Education and R&D oriented, Accurate Flip-Chip Bonder 3 µmThe ACCµRATM50 flip-chip bonder is a flexible and open platform for accurate placement and bonding. It supports a wide range of assembly applications.

It is particularly well-suited for Education, R&D laboratories and low volume production.

Applications• Micro assembly

• Laser diode, laser bar

• VCSEL, photo diode

• LED

• Flip-chip bonding

• Chip-to-chip, chip-to-substrate bonding

• MOEMS, MEMS, MCM packaging…

• 3D packaging

Highlights• Post-bonding accuracy* (± 3 µm)• Easy to use and very flexible• Quick set up of new applications• Cost-effective• Small footprint and compact design

*depending on configuration and application.

Semi-automatic

5 0Device Bonder

SET Corporation SASmart Equipment Technology

131 impasse Barteudet 74490 Saint-Jeoire - France • Ph: +33 (0)450 35 83 92 • Fax: +33 (0)450 35 88 01 • Email: info@set-sas.fr

www.set-sas.fr

Represented by:

SpecificationsMachine Footprint: 820 x 550 mm

Height: 890 mm

Weight: 70 kg

Component sizeChip(Upper die)

0,5 x 0,5 - 22 x 22 mmThickness: 0,3 to 3 mm

Substrate(Lower die)

0,5 x 0,5 - 100 x 200 mmThickness: 0,3 to 6 mm

Bonding armPost-bonding accuracy* ± 3 µm

Z resolution 0,1 µm

Force* 0,5 to 75 N

Bonding headsRoom temperature sq. 22 mm

Heating sq. 22 mm, 400°C

Ultrasonic 55 - 65 kHz, 40 W max

Optics

Digital camera resolution 2 independant cameras 0,44 x 0,34 µm per pixel

Field of view 280 x 200 µm

Automatic alignment Yes

OptionsDispenser Yes

UV Curing system Yes

Substrate chuckRoom temperature 100 x 200 mm

Heating sq. 22 or 50 mm, 400°C

Alignment stageXY stage Resolution 0,1 µm

Theta travel ± 90°, resolution 17 µrad

Data, design and specifications depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations, photos and specifications in this datasheet are not legally binding. Specifications are subject to change without prior notice.

*depending on configuration and application.

User benefits• Simple design associated to

a user-friendly interface result in quick set-up for new applications

• Ideal for universities and research laboratories

• The pattern recognition system eases low volume pre-production

Main bonding processes• Flip-chip bonding• Pick and place• Thermocompression• Thermosonic

• UV • Reflow• Gold, Gold/Tin, Indium, Copper, UV

or thermal cure adhesives, polymers…