esb kjl ebeam evaporator sop - shared research … operating procedure revised: ... wafer using...

KJL LAB 18 EBEAM EVAPORATOR

STANDARD OPERATING PROCEDURE

Purpose of this Instrument: This instrument is used for deposition of thin metal films onto substrates

and devices.

Source materials supplied by the WVU Shared Research Facilities:

Aluminum

Gold

Nickel

Platinum

Titanium

Location: Engineering Sciences Building (ESB) G75B2 Cleanroom

Primary Staff

Contact:

Harley Hart

(412) 443-1514 (M)

(304) 293-5847 (O)

Office: White Hall 409

[email protected]

Secondary

Staff Contact:

Dr. Weiqiang Ding

(304) 685-1938 (M)

(304) 293-9683 (O)

Office: ESB G75D

[email protected]

The Shared Research Facilities are operated for the benefit of all researchers. If you encounter any

problems with this piece of equipment, please contact the staff member listed above immediately. There

is never a penalty for asking questions. If the equipment is not behaving exactly the way it should, contact

a staff member.

ESB CR KJL Ebeam Evaporator Standard Operating Procedure

Revised: 02.03.16

1

INSTRUMENT START UP____________________________

1. Reserve the instrument in CORES and login using the CORES kiosk in the cleanroom

gowning room.

2. Visually inspect the computer touch screen. If it is turned off, swipe across the screen

with your hand to activate it. An image of the vacuum screen is shown Below in Figure

1. Check to make sure both chambers are depicted as black, which indicates they are

under vacuum. The isolation valve is closed, LL Iso Valve Close, should be green and

labeled as CLOSED. The chamber pressure indicated in the box at the bottom of the

screen should be below 9.0E-7.

Figure 1: KJL Operational Vacuum Screen


Revised: 02.03.16

2

MOUNTING A SAMPLE_____________________________

NOTE: The e-beam evaporator is designed to hold a 4” diameter sample. Users with samples smaller than 4” in diameter must mount them to a carrier wafer. Samples larger than 4” diameter cannot be coated using this instrument.

1. Samples must be mounted to a 4” carrier wafer

or other 4” sample holder using single sided or

double sided Kapton tape. Make sure samples

are firmly attached. An example of a properly

mounted 2” wafer is shown in Figure 2.

Figure 2: Sample properly mounted on a 4” carrier

wafer using double sided kapton tape

NOTE: Make sure that the sample is firmly attached to the substrate and will not come

off if held upside down.

WARNING: Kapton tape cannot be used if using the backside heater. Users should seek

the advice of a SRF Cleanroom Staff member for assistance.

MOUNTING A SAMPLE_____________________________

1. Vent the load lock by selecting Start LL Vent

button on the computer screen. As the load

lock vents up, the load lock chamber icon will

turn from black to white. The flap door on the

load lock may make a loud popping sound

when the vacuum seal is broken. The door

may also jitter for a few seconds. Open the LL

flap door shown in Figure 3. Figure 3: Loadlock flap door


Revised: 02.03.16

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2. Load a 4” wafer or sample holder with sample

attached onto the extension arm. The sample

should be face down and centered on the

fingers. The major flat should be between the

fingers as shown in Figure 4.

Figure 4: Wafer properly loaded on the extension

arm NOTE: If the wafer is not centered on the fork or if the major flat is not positioned between the two fork fingers the clamp may not grab the wafer properly and it will fall into the chamber.

3. Close the LL flap door.

4. Pump out the load lock chamber by selecting Start LL Pump button.

5. The recipe will automatically run, and pump out the load lock. The load lock chamber

icon will turn from white to black.

6. After the load lock pump out recipe is finished, wait until the load lock pressure reach

5 x 10-6 Torr

7. Load the sample into the chamber by selecting the Start Sample Load button on the

touch screen. The sample will be loaded automatically.

RUNNING A RECIPE________________________________

1. Before running a recipe, make sure that the software displays “loaded” in sample

status window.


Revised: 02.03.16

4

2. Check to see the chamber pressure is in the 10-7 pressure range or lower. This number

is displayed in the bottom center of the KJL vacuum window. Do not run the process

if the pressure is high!

3. Make sure the sigma six software is running. If it is not running, select the Sigma

button on the top right of the software panel. In the sigma screen, make sure the

Sigma Launch 242 button is selected and turns green as shown in Figure 5. Allow the

sigma software to start. If it asks for a password, just hit enter to open the sigma six

control screen.

Figure 5: Sigma screen

4. In the KJL screen, click run to select a recipe. A pop up menu, as shown in Figure 6,

will appear showing all possible recipes that can be run. Select the appropriate recipe

and hit run recipe.

5. The system should automatically start and maintain the deposition process.

NOTE: An alarm will pop up on the KJL software screen when the beam is turning on.

This alarm is normal and should clear after 30 seconds. If the alarm does not clear, abort

the run by clicking on the run program window and contact a SRF staff member

immediately.


Revised: 02.03.16

5

6. Additional layers can be added by selecting and running the new recipe.

Figure 6: Recipe Menu

7. Deposition progress can be followed by viewing the SQS-242 screen. This software will

display one of four screens during deposition. The first screen as shown in Figure 7,

depicts the ramping up of power. This will display the ramping of power to the

“soaking” power, then it will ramp up to a second preset power, which should provide

the required deposition rate.

8. Once the electron beam has reached the preset power in the recipe, the source

shutter will open. The SQS-242 screen will switch to the second observation screen

shown in Figure 8. This screen will display the deposition rate as the e-beam controller

adjusting the beam power to create the desired rate. It is normal for the deposition

rate to overshoot the preset rate, but it should stabilize in two minutes. It is

acceptable if the actual rate is slightly lower.

9. When the deposition rate stabilizes, the SQS-242 screen should automatically switch

to the third display screen when the substrate shutter is open. This screen is shown

in Figure 9. During this time, the material is depositing on the substrate and a crystal


Revised: 02.03.16

6

monitor is measuring the film thickness. The actual film thickness is displayed on the

bottom of the screen and the time remaining is in the upper right.

Figure 7: Electron beam power ramp up

Figure 8: Stabilization of deposition rate


Revised: 02.03.16

7

10. When the deposition is finished, the software will close both shutters and ramp down

the power applied to the e-beam. At this time the SQS-242 will display the final ramp

down screen shown in Figure 10.

Figure 9: SQS screen for monitoring film deposition


Revised: 02.03.16

8

Figure 10: E-beam power ramp down

HEATING THE SAMPLE_____________________________

NOTE: Users wishing to heat the substrate during deposition, should manually operate

the heater and bring the substrate to appropriate temperature before running a program.

The programs in the e-beam evaporator are not currently set to auto run the heater.

NOTE: The process programs have also been optimized for deposition with no heating.

1. Click on the “Heating” button to go to the heater screen, shown in Figure 11.

Figure 11: Heating control screen

2. Click on the Temp SP deg C box and set your desired temperature set point.

3. Select the RR deg C/Min box and set the temperature ramp up rate. The faster the

ramp up rate the faster the final temperature may be reached. However, a fast ramp

rate can also cause an overshoot of the final temperature on the substrate.


Revised: 02.03.16

9

NOTE: The temperature ramp up rate can cause temperature overshoot if trying to

heat up too fast. If the user is heating the substrate to a high temperature and there

is concern with overheating due to temperature overshoot, the user should break the

heating into two steps. The initial temperature set point should be lower than the final

temperature and the ramp up can be faster. Once this intermediate temperature is

reached the user can set the final temperature set point and a lower ramp rate to

achieve their final temperature.

4. Once the temperature set point and ramp rate are programmed, the user should

turn on the heater by clicking the Substrate heater on/off button. After the heater

is turned on, the user should also turn on the Substrate heater Auto button by

clicking it. This will allow the software to control the heater to make sure that the

temperature reaches and stays at set point.

5. Click the Substrate heater on/off button when finished applying heat to the

substrate. This should also turn off the Auto function. Change the Temp SP deg C

and the RR deg C/Min values back to zero.

NOTE: The system is interlocked so that the “Start Sample Unload” program will not

run if the substrate temperature is above 50°C. Therefore samples must cool down

before unloading.

UNLOADING THE SAMPLE__________________________

1. To remove the sample, select the Start Sample Unload button.

2. Once the sample removal recipe has completed, the load lock can be vented by

selecting the Start LL Vent button. As the load lock vents up, the load lock chamber

icon will turn from black to white. The flap door on the load lock may make a loud

popping sound when the vacuum seal is broken. The door may also jitter for a few

seconds.

3. Open the load lock flap door.


Revised: 02.03.16

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4. Remove 4” wafer or sample holder with sample attached onto the extension arm. The

sample should be face down.

5. Close the LL flap door.

6. Pump out the load lock chamber by selecting Start LL Pump button.

7. The recipe will automatically run, and pump out the load lock. The load lock chamber

icon will turn from white to black.

8. The pump out load lock recipe must be completed before logging out of the

instrument.

LOGGING OUT___________________________________

1. Check that both the chamber and the load lock are pumped down.

2. Logout of the tool by pressing the Logout ‘Account name’ Process Engineer button.

WARNING: Do not press exit! Pressing exit will exit the control software and turn off all pumps. 3. Make sure all information is filled out in log book operational log page.

NOTE: The %XTAL life, or XTAL Q, can be found on the Sigma screen in the KJL software.

4. Logout of the CORES system using the kiosk in the gowning room.


Revised: 02.03.16

11

EMERGENCY SHUT-DOWN PROCEDURES_______________

If, at any time, the user needs to contact someone for help, call or locate the following staff of the Shared

Research Facilities (SRF):

Primary Staff

Contact:

Harley Hart

(412) 443-1514 (M)

(304) 293-5847 (O)

Office: White Hall 409

[email protected]

Secondary

Staff Contact:

Dr. Weiqiang Ding

(304) 685-1938 (M)

(304) 293-9683 (O)

Office: ESB G75D

[email protected]

If no one is available and the instrument is not acting as expected, the user should do the following:

Press the ABORT icon button on the recipe.

Set the EBEAM to OFF on the Operation screen. Set the heater to OFF on the Operation screen.

Then, if possible, the user should stay by the instrument while trying to contact a Shared Research

Facilities staff member. If it becomes necessary to leave the instrument then the user should leave a

large, legible note on the KJL EBEAM EVAPORATOR stating:

The problem (describe what happened and steps taken)

When it occurred (date and time)

User name and phone number

If it becomes necessary to leave the instrument then the user should leave a large, legible note at the

KJL EBEAM EVAPORATOR stating the instrument is DOWN.

If a dangerous situation is evident (smoke, fire, sparks, etc.), the user should press the EMO button on

the front of the control rack or on the left-hand side of the process chamber. Then the user should

move the electrical disconnect to the OFF position. The user should notify all other cleanroom persons

within the cleanroom to evacuate and leave the cleanroom IMMEDIATELY. The user should then

contact proper emergency personnel from a safe place. The contact numbers be found posted outside

the cleanroom.

esb kjl ebeam evaporator sop - shared research … operating procedure revised: ... wafer using...

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