MULTIELEMENT (8E-32E) MCT/InAsSb DETECTORS

CUSTOMIZED SOLUTIONS

APPLICATIONS

• Contactless temperaturemeasurements of fast moving objects

(monitoring of railway transport, maintenance, monitoring of the combustion

process, monitoring of the cooling profile) • Spectrophotometry (gas detection)

• Military (laser beam positioning)

MULTIELEMENT (8E-32E) MCT/InAsSb DETECTORS

Our technology allows us to create multi-element detectors (8-32 elements) dedicated to the client’s application. 32-element array, so far implemented only as part of research and development, are now also easily accessible with dedicated preamplifiers.

FEATURES

• High S/N ratio allows to operation with low powerthermal sources or IR diodes

• High accuracy of temperature measurements (mK)• USB digital interface for easy integration,

no electronic engineer required• Easy to test and redesign to various

applications and shapes• Microprocessor on board enables

algorithms implementation such as filtering and output

shape correction• Support in selecting the

solution for the application

8E - 32E HOT DETECTOR ARRAY SPECIFICATION

PRODUCT DEVELOPMENT CYCLE

Parameter Value

Detector material HgCdTe or InAsSb

Detector type PV, PC

Operating wavelengthMWIR (λcut-off: 3.0 µm – 8.0 µm)LWIR (λcut-off: 8.0 µm – 14.0 µm)

λcut-on can be optimized upon request

Pixel size To be defined by applicationMinimum 25 µm sensor size

Pixel pattern

To be defined by applicationArray or bi-array

Minimum 20 µm between pixels Maximum 6 mm array length

Enclosure/Dimensions TO8 16-pinButterfly 40-pin

TEC type 2 TE, 3TE

Active elements temperature 210 – 270 K

Temperature sensor Thermistor or diode (Accuracy up to +/- 1 K)

Cooler power 1-4 W

Time constant 1 ns - 500 ns

Window Si/Al2O3/Ge with anti-reflection coating

Ambient temperature 0 to 70 °C

Storage temperature, °C -20 to 50 °C

Detector array ava i lab le with:

TEC controller Onboard analog controller

Lens mount C-mount 1” or SM1 THORLABS

Preamplifier Ultra-low noise, selectable bandwidth

DAQ SPI or USB HS

Stage Descr ipt ionNumber of months

Simpledevelopment

Standard development

Advanced development

I – Specification, project• 3D model• Spice simulation• Project: schematic + PCB

1 2 3

II – Prototype

• PCB printing and assembly• Circuit startup• Detector integration• Report, photos and tests• Shipment

2 2 4

III – Production

• Corrections• PCB printing and assembly• Startup and integration• Test report and shipment

2 2 2

We offer help in formulating requirements and matching solutions to the application.The project is most often divided into 3 stages:- Specification preparation and design,- Launching, testing and approving the prototype,- Performing a trial series.

phone: +48 22 733 54 10fax: +48 22 665 21 55e-mail: info@vigo.com.plPoznańska 129/13305-850 Ożarów MazowieckiPOLAND

North American partners:

www.boselec.com boselec@boselec.com+1.617.566.3821