including standard alkaline and lithium coin or button style batteries

2

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

1

Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords 0 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

0

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0

http://standards.corp.hp.com/elclass/AMF87701.htm�

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing refractory ceramic fibers

0

Components, parts and materials containing radioactive substances

0

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable)

Description #1 Cross head of screwdriver

Description #2 TORX T8 (2.31mm)

Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first. 3. Use correct screwdriver and torque value before unlock the screw. 4. 5. 6. 7. 8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

http://standards.corp.hp.com/elclass/AMF87701.htm�

MANUFACTURING PROCESS INSTRUCTIONS MECHANICAL ASSEMBLY

MODEL : Aladdin

Auditor ： Alicia Chien Tabulator：

A. Current station version list

B. Version Modify list Revision Date Station Content Ver. Design

0.1 2012/04/20 ALL FIRST VERSION 0.1 Stanley Chen

Sub-assembly name: Aladdin FA DIS ASS'Y SOP

Document No.: Aladdin FA DIS ASS'Y SOP

Written by: Stanley Chen Revision: 0.1

Date: 2012/04/20 Page: 1

Station Ver. Station Ver. Station Ver. Station Ver.

1 0.1 10 0.1 19 0.1 28 0.1

2 0.1 11 0.1 20 0.1 29 0.1

3 0.1 12 0.1 21 0.1 30 0.1

4 0.1 13 0.1 22 0.1 31 0.1

5 0.1 14 0.1 23 0.1 32 0.1

6 0.1 15 0.1 24 0.1 33 0.1

7 0.1 16 0.1 25 0.1 34 0.1

8 0.1 17 0.1 26 0.1

9 0.1 18 0.1 27 0.1

Standard Operation Procedure

Document No. : Aladdin FA DIS ASS’Y SOP Station : Name : Ver. : Date :

Step：

Notes : If finding anything uncommon, notice foreman or assistant at once.

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Tabulator： Issue department： Alicia Chien NPSU-SE

Disassemble Battery and Back Cover

1. Turn the computer over, slide and hold the

battery release latch to the unlock position

then remove the battery. (Fig.2)

2. Slide the back cover release latch to the

right then remove the back cover.

(Fig.3)

1(1/1) 0.1 2012/04/20

Fig.1

Fig.2

Slide the battery release latch to the left.

Fig.3



Step：




Loosen BTCB Screws

1. Loosen BTCB screw (6052B0185501)--

M2.5-0.45 X 6 * 8. (Fig.1)

2(1/1) 0.1 2012/04/20

Electric torx screwdriver (#1) 1

Fig.1



Step：




Disassemble Bluetooth

1. Separate bluetooth from the base. (Fig.1)

2. Separate bluetooth cable from bluetooth.

(Fig.2)

3(1/1) 0.1 2012/04/20

Fig.2

Fig.1



Step：




Disassemble ODD

1. Loosen BTCB set screw * 4. (Fig.1)

2. If w/o ODD and w/ HDD cradle, need to

loosen screw (6052B0131801) --M3.0*4.5 * 4.

(Fig.2)

3. Remove the ODD or HDD cradle.

4(1/1) 0.1 2012/04/20

Electric cross screwdriver (#0) 1

2 Fig.1 Fig.2



Step：




Loosen BTCB Screws

1. Loosen BTCB screw (6052A0034901)--

M2.5,3.0mm * 6. (Fig.1)

5(1/1) 0.1 2012/04/20


5

Fig.1



Step：




Fig.1

Fig.2

Disassemble Smart Card Holder

1. Loosen the FFC (Fig.3), loosen smart card holder screw * 2. (Fig.2) 2. Lift the smart card holder horizontally (Fig.1), then take out the round hole. 3.Loosen screw (6052A0034901) -- M2.5,3.0mm *1, separate smart card from smart card holder. (Fig.4)

6(1/1) 0.1 2012/04/20


2. Take out the round hole.

1. Lift the smart card holder horizontally.

Fig.3

Fig.4



Step：




Disassemble HDD-1

1. Loosen HDD-1 screw * 3. (Fig.2) 2. Remove the HDD-1. (Fig.2)

7(1/1) 0.1 2012/04/20

HDD-1

Fig.2

HDD-1 HDD-2

Fig.1

Electric cross screwdriver 1



Step：




Loosen Screws (HDD-1)

1. Put the HDD-1 on support fixture, loosen

screw (6052B0131801) -- M3.0*4.5 * 4.

8(1/1)


0.1 2012/04/20



Step：




Disassemble HDD-2

9(1/1) 0.1 2012/04/20

1. Loosen HDD-2 screw * 3. (Fig.2) 2. Remove the HDD-2. (Fig.2)

Fig.2

HDD-1 HDD-2

Fig.1



Step：




Loosen Screws (HDD-2)

1. Put the HDD-2 on support fixture, loosen

screw (6052B0131801) -- M3.0*4.5 * 4.

10(1/1)


0.1 2012/04/20



Step：




Disassemble DDR

1. Remove all DDR. (Fig.1)

11(1/1) 0.1 2012/04/20

Fig.1

Fig.2



Step：




Disassemble FFC and Keyboard

1. Disassemble K/B Stick-point FFC. Notice: Do not touch the touch pad FFC. (Fig.1) 2. Disassemble K/B light sensor FFC.(For backlight K/B) (Fig.2) 3. Disassemble K/B FFC.(Fig.3)

12(1/1) 0.1 2012/04/20

Fig.1

Fig.3 Fig.2



Step：




Disassemble FFC

1. Disassemble touch pad FFC and finger/p

FFC. (Fig.1)

2. Disassemble power button FFC from MB

CNTR. (Fig.2)

3. Disassemble SW/B FFC. (Fig.3)

13(1/1) 0.1 2012/04/20

Fig.1

Fig.2

Touch pad FFC

Fig.3

Finger FFC



Step：




Disassemble TPCB

1. Disassemble TPCB.

14(1/1) 0.1 2012/04/20

Fig.1 1 1

2 2

3 3



Step：




Disassemble CRT

15(1/1) 0.1 2012/04/20


1. Disassemble CRT/B (1310A2393601),

loosen screw (6052A0034901) -- M2.5,3.0mm

*1. (Fig.1)

Fig.2

Fig.1



Step：




Disassemble WLAN Cable

1. Disassemble WLAN cable from WLAN. (Fig.1)

2. Loosen screw (6052A0020901) -- SCREW-I-

M2-3.0 * 2 (Fig.1)

3. take out the WLAN module. (Fig.2)

16(1/1) 0.1 2012/04/20

Fig.1

Fig.2



Step：




Disassemble WWAN Cable

1. Disassemble WWAN cable * 2 from WWAN

module.

2. Loosen screw (6052A0020901) - SCREW-I-

M2-3.0 *2, take out the WWAN module.

17(1/1) 0.1 2012/04/20

Fig.1



Step：




Disassemble Cable

18(1/1) 0.1 2012/04/20

1. Disassemble the cable from hooks. Fig.1

Fig.2



Step：




1. Pull out the camera CNTR from M/B, take out

the camera cable from hooks. (Fig.1/Fig.2)

2. Take out the antenna from white hooks. (Fig.3)

3. Rip the release paper on antenna and

disassemble cable from base frame.

4. Disassemble LCM cable from M/B, take out

the LCM cable from hooks. (Fig.4)

Disassemble Antenna

19(1/1) 0.1 2012/04/20

Fig.2

Fig.3

Camera CNTR

Fig.1

Fig.4



Step：




Disassemble Hinge Cover

1. Turn the computer over, and put it on the support fixture. (Fig.1) 2. Loosen screw (6052B0178801) -SCREW,I, M2.5,3.0mm * 4. (Fig.2) 3. Remove the hinge cover. 4. Loosen screw (6052B0155201) *4.(Fig.3 /Fig.4 )

20(1/1) 0.1 2012/04/20

Electric torx screwdriver (#1) 1 Support fixture 1

Fig.1

Fig.2

Fig.3 Fig.4



Step：




1. Loosen screw (6052B0185501) – M2.5-

0.45 X 6 * 2. (Fig.1/Fig.2)。

2. Disassemble LCM.

Disassemble LCM

21(1/1) 0.1 2012/04/20

Electric torx screwdriver 1

Fig.1

Fig.2

1

2



Step：




Disassemble DDR

1. Remove all DDR. (Fig.1)

22(1/1) 0.1 2012/04/20

Fig.1



Step：




Disassemble USB 3.0/B

1. Loosen USB3.0/B &Audio/B screw

(6052A0034901 - M2.5,3.0mm ) * 6.

(Fig.1/Fig.2)。

2. Remove USB3.0/B.

23(1/1) 0.1 2012/04/20


Fig.1

Fig.2

2

2

3

4

5

6

1

4

5



Step：




Speaker 1

2

1. Loosen speaker screw (6052B0146301) -- SCREW,I,M2.0,2mm ) * 2. (Fig.1) 2. Remove speaker and audio/B. 3. Separate speaker from audio/B. (Fig.2)

24(1/1) 0.1 2012/04/20

Fig.1

Disassemble Speaker and Audio/B

Speaker CNTR

Fig.2




Step：




1. Loosen screw (6052A0020901)-

SCREW-I-M2-3.0 * 2. (Fig.2)

2. Disassemble modem, separate RJ11 cable

from modem.

3. Disassemble RJ11 cable from base.

(Fig.3/ Fig.4)

Disassemble Modem

25(1/1) 0.1 2012/04/20

Fig.1

Fig.3 Fig.4

Fig.2




Step：




1. Loosen screw (6052A0034901)-

M2.5,3.0mm *1, disassemble RJ11

(6017B0224101) or dummy (6051B0657701)

cable. (Fig.1/ Fig.2)

Disassemble RJ11

26(1/1) 0.1 2012/04/20

Fig.1

Fig.2




Step：




Disassemble VGA/B Thermal

1. Loosen VGA/B thermal screw * 6. (Fig.1) 2. Remove FAN cable from M/B. (Fig.2) 3. Remove VGA/B thermal.

27(1/1) 0.1 2012/04/20

Fig.2

Fig.1




Step：




Disassemble Fan

1. Loosen screw (6052A0020901) - SCREW-I-

M2-3.0 * 3, then remove the FAN

(6033B0028401). (Fig.1)

28(1/1) 0.1 2012/04/20

Electric cross screwdriver 1 Support fixture 1

1

3

2

Fig.1

Fig.2



Step：




29(1/1) 0.1 2012/04/20

1. Loosen screw (6052A0034901) * 2. (Fig.1) 2. Disassemble VGA/B.

Disassemble VGA/B

Fig.1 1

2




Step：




Disassemble CPU Thermal

1. Loosen thermal screw * 4. (Fig.1)

2. Disassemble CPU Thermal (6043B0091601)

from M/B.

30(1/1) 0.1 2012/04/20


Fig.1



Step：




Disassemble CPU

1. Disassemble CPU from CPU socket by slot screwdriver. (Fig.1) 2. Take out the CPU by vacuum pen. 。

31(1/1) 0.1 2012/04/20

Slot screwdriver 1 Vacuum Pen 1

Fig.1

Fig.2



Step：




1. Disassemble two standoffs.

(Long：6052B0184501,Short：6052B0184601)

Disassemble Standoffs

32(1/1) 0.1 2012/04/20

Electric hex screwdriver 1

Short： 6052B0184601

Long： 6052B0184501

Fig.1



Step：




1. Loosen screw (6052A0034901)-

M2.5,3.0mm * 3. (Fig.1 /Fig.2)

2. Separate DC cable (6017B0295901) and

RJ45 cable (6017B0199201) from M/B.

(Fig.3)

3. Turn the computer over, remove the RTC

battery. (Fig.4)

Disassemble DC Cable and RJ45

33(1/1) 0.1 2012/04/20

Fig.1 DC Cable

1

2

Fig.2

RJ 45 Cable

3

Fig.4 Fig.3




Step：




1. Loosen screw (6052A0034901)-- M2.5,3.0mm * 4. (Fig.1) 2. Remove the bluetooth cable from M/B. (Fig.2) 3. Take out the M/B.

Loosen Screws

34(1/1) 0.1 2012/04/20

3

Fig.2

Fig.1

Fig.3


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