©2018 by System Plus Consulting | Peraso X710 Chipset 1
22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Peraso X710 Chipset60 GHz Outdoor Wireless Broadband SolutionRF report by Stéphane ELISABETHAugust 2018 – sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Peraso X710 Chipset 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Company Profile – Peraso technologies
o WiFi History & Evolution
o WiFi Challenges – Residential & Infrastructure
o Peraso PortFolio
o IgniteNet ML-60-LW Teardown
Market Analysis 26
o mmWave Certification protocol
o mmWave Communication Penetration rate
o Wireless Infrastructure Wafer Count
o Infrastructure Process Technology Forecast
Physical Analysis 31
o Summary of the Physical Analysis 32
o Board Assembly 34
Board Views, Marking & Dimensions
Board Dissassembly & Cross-Section
o Baseband IC 41
Package Views & Dimensions
Package Opening & Cross-Section
Die View & Dimensions
Die Delayering & main Blocs
Die Process & Cross-Section:
Substrate, Metal layers, CMOS Transistors, Memory
Die Process Characteristic
o RFIC 58
Package Views & Dimensions
Package Overview, Opening & Cross-Section
Die View, Marking & Dimensions
Die Overview:
Tx/Rx Area, VCO, Power Amplifier, Tx/Rx Mixer, Tx/Rx Channel, Wilkinson, LNA & ADC
Die Delayering & main Blocs
Die Process & Cross-Section:
Substrate, Metal Layers, CMOS, FET & SiGe HBT Transistors
Die Process Characteristic
o Antenna Board 95
Board Views & Dimensions
Board Overview: Antenna Patch
Board Deprocessing: Via, Embedded Microstrip
Board Cross-Section: Substrate, Ground Planes, Dimensions
Board Process Characteristic
Physicla Comparison 112
o Peraso Chipset packaging – Baseband IC vs. RFIC
o Peraso vs. Qualcomm – Baseband IC, RFIC, Antennae
o Backhaul vs. Router vs. Smartphone – Chipset, Formfactor
Manufacturing Process 119
o Baseband IC & RFIC Front-End Process & Fabrication Unit
o Packaging Process & Fabrication unit
Cost Analysis 128
o Summary of the cost analysis 129
o Yields Explanation & Hypotheses 131
o Baseband IC & RFIC 133
Die Front-End Cost
Die Probe Test, Thinning & Dicing
Wafer & Die Cost
Packaging Cost
Component Cost
o Chipset Cost estimation 141
Selling price 142
Feedbacks 145
SystemPlus Consulting services 147
©2018 by System Plus Consulting | Peraso X710 Chipset 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Executive Summary
Even though millimeter-wave (mmWave) technology has become better defined this year, several questions remainunanswered. How will the technology be implemented? Which manufacturing technology will be used? Will it be used incellphone handsets? Which companies will prevail in the market? Today, the only glimpse of what could be done in the nearfuture is the WiGig application, which spans handsets, routers and backhaul products. Qualcomm is already in prime positionin radio-frequency (RF) CMOS technology in handset applications. But for backhaul, where the power and performancerequirements are higher, there’s room for other technologies and competitors. Peraso Technologies is one that is already wellpositioned, with several design wins for its X710 chipset.
Peraso Technologies’ three product series target consumer, industrial and augmented and virtual reality (AR/VR) applications.The X series chipset for outdoor wireless broadband solutions is composed of two separate components, a basebandintegrated circuit (IC) and an RFIC. Integrated into the IgniteNet ML-690-LW device, the solution features also a ceramicsubstrate-based phase array antenna. Soldered on the same board as 32 antennae, the all-60GHz solution takes up only 5% ofthe device volume.
Based on STMicroelectronics’ silicon germanium (SiGe) technology, the RFIC features up to eight transceivers controlling 32patch antennas for beamforming at 60GHz. Packaging and integration has been optimized to maintain RFIC performance.Featuring exposed die packaging, the component is directly in contact with thermal paste to dissipate heat. Also, to increasethe reactivity of the system, the baseband processor is soldered right next to the RFIC.
This report includes a full investigation of the system, featuring a detailed study of the baseband processor, the RFIC and theantenna board including die analyses, processes and board cross-sections. We focus on the RFIC block diagram and theantenna board routing view and dimensions. The report contains a complete cost analysis and a selling price estimation of thechipset. Finally, it features an exhaustive comparison with the Qualcomm chipset for router and handset applications.
©2018 by System Plus Consulting | Peraso X710 Chipset 4
Overview / Introduction
Company Profile & Supply Chain o Peraso Technologieso WiFi Historyo WiFi Challengeso Peraso PortFolioo Ignite ML-60-LW Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
IgniteNet ML-60-LW Teardown
©2018 by System Plus Consulting | Peraso X710 Chipset 5
Overview / Introduction
Company Profile & Supply Chain o Peraso Technologieso WiFi Historyo WiFi Challengeso Peraso PortFolioo Ignite ML-60-LW Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
IgniteNet ML-60-LW Teardown
©2018 by System Plus Consulting | Peraso X710 Chipset 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis o mmWave Cerificationo mmWave Penetration Rateo Market Forecast
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Wireless Infrastructure Wafer Count
©2018 by System Plus Consulting | Peraso X710 Chipset 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Summary of the Physical Analysis
©2018 by System Plus Consulting | Peraso X710 Chipset 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Board View & Dimensions
©2018 by System Plus Consulting | Peraso X710 Chipset 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Board Disassembly
©2018 by System Plus Consulting | Peraso X710 Chipset 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Board Cross-Section
©2018 by System Plus Consulting | Peraso X710 Chipset 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband IC – Package Cross-Section
©2018 by System Plus Consulting | Peraso X710 Chipset 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband IC – Package Cross-Section
Underfill
Solder maskLayer #1
Layer #2
Layer #3
Layer #4Solder mask
Dielectric Layer #1
Core
Dielectric Layer #2
Package Cross-Section – SEM View©2018 by System Plus Consulting
• Dielectric Thickness:• Layer #1 : xxx µm• Core: xxx µm• Layer #2 : xxx µm• Solder Mask : xxx µm
• Copper Line Thickness:• Line #4 : xxx µm• Line #3 : xxx µm• Line #2 : xxx µm• Line #1 : xxx µm
• Measured Line/Space Width in Cross-Section:
xxx µm / xxx µm
• The PCB substrate is manufactured with the layer #3 as dielectric core.
©2018 by System Plus Consulting | Peraso X710 Chipset 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Baseband IC – Die View & Dimensionsxxxx mm
xxx
mm
Die Overview – Optical View©2018 by System Plus Consulting
• Die area: xxxx mm2
(xxxx x xxx mm)
• Nb of PGDW per 12-inch wafer: xxxxx
• Pad Number: xxxx
©2018 by System Plus Consulting | Peraso X710 Chipset 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
RFIC – Package Opening
©2018 by System Plus Consulting | Peraso X710 Chipset 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
RFIC – Package Cross-Section
©2018 by System Plus Consulting | Peraso X710 Chipset 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
RFIC – Die Overview – VCO
• The VCO supply the Tx and the Rx blocks with high frequency signal.
©2018 by System Plus Consulting | Peraso X710 Chipset 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
RFIC – Die Process – HBT Transistors
Die Overview – SEM View ©2018 by System Plus Consulting
Die Process – Bipolar Transistors – SEM View ©2018 by System Plus Consulting
Emitter CollectorCollector
Base
Trench Isolation Poly #2
Poly #1
Oxide Spacer
xxxx µm
xxxx µm
xxx µm
©2018 by System Plus Consulting | Peraso X710 Chipset 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna Board – Board View & Dimensions
©2018 by System Plus Consulting | Peraso X710 Chipset 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Main Board Assemblyo Baseband IC Package Die Views Die Process
o RFIC Package Die Views Block Overview Die Process
o Antenna Board Board View Board Deprocessing Board Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Antenna Board – Antenna Deprocessing
Board Top View – Optical View©2018 by System Plus Consulting
Layer #3
Ground Plane
Hole (Øxxxxx mm)
©2018 by System Plus Consulting | Peraso X710 Chipset 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparisono Peraso Chipset Packagingo Peraso vs. Qualcommo Backhaul vs. Router vs. Handset
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Backhaul vs. Router vs. Smartphone – Chipset
ZenFone 4 ProTalon AD7200ML-60-LW
Antenna Board
Antenna Board
RFIC
Baseband Processor
RFIC
Baseband Processor
Baseband Processor BoardSmartphone Main Board
Antenna SiP
©2018 by System Plus Consulting | Peraso X710 Chipset 21
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Summaryo Baseband IC Front-Endo Baseband IC Fabrication Unito RFIC Front-End Processo RFIC Fabrication Unito Packaging Process Flowo Packaging Fabrication Unit
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Exposed Die FCBGA Packaging Process Flow
Panel PCB Substrate
•Panel PCB Substrate
Panel PCB Substrate
•NCF deposition
•Thermo Compression
Panel PCB Substrate
•Cavity Thermo Compression Molding
Panel PCB Substrate
• Solder Ball Dropping
•Dicing
©2018 by System Plus Consulting | Peraso X710 Chipset 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Summaryo Yields Hypothesiso Baseband IC FE Costo Baseband IC Wafer & Die Costo Packaging & Component Costo RFIC Front-End Costo RFIC Wafer & Die Costo Packaging & Component Costo Chipset Cost Estimation
Selling Price Analysis
Feedbacks
About System Plus
Baseband Processor Front-End Cost
The front-end cost for the Baseband Processor Die ranges from $xxxx to $xxxxaccording to yield variations.
The largest portion of the manufacturing cost is due to the Consumable at xxx%.
We estimate a gross margin of xxxx% for TSMC, which result in a Front-End priceranging from $xxxx to $xxxxx. This corresponds to the selling price to Peraso.
©2018 by System Plus Consulting | Peraso X710 Chipset 23
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Summaryo Yields Hypothesiso Baseband IC FE Costo Baseband IC Wafer & Die Costo Packaging & Component Costo RFIC Front-End Costo RFIC Wafer & Die Costo Packaging & Component Costo Chipset Cost Estimation
Selling Price Analysis
Feedbacks
About System Plus
RFIC Packaging Cost
The Packaging cost for the RFIC ranges from $xxxx to $xxxx per componentsaccording to yield variations.
The largest portion of the manufacturing cost is due to the PCB substrate at xxx%.
We estimate a gross margin of xxxx% for xxxx, which result in a package priceranging from $xxxx to $xxxx.
©2018 by System Plus Consulting | Peraso X710 Chipset 24
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Summaryo Yields Hypothesiso Baseband IC FE Costo Baseband IC Wafer & Die Costo Packaging & Component Costo RFIC Front-End Costo RFIC Wafer & Die Costo Packaging & Component Costo Chipset Cost Estimation
Selling Price Analysis
Feedbacks
About System Plus
Chipset Component Cost
By adding the Antenna Substrate, the Chipset Component costranges from $xxxx to $xxx according to yield variations.
o The Baseband processor Component represent xxxx% of thecomponent cost.
o The RFIC Component represent xxxx% of the component cost.
o The Antenna Substrate represent xxx% of the component cost.
©2018 by System Plus Consulting | Peraso X710 Chipset 25
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definition of Priceso Estimated Selling Price
Feedbacks
About System Plus
Estimated Manufacturer Price
Estimated Financial ratios of Peraso:
60.0% for Cost Of Sales (40% gross margin)10.0% for G&A15.0% for R&D15.0% for Operating income
We estimate that Peraso realizes a grossmargin of 40% on the module, which results ina final component price ranging from $xxx to$xxxx.
This corresponds to the selling price for largevolume to OEMs.
©2018 by System Plus Consulting | Peraso X710 Chipset 26
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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©2018 by System Plus Consulting | Peraso X710 Chipset 28
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©2018 by System Plus Consulting | Peraso X710 Chipset 29
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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