KYOCERA Corporation

Die Attach Pastes for Electronic Devices

This product classification table is current as of February 2016, and is subject to change at any time depending on product development. For details, please contact our sales staff.

Product Classification of Die Attach Paste

Use Application Standard High

Thermal Conductivity

Low Temperature Curable

(*1)

For large size (*2)

Recommended product

Semiconductor

SOP/DIP

○ CT212H

○ ◆ CT2510

○ CT284R CT284T-1 CT285 CT285-2

○ ○ CT262M CT285LT

○ ○ CT285F

QFP/QFN

○ ○ CT2001E CT262K CT265L

○ CT2020E

○ ○ CT2100

BGA ○ CT2021E ◆ CT2021S

○ ○ ◆ CT256 ◆ CT256B ◆ CT256BL2 LED

Visible light LED Coupler

○ CT212HS-F1

○ CT220HK-D2 CT220HK-S1 CT227L

White LED ○ CT288-3

Power LED ○ CT284T-1 CT285 CT285MK

○ ○ CT285LT

Electronic com

ponents

Capacitor ○ CT233KF

Resonator ○ CT290K-1

High thermal resistivity ○ CT291

*1 ：Cure temperature <150℃ *2 ：Adhesive area >5mm2 ○ ：Recommended item ◆ ：Insulation paste

Our die attach paste is classified in categories for semiconductors, LEDs and electronic components. Furthermore, there is standard type, high thermal conductivity addition type, low-temperature curable type, and available for large-size device type as a characteristic of each product. The below table gathered up the recommended products in each category and characteristic. There are the products with an each characteristic. In addition, we suggest a no listed product in this catalogue and a custom product developed to meet a need of customer. Please feel free to contact us.

Product Classification of Die Attach Paste

Die Attach Paste for Semiconductors

Insulator paste for semiconductor

Product name

Viscosity (Pa･s)

Elastic modul

us (GPa)

Tg (℃)

Thermal conductivity

(W/m･k)

Volume resistivity (Ω･cm)

Adhesive strength （N/4mm2） Cure condition

(In-line) Applied

chip size Characteristics

25℃ 260℃

CT212H 120 6.0 180 2.8 4x10-5 40 25 200℃x1.5h ～2mm2 For small-size IC good electrical

conductivity

CT262K 90 6.0 115 1.3 1x10-2 140 15 150℃x1h (180℃x120s) 2～8mm2 General type

For in-vehicle

CT265L 80 6.2 110 1.0 1 150 15 100℃x2h

or 150℃x1h (180℃ｘ60s)

2～8mm2

Low-temperature and fast cure Inhabitation of

oxidation for Cu flame

CT2001E 30 6.7 50 0.5 6x10-1 190 (Cu)

18 (Cu)

135℃x2h or 150℃x1h 1～8mm2 For SOP/QFP/QFN

Low-stress

CT2020E 20 0.6 50 0.5 8x10-1 100 (Cu)

30 (Cu)

170℃x1h 1～15mm2

For SOP/QFP/QFN Lead Flame : Cu

Low-stress Low Moisture

CT2021E 30 2.5 65 0.7 6x10-1 150 (Cu)

27 (Cu)

170℃x1h 1～15mm2 For BGA

Low-stress Low Moisture

Product name

Viscosity (Pa･s)

Elastic modulus (GPa)

Tg (℃)

Thermal conductivity

(W/m･k)

Volume resistivity (Ω･cm)

Adhesive strength （N/4mm2） Cure condition

(In-line) Applied

chip size Characteristics

25℃ 260℃

CT2021S 50 1.5 70 0.3 5x1016 140 22 170℃x1h 2～15mm2 For BGA

Low-stress Low Moisture

CT256B 75 6.5 95 0.3 5x1016 130 18 100℃x1.5h or 150℃x1h (180℃x60s)

2～8mm2 Low-temperature and fast curable Black color type

CT256BL2 50 6.7 95 0.3 5x1016 200< 10

100℃x1.5h or 150℃x1h (180℃x60s)

2～8mm2

Low-viscosity

type of CT256B

CT256BL2B 45 6.7 95 0.3 5x1016 200

< 10 100℃x1.5h or 150℃x1h (180℃x60s)

2～8mm2 Thickness control type of CT256BL2

CT2510 5 7.2 175 0.3 3x1015 150 25 150℃x1h ～5mm2

Support small-size chip High-Tg

micro dispensing

Our paste product for semiconductors has many actual achievements as die attach paste for IC, LSI, transistor and various discrete devices. We have contributed to improving the performance, function and productivity of semiconductor devices by responding to the needs of customers. Our line-up includes a standard type for good conductivity and a low-stress type for large-size devices or a low-temperature curable type and an in-line curable type or a high reliability type for in-vehicle applications. In addition, there is a series of insulation paste products which is highly rated by customers. We offer high reliability for a wide range of applications by having various products that match to device sizes and applications.

Conductive Paste for Semiconductors

High Thermal Conductive Paste

High Thermal Conductive Paste

Our high thermal conductive paste product was developed as a heat radiation countermeasure for small and high-density assembly of semiconductor packages and an environmentally friendly product for use as a substitute of lead solder. It has a thermal conductivity of the highest level in the industry from its high filling of silver filler and also has a high electrical conductivity. Therefore, it has been adopted by many customers since first developed. By applying our product adoption results, technical know-how and research results that we have accumulated as a market pioneer, we have succeeded in the paste development of a low temperature cure type and a low stress type. In the rapidly developing smart society, energy control technology is expected to become the most important key technology. Please consider our high thermal conductive paste for various power devices such as power IC, LSI and power LEDs.

Name Viscos

ity (Pa･s)

Elastic modul

us (GPa)

Tg (℃)

Thermal conduct

ivity (W/m･

k)

Volume Resistivity (Ω･cm)

Adhesive strength

（N/4mm2） Cure

condition (In-line)

Applied chip size Characteristic

25℃ 260℃

CT262M 100 10.0 115 5 6x10-4 160 20 150℃×1.5h 2～8mm2 Solventless

Corresponding large-size IC

CT284R 90 17.0 165 25 8x10-6 40 35 150℃x0.5h +200℃x1.5h ～3mm2

High electrical and thermal conductivity

standard type

CT284T-1 90 15.0 160 25 1x10-5 35 35 150℃x0.5h +200℃x1.5h ～3mm2 CT284R solventless

long tack free

CT285 100 16.5 160 25 9x10-6 35 28 150℃x0.5h +200℃x1.5h ～4mm2

High electrical and thermal conductivity

standard type

CT285-2 90 17.0 160 40 5x10-6 30 23 150℃x0.5h +200℃x1.5ｈ ～3mm2

High electrical and thermal conductivity CT285 hi filling type

CT285F 85 11.0 165 30 2x10-5 45 35 150℃x1h +200℃x1.5h ～6mm2

High electrical and thermal conductivity

low-stress corresponding large-

size chip

CT285LT 100 15.0 120 25 3x10-5 50 25 160℃x1.5h ～4mm2 High electrical and

thermal conductivity low-temperature cure

CT2100 90 9.0 120 30 2x10-4 95 25 130℃x0.5h +180℃x1.0h ～6mm2

High Thermal Conductivity Low Stress

Relation between silver-content rate and thermal conductivity

Silver content rate (wt%)

Conventional product (75-80%)

The

rmal

con

duct

ivit

y (W

/mK

)

CT284R / CT285 / CT285-2

Device reliability test

Conventional silver paste

Hi thermal conductive paste of other companies

PbSn solder

Pretreatment condition (P.C.): 85℃/85%/72h+260℃ TCT: -60℃(30min)⇔150℃(30min) reflow 3-times

Rat

e of

cha

nge

o

f th

erm

al r

esis

tivi

ty

Thermal sock cycles

Hi thermal conductive paste CT285

Conductive Pastes for LED and Electronic Components

Name Viscos

ity (Pa･s)

Elastic modul

us (GPa)

Tg (℃)

Thermal conductiv

ity (W/m･k)

Volume Resistivity (Ω･cm)

Adhesive strength

（N/4mm2） Cure

condition (In-line)

Applied chip size Characteristic

25℃ 260℃

CT212HS -F1 200 8.8 130 2.0 4x10-5 120 30 200℃x1.5h ～2mm2

Low pollution by outgas

For coupler application

CT220HK -S1 115 6.3 115 2.0 1x10-4 60 13 150℃x1.5h ～2mm2

For general purpose LED

standard type

CT220HK -D2 115 8.0 115 2.0 1x10-4 80 15 150℃x1.5h ～2mm2

For general purpose LED

High reliability

CT227L 90 6.5 143 2.0 5x10-5 75 20 150℃x1.5h ～2mm2 Low temperature cure Good strength during

hot state

CT288-3 85 7.8 90 1.8 2x10-4 150 20 150℃x1.0h ～4mm2 Good thermal and UV

resistance High reliability

Conductive Paste for LEDs

Conductive Paste for Electronic Components

Viscosity: E-type 3°cone, Value of 0.5min-1 Modulus: DMA25℃ Tg: DMA Adhesive strength: Cu/Ag plating flame vs. Bare-Si (2x2mm2)

We have expanded the business of pastes for LED and electronic components, and we have the results from many customers. In particular, our silver paste for LEDs has had the best sales share in the world and can meet various needs. Because our paste for LEDs has characteristics of excellent conductivity, workability and reliability, it has got a high evaluation of standard pastes in the LED industry. Our paste for electronic components has been adopted for adhesion of capacitors and quartz resonators, and we have a characteristic product line-up. For customer requirements of cost reduction, we also have a line-up of paste products using silver coated conductive.

Name Viscos

ity (Pa･s)

Elastic modul

us (GPa)

Tg (℃)

Thermal conducti

vity (W/m･k)

Volume Resistivity (Ω･cm)

Adhesive strength

（N/4mm2） Cure

condition (In-line)

Applied chip size Characteristic

25℃ 260℃

CT233KF 80 9.5 130 6.0 1x10-4 200 30 150℃x1.0h 1～3mm2 Low pollution by

outgas For tantalum

capacitor application

CT290K-1 90 1.0 -40 2.0 5x10-5 40 15 100℃x0.5h +180℃x1.0h 1～4mm2 Low modulus type

Silicon modification

Measurement conditions in the table

Pressure-less Silver Sintering Paste

Pressure-less Silver Sintering Paste

Recently, power devices such as IGBTs, LED power and automotive modules need more strict critical quality and are reaching their performance limit with resin-based DA pastes, so a new solution is needed to overcome technical hurdles. In addition, for environmental and health endangerment from lead, the semiconductor industry is making every effort to eliminate high-lead solder, when feasible. However, even now there is no single identified lead-free solution for all applications. The unique properties, such as the high melting point and thermal conductivity of these high-lead alloys are necessary for the level of reliability required for these products. Therefore, in order to achieve their requirement, we have developed pressure-less silver sintering paste based on nano-Ag technology. Our paste demonstrates a thermal conductivity of more than 200W/mK and excellent die shear adhesion to bare Cu as well as noble plating like gold and silver. Moreover, this paste shows excellent interface reliability in not only general automotive requirements but also in SiC applications with high Tj by adoption of an original resin dispersion system.

Name Viscosity (Pa･s)

Elastic modulus (GPa)

Thermal conductivity

(W/m･k)

Volume Resistivity (Ω･cm)

Adhesive strength （N/4mm2） Cure condition

(Nitrogen) Applied chip

size Characteristic

25℃ 260℃

CT2700R6 60 17.6 200 6x10-6 >400 >400 200deg.Cx1.5h (250deg.Cx1.5h) 2～6mm2

Standard High thermal conductivity

CT2700R7 55 26.2 200 4x10-6 >400 >400 200deg.Cx1.5h (250deg.Cx1.5h) 1～10mm2

For Bare Cu application

Excellent interface reliability

CT2700R7S 100 21.6 200 4x10-5 >400 >400 200deg.Cx1.5h (250deg.Cx1.5h)

0.3～12mm2

Printable Wide die size

window

Comparison with solder

Rth

(K

/W)

Die

she

ar@

260C

(MP

a)

High Adhesion

Low Thermal Resistance

Thermal Resistance Adhesive Strength

Ag nano particle

um size Ag

Excellent heat conduction path by intermetalic bond between Ag particles

CT2700R7

Sintering Mechanism